CN210024733U - Cooling liquid nozzle adjusting device in silicon wafer chamfering process - Google Patents
Cooling liquid nozzle adjusting device in silicon wafer chamfering process Download PDFInfo
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- CN210024733U CN210024733U CN201920643502.4U CN201920643502U CN210024733U CN 210024733 U CN210024733 U CN 210024733U CN 201920643502 U CN201920643502 U CN 201920643502U CN 210024733 U CN210024733 U CN 210024733U
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Abstract
The utility model provides a cooling liquid nozzle adjusting device in a silicon wafer chamfering process, which comprises an installation tray, an installation support and a nozzle, wherein the installation tray comprises a connecting rod and two tray sheets, an installation gap for a sucker to pass through is reserved between the tray sheets, a sliding track is reserved on the installation tray, the sliding track is arranged on the tray sheets, a threaded hole I for connecting a bolt I is reserved on a machine body below the sucker, and the installation tray is also connected with the installation support; the mounting bracket comprises a first adjusting plate, a connecting plate and a second adjusting plate, a mounting opening for the nozzle to pass through is reserved on the connecting plate, the first adjusting plate and the second adjusting plate are respectively arranged on two sides of the connecting plate, adjusting through holes are reserved on the first connecting plate and the second connecting plate, the first connecting plate is connected to the mounting tray through a bolt II, and the second connecting plate is further connected with the nozzle. The utility model discloses can guarantee the cooling effect of beveler when changing grinding behind the processing silicon chip size, avoid surface burn and piece.
Description
Technical Field
The utility model belongs to semiconductor silicon chip production field, concretely relates to cooling liquid nozzle adjusting device among silicon chip chamfer technology.
Background
After the silicon single crystal is cut into the silicon wafer, edge corners of the silicon single crystal are easy to generate damages such as edge breakage, notches and cracks, which cause different degrees of influence on the subsequent process, so that the silicon wafer chamfering process is introduced, the stress concentration area of the edge of the silicon wafer is eliminated, and the damage of the silicon wafer in the subsequent process is reduced. With the continuous development of semiconductor technology, the customer's requirements for the quality of the substrate sheet are higher and higher, and the chamfering of the wafer is regarded more and more as an important process for eliminating edge damage and reducing edge stress. During chamfering, the silicon wafer is fixed on a rotatable vacuum chuck, and a diamond grinding wheel rotating at a high speed is arranged in the edge direction of the silicon wafer, wherein the rotating speed of the grinding wheel is usually 6000-8000 r/min or higher. During chamfering of the silicon wafer, a large amount of energy is consumed during grinding and is converted into heat energy in a very short time, so that the temperature of a grinding area is rapidly increased at a heating speed of the order of 1 x 105 ℃/s, the contact position of abrasive particles and the silicon wafer reaches a high temperature of more than 1000 ℃, the structure of the surface layer of the silicon wafer is rapidly changed, and the surface layer residual stress is generated. This condition causes thermal damage to the ground surface, resulting in burning and microcracking of the silicon wafer. Therefore, the control of the grinding temperature is an important physical factor for the chamfering process. The chamfering machine usually uses cooling liquid to take away grinding heat, and adopts a main grinding cooling nozzle and an auxiliary cooling nozzle, wherein the cooling liquid is sprayed linearly, the former mainly cools and grinds silicon wafers, and the latter cleans grinding wheels. When the chamfering machine grinds, the linear velocity of the grinding wheel is very high, strong air flow is generated on the peripheral surface of the grinding wheel, and the current cooling method cannot enable cooling liquid to effectively and accurately enter a grinding area, so that the chamfering quality of a silicon wafer is seriously influenced.
At present, most of devices used by domestic semiconductor material processing manufacturers are W-GM4200 and WBM-2200 type chamfering machines, the rotating speed of a grinding wheel is usually 6000-8000 r/min or more during chamfering operation, the processing sizes of silicon wafers are 4 inches, 5 inches, 6 inches and 8 inches, the positions of cooling liquid spray heads are determined to be different according to different sizes, whether cooling liquid accurately enters a grinding area during working can directly cause the quality of a silicon wafer chamfering process, and therefore, the adjustment of a cooling liquid spray nozzle is of great importance.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a cooling liquid nozzle adjusting device in silicon chip chamfering technology can guarantee the cooling effect of beveler when changing the grinding behind the processing silicon chip size, avoids surface burn and piece.
