CN105881131B - Automatic frequency measurement wafer polishing equipment - Google Patents
Automatic frequency measurement wafer polishing equipment Download PDFInfo
- Publication number
- CN105881131B CN105881131B CN201610400872.6A CN201610400872A CN105881131B CN 105881131 B CN105881131 B CN 105881131B CN 201610400872 A CN201610400872 A CN 201610400872A CN 105881131 B CN105881131 B CN 105881131B
- Authority
- CN
- China
- Prior art keywords
- frequency measurement
- frequency
- controller
- top lap
- perforation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Abstract
The present invention provides a kind of automatic frequency measurement wafer polishing equipment, it includes controller and is all connected with the frequency measurement equipment of controller and milling apparatus, wherein, milling apparatus includes rack and the lower abrasive disk, top lap, pleasure boat and the motor that are installed in rack, the upper polished film of lower face laying of top lap, the lower polished film of upper surface laying of lower abrasive disk, the perforation penetrated through there are two being correspondingly arranged on top lap and upper polished film, the run trace of two perforation corresponds to machining position on pleasure boat and is arranged, controller control connection motor；Frequency measurement equipment includes chip frequency probe, two electrodes of eyeglass frequency probe are separately mounted in two perforation, the end of probe end face of each electrode is concordant with the lower face of upper polished film to be arranged, and controller control connection eyeglass frequency probe is so as to frequency rear control motor stalling up to standard.The automatic frequency measurement wafer polishing equipment has the advantages that design science, automatic frequency measurement, disposably completes polishing, substantially reduces labour cost.
Description
Technical field
The present invention relates to a kind of wafer fabs, specifically, relate to a kind of automatic frequency measurement wafer polishing equipment.
Background technology
Crystal chip polishing processing is now：Polishing is influenced by polishing material insulation, and upper and lower abrasive disk cannot
Effective circuit is formed, is also difficult to that frequency meter is directly used to go detection polishing frequency, must just use the method for calculating the number of turns,
Specifically include following steps：
1.1 rough calculations polish the number of turns
1.1.1 the polished amount range that each frequency point often encloses is summarized first：A-B (A is less than B) KHZ；
1.1.2 road polishing frequency variation Δ f is calculated, the polishing number of turns is ranging from：(Δf/A,Δf/B)；
1.1.3 the opposite meeting of the first coil number is more after repairing disk：Set number of turns I=Δ f/A；
1.1.4 the number of turns of the second disk will suitably reduce the setting number of turns：Reduce by 20 circles when grinding the number of turns and being no more than 150 circle,
Reduce by 30 circles when more than 150 circle（But Δ f/B ﹤ I ﹤ Δs f/A need to be met）.
1.2 actuarials polish the number of turns
The number of turns of setting takes piece measurement frequency after shutting down, and disk is played to target frequency, is less than target frequency and calculates the reality often enclosed
The polished amount on border calculates and arrives the remaining polished amount of target frequency, determines the remaining polishing number of turns.
This processing method the disadvantage is that：
1, manual frequency measurement uncertain factor is more, the number of turns is estimated according to the frequency point that manual frequency measurement obtains, due under polishing condition
Continuous variation error it is larger, it occur frequently that the number of turns is miscalculated, generate that frequency mill is super or mill owes phenomenon, cause scrapping for polished silicon wafer.
2, frequent to detect due in polishing process, needing ceaselessly to carry out frequency measurement to polishing chip, it causes detecting
Wafer breakage in journey, while in detection process, causing largely to polish cut piece, reducing the accepted product percentage of polishing process.
3, efficiency is low, and employee needs ceaselessly to shut down the estimation work for carrying out frequency measurement and the number of turns in polishing process,
It is easily chaotic but under the situation of multiple computer desk, cause scrapping for whole disk chip.So the utilization rate of equipment and installations of polishing machine platform is relatively low, employee
The board of operation is less simultaneously.
4, the scattered error caused by manual control between disk and disk is larger, Repetitive controller low precision, polishes the frequency of chip by the gross
Rate scattered error is big.
In the case of more than the tight order of production task, disadvantages mentioned above just highlights very much, causes order to be not timely completed and prolongs
Accidentally the case where friendship phase, occurs, while quality fluctuation is larger, and batch production is difficult.
In order to solve the above problems, people are seeking always a kind of ideal technical solution.
