CN105882038A - Workpiece, preparing method thereof and electronic device comprising workpiece - Google Patents
Workpiece, preparing method thereof and electronic device comprising workpiece Download PDFInfo
- Publication number
- CN105882038A CN105882038A CN201610202160.3A CN201610202160A CN105882038A CN 105882038 A CN105882038 A CN 105882038A CN 201610202160 A CN201610202160 A CN 201610202160A CN 105882038 A CN105882038 A CN 105882038A
- Authority
- CN
- China
- Prior art keywords
- layer
- surface layer
- workpiece
- prepreg tape
- laminboard
- Prior art date
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- Pending
Links
- 238000000034 method Methods 0.000 title abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 91
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 98
- 239000002344 surface layer Substances 0.000 claims description 93
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 35
- 239000004917 carbon fiber Substances 0.000 claims description 35
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 35
- 239000006260 foam Substances 0.000 claims description 19
- 238000002360 preparation method Methods 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 10
- 229920003023 plastic Polymers 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000002386 leaching Methods 0.000 claims description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 9
- 238000007731 hot pressing Methods 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 229920007790 polymethacrylimide foam Polymers 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 229920002545 silicone oil Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 2
- 229910001051 Magnalium Inorganic materials 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- 238000005087 graphitization Methods 0.000 description 2
- 239000004761 kevlar Substances 0.000 description 2
- 239000013081 microcrystal Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000012783 reinforcing fiber Substances 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920007019 PC/ABS Polymers 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/05—5 or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/02—Organic
- B32B2266/0214—Materials belonging to B32B27/00
- B32B2266/0257—Polyamide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a workpiece. The workpiece comprises a first face layer, a sandwich layer arranged below the first face layer and a second face layer arranged below the sandwich layer. The first face layer and the second face layer are formed by at least two presoaking belts respectively, and the presoaking belts are formed in the mode that first materials presoaked with thermosetting resin are dried; the sandwich layer is formed by second materials comprising a plurality of micro holes. The workpiece is light in weight, thin in thickness and good in mechanical performance. The invention further provides a preparing method for the workpiece and an electronic device comprising the workpiece.
Description
The application is filing date on February 20th, 2012, Application No. 201210040442.X,
Invention and created name is " a kind of workpiece and preparation method thereof and a kind of electricity including described workpiece
Subset " divisional application.
Technical field
The present invention relates to composite and preparation field thereof, be specifically related to a kind of workpiece and preparation thereof
Method and a kind of electronic equipment including described workpiece.
Background technology
At present, market is to the lightening needs of the mancarried electronic aids such as notebook computer increasingly
Height, therefore the design for mancarried electronic aid shells such as notebooks it is also proposed higher requirement.
It is known that material is the thinnest, shearing force, pulling force and the pressure that can bear are the least.In order to make
The shell of the mobile terminals such as notebook is the most frivolous, has again good mechanical performance, as resistance to compression,
Tensile property, it is necessary to using hot strength and the higher material of bending strength, such as, carbon is fine
Dimension, glass fibre etc..
Carbon fiber is the micro crystal graphite material that organic fiber obtains through carbonization and graphitization processing,
It not only has the intrinsic intrinsic property of material with carbon element, has again the flexibility of textile fabric concurrently and can process
Property, it is a new generation's reinforcing fiber.Compared with traditional glass fibre (GF), the Young of carbon fiber
Modulus is that they are more than 3 times.Compared with kevlar fiber (KF-49), carbon fiber not only Young's modulus
It is its about 2 times, and insoluble the most swollen in organic solvent, acid, alkali, corrosion-resistant.Just
Due to the plurality of advantages of carbon fiber, its be widely used in automobile, electronics, weaving, military project,
The fields such as sports equipment.
The sheathing material of the mobile electronic devices such as the most conventional notebook computer mainly has following
Several: 1) PC/ABS+15% Pulvis Talci formula plastics: density 1.3g/cm3, minimum can be realized
Thickness 1.8mm；2) nylon+50% glass fiber formula plastics: density 1.7g/cm3, can be real
Existing minimum thickness 1.3mm；3) magnalium, aluminium alloy: density 2.4g/cm3, can realize
Minimum thickness 0.8mm；4) titanium alloy: density 4.5g/cm3, minimum thickness 0.5mm can be realized；
5) carbon fibre composite (disregarding plastic cement dijection frame portion): density 1.65g/cm3, can be real
Existing minimum thickness 0.6mm.In above-mentioned 5 kinds of materials, outer casing thickness prepared by front 4 kinds of materials is more
Come the thinnest, but density is the most increasing, add the weight of shell, it is impossible to both met shell
The thinnest light requirement.And although the 5th kind of carbon fibre material disclosure satisfy that lightweight and thin the wanting of shell
Ask, but density is the biggest, and carbon fibre material is more expensive, adds being processed into of shell
This.
