CN105898112B - Image collection module and its assemble method - Google Patents
Image collection module and its assemble method Download PDFInfo
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- CN105898112B CN105898112B CN201410190836.2A CN201410190836A CN105898112B CN 105898112 B CN105898112 B CN 105898112B CN 201410190836 A CN201410190836 A CN 201410190836A CN 105898112 B CN105898112 B CN 105898112B
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Abstract
A kind of image collection module and its assemble method.The image sensing chip of image sensing unit has first level upper surface.Reflecting material is movably temporarily placed in the moveable mirror head assembly of actuator structure.Reflecting material has the second upper horizontal surface.First level upper surface and the second upper horizontal surface are parallel to each other, to increase assembling flatness of the moveable mirror head assembly relative to image sensing chip.Distance definition of the laser light source at a distance of first level upper surface is one first vertical range, laser light source is one second vertical range at a distance of the distance definition of the second upper horizontal surface, and first vertical range subtract the second vertical range can obtain the second upper horizontal surface at a distance of first level upper surface distance be a preset fixed focussing distance, to reduce focusing time of the moveable mirror head assembly relative to image sensing chip.
Description
Technical field
The present invention relates to a kind of image collection module and its assemble method, espespecially a kind of increase flatness and reduce focusing when
Between image collection module and its assemble method.
Background technology
In recent years, such as mobile phone, PDA handheld apparatus have the trend of image extraction module outfit more prevalent,
And along with the handheld device functional requirement of product market is more preferable and the smaller market demand of volume under, image extraction module has faced
To the double requirements of higher-definition and miniaturization.On the one hand it is to improve pixel, market becomes for the promotion of image extraction module image quality
Gesture has been improved to common two mega pixels, three mega pixels on the market at present, more very by 30 pixels of former VGA grades
Person has released the rank of eight mega pixels of greater degree or more.On the other hand it is to be concerned about capture other than the promotion of pixel
Clarity, therefore the image extraction module of handheld apparatus is also by fixed-focus capture function towards the auto-optical focusing work(similar to camera
Even can, be optical zoom function development.
The operating principle of auto-optical focusing function is the different remote, short distances according to subject matter, is taken with suitably movement
As mould camera lens in the block so that the optical imagery of capture target object be able to accurately focus on the image sensor, with
Generate clearly image.With it is general at present it is common to the activation manners that camera lens movement is driven in image extraction module comprising have
The modes such as stepper motor actuating, piezoelectric actuated and voice coil motor (Voice Coil Motor, VCM) actuating.However, when known
When imaging sensor and holder in image extraction module are sequentially stacked thereon using circuit board as stacking reference plane, it will cause to prop up
Frame is excessive relative to the assembling inclination angle of imaging sensor, and the picture quality accessed by known image extraction module is caused to be unable to get
The improvement of effect.Additionally, it is known that image extraction module is relative to manually focusing can expend many times used by imaging sensor.
Invention content
The embodiment of the present invention is to provide a kind of image collection module and its group for increasing flatness and reducing the focusing time
Dress method, can effectively solve " when in known image extraction module imaging sensor and holder using circuit board as stack reference plane
And when sequentially stacking thereon, it will cause holder excessive relative to the assembling inclination angle of imaging sensor, cause known image extraction module
Accessed image quality is unable to get effective improvement " and " known image extraction module is relative to used by imaging sensor
Artificial focusing can expend many times " defect.