In order to realize the purpose, the utility model discloses a technical scheme be:
a cooling liquid nozzle adjusting device in a silicon wafer chamfering process is arranged on a silicon wafer chamfering machine and is characterized in that: the mounting tray comprises a connecting rod and two tray sheets, the connecting rod is an arc-shaped rod, the two tray sheets are symmetrically connected to two ends of the connecting rod, a mounting gap for the sucker to pass through is reserved between the tray sheets, a sliding track is reserved on the mounting tray and arranged on the tray sheets, the sliding track is a rectangular track, the sliding tracks on the two tray sheets are parallel to the central axis of the mounting gap, scales are marked on the edge of the sliding track, a threaded hole I for the connection of a bolt I is reserved on a machine body below the sucker, the mounting tray is fixed below the sucker through the bolt I, and the mounting tray is connected with the mounting bracket; the mounting bracket comprises a first adjusting plate, a connecting plate and a second adjusting plate, the connecting plate is a rectangular plate, a mounting opening for a nozzle to pass through is reserved on the connecting plate, the first adjusting plate and the second adjusting plate are respectively arranged on two sides of the connecting plate, the first adjusting plate and the second adjusting plate are mutually vertical, and the first adjusting plate and the second adjusting plate are respectively vertically connected to two adjacent edges of the connecting plate through side edges; adjusting through holes are reserved in the first connecting plate and the second connecting plate, the first connecting plate is connected to the mounting tray through a bolt II, and the second connecting plate is further connected with the nozzle; the nozzle is arranged at the mounting opening.
Furthermore, the threaded end of the bolt I also penetrates through the sliding rail to be connected to the threaded hole I, and the bolt head of the bolt I is also larger than the width of the sliding rail.
Further, a threaded hole II matched with the bolt II is reserved in the tray sheet, the threaded end of the bolt II penetrates through the adjusting through hole to be connected with the threaded hole I, and the bolt head of the bolt II is larger than the adjusting width.
Furthermore, the adjusting through holes are two waist-shaped holes which are arranged in parallel. .
Furthermore, the number of the mounting brackets is three, and each mounting bracket is connected with the nozzle.
Furthermore, the nozzle is fixed at the second connecting plate through an anchor ear, and a bolt III of the anchor ear is connected at the adjusting through hole of the second connecting plate.
Further, a nozzle of the nozzle penetrates through the mounting hole and faces a contact area of the silicon wafer and the grinding wheel, and a pipe body of the nozzle is fixed to the second connecting plate through the hoop.
The utility model has the advantages that: the fixed positions of the installation trays connected into the omega-shaped structure are different, the position of the cooling liquid nozzle is roughly adjusted when different sizes are finished, then the nozzle position and the angle of the cooling liquid nozzle are adjusted again through the three adjustable installation supports on the trays, and finally the cooling liquid nozzle is installed, adjusted and accurately fixed on the installation supports at the three adjustable positions, so that when the cooling liquid enters a grinding area, the cooling liquid can be sprayed to a grinding contact area of a silicon wafer and a grinding wheel, and the cooling process effect of the chamfer is ensured. The device has the advantages of simple processing technology, low price and convenient operation, overcomes the problems that cooling liquid is not suitable to enter a grinding area during grinding and the nozzle is difficult to adjust, greatly saves the production cost and improves the working efficiency.
Drawings
FIG. 1 is a view of the present invention in conjunction with a chamfering machine;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic structural view of a mounting bracket;
FIG. 4 is a schematic structural view of a connecting plate;
FIG. 5 is a view of the mounting bracket in cooperation with the nozzle;
FIG. 6 is a schematic structural view of the hoop;
FIG. 7 is a schematic structural view of a nozzle;
fig. 8 is a matching view of the present invention and the machine body.
Wherein, each reference number in the figure is: 1. a grinding wheel; 2. a suction cup; 3. a silicon wafer; 4. a mounting gap; 5. a first adjusting plate; 6. a nozzle; 601. a nozzle orifice of the nozzle; 602. a nozzle body; 7. installing a tray; 701. a connecting rod; 702. supporting a disc sheet; 8. a sliding track; 9. a bolt I; 10. a bolt III; 11. a connecting plate; 12. a second adjusting plate; 13. an installation port; 14. adjusting the through hole; 15. a bolt II; 16. hooping; 17. a body; 18. screw hole I.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention.
Fig. 1 is the utility model discloses a schematic structure diagram, a cooling liquid nozzle 6 adjusting device in 3 chamfer technologies of silicon chip, including the installation tray 7 and the three adjustable installing support of size sign that 8 departments of slip track of an omega type have, three stainless steel nozzle 6 that sets up on the installing support, wherein, the installation tray 7 that the surface of omega type has size sign is installed on the organism below sucking disc 2, and three installing support distributes and fixes the both wings at installation tray 7, and three stainless steel nozzle 6 is fixed in respectively on the installing support. According to the different sizes of the chamfer silicon wafers 3, the fixed position of the mounting tray 7 is adjusted through adjusting the bolts I9, the rough adjustment of the cooling liquid nozzle 6 adjusting device is completed, and then the positions of the three nozzles 6 are respectively adjusted through adjusting the bolts II 15, so that the fine adjustment of the cooling liquid nozzle 6 adjusting device is completed.
