CN105856793A - Novel multilayered structure non-solvent compounding process - Google Patents
Novel multilayered structure non-solvent compounding process Download PDFInfo
- Publication number
- CN105856793A CN105856793A CN201610205654.7A CN201610205654A CN105856793A CN 105856793 A CN105856793 A CN 105856793A CN 201610205654 A CN201610205654 A CN 201610205654A CN 105856793 A CN105856793 A CN 105856793A
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- Prior art keywords
- glue
- layer
- solvent
- heating
- temperature
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1269—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives multi-component adhesive
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a novel multilayered structure non-solvent compounding process. The process comprises the following steps: (1) first time of compounding: commonly, the material of a first layer is one or more of BOPA, BOPP, PET or matte, and the material of a second layer is one of PET, VMPET and PE; the first layer and the second layer are compounded by single-component glue with the solid content of 45% and 3% of a curing agent; a baking box is used for heating in four sections; (2) second time of compounding: commonly, the material of a third layer is one of PE and CPP; when the third layer is compounded with the second layer, solvent-free glue is used and the solid content of glue A and glue B in the solvent-free glue is 100%; the adding ratio of the glue A to the glue B is 100 to (53-57); and the curing temperature is 36-39 DEG C and the curing time is 36-48 hours. According to the compounding method provided by the invention, ethyl ester is not used in an adhesive, and the curing time and the curing temperature are lower than traditional curing time and curing temperature, so that the production cost is reduced; and physicochemical properties of the obtained product are 20% higher than national standards, and the emission of harmful gas is reduced and avoided in the compounding process.
Description
Technical field
The invention belongs to packing articles complex technique field, particularly relate to a kind of multiple structure non-solvent new composite
Technique.
Background technology
Traditional processing mode of more than three layers composite membranes uses polyurethane glue, and glue allocation process need to add 1.3
Ethyl ester more than times, ethyl ester needs drying system drying and processing in the course of processing, always can not be thorough at drying course
All volatilizing ethyl ester in the end, carrys out certain potential safety hazard to food strap, controls because of needs in recombination process
Technological parameter is required higher by Determination of Residual Organic Solvents, between traditional solidification temperature needs 50 DEG C～60 DEG C, Gu
The change time, energy consumption was higher between 36～60h, increased production cost, simultaneously because use organic solvent at height
Temperature solidification process release harmful gas.
Summary of the invention
The present invention solves the problems referred to above provide a kind of be required for ethyl ester, hardening time is short, solidification temperature is low
Multiple structure non-solvent new composite technique.
The technical solution used in the present invention:
A kind of multiple structure non-solvent new composite technique, processing step is:
It is (1) the most compound: the material of ground floor is generally in BOPA, BOPP, PET or sub-light a kind of,
The material of the second layer is generally in PET, VMPET or PE one, ground floor and the second layer with one-component water
Glue solid content 45%, firming agent 3% is combined, and baking oven divides four sections of heating, heating-up temperature first paragraph 45～55 DEG C,
Second segment 55～65 DEG C, the 3rd section 65～75 DEG C, the 4th section 75～85 DEG C；
(2) second time is compound: the material of third layer is generally in PE or CPP one, third layer and second
Layer compound tense, uses solvent-free glue, and A glue and B glue solid content in solvent-free glue are 100%, A
Glue and B glue adding proportion 100:53～57, solidification temperature 36～39 DEG C, hardening time 36～48h.
In described step (1), baking oven divides four sections of methods heated the most permissible in addition to decocting in water, steaming and decocting infrastructure product
Use this kind of mode of heating.
Optimally, the baking oven in step (1) divides four sections of optimum temperatures heated to be that first paragraph heats 50 DEG C,
Second segment heating-up temperature 60 DEG C, the 3rd section of heating-up temperature 70 DEG C, the 4th section of heating-up temperature 80 DEG C.
Optimally, in step (2), in solvent-free glue, the ratio of greater inequality of A glue and B glue adding proportion is 20:11.
Beneficial effects of the present invention: the complex method of the present invention, does not use ethyl ester in adhesive, hardening time is relatively
The solidification temperature that Conventional temporal is short and solidification temperature is more traditional is low, reduces production cost, and compound products obtained therefrom thing
Change performance reduce higher than GB 20%, recombination process and stopped noxious gas emission.