A kind of increase flatness that a present invention wherein embodiment is provided and the image collection module for reducing the focusing time,
It includes：One image sensing unit, a frame case, an actuator structure and a reflecting material.Described image sensing unit packet
It includes a bearing substrate and one is arranged on the bearing substrate and is electrically connected at the image sensing chip of the bearing substrate,
Described in image sensing chip top have a level correction by a laser light source after obtained first level upper table
Face.The frame case is arranged on the bearing substrate and surrounds described image sensor chip.The actuator structure setting
Top in the frame case and positioned at described image sensor chip, wherein the actuator structure is arranged including one in institute
It states the lens bearing seat in frame case and one is arranged in the lens bearing seat and upper positioned at described image sensor chip
The inside of the moveable mirror head assembly of side, the lens bearing seat has one to surround shape movable member, the moveable mirror head assembly
It is described in shape movable member to be fixed on by least two fixation colloids, and the moveable mirror head assembly is enclosed by described
Around the drive of shape movable member to be movably disposed in the lens bearing seat.The reflecting material be temporarily placed in it is described can
On the top of moving lens component, wherein after the top of the reflecting material has a level correction by the laser light source
Obtained second upper horizontal surface.Wherein, the first level upper surface of described image sensor chip and the reverberation
Second upper horizontal surface of matter is parallel to each other, to increase the moveable mirror head assembly relative to described image sensor chip
Assembling flatness.Wherein, distance of the laser light source at a distance of the first level upper surface of described image sensor chip
It is defined as one first vertical range, the laser light source is fixed at a distance of the distance of second upper horizontal surface of the reflecting material
Justice is one second vertical range, and first vertical range subtracts second vertical range can obtain the reflecting material
Distance of second upper horizontal surface at a distance of the first level upper surface of described image sensor chip is one preset solid
It sets the tone defocus distance, to reduce focusing time of the moveable mirror head assembly relative to described image sensor chip.
A kind of increase flatness that the other embodiment of the present invention is provided and the image collection module for reducing the focusing time
Assemble method comprising the following steps：One image sensing unit and a frame case, wherein described image sensing unit are provided
It is arranged on the bearing substrate and is electrically connected at the image sensing chip of the bearing substrate including a bearing substrate and one,
And the frame case is arranged on the bearing substrate and surrounds described image sensor chip；Described image sensor chip passes through
The level correction of one laser light source, to obtain a first level upper surface being located on the top of described image sensor chip,
Described in distance definition of the laser light source at a distance of the first level upper surface of described image sensor chip be one first vertical
Distance；An actuator structure is provided, wherein the actuator structure is arranged in the frame case and is located at described image sense
The top of chip is surveyed, wherein the actuator structure includes a lens bearing seat being arranged in the frame case and a setting
The moveable mirror head assembly of top in the lens bearing seat and positioned at described image sensor chip, and the camera lens carries
The inside of seat has one to surround shape movable member；One reflecting material is temporarily placed on the top of the moveable mirror head assembly；
The reflecting material by the level correction of the laser light source, with obtain one be located on the top of the reflecting material second
Upper horizontal surface, wherein second water of the first level upper surface of described image sensor chip and the reflecting material
Flat upper surface is parallel to each other, to increase assembling flatness of the moveable mirror head assembly relative to described image sensor chip；
Focal length of the moveable mirror head assembly relative to the first level upper surface of described image sensor chip is adjusted, to drive
The reflecting material moves up and down, until the laser light source is at a distance of second upper horizontal surface of the reflecting material
Distance be equal to one second vertical range until, wherein first vertical range, which subtracts second vertical range, can obtain institute
State distance of second upper horizontal surface at a distance of the first level upper surface of described image sensor chip of reflecting material
For a preset fixed focussing distance, when reducing focusing of the moveable mirror head assembly relative to described image sensor chip
Between；Colloids are fixed by least two, the moveable mirror head assembly is fixed on to described in shape movable member, wherein institute
Moveable mirror head assembly is stated by the drive for surrounding shape movable member, to be movably disposed in the lens bearing seat；
And it is moved up from the moveable mirror head assembly except the reflecting material.
Beneficial effects of the present invention can be, the image collection module and its assembling side that the embodiment of the present invention is provided
Method, can be by the way that " top of described image sensor chip has obtained the after a level correction by a laser light source
The top of one upper horizontal surface, the reflecting material has obtained second after a level correction by the laser light source
Upper horizontal surface, and second level of the first level upper surface of described image sensor chip and the reflecting material
Upper surface is parallel to each other " design, effectively to reduce group of the moveable mirror head assembly relative to described image sensor chip
Inclination angle is filled, thereby to ensure planarization of the moveable mirror head assembly relative to described image sensor chip.In addition, of the invention
The image collection module and its assemble method that embodiment is provided, can be by the way that " laser light source is sensed at a distance of described image
The distance definition of the first level upper surface of chip is one first vertical range, and the laser light source is at a distance of the reverberation
The distance definition of second upper horizontal surface of matter is one second vertical range, and first vertical range subtracts described the
Two vertical ranges can obtain second upper horizontal surface of the reflecting material at a distance of described the of described image sensor chip
The distance of one upper horizontal surface be a preset fixed focussing distance " design, it is opposite to reduce the moveable mirror head assembly
In the focusing time of described image sensor chip.
