CN105898112A - Image obtaining module and assembling method thereof - Google Patents

Image obtaining module and assembling method thereof Download PDF

Info

Publication number
CN105898112A
CN105898112A CN201410190836.2A CN201410190836A CN105898112A CN 105898112 A CN105898112 A CN 105898112A CN 201410190836 A CN201410190836 A CN 201410190836A CN 105898112 A CN105898112 A CN 105898112A
Authority
CN
China
Prior art keywords
image sensing
horizontal
sensing chip
reflecting
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410190836.2A
Other languages
Chinese (zh)
Other versions
CN105898112B (en
Inventor
饶景隆
庄江源
周育德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luxvisions Innovation Ltd
Original Assignee
Lite On Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lite On Technology Corp filed Critical Lite On Technology Corp
Priority to CN201410190836.2A priority Critical patent/CN105898112B/en
Publication of CN105898112A publication Critical patent/CN105898112A/en
Application granted granted Critical
Publication of CN105898112B publication Critical patent/CN105898112B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention relates to an image obtaining module and an assembling method thereof. An image sensing chip of an image sensing unit includes a first horizontal upper surface; a reflection substance is placed on a movable lens assembly of an actuator structure movably and temporarily, and includes a second horizontal upper surface; the first horizontal upper surface is parallel with the second horizontal upper surface to improve the assembling flatness of the movable lens assembly relative to the image sensing chip. The distance from a laser source to the first horizontal upper surface is defined as a first vertical distance, the distance from the laser source to the second horizontal upper surface is defined as a second vertical distance, the first vertical distance is subtracted by the second vertical distance to obtain the distance, as a preset fixed focusing distance, from the second horizontal upper surface to the first horizontal upper surface, and thus, the focusing time of the movable lens assembly relative to the image sensing chip is reduced.

