CN105896307A - Self-aligning sintering clamp and method for semiconductor laser chip - Google Patents
Self-aligning sintering clamp and method for semiconductor laser chip Download PDFInfo
- Publication number
- CN105896307A CN105896307A CN201610285100.2A CN201610285100A CN105896307A CN 105896307 A CN105896307 A CN 105896307A CN 201610285100 A CN201610285100 A CN 201610285100A CN 105896307 A CN105896307 A CN 105896307A
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- chip
- briquetting
- heat sink
- sintering
- semiconductor laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a self-aligning sintering clamp and method for a semiconductor laser chip. The clamp comprises a pedestal, a guide rail support, and a press block. The pedestal is provided with a positioning card slot matched with a heat sink. Two sides of the press block are provided with symmetric positioning racks. The guide rail support is vertically disposed on the pedestal, and is provided with symmetric suspension arms. The interior of each suspension arm is provided with a positioning guide rail. The positioning racks of the press block can be sleeved by the positioning guide rails, and move up and down in the positioning guide rails. The bottom end of the press block is provided with a press column. When the press block moves downwards, the press column compresses a chip on the heat sink. The invention also provides the method for sintering the semiconductor laser chip through the above clamp. The clamp is simple in structure, is low in cost, can achieve the self-aligning, and is convenient for operation and observation. The method can achieve the quick batch sintering of the semiconductor laser chips and heat sinks, and remarkably improves the sintering yield of the clamp.
Description
Technical field
The present invention relates to a kind of autoregistration for semiconductor laser chip sinter fixture and use this fixture to carry out chip sintering
Method, belongs to semiconductor laser chip sintering technology field.
Background technology
Due to semiconductor laser have that volume is little, lightweight, electro-optical efficiency is high, life-span length and high reliability,
Gradually instead of the use of gas and solid state laser in fields such as communication, medical treatment, display, industry making and security protections, it should
Also progressively extending by scope.The used heat that during semiconductor laser work, chip produces needs to discharge timely and effectively, otherwise can make
Become chip of laser temperature too high, reduce device light emitting efficiency and induce the inefficacy of laser instrument.The technical scheme being widely used at present
It is semiconductor laser chip to be sintered on strong heat sink of heat-sinking capability, is carried out by the heat sink heat to producing during chip operation
Effectively evacuate.The heat sink solder sintering with chip chamber should meet the characteristics such as resistance is low, heat conductivity is high, solid and reliable, resisting fatigue,
Sintering quality is the key factor of the life and reliability affecting the heat dispersion of semiconductor laser or even laser instrument.
The most conventional sintering scheme has two kinds, and one is to use vacuum WAND to be picked up by chip to be positioned on heat sink, then adds
Thermal sintering.The sintering quality of the mode of used wand pressurization is preferable, but each heating and cooling circulation can only one laser of pressure sintering
Device chip, to be sintered complete and cool down after change next core assembly sheet again and heat sink be sintered, therefore sintering efficiency is low, and sets
Standby complicated, need vacuum equipment to manufacture negative pressure, be additionally difficult to sintering environment airtight, cause solder to be oxidized easily.Another kind of
It is to use alloying furnace or reflow ovens etc., chip is placed on heat sink and then carries out heat-agglomerating, chip is not applied pressure.By
Solder on heat sink has certain mobility when fusing so that chip and heat sink between sintering cavity easily occurs after sintering,
Also can result in the chip skew relative to heat sink position, cause the luminous position of chip of laser and direction to offset so that swash
The qualification rate of light device and life-span decline.
