CN105889778A - Phase change suppression finned radiator LED lamp - Google Patents
Phase change suppression finned radiator LED lamp Download PDFInfo
- Publication number
- CN105889778A CN105889778A CN201610403478.8A CN201610403478A CN105889778A CN 105889778 A CN105889778 A CN 105889778A CN 201610403478 A CN201610403478 A CN 201610403478A CN 105889778 A CN105889778 A CN 105889778A
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- Prior art keywords
- phase change
- heat
- heat sink
- heat transfer
- led lamp
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- 230000008859 change Effects 0.000 title claims abstract description 198
- 230000001629 suppression Effects 0.000 title claims abstract description 120
- 238000012546 transfer Methods 0.000 claims abstract description 128
- 239000000758 substrate Substances 0.000 claims description 64
- 230000002401 inhibitory effect Effects 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 39
- 230000008569 process Effects 0.000 claims description 39
- 238000003780 insertion Methods 0.000 claims description 28
- 230000037431 insertion Effects 0.000 claims description 28
- 230000005764 inhibitory process Effects 0.000 claims description 21
- 238000005192 partition Methods 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 13
- 238000004026 adhesive bonding Methods 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- 210000004907 gland Anatomy 0.000 claims description 9
- 238000005219 brazing Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 239000000463 material Substances 0.000 description 21
- 238000013475 authorization Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a phase change suppression finned radiator LED lamp. The phase change suppression finned radiator LED lamp comprises a phase change suppression radiator structure, a light emitting assembly and a power assembly. The light emitting assembly is located at one end of the phase change suppression radiator structure. The power assembly is located at the other end of the phase change suppression radiator structure and connected with the light emitting assembly, and is suitable for supplying power to the light emitting assembly. Phase change suppression heat transfer plates are adopted as radiating fins, so that the heat conduction rate is high, thermal homogeneity is good, the heat dissipation amount is increased, and meanwhile the size and weight are reduced.
Description
Technical Field
The invention relates to the field of illumination, in particular to a phase-change suppression finned radiator LED lamp.
Background
The high-power LED lamp is widely applied to places such as urban squares, large assembly workshops, warehouses, ports, factories, stadiums and the like for indoor and outdoor local or key illumination. All high-power LED street lamps sold in the market at present are based on the traditional heat transfer mechanism and the corresponding heat transfer technology. Various efforts for improving heat transfer technologies (including using heat pipes, fins, using chip base materials with excellent heat conductivity, etc.) on all heat transfer paths are still difficult to break through the bottleneck of chip heat dissipation, and especially for high-power LED lamps, the heat dissipation problem is more prominent, so that the LED lamp has high light attenuation and short service life, and the popularization and use of the LED lamp are affected.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides a phase-change suppression finned radiator LED lamp which is used for solving the problems of high light attenuation and short service life of the LED lamp in the prior art due to poor heat dissipation performance.
To achieve the above and other related objects, the present invention provides a phase-change suppressing finned heat sink LED lamp, including: a phase change inhibiting heat sink structure, a light emitting assembly and a power supply assembly;
the light emitting assembly is positioned at one end of the phase change suppression heat sink structure;
the power supply assembly is located at the other end of the phase change suppression heat sink structure, is connected with the light emitting assembly, and is suitable for supplying power to the light emitting assembly.
As a preferable scheme of the phase change suppression finned radiator LED lamp of the present invention, the phase change suppression radiator structure includes:
the heat radiator comprises a heat radiator substrate, wherein a boss is formed on the surface of the heat radiator substrate, a groove is formed in the boss, the groove comprises a first part and a second part which is positioned below the first part and connected with the first part, and the width of the first part of the groove is larger than that of the second part of the groove;
the phase change inhibiting heat transfer plate is inserted into the groove through the insertion edge; a heat superconducting pipeline with a specific shape is formed in the phase change inhibition heat transfer plate, the heat superconducting pipeline is a closed pipeline, and a heat transfer medium is filled in the heat superconducting pipeline;
the depth of the groove is larger than the distance between the insertion edge of the phase change inhibiting heat transfer plate and the heat superconducting pipeline which is most adjacent to the insertion edge.
As a preferable aspect of the phase change suppression finned heat sink LED lamp of the present invention, a length direction of the boss is identical to a length direction of the heat sink substrate, and the length of the boss is less than or equal to the length of the heat sink substrate.