For the enabled feature and technology contents for being further understood that the present invention, please refer to below in connection with the present invention specifically
Bright and attached drawing, however institute's accompanying drawings are only for reference and description, the person of being not intended to limit the present invention.
Description of the drawings
Fig. 1 is that the present invention increases flatness and reduces the flow chart of the assemble method of the image collection module of focusing time.
Fig. 2 is the side elevational cross-section schematic diagram of step S100 and S102 of the present invention.
Fig. 3 is the side elevational cross-section schematic diagram of step S104 of the present invention.
Fig. 4 is the side elevational cross-section schematic diagram of step S106 and S108 of the present invention.
Fig. 5 is the side elevational cross-section schematic diagram of step S110 of the present invention.
Fig. 6 is the side elevational cross-section schematic diagram of step S112 of the present invention.
Fig. 7 is the side elevational cross-section schematic diagram of step S114 of the present invention.
【Symbol description】
Image collection module M
Image sensing unit 1
Bearing substrate 10
Image sensing chip 11
First level upper surface 110
Frame case 2
Top end opening 200
Actuator structure 3
Lens bearing seat 30
Moveable mirror head assembly 31
First plane 310
Bottom end 311
Around shape movable member 30M
Reflecting material 4
Second upper horizontal surface 400
Second plane 401
Filter element 5
Fixed colloid H
Laser light source S
Precalculated position P
First laser light beam L1
First the reflected beams R1
Second laser light beam L2
Second the reflected beams R2
First vertical range D1
Second vertical range D2
Third vertical range D3
4th vertical range D4
Fixed focussing distance F
First predetermined thickness H1
Second predetermined thickness H2
Specific implementation mode
Illustrate presently disclosed " increase flatness and the image for reducing the focusing time below by way of specific specific example
The embodiment of acquisition module and its assemble method ", those skilled in the art can be by the contents disclosed by this specification
It will readily appreciate that other advantages and effect of the present invention.The present invention also can be implemented or be answered by other different specific embodiments
With the various details in this specification may be based on different viewpoints and application, various in lower progress without departing from the spirit
Modification and change.The schema of the present invention is only to briefly describe again, not describes according to actual size namely unreacted goes out related composition
Actual size, first give chat it is bright.The following embodiments and the accompanying drawings is the relevant technologies content that present invention be described in more detail, but not
To limit the technology scope of the present invention.
It please refers to Fig.1 to shown in Fig. 7, the present invention provides a kind of image acquisition mould for increasing flatness and reducing the focusing time
The assemble method of block M generally may include following several steps：
First, step S100 is：Coordinate shown in Fig. 1 and Fig. 2, an image sensing unit 1 and a frame case 2 be provided,
Middle image sensing unit 1 is arranged on bearing substrate 10 including a bearing substrate 10 and one and is electrically connected at bearing substrate 10
Image sensing chip 11, and frame case 2 is arranged on bearing substrate 10 and surrounds image sensing chip 11.For example,
As shown in Fig. 2, image sensing chip 11 can be cmos image sensor chip, and image sensing chip 11 can pass through adhesion colloid
(non-label, such as UV adhesion glues, thermmohardening glue or oven curing glue etc.), to be arranged on bearing substrate 10.In addition, frame
Frame shell 2 can also carried by adhesion colloid (such as UV adhesion glues, thermmohardening glue or oven curing glue etc.) with setting
On substrate 10.In addition, bearing substrate 10 can be the circuit board that a upper surface has multiple conductive welding pad (not labeled), image sense
The upper surface for surveying chip 11 has multiple conductive welding pad (not labeled), and each conductive welding pad of image sensing chip 11 can
By a conductor wire (not labeled), to be electrically connected at the conductive welding pad of bearing substrate 10, thereby to reach image sensing chip
Electrically conducting between 11 and bearing substrate 10.
