CN104943335A - Solvent-free glue compounding technology for instant noodle packaging - Google Patents
Solvent-free glue compounding technology for instant noodle packaging Download PDFInfo
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- CN104943335A CN104943335A CN201510302744.3A CN201510302744A CN104943335A CN 104943335 A CN104943335 A CN 104943335A CN 201510302744 A CN201510302744 A CN 201510302744A CN 104943335 A CN104943335 A CN 104943335A
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- Prior art keywords
- solvent
- free glue
- glue
- parts
- seconds
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a solvent-free glue compounding technology for instant noodle packaging. The instant noodle package obtained by the solvent-free glue compounding technology comprises a BOPP film and a VMCPP film. A white foam substrate is compounded between the BOPP film and the VMCPP film by solvent-free glue, and in compounding, a coating ratio is 0.9-2.9g/m<2>. The solvent-free glue is prepared from 100 parts by weight of a NCO isocyanate group ingredient and 50-80 parts by weight of an OH hydroxyl ingredient by mixing. The NCO isocyanate group ingredient and the OH hydroxyl ingredient are mixed by a glue mixing pump at a temperature of 30-60 DEG C, and in mixing, in 5-15s, the ingredients are rotated by 15-50 rounds , go through a channel with length of 20cm and then are discharged. The solvent-free glue compounding technology for instant noodle packaging has a low production cost and high environmental protection property, prevents white points or white pots produced in compounding production, and improves production quality, peeling strength and aesthetic property.
Description
Technical field
The present invention relates to a kind of solvent-free glue combination process for instant noodles packaging.
Background technology
The many employings of the outer packaging bag of traditional printing packaging industry to instant noodles have the dry type composite packaging process of solvent, and often produce the cost of one square metre of packaging film at about 0.12 yuan, cost is higher, there is the shortcomings such as volatile solutes simultaneously, and the feature of environmental protection is lower, on the other hand, along with popular in printing packaging industry of solvent-free technology, increasing manufacturer starts to pay attention to solvent-free production technology, but solvent-free process in packages printing in process of production, because packaging film needs laminating production, in laminating production process, usually adopt foam as the substrate of hyaline membrane, when thus often there is justifying laminating production foam substrate, produce white point or hickie phenomenon, affect the quality of packaging film, peel strength is lower, and aesthetic property is poor, this phenomenon is in the field of business to be existed comparatively at large, puzzlement manufacturer, therefore urgently to be resolved hurrily.
Summary of the invention
The object of the invention is to the problem overcoming above-mentioned prior art, a kind of solvent-free glue combination process for instant noodles packaging is provided, its production cost is lower, the feature of environmental protection is higher, the generation of white point or hickie phenomenon in laminating production process can be avoided simultaneously, improve the quality of production, improve peel strength, and aesthetic property is higher.
The object of the invention is to be achieved through the following technical solutions:
For a solvent-free glue combination process for instant noodles packaging, comprise BOPP film and VMCPP film, adopt solvent-free glue to be compounded with foam substrate between described BOPP film and described VMCPP film, compound tense coating content is 0.9g-2.9g every square metre,
Wherein, described solvent-free glue adopts the NCO NCO component of 100 parts and the OH hydroxy component of 50-80 part to be mixed by weight ratio, described NCO NCO component and described OH hydroxy component adopt mixed glue pump mixing, mixed process is at 30-60 DEG C, to turn and by the passage of 20cm length to complete 15-60 in the time of 5 seconds to 15 seconds, then plastic emitting.
Further, glue-spread adopts 1.5g every square metre, and described OH hydroxy component is 60 parts, at 45 DEG C, complete 40 turns by described passage in 10 seconds.
Alternatively, glue-spread adopts 0.9g every square metre, and described OH hydroxy component is 50 parts, at 30 DEG C, complete 15 turns by described passage in 5 seconds.