Chinese patent literature CN101515702A proposes a kind of semiconductor laser tube core chip apparatus and using method thereof, burns
Knot device includes end bearing, front apron, heat sink, stage clip post, spring, dials and pull, pressing, pillar, stick up depression bar, elastic support
With sliding foot；First the method is removed and is stuck up depression bar to empty place, uses suction spindle will to treat that burn-out sinking, at the front apron of device, is removed
Pull after suction spindle to dial and pull, be fixed on heat sink between stage clip post and front apron, under microscopic visualization with suction spindle by core to be sintered
Sheet is drawn onto heat sink edge and puts alignment, after suction spindle is removed, moves under microscopic visualization and sticks up depression bar, and the pressing that will stick up depression bar is accurate
Really fall above chip；Sintering is completed under vacuum and nitrogen are protected.The method is disadvantageous in that needs are at microscope
Bottom heat release is heavy, chip and fall pressing, and it is inconvenient and inefficient to operate；And whole device feature is more, processes and assemble
Required precise part is the most difficult, needs to use vacuum equipment to manufacture negative pressure to draw heat sink and chip, the manufacturing cost of equipment
Height, is not suitable for batch sinter.
Chinese patent literature CN105098593A proposes autoregistration sintering fixture and the sintering of a kind of semiconductor laser tube core
Method, sintering fixture includes support, para-position base, compression leg and spring；Support has end bearing and cantilever, and end bearing has with right
The locating groove that position base is adaptive, cantilever has compression leg guide hole, and spring housing is on compression leg top；Described para-position base has heat sink mounting
Platform, enables the compression leg lower end described in positive alignment when para-position base pushes against in locating groove completely of the tube core on heat sink, so that compression leg
Can be pressed on tube core under spring force.The method is disadvantageous in that the processing of C-shaped support is the most difficult；And by heat
After heavy and chip is put on para-position base and pushes the locating groove of support, cannot observe on heat sink due to blocking of frame upper
Chip whether be shifted in placement process；Additionally in the Thermal Cycling of sintering, the spring used can be moulded
Property deformation, cause down force pressure to diminish, be likely to result in chip occur sintering bad.
Summary of the invention
The present invention is directed to the problem that existing semiconductor laser chip sintering technology exists, propose a kind of there is automatic aligning function
Simple in construction, convenient operation and inspection, the semiconductor laser chip sintering fixture that production efficiency is high.
The present invention also provides for a kind of method utilizing this fixture to carry out semiconductor laser chip sintering.
Technical scheme is as follows:
A kind of semiconductor laser chip autoregistration sintering fixture, including base, rail brackets and briquetting；Described base is provided with
With the locating groove of heat sink adaptation, there is the road, location of symmetry described briquetting both sides, rail brackets have the cantilever of symmetry, in cantilever
It is provided with positioning guide rail, makes the road, location of briquetting can be inserted in positioning guide rail and in positioning guide rail and move up and down.
According to currently preferred, the road, location of briquetting is flange or groove, and the positioning guide rail on described cantilever is groove or flange,
Positioning guide rail is suitable with road, location.Ensure that briquetting can move up and down under the cooperation of road, location and positioning guide rail not offset, finally
Realize the chip to be sintered on heat sink on base of autoregistration and precise positioning.
According to currently preferred, described compression leg with heat sink on the size of chip and position suitable.
According to the present invention, the locating groove on described base has and heat sink adaptation, be instigate be loaded with the heat sink of chip to be sintered can be
Move in locating groove and be fitted on described locating groove inwall, and make heat sink completely pushing and pressing end locating groove in time heat sink on
Chip can be sitting at below the compression leg of described briquetting lower end, so that the gravity-pressing of briquetting is on chip.
According to the present invention, the distance between the cantilever of described symmetry is suitable with the size of briquetting.The height of described briquetting is more than outstanding
The height of arm；After making briquetting be inserted in cantilever, one section of cantilever, convenient use can be exposed in the upper end of briquetting.And ensure to be pressed in treat
Time on sintering chip, briquetting two sides are good with cantilever contact internal walls, and locating flange is limited in positioning guide rail.
According to the invention it is preferred to, there is compression leg described briquetting bottom, and when briquetting moves down, compression leg can compress the chip on heat sink.
The size of described briquetting bottom compression leg and position are adaptive, so that briquetting is at rail brackets with the size of chip to be sintered and position
The chip on heat sink can be compressed by described compression leg when positioning guide rail moves down.Described compression leg is cube shaped or cylindrical.
According to currently preferred, the cantilever of described symmetry is parallel two vertical arm, and cantilever is vertical with susceptor surface.
