CN105881216B - A kind of changeover mechanism that finishing is thrown for chip copper - Google Patents
A kind of changeover mechanism that finishing is thrown for chip copper Download PDFInfo
- Publication number
- CN105881216B CN105881216B CN201610391751.XA CN201610391751A CN105881216B CN 105881216 B CN105881216 B CN 105881216B CN 201610391751 A CN201610391751 A CN 201610391751A CN 105881216 B CN105881216 B CN 105881216B
- Authority
- CN
- China
- Prior art keywords
- groove
- reel
- finishing
- thrown
- lower disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 239000010949 copper Substances 0.000 title claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 28
- 239000004677 Nylon Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 7
- 229920001778 nylon Polymers 0.000 claims abstract description 7
- 239000000919 ceramic Substances 0.000 abstract description 17
- -1 processing axle Chemical compound 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000007596 consolidation process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N Methylcyclohexane Natural products CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- KTLIMPGQZDZPSB-UHFFFAOYSA-N diethylphosphinic acid Chemical class CCP(O)(=O)CC KTLIMPGQZDZPSB-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to a kind of changeover mechanism that finishing is thrown for chip copper, including processing axle, reel, transfer panel and bolt made of nylon material, processing axle bottom is provided with adpting flange, reel bottom is provided with the first groove, reel is externally provided with some fastening plates and ejecting mechanism, ejecting mechanism includes support base, liftout plate and limited block, cavity is provided with support base, support base both sides are provided with guide plate, guide plate is provided with through hole, liftout plate side is provided with flap, flap both sides are provided with nose bar, transfer panel includes upper disk and lower disc, lower disc bottom is provided with the second groove, cross square groove is provided with second groove；Rational in infrastructure, convenient disassembly of the invention, practicality is high, for the existing difference between minicomputer and large scale computer, can be transferred to big ceramic disk on small type and be repaired, to reduce chip TTV, realize flatness requirement, while improve processing efficiency.
Description
Technical field
The present invention relates to a kind of changeover mechanism that finishing is thrown for chip copper, belongs to sapphire substrate sheet process technology neck
Domain.
Background technology
Flatness is an important quality index in Sapphire Substrate processing, and in substrate manufacturing procedure, copper throws conduct
The important procedure of chip flatness is moulded, the chip integral thickness after paster is poor（TTV）Carrying out becomes key.
In copper throws processing, heat can cause card to deform upon caused by the grinding between chip and diamond polishing fluid,
So as to influence chip flatness, in current copper throws process, the equipment of main flow has two kinds, and one kind is applied to ceramic disk diameter
355mm small type, the type are easier to control the flatness of card, the chip processed because copper dish card diameter is smaller
TTV is more excellent, but processing capacity is not high, and another kind is used for ceramic disk diameter 485mm big type, and the type is straight due to copper dish card
Footpath is big, and the flatness of card is difficult to control, and the chip TTV processed does not reach higher level.
The content of the invention
The purpose of the present invention is the defects of being directed to prior art, there is provided a kind of changeover mechanism that finishing is thrown for chip copper,
For existing difference between the two, try deep bid being transferred on small type and repaired, to reduce chip TTV, realize
Flatness requirement, improve processing efficiency.
The present invention is achieved by the following technical solutions：
A kind of changeover mechanism that finishing is thrown for chip copper, including processing axle, reel, the transfer panel made of nylon material
And bolt, wherein, the processing axle bottom is provided with adpting flange, and the adpting flange is provided with some connecting holes, described some
Connecting hole is set around one week uniform intervals of adpting flange, and processing axle and reel phase are realized through connecting hole and reel by bolt
Even, the reel bottom is provided with the first groove, and the reel is externally provided with some fastening plates and ejecting mechanism, some fastening plates
Set around one week uniform intervals of reel, the fastening plates are provided with trip bolt, and the trip bolt end is placed in the first groove
It is interior；
The ejecting mechanism is located at both sides at the top of reel, and the ejecting mechanism includes support base, liftout plate and limited block, institute
State in support base and be provided with cavity, the cavity connects with the first groove, and the support base both sides are provided with guide plate, are set on the guide plate
There is through hole, the limited block is located at guide plate side, and is connected with support base, and the liftout plate is located at guide plate opposite side, the top
Ejecting plate side is provided with flap, and the flap is placed between guide plate, and both sides are provided with nose bar, and the nose bar is placed in through hole, described
Flap is provided with inclined plane, and the inclined plane coordinates with limited block；
The transfer panel includes upper disk and lower disc, and the upper disk and lower disc are coaxially set with reel and processing axle
Put, the upper disk bottom at the top of lower disc with being connected, and the upper disk outer wall and the first groove inner wall gap coordinate, under described
Disk is placed between some fastening plates, and the lower disc bottom is provided with the second groove, and second groove is cylindrical groove, described
Cross square groove is provided with second groove, the crosspoint of the cross square groove is located at the second groove top surface circle centre position.