Summary of the invention
The technical problem to be solved in the present invention is to provide one lightweight and thinner thickness has
Workpiece of good mechanical properties and preparation method thereof, and a kind of electronics using described workpiece sets
Standby.
In order to solve above technical problem, the invention provides a kind of workpiece, including:
First surface layer；
Laminboard layer, is arranged on below described first surface layer；
Second surface layer, is arranged on below described laminboard layer；
Wherein, described first surface layer and described second surface layer are band-shaped by the preimpregnation of at least two-layer respectively
Become；Described prepreg tape is dried by the first material being soaked with thermosetting resin in advance and is formed；Described sandwich
Layer is formed by second material with some micropores.
Preferably, the rigidity of described first material is more than the rigidity of described second material.
Preferably, the micropore in described second material is Guan Bi micropore.
Preferably, described first material is carbon fiber, and described second material is foam plastics
Present invention also offers a kind of workpiece, including:
First surface layer；
Laminboard layer, is arranged on below described first surface layer；
Second surface layer, is arranged on below described laminboard layer；
Wherein, described first surface layer and described second surface layer are band-shaped by the preimpregnation of at least two-layer respectively
Become；Described prepreg tape is dried by the first material being soaked with thermosetting resin in advance and is formed；Described sandwich
Layer is formed by second material with some micropores；
The density of described workpiece is less than or equal to 1g/cm3。
Present invention also offers the preparation method of a kind of workpiece, including:
A) take at least two-layer prepreg tape to stack and form the first prefabricated component in a mold；Described prepreg tape
It is dried by the first material being soaked with thermosetting resin in advance and is formed；
B) sheet material that the second material is formed is placed in described first preform surfaces, obtains second
Prefabricated component；
C) at least two-layer prepreg tape is overlayed described second preform surfaces, obtain the 3rd prefabricated
Part；
D) Guan Bi mould, by hot-forming for described 3rd prefabricated component；Described second material is formed
Sheet material formed laminboard layer；It is positioned at least two-layer prepreg tape below laminboard layer and forms the first surface layer；
It is positioned at least two-layer prepreg tape above described laminboard layer and forms the second surface layer.
Preferably, step a) particularly as follows:
Take at least two-layer prepreg tape to stack and form the first prefabricated component in a mold；Described adjacent two pre-
In leaching band, fibrous first material is arranged vertically.
Preferably, described first material is fiber；Described second material is foam plastics.
Present invention also offers a kind of electronic equipment, including:
Electronic devices and components；
Housing, described electronic devices and components are fixedly installed in described housing；Described housing includes:
First surface layer；
Laminboard layer, is arranged on below described first surface layer；
Second surface layer, is arranged on below described laminboard layer；
Wherein, described first surface layer and described second surface layer are band-shaped by the preimpregnation of at least two-layer respectively
Become；Described prepreg tape is dried by the first material being soaked with thermosetting resin in advance and is formed；Described sandwich
Layer is formed by second material with some micropores.
Preferably, described first material is fiber；Described second material is foam plastics.
The invention provides a kind of workpiece, including two surface layers and a laminboard layer, wherein said surface layer
Being made up of prepreg tape, described prepreg tape is dried by the first material being soaked with thermosetting resin in advance and is formed,
Described laminboard layer is made up of second material with micropore.The workpiece provided due to the present invention is folder
Cored structure, the prepreg tape formed after the first material preimpregnation thermosetting resin has high intensity, so
First surface layer and the second surface layer bear pressure and the pulling force that the external world bestows, and laminboard layer is by the second material
Composition, described second material includes a large amount of micropore, it is possible to reduces the density of one-piece machine member, subtracts
The weight of light whole material.And microcellular structure also is able to improve tension and the anti-pressure ability of material,
And be experimentally confirmed, the thickness of workpiece that the present invention provides is 0.70～1mm, so the present invention
The workpiece light weight of offer, thinner thickness, and there is good mechanical performance.
