CN105856553A - Three-dimensional semiconductor laser plastic welding system - Google Patents
Three-dimensional semiconductor laser plastic welding system Download PDFInfo
- Publication number
- CN105856553A CN105856553A CN201610402715.9A CN201610402715A CN105856553A CN 105856553 A CN105856553 A CN 105856553A CN 201610402715 A CN201610402715 A CN 201610402715A CN 105856553 A CN105856553 A CN 105856553A
- Authority
- CN
- China
- Prior art keywords
- laser
- motion
- laser head
- slide block
- guide rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004023 plastic welding Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 230000033001 locomotion Effects 0.000 claims abstract description 56
- 238000003466 welding Methods 0.000 claims abstract description 43
- 230000002441 reversible effect Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 12
- 239000013307 optical fiber Substances 0.000 claims description 12
- 241000931526 Acer campestre Species 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000013519 translation Methods 0.000 claims description 3
- 230000008450 motivation Effects 0.000 claims 1
- 230000026676 system process Effects 0.000 claims 1
- 239000004033 plastic Substances 0.000 abstract description 10
- 229920003023 plastic Polymers 0.000 abstract description 10
- 238000003754 machining Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000002835 absorbance Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000004886 head movement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
- B29C65/1641—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding making use of a reflector on the opposite side, e.g. a polished mandrel or a mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
- B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/301—Three-dimensional joints, i.e. the joined area being substantially non-flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Robotics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laser Beam Processing (AREA)
Abstract
A three-dimensional semiconductor laser plastic welding system comprises an upper computer, a semiconductor laser system, a single-chip microcomputer control system, a laser head motion mechanism making a laser head do three-dimensional translational motion, a reflector mechanism making a reflector do two-dimensional translational motion in an X plane and a Y plane, and a rotatable workpiece table making a workpiece rotate clockwise or counterclockwise. The upper computer emits a motion signal to the laser head motion mechanism through the single-chip microcomputer control system so as to control motion of the laser head, the reflector and the workpiece. The upper computer emits a laser on/off signal to the semiconductor laser system through the single-chip microcomputer control system so as to control on/off of lasers and realize three-dimensional welding on the workpiece. According to the three-dimensional semiconductor laser plastic welding system, the laser system and the motion system are integrated, meanwhile, high-efficiency high-quality three-dimensional laser welding of different plastic devices can be realized, and the problems that current laser plastic welding equipment adopted commonly is small in machining width and low in machining efficiency are solved.
Description
Technical field
The present invention relates to laser transmission welding field, particularly to a kind of 3 D semiconductor laser plastic weldering
Welding system, the laser transmission welding between thermoplastic.
Background technology
Laser welding technology is widely used at the manufacture field of metal material, the performance of its excellence already by
Each application industry is accepted, and achievement is notable.Along with environmental protection theory is in global industry produces
Implementing and consideration in terms of production cost control, plastics are as the renewable non-gold of a kind of excellent performance
Belong to material, increasingly applied in every profession and trade.
Laser plastic welding occurs in 20 century 70s the earliest, but due to somewhat expensive, it is impossible to
Compete mutually with conventional plastic solder technology, therefore slower development.But from the mid-90 in 20th century
Starting, owing to the cost of equipment required for laser welding technology declines, this technology is gradually by people's
Extensive welcome.
Laser plastic welding utilizes transmission welding principle, and selection iraser is as welding heat source, typically
Based on the laser of 800nm-1100nm wave band, the laser of this wave band is welding for major part
For transparent or coloured hot melting plastic, absorbance is the lowest, and laser is through energy loss during these materials very
Few.The materials at two layers up and down being superimposed during welding needs to meet certain requirement；And subsurface material
As heat effect district, need laser is had higher absorbance.Just meet above two condition
Can ensure that laser can arrive the surface of subsurface material with less energy loss through upper layer of material, by
Having higher absorbance in subsurface material, laser is absorbed at the faying face of materials at two layers and produces
, under suitable pressure effect, there is after polymerization, so cold in heat so that the plastic molting at this
But up and down form weld seam between materials at two layers again after and make them link together.
The most commonly used laser plastic welding equipment is lathe class formation, and the execution of laser trace is led to
Each axle crossing lathe realizes, and its working (machining) efficiency is relatively low.By data-searching, retrieve and apply for
Patent documentation,
Chinese Patent Application No. 201410846200.9 discloses a kind of device, and it comes with mechanical arm
Weld.But plastics part planar can only be welded, it is impossible to realize on three dimensions
Welding.And the welding of large format is cannot be carried out with mechanical arm.
Chinese Patent Application No. 201410066447.5 discloses similar three-dimensional laser plastic welding
Device, but the while of this patent being make optical fiber head in ZY face and XY face by reversible turntable
Doing the rotation of 360 degree, thus realize laser head movement in z-direction, this is in Practical Project
Can not be implemented.
Summary of the invention
It is an object of the invention to design a kind of 3 D semiconductor laser plastic welding system, by laser instrument
System and motor system are integrated into one, the most also can realize the different high efficiency of plastic device, height
The three-dimensional laser welding of quality, solves the processing breadth of the most commonly used laser plastic welding equipment
Little, that working (machining) efficiency is low problem.