A kind of above-mentioned changeover mechanism that finishing is thrown for chip copper, wherein, the liftout plate is provided with some fixing holes.
A kind of above-mentioned changeover mechanism that finishing is thrown for chip copper, wherein, the upper disk and the second groove top surface are
Horizontal plane or slightly concave surface.
A kind of above-mentioned changeover mechanism that finishing is thrown for chip copper, wherein, the upper disk diameter d1 is 355mm, thickness
H1 is 15mm.
A kind of above-mentioned changeover mechanism that finishing is thrown for chip copper, wherein, the lower disc thickness h 2 is 32mm.
A kind of above-mentioned changeover mechanism that finishing is thrown for chip copper, wherein, the second groove diameter d2 is 485mm, deep
Degree h3 is 12mm.
A kind of above-mentioned changeover mechanism that finishing is thrown for chip copper, wherein, the cross square groove width d3 is 10mm, depth
H4 is 5mm.
Beneficial effects of the present invention are：
Processing axle bottom is connected with small type, a diameter of 485mm ceramic disk can be put in the second groove, is pressed by axle
The existing transfer panel of consolidation and ceramic disk compress installation, screw the trip bolt in fastening plates, can be driven when processing axle rotation
Ceramic disc spins, realize that chip copper throws finishing；During dismounting, trip bolt is unscrewed, passes through the liftout plate of pull-up ejecting mechanism, flap
End is gone in the cavity of support base, when inclined plane and limited block cooperation, can be placed in the first groove and be supported out transfer panel, then
Take out transfer panel and ceramic disk.
Disk and lower disc are coaxially disposed with reel and processing axle in the present invention, prevent from rotating bias；Will by fixing hole
Liftout plate is fixed, and liftout plate is got rid of de- when anti-locking mechanism rotates；Upper disk diameter is 355, ensures that the first groove can put diameter 355mm
Ceramic disk, improve versatility；Upper disk and the second groove top surface are horizontal plane or omit concave surface, ensure transfer panel and ceramics
The contact surface of disk is close, avoids causing pressurization uneven because certain goes out projection；Cross square groove avoids contact with complete between face and ceramic disk
It is complete closely sealed and form the difficulty that vacuum increase takes ceramic disk；Second depth of groove is 12mm, less than the thickness of ceramic disk, is prevented pair
Copper throws machine card and causes to scratch；Transfer panel is nylon material, and hardness is high, is unlikely to deform, lighter.
To sum up, rational in infrastructure, convenient disassembly of the invention, practicality is high, existing between minicomputer and large scale computer
Difference, big ceramic disk can be transferred on small type and be repaired, to reduce chip TTV, realized flatness requirement, improve simultaneously
Processing efficiency.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention.
Fig. 2 is this practical schematic cross-sectional view.
Fig. 3 is top view of the present invention.
Fig. 4 is transfer panel upward view of the present invention.
Embodiment
The embodiment of the present invention is described further below in conjunction with the accompanying drawings.