Present invention also offers the preparation method of a kind of workpiece, a) take at least two-layer prepreg tape and stack
Form the first prefabricated component in a mold；Described prepreg tape is by the first material being soaked with thermosetting resin in advance
Material is dried and is formed；B) sheet material that the second material is formed is placed in described first preform surfaces,
To the second prefabricated component；C) at least two-layer prepreg tape is overlayed described second preform surfaces,
To the 3rd prefabricated component；D) Guan Bi mould, by hot-forming for described 3rd prefabricated component；Described second
The sheet material that material is formed forms laminboard layer；It is positioned at least two-layer prepreg tape below laminboard layer to be formed
First surface layer；It is positioned at least two-layer prepreg tape above described laminboard layer and forms the second surface layer.This
The preparation method that invention provides uses hot pressing to send out, by workpiece one-shot forming, it is not necessary to use other
Step, process control is easy, is suitable for large-scale industrial production.
Accompanying drawing explanation
Fig. 1 object is by force analysis schematic diagram during external force；
The cross sectional representation of the workpiece that Fig. 2 embodiment of the present invention provides；
The cross sectional representation of the workpiece that Fig. 3 embodiment of the present invention provides.
Detailed description of the invention
In order to further appreciate that the present invention, below in conjunction with embodiment to the present invention side of being preferable to carry out
Case is described, but it is to be understood that these describe is simply the spy further illustrating the present invention
Advantage of seeking peace rather than the restriction to patent requirements of the present invention.
It is an object of the invention to provide a kind of lightweight, thinner thickness and there is preferable mechanical performance
Workpiece.Described workpiece includes:
First surface layer；
Laminboard layer, is arranged on below described first surface layer；
Second surface layer, is arranged on below described laminboard layer；
Wherein, described first surface layer and described second surface layer are band-shaped by the preimpregnation of at least two-layer respectively
Become；Described prepreg tape is dried by the first material being soaked with thermosetting resin in advance and is formed；Described sandwich
Layer is formed by second material with some micropores.
It is known that when object is by ambient pressure, the stress side at each position of described object
To as it is shown in figure 1, under the effect of pressure 1, the upper surface of described object is by inside pressure
Contracting power 2, lower surface by direction by the outside tensile force 3 of normal direction, and along normal direction
The shearing force 4 being subject to.And the deformation that compression stress 2 causes is by the stretch modulus (springform of object
Amount) to weigh, the deformation that tensile force 3 causes is weighed by the flexible modulus (bending modulus) of object.
Described stretch modulus refers to that, when putting on object or material effectively, its elastic deformation is (impermanent
Deformation) mathematical description of trend.The elastic modelling quantity of object be defined as the stress of elastic deformation area-
The slope of strain curve:
Wherein λ is elastic modelling quantity, and stress (stress) is the power causing force area to deform, strain
(strain) is the change that causes of stress and the ratio of object initial condition.Answering unit of force is Paasche
Card, strain is not have unit (nondimensional), then the unit of λ is also Pascal.
When bending modulus refers to put on effectively object or material, its flexural deformation (impermanent change
Shape) mathematical description of trend, the bending modulus of object is defined as the stress-strain of bending deformation area
Slope of a curve:
Wherein E is bending modulus, does deflection test, if w and h is on a simply supported beam
The width of beam and length, then L is the thickness of beam both sides, and F is applied force, and d is owing to F makees
With and the deformation that occurs.The force-bearing situation of material is can be obtained by by above-mentioned two relational expression,
And mechanical performance.
The workpiece that the present invention provides also uses above-mentioned stress rule.The workpiece provided due to the present invention
For sandwich structure, so when being under pressure effect, the main power effect by compression of the first surface layer,
The main Tensile power effect of second surface layer, and laminboard layer mainly receives the shearing force along normal direction
Effect, decomposes pressure, by pressure described in 3 layers of different structure release, improves workpiece
Mechanical performance.
The structure that only can discharge pressure can not meet the workpiece requirement to mechanical performance, also
Must start with from material itself.According to the present invention, described first surface layer and the second surface layer respectively by
At least two-layer prepreg tape is made, and described prepreg tape is by the first material of preimpregnation thermosetting resin
Obtain after drying.According to the present invention, described first material preferably has stronger tension and resists
The material of Compressive Strength, more preferably fibrous material or resin material, most preferably carbon fiber.Carbon
Fiber is the micro crystal graphite material that organic fiber obtains through carbonization and graphitization processing, and it is not only
There is the intrinsic intrinsic property of material with carbon element, have again flexibility and the machinability of textile fabric concurrently, be
A new generation's reinforcing fiber.Compared with traditional glass fibre (GF), the Young's modulus of carbon fiber is
They are more than 3 times.Compared with kevlar fiber (KF-49), carbon fiber not only Young's modulus be its 2
About times, and insoluble the most swollen in organic solvent, acid, alkali, corrosion-resistant.Described carbon is fine
After dimension preimpregnation thermosetting resin, arrange according to a certain direction, obtain prepreg tape after drying.