Invention content
The purpose of the present invention is in view of the deficiencies of the prior art, to provide a kind of design science, automatic frequency measurement, disposable
The automatic frequency measurement wafer polishing equipment completed polishing, substantially reduce labour cost.
To achieve the goals above, the technical solution adopted in the present invention is：A kind of automatic frequency measurement wafer polishing equipment, packet
Include controller and be all connected with the frequency measurement equipment and milling apparatus of the controller, wherein the milling apparatus include rack and
Lower abrasive disk, top lap, the pleasure boat between two abrasive disks and the driving two being installed in the rack are ground
The motor of disk rotation, the top lap, the pleasure boat and the vertical face setting of the lower abrasive disk, the pleasure boat, which is equipped with, to be used
In the machining position for placing chip, the upper polished film of lower face laying of the top lap, the upper surface laying of the lower abrasive disk
It is correspondingly arranged on lower polished film, the top lap and the upper polished film there are two the perforation penetrated through, two perforation
Run trace corresponds to machining position on the pleasure boat and is arranged, and the controller control connects the motor；The frequency measurement equipment packet
Chip frequency probe is included, two electrodes of the eyeglass frequency probe are separately mounted in two perforation, each electrode
End of probe end face is concordant with the lower face of upper polished film to be arranged, controller control connect the eyeglass frequency probe with
Just the control motor stalling after frequency is up to standard.
Described on base, it further includes electrode fixed plate, and the perforation setting electrode is corresponded in the electrode fixed plate and is installed
Hole, the electrode fixed plate are mounted on the upper end of the top lap, and the side of the electrode fixed plate corresponds to the perforation and sets
Set lock-screw.
Described on base, it further includes the frequency measurement counting change-over switch for being associated with the motor, the controller control connection institute
It states frequency measurement and counts the power supply circuit that change-over switch disconnects the motor after target frequency so that the frequency measurement equipment measures.
Described on base, it further includes that the mill platform being mounted in the rack and mill sunpender, the top lap are mounted on
The lower end of the mill sunpender, the lower abrasive disk are mounted on the mill platform, and the pleasure boat is mounted in rack.
Described on base, the controller connects the chip frequency by adapter and pops one's head in.
Described on base, the adapter connects the controller by signal-transmitting cable, and the mill sunpender is hollow
Structure, a part of signal-transmitting cable are arranged in the mill sunpender.
The present invention has substantive distinguishing features outstanding and marked improvement compared with the prior art, and specifically, the present invention has
Following advantages：
1, automatic frequency measurement, due to being punched on top lap and upper polished film, circuit is no longer by the insulation attribute of polished film
It influences.
2, electrode corresponds to the machining position setting of crystal chip, and in top lap rotation process, chip frequency probe can be held
It is continuous that frequency measurement work is carried out to crystal chip, realize automatic frequency measurement.
3, using the thickness of crystal chip and the relationship of frequency, by the corresponding frequency values input control of the thickness of finished product chip
Device, chip occur resonance under the driving of a certain voltage, capture resonance signal in real time, by signal processing, measure chip frequency.When
When frequency reaches given value, it is automatically stopped process of lapping.
4, for convenience of chip frequency probe and being associated between motor, setting frequency measurement counts change-over switch, when frequency is up to standard
Controller controls the motor stalling afterwards.
5, mill is hollow structure, facilitates the cabling of signal-transmitting cable, it is not necessary in addition be punched in equipment.
6, efficiency is improved, an originally employee can only operate three boards simultaneously, can operate four simultaneously now
Board；And separate unit board production capacity is able to promotion 15%.Whole efficiency is promoted to the 153% of former technique.
7, the quality, qualification rate of product have large increase.
8, with short production cycle efficient, solve the bottleneck problem in the processing of this industry chip well.
Description of the drawings
Fig. 1 is the structural schematic diagram of automatic frequency measurement wafer polishing equipment in the present invention.
In figure：1. rack；2. top lap；3. lower abrasive disk；Polished film on 4.；5. lower polished film；6. perforation；7. electrode
Fixed plate；8. electrode；9. chip frequency is popped one's head in；10. adapter；11. controller；12. motor；13. grinding platform；14. mill sunpender；
15. pleasure boat；16. chip.