As a preferable aspect of the phase change suppression finned radiator LED lamp of the present invention, a length direction of the groove is identical to a length direction of the boss, and the length of the groove is equal to the length of the boss.
As a preferable aspect of the phase change suppression finned heat sink LED lamp of the present invention, the side wall of the groove is perpendicular to the surface of the heat sink substrate.
As a preferable scheme of the phase change suppression finned radiator LED lamp of the present invention, the boss and the radiator substrate are integrated.
As a preferable aspect of the phase change suppression finned heat sink LED lamp of the present invention, the groove second portion extends to an inside of the heat sink substrate.
As a preferable embodiment of the phase change suppression finned heat sink LED lamp of the present invention, the number of the bosses and the number of the phase change suppression heat transfer plates are both plural, and the plural bosses and the phase change suppression heat transfer plates are distributed on the heat sink substrate in parallel at intervals or in a radial shape.
As a preferable scheme of the phase change suppression finned radiator LED lamp of the present invention, the phase change suppression heat transfer plate is of a composite plate type structure, and the phase change suppression heat transfer plate is of a single-sided expanded form, a double-sided expanded form, or a double-sided flat form.
As a preferable scheme of the phase change suppression finned radiator LED lamp of the present invention, the shape of the thermal superconducting pipeline is a hexagonal honeycomb shape, a criss-cross mesh shape, a plurality of U-shapes connected end to end in series, a diamond shape, a triangle shape, a circular ring shape, or any combination of any one or more of them.
As a preferable aspect of the phase change suppression finned heat sink LED lamp of the present invention, an edge of the phase change suppression heat transfer plate is a non-pipe portion, and the non-pipe portion is inserted into the second groove portion; the heat superconducting pipeline is positioned in the first part of the groove and comprises a first straight-edge sub pipeline and a second straight-edge sub pipeline, the length direction of the first straight-edge sub pipeline is consistent with that of the insertion edge of the phase change inhibition heat transfer plate, and the second straight-edge sub pipeline is vertically connected with the first straight-edge sub pipeline.
As a preferable scheme of the phase change suppression finned radiator LED lamp of the present invention, a heat conductive glue is filled between the phase change suppression heat transfer plate and the boss.
As a preferred embodiment of the phase change suppression finned heat sink LED lamp of the present invention, the heat sink substrate and the phase change suppression heat transfer plate are fixed together by a pressing process, a heat conductive adhesive bonding process, a friction stir welding process, a brazing welding process, a pressing and heat conductive adhesive bonding process, a pressing and friction stir welding bonding process, or a pressing and brazing welding bonding process.
As a preferable aspect of the phase change suppression finned heat sink LED lamp of the present invention, a dimension of the heat sink substrate in a length direction of the insertion edge of the phase change suppression heat transfer plate is smaller than or equal to a length of the insertion edge of the phase change suppression heat transfer plate.
As a preferable aspect of the phase change suppression finned radiator LED lamp of the present invention, a vent hole is provided in a region between the heat superconducting pipes on the phase change suppression heat transfer plate.
As a preferable scheme of the phase change suppression finned radiator LED lamp of the present invention, the phase change suppression radiator structure includes: the heat sink comprises a heat sink substrate and a plurality of phase change suppression heat transfer plates inserted on the heat sink substrate.
As a preferable scheme of the phase change suppression finned radiator LED lamp of the present invention, the phase change suppression radiator structure includes: a heat sink base plate and a plurality of phase change inhibiting heat transfer plates; wherein,
the heat radiator base plate comprises a plurality of partition plates, the partition plates and the phase change inhibition heat transfer plates are alternately arranged, one end surfaces of the partition plates are flush with one end of each phase change inhibition heat transfer plate, and the partition plates and the end surfaces of the phase change inhibition heat transfer plates form a mounting surface of the light-emitting assembly together;
the partition plate is fixedly connected with the phase change suppression heat transfer plate.
As a preferable aspect of the phase change suppression finned heat sink LED lamp of the present invention, the phase change suppression finned heat sink LED lamp further includes a side fixing plate fixed to an outer surface of the phase change suppression heat transfer plate located on the outermost side.