The size specification present invention of described prepreg tape does not limits.Then described prepreg tape is stacked.Press
According to the present invention, described certain orientation is the most arranged in parallel, due to the first surface layer and
Respectively at least by two prepreg tapes in two surface layers, it is proposed, according to the invention, in described adjacent two prepreg tapes
The orientation of carbon fiber is the most orthogonal, and the carbon fiber in described first surface layer and
Carbon fiber in two surface layers is 60 °～120 ° arrangements.The purpose of do so is to make carbon fiber shape
Reticulate structure, increase the first surface layer and the intensity of the second surface layer.This law is bright can also gone up most
Cover woven cloth on side's carbon fiber, described first surface layer or the second surface layer can be made to have woven cloth
Effect.According to the present invention, described carbon fiber is preferably used Mitsubishi TR 50S 12L (24T)
Or HR 40 12M (40T).Described thermosetting resin is preferably epoxy resin.
According to the present invention, described second material is preferably the foam plastics containing some micropores, and
Described micropore is preferably closed pore.It is preferably polrvinyl chloride (PVC), polystyrene (PS), gathers
Urethane (PUR), acrylonitrile-styrene (SAN), Polyetherimide (PEI) and poly-methyl
The foams such as acrylimide (PMI), wherein PS and PUR foam are generally only used as buoyancy material
Material rather than structural applications.PVC foam replaces PUR foam to make the most completely at present
For structural core.Most preferably Polymethacrylimide (PMI).Polymethyl acyl is sub-
Amine (PMI) foam plastics is the rigid foam of a kind of lightweight, closed pore.Have good
Mechanical property, heat distortion temperature and chemical stability.According to the present invention, described PMI preferably makes
With Evonik IG Series P MI foam, thickness 1mm.Foam cutting area is flat with the design of A face
Face area.
According to the present invention, described workpiece is made up of above two material, and with the first surface layer and
As a example by two surface layers are prepared by two-layer prepreg tape respectively, the gross thickness of the first surface layer and the second surface layer is
0.5mm～0.6mm, and laminboard layer thickness is 0.2～0.4mm.So the gross thickness of workpiece is
0.70～1mm.And owing to the addition of PMI, reduce the global density of workpiece, alleviate weight.
According to the present invention, the density of described workpiece is less than or equal to 1g/cm3.More preferably 0.8～1g/cm3,
So the workpiece that the present invention provides can swim in the water surface, it is seen that its weight can meet the present invention
Purpose.The cross sectional representation of the workpiece that Fig. 2 provides for the present invention, its pressurized situation issues
Raw flexural deformation, including the first surface layer S3, laminboard layer S2 and the second surface layer S1.
Present invention also offers the workpiece that the preparation method of a kind of workpiece, the preferably present invention provide
Preparation method: including:
A) take at least two-layer prepreg tape to stack and form the first prefabricated component in a mold；Described prepreg tape
It is dried by the first material being soaked with thermosetting resin in advance and is formed；
B) sheet material that the second material is formed is placed in described first preform surfaces, obtains second
Prefabricated component；
C) at least two-layer prepreg tape is overlayed described second preform surfaces, obtain the 3rd prefabricated
Part；
D) Guan Bi mould, by hot-forming for described 3rd prefabricated component；Described second material is formed
Sheet material forms laminboard layer；It is positioned at least two-layer prepreg tape below laminboard layer and forms the first surface layer；
It is positioned at least two-layer prepreg tape above described laminboard layer and forms the second surface layer.
According to the present invention, take at least two-layer prepreg tape and stack and form the first prefabricated component in a mold；
In described adjacent two prepreg tapes, fibrous first material is arranged vertically.