Specific implementation mode
Below by specific implementation mode, technical scheme of the present invention will be described in further detail.
As shown in Figure 1, a kind of automatic frequency measurement wafer polishing equipment, including controller and the survey for being all connected with the controller
Frequency equipment and milling apparatus, wherein the milling apparatus includes rack 1, mill platform 13, mill sunpender 14, is mounted on mill platform 13
Lower abrasive disk 3,14 lower end of installation mill sunpender top lap 2, the pleasure boat 15 between two abrasive disks and driving
The motor 12 of two abrasive disks rotation, the top lap 2, the pleasure boat 15 and the setting of 3 vertical face of the lower abrasive disk are described
Pleasure boat 15 is equipped with the machining position for placing chip 16, the upper polished film 4 of lower face laying of the top lap 2, under described
The lower polished film 5 of upper surface laying of abrasive disk 3, the upper end installation electrode fixed plate 7 of the top lap 2, the electrode is fixed
The perforation 6 of two perforations, the side pair of the electrode fixed plate 7 are set on plate 7, the top lap 2 and the upper polished film 4
6 setting lock-screw of the perforation is answered, to fix electrode 8.The run trace of the perforation 6 corresponds to machining position on the pleasure boat 15
Setting, so that electrode 8 persistently can carry out frequency measurement to chip 16, the control of the controller 11 connects the motor 12, the electricity
Grounding screw is installed in pole fixed plate 7, is used for the connection of ground wire.
The frequency measurement equipment includes chip frequency probe 9, and two electrodes 8 of the chip frequency probe 9 are separately mounted to
In two perforation 6, the upper end of the electrode 8 is fixed by electrode fixed plate 7, the end of probe of the electrode 8 with it is described on
The lower face of polished film 4 is concordant, and the controller 11 connects the chip frequency probe 9 so as to frequency by the control of adapter 10
The control motor 12 stalls after up to standard.
It further includes the frequency measurement counting change-over switch for being associated with the motor 12, and the control of the controller 11 connects the frequency measurement
Count the power supply circuit that change-over switch disconnects the motor after target frequency so that the frequency measurement equipment measures.
The adapter 10 connects the controller 11 by signal-transmitting cable, and for convenience of cabling, the mill is hung
Bar 14 is designed as hollow structure, and a part of signal-transmitting cable is arranged in the mill sunpender 14.
Operation principle：Using the thickness of crystal chip and the relationship of frequency, by the corresponding frequency values of the thickness of finished product chip
Under the driving of a certain voltage resonance occurs for input controller 11, chip, real-time using chip frequency probe 9 and two electrode 8
Capture resonance signal measures chip frequency by signal processing.When frequency reaches given value, electricity is closed in the control of controller 11
Machine 12, is automatically stopped process of lapping.
Specific adaptation step：
Step 1 bores two at a distance of the hole of 48mm diameters 4.5, for installing solid-state relay in the electric cabinet left side of rack
Device.Then nigh suitable position bores the hole of a diameter 12, and change-over switch is counted for installing frequency measurement.
Step 2, the hole for boring a diameter 3.5 by entad in top lap, deep 8mm attack M4 screw threads above, use
Electrode fixed plate is fixed on top lap by M4x10 screws.
It drills in step 3, the corresponding top lap of the electrode mounting hole in electrode fixed plate, it is solid to remove electrode by deep 2mm
Fixed board continues the entire top lap that drills and run through, clears up drill hole burr, and thoroughly clean top lap.
Two pieces of electrodes are inserted into the electrode mounting hole in fixed plates by step 4, are then inserted into that top lap is corresponding to be worn
Hole.It is packed into fixed plate counterbore and is coated with the M4x10 screws of lubricating grease and tightens, fixed plate is made to be connected with top lap.
Two pieces of step 5, adjustment electrode protrusion heights, and the trepanning on upper polished film make under the upper polished film of electrode alignment
Two electrode lock-screws of fixed plate side are tightened in end face.Grounding screw is screwed into the corresponding screw hole of fixed plate.
Step 6 penetrates the connecting pin of signal-transmitting cable in mill sunpender, adjustment cable extension elongation to 100mm
Left and right, is then fixed cable with nylon cable tie.
Step 7, connection adapter tighten fixing screws to grinding machine sunpender.Cable plug is inserted into adapter top BNC
Seat, is rotated by 90 ° locking plug.Cable earth wire is fixed on the earthing screw between two BNC.