Description

Image collection module and assemble method thereof
Technical field
The present invention relates to a kind of image collection module and assemble method thereof, espespecially a kind of increase flatness and Reduce image collection module and the assemble method thereof of focusing time.
Background technology
In recent years, such as the handheld apparatus such as mobile phone, PDA, there is becoming of image extraction module outfit Gesture is the most more prevalent, and more preferably and volume is less along with the handheld device functional requirement of product market The market demand under, image extraction module has faced the double requirements of more high image quality and miniaturization.For taking As the lifting of module image quality, being on the one hand to improve pixel, the trend in market is by former VGA grade 30 pixels, progressive two the most common mega pixels, three mega pixels, what is more Release the rank of more than eight mega pixels of greater degree.In addition to the lifting of pixel, on the other hand Be be concerned about capture definition, therefore the image extraction module of handheld apparatus also by focus capture function towards Even the auto-optical focusing function of similar photographing unit is optical zoom function development.
The operating principle of auto-optical focusing function be the difference according to subject matter far, closely, with suitable Camera lens in local mobile image extraction module, and then the optical imagery of capture target object is able to accurately Ground focuses on the image sensor, to produce image clearly.With at present the most common arrive in capture Module drives the activation manners that moves of camera lens, its include stepper motor activate, piezoelectric actuated and The modes such as voice coil motor (Voice Coil Motor, VCM) actuating.But, when known image extraction module In imageing sensor and support using circuit board as stacking datum level when sequentially stacking on it, it will Cause support excessive relative to the assembling inclination angle of imageing sensor, cause accessed by known image extraction module Picture quality cannot be improved.Additionally, it is known that image extraction module is relative to imageing sensor The artificial focusing used can expend the much time.
Summary of the invention
The embodiment of the present invention is to provide a kind of Image Acquisition increasing flatness and reducing the focusing time Module and assemble method thereof, its can effectively solve " when the imageing sensor in known image extraction module and Frame is using circuit board as stacking datum level when sequentially stacking on it, it will cause support relative to image The assembling inclination angle of sensor is excessive, causes the image quality accessed by known image extraction module to obtain Effective improvement " and " the artificial focusing that known image extraction module is used relative to imageing sensor can consume Take the much time " defect.
A kind of figure increasing flatness and reducing the focusing time that a present invention wherein embodiment is provided As acquisition module, comprising: an image sensing unit, a frame case, an actuator structure and Reflecting material.Described image sensing unit includes that a bearing substrate and is arranged on described bearing substrate And it is electrically connected at the image sensing chip of described bearing substrate, the top of wherein said image sensing chip End has one by the first upper horizontal surface obtained after the level correction of a LASER Light Source.Described frame Frame housing is arranged on described bearing substrate and surrounds described image sensing chip.Described actuator structure It is arranged in described frame case and is positioned at the top of described image sensing chip, wherein said actuator Structure includes that one is arranged on the lens bearing seat in described frame case and and is arranged on described camera lens and holds Carrying in seat and be positioned at the movable lens assembly of top of described image sensing chip, described camera lens carries The inside of seat has one and passes through at least two fixing glue around shape movable piece, described movable lens assembly Body is described in shape movable piece to be fixed on, and described movable lens assembly is by described around shape The drive of movable piece is to be movably disposed in described lens bearing seat.Described reflecting material is temporarily put Putting on the top of described movable lens assembly, the top of wherein said reflecting material has to be passed through The second upper horizontal surface obtained by after the level correction of described LASER Light Source.Wherein, described image sense Survey chip described first upper horizontal surface and described reflecting material described second upper horizontal surface that This is parallel, smooth relative to the assembling of described image sensing chip to increase described movable lens assembly Degree.Wherein, described LASER Light Source is at a distance of described first upper horizontal surface of described image sensing chip Distance definition is one first vertical dimension, and described LASER Light Source is at a distance of described the second of described reflecting material The distance definition of upper horizontal surface is one second vertical dimension, and described first vertical dimension deducts described Second vertical dimension can obtain described second upper horizontal surface of described reflecting material at a distance of described image The distance of described first upper horizontal surface of sensor chip is a fixing focussing distance preset, to reduce Described movable lens assembly is relative to the focusing time of described image sensing chip.
A kind of figure increasing flatness and reducing the focusing time that the other embodiment of the present invention is provided As the assemble method of acquisition module, it comprises the following steps: to provide an image sensing unit and a framework Housing, wherein said image sensing unit includes that a bearing substrate and is arranged on described bearing substrate And be electrically connected at the image sensing chip of described bearing substrate, and described frame case is arranged on described On bearing substrate and surround described image sensing chip;Described image sensing chip passes through a LASER Light Source Level correction, to obtain table in the first level on a top being positioned at described image sensing chip Face, wherein said LASER Light Source at a distance of described image sensing chip described first upper horizontal surface away from From being defined as one first vertical dimension;Thering is provided an actuator structure, wherein said actuator structure is arranged In described frame case and be positioned at above described image sensing chip, wherein said actuator structure It is arranged on the lens bearing seat in described frame case and including one and is arranged on described lens bearing seat In and be positioned at the movable