As a preferable aspect of the phase change suppression finned radiator LED lamp of the present invention, the light emitting assembly includes: the LED light source comprises an LED chip, a lens gland and a reflecting cover;
the LED chip is positioned on the surface of the heat radiator substrate away from the phase change inhibition heat transfer plate;
the lens, the lens gland and the reflector are sequentially overlapped at the periphery of the LED chip.
As a preferable aspect of the phase change suppression finned radiator LED lamp of the present invention, the power supply module includes: a power supply and a power supply cover plate;
the power supply is positioned at one end of the phase change inhibiting heat transfer plate, which is far away from the light-emitting component, and the power supply cover plate is pressed on the surface of the power supply.
As a preferable scheme of the phase change suppression finned radiator LED lamp of the present invention, the phase change suppression finned radiator LED lamp further includes a fixing device, and the fixing device is located on the power supply cover plate.
As described above, the phase change suppression finned radiator LED lamp of the present invention has the following beneficial effects:
1) the phase change inhibiting heat transfer plate is used as the heat dissipation fin, so that the heat conduction rate is high, the temperature uniformity is good, the heat dissipation capacity is improved, and the volume and the weight are reduced.
2) The bosses are arranged on the surface of the radiator substrate, the grooves with different widths are arranged in the bosses, the non-pipeline part is positioned at the part with the narrower width of the groove after the phase change inhibition heat transfer plate is inserted into the groove, the heat superconducting pipeline is positioned at the part with the wider width of the groove, and heat conducting glue is filled between the phase change inhibition heat transfer plate and the radiator substrate, so that the thermal resistance between the phase change inhibition heat transfer plate and the radiator substrate is greatly reduced, and the heat radiation performance of the inserted radiator is improved.
3) The phase change inhibiting heat transfer plate is connected with the LED fixing substrate through seamless connection processes such as friction stir welding, mechanical extrusion or heat conducting glue bonding, so that the connection thermal resistance is greatly reduced.
Drawings
Fig. 1 is a schematic structural diagram of an LED lamp with a phase-change suppression finned heat sink according to an embodiment of the present invention.
Fig. 2 is an enlarged schematic view of a region a in fig. 1.
Fig. 3 is an enlarged schematic view of the heat spreader substrate in area a of fig. 1.
Fig. 4 is an enlarged partial cross-sectional view of a pipe portion of a phase change suppressing heat transfer plate in the fin-inserted heat sink provided in the second embodiment of the present invention.
Fig. 5 is a schematic structural view showing a phase change suppressing heat transfer plate in which the internal heat superconducting pipe in the fin-inserted heat sink provided in the second embodiment of the present invention is formed in a hexagonal honeycomb shape.
Description of the element reference numerals
1 phase change suppression radiator structure
11 Heat sink base plate
111 boss
112 groove
1121 channel first portion
1122 channel second portion
12 phase change inhibiting heat transfer plate
121 first plate
122 second plate
123 heat superconducting pipeline
1231 first straight side sub-pipeline
1232 second straight side line
124 non-line section
125 craft mouth
126 bump structure
127 heat transfer working medium
Insertion edge of 128 phase change inhibiting heat transfer plate
13 Heat-conducting glue
14 side fixing plate
15 fastener
2 light emitting component
21 LED chip
22 lens
23 lens gland
24 reflecting shade
3 Power supply assembly
31 power supply
32 power supply cover plate
4 fixing device
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Referring to fig. 1 to 5, it should be noted that the drawings provided in the present embodiment are only schematic illustrations for explaining the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the type, number and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
Referring to fig. 1, the present invention provides a phase change suppression finned heat sink LED lamp, including: a phase change suppressing heat sink structure 1, a light emitting module 2, and a power module 3; the light emitting component 2 is positioned at one end of the phase change suppression heat sink structure 1; the power supply module 3 is located at the other end of the phase change suppression heat sink structure 1, is connected to the light emitting module 2, and is adapted to supply power to the light emitting module 2.
As shown in fig. 2 and 3, the phase change suppression heat sink structure 1 includes: the heat sink substrate 11, a boss 111 is formed on the surface of the heat sink substrate 11, a groove 112 is formed in the boss 111, the groove 112 includes a first portion and a second portion located below the first portion and connected to the first portion, and the width of the groove first portion 1121 is greater than the width of the groove second portion 1122; a phase change suppressing heat transfer plate 12, one side of the phase change suppressing heat transfer plate 12 being an insertion side through which the phase change suppressing heat transfer plate 12 is inserted into the groove 112; a heat superconducting pipeline 123 with a specific shape is formed in the phase change inhibiting heat transfer plate 12, the heat superconducting pipeline 123 is a closed pipeline, and a heat transfer working medium 127 is filled in the heat superconducting pipeline 123; the depth of the groove 112 is larger than the distance between the insertion edge 128 of the phase change suppressing heat transfer plate 12 and the heat superconducting pipe 123 most adjacent to the insertion edge. The depth of the groove 112 is greater than the distance from the insertion edge 128 of the phase change inhibiting heat transfer plate 12 to the heat superconducting pipeline 123 nearest to the insertion edge, so that after the phase change inhibiting heat transfer plate 12 is inserted into the groove 112, the part where the heat superconducting pipeline 123 is distributed can be ensured to be in direct contact with the radiator substrate 11, the thermal resistance between the phase change inhibiting heat transfer plate 12 and the radiator substrate 11 is reduced, and the heat radiation performance of the plug-in fin radiator is improved; since the thickness of the portion of the phase change suppression heat transfer plate 12 where the heat superconducting pipes 123 are distributed is greater than the thickness of the non-pipe portion, the groove 112 is configured to include a first portion and a second portion located below the first portion and connected to the first portion, and the width of the groove first portion 1121 is greater than the width of the groove second portion 1122, so that after the phase change suppression heat transfer plate 12 is inserted into the groove 112, the distance between the heat superconducting pipe portion and the non-pipe portion of the phase change suppression heat transfer plate 12 and the heat sink substrate 11 can be ensured to be in good contact, thereby further reducing the thermal resistance between the phase change suppression heat transfer plate 12 and the heat sink substrate 11, and improving the heat dissipation performance of the plug-in heat sink.
As an example, the depth of the groove second portion 1122 is equal to the distance between the insertion side 128 of the phase change suppressing heat transfer plate 12 to the heat superconducting pipe 123 most adjacent to the insertion side.
As an example, the length direction of the boss 111 coincides with the length direction of the heat sink substrate 11, and the length of the boss 111 is less than or equal to the length of the heat sink substrate 12.
As an example, the length direction of the groove 112 coincides with the length direction of the boss 111, and the length of the groove 112 is equal to the length of the boss 111.
As an example, the side walls of the grooves 112 are perpendicular to the surface of the heat sink substrate 11.
As an example, the boss 111 and the heat sink substrate 11 are integrated.
In one example, the first groove portion 1121 and the second groove portion 1122 are both located within the boss 111, as shown in fig. 1; in another example, the trench second portion 1122 extends to the interior of the heat sink substrate 11.
As an example, the material of the heat sink substrate 11 should be a material with good thermal conductivity; preferably, in this embodiment, the material of the heat sink substrate 11 may be copper, copper alloy, aluminum or aluminum alloy or any combination of any one or more of them.
As an example, the number of the bosses 111 and the phase change suppressing heat transfer plates 12 is plural, and the plurality of bosses 111 and the phase change suppressing heat transfer plates 12 are distributed on the heat sink base plate 11 at intervals in parallel. The longitudinal direction of the plurality of bosses 11 may be parallel to the edge of the heat sink base plate 11, or may be oblique to the edge of the heat sink base plate 11.
For example, the number of the bosses 111 is plural, and the plural bosses 111 are radially distributed on the heat sink base plate 11. The radial distribution of the plurality of bosses 111 on the heat sink substrate 11 means that the plurality of bosses 111 are located on the surface of the heat sink substrate 11 and extend from a position near the center of the heat sink substrate 11 to the edge of the heat sink substrate 11. It should be further noted that the plurality of bosses 111 are uniformly distributed in the circumferential direction of the heat sink base plate 11.
It should be further noted that the length direction of the heat sink substrate 11 is a direction corresponding to the length of the boss 111, i.e., a direction parallel to the surface of the boss 111, and the width direction of the heat sink substrate 11 is a direction corresponding to the width of the boss 111, i.e., a cross-sectional direction shown in fig. 2 and 3, i.e., a direction perpendicular to the surface of the boss 111.
