CN105898113A - Image obtaining module and assembling method thereof - Google Patents

Image obtaining module and assembling method thereof Download PDF

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Publication number
CN105898113A
CN105898113A CN201410191478.7A CN201410191478A CN105898113A CN 105898113 A CN105898113 A CN 105898113A CN 201410191478 A CN201410191478 A CN 201410191478A CN 105898113 A CN105898113 A CN 105898113A
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China
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image sensing
sensing chip
upper horizontal
horizontal surface
filter element
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CN201410191478.7A
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CN105898113B (en
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饶景隆
庄江源
周育德
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Luxvisions Innovation Ltd
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Lite On Technology Corp
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Abstract

The invention relates to an image obtaining module and an assembling method thereof. The top end of an image sensing chip includes a first horizontal upper surface which is corrected horizontally by a laser source, the top end of a filtering component includes a second horizontal upper surface which is corrected horizontally by the laser source, and the distance from the second horizontal upper surface of the filtering component to the first horizontal upper surface of the image sensing chip is defined as a preset fixed focusing distance. A movable lens assembly is arranged at the second horizontal upper surface of the filtering component directly to reduce the focusing time of the movable lens assembly relative to the image sensing chip. The first horizontal upper surface of the image sensing chip is parallel with the second horizontal upper surface of the filtering component to improve the assembling flatness of the movable lens assembly relative to the image sensing chip.

Description

Image collection module and assemble method thereof
Technical field
The present invention relates to a kind of image collection module and assemble method thereof, a kind of image collection module and assemble method thereof saving the focusing time and increasing flatness.
Background technology
In recent years, as the handheld apparatus such as mobile phone, PDA have image extraction module be equipped with trend the most more prevalent, and along with under the market demand that the handheld device functional requirement of product market is more preferable and volume is less, image extraction module has faced the double requirements of more high image quality and miniaturization.Lifting for image extraction module image quality, on the one hand it is to improve pixel, the trend in market is by 30 pixels of former VGA grade, progressive two the most common mega pixels, three mega pixels, has the most released the rank of more than eight mega pixels of greater degree.On the other hand in addition to the lifting of pixel, it is the definition being concerned about capture, even therefore the image extraction module of handheld apparatus is also optical zoom function development by focusing the capture function auto-optical focusing function towards similar photographing unit.
The operating principle of auto-optical focusing function be the difference according to subject matter far, closely, suitably to move the camera lens in image extraction module, and then the optical imagery of capture target object is focused on the image sensor exactly, to produce image clearly.With at present the most common to the activation manners driving camera lens to move in image extraction module, its include stepper motor activate, the mode such as piezoelectric actuated and voice coil motor (Voice Coil Motor, VCM) actuating.But, when the imageing sensor in known image extraction module and support sequentially stack on it as stacking datum level with circuit board, support will be caused excessive relative to the assembling inclination angle of imageing sensor, cause the image quality accessed by known image extraction module to be improved.Additionally, it is known that image extraction module can expend the much time relative to the artificial focusing that imageing sensor is used.
Summary of the invention
The embodiment of the present invention is to provide a kind of image collection module and assemble method thereof saving the focusing time and increasing flatness, it can effectively solve " when the imageing sensor in known image extraction module and support sequentially stack on it as stacking datum level; support will be caused excessive relative to the assembling inclination angle of imageing sensor, cause the image quality accessed by known image extraction module to be improved " and the defect of " known image extraction module can expend the much time relative to the artificial focusing that imageing sensor is used " using circuit board.
A kind of image collection module saved the focusing time and increase flatness that a present invention wherein embodiment is provided, comprising: an image sensing unit, a frame case, an actuator structure and a filter element.Described image sensing unit includes that a bearing substrate and is arranged on described bearing substrate and is electrically connected at the image sensing chip of described bearing substrate, and the top of wherein said image sensing chip has one by the first upper horizontal surface obtained after the level correction of a LASER Light Source.Described frame case is arranged on described bearing substrate and surrounds described image sensing chip.Described actuator structure is arranged in described frame case and is positioned at the top of described image sensing chip, wherein said actuator structure includes that one is arranged on the movable lens assembly of top that the lens bearing seat in described frame case and is arranged in described lens bearing seat and is positioned at described image sensing chip, the inside of described lens bearing seat has one around shape movable piece, it is described around in shape movable piece to be fixed on that described movable lens assembly fixes colloid by least two, and described movable lens assembly by the described drive around shape movable piece to be movably disposed in described lens bearing seat.Described filter element is arranged in described frame case and between described image sensing chip and described movable lens assembly, the top of wherein said filter element has one by the second upper horizontal surface obtained by after the level correction of described LASER Light Source, and described second upper horizontal surface of described filter element is a fixing focussing distance preset at a distance of the distance definition of described first upper horizontal surface of described image sensing chip.Wherein, described movable lens assembly is set directly in described second upper horizontal surface of described filter element, to save the described movable lens assembly focusing time relative to described image sensing chip.Wherein, described first upper horizontal surface of described image sensing chip is parallel to each other with described second upper horizontal surface of described filter element, to increase the described movable lens assembly assembling flatness relative to described image sensing chip.