According to currently preferred, described rail brackets is perpendicular to described susceptor surface.
According to currently preferred, the locating groove on described base is rectangle or the square draw-in groove of one end open, and is loaded with
The heat sink phase size of chip to be sintered is adaptive.
According to currently preferred, described locating groove bottom just has protection groove to heat sink upper chip position；To protect laser
The front facet of device chip.Described locating groove bottom is one end relative with locating groove opening.
According to currently preferred, described briquetting main part is the square bodily form or cuboid；Briquetting size is hanged with rail brackets
Size between arm is suitable, makes briquetting freely up and down can move between rail brackets cantilever.
According to currently preferred, the road, location of described briquetting both sides is square flange, correspondingly, and the location on described cantilever
Guide rail is square groove, and both its sizes and position are suitable, so that locating flange can the most freely up and down move.
According to the present invention, described base, rail brackets and briquetting all use metal material to make, it is preferred that described base, lead
Rail support and briquetting use oxygen-free copper to make.
According to the invention it is preferred to, the bottom polishing of described compression leg.
According to the present invention, the height of described rail brackets is to examine under a microscope the heat sink of the locating groove of putting into end bearing
And chip.
When the fixture of the present invention uses, by the heat sink locating groove pushed against completely on base being placed with chip, then by briquetting
Being placed between cantilever, the road, location (flange or groove) of briquetting both sides is limited in the positioning guide rail of rail brackets cantilever, briquetting
The compression leg being moved up and down and making briquetting lower end by guide rail compresses the chip on heat sink.Locating groove on base and heat sink size
Adaptation, heat sink lucky can push in open slot, heat sink when arriving to locating groove bottom on the position of chip be right against compression leg bottom,
Position-limiting action between briquetting side and cantilever inner face, locating flange or groove and positioning guide rail ensure that briquetting is after pressure down simultaneously
There is not horizontal movement, thus realize autoregistration and position is stable.Compression leg acts on chip of laser and heat sink pressure is permissible
Adjust by changing the overall dimensions of briquetting main body.
According to the present invention, the method for a kind of semiconductor laser chip sintering, including using above-mentioned autoregistration sintering fixture, bag
Include following steps:
(1) by adsorption machine, semiconductor laser chip is placed on heat sink solder under the microscope；
(2) placing is had in the heat sink locating groove being inserted into base of chip, and push against on earth；
(3) with microscope confirmation viewed from above heat sink on chip position in operation be not shifted over；
(4) by briquetting both sides location road be placed in the positioning guide rail of rail brackets cantilever, make briquetting be inserted between cantilever and to
Lower movement, makes to rectify the chip of laser on the most heat sink under the compression leg of briquetting low side and compress, completes holder；
(5) repeat the above steps (1)～(4), arrange that other several identical holder is heat sink and chip；Then will
Clamp the heat sink and fixture marshalling of chip, seal after the protective cover cap residence being connected with nitrogen is stated the fixture being well placed, put
Sinter on warm table.
Described sintering process is carried out according to prior art.
Beneficial effects of the present invention:
Present clip simple in construction, with low cost, operate and check convenient and reliable, can realize being directed at voluntarily.Utilize briquetting
Gravity, to chip apply certain pressure be sintered, can effectively reduce chip and heat sink between sintering cavity, promote swash
The life-span of light device, it is ensured that the quality of product；Locating groove can ensure that heat sink pressure when realizing after such insertion pressing under autoregistration, briquetting
Post just to chip, is not required to adjust the position of briquetting, and compression leg can keep chip to be compacted on heat sink under gravity after putting down.
The rail brackets top of present clip is not blocked, after heat sink and chip are advanced locating groove, it is possible to facilitate land productivity
Check the heat sink relative position with chip from top with microscope, thus avoid heat sink with chip during being positioned over locating groove
Occur that accidentally displacement causes the product sintered defective, improve the qualification rate of fixture sintering further.By briquetting main body side
Positioning guide rail inside face and cantilever and on rail brackets and the adaptation in the road, location (flange or groove) on briquetting and spacing
Effect, it is ensured that briquetting is rear between the cantilever being positioned over rail brackets keeps stablizing of lateral attitude, is only capable of moving up and down and making
The compression leg obtaining briquetting lower end can be just to chip.The sintering Yield lmproved of the fixture of the present invention is to more than 90%.