Then, step S102 is：Coordinate shown in Fig. 1, Fig. 2 and Fig. 5, image sensing chip 11 passes through a laser light source S's
Level correction, to obtain a first level upper surface 110 being located on the top of image sensing chip 11, wherein laser light source S
Distance definition at a distance of the first level upper surface 110 of image sensing chip 11 is one first vertical range D1.Further to
It saying, laser light source S is arranged on a precalculated position P (such as fixed position) of the top of image sensing chip 11, for
Generate first laser light beam L1 of the direct perpendicular projection on the first level upper surface 110 of image sensing chip 11.Laser
First laser light beam L1 caused by light source S can be by the reflection of the first level upper surface 110 of image sensing chip 11, with shape
The first the reflected beams R1 at a direct perpendicular projection on the P of precalculated position or very close to precalculated position P.In other words, work as figure
When adjusting to horizontality as the top of sensor chip 11, first laser light beam L1 is anti-by the top of image sensing chip 11
First the reflected beams R1 caused by penetrating directly will be vertically back on the P of precalculated position or the first the reflected beams R1 meetings
Generate a deflection in tolerable error range and closely precalculated position P.At this point, the top of image sensing chip 11 is just
It is the first level upper surface 110 that can be used as horizontal plane.
Then, step S104 is：Coordinate shown in Fig. 1 and Fig. 3, provides an actuator structure 3, wherein actuator structure 3 is set
The top in frame case 2 and positioned at image sensing chip 11 is set, wherein actuator structure 3 includes a setting in frame case
Lens bearing seat 30 (lens holder) and one on 2 are arranged in lens bearing seat 30 and positioned at image sensing chips 11
The moveable mirror head assembly 31 of top, and the inside of lens bearing seat 30 has one to surround shape movable member 30M.For example,
Lens bearing seat 30 is also can be by adhesion colloid (such as UV adhesion glues, thermmohardening glue or oven curing glue etc.), to set
It sets in frame case 2, and moveable mirror head assembly 31 can be made of multiple optical lens (not labeled).In addition, being worth
One is mentioned that, as shown in figure 3, actuator structure 3 can be a voice coil actuator (voice coil actuator).However, this hair
It is bright to be not limited, such as the actuator structure 3 of the present invention can also an optics supplementary structure with fixed lens assembly
To replace.
Next, step S106 is：Coordinate shown in Fig. 1, Fig. 3 and Fig. 4, a reflecting material 4 is temporarily placed in removable
On the top of lens assembly 31.More specifically, the top of moveable mirror head assembly 31 has one first plane 310, reflection
The bottom end of substance 4 has one to correspond to the first plane 310 and second plane 401 parallel to each other with the second upper horizontal surface 400,
And reflecting material 4 is movably disposed in the first plane 310 of moveable mirror head assembly 31.For example, reflecting material 4
It can be the total reflection substance of such as speculum, or can be the half reflection substance of such as glass, but invention is not limited thereto.
And then, step S108 is：Coordinate shown in Fig. 1 and Fig. 4, reflecting material 4 by the level correction of laser light source S,
To obtain second upper horizontal surface 400 being located on the top of reflecting material 4, the wherein first level of image sensing chip 11
Second upper horizontal surface 400 of upper surface 110 and reflecting material 4 can be parallel to each other, opposite to increase moveable mirror head assembly 31
In the assembling flatness of image sensing chip 11.Therefore, because the first level upper surface 110 of image sensing chip 11 and reflection
Second upper horizontal surface 400 of substance 4 can be parallel to each other, thus the present invention can effectively reduce moveable mirror head assembly 31 relative to
The assembling inclination angle of image sensing chip 11, thereby to ensure moveable mirror head assembly 31 relative to the smooth of image sensing chip 11
Property.
More specifically, laser light source S (such as laser leveler) is arranged in the precalculated position of the top of reflecting material 4
On P, for generating second laser light beam L2 of the direct perpendicular projection in the second upper horizontal surface 400 of reflecting material 4.
Second laser light beam L2 caused by laser light source S can be by the reflection of the second upper horizontal surface 400 of reflecting material 4, with shape
The second the reflected beams R2 at a direct perpendicular projection on the P of precalculated position or very close to precalculated position P.In other words, when anti-
When penetrating the top of substance 4 and adjusting to horizontality, caused by reflections of the second laser light beam L2 by the top of reflecting material 4
Second the reflected beams R2 directly will be vertically back on the P of precalculated position or the second the reflected beams R2 will produce one can
Deflection in range of allowable error and very close precalculated position P.At this point, the top of reflecting material 4 will be formed in parallel with
Second upper horizontal surface 400 of one upper horizontal surface 110.