lens assembly of top of described image sensing chip, and described lens bearing seat Inside have one around shape movable piece;One reflecting material is temporarily placed in described movable lens group On the top of part;Described reflecting material by the level correction of described LASER Light Source, is positioned at obtaining one The second upper horizontal surface on the top of described reflecting material, wherein said image sensing chip described First upper horizontal surface is parallel to each other with described second upper horizontal surface of described reflecting material, to increase Described movable lens assembly is relative to the assembling flatness of described image sensing chip;Can described in adjusting Moving lens assembly relative to the focal length of described first upper horizontal surface of described image sensing chip, with Described reflecting material is driven to move up and down, until described LASER Light Source is at a distance of described reflecting material The distance of described second upper horizontal surface is equal to till one second vertical dimension, wherein said first vertical Distance deducts described second vertical dimension can obtain described second upper horizontal surface of described reflecting material Distance at a distance of described first upper horizontal surface of described image sensing chip is a fixing tune preset Defocus distance, during to reduce described movable lens assembly relative to the focusing of described image sensing chip Between;Colloid is fixed by least two, described around shape so that described movable lens assembly is fixed on In movable piece, wherein said movable lens assembly is by the described drive around shape movable piece, with can It is movably arranged as in described lens bearing seat;And, from described movable lens assembly, remove institute State reflecting material.
Beneficial effects of the present invention can be, image collection module that the embodiment of the present invention is provided and Its assemble method, it can be by " top of described image sensing chip has one by a LASER Light Source Level correction after obtained by the first upper horizontal surface, the top of described reflecting material has to be passed through The second upper horizontal surface obtained by after the level correction of described LASER Light Source, and described image sensing core Described first upper horizontal surface of sheet is put down each other with described second upper horizontal surface of described reflecting material Design OK ", effectively to reduce described movable lens assembly relative to described image sensing chip Assemble inclination angle, thereby to guarantee described movable lens assembly putting down relative to described image sensing chip Whole property.It addition, the image collection module that provided of the embodiment of the present invention and assemble method thereof, it can lead to Cross that " described LASER Light Source is fixed at a distance of the distance of described first upper horizontal surface of described image sensing chip Justice is one first vertical dimension, and described LASER Light Source is in described second level of described reflecting material The distance definition on surface is one second vertical dimension, and described first vertical dimension deducts described second and hangs down Straight distance can obtain described second upper horizontal surface of described reflecting material at a distance of described image sensing core The distance of described first upper horizontal surface of sheet be one preset fixing focussing distance " design, with fall Low described movable lens assembly is relative to the focusing time of described image sensing chip.
It is further understood that inventive feature and technology contents for enabling, refers to below in connection with this Bright detailed description and accompanying drawing, but institute's accompanying drawings only provides reference and explanation use, is not used for this The invention person of being any limitation as.
Accompanying drawing explanation
Fig. 1 is the assembling side that the present invention increases the image collection module of flatness and reduction focusing time The flow chart of method.
Fig. 2 is the side elevational cross-section schematic diagram of step S100 of the present invention and S102.
Fig. 3 is the side elevational cross-section schematic diagram of step S104 of the present invention.
Fig. 4 is the side elevational cross-section schematic diagram of step S106 of the present invention and S108.
Fig. 5 is the side elevational cross-section schematic diagram of step S110 of the present invention.
Fig. 6 is the side elevational cross-section schematic diagram of step S112 of the present invention.
Fig. 7 is the side elevational cross-section schematic diagram of step S114 of the present invention.
[symbol description]
Image collection module M
Image sensing unit 1
Bearing substrate 10
Image sensing chip 11
First upper horizontal surface 110
Frame case 2
Top end opening 200
Actuator structure 3
Lens bearing seat 30
Movable lens assembly 31
First plane 310
Bottom 311
Around shape movable piece 30M
Reflecting material 4
Second upper horizontal surface 400
Second plane 401
Filter element 5
Fixing colloid H
LASER Light Source S
Precalculated position P
First laser beam L1
First reflection light beam R1
Second laser beam L2
Second reflection light beam R2
First vertical dimension D1
Second vertical dimension D2
3rd vertical dimension D3
4th vertical dimension D4
Fixing focussing distance F
First predetermined thickness H1
Second predetermined thickness H2
Detailed description of the invention
" increase flatness below by way of the explanation of specific instantiation is presently disclosed and reduce focusing The image collection module of time and assemble method thereof " embodiment, those of ordinary skill in the art Other advantages and the effect of the present invention can be will readily appreciate that by the content disclosed by this specification.The present invention is also Can be implemented by other different specific embodiments or be applied, the every details in this specification is also Various modification and change can be carried out under without departing from the spirit based on different viewpoints and application. The graphic of the present invention is only simple declaration again, not describes according to actual size, namely unreacted goes out relevant Constitute actual size, first give chat bright.Following embodiment is to further describe the present invention Correlation technique content, but and it is not used to limit the technology category of the present invention.
Referring to shown in Fig. 1 to Fig. 7, the present invention provides a kind of to be increased flatness and reduces the focusing time The assemble method of image collection module M, it generally can include following several step:
First, step S100 is: coordinate shown in Fig. 1 and Fig. 2, it is provided that an image sensing unit 1 And a frame case 2, wherein image sensing unit 1 includes that a bearing substrate 10 and is arranged on carrying On substrate 10 and be electrically connected at the image sensing chip 11 of bearing substrate 10, and frame case 2 It is arranged on bearing substrate 10 and surrounds image sensing chip 11.For example, as in figure 2 it is shown, Image sensing chip 11 can be cmos image sensor chip, and image sensing chip 11 can pass through Adhesion colloid (non-label, such as UV adhesion glue, thermmohardening glue or oven curing glue etc.), To be arranged on bearing substrate 10.It addition, frame case 2 also can pass through adhesion colloid (such as UV Adhesion glue, thermmohardening glue or oven curing glue etc.), to be arranged on bearing substrate 10.Additionally, Bearing substrate 10 can be the circuit substrate that a upper surface has multiple conductive welding pad (non-label), figure As the upper surface of sensor chip 11 has multiple conductive welding pad (non-label), and image sensing chip Each conductive welding pad of 11 can pass through a conductor wire (non-label), to be electrically connected at bearing substrate The conductive welding pad of 10, thereby to reach electrically leading between image sensing chip 11 and bearing substrate 10 Logical.
Then, step S102 is: coordinate shown in Fig. 1, Fig. 2 and Fig. 5, image sensing chip 11 By the level correction of a LASER Light Source S, to obtain on a top being positioned at image sensing chip 11 The first upper horizontal surface 110, the wherein LASER Light Source S-phase the first level away from image sensing chip 11 The distance definition of upper surface 110 is one first vertical dimension D1.For further, LASER Light Source S On the one precalculated position P (such as fixed position) of the top being arranged on image sensing chip 11, with For producing a direct perpendicular projection in the first upper horizontal surface 110 of image sensing chip 11 First laser beam L1.Produced by LASER Light Source S, the first laser beam L1 can pass through image sensing The reflection of the first upper horizontal surface 110 of chip 11, to form a direct perpendicular projection in pre-determined bit Put on P or the first reflection light beam R1 of closely precalculated position P.In other words, image sensing is worked as When the top of chip 11 adjusts to level, the first laser beam L1 passes through image sensing chip 11 Top reflection produced by first reflection light beam R1 will the most vertically be back to precalculated position P On, or the first reflection light beam R1 can produce a deflection in tolerable range of error and very Close to precalculated position P.Now, the top of image sensing chip 11 just can serve as level reference First upper horizontal surface 110.
Then, step S104 is: coordinate shown in Fig. 1 and Fig. 3, it is provided that an actuator structure 3, Wherein actuator structure 3 is arranged in frame case 2 and is positioned at the top of image sensing chip 11, Wherein actuator structure 3 includes a lens bearing seat 30 (lens being arranged in frame case 2 Holder) and one be arranged on lens bearing seat 30 in and be positioned at image sensing chip 11 top can Moving lens assembly 31, and the inside of lens bearing seat 30 has one around shape movable piece 30M. For example, lens bearing seat 30 also can be by adhesion colloid (such as UV adhesion glue, heat Curable paste or oven curing glue etc.), to be arranged in frame case 2, and movable lens Assembly 31 can be made up of multiple optical lenses (non-label).It addition, it is noted that such as Shown in Fig. 3, actuator structure 3 can be a voice coil actuator (voice coil actuator).But, The present invention is not limited, and the actuator structure 3 of the such as present invention one can also have fixed camera lens The optics supplementary structure of assembly replaces.
It follows that step S106 is: coordinate shown in Fig. 1, Fig. 3 and Fig. 4, by a reflecting material On 4 tops being temporarily placed in movable lens assembly 31.For further, movable lens group The top of part 31 has one first plane 310, and it is flat corresponding to first that the bottom of reflecting material 4 has one Face 310 and second plane 401 parallel to each other with the second upper horizontal surface 400, and reflecting material 4 are movably disposed in the first plane 310 of movable lens assembly 31.For example, reflection Material 4 can be the total reflection material of such as reflecting mirror, or can be the half reflection material of such as glass, But the present invention is not limited.
And then, step S108 is: coordinating shown in Fig. 1 and Fig. 4, reflecting material 4 passes through laser The level correction of light source S, to obtain the second upper horizontal surface on a top being positioned at reflecting material 4 400, wherein the second water of the first upper horizontal surface 110 of image sensing chip 11 and reflecting material 4 Flat upper surface 400 can be parallel to each other, to increase movable lens assembly 31 relative to image sensing core The assembling flatness of sheet 11.Accordingly, because the first upper horizontal surface 110 of image sensing chip 11 The second upper horizontal surface 400 meeting with reflecting material 4 is parallel to each other, so the present invention can effectively reduce Movable lens assembly 31 is relative to the assembling inclination angle of image sensing chip 11, thereby to guarantee to move Dynamic lens assembly 31 is relative to the planarization of image sensing chip 11.
For further, LASER Light Source S (such as laser leveler) is arranged on reflecting material 4 On the precalculated position P of top, for producing the direct perpendicular projection the second water at reflecting material 4 The second laser beam L2 on flat upper surface 400.Second laser beam produced by LASER Light Source S L2 can be the most vertical to form one by the reflection of the second upper horizontal surface 400 of reflecting material 4 Be incident upon on the P of precalculated position or closely precalculated position P second reflection light beam R2.In other words, When the top of reflecting material 4 adjusts to level, the second laser beam L2 passes through reflecting material Produced by the reflection on the top of 4, the second reflection light beam R2 will the most vertically be back to precalculated position P On, or the second reflection light beam R2 can produce a deflection in tolerable range of error and very Close to precalculated position P.Now, the top of reflecting material 4 will be formed in parallel with table in the first level Second upper horizontal surface 400 in face 110.
It is noted that the first laser beam L1 produced by LASER Light Source S can also be to tilt It is incident upon in the first upper horizontal surface 110 of image sensing chip 11, and LASER Light Source S is produced The second raw laser beam L2 can also be to tilt to be incident upon the second upper horizontal surface of reflecting material 4 On 400, as long as enable to " the first laser beam L1 top by image sensing chip 11 Reflection produced by first reflection light beam R1 " and " the second laser beam L2 pass through reflecting material 4 Top reflection produced by second reflection light beam R2 " mode in same point can be reflexed to, also Can reach " top of image sensing chip 11 can be parallel to each other with the top of reflecting material 4, with increase Add the movable lens assembly 31 assembling flatness relative to image sensing chip 11 " purpose.