When preparing described workpiece as a example by carbon fiber and PMI: described carbon fiber is as those skilled in the art
Known to the carbon fiber prepared of method, after preferred for carbon fiber preimpregnation thermosetting resin arranged in parallel
It is dried, obtains described prepreg tape.So the carbon fiber in described prepreg tape is unidirectional, and it is
Increase intensity, so the direction of carbon fiber is orthogonal in adjacent two prepreg tapes.The present invention adopts
Once make workpiece one-shot forming by pressure sintering, the upper and lower mould of the mould that hot pressing uses is pre-coated with
Releasing agent, described releasing agent is preferably silicone oil release agent.Then by described mould at 100 DEG C
～preheat 5 minutes at 150 DEG C.Described first prefabricated component is placed in described mould, if described
Workpiece is by shirt rim, and that needs to stop prepreg tape in the position of shirt rim so that molding.
The sheet material that second material is formed is placed in described first preform surfaces, obtains second prefabricated
Part；Described second material is preferably material thickness 1mm described in PMI.Can on PMI following table
Face application of adhesive.Described binding agent is epoxy adhesive.
Being placed on PMI foam by the most at least two-layer prepreg tape, concrete technology such as first is prefabricated
Shown in the preparation method of part.Obtain the 3rd prefabricated component.
Matched moulds is also stepped up mould temperature, hot pressing the 3rd prefabricated component.Dies cavity is highly preferred is
0.75-1mm.After mould temperature arrives 220～270 DEG C, heat-insulation pressure keeping 15～30min is (according to design
Situation is fixed).Thermosetting resin solidifies subsequently in mould.PMI forms sandwich structure, surrounding skirt
While be laminated by four layers of carbon fiber prepregs.Can not mistake according to the pressure of hot press operation of the present invention
Greatly, can not be too small, preferred described hot pressing pressure is 0～25kgf/cm2, because PMI is
Closed pore rigid foam, if pressure is excessive during hot pressing, can rack the micropore in PMI,
Add the density of PMI and one-piece machine member, it is impossible to reduce density and alleviate the mesh of quality
's.Reduce the performance of workpiece.
According to the present invention, PMI foam can necessarily be compressed, with four layers of carbon by pressure maintaining period
One-way fiber band altogether 0.5mm calculates, and is 0.7～1mm such as integral thickness after compression, then PMI
During depth of foam 0.2～0.5mm, the density of described workpiece is less than or equal to 1g/cm3.More preferably
0.8～1g/cm3。
It is multiple structure owing to the present invention is to provide workpiece, the material the most not phase that each layer uses
The most different with force-bearing types, when processing thermoforming, different materials has different linear heat
The coefficient of expansion, thermal coefficient of expansion is the biggest, and its deformation at high temperature is the fastest.In the present invention by
Second material with some micropores is employed in sandwich of layers, so the linear heat of described sandwich of layers
The coefficient of expansion is bigger than the first material in the first surface layer and the second surface layer and resin combination, for
Make composite in the course of processing, sandwich of layers thermal expansion is too fast and crimp, rupture,
Flange, it is necessary to use the resin combination matched with its thermal linear expansion coefficient.According to this
Bright, described resin combination is preferably epoxy resin, more preferably bisphenol A type epoxy resin.
According to the present invention, the thermal linear expansion coefficient of described sandwich of layers is much larger than described first surface layer
With the thermal linear expansion coefficient of the second surface layer such as carbon fiber, it is carbon fiber at a temperature of 200 DEG C
Thermal linear expansion coefficient is 0 × 10-6/ K, is negative (-0.5～-1.6) × 10 during room temperature-6/K.It is used for pre-
Leaching carbon fiber resin combination, as epoxy resin thermal linear expansion coefficient according to component not
Very big with diversity, need the linear heat by adjusting resin composition formula and component and surface layer
Matched expansion coefficient.According to the present invention, the thermal linear expansion coefficient of described resin combination is excellent
Elect 20～50 × 10 as-6/ K, uses the resinous polymer with this thermal linear expansion coefficient, it is possible to
Ensure to presoak the first surface layer that the first material after described resinous polymer formed and the second surface layer with
Have between the sandwich that the second material is formed and there is the excessive of thermal linear expansion coefficient so that in heat
During processing and forming, resin combination can regulate the swollen of sandwich of layers and the first surface layer and the second surface layer
Swollen speed, makes laminboard layer speed of expansion slow down.If mould has chamfering, in forming process
Described first surface layer and the second surface layer and described laminboard layer are according to the position of the chamfering in mould and angle
Degree molding, the most described first surface layer and the second surface layer are according to the first shape of shape molding in mould
Consistent according to the second shape of shape molding in mould with described surface layer, obtain that there is definite shape
Workpiece, and the problem such as described workpiece does not crimps at chamfering, flange or fracture.It addition,
The rigidity of the most described first surface layer and the second surface layer, more than the rigidity of described sandwich of layers, makes
Described second surface layer and the second surface layer can preferably play and support and the effect of protection.