It is noted that first laser light beam L1 caused by laser light source S can also be that inclination is incident upon image sense
It surveys on the first level upper surface 110 of chip 11, and second laser light beam L2 caused by laser light source S can also be to tilt
It is incident upon in the second upper horizontal surface 400 of reflecting material 4, as long as enabling to that " first laser light beam L1 passes through image sense
Survey the first the reflected beams R1 " and " top that second laser light beam L2 passes through reflecting material 4 caused by the reflection on the top of chip 11
Second the reflected beams R2 " caused by the reflection at end can be reflected into the mode in same point, also can reach " image sensing chip 11
Top and the top of reflecting material 4 can be parallel to each other, to increase moveable mirror head assembly 31 relative to image sensing chip 11
Assembling flatness " purpose.
Then, step S110 is：Coordinate shown in Fig. 1, Fig. 4 and Fig. 5, adjustment moveable mirror head assembly 31 is relative to image sense
The focal length for surveying the first level upper surface 110 of chip 11, to drive reflecting material 4 to move up and down, until laser light source S phases
The distance of the second upper horizontal surface 400 away from reflecting material 4 (is such as schemed until being substantially or entirely equal to one second vertical range D2
Shown in 5), wherein the first vertical range D1 subtracts the second vertical range D2, the second upper horizontal surface of reflecting material 4 can be obtained
400 distance at a distance of the first level upper surface 110 of image sensing chip 11 is a preset fixed focussing distance F, to reduce
Focusing time of the moveable mirror head assembly 31 relative to image sensing chip 11.Therefore, pre- in preset fixed focussing distance F
User's setting is first passed through, and under the conditions of the first vertical range D1 is known after the measurement of laser light source S, user is only
It needs directly to be adjusted to laser light source S substantially or entirely etc. at a distance of the distance of the second upper horizontal surface 400 of reflecting material 4
In the second vertical range D2, it will be able to ensure first level upper surface of the index glass head assembly 31 relative to image sensing chip 11
110 distance has been adjusted to best focussing distance, thereby to reduce moveable mirror head assembly 31 relative to image sensing chip
11 focusing time.
More specifically, coordinating shown in Fig. 4 and Fig. 5, moveable mirror head assembly 31 has one first predetermined thickness H1, and
And reflecting material 4 has one second predetermined thickness H2.First plane 310 of moveable mirror head assembly 31 is at a distance of image sensing chip
The distance definition of 11 first level upper surface 110 is a third vertical range D3, and the bottom end of moveable mirror head assembly 31
311 distance definition at a distance of the first level upper surface 110 of image sensing chip 11 is one the 4th vertical range D4.Thereby,
Both three vertical range D3 and first predetermined thickness H1 are added that be equal to preset fixed focussing distance F or the 4th vertical
Distance D4, the first predetermined thickness H1 are added with the second predetermined thickness H2 three can be equal to preset fixed focussing distance F.
Then, step S112 is：Coordinate shown in Fig. 1 and Fig. 6, in " the first level upper surface 110 of image sensing chip 11
It is parallel to each other with the second upper horizontal surface 400 of reflecting material 4 " and " laser light source S is in the second level of reflecting material 4
The distance on surface 400 has been adjusted in the case of being substantially or entirely equal to the second vertical range D2 ", can be solid by least two
Determine colloid H, moveable mirror head assembly 31 is fixed in shape movable member 30M, wherein moveable mirror head assembly 31 can lead to
The drive around shape movable member 30M is crossed, to be movably disposed in lens bearing seat 30.