Step 8, the contact pin that chip frequency is popped one's head in are inserted into corresponding electrode hole.Two BNC heads that chip frequency is popped one's head in
It is inserted into adapter lower part BNC, is rotated by 90 ° locking plug.And the ground wire that chip frequency is popped one's head in is fixed on two BNC seats
Between earthing screw on.
Step 9, by solid-state relay, inside has been bored on the position of mounting hole on the left of electric cabinet, and frequency measurement is counted and is converted
Switch is on 12 hole of diameter on the left of electric cabinet.
Step 10, as shown in Figure 1 by frequency measurement count change-over switch it is in parallel with solid-state relay output end, then with motor
Stop button is connected.
Step 11, will control cable DB9-F plug inserting controller rear panels corresponding control output end mouthful, then by cable
The other end is connected to the input terminal of solid-state relay.
Step 12, by signal-transmitting cable plug inserting controller rear panel socket, cable earth wire and protective grounding phase
Connection.
Step 13, by the power outlet of power cord inserting controller rear panel, then with the AC220V power supplys with ground wire
Connection.
Finally it should be noted that:The above embodiments are merely illustrative of the technical scheme of the present invention and are not intended to be limiting thereof；To the greatest extent
The present invention is described in detail with reference to preferred embodiments for pipe, those of ordinary skills in the art should understand that：Still
It can modify to the specific implementation mode of the present invention or equivalent replacement is carried out to some technical characteristics；Without departing from this hair
The spirit of bright technical solution should all cover within the scope of the technical scheme claimed by the invention.
Claims (4)
1. a kind of automatic frequency measurement wafer polishing equipment, it is characterised in that：It includes controller and is all connected with the controller
Frequency measurement equipment and milling apparatus, wherein the milling apparatus include rack and be installed in the rack lower abrasive disk, on
The motor of abrasive disk, the pleasure boat between two abrasive disks and driving two abrasive disks rotation, the top lap, the trip
Wheel and the vertical face setting of the lower abrasive disk, the pleasure boat are equipped with the machining position for placing chip, the top lap
The upper polished film of lower face laying, the lower polished film of upper surface laying of the lower abrasive disk, the top lap and the upthrow
It is correspondingly arranged on light film there are two the perforation penetrated through, the run trace of two perforation corresponds to machining position on the pleasure boat and sets
It sets, the controller control connects the motor；The frequency measurement equipment includes chip frequency probe, the chip frequency probe
Two electrodes are separately mounted in two perforation, and the end of probe end face of each electrode and the lower face of the upper polished film are flat
Setting together, the controller control connect the chip frequency probe so as to the frequency rear control motor stalling up to standard, it is also
Frequency measurement including being associated with the motor counts change-over switch, the controller control connect the frequency measurement count change-over switch so as to
The frequency measurement equipment measures the power supply circuit that the motor is disconnected after target frequency, it further includes the mill being mounted in the rack
Platform and mill sunpender, the top lap are mounted on the lower end of the mill sunpender, and the lower abrasive disk is mounted on the mill platform
On, the pleasure boat is mounted in rack.
2. automatic frequency measurement wafer polishing equipment according to claim 1, it is characterised in that：It further includes electrode fixed plate,
The perforation setting electrode mounting hole is corresponded in the electrode fixed plate, the electrode fixed plate is mounted on the top lap
The side of upper end, the electrode fixed plate corresponds to the perforation setting lock-screw.
3. automatic frequency measurement wafer polishing equipment according to claim 2, it is characterised in that：The controller passes through adapter
Connect the chip frequency probe.