Present invention also offers a kind of electronic equipment, including:
Electronic devices and components；
Housing, described electronic devices and components are fixedly installed in described housing；Described housing includes:
First surface layer；
Laminboard layer, is arranged on below described first surface layer；
Second surface layer, is arranged on below described laminboard layer；
Wherein, described first surface layer and described second surface layer are formed by least two-layer prepreg tape respectively；
Described prepreg tape is dried by the first material being soaked with thermosetting resin in advance and is formed；Described laminboard layer by
Second material with some micropores is formed.
According to the present invention, the housing of described electronic equipment is prepared by described workpiece, and the first surface layer
The prepreg tape being preferably the formation of carbon fibre initial rinse epoxy resin is made, and laminboard layer is preferably steeped by PMI
Prepared by foam.According to the present invention, described electronic equipment can be notebook computer, it is also possible to be flat
Plate computer, mobile phone or other mobile terminals.
Being below the embodiment of the present invention, the precursor that wherein said carbon fiber uses is: Mitsubishi
TR 50S 12L (24T) or HR 40 12M (40T).Sandwich materials chooses Evonik IG
Series P MI foam, thickness 1mm.Foam cutting area is with A face design plane area.
Embodiment 1
After Mitsubishi TR 50S 12L (24T) pre-epoxy resin dipping, form unidirectional preimpregnation
Band, is placed in unidirectional prepreg tape described in two-layer in mould and obtains the first prefabricated component.In advance described
Mould coats aqueous dimethylformamide silicone oil, and at 100 DEG C, has preheated 5 minutes.It is 1mm by thickness
Described Evonik IG PMI foam be placed on described first prefabricated component, obtain the second prefabricated component,
Take unidirectional prepreg tape described in two-layer the most again and be placed in described second preform surfaces, obtain the 3rd pre-
Product.3rd prefabricated component described in matched moulds hot pressing, is gradually heating to 250 DEG C, and pressure is 0kgf/cm2,
Heat-insulation pressure keeping 15min, the demoulding obtains notebook computer shell as shown in Figure 3.Including the second surface layer S1,
Sandwich of layers S2, the first surface layer S3.Position, wherein said shirt rim is made up of 4 layers of prepreg tape.
Through detection, notebook computer shell center thickness D prepared by the present embodiment is 0.75mm,
Position, shirt rim thickness d is 0.5mm.Density is 1g/cm3。
Embodiment 2
After Mitsubishi HR 40 12M (40T) pre-epoxy resin dipping, form unidirectional preimpregnation
Band, is placed in unidirectional prepreg tape described in two-layer in mould and obtains the first prefabricated component.In advance described
Mould coats aqueous dimethylformamide silicone oil, and at 120 DEG C, has preheated 5 minutes.It is 1mm by thickness
Described Evonik IG PMI foam be placed on described first prefabricated component, obtain the second prefabricated component,
Take unidirectional prepreg tape described in two-layer the most again and be placed in described second preform surfaces, obtain the 3rd pre-
Product.3rd prefabricated component described in matched moulds hot pressing, is gradually heating to 250 DEG C, and pressure is 25
kgf/cm2, heat-insulation pressure keeping 30min, the demoulding obtains notebook computer shell.
Through detection, notebook computer shell center thickness prepared by the present embodiment is 0.75mm, skirt
Position, limit thickness is 0.5mm.Density is 1g/cm3。
Embodiment 3
After Mitsubishi HR 40 12M (40T) pre-epoxy resin dipping, form unidirectional preimpregnation
Band, is placed in unidirectional prepreg tape described in two-layer in mould and obtains the first prefabricated component.In advance described
Mould coats aqueous dimethylformamide silicone oil, and at 120 DEG C, has preheated 5 minutes.It is 1mm by thickness
Described Evonik IG PMI foam be placed on described first prefabricated component, obtain the second prefabricated component,
Take unidirectional prepreg tape described in two-layer the most again and be placed in described second preform surfaces, obtain the 3rd pre-
Product.3rd prefabricated component described in matched moulds hot pressing, is gradually heating to 250 DEG C, and pressure is 10
kgf/cm2, heat-insulation pressure keeping 15min, the demoulding obtains notebook computer shell.