Then, step S110 is: coordinates shown in Fig. 1, Fig. 4 and Fig. 5, adjusts movable lens Assembly 31 is relative to the focal length of the first upper horizontal surface 110 of image sensing chip 11, anti-to drive Penetrate material 4 to move up and down, until LASER Light Source S-phase table in the second level of reflecting material 4 The distance in face 400 is substantially or entirely equal to till one second vertical dimension D2 (as shown in Figure 5), Wherein the first vertical dimension D1 deducts the second vertical dimension D2, can obtain the second water of reflecting material 4 Flat upper surface 400 is one pre-at a distance of the distance of the first upper horizontal surface 110 of image sensing chip 11 If fixing focussing distance F, to reduce movable lens assembly 31 relative to image sensing chip 11 The focusing time.Therefore, first pass through user the most in advance at default fixing focussing distance F and set, and First vertical dimension D1 after the measurement of LASER Light Source S be known under the conditions of, user only needs The distance wanting direct the second upper horizontal surface 400 by LASER Light Source S-phase away from reflecting material 4 is adjusted to Substantially or entirely equal to the second vertical dimension D2, it becomes possible to guarantee that dynamic lens assembly 31 is relative to figure As the distance of the first upper horizontal surface 110 of sensor chip 11 has adjusted to optimal focussing distance, Thereby to reduce the movable lens assembly 31 focusing time relative to image sensing chip 11.
For further, coordinating shown in Fig. 4 and Fig. 5, movable lens assembly 31 has one the One predetermined thickness H1, and reflecting material 4 has one second predetermined thickness H2.Movable lens group First plane 310 of part 31 is at a distance of the distance of the first upper horizontal surface 110 of image sensing chip 11 It is defined as one the 3rd vertical dimension D3, and the bottom 311 of movable lens assembly 31 is at a distance of image The distance definition of the first upper horizontal surface 110 of sensor chip 11 is one the 4th vertical dimension D4.Mat This, the 3rd vertical dimension D3 and the first predetermined thickness H1 are added can be equal to the fixing tune preset Defocus distance F, or the 4th vertical dimension D4, the first predetermined thickness H1 and the second predetermined thickness H2 three is added can be equal to the fixing focussing distance F preset.
Then, step S112 is: coordinate shown in Fig. 1 and Fig. 6, at " image sensing chip 11 The first upper horizontal surface 110 parallel to each other with the second upper horizontal surface 400 of reflecting material 4 " and " distance of the LASER Light Source S-phase the second upper horizontal surface 400 away from reflecting material 4 has been adjusted to substantially Go up or be equal to the second vertical dimension D2 " in the case of, colloid H can be fixed by least two, Movable lens assembly 31 is fixed in shape movable piece 30M, wherein movable lens group Part 31 can be by the drive around shape movable piece 30M, to be movably disposed in lens bearing seat 30 In.
Thereby, by above-mentioned steps S100 to the assembling mode disclosed by step S112, the present invention A kind of image collection module M increasing flatness and reducing the focusing time can be provided, comprising: a figure As sensing unit 1, frame case 2, actuator structure 3 and reflecting material 4, wherein an image The top of sensor chip 11 has one by the first water obtained after the level correction of LASER Light Source S Flat upper surface 110, and the top of reflecting material 4 has one by the level correction of LASER Light Source S The second upper horizontal surface 400 obtained by rear.Thereby, table in the first level of image sensing chip 11 Face 110 is parallel to each other, to increase moveable mirror with the second upper horizontal surface 400 meeting of reflecting material 4 Head assembly 31 is relative to the assembling flatness of image sensing chip 11.It addition, when LASER Light Source S-phase The distance definition of the first upper horizontal surface 110 away from image sensing chip 11 is one first vertical dimension D1, and the distance definition of the second upper horizontal surface 400 that LASER Light Source S-phase is away from reflecting material 4 is In the case of one second vertical dimension D2, after the first vertical dimension D1 deducts the second vertical dimension D2, The second upper horizontal surface 400 of reflecting material 4 will be obtained at a distance of the first of image sensing chip 11 The distance of upper horizontal surface 110 is a fixing focussing distance F preset, thereby to reduce moveable mirror Head assembly 31 is relative to the focusing time of image sensing chip 11.
Additionally, as shown in Figure 6, presently disclosed increase flatness and the image of reduction focusing time Acquisition module M may further comprise: a filter element 5, and wherein filter element 5 is arranged on frame shell On body 2 and between image sensing chip 11 and movable lens assembly 31.Furthermore, frame shell The top of body 2 has a top between image sensing chip 11 and movable lens assembly 31 Opening 200, and the top end opening 200 of frame case 2 closed by filter element 5.
Finally, step S114 is: coordinate shown in Fig. 1, Fig. 6 and Fig. 7, from movable lens group Reflecting material 4 is removed on part 31.
(the possible effect of embodiment)
In sum, beneficial effects of the present invention can be, the image that the embodiment of the present invention is provided Acquisition module M and assemble method thereof, it can be by " top of image sensing chip 11 has one and leads to The first upper horizontal surface 110 obtained after crossing the level correction of LASER Light Source S, reflecting material 4 The second upper horizontal surface 400 that top is obtained after having a level correction passing through LASER Light Source S, And table in the second level of the first upper horizontal surface 110 of image sensing chip 11 and reflecting material 4 Face 400 is parallel to each other " design, effectively to reduce movable lens assembly 31 relative to image sense Survey the assembling inclination angle of chip 11, thereby to guarantee that movable lens assembly 31 is relative to image sensing core The planarization of sheet 11.It addition, the present invention also has can reduce movable lens assembly 31 relative to image The advantage of the focusing time of sensor chip 11.
The foregoing is only the preferred possible embodiments of the present invention, the non-patent model therefore limiting to the present invention Enclose, therefore the equivalence techniques change such as using description of the invention and graphic content to be done, it is both contained in In protection scope of the present invention.