The mounting tray 7 specifically comprises a connecting rod 701 and two tray plates 702, a threaded hole II matched with the bolt II 15 is reserved on each tray plate 702, the threaded end of the bolt II 15 passes through the adjusting through hole 14 to be connected with the threaded hole I, the bolt head of the bolt II 15 is larger than the adjusting width, the connecting rod 701 is an arc-shaped rod, the two tray plates 702 are symmetrically connected with two ends of the connecting rod 701, a mounting gap 4 for the suction disc 2 to pass through is reserved between the tray plates 702, a sliding rail 8 is reserved on the mounting tray 7, the sliding rail 8 is arranged on each tray plate 702 and is a rectangular rail, the sliding rails 8 on the two tray plates 702 are parallel to the central axis of the mounting gap 4, scales are marked on the edge of each sliding rail 8, a threaded hole I for the bolt I9 to be connected with is reserved on the machine body below the suction disc 2, the threaded end of the bolt I9 passes through the sliding rail 8 to be, the bolt head of the bolt I9 is larger than the width of the sliding track 8; the installation tray 7 is further fixed below the sucker 2 through a bolt I9, and the installation tray 7 is further connected with an installation support.
The mounting support comprises a first adjusting plate 5, a connecting plate 11 and a second adjusting plate 12, the connecting plate 11 is a rectangular plate, a mounting opening 13 for the nozzle 6 to pass through is reserved in the connecting plate 11, the first adjusting plate 5 and the second adjusting plate 12 are also respectively arranged on two sides of the connecting plate 11, the first adjusting plate 5 and the second adjusting plate 12 are also mutually perpendicular, the first adjusting plate 5 and the second adjusting plate 12 are also respectively and vertically connected to two adjacent sides of the connecting plate 11 through side edges, adjusting through holes 14 are reserved in the first connecting plate 11 and the second connecting plate 11, the adjusting through holes 14 are two rectangular through holes with chamfers, the two rectangular through holes are also mutually parallel, the first connecting plate 11 is connected to the mounting tray 7 through a bolt II 15, and the second connecting plate 11 is also connected with the nozzle 6; the nozzle 6 is arranged at the mounting opening 13, a nozzle 601 of the nozzle penetrates through the mounting opening 13 and faces a contact area between the silicon wafer 3 and the grinding wheel, a tube body 602 of the nozzle is fixed at the second connecting plate 11 through an anchor ear 16, holes are symmetrically reserved at two ends of the anchor ear 16, the anchor ear 16 can be fixed on the second connecting plate 11 through bolts, when the connection is performed, a connecting end of each bolt penetrates through the hole and an adjusting through hole 14 of the second connecting plate upwards along the vertical direction, each bolt is fixed through a nut matched with the corresponding bolt, and specifically, the bolts are fixed on the anchor ear 16 and the second connecting plate 11 through the nuts; the nozzle 6 can also perform fine angle adjustment on the mounting bracket, specifically, the nozzle 601 of the nozzle penetrates through the mounting port 13, and the nozzle body 602 is erected at the mounting port 13, when the nozzle is mounted, the diameter of the mounting port 13 has surplus compared with the nozzle body, the angle of the nozzle body 602 can be changed when the nozzle body is erected in the mounting port 13, when the angle of the nozzle 601 needs to be adjusted, the hoop 16 is firstly removed from the second connecting plate 11, then the nozzle 601 of the nozzle is adjusted to a proper angle, the cooling liquid can be more accurately sprayed to a grinding contact area of a silicon wafer and a grinding wheel, the cooling process effect of a chamfer is ensured, and finally the nozzle body 602 of the nozzle is fixed on the second mounting plate 11 by the hoop 16 under the condition that the angle is maintained, so that the angle adjustment of the nozzle 6 is completed.
The utility model discloses a connect the fixed position difference that is omega type's installation tray 7, 6 coarse adjusting positions of coolant liquid nozzle when accomplishing not unidimensional, then adjust 6 positions of nozzle and 6 angles of coolant liquid nozzle once more through the three adjustable installing support on the tray, last 6 installation, the adjustment of coolant liquid nozzle, the accuracy is fixed on three adjustable position's installing support, thereby when guaranteeing that the coolant liquid gets into to grind the region, the coolant liquid can spout the grinding contact zone to silicon chip 3 and emery wheel, ensure the cooling process effect of chamfer. The device has the advantages of simple processing technology, low price and convenient operation, overcomes the problems that cooling liquid is not suitable to enter a grinding area during grinding and the nozzle 6 is difficult to adjust, greatly saves the production cost and improves the working efficiency.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention, and the present invention is not intended to be limited to the embodiments shown herein.