Thereby, the assembling mode disclosed by S100 to step S112 through the above steps, the present invention can provide a kind of increases
Flatness and the image collection module M for reducing the focusing time comprising：One image sensing unit 1, a frame case 2, one actuating
After device structure 3 and a reflecting material 4, the wherein top of image sensing chip 11 have a level correction by laser light source S
Obtained first level upper surface 110, and the top of reflecting material 4 is with after a level correction by laser light source S
Obtained second upper horizontal surface 400.Thereby, the first level upper surface 110 of image sensing chip 11 and reflecting material 4
Second upper horizontal surface 400 can be parallel to each other, to increase assembling of the moveable mirror head assembly 31 relative to image sensing chip 11
Flatness.In addition, when distance definitions of the laser light source S at a distance of the first level upper surface 110 of image sensing chip 11 is one the
One vertical range D1, and laser light source S is one second at a distance of the distance definition of the second upper horizontal surface 400 of reflecting material 4
In the case of vertical range D2, after the first vertical range D1 subtracts the second vertical range D2, it will obtain the second of reflecting material 4
Distance of the upper horizontal surface 400 at a distance of the first level upper surface 110 of image sensing chip 11 is that a preset fixation focalizes
From F, thereby to reduce focusing time of the moveable mirror head assembly 31 relative to image sensing chip 11.
In addition, as shown in fig. 6, it is presently disclosed increase flatness and reduce focusing the time image collection module M also
Further comprise：One filter element 5, wherein filter element 5 are arranged in frame case 2 and are located at image sensing chip 11 and can
Between moving lens component 31.Furthermore the top of frame case 2 has one to be located at image sensing chip 11 and movable lens group
Top end opening 200 between part 31, and the top end opening 200 of frame case 2 is closed by filter element 5.
Finally, step S114 is：Coordinate shown in Fig. 1, Fig. 6 and Fig. 7, reflecting material is removed from moveable mirror head assembly 31
4。
(the possibility effect of embodiment)
In conclusion beneficial effects of the present invention can be, image collection module M that the embodiment of the present invention is provided and
Its assemble method, can be by the way that " top of image sensing chip 11 is with one by acquired after the level correction of laser light source S
First level upper surface 110, the top of reflecting material 4 has obtained the after a level correction by laser light source S
Two upper horizontal surfaces 400, and the second horizontal upper table of the first level upper surface 110 of image sensing chip 11 and reflecting material 4
Face 400 is parallel to each other " design, inclined relative to the assembling of image sensing chip 11 with effectively reducing moveable mirror head assembly 31
Angle, thereby to ensure planarization of the moveable mirror head assembly 31 relative to image sensing chip 11.It can be dropped in addition, the present invention also has
The advantages of focusing time of the low moveable mirror head assembly 31 relative to image sensing chip 11.
The foregoing is merely the preferred possible embodiments of the present invention, non-therefore the limitation present invention the scope of the claims, therefore such as
The equivalence techniques variation done with description of the invention and schema content, is both contained in protection scope of the present invention.
Claims (10)
1. a kind of image collection module, which is characterized in that described image acquisition module includes：
One image sensing unit, described image sensing unit include that a bearing substrate and a setting are on the bearing substrate and electric
Property be connected to the image sensing chip of the bearing substrate, the wherein top of described image sensor chip has one to pass through a laser
Obtained first level upper surface after the level correction of light source；
One frame case, the frame case are arranged on the bearing substrate and surround described image sensor chip；
One actuator structure, the actuator structure are arranged in the frame case and positioned at the upper of described image sensor chip
Side is arranged wherein the actuator structure includes a lens bearing seat being arranged in the frame case and one in the camera lens
The moveable mirror head assembly of top in bearing seat and positioned at described image sensor chip, the inside of the lens bearing seat has
One surrounds shape movable member, and the moveable mirror head assembly is fixed on described around shape movable member by least two fixation colloids
It is interior, and the moveable mirror head assembly is carried by the drive around shape movable member with that can be movably arranged as the camera lens
In seat；And
One reflecting material, the reflecting material is temporarily placed on the top of the moveable mirror head assembly, wherein the reflection
The top of substance has obtained second upper horizontal surface after a level correction by the laser light source；
Wherein, the described second horizontal upper table of the first level upper surface of described image sensor chip and the reflecting material
Face is parallel to each other, to increase assembling flatness of the moveable mirror head assembly relative to described image sensor chip；
Wherein, distance definition of the laser light source at a distance of the first level upper surface of described image sensor chip is one the
One vertical range, the laser light source are one second at a distance of the distance definition of second upper horizontal surface of the reflecting material
Vertical range, and first vertical range subtracts second vertical range can obtain second water of the reflecting material
Distance of the flat upper surface at a distance of the first level upper surface of described image sensor chip is a preset fixed focussing distance,
To reduce focusing time of the moveable mirror head assembly relative to described image sensor chip.