Claims (10)

1. an image collection module, it is characterised in that described image collection module includes:
One image sensing unit, described image sensing unit includes a bearing substrate and a setting On described bearing substrate and be electrically connected at the image sensing chip of described bearing substrate, its Described in the top of image sensing chip have one by institute after the level correction of a LASER Light Source The first upper horizontal surface obtained;
One frame case, described frame case is arranged on described bearing substrate and surrounds described Image sensing chip;
One actuator structure, described actuator structure is arranged in described frame case and is positioned at The top of described image sensing chip, wherein said actuator structure include one be arranged on described Lens bearing seat and one in frame case is arranged in described lens bearing seat and is positioned at described The movable lens assembly of the top of image sensing chip, the inside tool of described lens bearing seat Have one around shape movable piece, described movable lens assembly by least two fix colloid with Be fixed on described in shape movable piece, and described movable lens assembly by described around The drive of shape movable piece is can be movably arranged as in described lens bearing seat;And
One reflecting material, described reflecting material is temporarily placed in described movable lens assembly On top, the top of wherein said reflecting material has a level by described LASER Light Source The second upper horizontal surface obtained by after correction;
Wherein, described first upper horizontal surface of described image sensing chip and described reverberation Described second upper horizontal surface of matter is parallel to each other, to increase described movable lens assembly phase Assembling flatness for described image sensing chip;
Wherein, described LASER Light Source is in described first level of described image sensing chip The distance definition on surface is one first vertical dimension, and described LASER Light Source is at a distance of described reverberation The distance definition of described second upper horizontal surface of matter is one second vertical dimension, and described One vertical dimension deducts described second vertical dimension can obtain described the second of described reflecting material Upper horizontal surface at a distance of the distance of described first upper horizontal surface of described image sensing chip is The one fixing focussing distance preset, to reduce described movable lens assembly relative to described figure The focusing time as sensor chip.
Image collection module the most according to claim 1, it is characterised in that described moveable mirror The described top of head assembly has one first plane, and the bottom of described reflecting material has one Flat corresponding to described first plane and parallel to each other with described second upper horizontal surface second Face, wherein said reverberation mass-energy is movably arranged as the described of described movable lens assembly In first plane, and described reflecting material is total reflection material or half reflection material.
Image collection module the most according to claim 2, it is characterised in that described moveable mirror Head assembly has one first predetermined thickness, and described reflecting material has one second predetermined thickness, Described first plane of described movable lens assembly is described at a distance of described image sensing chip The distance definition of the first upper horizontal surface is one the 3rd vertical dimension, described movable lens group The bottom of part is at a distance of the distance definition of described first upper horizontal surface of described image sensing chip It is one the 4th vertical dimension, and described 3rd vertical dimension and described first predetermined thickness It is added or described 4th vertical dimension, described first predetermined thickness and described second predetermined thickness Three is added equal to described fixing focussing distance.
Image collection module the most according to claim 1, it is characterised in that described LASER Light Source On one precalculated position of the top being arranged on described image sensing chip, for producing always Connect the first laser light in described first upper horizontal surface being incident upon described image sensing chip Restrainting, produced by described LASER Light Source, described first laser beam is by described image sensing core The reflection of described first upper horizontal surface of sheet, is directly incident upon described pre-determined bit forming one Put or the first reflection light beam in the most described precalculated position.
Image collection module the most according to claim 1, it is characterised in that described LASER Light Source On one precalculated position of the top being arranged on described reflecting material, directly throw for producing one Penetrate the second laser beam in described second upper horizontal surface of described reflecting material, described Described second laser beam produced by LASER Light Source passes through described the second of described reflecting material The reflection of upper horizontal surface, is directly incident upon on described precalculated position or connects very much forming one The second reflection light beam in nearly described precalculated position.
6. an image collection module, it is characterised in that described image collection module includes:
One image sensing unit, described image sensing unit includes a bearing substrate and a setting On described bearing substrate and be electrically connected at the image sensing chip of described bearing substrate, its Described in the top of image sensing chip there is one first upper horizontal surface;
One frame case, described frame case is arranged on described bearing substrate and surrounds described Image sensing chip;
One actuator structure, described actuator structure is arranged in described frame case and is positioned at The top of described image sensing chip, wherein said actuator structure include one be arranged on described Lens bearing seat and one in frame case can be movably arranged as in described lens bearing seat and It is positioned at the movable lens assembly of the top of described image sensing chip, and described moveable mirror The top of head assembly has one first plane;And
One reflecting material, described reverberation mass-energy is temporarily placed in described moveable mirror actively In described first plane of head assembly, the top of wherein said reflecting material has one second water Flat upper surface, and the bottom of described reflecting material have one corresponding to described first plane and with The second plane that described second upper horizontal surface is parallel to each other;
