CN105895654B - 内嵌入式照明通信双功能led器件及其制作方法 - Google Patents

内嵌入式照明通信双功能led器件及其制作方法 Download PDF

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CN105895654B
CN105895654B CN201610320742.1A CN201610320742A CN105895654B CN 105895654 B CN105895654 B CN 105895654B CN 201610320742 A CN201610320742 A CN 201610320742A CN 105895654 B CN105895654 B CN 105895654B
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孙慧卿
黄鸿勇
黄涌
张柱定
黄晶
孙杰
杨晛
衣新燕
郭志友
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Abstract

本发明公开一种内嵌入式照明通信双功能LED器件，包括一个外围LED芯粒和嵌于所述外围LED芯粒内部的2N个通信型发光芯粒，所述2N个通信型发光芯粒在外围LED芯粒内部呈N×2阵列排列，还包括外围LED芯粒和2N个通信型发光芯粒共用的p型焊点、通信型发光芯粒的n型焊点和外围LED芯粒的n型焊点，所述外围LED芯粒和通信型发光芯粒均沉积于衬底上，所述2N个通信型发光芯粒通过串联方式连接。

Description

内嵌入式照明通信双功能LED器件及其制作方法
技术领域
本发明涉及可见光通信领域，具体涉及一种内嵌入式照明通信双功能LED器件及其制作方法。
背景技术
照明用LED器件问世已有十余载，大功率LED照明器件也有数年的研究和使用，发光器件作为通信信息的载体成为近两年的热门研究课题，但是该技术推广和应用受到了普通的LED器件相应频率的制约，如果采用微米级LED器件虽然相应频率上去了，但存在照明效果差的问题，也就是说现在的通信用的发光器件还是应用均处于初级阶段，实际应用因为发光能力而被限制。
发明内容
本发明的目的是解决现有技术的缺陷，提供一种内嵌入式照明通信双功能LED器件，采用的技术方案如下：
一种内嵌入式照明通信双功能LED器件，包括一个外围LED芯粒和嵌于所述外围LED芯粒内部的2N个通信型发光芯粒，所述2N个通信型发光芯粒在外围LED芯粒内部呈N×2阵列排列，还包括外围LED芯粒和2N个通信型发光芯粒共用的p型焊点、通信型发光芯粒的n型焊点和外围LED芯粒的n型焊点，所述外围LED芯粒和通信型发光芯粒均沉积于衬底上，所述2N个通信型发光芯粒通过串联方式连接。
通信型发光芯粒为通信基本单元，通过减小其面积，也是减小芯粒体积，从而提升器件响应时间和响应速率。而使用串联方式将2N个芯粒串在一起，虽然增加了整个器件的电阻R，但是以同样比例缩小了整个器件的电容C，相比单颗芯粒的结构，器件整体响应频率变化不大，但是其照明效果是单颗的2N倍，这也是实现功率型可见光通信器件的关键设计，而外围的外围LED芯粒则作为器件照明主要来源。
本发明通过在外围LED芯粒内嵌入照明通信双功能LED器件，充分利用了LED具有响应时间短、高速调制特点，满足普通照明使用要求，又能满足通信的要求。
外围的外围LED芯粒采用本领域普通的外围LED芯粒即可。
作为优选，所述通信型发光芯粒包括依次沉积在衬底上的缓冲层、n型半导体层、发光层、p型半导体层和透明电极，将2N个芯粒串联连接于p型焊点和通信型发光芯粒的n型焊点两端的电极线路。
作为优选，所述通信型发光芯粒间、通信型发光芯粒与外围LED芯粒间铺垫有二氧化硅，并通过刻蚀技术在二氧化硅上刻出为所述焊点预留的位置。
所述二氧化硅使电极线路在芯粒间连接和踮起电极焊点于衬底上。
相邻芯粒间的是为了让电极线在芯粒间不存在高阶梯情况，导致电极断裂，焊点处的二氧化硅则可以踮起焊点，让焊点与芯粒间不存在高阶梯情况，导致电极断裂。
作为优选，本发明包括8个通信型发光芯粒，所述芯粒为环形结构的芯粒。
采用环形结构Chip芯粒使得发光层的电子空穴复合均匀，达到高复合率，以便达到器件高速和宽频带技术效果，9个(一个外围LED芯粒和8个通信型发光芯粒）芯粒组成使得其在照明效果上达到1W。
作为优选，所述衬底为蓝宝石衬底。
与现有技术相比，本发明的有益效果：
（1）器件采用环形结构芯粒，增加芯片的有效发光面，提升响应速率。
（2）采用8颗芯粒串联的通信型晶粒外围设计一个方形框型普通外围LED芯粒，它们在同一衬底上弥补了单颗通信型光电器件照明能力不足
（3）采用公用电极焊点，减少了焊点占用率，而将焊点沉积在衬底上面的二氧化硅上，减少电极焊点对照明和通信性能的影响。
本发明的另一目的是解决现有技术的缺陷，提供一种内嵌入式照明通信双功能LED器件的制作方法，包括以下步骤：
选用MOCVD系统，在导电型衬底上生长具有量子阱结构的GaN/InGaN外延片；
利用半导体平面工艺进行制备工作，通过芯片制备刻蚀工艺将外延片形成以下结构：2N个通信型发光芯粒在外围LED芯粒内部呈N×2阵列排列；
通过台面刻蚀形成每个通信型发光芯粒和外围LED芯粒的n型半导体层；
在每个通信型发光芯粒和外围LED芯粒的P型层上沉积透明电极层；
在通信型发光芯粒间、通信型发光芯粒和外围LED芯粒间沉积二氧化硅层，并在二氧化硅层上预留焊点位置，通过刻蚀技术在二氧化硅层上刻出；
制备2N个通信型发光芯粒共用的p型焊点、通信型发光芯粒的n型焊点和外围LED芯粒的n型焊点；
将2N个芯粒串联连接于p型焊点和通信型发光芯粒的n型焊点两端的电极线路。
作为优选，本发明中，N=4，所述芯粒为环形结构的芯粒。
与现有技术相比，本发明的有益效果：
（1）器件采用环形结构芯粒，增加芯片的有效发光面，提升响应速率；
（2）采用8颗芯粒串联的通信型晶粒外围设计一个方形框型普通外围LED芯粒，它们在同一衬底上弥补了单颗通信型光电器件照明能力不足；
（3）采用公用电极焊点，减少了焊点占用率，而将焊点沉积在衬底上面的二氧化硅上，减少电极焊点对照明和通信性能的影响。
附图说明
图1是本发明的器件示意图；
图2是通信型相邻晶粒的剖面结构图；
图3是本发明的器件照明晶粒和8个光通信晶粒分立制备图；
图4是本发明的器件台面工艺制备图；
图5 是本发明的器件透明电极制备图；
图6是本发明的器件二氧化硅设计制备图；
图 7是本发明的器件电极制备图；
图8 是本发明的器件二氧化硅保护层制备图。
具体实施方式
下面结合附图和实施例对本发明做进一步详细描述。
实施例：
如图1和图2所示，一种内嵌入式照明通信双功能LED器件，包括一个外围LED芯粒和嵌于所述外围LED芯粒内部的2N个通信型发光芯粒，所述2N个通信型发光芯粒在外围LED芯粒内部呈N×2阵列排列，还包括外围LED芯粒和2N个通信型发光芯粒共用的p型焊点26、通信型发光芯粒的n型焊点25和外围LED芯粒的n型焊点27，所述外围LED芯粒和通信型发光芯粒均沉积于衬底上，所述2N个通信型发光芯粒通过串联方式连接。
所述通信型发光芯粒包括依次沉积在衬底1上的缓冲层2、n型半导体层3、发光层4、p型半导体层5和透明电极6，将2N个芯粒串联连接于p型焊点26和通信型发光芯粒的n型焊点27两端的电极线路9。
所述芯粒间铺垫有二氧化硅10，并通过刻蚀技术在二氧化硅10上刻出为所述焊点预留的位置。
所述二氧化硅使电极线路在芯粒间连接和踮起电极焊点于衬底上。
本实施例包括8个通信型发光芯粒，所述芯粒为环形结构的芯粒。
如图3至图8所示，一种内嵌入式照明通信双功能LED器件的制作方法，包括以下步骤：
选用MOCVD系统，在导电型衬底上生长具有量子阱结构的GaN/InGaN外延片；
利用半导体平面工艺进行制备工作，通过芯片制备刻蚀工艺将外延片形成以下结构：2N个通信型发光芯粒在外围LED芯粒内部呈N×2阵列排列，如图3所示；
通过台面刻蚀形成每个通信型发光芯粒和外围LED芯粒的n型半导体层，如图4所示，图中标号14、15分别为外围LED芯粒和通信型芯粒的台面图样；
在每个通信型发光芯粒和外围LED芯粒的P型层上沉积透明电极层，如图5所示，图中16和17分别为外围LED芯粒和通信型芯粒的的透明电极结构；
在通信型发光芯粒间、通信型发光芯粒和外围LED芯粒间沉积二氧化硅层，并在二氧化硅层上预留焊点位置，通过刻蚀技术在二氧化硅层上刻出，如图6所示，图中标号18、19分别是为串联电极和焊点沉积二氧化硅层；
制备2N个通信型发光芯粒共用的p型焊点、通信型发光芯粒的n型焊点和外围LED芯粒的n型焊点；
将2N个芯粒串联连接于p型焊点和通信型发光芯粒的n型焊点两端的电极线路，图7所示20、21、22、23是外围LED芯粒和通信晶粒的p和n电极走向；
覆盖一层二氧化硅保护层，如图8所示24为覆盖二氧化硅之后进行刻蚀出电极的光刻板图形，所有工序完成之后得到如图1所示的器件图。