A kind of image collection module saved the focusing time and increase flatness that the other embodiment of the present invention is provided, comprising: an image sensing unit, a frame case, an actuator structure and a filter element.Described image sensing unit includes that a bearing substrate and is arranged on described bearing substrate and is electrically connected at the image sensing chip of described bearing substrate, and the top of wherein said image sensing chip has one first upper horizontal surface.Described frame case is arranged on described bearing substrate and surrounds described image sensing chip.Described actuator structure is arranged in described frame case and is positioned at the top of described image sensing chip, and wherein said actuator structure includes that one is arranged on the movable lens assembly of top that the lens bearing seat in described frame case and is movably disposed in described lens bearing seat and is positioned at described image sensing chip.Described filter element is arranged in described frame case and between described image sensing chip and described movable lens assembly, the top of wherein said filter element has one second upper horizontal surface, and described second upper horizontal surface of described filter element is a fixing focussing distance preset at a distance of the distance definition of described first upper horizontal surface of described image sensing chip.Wherein, described movable lens assembly is set directly in described second upper horizontal surface of described filter element, to save the described movable lens assembly focusing time relative to described image sensing chip.Wherein, described first upper horizontal surface of described image sensing chip is parallel to each other with described second upper horizontal surface of described filter element, to increase the described movable lens assembly assembling flatness relative to described image sensing chip.
The assemble method of a kind of image collection module saving focusing time and increase flatness that the other another embodiment of the present invention is provided, it comprises the following steps: to provide an image sensing unit and a frame case, wherein said image sensing unit includes that a bearing substrate and is arranged on described bearing substrate and is electrically connected at the image sensing chip of described bearing substrate, and described frame case is arranged on described bearing substrate and surrounds described image sensing chip;The level correction by a LASER Light Source of the described image sensing chip, to obtain the first upper horizontal surface on a top being positioned at described image sensing chip;One filter element is arranged in described frame case and is positioned at the surface of described image sensing chip;Described filter element is by the level correction of described LASER Light Source, to obtain the second upper horizontal surface on a top being positioned at described filter element, described second upper horizontal surface of wherein said filter element is a fixing focussing distance preset at a distance of the distance definition of described first upper horizontal surface of described image sensing chip;nullOne actuator structure is provided,Wherein said actuator structure is arranged in described frame case and is positioned at the top of described image sensing chip,Wherein said actuator structure includes that one is arranged on the movable lens assembly of top that the lens bearing seat in described frame case and is arranged in described lens bearing seat and is positioned at described image sensing chip,And the inside of described lens bearing seat has one around shape movable piece,Wherein said movable lens assembly is set directly in described second upper horizontal surface of described filter element,To save the described movable lens assembly focusing time relative to described image sensing chip,And described first upper horizontal surface of described image sensing chip is parallel to each other with described second upper horizontal surface of described filter element,To increase the described movable lens assembly assembling flatness relative to described image sensing chip;And, fix colloid by least two, described in shape movable piece to be fixed on by described movable lens assembly, wherein said movable lens assembly is by the described drive around shape movable piece, to be movably disposed in described lens bearing seat.
Beneficial effects of the present invention can be, image collection module that the embodiment of the present invention is provided and assemble method thereof, it can be by " top of described image sensing chip has one by the first upper horizontal surface obtained after the level correction of a LASER Light Source, the top of described filter element has one by the second upper horizontal surface obtained after the level correction of described LASER Light Source, and described first upper horizontal surface of described image sensing chip is parallel to each other with described second upper horizontal surface of described filter element " design, effectively to reduce the described movable lens assembly assembling inclination angle relative to described image sensing chip, thereby to guarantee the described movable lens assembly planarization relative to described image sensing chip.Therefore, when described second upper horizontal surface of described filter element be predefined at a distance of the distance of described first upper horizontal surface of described image sensing chip be fixing focussing distance that one presets time, described movable lens assembly just can be arranged directly in described second upper horizontal surface of described filter element, thereby to save the described movable lens assembly focusing time relative to described image sensing chip.