Wherein, described first upper horizontal surface of described image sensing chip and described reverberation Described second upper horizontal surface of matter is parallel to each other, to increase described movable lens assembly phase Assembling flatness for described image sensing chip;
Wherein, described LASER Light Source is in described first level of described image sensing chip The distance definition on surface is one first vertical dimension, and described LASER Light Source is at a distance of described reverberation The distance definition of described second upper horizontal surface of matter is one second vertical dimension, and described One vertical dimension deducts described second vertical dimension can obtain described the second of described reflecting material Upper horizontal surface at a distance of the distance of described first upper horizontal surface of described image sensing chip is The one fixing focussing distance preset, to reduce described movable lens assembly relative to described figure The focusing time as sensor chip.
Image collection module the most according to claim 6, it is characterised in that described moveable mirror Head assembly has one first predetermined thickness, and described reflecting material has one second predetermined thickness, Described first plane of described movable lens assembly is described at a distance of described image sensing chip The distance definition of the first upper horizontal surface is one the 3rd vertical dimension, described movable lens group The bottom of part is at a distance of the distance definition of described first upper horizontal surface of described image sensing chip It is one the 4th vertical dimension, and described 3rd vertical dimension and described first predetermined thickness It is added or described 4th vertical dimension, described first predetermined thickness and described second predetermined thickness Three is added equal to described fixing focussing distance.
8. the assemble method of an image collection module, it is characterised in that described image collection module Assemble method comprises the following steps:
One image sensing unit and a frame case, wherein said image sensing unit bag are provided Include a bearing substrate and and be arranged on described bearing substrate and be electrically connected at described carrying base The image sensing chip of plate, and described frame case is arranged on described bearing substrate and surrounds Described image sensing chip;
Described image sensing chip by the level correction of a LASER Light Source, is positioned at obtaining one The first upper horizontal surface on the top of described image sensing chip, wherein said LASER Light Source Distance definition at a distance of described first upper horizontal surface of described image sensing chip is one first Vertical dimension;
An actuator structure, wherein said actuator structure is provided to be arranged on described frame case Going up and be positioned at the top of described image sensing chip, wherein said actuator structure includes that one sets Put in the lens bearing seat in described frame case and is arranged on described lens bearing seat and It is positioned at the movable lens assembly of the top of described image sensing chip, and the carrying of described camera lens The inside of seat has one around shape movable piece;
One reflecting material is temporarily placed on the top of described movable lens assembly;
Described reflecting material by the level correction of described LASER Light Source, is positioned at institute obtaining one State the second upper horizontal surface on the top of reflecting material, wherein said image sensing chip Described second upper horizontal surface of described first upper horizontal surface and described reflecting material is put down each other OK, flat relative to the assembling of described image sensing chip to increase described movable lens assembly Whole degree;
Adjust described movable lens assembly relative to described the of described image sensing chip The focal length of one upper horizontal surface, to drive described reflecting material to move up and down, until institute State the LASER Light Source distance at a distance of described second upper horizontal surface of described reflecting material equal to one Till second vertical dimension, wherein said first vertical dimension deducts described second vertical dimension Described second upper horizontal surface of described reflecting material can be obtained at a distance of described image sensing chip The distance of described first upper horizontal surface be a fixing focussing distance preset, to reduce State the movable lens assembly focusing time relative to described image sensing chip;
Colloid is fixed by least two, described so that described movable lens assembly is fixed on In shape movable piece, wherein said movable lens assembly is by described around shape movable piece Drive, can be movably arranged as in described lens bearing seat;And
Described reflecting material is removed from described movable lens assembly.
The assemble method of image collection module the most according to claim 8, it is characterised in that institute State on a precalculated position of the top that LASER Light Source is arranged on described image sensing chip, with Directly it is incident upon in described first upper horizontal surface of described image sensing chip in producing one First laser beam, described first laser beam produced by described LASER Light Source is by described The reflection of described first upper horizontal surface of image sensing chip, is directly incident upon forming one The first reflection light beam on described precalculated position or the most described precalculated position.
The assemble method of image collection module the most according to claim 8, it is characterised in that institute State on a precalculated position of the top that LASER Light Source is arranged on described reflecting material, for product Raw one is directly incident upon the second laser in described second upper horizontal surface of described reflecting material Light beam, described second laser beam produced by described LASER Light Source is by described reflecting material The reflection of described second upper horizontal surface, be directly incident upon described precalculated position forming one Go up or the second reflection light beam in the most described precalculated position.
CN201410190836.2A 2014-05-07 2014-05-07 Image collection module and its assemble method Active CN105898112B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410190836.2A CN105898112B (en) 2014-05-07 2014-05-07 Image collection module and its assemble method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410190836.2A CN105898112B (en) 2014-05-07 2014-05-07 Image collection module and its assemble method

