CN105881216B - A kind of changeover mechanism that finishing is thrown for chip copper - Google Patents
A kind of changeover mechanism that finishing is thrown for chip copper Download PDFInfo
- Publication number
- CN105881216B CN105881216B CN201610391751.XA CN201610391751A CN105881216B CN 105881216 B CN105881216 B CN 105881216B CN 201610391751 A CN201610391751 A CN 201610391751A CN 105881216 B CN105881216 B CN 105881216B
- Authority
- CN
- China
- Prior art keywords
- groove
- reel
- finishing
- thrown
- lower disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 239000010949 copper Substances 0.000 title claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 28
- 239000004677 Nylon Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 7
- 229920001778 nylon Polymers 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 abstract description 17
- -1 processing axle Chemical compound 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000007596 consolidation process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N Methylcyclohexane Natural products CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- KTLIMPGQZDZPSB-UHFFFAOYSA-N diethylphosphinic acid Chemical class CCP(O)(=O)CC KTLIMPGQZDZPSB-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610391751.XA CN105881216B (en) | 2016-06-06 | 2016-06-06 | A kind of changeover mechanism that finishing is thrown for chip copper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610391751.XA CN105881216B (en) | 2016-06-06 | 2016-06-06 | A kind of changeover mechanism that finishing is thrown for chip copper |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105881216A CN105881216A (en) | 2016-08-24 |
CN105881216B true CN105881216B (en) | 2018-02-13 |
Family
ID=56709852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610391751.XA Active CN105881216B (en) | 2016-06-06 | 2016-06-06 | A kind of changeover mechanism that finishing is thrown for chip copper |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105881216B (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10061559A1 (en) * | 2000-12-07 | 2002-06-13 | C & E Fein Gmbh & Co Kg | Holder for attaching a tool to a drive shaft and adapter for this |
US20060022456A1 (en) * | 2004-07-30 | 2006-02-02 | Hull Eric G | Transition adapter for electrical conduit |
CN100399554C (en) * | 2005-07-25 | 2008-07-02 | 华信精密股份有限公司 | Fan device with transfer mechanism |
CN201483468U (en) * | 2009-09-02 | 2010-05-26 | 苏州宝时得电动工具有限公司 | Adapter |
CN201659552U (en) * | 2010-03-19 | 2010-12-01 | 南京德朔实业有限公司 | Multifunctional tool adapter |
CN103448034B (en) * | 2013-09-16 | 2015-10-14 | 宁波汉浦工具有限公司 | A kind of instrument switching device |
CN205674035U (en) * | 2016-06-06 | 2016-11-09 | 江苏吉星新材料有限公司 | A kind of changeover mechanism throwing finishing for wafer copper |
-
2016
- 2016-06-06 CN CN201610391751.XA patent/CN105881216B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN105881216A (en) | 2016-08-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20160824 Assignee: Zhejiang Zhaojing New Material Technology Co.,Ltd. Assignor: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. Contract record no.: X2022980008188 Denomination of invention: A transfer mechanism for wafer copper polishing and trimming Granted publication date: 20180213 License type: Common License Record date: 20220627 |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230109 Address after: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee after: Youran Walker (Beijing) Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230621 Address after: 050035 No. 369, Zhujiang Avenue, high tech Zone, Shijiazhuang, Hebei Patentee after: TUNGHSU GROUP Co.,Ltd. Address before: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee before: Youran Walker (Beijing) Technology Co.,Ltd. |
|
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20160824 Assignee: Hunan Lanxin Microelectronics Technology Co.,Ltd. Assignor: TUNGHSU GROUP Co.,Ltd. Contract record no.: X2023110000125 Denomination of invention: A transfer mechanism for copper wafer polishing and trimming Granted publication date: 20180213 License type: Common License Record date: 20230925 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A transfer mechanism for copper polishing and trimming of chips Granted publication date: 20180213 Pledgee: Hengshui Bank Co.,Ltd. Pledgor: TUNGHSU GROUP Co.,Ltd. Registration number: Y2024980031973 |