2. image collection module according to claim 1, which is characterized in that the top of the moveable mirror head assembly
With one first plane, and the bottom end of the reflecting material have one correspond to first plane and in second level
Surface the second plane parallel to each other, wherein the reflecting material can be movably arranged as the described of the moveable mirror head assembly
In first plane, and the reflecting material is total reflection substance or half reflection substance.
3. image collection module according to claim 2, which is characterized in that the moveable mirror head assembly has one first
Predetermined thickness, the reflecting material have one second predetermined thickness, and first plane of the moveable mirror head assembly is apart
The distance definition of the first level upper surface of described image sensor chip is a third vertical range, the movable lens
Distance definition of the bottom end of component at a distance of the first level upper surface of described image sensor chip is one the 4th vertical range,
And both the third vertical range and described first predetermined thickness are added or the 4th vertical range, the first predetermined thickness
Degree is added with the second predetermined thickness three is equal to the fixed focussing distance.
4. image collection module according to claim 1, which is characterized in that the laser light source is arranged in described image sense
It surveys on a precalculated position of the top of chip, for generating first water for being directly incident upon described image sensor chip
First laser light beam on flat upper surface, the first laser light beam caused by the laser light source are sensed by described image
The reflection of the first level upper surface of chip is directly incident upon with formation one on the precalculated position or very close described
First the reflected beams in precalculated position.
5. image collection module according to claim 1, which is characterized in that the laser light source is arranged in the reverberation
On one precalculated position of the top of matter, for generating second upper horizontal surface for being directly incident upon the reflecting material
On second laser light beam, the second laser light beam caused by the laser light source pass through the reflecting material described
The reflection of two upper horizontal surfaces, with formed one be directly incident upon on the precalculated position or the very close precalculated position the
Two the reflected beams.
6. a kind of image collection module, which is characterized in that described image acquisition module includes：
One image sensing unit, described image sensing unit include that a bearing substrate and a setting are on the bearing substrate and electric
Property be connected to the image sensing chip of the bearing substrate, the wherein top of described image sensor chip has in a first level
Surface；
One frame case, the frame case are arranged on the bearing substrate and surround described image sensor chip；
One actuator structure, the actuator structure are arranged in the frame case and positioned at the upper of described image sensor chip
Side, can be movably arranged as wherein the actuator structure includes a lens bearing seat being arranged in the frame case and one
The moveable mirror head assembly of top in the lens bearing seat and positioned at described image sensor chip, and the movable lens
The top of component has one first plane；And
One reflecting material, the reflecting material can actively be temporarily placed in first plane of the moveable mirror head assembly
On, wherein the top of the reflecting material has one second upper horizontal surface, and the bottom end of the reflecting material has one to correspond to
In first plane and second plane parallel to each other with second upper horizontal surface；
Wherein, the described second horizontal upper table of the first level upper surface of described image sensor chip and the reflecting material
Face is parallel to each other, to increase assembling flatness of the moveable mirror head assembly relative to described image sensor chip；
Wherein, distance definition of the laser light source at a distance of the first level upper surface of described image sensor chip is one first
Vertical range, the laser light source are one second vertical at a distance of the distance definition of second upper horizontal surface of the reflecting material
Straight distance, and first vertical range subtracts second vertical range can obtain the described second horizontal of the reflecting material
Distance of the upper surface at a distance of the first level upper surface of described image sensor chip is a preset fixed focussing distance, with
Reduce focusing time of the moveable mirror head assembly relative to described image sensor chip.
7. image collection module according to claim 6, which is characterized in that the moveable mirror head assembly has one first
Predetermined thickness, the reflecting material have one second predetermined thickness, and first plane of the moveable mirror head assembly is apart
The distance definition of the first level upper surface of described image sensor chip is a third vertical range, the movable lens
Distance definition of the bottom end of component at a distance of the first level upper surface of described image sensor chip is one the 4th vertical range,
And both the third vertical range and described first predetermined thickness are added or the 4th vertical range, the first predetermined thickness
Degree is added with the second predetermined thickness three is equal to the fixed focussing distance.