Publications (2)

Publication Number Publication Date
CN105898112A true CN105898112A (en) 2016-08-24
CN105898112B CN105898112B (en) 2018-11-06

Family

ID=56999863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410190836.2A Active CN105898112B (en) 2014-05-07 2014-05-07 Image collection module and its assemble method

Country Status (1)

Country Link
CN (1) CN105898112B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020034789A1 (en) * 2018-08-14 2020-02-20 宁波舜宇光电信息有限公司 Optical lens, photographing module, and assembling methods therefor
CN111464751A (en) * 2020-05-14 2020-07-28 歌尔光学科技有限公司 Focusing method, focusing apparatus, and readable storage medium

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2606337Y (en) * 2003-03-25 2004-03-10 武汉大学 Gyrotheodolites with laser calibrators
US20090153706A1 (en) * 2007-12-18 2009-06-18 Hon Hai Precision Industry Co., Ltd. Imaging module package
CN202617250U (en) * 2012-06-04 2012-12-19 美细耐斯(上海)电子有限公司 Camera module
CN103279001A (en) * 2013-06-05 2013-09-04 南昌欧菲光电技术有限公司 Support structure and camera shooting module with support structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2606337Y (en) * 2003-03-25 2004-03-10 武汉大学 Gyrotheodolites with laser calibrators
US20090153706A1 (en) * 2007-12-18 2009-06-18 Hon Hai Precision Industry Co., Ltd. Imaging module package
CN202617250U (en) * 2012-06-04 2012-12-19 美细耐斯(上海)电子有限公司 Camera module
CN103279001A (en) * 2013-06-05 2013-09-04 南昌欧菲光电技术有限公司 Support structure and camera shooting module with support structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020034789A1 (en) * 2018-08-14 2020-02-20 宁波舜宇光电信息有限公司 Optical lens, photographing module, and assembling methods therefor
CN111464751A (en) * 2020-05-14 2020-07-28 歌尔光学科技有限公司 Focusing method, focusing apparatus, and readable storage medium

Also Published As

Publication number Publication date
CN105898112B (en) 2018-11-06

Similar Documents

Publication Publication Date Title
CN106662796B (en) Use the folding optical array camera of refracting prisms
US9860434B2 (en) Auto-focus in low-profile folded optics multi-camera system
CN106464787B (en) Automatic focusing for folded-optics array camera
CN106415386A (en) Multi-camera system using folded optics free from parallax and tilt artifacts
CN103988115B (en) Optical image stabilization
CN104469105A (en) Camera module
CN109302556A (en) Anti-shaking structure, stabilization system and the photographic device with it
CN105898112A (en) Image obtaining module and assembling method thereof
CN105100556A (en) Image acquisition module
JP6816967B2 (en) Imaging equipment and imaging equipment
CN110913096A (en) Camera module and electronic equipment
CN107589509A (en) Suitable for the assembly method of the camera system of mobile terminal
CN104270557B (en) Camera module
CN105898113B (en) Image collection module and its assemble method
CN110661950A (en) Camera module and electronic equipment
CN203423737U (en) Image obtaining module and optical auxiliary unit thereof
CN206946071U (en) A kind of camera module of auto-focusing
CN105025206B (en) Image acquisition module and its assemble method for increasing assembling flatness
US9413998B2 (en) Image capturing module for increasing assembly flatness and shortening focusing time and method of assembling the same
CN105025204A (en) Image acquisition module
TWI503589B (en) Image capturing module for increasing assembly flatness and decreasing focusing time and method of assembling the same
US9432560B2 (en) Image capturing module for saving focusing time and increasing assembly flatness and method of assembling the same
US9319608B2 (en) Image capturing module for increasing assembly flatness and method of assembling the same
US11039117B2 (en) Dual lens imaging module and capturing method thereof
CN106464859A (en) Camera module and mobile terminal including same

Legal Events

Date Code Title Description
PB01 Publication
C06 Publication
SE01 Entry into force of request for substantive examination
C10 Entry into substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20180920

Address after: Room 2018, Sha Tin business centre, 24 Sha Tau Street, 18, Fo Tan Shan, New Territories, Hongkong, China

Applicant after: Lijing Innovation Co., Ltd.

Address before: Taipei City, Taiwan, China

Applicant before: Lite-On Technology Corporation

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20201106

Address after: No. 25 West Road, Science City, Guangzhou high tech Industrial Development Zone, Guangdong, China

Patentee after: LUXVISIONS INNOVATION Ltd.

Address before: Room 2018, Sha Tin business centre, 24 Sha Tau Street, 18, Fo Tan Shan, New Territories, Hongkong, China

Patentee before: Lijing Innovation Co.,Ltd.

TR01 Transfer of patent right