Alternatively, glue-spread adopts 2.9g every square metre, and described OH hydroxy component is 80 parts, at 60 DEG C, complete 60 turns by described passage in 15 seconds.
A kind of solvent-free glue combination process for instant noodles packaging of the present invention, comprise BOPP film and VMCPP film, solvent-free glue is adopted to be compounded with foam substrate between described BOPP film and described VMCPP film, compound tense coating content is 0.9g-2.9g every square metre, wherein, described solvent-free glue adopts the NCO NCO component of 100 parts and the OH hydroxy component of 50-80 part to be mixed by weight ratio, described NCO NCO component and described OH hydroxy component adopt mixed glue pump mixing, mixed process is at 30-60 DEG C, to turn and by the passage of 20cm length to complete 15-60 in the time of 5 seconds to 15 seconds, then plastic emitting.This solvent-free glue combination process for instant noodles packaging, its production cost is lower, and the feature of environmental protection is higher, avoids the generation of white point or hickie phenomenon in laminating production process simultaneously, improves the quality of production, improve peel strength, and aesthetic property is higher.
Detailed description of the invention
According to embodiment, the present invention is described in further detail below.
A kind of solvent-free glue combination process for instant noodles packaging described in the embodiment of the present invention, comprise BOPP film and VMCPP film, adopt solvent-free glue to be compounded with foam substrate between described BOPP film and described VMCPP film, compound tense coating content is 0.9g-2.9g every square metre
Wherein, described solvent-free glue adopts the NCO NCO component of 100 parts and the OH hydroxy component of 50-80 part to be mixed by weight ratio, described NCO NCO component and described OH hydroxy component adopt mixed glue pump mixing, mixed process is at 30-60 DEG C, to turn and by the passage of 20cm length to complete 15-60 in the time of 5 seconds to 15 seconds, then plastic emitting.
Embodiment one: wherein, glue-spread adopts 1.5g every square metre, and described OH hydroxy component is 60 parts, at 45 DEG C, complete 40 turns by described passage in 10 seconds.
Embodiment two: glue-spread adopts 0.9g every square metre, and described OH hydroxy component is 50 parts, completes 15 turns by described passage at 30 DEG C in 5 seconds.
Embodiment three: glue-spread adopts 2.9g every square metre, and described OH hydroxy component is 80 parts, completes 60 turns by described passage at 60 DEG C in 15 seconds.
The foregoing is only explanation embodiments of the present invention; be not limited to the present invention, for a person skilled in the art, within the spirit and principles in the present invention all; any amendment of doing, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. the solvent-free glue combination process for instant noodles packaging, it is characterized in that, comprise BOPP film and VMCPP film, between described BOPP film and described VMCPP film, adopt solvent-free glue to be compounded with foam substrate, compound tense coating content is 0.9g-2.9g every square metre
Wherein, described solvent-free glue adopts the NCO NCO component of 100 parts and the OH hydroxy component of 50-80 part to be mixed by weight ratio, described NCO NCO component and described OH hydroxy component adopt mixed glue pump mixing, mixed process is at 30-60 DEG C, to turn and by the passage of 20cm length to complete 15-60 in the time of 5 seconds to 15 seconds, then plastic emitting.
2. as claimed in claim 1 for the solvent-free glue combination process of instant noodles packaging, it is characterized in that, glue-spread adopts 1.5g every square metre, and described OH hydroxy component is 60 parts, at 45 DEG C, complete 40 turns by described passage in 10 seconds.
3. as claimed in claim 1 for the solvent-free glue combination process of instant noodles packaging, it is characterized in that, glue-spread adopts 0.9g every square metre, and described OH hydroxy component is 50 parts, at 30 DEG C, complete 15 turns by described passage in 5 seconds.