A kind of changeover mechanism that finishing is thrown for chip copper, including processing axle 1, reel 2, the switching made of nylon material
Disk 3 and bolt 4, wherein, processing axle 1 bottom is provided with adpting flange 5, and the adpting flange 5 is provided with some connecting holes 6,
Some connecting holes 6 are set around 5 one weeks uniform intervals of adpting flange, are realized and added through connecting hole 6 and reel 2 by bolt 4
Work axle 1 is connected with reel 2, and the bottom of reel 2 is provided with the first groove 7, and the reel 2 is externally provided with some fastening plates 8 and ejection
Mechanism 9, some fastening plates 8 are set around 2 one weeks uniform intervals of reel, and the fastening plates 8 are provided with trip bolt 10, described
The end of trip bolt 10 is placed in the first groove 7；
The ejecting mechanism 9 is located at the top both sides of reel 2, and the ejecting mechanism 9 includes support base 11, liftout plate 12 and limit
Position block 13, the support base 11 is interior to be provided with cavity 14, and the cavity 14 is connected with the first groove 7, and the both sides of support base 11 are set
There is guide plate 15, the guide plate 15 is provided with through hole 16, and the limited block 13 is located at the side of guide plate 15, and is connected with support base 11,
The liftout plate 12 is located at the opposite side of guide plate 15, and the liftout plate 12 is provided with some fixing holes 24, the side of liftout plate 12
Provided with flap 17, the flap 17 is placed between guide plate 15, and both sides are provided with nose bar 18, and the nose bar 18 is placed in through hole 16,
The flap 17 is provided with inclined plane 19, and the inclined plane 19 coordinates with limited block 13；
The transfer panel 3 includes upper disk 20 and lower disc 21, the upper disk 20 and lower disc 31 and reel 2 and processing
Axle 1 is coaxially disposed, and the upper bottom of disk 20 is connected with the top of lower disc 21, in the upper outer wall of disk 20 and the first groove 7
Wall gap coordinates, and the upper diameter d1 of disk 20 is 355mm, and thickness h 1 is 15mm；
The lower disc 21 is placed between some fastening plates 8, and the thickness h 2 of lower disc 21 is 32mm, the lower disc 21
Bottom is provided with the second groove 22, and the upper top surface of 20 and second groove of disk 22 is horizontal plane or omits concave surface, and described second
Groove 22 is cylindrical groove, and the diameter d2 of the second groove 22 is 485mm, and depth h3 is 12mm, is set in second groove 22
There is cross square groove 23, the crosspoint of the cross square groove 23 is located at the top surface circle centre position of the second groove 22, and the cross square groove is wide
Degree d3 is 10mm, and depth h4 is 5mm.
The nylon material is by nylon 612, nylon66 fiber, carbon fiber, graphene, nano silicon, diethyl phosphinic acids
Aluminium, methyl cyclohexane diamines, toluene di-isocyanate(TDI) in mass ratio 40:50:14:10:7:9:3:2 mediations form.
The present invention working method be：
Processing axle bottom is connected with small type, a diameter of 485mm ceramic disk can be put in the second groove, is pressed by axle
The existing transfer panel of consolidation and ceramic disk compress installation, screw the trip bolt in fastening plates, can be driven when processing axle rotation
Ceramic disc spins, realize that chip copper throws finishing；During dismounting, trip bolt is unscrewed, passes through the liftout plate of pull-up ejecting mechanism, flap
End is gone in the cavity of support base, when inclined plane and limited block cooperation, can be placed in the first groove and be supported out transfer panel, then
Take out transfer panel and ceramic disk.
Nylon material of the present invention has ultrahigh hardness high, impact resistance, is unlikely to deform, while lighter, heat-resisting
Fire resistance is good.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, the change or replacement that can readily occur in,
It should all cover within the scope of the present invention.Therefore, protection scope of the present invention should be with the protection domain of claims
It is defined.
Claims (7)
1. it is a kind of for chip copper throw finishing changeover mechanism, including processing axle, reel, made of nylon material transfer panel and
Bolt, it is characterized in that, the processing axle bottom is provided with adpting flange, and the adpting flange is provided with some connecting holes, if described
Dry connecting hole is set around one week uniform intervals of adpting flange, and processing axle and reel phase are realized through connecting hole and reel by bolt
Even, the reel bottom is provided with the first groove, and the reel is externally provided with some fastening plates and ejecting mechanism, some fastening plates
Set around one week uniform intervals of reel, the fastening plates are provided with trip bolt, and the trip bolt end is placed in the first groove
It is interior；
The ejecting mechanism is located at both sides at the top of reel, and the ejecting mechanism includes support base, liftout plate and limited block, the branch
Cavity is provided with support seat, the cavity connects with the first groove, and the support base both sides are provided with guide plate, and the guide plate is provided with logical
Hole, the limited block is located at guide plate side, and is connected with support base, and the liftout plate is located at guide plate opposite side, the liftout plate
Side is provided with flap, and the flap is placed between guide plate, and both sides are provided with nose bar, and the nose bar is placed in through hole, the flap
Inclined plane is provided with, the inclined plane coordinates with limited block；
The transfer panel includes upper disk and lower disc, and the upper disk and lower disc are coaxially disposed with reel and processing axle, institute
Disk bottom is stated with being connected at the top of lower disc, the upper disk outer wall and the first groove inner wall gap coordinate, the lower disc
It is placed between some fastening plates, the lower disc bottom is provided with the second groove, and second groove is cylindrical groove, and described second
Cross square groove is provided with groove, the crosspoint of the cross square groove is located at the second groove top surface circle centre position.
