CN105892732B - Panel device and preparation method thereof - Google Patents
Panel device and preparation method thereof Download PDFInfo
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- CN105892732B CN105892732B CN201410705127.3A CN201410705127A CN105892732B CN 105892732 B CN105892732 B CN 105892732B CN 201410705127 A CN201410705127 A CN 201410705127A CN 105892732 B CN105892732 B CN 105892732B
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Abstract
The present invention relates to technical field of flat panel display more particularly to a kind of panel device and preparation method thereof.The panel device includes at least a first substrate, one first binder course and a binding unit, the first substrate at least has a first surface and a functional layer, the first surface includes at least first area and second area, the second area is adjacent and is located at at least side of the first area, the functional layer is located at the first surface where the first area, the binding unit is located at the first surface where the second area, there is an accommodating space between the functional layer and the binding unit, first binder course covers the functional layer, and extend to the accommodating space.In addition, there is a need to disclose a kind of panel device production method.
Description
Technical field
The present invention relates to technical field of flat panel display more particularly to a kind of panel device and preparation method thereof.
Background technique
Touch technology is widely used in various electronic multimedia product in recent years, especially carry-on mobile production
Product, such as mobile phone, e-book, tablet computer.Using touch technology means as input can effectively replace existing keyboard or
The input method of mouse.Other than convenience, more due to the intuitive of operation, the input mode technology of touch-control have become pole by
The man-machine interface and multimedia interaction mode of welcome.
As the application of touch technology most typically --- touch control display apparatus is usually by touch panel and display panel
It constitutes, touch panel generally includes touch base plate and the flexible circuit board by binding technique (FOG) binding on it
(FPC), touching signals realize that signal is connect with exterior I C by flexible circuit board.FOG technique is conductive by a kind of anisotropy
FPC is bound on touch base plate by glue.However, when carrying out FOG technique, on the conductive pad or touch base plate above FPC
Conductive lead wire a part can expose in air, easily be corroded, and seriously affect the reliability of touch control display apparatus.
Summary of the invention
In view of this, the present invention provides a kind of panel device for being conducive to improve reliability.
In addition, there is a need to provide a kind of production method of above-mentioned panel device.
It is single that the panel device provided by the invention includes at least a first substrate, one first binder course and a binding
Member, the first substrate at least have a first surface and a functional layer, the first surface include at least first area and
Second area, the second area is adjacent and is located at at least side of the first area, and the functional layer is located at described first
First surface where region, the binding unit are located at the first surface where the second area, the functional layer and institute
Stating has an accommodating space between binding unit, first binder course covers the functional layer, and it is empty to extend to the receiving
Between.
In the panel device provided by the invention, the panel device further includes a second substrate, and described first combines
Layer is used to combine the first substrate and the second substrate, described second between the first substrate and the second substrate
The projection of substrate on the first surface is less than the area of the first surface.
In the panel device provided by the invention, the binding unit includes a flexible circuit board, is formed in the base
The conductive lead wire on first surface where plate second area, and the flexible circuit board and conductive lead wire are electrically connected
One second binder course, second binder course have one the perpendicular to the first surface close to the side of the first area
One end face, first binder course are contacted by the accommodating space with the first end face.
In the panel device production method provided by the invention, the flexible circuit board close to the first area one
There are multiple conductive pads, the conductive pad has close to the first area and is parallel to the one second of the first surface in example
End face, is not formed second binder course between the second end face and the conductive lead wire, first binder course passes through
The accommodating space is contacted with the second end face.
In the panel device provided by the invention, the flexible circuit board also has the third backwards to the first substrate
Surface, first binder course are also covered close to the third surface of the first area.
In the panel device provided by the invention, the second area is around the first area, the first substrate
For touch panel, the second substrate is display panel, and first functional layer is touch control electrode layer, and first binder course is
Solid-state or liquid optical cement.
In the panel device provided by the invention, the flexible circuit board further includes a substrate, and the substrate is carrying
The substrate of multiple conductive pads, the coefficient of elasticity for constituting the material of first binder course are greater than the elasticity system of the substrate
Number.
A kind of panel device production method, at least includes the following steps:
A first substrate is provided, the first substrate at least has a first surface and a functional layer, first table
Face includes at least first area and second area, and the second area is adjacent and is located at at least side of the first area, institute
State the first surface that functional layer is located at where the first area；In the first surface setting one where the substrate second area
Binding unit has an accommodating space between the functional layer and the binding unit；One first is covered in the functional layer
Binder course, and first binder course is extended into the accommodating space.
In the panel device production method provided by the invention, the panel device further includes a second substrate, described
Panel device production method further includes combining the second substrate by institute's first binder course with the first substrate
The step of.