4. as claimed in claim 1 for the solvent-free glue combination process of instant noodles packaging, it is characterized in that, glue-spread adopts 2.9g every square metre, and described OH hydroxy component is 80 parts, at 60 DEG C, complete 60 turns by described passage in 15 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510302744.3A CN104943335A (en) | 2015-06-06 | 2015-06-06 | Solvent-free glue compounding technology for instant noodle packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510302744.3A CN104943335A (en) | 2015-06-06 | 2015-06-06 | Solvent-free glue compounding technology for instant noodle packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104943335A true CN104943335A (en) | 2015-09-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510302744.3A Pending CN104943335A (en) | 2015-06-06 | 2015-06-06 | Solvent-free glue compounding technology for instant noodle packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104943335A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105219338A (en) * | 2015-10-16 | 2016-01-06 | 无锡市方成彩印包装有限公司 | A kind of composite film for foods package and complete processing |
| CN105856793A (en) * | 2016-04-05 | 2016-08-17 | 天津市宝德包装有限公司 | Novel multilayered structure non-solvent compounding process |
| CN106240032A (en) * | 2016-07-29 | 2016-12-21 | 诚德科技股份有限公司 | A kind of PET/PA/CPP laminated film and preparation technology thereof and application |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2195527Y (en) * | 1994-03-29 | 1995-04-26 | 戈晓宁 | Square, folding box for convenient noodles |
| CN101503611A (en) * | 2009-03-10 | 2009-08-12 | 中山大学 | Solvent-free polyurethane adhesive for compound film |
| CN101544880A (en) * | 2009-03-12 | 2009-09-30 | 中山市康和化工有限公司 | Adhesive for soft package compound and preparation method thereof |
| CN101792650A (en) * | 2010-02-08 | 2010-08-04 | 广东国望精细化学品有限公司 | Solvent-free polyurethane adhesive for flexible package |
| CN102559125A (en) * | 2011-12-02 | 2012-07-11 | 美邦（黄山）胶业有限公司 | Degradable solvent free polyurethane adhesive and preparation and use method thereof |
| CN104071480A (en) * | 2013-03-28 | 2014-10-01 | 天津市盛之和食品有限公司 | Packing box for instant mixed noodles |
-
2015
- 2015-06-06 CN CN201510302744.3A patent/CN104943335A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2195527Y (en) * | 1994-03-29 | 1995-04-26 | 戈晓宁 | Square, folding box for convenient noodles |
| CN101503611A (en) * | 2009-03-10 | 2009-08-12 | 中山大学 | Solvent-free polyurethane adhesive for compound film |
| CN101544880A (en) * | 2009-03-12 | 2009-09-30 | 中山市康和化工有限公司 | Adhesive for soft package compound and preparation method thereof |
| CN101792650A (en) * | 2010-02-08 | 2010-08-04 | 广东国望精细化学品有限公司 | Solvent-free polyurethane adhesive for flexible package |
| CN102559125A (en) * | 2011-12-02 | 2012-07-11 | 美邦（黄山）胶业有限公司 | Degradable solvent free polyurethane adhesive and preparation and use method thereof |
| CN104071480A (en) * | 2013-03-28 | 2014-10-01 | 天津市盛之和食品有限公司 | Packing box for instant mixed noodles |
Non-Patent Citations (1)
| Title |
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| 陈昌杰主编: "《绿色包装技术及其典型案例》", 31 January 2008, 化学工业出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105219338A (en) * | 2015-10-16 | 2016-01-06 | 无锡市方成彩印包装有限公司 | A kind of composite film for foods package and complete processing |
| CN105856793A (en) * | 2016-04-05 | 2016-08-17 | 天津市宝德包装有限公司 | Novel multilayered structure non-solvent compounding process |
| CN106240032A (en) * | 2016-07-29 | 2016-12-21 | 诚德科技股份有限公司 | A kind of PET/PA/CPP laminated film and preparation technology thereof and application |
| CN106240032B (en) * | 2016-07-29 | 2018-03-23 | 诚德科技股份有限公司 | A kind of PET/PA/CPP laminated films and its preparation technology and application |
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Application publication date: 20150930 |