CN105895600A - External mobile phone cooling device employing earphone jack - Google Patents

External mobile phone cooling device employing earphone jack Download PDF

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Publication number
CN105895600A
CN105895600A CN201610338220.4A CN201610338220A CN105895600A CN 105895600 A CN105895600 A CN 105895600A CN 201610338220 A CN201610338220 A CN 201610338220A CN 105895600 A CN105895600 A CN 105895600A
Authority
CN
China
Prior art keywords
mobile phone
heat transfer
heat
headset
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610338220.4A
Other languages
Chinese (zh)
Inventor
蔡燕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Yuheng Smart Home Technology Co Ltd
Original Assignee
Chengdu Yuheng Smart Home Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Yuheng Smart Home Technology Co Ltd filed Critical Chengdu Yuheng Smart Home Technology Co Ltd
Priority to CN201610338220.4A priority Critical patent/CN105895600A/en
Publication of CN105895600A publication Critical patent/CN105895600A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Abstract

The invention relates to a mobile phone cooling device, in particular to an external mobile phone cooling device employing an earphone jack. The external mobile phone cooling device comprises a heating chip in a mobile phone, an earphone receptacle and an external cooling part, wherein the external mobile phone cooling device is characterized in that a strip heat transfer part is connected between the heating chip in the mobile phone and the earphone receptacle; the strip heat transfer part has certain insulativity or an insulating layer is arranged between the strip heat transfer part and the earphone receptacle; the cooling part is provided with an earphone male-shaped metal heat transfer part which is matched with the earphone receptacle; and the metal heat transfer part is connected with a hollow cooling metal part. An external interface of the mobile phone and the external cooling part are fully utilized; and a new-way cooling mode is provided for the heating chip in the mobile phone, especially a CPU chip.

Description

A kind of outside mobile phone heat abstractor utilizing earpiece holes
Technical field
The present invention relates to mobile phone heat abstractor, particularly relate to a kind of outside mobile phone heat abstractor utilizing earpiece holes.
Background technology
Nowadays one of communication tool that mobile phone is indispensable in having become people's life, along with the increase of cell-phone function, the caloric value of mobile phone is more and more higher in use;When mobile phone is overheated, the power consumption of mobile phone can increase accordingly, causes the cell phone standby time to shorten;When mobile phone temp is too high, possibly even there are the phenomenons such as deadlock in mobile phone, the potential safety hazards such as blast the most easily occurs simultaneously;Particularly when summer, the use of short time will make mobile phone hot, the service life of this serious curtailment mobile phone;In addition; people also like mobile phone is used containment vessel; mobile phone shell is prevented from abrasion when mobile phone falls by mistake; but but have a strong impact on the heat radiation of mobile phone; the poor mobile phone shell of some materials under the high-temperature baking of mobile phone it also occur that deformation; not only do not have protective effect, also can make that mobile phone is overheated, the lost of life.
Along with the continuous upgrading of mobile phone hardware, the chip parts such as its performed task computation processes more numerous and diverse, CPU will face the invasion and attack of heat.CPU core calculation improves constantly, and dominant frequency is more and more higher, so that mobile phone is properly functioning, it is particularly important that the good heat radiating of mobile phone becomes.Mobile phone volume has certain limitation, and processor system performance can decrease because temperature raises, and therefore the power limit of mobile phone is not to be exceeded its heat-sinking capability.
The heat radiation of actual mobile phone is still divided into actively dispels the heat two kinds with passive, and basic thinking is to reduce the thermal resistance of mobile phone heat radiation or reduce the caloric value of mobile phone, and the former is passive heat radiation, and the latter is active heat removal category.Active heat removal reduces heat by the power consumption reducing chip and realizes, and present mobile phone main flow has several heat sink conception:
One, graphite radiating scheme:
Conductive graphite sheet (GTS) is also referred to as graphite heat radiation fin, it is a kind of brand-new heat conduction and heat radiation material, there is the crystal grain orientation of uniqueness, along both direction uniform heat conduction, laminar structured being well adapted for, improves the performance of consumer electronics product at any surface while shielding thermal source and assembly.Why can be designed to graphite heat radiation fin, also use the plasticity of graphite, we can make graphite material the thin slice of one piece of picture paster, allows it be attached to the circuit board top of interior of mobile phone.Both can intercept the contact between original paper, also function to certain antihunt action.
Pyrotoxin CPU and Flash chip caloric value are big, and graphite heat radiation fin is on the encapsulated layer of these chips, and the another side of fin can be attached to above the metallic plate of centre in fuselage.The another side of metallic plate the most also has one piece of graphite heat radiation fin, corresponding connection cell phone back cover.After screen and the heat of CPU/Flash all mutually can be transmitted by middle metal level, due to the heat-sinking capability that graphite heat radiation fin is more outstanding, plus outstanding thickness and plasticity, dispel the heat after finally making heat to be uniformly distributed and by the flowing of air, also can survive inside narrow and small mobile phone space.
Two: ice nest dispels the heat
The heat radiation of ice nest is to improve in basic graphite radiating scheme, uses the ice nest cooling system with exclusive patent.This system is to add the metal material of a kind of fluid-like state between chip and graphite, is solid-state usually, treats that, the when that chip heating strengthening, it will absorb heat and become liquid, improves heat transference efficiency.
But being as the development of mobile phone technique, people increasingly pursue the Novel mobile phone that performance is gradually climbed to a higher point, for overwhelming majority crowd, its high performance nature often can't be used.But popular along with the mobile phone games of high demand, testing mobile phone software etc., for the high performance demands in the mobile phone short time, and the short time high heat problem brought therewith, high degree have impact on mobile phone and uses and the life-span.
Summary of the invention
It is an object of the invention to solve the problem in above-mentioned background technology, a kind of outside mobile phone heat abstractor utilizing earpiece holes is provided, make full use of the external interface of mobile phone, mobile phone inner heat chip particularly cpu chip is provided the radiating mode of a kind of new way.
For realizing the object of the invention, the technical scheme of employing is:
A kind of outside mobile phone heat abstractor utilizing earpiece holes, including interior of mobile phone euthermic chip, socket and headset, it is characterized in that: be connected between the euthermic chip of interior of mobile phone and socket and headset and have banding heat transfer piece, described banding heat transfer piece have certain insulating properties or and socket and headset between be provided with insulating barrier;Being additionally provided with an external cooling part, described radiating piece is provided with the earphone male shaped metal heat transfer piece matched with socket and headset, and metal heat transfer part is connected with hollow heat radiating metal part.
Further, described banding heat transfer piece is metal material, is provided with insulating sticky with the euthermic chip of interior of mobile phone and the junction of socket and headset and sticks layer.
Further, described banding heat transfer piece is copper or aluminium material.
Further, described earphone male shaped metal heat transfer piece surface is provided with insulation heat transfer layer.
Further, described hollow heat radiating metal part is porous hollow pipe structure.
The present invention is at interior of mobile phone euthermic chip such as CPU etc., the amount of heat that it is given out when high-performance is run, transfer heat on the external cooling part with radiating tube by the socket and headset of mobile phone, by the hollow heat radiating metal part on external cooling part, to tackle the mobile phone high radiating requirements in the short time.
The new way radiating mode provided by the present invention, by making full use of mobile phone socket and headset, it is provided that the new way of a kind of mobile phone heat radiation, is integrally improved the heat dispersion of mobile phone simultaneously.
Accompanying drawing explanation
Fig. 1 is the internal structure of mobile phone schematic diagram of a kind of outside mobile phone heat abstractor utilizing earpiece holes of the present invention.
Fig. 2 is the external cooling part structural representation of a kind of outside mobile phone heat abstractor utilizing earpiece holes of the present invention.
Fig. 3 is the structural representation of the socket and headset of a kind of outside mobile phone heat abstractor utilizing earpiece holes of the present invention.
Detailed description of the invention
Combine accompanying drawing below by specific embodiment the present invention is described in further detail.
Embodiment 1
A kind of outside mobile phone heat abstractor utilizing earpiece holes, including interior of mobile phone euthermic chip 1, socket and headset 3 and outside mobile phone shell, it is connected between the euthermic chip 1 of interior of mobile phone and socket and headset 3 and has banding heat transfer piece 2, described banding heat transfer piece 2 is banding aluminum strip, is provided with insulating sticky with the euthermic chip 1 of interior of mobile phone and the junction of socket and headset 3 and sticks layer 5;Between described banding heat transfer piece 2 and socket and headset 3, junction is arranged on the metal contact element 4 of socket and headset 3;Being additionally provided with an external cooling part, described radiating piece is provided with the earphone male shaped metal heat transfer piece 6 matched with socket and headset 3, and metal heat transfer part 6 is connected with hollow heat radiating metal part 7;Described earphone male shaped metal heat transfer piece 6 surface is provided with insulation heat transfer layer, and described hollow heat radiating metal part 7 constructs for porous hollow pipe.
Euthermic chip transfers heat on the metal contact element of handset earphone female seat by banding heat transfer piece, after installing external cooling part, heat is delivered on hollow heat radiating metal part by the machine male shaped metal heat transfer piece on external cooling part, is dispelled the heat by heat radiation structure outside.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.