In the panel device production method provided by the invention, the binding unit includes a flexible circuit board, is formed
Conductive lead wire on the first surface where the substrate second area, and the flexible circuit board and conductive lead wire is electric
Property connection one second binder course, second binder course close to the first area side have perpendicular to first table
One first end face in face, first binder course are contacted by the accommodating space with the first end face.The flexible circuitry
Plate has multiple conductive pads on the side of the first area, and the conductive pad has close to the first area and parallel
In a second end face of the first surface, described second is not formed between the second end face and the conductive lead wire and is combined
Layer, first binder course are contacted by the accommodating space with the second end face.
In the panel device production method provided by the invention, the second area is described around the first area
First substrate is touch panel, the second substrate be display panel, first functional layer be touch control electrode layer, described first
Binder course is solid-state or liquid optical cement.
In described panel device provided by the invention and preparation method thereof, by extending to first binder course by institute
The accommodating space for stating first substrate, functional layer, binding unit three composition, it is therefore possible to prevent binding unit and the first base
Exposed conductive pad or conductive lead wire are exposed in air on plate, and then improve the reliability of the panel device.And due to
First binder course is the engaging member for combining the first substrate and the second substrate, in conjunction with the first substrate and
The accommodating space is filled while two substrates, without increasing other techniques, is conducive to improve production efficiency.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
Fig. 1 is the structural schematic diagram of the panel device 100 of a better embodiment provided by the invention；
Fig. 2 is schematic cross-section of the panel device shown in Fig. 1 along a better embodiment in the direction A-A；
Fig. 3 is the flow diagram of panel device production method shown in FIG. 1；
Fig. 4 is schematic cross-section of the panel device shown in Fig. 1 along another better embodiment in the direction A-A.
Specific embodiment
Panel device provided to illustrate the invention and preparation method thereof, below in conjunction with Figure of description and explanatory note into
Row elaborates.
Fig. 1 and Fig. 2 are please referred to, is the structural representation of the panel device 100 of a better embodiment provided by the invention
The schematic cross-section of figure and its better embodiment along the direction A-A.The panel device 100 includes at least a first substrate
101, a second substrate 102, one first binder course 103 and a binding unit.
The first substrate 101 at least has a first surface 101a and a functional layer 107, the first surface 101a
Including at least first area 101A and second area 101B, the second area 101B is adjacent and is surrounded on the first area
101A, in other embodiments, second area can be positioned at the side of first area or two sides or three sides.This embodiment party
In formula, the first substrate 101 is touch base plate.First functional layer 107 is located at where the first area 101A
One surface 101a, in present embodiment, the functional layer 107 is touch control electrode layer.
First binder course 103 is between the first substrate 101 and the second substrate 103, the second substrate 103
It is combined by first binder course 103 with the first substrate 101.The second substrate 103 is in the first surface 101a
On projection be less than the first surface 101a area.The second substrate 102 is display panel, first binder course
103 be solid-state or liquid optical cement.
The binding unit is located at the first surface 101a where the second area 101B, the functional layer 107 and institute
State between binding unit have an accommodating space U, specifically, the first substrate 101, functional layer 107, binding unit three it
Between constitute an accommodating space U.First binder course 103 covers the functional layer 107, and first binder course 103 extends
To the accommodating space U.Specifically, general solid state optics glue is flexibility when first binder course 103 is solid state optics glue
Material, can by certain pressure by the solid state optics glue laminated into the accommodating space U；When first binder course 103 is
When liquid optical cement, since liquid optical cement has mobility, it is more advantageous to and fills up the accommodating space U.Described first combines
Layer 103 extends to the entrance that the accommodating space U is conducive to avoid air or moisture.
In present embodiment, the binding unit includes a flexible circuit board 106, is formed in the first substrate 101 the
The conductive lead wire (not shown) on first surface 101a where two region 101B, and by the flexible circuit board 106
With conductive lead wire be electrically connected one second binder course 105, second binder course 105 close to the first area 101A one
Side has the first end face 105a perpendicular to the first surface 101a, and first binder course 103 is empty by the receiving
Between U contacted with the first end face 105a.The flexible circuit board 106 has more on the side of the first area 101A
A conductive pad (not shown), the conductive pad (not shown) have close to the first area 101A and are parallel to institute
The second end face 106a for stating first surface 101a is not formed described between the second end face 106a and the conductive lead wire
Second binder course 105, first binder course 103 are contacted by the accommodating space U with the second end face 106a.Described
Two binder courses 105 are conducting resinl, specifically can be anisotropic conductive adhesive paste (ACF).
The flexible circuit board 106 further includes a substrate, and the substrate is the substrate for carrying multiple conductive pads, is constituted
The coefficient of elasticity of the material of first binder course 103 is greater than the coefficient of elasticity of the substrate.