As an example, the phase change inhibiting heat transfer plate 12 is a composite plate structure, the surface of the phase change inhibiting heat transfer plate 12 may be in a double-sided expansion shape as shown in fig. 4, the phase change inhibiting heat transfer plate 12 includes a first plate material 121 and a second plate material 122, and the first plate material 121 and the second plate material 122 are combined together through a rolling process; the heat superconducting pipes 123 are formed by an inflation process, and at the same time, the heat superconducting pipes 123 are formed, and the convex structures 126 corresponding to the heat superconducting pipes 123 are formed on the surfaces of the first plate material 121 and the second plate material 122.
In addition to the structure shown in fig. 4, when the phase change suppressing heat transfer plate 12 includes the first plate material 121 and the second plate material 122, the heat superconducting pipes 123 may be formed by a blowing process, and the convex structures 126 corresponding to the heat superconducting pipes 123 may be formed on the surface of the first plate material 121 or the surface of the second plate material 122, that is, the surface of the phase change suppressing heat transfer plate 12 is in a single-sided swelling shape.
It should be further noted that the surface of the phase change inhibiting heat transfer plate 12 may also be a double-sided flat shape, and in this case, the specific structure of the phase change inhibiting heat transfer plate 12 may be the same as that of the double-sided flat phase change inhibiting heat transfer plate described in the patent application No. 201511029540.3, and the specific description thereof will not be repeated herein.
As an example, the shape of the thermal superconducting pipe 123 may be a hexagonal honeycomb shape, a criss-cross mesh shape, a plurality of U-shapes connected end to end in series, a diamond shape, a triangular shape, a circular shape, or any combination of any one or more thereof. Fig. 5 exemplifies that the shape of the thermal superconducting conduit 123 is a hexagonal honeycomb shape. As can be seen from fig. 5, in fig. 5, the hexagonal portions and the edge regions are non-pipe portions 124, and the heat superconducting pipes 123 are formed by surrounding the hexagons and communicating with each other. It should be noted that, since the thermal superconducting pipeline 123 is prepared through an inflation process, in the process of forming the thermal superconducting pipeline 123, a process port 125, that is, a working medium charging port, is formed on the first plate 121 or the second plate 122. After the shape of the thermal superconducting pipe 123 is initially formed at the process port 125, the process port 125 is sealed by welding, so that the thermal superconducting pipe 123 is not conducted with the outside.
By way of example, with continued reference to fig. 5, the non-conduit portion 124 is inserted into the channel second portion 1122; a portion of the heat superconducting pipe 123 close to the insertion edge 123 of the phase transition suppression heat transfer plate is located in the groove first portion 1121, the heat superconducting pipe 123 located in the groove first portion 1121 includes a first straight-side sub-pipe 1231 and a second straight-side sub-pipe 1232, a length direction of the first straight-side sub-pipe 1231 is identical to a length direction of the insertion edge 128 of the phase transition suppression heat transfer plate, and the second straight-side sub-pipe 1232 is perpendicularly connected to the first straight-side sub-pipe 1231. The heat superconducting pipe 123 located in the first portion 1121 of the groove is configured to include a first straight-side sub pipe 1231 and a second straight-side sub pipe 1232, that is, the heat superconducting pipe 123 located in the first portion 1121 of the groove is configured to be a straight-side shape, such a design enables the phase change suppression heat transfer plate 12 to be conveniently matched with the heat sink substrate 11, the process is easy to implement, the groove 112 and the protruding structure 126 can be tightly combined, the combination property and the thermal conductivity of the groove 112 and the protruding structure 126 after the pressing are good, and the mechanical strength is high.
By way of example, the heat transfer medium 127 is a fluid, preferably, the heat transfer medium 127 is a gas, a liquid, or a mixture of a gas and a liquid, and more preferably, in the present embodiment, the heat transfer medium 127 is a mixture of a liquid and a gas.
As an example, the material of the phase change suppressing heat transfer plate 12 should be a material excellent in thermal conductivity; preferably, in this embodiment, the material of the phase change suppressing heat transfer plate 12 may be copper, a copper alloy, aluminum, or an aluminum alloy, or any combination of any one or more of them. The material of the phase change suppressing heat transfer plate 12 may be the same as or different from the material of the heat sink base plate 11; preferably, in the present embodiment, the material of the phase change suppressing heat transfer plate 12 is the same as the material of the heat sink base plate 11.
As an example, a heat conductive adhesive 13 is filled between the phase change suppressing heat transfer plate 12 and the boss 111.