It is further understood that inventive feature and technology contents for enabling, refers to below in connection with detailed description of the invention and accompanying drawing, but institute's accompanying drawings only provides reference and explanation use, is not used for the present invention person of being any limitation as.
Accompanying drawing explanation
Fig. 1 is the flow chart that the present invention saves the assemble method of the image collection module of focusing time and increase flatness.
Fig. 2 is the side elevational cross-section schematic diagram of step S100 of the present invention and S102.
Fig. 3 is the side elevational cross-section schematic diagram of step S104 of the present invention and S106.
Fig. 4 is the side elevational cross-section schematic diagram of step S108 of the present invention and S110.
[symbol description]
Image collection module M
Image sensing unit 1
Bearing substrate 10
Image sensing chip 11
First upper horizontal surface 110
Frame case 2
Top end opening 200
Actuator structure 3
Lens bearing seat 30
Interior around surface 300
Movable lens assembly 31
Bottom plane 310
Surface, outside 311
Around shape movable piece 30M
Filter element 4
Second upper horizontal surface 400
Fixing colloid H
LASER Light Source S
Precalculated position P
First laser beam L1
First reflection light beam R1
Second laser beam L2
Second reflection light beam R2
Fixing focussing distance D
Focussing distance F
Detailed description of the invention
Below by way of the embodiment of specific instantiation explanation presently disclosed " save the focusing time and increase image collection module and the assemble method thereof of flatness ", those of ordinary skill in the art can be will readily appreciate that other advantages and the effect of the present invention by the content disclosed by this specification.The present invention also can be implemented by other different specific embodiments or be applied, and the every details in this specification may be based on different viewpoints and application, carries out various modification and change under without departing from the spirit.Again the present invention graphic be only simple declaration, not according to actual size describe, namely unreacted go out be correlated with composition actual size, first give chat bright.Following embodiment further describes the correlation technique content of the present invention, but and is not used to limit the technology category of the present invention.
Referring to shown in Fig. 1 to Fig. 4, the present invention provides a kind of assemble method of image collection module M saving the focusing time and increasing flatness, and it generally can include following several step:
First, step S100 is: coordinate shown in Fig. 1 and Fig. 2, one image sensing unit 1 and a frame case 2 is provided, wherein image sensing unit 1 includes that a bearing substrate 10 and is arranged on bearing substrate 10 and is electrically connected at the image sensing chip 11 of bearing substrate 10, and frame case 2 is arranged on bearing substrate 10 and surrounds image sensing chip 11.For example, as in figure 2 it is shown, image sensing chip 11 can be cmos image sensor chip, and image sensing chip 11 can pass through adhesion colloid (non-label, such as UV adhesion glue, thermmohardening glue or oven curing glue etc.), to be arranged on bearing substrate 10.It addition, frame case 2 also can pass through adhesion colloid (such as UV adhesion glue, thermmohardening glue or oven curing glue etc.), to be arranged on bearing substrate 10.In addition, bearing substrate 10 can be the circuit substrate that a upper surface has multiple conductive welding pad (non-label), the upper surface of image sensing chip 11 has multiple conductive welding pad (non-label), and each conductive welding pad of image sensing chip 11 can pass through a conductor wire (non-label), to be electrically connected at the conductive welding pad of bearing substrate 10, thereby to reach electrically conducting between image sensing chip 11 and bearing substrate 10.
Then, step S102 is: coordinate shown in Fig. 1 and Fig. 2, and the image sensing chip 11 level correction by a LASER Light Source S, to obtain the first upper horizontal surface 110 on a top being positioned at image sensing chip 11.For further, LASER Light Source S is arranged on a precalculated position P (such as fixed position) of the top of image sensing chip 11, for producing the direct perpendicular projection the first laser beam L1 in the first upper horizontal surface 110 of image sensing chip 11.First laser beam L1 produced by LASER Light Source S can reflect light beam R1 forming the first of a direct perpendicular projection on the P of precalculated position or closely precalculated position P by the reflection of the first upper horizontal surface 110 of image sensing chip 11.In other words, when the top of image sensing chip 11 adjusts to level, first laser beam L1 will be the most vertically back on the P of precalculated position by the first reflection light beam R1 produced by the reflection on the top of image sensing chip 11, or the first reflection light beam R1 can produce a deflection in tolerable range of error and closely precalculated position P.Now, the top of image sensing chip 11 just can serve as the first upper horizontal surface 110 of level reference.