2. a kind of changeover mechanism that finishing is thrown for chip copper as claimed in claim 1, it is characterized in that, set on the liftout plate
There are some fixing holes.
3. a kind of changeover mechanism that finishing is thrown for chip copper as claimed in claim 1, it is characterized in that, the upper disk and the
Two groove top surfaces are horizontal plane or omit concave surface.
4. a kind of changeover mechanism that finishing is thrown for chip copper as claimed in claim 1, it is characterized in that, the upper disk diameter
D1 is 355mm, and thickness h 1 is 15mm.
5. a kind of changeover mechanism that finishing is thrown for chip copper as claimed in claim 1, it is characterized in that, the lower disc thickness
H2 is 32mm.
6. a kind of changeover mechanism that finishing is thrown for chip copper as claimed in claim 1, it is characterized in that, second groove is straight
Footpath d2 is 485mm, and depth h3 is 12mm.
7. a kind of changeover mechanism that finishing is thrown for chip copper as claimed in claim 1, it is characterized in that, the cross square groove is wide
Degree d3 is 10mm, and depth h4 is 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610391751.XA CN105881216B (en) | 2016-06-06 | 2016-06-06 | A kind of changeover mechanism that finishing is thrown for chip copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610391751.XA CN105881216B (en) | 2016-06-06 | 2016-06-06 | A kind of changeover mechanism that finishing is thrown for chip copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105881216A CN105881216A (en) | 2016-08-24 |
| CN105881216B true CN105881216B (en) | 2018-02-13 |
Family
ID=56709852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610391751.XA Active CN105881216B (en) | 2016-06-06 | 2016-06-06 | A kind of changeover mechanism that finishing is thrown for chip copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105881216B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10061559A1 (en) * | 2000-12-07 | 2002-06-13 | C & E Fein Gmbh & Co Kg | Holder for attaching a tool to a drive shaft and adapter for this |
| US20060022456A1 (en) * | 2004-07-30 | 2006-02-02 | Hull Eric G | Transition adapter for electrical conduit |
| CN100399554C (en) * | 2005-07-25 | 2008-07-02 | 华信精密股份有限公司 | Fan device with transfer mechanism |
| CN201483468U (en) * | 2009-09-02 | 2010-05-26 | 苏州宝时得电动工具有限公司 | Adapter |
| CN201659552U (en) * | 2010-03-19 | 2010-12-01 | 南京德朔实业有限公司 | Multifunctional tool adapter |
| CN103448034B (en) * | 2013-09-16 | 2015-10-14 | 宁波汉浦工具有限公司 | A kind of instrument switching device |
| CN205674035U (en) * | 2016-06-06 | 2016-11-09 | 江苏吉星新材料有限公司 | A kind of changeover mechanism throwing finishing for wafer copper |
-
2016
- 2016-06-06 CN CN201610391751.XA patent/CN105881216B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105881216A (en) | 2016-08-24 |
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| C06 | Publication | ||
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| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20160824 Assignee: Zhejiang Zhaojing New Material Technology Co.,Ltd. Assignor: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. Contract record no.: X2022980008188 Denomination of invention: A transfer mechanism for wafer copper polishing and trimming Granted publication date: 20180213 License type: Common License Record date: 20220627 |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230109 Address after: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee after: Youran Walker (Beijing) Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. |
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Effective date of registration: 20230621 Address after: 050035 No. 369, Zhujiang Avenue, high tech Zone, Shijiazhuang, Hebei Patentee after: TUNGHSU GROUP Co.,Ltd. Address before: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee before: Youran Walker (Beijing) Technology Co.,Ltd. |
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| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20160824 Assignee: Hunan Lanxin Microelectronics Technology Co.,Ltd. Assignor: TUNGHSU GROUP Co.,Ltd. Contract record no.: X2023110000125 Denomination of invention: A transfer mechanism for copper wafer polishing and trimming Granted publication date: 20180213 License type: Common License Record date: 20230925 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A transfer mechanism for copper polishing and trimming of chips Granted publication date: 20180213 Pledgee: Hengshui Bank Co.,Ltd. Pledgor: TUNGHSU GROUP Co.,Ltd. Registration number: Y2024980031973 |