Claims (5)

1. the outside mobile phone heat abstractor utilizing earpiece holes, including interior of mobile phone euthermic chip, socket and headset, it is characterized in that: be connected between the euthermic chip of interior of mobile phone and socket and headset and have banding heat transfer piece, described banding heat transfer piece have certain insulating properties or and socket and headset between be provided with insulating barrier;Being additionally provided with an external cooling part, described radiating piece is provided with the earphone male shaped metal heat transfer piece matched with socket and headset, and metal heat transfer part is connected with hollow heat radiating metal part.
A kind of outside mobile phone heat abstractor utilizing earpiece holes the most according to claim 1, it is characterised in that: described banding heat transfer piece is metal material, is provided with insulating sticky with the euthermic chip of interior of mobile phone and the junction of socket and headset and sticks layer.
A kind of outside mobile phone heat abstractor utilizing earpiece holes the most according to claim 2, it is characterised in that: described banding heat transfer piece is copper or aluminium material.
A kind of outside mobile phone heat abstractor utilizing earpiece holes the most according to claim 1, it is characterised in that: described earphone male shaped metal heat transfer piece surface is provided with insulation heat transfer layer.
A kind of outside mobile phone heat abstractor utilizing earpiece holes the most according to claim 1, it is characterised in that: described hollow heat radiating metal part is porous hollow pipe structure.
CN201610338220.4A 2016-05-19 2016-05-19 External mobile phone cooling device employing earphone jack Pending CN105895600A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610338220.4A CN105895600A (en) 2016-05-19 2016-05-19 External mobile phone cooling device employing earphone jack

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610338220.4A CN105895600A (en) 2016-05-19 2016-05-19 External mobile phone cooling device employing earphone jack

Publications (1)

Publication Number Publication Date
CN105895600A true CN105895600A (en) 2016-08-24

Family

ID=56716547

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610338220.4A Pending CN105895600A (en) 2016-05-19 2016-05-19 External mobile phone cooling device employing earphone jack

Country Status (1)

Country Link
CN (1) CN105895600A (en)

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Legal Events

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PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160824

WD01 Invention patent application deemed withdrawn after publication