Then, step S104 is: coordinates shown in Fig. 1 and Fig. 3, is arranged in frame case 2 by a filter element 4 and is positioned at the surface of image sensing chip 11.For further, as it is shown on figure 3, the top of frame case 2 has the top end opening 200 of a surface being positioned at image sensing chip 11, and the top end opening 200 of frame case 2 is closed by filter element 4.For example, filter element 4 can be that a surface is coated with infrared resistant (IR) layer and/or the flat glass plate of antireflection (AR) layer, and filter element 4 can pass through multiple first adhesion colloids (non-label), to be fixed in a dented space of frame case 2, with the top end opening 200 of closed frame housing 2.
And then, step S106 is: coordinate shown in Fig. 1 and Fig. 3, the filter element 4 level correction by LASER Light Source S, to obtain the second upper horizontal surface 400 on a top being positioned at filter element 4, wherein the second upper horizontal surface 400 of filter element 4 is a fixing focussing distance D preset at a distance of the distance definition of the first upper horizontal surface 110 of image sensing chip 11.For further, on the precalculated position P of the top that LASER Light Source S (such as laser leveler) is arranged on filter element 4, for producing the direct perpendicular projection the second laser beam L2 in the second upper horizontal surface 400 of filter element 4.Second laser beam L2 produced by LASER Light Source S can reflect light beam R2 forming the second of a direct perpendicular projection on the P of precalculated position or closely precalculated position P by the reflection of the second upper horizontal surface 400 of filter element 4.In other words, when the top of filter element 4 adjusts to level, second laser beam L2 will be the most vertically back on the P of precalculated position by the second reflection light beam R2 produced by the reflection on the top of filter element 4, or the second reflection light beam R2 can produce a deflection in tolerable range of error and closely precalculated position P.Now, the top of filter element 4 will be formed in parallel with the second upper horizontal surface 400 of the first upper horizontal surface 110.
nullIt is worth mentioning that,First laser beam L1 produced by LASER Light Source S can also be to tilt to be incident upon in the first upper horizontal surface 110 of image sensing chip 11,And the second laser beam L2 produced by LASER Light Source S can also be to tilt to be incident upon in the second upper horizontal surface 400 of filter element 4,As long as enable to by the way of " the first laser beam L1 is by the first reflection light beam R1 produced by the reflection on the top of image sensing chip 11 " and " the second laser beam L2 is by the second reflection light beam R2 produced by the reflection on the top of filter element 4 " can reflex in same point,Also can reach that " top of image sensing chip 11 can be parallel to each other with the top of filter element 4,To increase movable lens assembly 31 relative to the assembling flatness of image sensing chip 11 " purpose.
nullThen,Step S108 is: coordinate shown in Fig. 1 and Fig. 3,One actuator structure 3 is provided,Wherein actuator structure 3 is arranged in frame case 2 and is positioned at the top of image sensing chip 11,Wherein actuator structure 3 include a lens bearing seat 30 (lens holder) and being arranged in frame case 2 be arranged on lens bearing seat 30 in and be positioned at the movable lens assembly 31 of top of image sensing chip 11,And the inside of lens bearing seat 30 has one around shape movable piece 30M,Wherein movable lens assembly 31 is set directly in the second upper horizontal surface 400 of filter element 4,To save the movable lens assembly 31 focusing time relative to image sensing chip 11,And the first upper horizontal surface 110 of image sensing chip 11 is parallel to each other with the second upper horizontal surface 400 of filter element 4,To increase the movable lens assembly 31 assembling flatness relative to image sensing chip 11 of " being set directly in the second upper horizontal surface 400 of filter element 4 ".Thereby, owing to the first upper horizontal surface 110 of image sensing chip 11 and the second upper horizontal surface 400 of filter element 4 can be parallel to each other, so when movable lens assembly 31 is set directly in the second upper horizontal surface 400 of filter element 4, the present invention not only can will effectively reduce the movable lens assembly 31 assembling inclination angle relative to image sensing chip 11, to guarantee the movable lens assembly 31 planarization relative to image sensing chip 11, and also can save the movable lens assembly 31 focusing time relative to image sensing chip 11.