Claims (2)

1.一种内嵌入式照明通信双功能LED器件的制作方法，其特征在于，包括以下步骤：
选用MOCVD系统，在导电型衬底上生长具有量子阱结构的GaN/InGaN外延片；
利用半导体平面工艺进行制备工作，通过芯片制备刻蚀工艺将外延片形成以下结构：2N个通信型发光芯粒在外围LED芯粒内部呈N×2阵列排列；
通过台面刻蚀形成每个通信型发光芯粒和外围LED芯粒的n型半导体层；
在每个通信型发光芯粒和外围LED芯粒的P型层上沉积透明电极层；
在通信型发光芯粒间、通信型发光芯粒和外围LED芯粒间沉积二氧化硅层，并在二氧化硅层上预留焊点位置，通过刻蚀技术在二氧化硅层上刻出预留的所述焊点位置；
制备2N个通信型发光芯粒共用的p型焊点、通信型发光芯粒的n型焊点和外围LED芯粒的n型焊点；
将2N个芯粒串联连接于p型焊点和通信型发光芯粒的n型焊点两端的电极线路。
2.根据权利要求1所述的内嵌入式照明通信双功能LED器件的制作方法，其特征在于，N=4。
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CN104333418A (zh) * 2014-09-01 2015-02-04 中国科学院半导体研究所 显示通信两用的可见光模块
CN105161581A (zh) * 2015-09-15 2015-12-16 华南师范大学 具有照明和通信双功能的发光器件
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