The briquetting of present clip can move up and down, thus can meet the heat sink sintering needs with different-thickness chip of differing heights.
By adjusting size and the position of locating groove on guiderail base, heat sink can be sintered various sizes of.
This invention simplifies being accurately positioned of chip sintering；Briquetting is applied to the gravity of chip and effectively reduces the string of chip of laser
Connection resistance and thermal resistance, solve because during heat sink upper solder fusing, chip shifts the problem that the luminous efficiency caused is low, and technique is the most real
With, and convenient inspection before sintering；Device only includes two assemblies, simple in construction, and cost of manufacture is low, and production efficiency is high.
The fixture of the present invention can be placed in nitrogen protecting cover shell easily, effectively prevents solder from aoxidizing when high temperature sintering.
After utilizing many group fixtures to fix and often organize heat sink and chip, it is possible to use heater carries out the sintering of rapid batch, thus significantly
Improving production efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of semiconductor laser chip autoregistration of the present invention sintering fixture.
Fig. 2 is the structural representation of briquetting in present clip.
Fig. 3 is the structural representation of present clip middle guide support.
In figure: 1, chip of laser, 2, heat sink, 3, briquetting main body, 4, road, location (flange) on briquetting, 5, compression leg,
6, base, 7, locating groove, 8, protection groove, 9, cantilever, 10, rail brackets, 11, positioning guide rail (groove).
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention will be further described.But it is not limited to this.
Embodiment 1:
The autoregistration sintering fixture of semiconductor laser chip, as it is shown in figure 1, include base 6, rail brackets 10 and briquetting 3.
Described rail brackets is erected on described base, rail brackets has the cantilever 9 of symmetry, is provided with positioning guide rail 11 in cantilever 9,
This positioning guide rail is square groove.As shown in Figure 3.Have on described base 6 and the locating groove 7 of heat sink 2 adaptations, locator card
Groove 7 is the rectangular groove of openings at one side, makes heat sink 2 can move in locating groove 7 and fits with draw-in groove inwall in side.
The structure of described briquetting 3 as in figure 2 it is shown, include briquetting main body 3, briquetting road 4, location and compression leg 5, briquetting main body 3
Space between the cantilever 9 of size and rail brackets is suitable；There is briquetting road, location (flange) 4 of location briquetting both sides, should
Road 4, briquetting location is square boss, can be enclosed within the positioning guide rail 11 on rail brackets cantilever 9 and move up and down；Described briquetting
Compression leg 5 is arranged at bottom, and time in the locating groove 7 on heat sink 2 completely pushing and pressing road base 6, compression leg 5 bottom is right against heat sink 2
On chip 1, make compression leg compress chip and heat sink by action of gravity, it is achieved autoregistration and fixing.
Just heat sink chip position is being had protection groove 8, to protect the front facet of chip of laser in described locating groove 7.
Size between described cantilever 9 just accommodate briquetting main body 3 and make briquetting side can and the cantilever 9 of symmetry between interior
Wall is fitted, it is ensured that briquetting can move up and down in rail brackets；As it is shown in figure 1, pass through positioning guide rail and locating flange and hang
Position-limiting action between arm inwall and briquetting main body, it is ensured that briquetting is in being placed into rail brackets and when freely placing downwards, laterally
It is not shifted on direction, simultaneously by locating groove, briquetting lower end compression leg and the design of heat sink relative position, it is ensured that pressure
When block is placed downwards, compression leg is pressed on the chip 1 on heat sink 2 just, it is achieved position is stablized and autoregistration.