Through detection, notebook computer shell center thickness prepared by the present embodiment is 0.85mm, skirt
Position, limit thickness is 0.5mm.Density is 0.95g/cm3。
Embodiment 4
After Mitsubishi HR 40 12M (40T) pre-epoxy resin dipping, form unidirectional preimpregnation
Band, is placed in unidirectional prepreg tape described in two-layer in mould and obtains the first prefabricated component.In advance described
Mould coats aqueous dimethylformamide silicone oil, and at 120 DEG C, has preheated 5 minutes.It is 1mm by thickness
Described Evonik IG PMI foam be placed on described first prefabricated component, obtain the second prefabricated component,
Take unidirectional prepreg tape described in two-layer the most again and be placed in described second preform surfaces, obtain the 3rd pre-
Product.3rd prefabricated component described in matched moulds hot pressing, is gradually heating to 250 DEG C, and pressure is 15
kgf/cm2, heat-insulation pressure keeping 15min, the demoulding obtains notebook computer shell.
Through detection, notebook computer shell center thickness prepared by the present embodiment is 1mm, position, shirt rim
Putting thickness is 0.5mm.Density is 1g/cm3。
Comparative example 1
Carbon fiber prepregs is all used to prepare notebook computer shell, preparation method such as embodiment 1 institute
Showing, the notebook computer shell density obtained after preparation is 1.6g/cm3。
Comparative example 2
Being tested by computer simulation, stack pile, with the mg-al alloy parts of rigidity, density is
2.4g/cm3。
By embodiment 1～4 and comparative example 1 and the contrast of comparative example 2, the present invention provides workpiece
Density reduces, and weight ratio reduces by 58% with the magnalium of rigidity stack pile.
Above a kind of workpiece that the present invention provides and preparation method thereof and one are included described
The electronic equipment of workpiece is described in detail, and specific case used herein is to the present invention
Principle and embodiment be set forth, the explanation of above example be only intended to help understand
The method of the present invention and core concept thereof, it is noted that for the ordinary skill of the art
For personnel, under the premise without departing from the principles of the invention, it is also possible to the present invention is carried out some
Improving and modify, these improve and modify in the protection domain also falling into the claims in the present invention.
Claims (12)
1. a workpiece, it is characterised in that including:
First surface layer；
Laminboard layer, is arranged on below described first surface layer；
Second surface layer, is arranged on below described laminboard layer；
Wherein, described first surface layer and described second surface layer are band-shaped by the preimpregnation of at least two-layer respectively
Become, and described at least two-layer prepreg tape stacks；Described prepreg tape is by being soaked with thermosetting resin in advance
Carbon fiber is dried formation；Described laminboard layer is formed by second material with some micropores.
Workpiece the most according to claim 1, it is characterised in that carbon in described prepreg tape
The orientation of fiber is arranged in parallel.
Workpiece the most according to claim 1, it is characterised in that in adjacent two prepreg tapes
The orientation of carbon fiber is mutually perpendicular to.
Workpiece the most according to claim 1, it is characterised in that in described first surface layer
Carbon fiber and the second surface layer in carbon fiber be 60 °～120 ° arrangements.
Workpiece the most according to claim 1, it is characterised in that described carbon fiber firm
Degree is more than the rigidity of described second material.
Workpiece the most according to claim 1, it is characterised in that in described second material
Micropore for Guan Bi micropore.
Workpiece the most according to claim 1, it is characterised in that described second material is
Foam plastics.
8. a workpiece, it is characterised in that including:
First surface layer；
Laminboard layer, is arranged on below described first surface layer；
Second surface layer, is arranged on below described laminboard layer；
Wherein, described first surface layer and described second surface layer are band-shaped by the preimpregnation of at least two-layer respectively
Become, and described at least two-layer prepreg tape stacks；Described prepreg tape is by being soaked with thermosetting resin in advance
Carbon fiber is dried formation；Described laminboard layer is formed by second material with some micropores；
The density of described workpiece is less than or equal to 1g/cm3。
9. a preparation method for the workpiece described in any one of claim 1～8, its feature exists
In, including:
A) take at least two-layer prepreg tape to stack and form the first prefabricated component in a mold；Described prepreg tape
It is dried by the carbon fiber being soaked with thermosetting resin in advance and is formed；
B) sheet material that the second material is formed is placed in described first preform surfaces, obtains second
Prefabricated component；
C) at least two-layer prepreg tape is overlayed described second preform surfaces, obtain the 3rd prefabricated
Part；
D) Guan Bi mould, by hot-forming for described 3rd prefabricated component；Described second material is formed
Sheet material formed laminboard layer；It is positioned at least two-layer prepreg tape below laminboard layer and forms the first surface layer；
It is positioned at least two-layer prepreg tape above described laminboard layer and forms the second surface layer.