8. a kind of assemble method of image collection module, which is characterized in that under the assemble method of described image acquisition module includes
Row step：
An image sensing unit and a frame case are provided, wherein described image sensing unit includes a bearing substrate and a setting
On the bearing substrate and it is electrically connected at the image sensing chip of the bearing substrate, and the frame case is arranged in institute
It states on bearing substrate and surrounds described image sensor chip；
Described image sensor chip is by the level correction of a laser light source, to obtain a top for being located at described image sensor chip
First level upper surface on end, wherein the laser light source is at a distance of the first level upper surface of described image sensor chip
Distance definition be one first vertical range；
An actuator structure is provided, wherein the actuator structure is arranged in the frame case and is sensed positioned at described image
The top of chip exists wherein the actuator structure includes a lens bearing seat being arranged in the frame case and a setting
The moveable mirror head assembly of top in the lens bearing seat and positioned at described image sensor chip, and the lens bearing seat
Inside have one surround shape movable member；
One reflecting material is temporarily placed on the top of the moveable mirror head assembly；
The reflecting material is located at obtaining one on the top of the reflecting material by the level correction of the laser light source
Described the of second upper horizontal surface, wherein the first level upper surface of described image sensor chip and the reflecting material
Two upper horizontal surfaces are parallel to each other, smooth relative to the assembling of described image sensor chip to increase the moveable mirror head assembly
Degree；
Focal length of the moveable mirror head assembly relative to the first level upper surface of described image sensor chip is adjusted, with
The reflecting material is driven to move up and down, until the laser light source is in second level of the reflecting material
Until the distance on surface is equal to one second vertical range, it can be obtained wherein first vertical range subtracts second vertical range
To the reflecting material second upper horizontal surface at a distance of the first level upper surface of described image sensor chip
Distance is a preset fixed focussing distance, to reduce tune of the moveable mirror head assembly relative to described image sensor chip
The burnt time；
Fix colloids by least two, the moveable mirror head assembly is fixed on it is described in shape movable member, wherein
The moveable mirror head assembly is by the drive for surrounding shape movable member, can be movably arranged as the lens bearing seat
It is interior；And
It is moved up from the moveable mirror head assembly except the reflecting material.
9. the assemble method of image collection module according to claim 8, which is characterized in that the laser light source setting exists
On one precalculated position of the top of described image sensor chip, described image sensor chip is directly incident upon for generating one
First laser light beam on the first level upper surface, the first laser light beam caused by the laser light source pass through institute
The reflection for stating the first level upper surface of image sensing chip is directly incident upon on the precalculated position or non-with formation one
Very close to first the reflected beams in the precalculated position.
10. the assemble method of image collection module according to claim 8, which is characterized in that the laser light source setting
On a precalculated position of the top of the reflecting material, for generate one be directly incident upon the reflecting material described the
Second laser light beam in two upper horizontal surfaces, the second laser light beam caused by the laser light source pass through the reflection
The reflection of second upper horizontal surface of substance is directly incident upon with formation one on the precalculated position or very close described
Second the reflected beams in precalculated position.
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| CN110824653B (en) | 2018-08-14 | 2021-08-06 | 宁波舜宇光电信息有限公司 | Optical lens, camera module and assembling method thereof |
| CN111464751B (en) * | 2020-05-14 | 2021-10-26 | 歌尔光学科技有限公司 | Focusing method, focusing apparatus, and readable storage medium |
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|---|---|---|---|---|
| CN2606337Y (en) * | 2003-03-25 | 2004-03-10 | 武汉大学 | Gyrotheodolites with laser calibrators |
| CN202617250U (en) * | 2012-06-04 | 2012-12-19 | 美细耐斯(上海)电子有限公司 | Camera module |
| CN103279001A (en) * | 2013-06-05 | 2013-09-04 | 南昌欧菲光电技术有限公司 | Support structure and camera shooting module with support structure |
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| CN101465344B (en) * | 2007-12-18 | 2011-02-02 | 鸿富锦精密工业（深圳）有限公司 | Encapsulation structure of image die set |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2606337Y (en) * | 2003-03-25 | 2004-03-10 | 武汉大学 | Gyrotheodolites with laser calibrators |
| CN202617250U (en) * | 2012-06-04 | 2012-12-19 | 美细耐斯(上海)电子有限公司 | Camera module |
| CN103279001A (en) * | 2013-06-05 | 2013-09-04 | 南昌欧菲光电技术有限公司 | Support structure and camera shooting module with support structure |
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