Detailed description of the invention
Embodiment 1
A kind of multiple structure non-solvent new composite technique, processing step is:
(1) the most compound: the material of ground floor is BOPA, and the material of the second layer is PET, ground floor
Being combined with one-component glue solid content 45%, firming agent 3% with the second layer, baking oven divides four sections of heating, heating temperature
Degree first paragraph 45～55 DEG C, second segment 55～65 DEG C, the 3rd section 65～75 DEG C, the 4th section 75～85 DEG C；
(2) second time is compound: the material of third layer is PE, third layer and second layer compound tense, uses without molten
Agent glue, A glue and B glue solid content in solvent-free glue be 100%, A glue and B glue adding proportion
20:11, solidification temperature 36 DEG C, hardening time 48h.
Embodiment 2
A kind of multiple structure non-solvent new composite technique, processing step is:
(1) for the first time compound: the material of ground floor be Asia light, and the material of the second layer is PE, ground floor and the
Two layers with one-component glue solid content 45%, firming agent 3% is combined, and baking oven divides four sections of heating, heating-up temperature the
One section 45～55 DEG C, second segment 55～65 DEG C, the 3rd section 65～75 DEG C, the 4th section 75～85 DEG C；
(2) second time is compound: the material of third layer is CPP, third layer and second layer compound tense, uses nothing
Solvent glue, A glue in solvent-free glue and B glue solid content are 100%, and A glue and B glue add ratio
Example 100:53, solidification temperature 39 DEG C, hardening time 36h.
Embodiment 3
A kind of multiple structure non-solvent new composite technique, processing step is:
(1) the most compound: the material of ground floor is BOPP, and the material of the second layer is VMPET, first
Layer and the second layer are combined with one-component glue solid content 45%, firming agent 3%, and baking oven divides four sections of heating, heating
Temperature first paragraph 45～55 DEG C, second segment 55～65 DEG C, the 3rd section 65～75 DEG C, the 4th section 75～85 DEG C；
(2) second time is compound: the material of third layer is PE, third layer and second layer compound tense, uses without molten
Agent glue, A glue and B glue solid content in solvent-free glue be 100%, A glue and B glue adding proportion
100:57, solidification temperature 37 DEG C, hardening time 40h.
Embodiment 4
A kind of multiple structure non-solvent new composite technique, processing step is:
(1) for the first time compound: the material of ground floor is PET, and the material of the second layer is PET, ground floor and
The second layer is combined with one-component glue solid content 45%, firming agent 3%, and baking oven divides four sections of heating, heating-up temperature
First paragraph 45～55 DEG C, second segment 55～65 DEG C, the 3rd section 65～75 DEG C, the 4th section 75～85 DEG C；
(2) second time is compound: the material of third layer is CPP, third layer and second layer compound tense, uses nothing
Solvent glue, A glue in solvent-free glue and B glue solid content are 100%, and A glue and B glue add ratio
Example 25:14, solidification temperature 38 DEG C, hardening time 44h.
Above four embodiments of the present invention are described in detail, but described content has been only the preferable of the present invention
Embodiment, it is impossible to be considered the practical range for limiting the present invention.All according to the present patent application scope made equal
Deng change and improvement etc., within all should still belonging to the patent covering scope of the present invention.
Claims (4)
1. a multiple structure non-solvent new composite technique, it is characterised in that processing step is:
It is (1) the most compound: the material of ground floor is generally in BOPA, BOPP, PET or sub-light a kind of,
The material of the second layer is generally in PET, VMPET or PE one, ground floor and the second layer with one-component water
Glue solid content 45%, firming agent 3% is combined, and baking oven divides four sections of heating, heating-up temperature first paragraph 45～55 DEG C,
Second segment 55～65 DEG C, the 3rd section 65～75 DEG C, the 4th section 75～85 DEG C；
(2) second time is compound: the material of third layer is generally in PE or CPP one, third layer and second
Layer compound tense, uses solvent-free glue, and A glue and B glue solid content in solvent-free glue are 100%, A
Glue and B glue adding proportion 100:53～57, solidification temperature 36～39 DEG C, hardening time 36～48h.