Preparation method the most according to claim 9, it is characterised in that step a) has
Body is:
Take at least two-layer prepreg tape to stack and form the first prefabricated component in a mold；Described adjacent two pre-
In leaching band, fibrous first material is arranged vertically.
11. 1 kinds of electronic equipments, it is characterised in that including:
Electronic devices and components；
Housing, described electronic devices and components are fixedly installed in described housing；Described housing includes:
First surface layer；
Laminboard layer, is arranged on below described first surface layer；
Second surface layer, is arranged on below described laminboard layer；
Wherein, described first surface layer and described second surface layer are band-shaped by the preimpregnation of at least two-layer respectively
Become, and described at least two-layer prepreg tape stacks；Described prepreg tape is by being soaked with thermosetting resin in advance
Carbon fiber is dried formation；Described laminboard layer is formed by second material with some micropores.
12. electronic equipments according to claim 11, it is characterised in that described second material
Material is foam plastics.
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| CN201610202160.3A CN105882038A (en) | 2012-02-20 | 2012-02-20 | Workpiece, preparing method thereof and electronic device comprising workpiece |
| CN201210040442.XA CN103252946B (en) | 2012-02-20 | 2012-02-20 | A kind of workpiece and preparation method thereof and a kind of electronic equipment including described workpiece |
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| CN201210040442.XA Active CN103252946B (en) | 2012-02-20 | 2012-02-20 | A kind of workpiece and preparation method thereof and a kind of electronic equipment including described workpiece |
| CN201610202156.7A Pending CN105856661A (en) | 2012-02-20 | 2012-02-20 | Workpiece, preparation method thereof and electronic equipment containing the workpiece |
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| CN104708865A (en) * | 2015-03-13 | 2015-06-17 | 东莞市驰悦电子科技有限公司 | Light-weight plate |
| EP3698952B1 (en) | 2015-07-08 | 2022-06-01 | Mitsubishi Chemical Corporation | Method for manufacturing fiber-reinforced composite material |
| CN106183135A (en) * | 2016-07-06 | 2016-12-07 | 江苏澳盛复合材料科技有限公司 | A kind of carbon fiber plate |
| CN108312681A (en) * | 2018-01-25 | 2018-07-24 | 五行科技股份有限公司 | A kind of fire-retardant recyclable carbon fiber sandwich boards and preparation method thereof of high-strength light |
| CN109348031B (en) * | 2018-11-14 | 2020-06-26 | 华侨大学 | Mobile phone shell mechanism |
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| CN101010188A (en) * | 2004-09-07 | 2007-08-01 | 东丽株式会社 | Sandwich structure and integrated formed article using the same |
| US20090120567A1 (en) * | 2004-05-10 | 2009-05-14 | Honda Motor Co., Ltd. | Molded laminate and manufacturing method thereof |
| JP2010147377A (en) * | 2008-12-22 | 2010-07-01 | Fujitsu Ltd | Housing, and method of manufacturing the same |
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| ES2527168T3 (en) * | 2002-07-18 | 2015-01-21 | Mitsubishi Rayon Co., Ltd. | Prepreg and procedures for the production of fiber reinforced composite materials |
| TW200635830A (en) * | 2004-12-29 | 2006-10-16 | Hunter Paine Entpr Llc | Composite structural material and method of making the same |
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| CN101532253B (en) * | 2008-03-12 | 2012-09-05 | 比亚迪股份有限公司 | Carbon fiber composite material product and manufacturing method thereof |
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| US20090120567A1 (en) * | 2004-05-10 | 2009-05-14 | Honda Motor Co., Ltd. | Molded laminate and manufacturing method thereof |
| CN101010188A (en) * | 2004-09-07 | 2007-08-01 | 东丽株式会社 | Sandwich structure and integrated formed article using the same |
| JP2010147377A (en) * | 2008-12-22 | 2010-07-01 | Fujitsu Ltd | Housing, and method of manufacturing the same |
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| CN103252946B (en) | 2016-06-01 |
| CN103252946A (en) | 2013-08-21 |
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