The panel device 100 that the first substrate 101 and the second substrate 102 in present embodiment are constituted, is used for
Realize touch display function.In other embodiments, the first substrate can be glass cover-plate, and the second substrate can be touching
It controls panel or the first substrate is thin-film transistor array base-plate, the second substrate is colored filter etc., Huo Zhesuo
It states first substrate and the second substrate collectively forms touch panel.
In the panel device 100 of present embodiment, due to extending to first binder course 103 by the first substrate
101, the accommodating space U that functional layer 107, binding unit three are constituted, it is therefore possible to prevent binding unit and first substrate
Exposed conductive pad or conductive lead wire are exposed in air on 101, and then improve the reliability of the panel device 100.Again
Since first binder course is the engaging member for combining the first substrate and the second substrate, in conjunction with the first substrate
The accommodating space is filled while with the second substrate, without increasing other techniques, is conducive to improve production efficiency.
As shown in figure 3, it is the flow diagram of better embodiment panel device production method provided by the invention,
Shown production method at least includes the following steps:
Step S01: providing a first substrate, and the first substrate at least has a first surface and a functional layer, institute
First surface is stated including at least first area and second area, the second area is adjacent and is located at the first area at least
Side, the functional layer are located at the first surface where the first area.
In present embodiment, the first substrate is touch base plate, and the functional layer is touch control electrode layer.
Step S02: one binding unit, the functional layer and institute are set in the first surface where the substrate second area
Stating has an accommodating space between binding unit.The binding unit is located at the first surface where the second area, this reality
It applies in mode, the binding unit includes a flexible circuit board, the first table for being formed in where the first substrate second area
Conductive lead wire on face, and one second binder course that the flexible circuit board and conductive lead wire are electrically connected.
Step S03: one first binder course is covered in the functional layer, and first binder course is extended into the receipts
Hold space.First binder course covers the functional layer, and first binder course is located at the first substrate and the second substrate
Between, the second substrate is by first binder course in conjunction with the first substrate.First binder course extends to institute
State accommodating space.The second substrate is display panel, and first binder course is solid-state or liquid optical cement.Second knot
Conjunction layer has the first end face perpendicular to the first surface close to the side of the first area, and first binder course is logical
The accommodating space is crossed to contact with the first end face.The flexible circuit board has more on the side of the first area
A conductive pad, the conductive pad has close to the first area and is parallel to a second end face of the first surface, described
Second binder course is not formed between second end face and the conductive lead wire, first binder course is empty by the receiving
Between contacted with the second end face.
As shown in figure 4, it is schematic cross-section of the panel device described in Fig. 1 along another better embodiment in the direction A-A,
The difference of itself and Fig. 2 are that the flexible circuit board 106 also has the third surface 106b backwards to the first substrate, described
First binder course 103 also covers the third surface 106b close to the first area 101A.
The above are the better embodiment of panel device provided by the invention and preparation method thereof, can not be interpreted as to this
The limitation of protection of inventors'rights range, those skilled in the art should know, without departing from the inventive concept of the premise, go back
A variety of improvement or replacement can be done, all this equal improves or replacement all should be in the scope of the present invention, i.e. this hair
Bright rights protection scope should be subject to the claims.
Claims (10)
1. a kind of panel device, it is characterised in that: it is single that it includes at least a first substrate, one first binder course and a binding
Member, the first substrate at least have a first surface and a functional layer, the first surface include at least first area and
Second area, the second area is adjacent and is located at at least side of the first area, and the functional layer is located at described first
First surface where region, the binding unit are located at the first surface where the second area, the functional layer and institute
Stating has an accommodating space between binding unit, first binder course covers the functional layer, and it is empty to extend to the receiving
Between.
2. panel device as described in claim 1, it is characterised in that: the panel device further includes a second substrate, described
First binder course is used to combine the first substrate and the second substrate between the first substrate and the second substrate,
The projection of the second substrate on the first surface is less than the area of the first surface.
3. panel device as described in claim 1, it is characterised in that: the binding unit includes a flexible circuit board, formed
Conductive lead wire on the first surface where the substrate second area, and the flexible circuit board and conductive lead wire is electric
Property connection one second binder course, second binder course close to the first area side have perpendicular to first table
One first end face in face, first binder course are contacted by the accommodating space with the first end face.
4. panel device as claimed in claim 3, it is characterised in that: the flexible circuit board close to the first area one
There are multiple conductive pads, the conductive pad has close to the first area and is parallel to the one second of the first surface on side
End face, is not formed second binder course between the second end face and the conductive lead wire, first binder course passes through
The accommodating space is contacted with the second end face.
5. panel device as claimed in claim 3, it is characterised in that: the flexible circuit board also has backwards to first base
The third surface of plate, first binder course are also covered close to the third surface of the first area.
6. panel device as claimed in claim 2, it is characterised in that: the second area is described around the first area
First substrate is touch panel, and the second substrate is display panel, and the functional layer is touch control electrode layer, and described first combines
Layer is solid-state or liquid optical cement.
7. panel device as claimed in claim 4, it is characterised in that: the flexible circuit board further includes a substrate, the base
Material is the substrate for carrying multiple conductive pads, and the coefficient of elasticity for constituting the material of first binder course is greater than the substrate
Coefficient of elasticity.
8. a kind of panel device production method, at least includes the following steps:
A first substrate is provided, the first substrate at least has a first surface and a functional layer, and the first surface is extremely
It less include first area and second area, the second area is adjacent and is located at at least side of the first area, the function
Ergosphere is located at the first surface where the first area；
In the first surface where the substrate second area, one binding unit is set, the functional layer and the binding unit it
Between have an accommodating space；
One first binder course is covered in the functional layer, and first binder course is extended into the accommodating space.
9. panel device production method as claimed in claim 8, it is characterised in that: the panel device further includes one second base
Plate, the panel device production method further include that the second substrate and the first substrate are passed through first binder course
The step of combining.
10. panel device production method as claimed in claim 8, it is characterised in that: the binding unit includes a flexible wires
Road plate, the conductive lead wire being formed on the first surface where the substrate second area, and by the flexible circuit board and
Conductive lead wire be electrically connected one second binder course, second binder course close to the first area side have perpendicular to
One first end face of the first surface, first binder course are contacted by the accommodating space with the first end face；
The flexible circuit board has multiple conductive pads on the side of the first area, and the conductive pad has close to institute
It states first area and is parallel to a second end face of the first surface, non-shape between the second end face and the conductive lead wire
At there is second binder course, first binder course is contacted by the accommodating space with the second end face, and described first
Binder course is solid-state or liquid optical cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410705127.3A CN105892732B (en) | 2014-11-28 | 2014-11-28 | Panel device and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410705127.3A CN105892732B (en) | 2014-11-28 | 2014-11-28 | Panel device and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105892732A CN105892732A (en) | 2016-08-24 |
| CN105892732B true CN105892732B (en) | 2019-04-12 |
Family
ID=56698998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410705127.3A Active CN105892732B (en) | 2014-11-28 | 2014-11-28 | Panel device and preparation method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN105892732B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107272951A (en) * | 2017-06-14 | 2017-10-20 | 长沙市宇顺显示技术有限公司 | One kind touches aobvious product and its encapsulating method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012210A1 (en) * | 1995-09-29 | 1997-04-03 | Swee Chuan Tjin | Fiber optic catheter for accurate flow measurements |
| CN101281312A (en) * | 2007-04-05 | 2008-10-08 | 爱普生映像元器件有限公司 | Input device, and electro-optical device |
| CN203350830U (en) * | 2013-07-12 | 2013-12-18 | 南昌欧菲光科技有限公司 | Sensing module of touch screen, thin-film type capacitive touch screen adopting sensing module and handheld communication device |
| CN103885235A (en) * | 2012-12-19 | 2014-06-25 | 林志忠 | Polarizing structure with touch control function |
| CN204423231U (en) * | 2014-11-28 | 2015-06-24 | 浙江金徕镀膜有限公司 | A kind of face equipment |
-
2014
- 2014-11-28 CN CN201410705127.3A patent/CN105892732B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012210A1 (en) * | 1995-09-29 | 1997-04-03 | Swee Chuan Tjin | Fiber optic catheter for accurate flow measurements |
| CN101281312A (en) * | 2007-04-05 | 2008-10-08 | 爱普生映像元器件有限公司 | Input device, and electro-optical device |
| CN103885235A (en) * | 2012-12-19 | 2014-06-25 | 林志忠 | Polarizing structure with touch control function |
| CN203350830U (en) * | 2013-07-12 | 2013-12-18 | 南昌欧菲光科技有限公司 | Sensing module of touch screen, thin-film type capacitive touch screen adopting sensing module and handheld communication device |
| CN204423231U (en) * | 2014-11-28 | 2015-06-24 | 浙江金徕镀膜有限公司 | A kind of face equipment |
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| Publication number | Publication date |
|---|---|
| CN105892732A (en) | 2016-08-24 |
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Address after: 321016 No. 333, Chung Xue street, Wucheng District, Jinhua, Zhejiang. Applicant after: Zhejiang Lai Bao Technology Co., Ltd. Address before: 321016 No. 333, Chung Xue street, Wucheng District, Jinhua, Zhejiang. Applicant before: Zhejiang Jinley Coating Co., Ltd. |
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