During use, by adsorption machine, semiconductor laser chip 1 is placed on heat sink 2 with solder under the microscope.To carry
It is placed with in the locating groove 7 of the bearing 6 that heat sink the 2 of chip 1 is inserted into rail brackets, and pushes against on earth.Determining on bearing 6
Position draw-in groove 7 with heat sink 2 size fit, when heat sink 2 pushing and pressing are to locating groove 7 bottom, the position of chip 1 is being just on heat sink 2
Compression leg 5 for briquetting lower end.Can observe from the top through microscope and confirm the chip 1 position on heat sink 2 the most not
It is shifted over.Briquetting main body 3 is nested between the cantilever 9 of rail brackets, and makes the road 4, briquetting location of briquetting both sides be inserted in
In the positioning guide rail 11 of cantilever 9, make briquetting free releasing, the compression leg 5 of briquetting lower end just to firmly chip of laser 1 and compress,
Thus realize autoregistration and fix, complete holder.
The bottom of compression leg 5 is polished, and contacts the upper surface that the placement on chip of laser and base is heat sink, at the bottom of compression leg bottom this
The size of end can adjust according to the size of chip to be sintered, and the size of locating groove and position can be according to be sintered heat sink big
Little adjustment.During sintering, compression leg acts on chip of laser and heat sink pressure can be adjusted by the entire length changing briquetting.
Embodiment 2:
Utilizing the method that the autoregistration sintering fixture of embodiment 1 carries out semiconductor laser chip sintering, step is as follows:
(1) by adsorption machine, semiconductor laser chip 1 is placed on the solder on heat sink 2 under the microscope；
(2) placing has heat sink the 2 of chip 1 be inserted in the locating groove 7 of base, and push against on earth；
(3) it is not shifted over chip of laser 1 position in operation in microscope confirmation viewed from above heat sink 2；
(4) briquetting of briquetting both sides is positioned road 4 to be placed in the positioning guide rail 11 of rail brackets upper cantilever, make briquetting be inserted into
Between cantilever and transfer, make compression leg rectify firmly chip of laser 1 and compress for 5 times, complete holder；
(5) repeat the above steps (1)～(4), arrange that other several identical holder is heat sink and chip；Then will
Clamp the heat sink and fixture marshalling of chip, seal after the protective cover cap residence being connected with nitrogen is stated the fixture being well placed, put
Sinter on warm table.
Sintering test:
The fixture utilizing embodiment 1 as described in Example 2 carries out semiconductor laser chip sintering, sinters quantity 128,
Wherein certified products number is 116, sinters yield 90.6%.
Contrast experiment:
Carry out semiconductor laser tube core sintering by the fixture of CN105098593A embodiment 1 by the method for embodiment 2, burn
Footing amount 120, wherein certified products number is 97, sinters yield 80.8%.
During owing to utilizing the fixture of the present invention to carry out semiconductor laser chip sintering, it is inserted into the end placing there being the heat sink of chip
In the locating groove of seat and after pushing and pressing on earth, can observe whether chip shifts by microscope above fixture, move if any chip
The adjustment that can be taken off of position reinstalls, thus improves the yield of the Laser Devices after sintering further.The sintering of the fixture of the present invention
Yield can be promoted to more than 90% by about the 80% of CN105098593A.
Claims (10)
1. a semiconductor laser chip autoregistration sintering fixture, including base, rail brackets and briquetting；Set on described base
Having and the locating groove of heat sink adaptation, there is the road, location of symmetry described briquetting both sides, and rail brackets has the cantilever of symmetry, cantilever
Inside it is provided with positioning guide rail, makes the road, location of briquetting can be inserted in positioning guide rail and in positioning guide rail and move up and down.
2. semiconductor laser chip autoregistration sintering fixture as claimed in claim 1, it is characterised in that determining of described briquetting
Road, position is flange or groove, and the positioning guide rail on described cantilever is groove or flange, and positioning guide rail is suitable with road, location.
3. semiconductor laser chip autoregistration sintering fixture as claimed in claim 1, it is characterised in that hanging of described symmetry
Arm is parallel two vertical arm, and cantilever is vertical with susceptor surface.
4. semiconductor laser chip autoregistration sintering fixture as claimed in claim 1, it is characterised in that on described base
Locating groove is rectangle or the square draw-in groove of one end open, adaptive with the heat sink phase size being loaded with chip to be sintered.