For further, the bottom of movable lens assembly 31 has the bottom plane 310 of second upper horizontal surface 400 directly contacting filter element 4, and the bottom plane 310 of movable lens assembly 31 fully or substantially upper can be equal to the default fixing focussing distance D of " the second upper horizontal surface 400 of filter element 4 is at a distance of the first upper horizontal surface 110 of image sensing chip 11 " at a distance of a focussing distance F of the first upper horizontal surface 110 of image sensing chip 11.
For example, the interior surface, outside 311 around surface 300 and movable lens assembly 31 around shape movable piece 30M is all without thread surface.Lens bearing seat 30 also can be by adhesion colloid (such as UV adhesion glue, thermmohardening glue or oven curing glue etc.), to be arranged in frame case 2, and movable lens assembly 31 can be made up of multiple optical lenses (non-label).It addition, it is noted that as shown in Figure 4, actuator structure 3 can be a voice coil actuator (voice coil actuator).But, the present invention is not limited, and the actuator structure 3 of the such as present invention can also replace by an optics supplementary structure with fixed lens assembly.
Finally, step S110 is: coordinate shown in Fig. 1 and Fig. 4, in the case of " the first upper horizontal surface 110 of image sensing chip 11 is parallel to each other with the second upper horizontal surface 400 of filter element 4 " and " movable lens assembly 31 is set directly in the second upper horizontal surface 400 of filter element 4 ", colloid H can be fixed by least two, movable lens assembly 31 is fixed in shape movable piece 30M, wherein movable lens assembly 31 can be by the drive around shape movable piece 30M, to be movably disposed in lens bearing seat 30.
Thereby, by above-mentioned steps S100 to the assembling mode disclosed by step S110, the present invention can provide a kind of image collection module M saved the focusing time and increase flatness, comprising: image sensing unit 1, frame case 2, actuator structure 3 and a filter element 4, wherein the top of image sensing chip 11 has one by the first upper horizontal surface 110 obtained by after the level correction of LASER Light Source S, and the top of filter element 4 has one by the second upper horizontal surface 400 obtained by after the level correction of LASER Light Source S.Therefore, when the second upper horizontal surface 400 of filter element 4 be predefined at a distance of the distance of the first upper horizontal surface 110 of image sensing chip 11 be fixing focussing distance D that one presets time, movable lens assembly 31 just can be arranged directly in the second upper horizontal surface 400 of filter element 4, thereby to save the movable lens assembly 31 focusing time relative to image sensing chip 11, and the first upper horizontal surface 110 of image sensing chip 11 is parallel to each other with the second upper horizontal surface 400 meeting of filter element 4, to increase the movable lens assembly 31 assembling flatness relative to image sensing chip 11.
(the possible effect of embodiment)
In sum, beneficial effects of the present invention can be, image collection module M that the embodiment of the present invention is provided and assemble method thereof, it can be by " top of image sensing chip 11 has one by the first upper horizontal surface 110 obtained after the level correction of LASER Light Source S, the top of filter element 4 has one by the second upper horizontal surface 400 obtained after the level correction of LASER Light Source S, and the first upper horizontal surface 110 of image sensing chip 11 is parallel to each other with the second upper horizontal surface 400 of filter element 4 " design, effectively to reduce the movable lens assembly 31 assembling inclination angle relative to image sensing chip 11, thereby to guarantee the movable lens assembly 31 planarization relative to image sensing chip 11.Therefore, when the second upper horizontal surface 400 of filter element 4 be predefined at a distance of the distance of the first upper horizontal surface 110 of image sensing chip 11 be fixing focussing distance D that one presets time, movable lens assembly 31 just can be arranged directly in the second upper horizontal surface 400 of filter element 4, thereby to save the movable lens assembly 31 focusing time relative to image sensing chip 11.
The foregoing is only the preferred possible embodiments of the present invention, non-the scope of the claims therefore limiting to the present invention, therefore the equivalence techniques such as using description of the invention and graphic content to be done changes, and is both contained in protection scope of the present invention.