4. automatic frequency measurement wafer polishing equipment according to claim 3, it is characterised in that：The adapter is passed by signal
Transmission cable connects the controller, and the mill sunpender is hollow structure, and a part of signal-transmitting cable is arranged in the mill
In sunpender.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610400872.6A CN105881131B (en) | 2016-06-08 | 2016-06-08 | Automatic frequency measurement wafer polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610400872.6A CN105881131B (en) | 2016-06-08 | 2016-06-08 | Automatic frequency measurement wafer polishing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105881131A CN105881131A (en) | 2016-08-24 |
| CN105881131B true CN105881131B (en) | 2018-10-02 |
Family
ID=56710136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610400872.6A Active CN105881131B (en) | 2016-06-08 | 2016-06-08 | Automatic frequency measurement wafer polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105881131B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107877355B (en) * | 2017-12-19 | 2023-08-11 | 浙江大学台州研究院 | High-reliability grinding machine shutdown control device and method thereof |
| CN110076646A (en) * | 2019-06-04 | 2019-08-02 | 马鞍山荣泰科技有限公司 | A kind of quartz wafer grinding frequency measuring device |
| CN111002214B (en) * | 2019-12-25 | 2021-08-06 | 唐山万士和电子有限公司 | Piezoelectric quartz wafer convex surface grinding frequency real-time monitoring device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2674662B2 (en) * | 1989-02-15 | 1997-11-12 | 住友電気工業株式会社 | Semiconductor wafer grinding machine |
| JP2674665B2 (en) * | 1989-03-24 | 1997-11-12 | 住友電気工業株式会社 | Semiconductor wafer grinding machine |
| US6261152B1 (en) * | 1998-07-16 | 2001-07-17 | Nikon Research Corporation Of America | Heterdoyne Thickness Monitoring System |
| JP2000310512A (en) * | 1999-04-28 | 2000-11-07 | Hitachi Ltd | Method and device for measuring film thickness of thin film and method and device for manufacturing thin film device using the same |
| CN201235498Y (en) * | 2008-07-30 | 2009-05-13 | 常州松晶电子有限公司 | Lapping machine for two-side of wafer |
| CN201405261Y (en) * | 2009-06-02 | 2010-02-17 | 济源石晶光电频率技术有限公司 | grinding machine for polishing |
| CN201711859U (en) * | 2010-05-25 | 2011-01-19 | 嘉兴海盛电子有限公司 | Grinding mill capable of measuring frequency |
| CN105588980B (en) * | 2016-01-22 | 2018-06-26 | 浙江大学台州研究院 | A kind of method that quartz wafer based on waveform-matching approach grinds online frequency measurement |
| CN205870165U (en) * | 2016-06-08 | 2017-01-11 | 济源石晶光电频率技术有限公司 | Automatic frequency measurement wafer polishing equipment |
-
2016
- 2016-06-08 CN CN201610400872.6A patent/CN105881131B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105881131A (en) | 2016-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105881131B (en) | Automatic frequency measurement wafer polishing equipment | |
| CN205817262U (en) | Intelligence filature | |
| CN104180767B (en) | steel-rail wear measurement device based on machine vision and grinding strategy method thereof | |
| CN206772739U (en) | A kind of construction material rigidity detection device | |
| CN205870165U (en) | Automatic frequency measurement wafer polishing equipment | |
| CN207415090U (en) | A kind of special plain type sanding apparatus of bolt head | |
| CN109158946A (en) | Digitize three-phase lubricating system with trace amount and micro-lubricating cutting method for establishing model | |
| CN103611705A (en) | Ultrasonic cleaning device for diamond wires | |
| CN203156354U (en) | Drilling and tapping integrated machine | |
| CN213239811U (en) | TP surface abrasion resistance testing device | |
| CN202438932U (en) | Automatic height-adjustable testing and controlling device for water cutting | |
| CN208196342U (en) | A kind of hole processing special hydraulic clamp chip protection mechanism | |
| CN210704318U (en) | Electric spark grinding wheel shaping device of bearing ring raceway grinding machine | |
| CN207104661U (en) | A kind of device for judging diamond polishing terminal | |
| CN208321462U (en) | A kind of throwing device of cleaning equipment for work-piece | |
| CN210255560U (en) | Polishing device for quartz stone production | |
| CN204975587U (en) | Portable high -power electric spark machine | |
| CN102922412B (en) | Grinding device and grinding method | |
| CN207669118U (en) | Mechanical thickness measurement online device | |
| CN202240880U (en) | Grinding speed-limiting alarm for grinder | |
| CN207043931U (en) | A kind of horizontal membrane removing machine of coated glass | |
| CN204758422U (en) | Coating wearing and tearing controlling means and use instrument thereof | |
| CN204882056U (en) | Upset detection mechanism | |
| CN209579179U (en) | A kind of Novel grinder swing arm | |
| CN218168824U (en) | Hub preparation is with milling processing agency |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |