CN105892732A - Panel apparatus and manufacturing method therefor - Google Patents
Panel apparatus and manufacturing method therefor Download PDFInfo
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- CN105892732A CN105892732A CN201410705127.3A CN201410705127A CN105892732A CN 105892732 A CN105892732 A CN 105892732A CN 201410705127 A CN201410705127 A CN 201410705127A CN 105892732 A CN105892732 A CN 105892732A
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- substrate
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- binder course
- face
- face equipment
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Abstract
The invention relates to the technical field of panel display, in particular to a panel apparatus and a manufacturing method therefor. The panel apparatus at least comprises a first substrate, a first combining layer and a binding unit, wherein the first substrate at least has a first surface and a functional layer; the first surface at least comprises a first region and a second region; the second region is adjacent to and located on at least one side of the first region; the functional layer is located on the first surface with the first region; the binding unit is located on the first surface with the second region; an accommodating space is formed between the functional layer and the binding unit; and the first combining layer covers the functional layer and extends to the accommodating space. In addition, it is necessary for the invention to disclose a manufacturing method for the panel apparatus.
Description
Technical field
The present invention relates to technical field of flat panel display, particularly relate to a kind of face equipment and preparation method thereof.
Background technology
During touch technology is widely used in various electronic multimedia product in recent years, the most carry-on shifting
Dynamic formula product, such as mobile phone, e-book, panel computer etc..Use touch technology can have as the means of input
Effect replaces existing keyboard or the input method of mouse.In addition to convenience, more due to the intuitive of operation,
The input mode technology of touch-control has become the most welcome man-machine interface and multimedia interaction mode.
As touch technology application touch control display device most typically, it is typically by contact panel and shows
Showing that panel is constituted, contact panel generally includes touch base plate and is bundled in it by binding technique (FOG)
On flexible circuit board (FPC), touching signals realizes signal by flexible circuit board with exterior I C and is connected.
FOG technique is to be bound on touch base plate by FPC by a kind of anisotropic conductive.But, carry out
During FOG technique, the conductive pad above FPC or the conductive lead wire part on touch base plate can be exposed to
In air, easily it is corroded, has had a strong impact on the reliability of touch control display apparatus.
Summary of the invention
In view of this, the present invention provides a kind of face equipment being conducive to improving reliability.
Additionally, there is a need to provide the manufacture method of a kind of above-mentioned face equipment.
The described face equipment that the present invention provides at least includes that a first substrate, one first binder course and are tied up
Cell, described first substrate at least has a first surface and a functional layer, and described first surface is at least
Including first area and second area, described second area is adjacent and is positioned at least the one of described first area
Side, described functional layer is positioned at the first surface at place, described first area, and described binding unit is positioned at described
The first surface in two place, regions, has a receiving space, institute between described functional layer and described binding unit
State the first binder course and cover described functional layer, and extend to described receiving space.
In the described face equipment that the present invention provides, described face equipment also includes a second substrate, described the
One binder course is between described first substrate and second substrate, and is used for described first substrate and the second base
Hardening conjunction, the projection on the first surface of described second substrate is less than the area of described first surface.
In the described face equipment that the present invention provides, described binding unit includes a flexible circuit board, is formed at
Conductive lead wire on the first surface at described substrate second area place, and by described flexible circuit board and leading
One second binder course that electrical lead is electrically connected with, described second binder course has near the side of described first area
Having one first end face being perpendicular to described first surface, described first binder course passes through described receiving space and institute
State the first end contact.
In the described face equipment manufacture method that the present invention provides, described flexible circuit board is near described firstth district
Having multiple conductive pad in one example in territory, described conductive pad has near described first area and is parallel to described
One second end face of first surface, is formed without described second between described second end face and described conductive lead wire
Binder course, described first binder course is by described receiving space and described second end contact.
In the described face equipment that the present invention provides, described flexible circuit board also has the most described first substrate
The 3rd surface, described first binder course also covers the 3rd surface near described first area.
In the described face equipment that the present invention provides, described second area around described first area, described the
One substrate is contact panel, and described second substrate is display floater, and described first functional layer is touch control electrode layer,
Described first binder course is solid-state or liquid optical cement.
In the described face equipment that the present invention provides, described flexible circuit board also includes a base material, described base material
For carrying the substrate of multiple described conductive pads, constitute the coefficient of elasticity of material of described first binder course more than institute
State the coefficient of elasticity of base material.
A kind of face equipment manufacture method, it at least comprises the following steps:
A first substrate, described first substrate is provided at least to have a first surface and a functional layer, described
First surface at least includes first area and second area, and described second area is adjacent and is positioned at described firstth district
At least side in territory, described functional layer is positioned at the first surface at place, described first area；At described substrate
The first surface in two place, regions arranges a binding unit, has between described functional layer and described binding unit
One receiving space；Described functional layer covers one first binder course, and described first binder course is extended to
Described receiving space.
In the described face equipment manufacture method that the present invention provides, described face equipment also includes one second base
Plate, described face equipment manufacture method also includes described second substrate described by institute with described first substrate
The step that first binder course combines.
In the described face equipment manufacture method that the present invention provides, described binding unit includes a flexible circuitry
Plate, the conductive lead wire being formed on the first surface at described substrate second area place, and by described flexibility
One second binder course that wiring board and conductive lead wire are electrically connected with, described second binder course is near described firstth district
The side in territory has one first end face being perpendicular to described first surface, and described first binder course is by described receipts
Hold space and described first end contact.Described flexible circuit board has on the side of described first area
Multiple conductive pads, described conductive pad has near described first area and is parallel to the one the of described first surface
Biend, is formed without described second binder course between described second end face and described conductive lead wire, and described
One binder course is by described receiving space and described second end contact.
In the described face equipment manufacture method that the present invention provides, described second area is around described firstth district
Territory, described first substrate is contact panel, and described second substrate is display floater, and described first functional layer is
Touch control electrode layer, described first binder course is solid-state or liquid optical cement.
In described face equipment that the present invention provides and preparation method thereof, owing to described first binder course is extended
To the receiving space being made up of described first substrate, functional layer, binding unit three, it is therefore possible to prevent
Conductive pad exposed in binding unit and first substrate or conductive lead wire are exposed in air, and then improve
The reliability of described face equipment.It is by described first substrate and second substrate due to described first binder course again
The conjunction combined, fills described receiving space while combining described first substrate and second substrate,
Without increasing other technique, be conducive to improving production efficiency.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
The structural representation of the face equipment 100 of the better embodiment that Fig. 1 provides for the present invention；
Fig. 2 is the schematic cross-section along a better embodiment in A-A direction of the face equipment shown in Fig. 1；
Fig. 3 is the schematic flow sheet of the face equipment manufacture method shown in Fig. 1；
Fig. 4 is that face equipment shown in Fig. 1 is along the schematic cross-section of another better embodiment in A-A direction.
Detailed description of the invention
Face equipment for explanation present invention offer and preparation method thereof, below in conjunction with Figure of description and word
Explanation is described in detail.
Refer to Fig. 1 and Fig. 2, the face equipment 100 of its better embodiment provided for the present invention
Structural representation and the schematic cross-section of the better embodiment along A-A direction thereof.Described face equipment
100 at least include that first substrate 101, second substrate 102,1 first binder course 103 and is tied up
Cell.
Described first substrate 101 at least has a first surface 101a and a functional layer 107, and described
One surface 101a at least includes first area 101A and second area 101B, described second area 101B
Adjacent and be surrounded on described first area 101A, in other embodiments, second area may be located at the
The side in one region or both sides or three sides.In present embodiment, described first substrate 101 is touch-control base
Plate.Described first functional layer 107 is positioned at the first surface 101a at 101A place, described first area, this reality
Executing in mode, described functional layer 107 is touch control electrode layer.
Described first binder course 103 between described first substrate 101 and second substrate 103, described
Two substrates 103 are combined with described first substrate 101 by described first binder course 103.Described second substrate
103 projections on the described first surface 101a area less than described first surface 101a.Described second
Substrate 102 is display floater, and described first binder course 103 is solid-state or liquid optical cement.
Described binding unit is positioned at the first surface 101a at described second area 101B place, described functional layer
There is between 107 and described binding unit a receiving space U, concrete, described first substrate 101, merit
A receiving space U is constituted between ergosphere 107, binding unit three.Described first binder course 103 covers institute
State functional layer 107, and described first binder course 103 extends to described receiving space U.Concrete, work as institute
When stating the first binder course 103 for solid state optics glue, general solid state optics glue is flexible material, can be by certain
Pressure described solid state optics glue laminated is entered described receiving space U；When described first binder course 103 is liquid
During optical cement, owing to liquid optical cement has mobility, it is more beneficial for filling up described receiving space U.Described
First binder course 103 extends to described receiving space U and is conducive to avoiding the entrance of air or moisture.
In present embodiment, described binding unit includes a flexible circuit board 106, is formed at described first base
Conductive lead wire (not shown) on the first surface 101a at plate 101 second area 101B place, with
And one second binder course 105 that described flexible circuit board 106 and conductive lead wire be electrically connected with, described second
Binder course 105 has near the side of described first area 101A and is perpendicular to described first surface 101a's
One first end face 105a, described first binder course 103 is by described receiving space U and described first end face
105a contacts.Described flexible circuit board 106 has multiple leading on the side of described first area 101A
Electrical pad (not shown), described conductive pad (not shown) has near described first area 101A
And the one second end face 106a, described second end face 106a being parallel to described first surface 101a leads with described
Being formed without described second binder course 105 between electrical lead, described first binder course 103 is by described collecting
Space U contacts with described second end face 106a.Described second binder course 105 is conducting resinl, and concrete can
For anisotropic conductive (ACF).
Described flexible circuit board 106 also includes that a base material, described base material are the lining carrying multiple described conductive pads
The end, the coefficient of elasticity of the material constituting described first binder course 103 is more than the coefficient of elasticity of described base material.
Described first substrate 101 in present embodiment and the described face equipment of second substrate 102 composition
100, it is used for realizing touch display function.In other embodiments, described first substrate can be glass cover
Plate, described second substrate can be contact panel, or described first substrate is thin-film transistor array base-plate,
Described second substrate is colored filter etc., or described first substrate and second substrate collectively form touch surface
Plate.
In the face equipment 100 of present embodiment, owing to described first binder course 103 is extended to by described
The receiving space U that first substrate 101, functional layer 107, binding unit three are constituted, therefore, can prevent
Stop exposed conductive pad or conductive lead wire on binding unit and first substrate 101 to be exposed in air, enter
And improve the reliability of described face equipment 100.It is by described first substrate due to described first binder course again
The conjunction combined with second substrate, fills described while combining described first substrate and second substrate
Receiving space, it is not necessary to the technique increasing other, is conducive to improving production efficiency.
As it is shown on figure 3, the flow process of its better embodiment face equipment manufacture method provided for the present invention
Schematic diagram, shown manufacture method at least comprises the following steps:
Step S01: provide a first substrate, described first substrate at least to have a first surface and a merit
Ergosphere, described first surface at least includes first area and second area, and described second area is adjacent and is positioned at
At least side of described first area, described functional layer is positioned at the first surface at place, described first area.
In present embodiment, described first substrate is touch base plate, and described functional layer is touch control electrode layer.
Step S02: the first surface at described substrate second area place arranges a binding unit, described merit
There is between ergosphere and described binding unit a receiving space.Described binding unit is positioned at described second area institute
First surface, in present embodiment, described binding unit include a flexible circuit board, be formed at described
Conductive lead wire on the first surface at first substrate second area place, and by described flexible circuit board and leading
One second binder course that electrical lead is electrically connected with.
Step S03: cover one first binder course in described functional layer, and described first binder course is extended
To described receiving space.Described first binder course covers described functional layer, and described first binder course is positioned at described
Between first substrate and second substrate, described second substrate is by described first binder course and described first substrate
In conjunction with.Described first binder course extends to described receiving space.Described second substrate is display floater, described
First binder course is solid-state or liquid optical cement.Described second binder course has near the side of described first area
Having one first end face being perpendicular to described first surface, described first binder course passes through described receiving space and institute
State the first end contact.Described flexible circuit board has multiple conduction on the side of described first area
Pad, described conductive pad has close described first area and is parallel to one second end face of described first surface,
Described second binder course, described first binder course it is formed without between described second end face and described conductive lead wire
By described receiving space and described second end contact.
As shown in Figure 4, its for face equipment described in Fig. 1 along another better embodiment in A-A direction
Schematic cross-section, it is with the difference of Fig. 2, and described flexible circuit board 106 also has the most described first
3rd surface 106b of substrate, described first binder course 103 also covers near described first area 101A's
3rd surface 106b.
The better embodiment of the face equipment provided for the present invention above and preparation method thereof, can not understand
For the restriction to rights protection scope of the present invention, those skilled in the art should know, without departing from this
On the premise of bright design, also can do multiple improvement or replacement, all of such improvement or replacement all should be at this
In the range of the rights protection of invention, i.e. the scope of the present invention should be as the criterion with claim.
Claims (10)
1. a face equipment, it is characterised in that: it at least includes a first substrate, one first binder course
And a binding unit, described first substrate at least has a first surface and a functional layer, and described first
Surface at least includes first area and second area, and described second area is adjacent and is positioned at described first area
At least side, described functional layer is positioned at the first surface at place, described first area, and described binding unit is positioned at
The first surface at described second area place, has a collecting empty between described functional layer and described binding unit
Between, described first binder course covers described functional layer, and extends to described receiving space.
2. face equipment as claimed in claim 1, it is characterised in that: described face equipment also includes one
Second substrate, described first binder course is between described first substrate and second substrate, and is used for described
First substrate and second substrate combine, and the projection on the first surface of described second substrate is less than described the
The area on one surface.
3. face equipment as claimed in claim 1, it is characterised in that: described binding unit includes that one is soft
Property wiring board, the conductive lead wire being formed on the first surface at described substrate second area place, and by institute
Stating flexible circuit board and one second binder course of conductive lead wire electric connection, described second binder course is near described
The side of first area has one first end face being perpendicular to described first surface, and described first binder course passes through
Described receiving space and described first end contact.
4. face equipment as claimed in claim 3, it is characterised in that: described flexible circuit board is near institute
Stating and have multiple conductive pad on the side of first area, described conductive pad has near described first area and puts down
Row, in one second end face of described first surface, is formed without between described second end face and described conductive lead wire
Described second binder course, described first binder course is by described receiving space and described second end contact.
5. face equipment as claimed in claim 3, it is characterised in that: described flexible circuit board also has
3rd surface of the most described first substrate, described first binder course also covers the near described first area
Three surfaces.
6. face equipment as claimed in claim 2, it is characterised in that: described second area is around described
First area, described first substrate is contact panel, and described second substrate is display floater, described first merit
Ergosphere is touch control electrode layer, and described first binder course is solid-state or liquid optical cement.
7. face equipment as claimed in claim 4, it is characterised in that: described flexible circuit board also includes
One base material, described base material is the substrate carrying multiple described conductive pads, constitutes the material of described first binder course
Coefficient of elasticity more than the coefficient of elasticity of described base material.
8. a face equipment manufacture method, it at least comprises the following steps:
A first substrate, described first substrate is provided at least to have a first surface and a functional layer, described
First surface at least includes first area and second area, and described second area is adjacent and is positioned at described firstth district
At least side in territory, described functional layer is positioned at the first surface at place, described first area；
First surface at described substrate second area place arranges a binding unit, and described functional layer is with described
There is between binding unit a receiving space；
Described functional layer covers one first binder course, and described first binder course is extended to described collecting
Space.
9. face equipment manufacture method as claimed in claim 8, it is characterised in that: described face equipment
Also include that a second substrate, described face equipment manufacture method also include described second substrate and described first
Substrate by the step that combines of described first binder course.
10. face equipment manufacture method as claimed in claim 8, it is characterised in that: described binding unit
Including a flexible circuit board, be formed at described substrate second area place first surface on conductive lead wire,
And by described flexible circuit board and one second binder course of conductive lead wire electric connection, described second binder course
There is one first end face being perpendicular to described first surface, described first knot near the side of described first area
Close layer by described receiving space and described first end contact.Described flexible circuit board is near described firstth district
Having multiple conductive pad on the side in territory, described conductive pad has near described first area and is parallel to described
One second end face of first surface, is formed without described second between described second end face and described conductive lead wire
Binder course, described first binder course is by described receiving space and described second end contact, described first knot
Closing layer is solid-state or liquid optical cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410705127.3A CN105892732B (en) | 2014-11-28 | 2014-11-28 | Panel device and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410705127.3A CN105892732B (en) | 2014-11-28 | 2014-11-28 | Panel device and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105892732A true CN105892732A (en) | 2016-08-24 |
| CN105892732B CN105892732B (en) | 2019-04-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410705127.3A Active CN105892732B (en) | 2014-11-28 | 2014-11-28 | Panel device and preparation method thereof |
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| Country | Link |
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| CN (1) | CN105892732B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107272951A (en) * | 2017-06-14 | 2017-10-20 | 长沙市宇顺显示技术有限公司 | One kind touches aobvious product and its encapsulating method |
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|---|---|---|---|---|
| WO1997012210A1 (en) * | 1995-09-29 | 1997-04-03 | Swee Chuan Tjin | Fiber optic catheter for accurate flow measurements |
| CN101281312A (en) * | 2007-04-05 | 2008-10-08 | 爱普生映像元器件有限公司 | Input device, and electro-optical device |
| CN203350830U (en) * | 2013-07-12 | 2013-12-18 | 南昌欧菲光科技有限公司 | Sensing module of touch screen, thin-film type capacitive touch screen adopting sensing module and handheld communication device |
| CN103885235A (en) * | 2012-12-19 | 2014-06-25 | 林志忠 | Polarizing structure with touch control function |
| CN204423231U (en) * | 2014-11-28 | 2015-06-24 | 浙江金徕镀膜有限公司 | A kind of face equipment |
-
2014
- 2014-11-28 CN CN201410705127.3A patent/CN105892732B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012210A1 (en) * | 1995-09-29 | 1997-04-03 | Swee Chuan Tjin | Fiber optic catheter for accurate flow measurements |
| CN101281312A (en) * | 2007-04-05 | 2008-10-08 | 爱普生映像元器件有限公司 | Input device, and electro-optical device |
| CN103885235A (en) * | 2012-12-19 | 2014-06-25 | 林志忠 | Polarizing structure with touch control function |
| CN203350830U (en) * | 2013-07-12 | 2013-12-18 | 南昌欧菲光科技有限公司 | Sensing module of touch screen, thin-film type capacitive touch screen adopting sensing module and handheld communication device |
| CN204423231U (en) * | 2014-11-28 | 2015-06-24 | 浙江金徕镀膜有限公司 | A kind of face equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107272951A (en) * | 2017-06-14 | 2017-10-20 | 长沙市宇顺显示技术有限公司 | One kind touches aobvious product and its encapsulating method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105892732B (en) | 2019-04-12 |
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Address after: 321016 No. 333, Chung Xue street, Wucheng District, Jinhua, Zhejiang. Applicant after: Zhejiang Lai Bao Technology Co., Ltd. Address before: 321016 No. 333, Chung Xue street, Wucheng District, Jinhua, Zhejiang. Applicant before: Zhejiang Jinley Coating Co., Ltd. |
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