Claims (10)

1. an image collection module, it is characterised in that described image collection module includes:
One image sensing unit, described image sensing unit includes a bearing substrate and a setting On described bearing substrate and be electrically connected at the image sensing chip of described bearing substrate, its Described in the top of image sensing chip have one by institute after the level correction of a LASER Light Source The first upper horizontal surface obtained;
One frame case, described frame case is arranged on described bearing substrate and surrounds described Image sensing chip;
One actuator structure, described actuator structure is arranged in described frame case and is positioned at The top of described image sensing chip, wherein said actuator structure include one be arranged on described Lens bearing seat and one in frame case is arranged in described lens bearing seat and is positioned at described The movable lens assembly of the top of image sensing chip, the inside tool of described lens bearing seat One is had to fix colloid admittedly around shape movable piece, described movable lens assembly by least two It is scheduled on described in shape movable piece, and described movable lens assembly is by described around shape The drive of movable piece and can be movably arranged as in described lens bearing seat;And
One filter element, described filter element is arranged in described frame case and is positioned at described Between image sensing chip and described movable lens assembly, the top of wherein said filter element End has one by table in the second level obtained after the level correction of described LASER Light Source Face, and described second upper horizontal surface of described filter element is at a distance of described image sensing chip The distance definition of described first upper horizontal surface be a fixing focussing distance preset;
Wherein, described movable lens assembly is set directly at described the of described filter element In two upper horizontal surface, to save described movable lens assembly relative to described image sensing The focusing time of chip;
Wherein, described first upper horizontal surface of described image sensing chip and the described unit that filters Described second upper horizontal surface of part is parallel to each other, to increase described movable lens assembly phase Assembling flatness for described image sensing chip.
Image collection module the most according to claim 1, it is characterised in that described frame case Top have one between described image sensing chip and described movable lens assembly Top end opening, and the described top end opening of described frame case closed by described filter element, The bottom of wherein said movable lens assembly has an institute directly contacting described filter element Stating the bottom plane of the second upper horizontal surface, the described bottom of described movable lens assembly is put down Face is equal at a distance of a focussing distance of described first upper horizontal surface of described image sensing chip Described second upper horizontal surface of described filter element is described at a distance of described image sensing chip The described default fixing focussing distance of the first upper horizontal surface, and described around shape movable piece One in be all without thread around a surface, outside of surface and described movable lens assembly Surface.
Image collection module the most according to claim 1, it is characterised in that described LASER Light Source On one precalculated position of the top being arranged on described image sensing chip, for producing always Connect the first laser light in described first upper horizontal surface being incident upon described image sensing chip Restrainting, produced by described LASER Light Source, described first laser beam is by described image sensing core The reflection of described first upper horizontal surface of sheet and form one and be directly incident upon described precalculated position Go up or the first reflection light beam in the most described precalculated position.
Image collection module the most according to claim 1, it is characterised in that described LASER Light Source On one precalculated position of the top being arranged on described filter element, directly throw for producing one Penetrate the second laser beam in described second upper horizontal surface of described filter element, described Described second laser beam produced by LASER Light Source passes through described the second of described filter element The reflection of upper horizontal surface and form one and be directly incident upon on described precalculated position or closely The second reflection light beam in described precalculated position.
5. an image collection module, it is characterised in that described image collection module includes:
One image sensing unit, described image sensing unit includes a bearing substrate and a setting On described bearing substrate and be electrically connected at the image sensing chip of described bearing substrate, its Described in the top of image sensing chip there is one first upper horizontal surface;
One frame case, described frame case is arranged on described bearing substrate and surrounds described Image sensing chip;
One actuator structure, described actuator structure is arranged in described frame case and is positioned at The top of described image sensing chip, wherein said actuator structure include one be arranged on described Lens bearing seat and one in frame case can be movably arranged as in described lens bearing seat and It is positioned at the movable lens assembly of the top of described image sensing chip;And
One filter element, described filter element is arranged in described frame case and is positioned at described Between image sensing chip and described movable lens assembly, the top of wherein said filter element End has one second upper horizontal surface, and described second upper horizontal surface of described filter element The distance definition of described first upper horizontal surface at a distance of described image sensing chip is one to preset Fixing focussing distance;
Wherein, described movable lens assembly is set directly at described the of described filter element In two upper horizontal surface, to save described movable lens assembly relative to described image sensing The focusing time of chip;
Wherein, described first upper horizontal surface of described image sensing chip and the described unit that filters Described second upper horizontal surface of part is parallel to each other, to increase described movable lens assembly phase Assembling flatness for described image sensing chip.