Multiple structure non-solvent new composite technique the most according to claim 1, it is characterised in that described
Step (1) in baking oven divide four sections of methods heated all can use this kind in addition to decocting in water, steaming and decocting infrastructure product
Mode of heating.
Multiple structure non-solvent new composite technique the most according to claim 1, it is characterised in that step
(1) baking oven in divides four sections of optimum temperatures heated to be that first paragraph heats 50 DEG C, second segment heating-up temperature 60 DEG C,
3rd section of heating-up temperature 70 DEG C, the 4th section of heating-up temperature 80 DEG C.
Multiple structure non-solvent new composite technique the most according to claim 1, it is characterised in that step
(2) in, in solvent-free glue, the ratio of greater inequality of A glue and B glue adding proportion is 20:11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610205654.7A CN105856793A (en) | 2016-04-05 | 2016-04-05 | Novel multilayered structure non-solvent compounding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610205654.7A CN105856793A (en) | 2016-04-05 | 2016-04-05 | Novel multilayered structure non-solvent compounding process |
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| Publication Number | Publication Date |
|---|---|
| CN105856793A true CN105856793A (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610205654.7A Pending CN105856793A (en) | 2016-04-05 | 2016-04-05 | Novel multilayered structure non-solvent compounding process |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106626652A (en) * | 2016-12-02 | 2017-05-10 | 德施普科技发展温州有限公司 | Solvent-free composite PET/PE (Polyethylene Terephthalate/Polyethylene) film and preparation process thereof |
| CN107187129A (en) * | 2017-05-25 | 2017-09-22 | 杭州科能新材料科技有限公司 | It is highlighted to prevent dizzy film |
| CN114274630A (en) * | 2021-12-20 | 2022-04-05 | 四川省新都永志印务有限公司 | Composite packaging film and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102423929A (en) * | 2011-09-01 | 2012-04-25 | 江阴新奇特塑胶制品有限公司 | Solvent-free composite plastic film and composite technology thereof |
| CN103879125A (en) * | 2014-02-26 | 2014-06-25 | 成都市兴恒泰印务有限公司 | Solvent-free complex method of high temperature cooking complex films and bags and complex device thereof |
| CN104924716A (en) * | 2015-06-10 | 2015-09-23 | 无锡市方成彩印包装有限公司 | Compounding process and structure for high-temperature water boiling resistant multi-layer composite packing bag |
| CN104943335A (en) * | 2015-06-06 | 2015-09-30 | 无锡市方成彩印包装有限公司 | Solvent-free glue compounding technology for instant noodle packaging |
-
2016
- 2016-04-05 CN CN201610205654.7A patent/CN105856793A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102423929A (en) * | 2011-09-01 | 2012-04-25 | 江阴新奇特塑胶制品有限公司 | Solvent-free composite plastic film and composite technology thereof |
| CN103879125A (en) * | 2014-02-26 | 2014-06-25 | 成都市兴恒泰印务有限公司 | Solvent-free complex method of high temperature cooking complex films and bags and complex device thereof |
| CN104943335A (en) * | 2015-06-06 | 2015-09-30 | 无锡市方成彩印包装有限公司 | Solvent-free glue compounding technology for instant noodle packaging |
| CN104924716A (en) * | 2015-06-10 | 2015-09-23 | 无锡市方成彩印包装有限公司 | Compounding process and structure for high-temperature water boiling resistant multi-layer composite packing bag |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106626652A (en) * | 2016-12-02 | 2017-05-10 | 德施普科技发展温州有限公司 | Solvent-free composite PET/PE (Polyethylene Terephthalate/Polyethylene) film and preparation process thereof |
| CN106626652B (en) * | 2016-12-02 | 2018-07-24 | 德施普科技发展温州有限公司 | The solvent-free compound PET/PE films of one kind and its preparation process |
| CN107187129A (en) * | 2017-05-25 | 2017-09-22 | 杭州科能新材料科技有限公司 | It is highlighted to prevent dizzy film |
| CN107187129B (en) * | 2017-05-25 | 2019-01-25 | 杭州科能新材料科技有限公司 | It is highlighted to prevent dizzy film |
| CN114274630A (en) * | 2021-12-20 | 2022-04-05 | 四川省新都永志印务有限公司 | Composite packaging film and preparation method thereof |
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Application publication date: 20160817 |