As an example, the heat sink base plate 11 and the phase change suppressing heat transfer plate 12 are fixed together by a press bonding process, a heat conductive adhesive bonding process, a friction stir welding process, a brazing welding process, a press and heat conductive adhesive bonding process, a press and friction stir welding bonding process, or a press and brazing welding bonding process. The phase change inhibiting heat transfer plate 12 and the radiator substrate 11 are connected through a seamless connection process such as a pressing process, a heat conducting glue bonding process, a friction stir welding process, a brazing welding process, a pressing and heat conducting glue bonding process, a pressing and friction stir welding bonding process or a pressing and brazing welding bonding process, so that the thermal resistance of connection between the two is greatly reduced.
As an example, the dimension of the heat sink base plate 11 in the length direction of the insertion side 128 of the phase change suppressing heat transfer plate 12 is smaller than or equal to the length of the insertion side 128 of the phase change suppressing heat transfer plate 12.
As an example, the region between the heat superconducting pipes 123 on the phase transition suppression heat transfer plate 12 is provided with a vent hole (not shown) to enhance heat dissipation.
As an example, the phase change suppression finned heat sink LED lamp further includes a side fixing plate 14, and the side fixing plate 14 is fixed to an outer surface of the phase change suppression heat transfer plate 12 located on the outermost side. That is, the side fixing plates 14 are located outside the phase change inhibiting heat transfer plates 12 arranged in parallel at intervals, and are fixed to the outer surfaces of the phase change inhibiting heat transfer plates 12 located on the outermost sides. The side fixing plates 14 function to protect the phase change suppressing heat transfer plates 12. The side fixing plates 14 are fixed to the outer sides of the phase change suppression heat transfer plates 12 arranged in parallel at intervals by means of fasteners 15.
As an example, the light emitting assembly 2 includes: the LED chip 21, the lens 22, the lens gland 23 and the reflector 24; the LED chip 21 is located on the surface of the heat sink substrate 11 away from the phase change suppression heat transfer plate 12; the lens 22, the lens gland 23 and the reflector 24 are sequentially overlapped on the periphery of the LED chip 21, that is, the LED chip 21 is fixed on the surface of the heat sink substrate 11, the lens 22 is buckled on the periphery of the LED chip 21, the lens gland 23 is pressed on the periphery of the lens 22, and the reflector 24 is fixed on the lens gland 23.
As an example, the power supply assembly 3 comprises: a power supply 31 and a power supply cover 32; the power supply 31 is located at one end of the phase change inhibiting heat transfer plate 12 away from the light emitting component 2, and the power supply cover plate 32 is pressed on the surface of the power supply 31.
As an example, the phase change suppression finned heat sink LED lamp further comprises a fixing device 4, and the fixing device 4 is located on the power cover plate 32. The fixing device 4 may be, but is not limited to, a fixing frame or a hook.
Example two
The invention also provides a phase change suppression finned radiator LED lamp, the structure of the phase change suppression finned radiator LED lamp in the embodiment is substantially the same as that of the phase change suppression finned radiator LED lamp in the first embodiment, and the difference between the two is as follows: in the first embodiment, a protrusion 111 is formed on the surface of the heat sink substrate 11 of the phase change suppression finned heat sink LED lamp, a groove 112 is formed in the protrusion 111, the groove 112 includes a first portion and a second portion located below the first portion and connected to the first portion, and a width of the groove first portion 1121 is greater than a width of the groove second portion 1122; one side of the phase change inhibiting heat transfer plate 12 is an insertion side, and the phase change inhibiting heat transfer plate 12 is inserted into the groove 112 through the insertion side; in this embodiment, the phase change suppression heat sink structure also includes: the heat radiator comprises a heat radiator substrate and a plurality of phase change suppression heat transfer plates inserted on the heat radiator substrate, wherein the specific structures and the mutual position connection relations of the heat radiator substrate and the phase change suppression heat transfer plates are the same as those of the heat radiator substrate and the heat superconducting heat radiating fins in the patent document with the publication number of CN205071563U, the heat radiator substrate in the embodiment is the heat radiator substrate in the patent document with the publication number of CN205071563U, and the phase change suppression heat transfer plates 12 in the embodiment are the heat superconducting heat radiating fins in the patent document with the publication number of CN 205071563U; for the specific structure and the position connection relationship, please refer to patent document with an authorization publication number of CN205071563U, which is not repeated herein.