Image collection module the most according to claim 5, it is characterised in that described frame case Top have one between described image sensing chip and described movable lens assembly Top end opening, and the described top end opening of described frame case closed by described filter element, The bottom of wherein said movable lens assembly has an institute directly contacting described filter element State the bottom plane of the second upper horizontal surface, and the described bottom of described movable lens assembly Plane is at a distance of a focussing distance etc. of described first upper horizontal surface of described image sensing chip Institute in the described second upper horizontal surface described image sensing chip apart of described filter element State the described default fixing focussing distance of the first upper horizontal surface.
7. the assemble method of an image collection module, it is characterised in that described image collection module Assemble method comprises the following steps:
One image sensing unit and a frame case, wherein said image sensing unit bag are provided Include a bearing substrate and and be arranged on described bearing substrate and be electrically connected at described carrying base The image sensing chip of plate, and described frame case is arranged on described bearing substrate and surrounds Described image sensing chip;
Described image sensing chip is obtained one be positioned at by the level correction of a LASER Light Source The first upper horizontal surface on the top of described image sensing chip;
One filter element is arranged in described frame case and is positioned at described image sensing core The surface of sheet;
Described filter element is obtained one be positioned at institute by the level correction of described LASER Light Source State the second upper horizontal surface on the top of filter element, wherein said filter element described Second upper horizontal surface at a distance of described image sensing chip described first upper horizontal surface away from From being defined as a fixing focussing distance preset;
An actuator structure, wherein said actuator structure is provided to be arranged on described frame case Going up and be positioned at the top of described image sensing chip, wherein said actuator structure includes that one sets Put in the lens bearing seat in described frame case and is arranged on described lens bearing seat and It is positioned at the movable lens assembly of the top of described image sensing chip, and the carrying of described camera lens The inside of seat has one and directly arranges around shape movable piece, wherein said movable lens assembly In described second upper horizontal surface of described filter element, to save described movable lens Assembly is relative to the focusing time of described image sensing chip, and described image sensing chip Described second upper horizontal surface of described first upper horizontal surface and described filter element is put down each other OK, flat relative to the assembling of described image sensing chip to increase described movable lens assembly Whole degree;And
By at least two fix colloid described movable lens assembly is fixed on described in enclose In shape movable piece, wherein said movable lens assembly by described around shape movable piece Drive and can be movably arranged as in described lens bearing seat.
The assemble method of image collection module the most according to claim 7, it is characterised in that institute State the top of frame case to have one and be positioned at described image sensing chip and described movable lens Top end opening between assembly, and the described top end opening of described frame case is by described optical filtering Element is closed, and it is described that the bottom of wherein said movable lens assembly has a direct contact The bottom plane of described second upper horizontal surface of filter element, described movable lens assembly Described bottom plane at a distance of described image sensing chip described first upper horizontal surface one Focussing distance is equal to the described second upper horizontal surface described image sense apart of described filter element Survey the described default fixing focussing distance of described first upper horizontal surface of chip, and described Around surface and an outside table of described movable lens assembly in the one of shape movable piece Face is all without thread surface.
The assemble method of image collection module the most according to claim 7, it is characterised in that institute State on a precalculated position of the top that LASER Light Source is arranged on described image sensing chip, with Directly it is incident upon in described first upper horizontal surface of described image sensing chip in producing one First laser beam, described first laser beam produced by described LASER Light Source is by described The reflection of described first upper horizontal surface of image sensing chip and form one and be directly incident upon institute State on precalculated position or the first reflection light beam in the most described precalculated position.
The assemble method of image collection module the most according to claim 7, it is characterised in that institute State on a precalculated position of the top that LASER Light Source is arranged on described filter element, for product Raw one is directly incident upon the second laser in described second upper horizontal surface of described filter element Light beam, described second laser beam produced by described LASER Light Source is by described filter element The reflection of described second upper horizontal surface and form one and be directly incident upon on described precalculated position Or the second reflection light beam in the most described precalculated position.
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TWI768105B (en) * 2018-08-16 2022-06-21 先進光電科技股份有限公司 Optical image capturing module, system and manufacturing method thereof
TWI768103B (en) * 2018-08-16 2022-06-21 先進光電科技股份有限公司 Optical image capturing module、system and manufacturing method thereof
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