5. semiconductor laser chip autoregistration sintering fixture as claimed in claim 1, it is characterised in that described locating groove
Bottom just has protection groove to heat sink upper chip position.
6. semiconductor laser chip autoregistration sintering fixture as claimed in claim 1, it is characterised in that described briquetting main body
Part is the square bodily form or cuboid；Size between briquetting size and rail brackets cantilever is suitable.
7. semiconductor laser chip autoregistration sintering fixture as claimed in claim 1, it is characterised in that described briquetting both sides
Road, location be square flange, correspondingly, the positioning guide rail on described cantilever is square groove.
8. semiconductor laser chip autoregistration sintering fixture as claimed in claim 1, it is characterised in that described briquetting bottom
Having compression leg, when briquetting moves down, compression leg compresses the chip on heat sink；The size of described compression leg and position and chip to be sintered
Size and position are adaptive；The bottom polishing of the most described compression leg.
9. semiconductor laser chip autoregistration sintering fixture as claimed in claim 1, it is characterised in that described base, guide rail
Support and briquetting all use metal material to make；Preferably employ oxygen-free copper to make.
10. a method for semiconductor laser chip sintering, including using autoregistration sintering clip described in any one of claim 1-9
Tool is sintered, and comprises the steps:
(1) by adsorption machine, semiconductor laser chip is placed on heat sink solder under the microscope；
(2) placing is had in the heat sink locating groove being inserted into base of chip, and push against on earth；
(3) with microscope confirmation viewed from above heat sink on chip position in operation be not shifted over；
(4) by briquetting both sides location road be placed in the positioning guide rail of rail brackets cantilever, make briquetting be inserted between cantilever and to
Lower movement, makes to rectify the chip of laser on the most heat sink under the compression leg of briquetting low side and compress, completes holder；
(5) repeat the above steps (1)～(4), arrange that other several identical holder is heat sink and chip；Then will
Clamp the heat sink and fixture marshalling of chip, seal after the protective cover cap residence being connected with nitrogen is stated the fixture being well placed, put
Sinter on warm table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610285100.2A CN105896307B (en) | 2016-04-29 | 2016-04-29 | A kind of the autoregistration sintering fixture and sintering method of semiconductor laser chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610285100.2A CN105896307B (en) | 2016-04-29 | 2016-04-29 | A kind of the autoregistration sintering fixture and sintering method of semiconductor laser chip |
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| CN105896307A true CN105896307A (en) | 2016-08-24 |
| CN105896307B CN105896307B (en) | 2019-03-22 |
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| CN109326951A (en) * | 2017-07-31 | 2019-02-12 | 山东华光光电子股份有限公司 | A kind of multiple semiconductor laser tube cores sintering fixture and its sintering method |
| CN110289547A (en) * | 2018-03-19 | 2019-09-27 | 山东华光光电子股份有限公司 | A kind of gravity clamping semiconductor laser chip sintering fixture |
| CN111446617A (en) * | 2020-05-15 | 2020-07-24 | 江苏天元激光科技有限公司 | High efficiency multistation laser apparatus for producing |
| CN111478177A (en) * | 2019-01-23 | 2020-07-31 | 潍坊华光光电子有限公司 | Rapid bonding device and bonding method for semiconductor laser electrode wire |
| CN111843877A (en) * | 2020-07-23 | 2020-10-30 | 江苏天元激光科技有限公司 | Semiconductor laser chip fast axis light spot collimating lens clamp |
| CN111999631A (en) * | 2019-05-27 | 2020-11-27 | 潍坊华光光电子有限公司 | Aging clamp for semiconductor laser chip |
| CN114247952A (en) * | 2020-09-22 | 2022-03-29 | 中国科学院大连化学物理研究所 | Laser crystal welding jig and welding method |
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| CN109326951A (en) * | 2017-07-31 | 2019-02-12 | 山东华光光电子股份有限公司 | A kind of multiple semiconductor laser tube cores sintering fixture and its sintering method |
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