EXAMPLE III
The invention also provides a phase change suppression finned radiator LED lamp, the structure of the phase change suppression finned radiator LED lamp in the embodiment is substantially the same as that of the phase change suppression finned radiator LED lamp in the first embodiment, and the difference between the two is as follows: in the first embodiment, a protrusion 111 is formed on the surface of the heat sink substrate 11 of the phase change suppression finned heat sink LED lamp, a groove 112 is formed in the protrusion 111, the groove 112 includes a first portion and a second portion located below the first portion and connected to the first portion, and a width of the groove first portion 1121 is greater than a width of the groove second portion 1122; one side of the phase change inhibiting heat transfer plate 12 is an insertion side, and the phase change inhibiting heat transfer plate 12 is inserted into the groove 112 through the insertion side; in this embodiment, the phase change suppression heat sink structure includes: a heat sink base plate and a plurality of phase change inhibiting heat transfer plates; the heat radiator substrate comprises a plurality of partition plates, the partition plates and the phase change inhibition heat transfer plates are alternately arranged, one end surfaces of the partition plates are flush with one end of each phase change inhibition heat transfer plate, and the partition plates and the phase change inhibition heat transfer plates jointly form a mounting surface of the light-emitting assembly; the partition plate is fixedly connected with the phase change suppression heat transfer plate. The specific structures and the mutual position connection relations of the partition plate and the phase change suppression heat transfer plate are the same as those of the partition plate and the heat superconducting heat dissipation fin in the patent document with the authorization publication number of CN205104482U, the partition plate in this embodiment is the partition plate in the patent document with the authorization publication number of CN205104482U, and the phase change suppression heat transfer plate 12 in this embodiment is the heat superconducting heat dissipation fin in the patent document with the authorization publication number of CN 205104482U; for the specific structure and the position connection relationship, please refer to patent document with an authorization publication number of CN205104482U, which is not repeated herein.
In summary, the present invention provides a phase change suppression finned heat sink LED lamp, including: a phase change inhibiting heat sink structure, a light emitting assembly and a power supply assembly; the light emitting assembly is positioned at one end of the phase change suppression heat sink structure; the power supply assembly is located at the other end of the phase change suppression heat sink structure, is connected with the light emitting assembly, and is suitable for supplying power to the light emitting assembly. The phase change suppression heat transfer plate is used as the heat dissipation fin, so that the heat conduction rate is high, the temperature uniformity is good, the heat dissipation capacity is improved, and the volume and the weight are reduced; the heat resistance between the phase change inhibition heat transfer plate and the radiator substrate is greatly reduced, and the heat radiation performance of the inserted radiator is improved; the phase change inhibiting heat transfer plate is connected with the LED fixing substrate through seamless connection processes such as friction stir welding, mechanical extrusion or heat conducting glue bonding, so that the connection thermal resistance is greatly reduced.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (21)
1. The phase change suppression finned radiator LED lamp is characterized by comprising: a phase change inhibiting heat sink structure, a light emitting assembly and a power supply assembly;
the light emitting assembly is positioned at one end of the phase change suppression heat sink structure;
the power supply assembly is located at the other end of the phase change suppression heat sink structure, is connected with the light emitting assembly, and is suitable for supplying power to the light emitting assembly.
2. The phase change suppression finned heat sink LED lamp of claim 1, wherein: the phase change suppression heat sink structure includes:
the heat radiator comprises a heat radiator substrate, wherein a boss is formed on the surface of the heat radiator substrate, a groove is formed in the boss, the groove comprises a first part and a second part which is positioned below the first part and connected with the first part, and the width of the first part of the groove is larger than that of the second part of the groove;
the phase change inhibiting heat transfer plate is inserted into the groove through the insertion edge; a heat superconducting pipeline with a specific shape is formed in the phase change inhibition heat transfer plate, the heat superconducting pipeline is a closed pipeline, and a heat transfer medium is filled in the heat superconducting pipeline;
the depth of the groove is larger than the distance between the insertion edge of the phase change inhibiting heat transfer plate and the heat superconducting pipeline which is most adjacent to the insertion edge.
3. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the length direction of the boss is consistent with that of the radiator substrate, and the length of the boss is smaller than or equal to that of the radiator substrate.
4. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the length direction of the groove is consistent with that of the boss, and the length of the groove is equal to that of the boss.
5. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the side walls of the grooves are perpendicular to the surface of the heat sink substrate.
6. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the lug boss and the radiator substrate are of an integrated structure.
7. The phase change fin-suppressing heat sink LED lamp of claim 2, wherein: the trench second portion extends into the heat spreader substrate interior.
8. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the number of the bosses and the number of the phase change inhibiting heat transfer plates are both multiple, and the bosses and the phase change inhibiting heat transfer plates are distributed on the radiator base plate in parallel at intervals or in radial distribution.
9. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the phase change inhibiting heat transfer plate is of a composite plate type structure, and is in a single-side expansion shape, a double-side expansion shape or a double-side flat shape.
10. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the shape of the heat superconducting pipeline is hexagonal honeycomb, criss-cross net shape, a plurality of U-shapes connected in series end to end, rhombus, triangle, circular ring shape or any combination of more than one of the above.
11. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the edge of the phase change inhibiting heat transfer plate is a non-pipe portion which is inserted into the groove second portion; the heat superconducting pipeline is positioned in the first part of the groove and comprises a first straight-edge sub pipeline and a second straight-edge sub pipeline, the length direction of the first straight-edge sub pipeline is consistent with that of the insertion edge of the phase change inhibition heat transfer plate, and the second straight-edge sub pipeline is vertically connected with the first straight-edge sub pipeline.
12. The phase change suppression finned heat sink LED lamp of claim 2, wherein: and heat conducting glue is filled between the phase change inhibition heat transfer plate and the boss.
13. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the heat radiator substrate and the phase change suppression heat transfer plate are fixed together through a pressing process, a heat conducting glue bonding process, a friction stir welding process, a brazing welding process, a pressing and heat conducting glue bonding process, a pressing and friction stir welding bonding process or a pressing and brazing welding bonding process.
14. The phase change suppression finned heat sink LED lamp of claim 2, wherein: the dimension of the heat sink substrate along the length direction of the insertion edge of the phase change inhibiting heat transfer plate is smaller than or equal to the length of the insertion edge of the phase change inhibiting heat transfer plate.
15. The phase change suppression finned heat sink LED lamp of claim 2, wherein: and vent holes are formed in the areas between the heat superconducting pipelines on the phase change inhibition heat transfer plates.
16. The phase change suppression finned heat sink LED lamp of claim 1, wherein: the phase change suppression heat sink structure includes: the heat sink comprises a heat sink substrate and a plurality of phase change suppression heat transfer plates inserted on the heat sink substrate.
17. The phase change suppression finned heat sink LED lamp of claim 1, wherein: the phase change suppression heat sink structure includes: a heat sink base plate and a plurality of phase change inhibiting heat transfer plates; wherein,
the heat radiator base plate comprises a plurality of partition plates, the partition plates and the phase change inhibition heat transfer plates are alternately arranged, one end surfaces of the partition plates are flush with one end of each phase change inhibition heat transfer plate, and the partition plates and the end surfaces of the phase change inhibition heat transfer plates form a mounting surface of the light-emitting assembly together;
the partition plate is fixedly connected with the phase change suppression heat transfer plate.
18. The phase change suppression finned heat sink LED lamp of any one of claims 2 to 16, wherein: the phase change suppression heat transfer plate comprises a heat transfer plate body and a side fixing plate, wherein the side fixing plate body is fixed on the outer surface of the phase change suppression heat transfer plate body located on the outermost side.
19. The phase change suppression finned heat sink LED lamp of any one of claims 2 to 16, wherein: the light emitting assembly includes: the LED light source comprises an LED chip, a lens gland and a reflecting cover;
the LED chip is positioned on the surface of the heat radiator substrate away from the phase change inhibition heat transfer plate;
the lens, the lens gland and the reflector are sequentially overlapped at the periphery of the LED chip.
20. The phase change suppression finned heat sink LED lamp of any one of claims 2 to 16, wherein: the power supply assembly includes: a power supply and a power supply cover plate;
the power supply is positioned at one end of the phase change inhibiting heat transfer plate, which is far away from the light-emitting component, and the power supply cover plate is pressed on the surface of the power supply.
21. The phase change suppression finned heat sink LED lamp of claim 19, wherein: still include fixing device, fixing device is located on the power apron.
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