Claims (7)
1. A cooling liquid nozzle adjusting device in a silicon wafer chamfering process is arranged on a silicon wafer chamfering machine and is characterized in that: the mounting tray comprises a connecting rod and two tray sheets, the connecting rod is an arc-shaped rod, the two tray sheets are symmetrically connected to two ends of the connecting rod, a mounting gap for the sucker to pass through is reserved between the tray sheets, a sliding track is reserved on the mounting tray and arranged on the tray sheets, the sliding track is a rectangular track, the sliding tracks on the two tray sheets are parallel to the central axis of the mounting gap, scales are marked on the edge of the sliding track, a threaded hole I for the connection of a bolt I is reserved on a machine body below the sucker, the mounting tray is fixed below the sucker through the bolt I, and the mounting tray is connected with the mounting bracket;
the mounting bracket comprises a first adjusting plate, a connecting plate and a second adjusting plate, the connecting plate is a rectangular plate, a mounting opening for a nozzle to pass through is reserved on the connecting plate, the first adjusting plate and the second adjusting plate are respectively arranged on two sides of the connecting plate, the first adjusting plate and the second adjusting plate are mutually vertical, and the first adjusting plate and the second adjusting plate are respectively vertically connected to two adjacent edges of the connecting plate through side edges; adjusting through holes are reserved in the first adjusting plate and the second adjusting plate, the first adjusting plate is connected to the mounting tray through a bolt II, and the second adjusting plate is further connected with the nozzle; the nozzle is arranged at the mounting opening.
2. The cooling liquid nozzle adjusting device in the silicon wafer chamfering process according to claim 1, wherein: the threaded end of the bolt I also penetrates through the sliding rail to be connected with the threaded hole I, and the bolt head of the bolt I is also larger than the width of the sliding rail.
3. The cooling liquid nozzle adjusting device in the silicon wafer chamfering process according to claim 1 or 2, wherein: and a threaded hole II matched with the bolt II is reserved on the tray sheet, the threaded end of the bolt II passes through the adjusting through hole to be connected with the threaded hole I, and the bolt head of the bolt II is larger than the adjusting width.
4. The cooling liquid nozzle adjusting device in the silicon wafer chamfering process according to claim 3, wherein: the adjusting through holes are two waist-shaped holes which are arranged in parallel.
5. The cooling liquid nozzle adjusting device in the silicon wafer chamfering process according to claim 1, wherein: the mounting support sets up to three, all connects on every mounting support the nozzle.
6. The cooling liquid nozzle adjusting device in the silicon wafer chamfering process according to claim 1 or 5, wherein: the nozzle is further fixed at the second adjusting plate through an anchor ear, and a bolt III of the anchor ear is further connected to the adjusting through hole of the second adjusting plate.
7. The cooling liquid nozzle adjusting device in the silicon wafer chamfering process according to claim 6, wherein: and a nozzle of the nozzle penetrates through the mounting hole and faces a contact area of the silicon wafer and the grinding wheel, and a pipe body of the nozzle is fixed at the second adjusting plate through the hoop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920643502.4U CN210024733U (en) | 2019-05-07 | 2019-05-07 | Cooling liquid nozzle adjusting device in silicon wafer chamfering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920643502.4U CN210024733U (en) | 2019-05-07 | 2019-05-07 | Cooling liquid nozzle adjusting device in silicon wafer chamfering process |
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| CN210024733U true CN210024733U (en) | 2020-02-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920643502.4U Active CN210024733U (en) | 2019-05-07 | 2019-05-07 | Cooling liquid nozzle adjusting device in silicon wafer chamfering process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114147569A (en) * | 2021-12-03 | 2022-03-08 | Tcl华星光电技术有限公司 | Side grinding device |
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2019
- 2019-05-07 CN CN201920643502.4U patent/CN210024733U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114147569A (en) * | 2021-12-03 | 2022-03-08 | Tcl华星光电技术有限公司 | Side grinding device |
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| CP03 | Change of name, title or address |
Address after: 471000 No. 99 Binhe North Road, Luoyang hi tech Industrial Development Zone, Henan Patentee after: Mesk Electronic Materials Co., Ltd Address before: 471000 No. 99 Binhe North Road, Luoyang hi tech Industrial Development Zone, Henan, Luoyang Patentee before: MCL ELECTRONIC MATERIALS Ltd. |
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| CP03 | Change of name, title or address |