For achieving the above object, the technical scheme is that
A kind of 3 D semiconductor laser plastic welding system, including, host computer, semiconductor laser system
System, single-chip computer control system；It also includes the laser head fitness machine allowing laser head do D translation motion
Structure, make reflecting mirror do in X, Y plane two-dimension translational motion mirror body and make workpiece up time
Pin or the rotatable work stage rotated counterclockwise；Host computer is by sending fortune to single-chip computer control system
Dynamic signal is to laser head motion, thus controls the motion of laser head, reflecting mirror and workpiece；Upper
Machine by sending the signal of laser switch to single-chip computer control system to described Laser Diode System,
Thus control the switch of laser；Laser head, reflecting mirror and work stage three's routing motion, it is achieved to work
The three-dimensional welding of part.
Further, 3 D semiconductor laser plastic welding system of the present invention, including, work
Platform；Laser head motion, is arranged at the side of described workbench；Including, two Y-directions are led
Rail, is set in parallel on described workbench by two Y-direction columns respectively, on this two Y-directions guide rail
If first, second slide block and corresponding driving means；A piece X-direction guide rail, its two ends connect respectively
Connect first, second slide block on described two Y-direction guide rails, make X-direction guide rail lead with Y-direction
Rail is vertical；The 3rd slide block and corresponding driving means is set on this X-direction guide rail；Two Z-direction columns,
Being arranged at the upper and lower end face of described 3rd slide block, Z-direction column is vertical with X-direction guide rail；Z-direction
Guide rail, its two ends are connected by the outer end of a contiguous block and two Z-direction columns respectively, make Z side
Direction guiding rail is vertical with X-direction guide rail；Laser head fixture and corresponding driving means, be slidedly arranged on described Z
On traversing guide；Mirror body, is arranged at the opposite side of described workbench；Including, two Y sides
To track, it is set in parallel on workbench, this two Y-directions track arranges the four, the 5th slide blocks
And corresponding driving means；X-direction track, its two ends connect described four, the 5th slide blocks, with Y
Direction track is vertical；The 6th slide block and corresponding driving means is set on X-direction track；Reflector mount,
It is arranged on described 6th slide block；Reflecting mirror, is arranged on described reflector mount, reflecting mirror and level
Direction is 45 degree of angles；Rotatable work stage and control its reversible electric machine rotated, is arranged at described
The workbench central authorities of laser head motion；Laser Diode System, including laser head, this laser
Head is installed on described laser head fixture；The described corresponding driving means of each slide block and reversible electric machine are respectively
It is electrically connected with single-chip computer control system.
Preferably, the described corresponding driving means of each slide block includes servomotor, pulley and is connected to
Transmission band on Liang Zhe, described slide block is connected on transmission band.
Further, described single-chip computer control system includes single-chip microcomputer gripper shoe, insulated column, single-chip microcomputer
And peripheral circuit；Described single-chip microcomputer gripper shoe is fixing on the table；Described single-chip microcomputer is by isolation
Post is fixed in single-chip microcomputer gripper shoe；The control of laser plastic welding is realized by host computer, wherein,
Host computer presets the cephalomotor track of laser, is then communicated in single-chip microcomputer, through single-chip microcomputer control
After system processed processes, control the corresponding driving means of each slide block and the motion of reversible electric machine, so that
Laser head is according to set orbiting motion.
Preferably, described Laser Diode System is the laser of the LASER Light Source that an output collimates
Device system, the collimated light of output focuses on work pieces process face by described laser head.
Preferably, described Laser Diode System is the laser of the LASER Light Source that an optical fiber exports
Device system, optical fiber Output of laser focuses on work pieces process face by described laser head.
When needs switch laser when, host computer sends signal to single-chip microcomputer, processes through relay
After reach Laser Diode System, thus realize the on-off control to laser instrument.Described quasiconductor swashs
The laser of light device system output is to be transmitted by optical fiber, passes through optical fiber from the laser of laser instrument output
After transmission, it is adapted to distance working environment.Laser at optical fiber connector collimates through collimating lens,
And focus on work pieces process face eventually through described laser head.
3 D semiconductor laser plastic welding system of the present invention, laser head fixture is at slide block and servomotor
All can move in the X, Y, Z direction under control.When side surface of workpiece is welded by needs, with
Horizontal direction is that the reflecting mirror at 45 degree of angles can ensure that laser straight down is penetrated in work through reflective vertical
On the side of part.Reflecting mirror can do the motion of X, Y-direction under the control of servomotor.The most anti-
Penetrate mirror movement in the X direction plus the movement in z-direction of laser head fixture can coordinate for
Focusing.Workpiece turntable can rotate under the control of reversible electric machine, to ensure the side of workpiece
Can weld completely.I.e. achieve the three-dimensional welding to plastics part.Described servomotor and reversible electricity
Machine F is connected with single-chip computer control system respectively, is finally controlled by host computer.
Plastic Welding system of the present invention can coordinate workpiece motion s reflecting mirror X-axis when welding side
Or Motion laser head Z axis is focused.Wherein reflecting mirror and laser head emergent light angle are 45 degree.
When welding bottom workpiece as required, thus it is possible to vary reflecting mirror and the angle of laser head emergent light, allow
Laser head, reflecting mirror and workbench three's routing motion can complete the welding bottom workpiece.
Laser head fixture is connected with Z-direction guide rail, can slide on.Laser head is fixed on laser
On fixture head.X-direction guide rail, Y-direction guide rail, Z-direction guide rail is controlled respectively by servomotor
On slide block movement, make laser head fixture can move upward in tri-sides of X, Y, Z.
Compared with prior art, beneficial effects of the present invention:
1. present system is by the combination of reflecting mirror with two-dimension moving platform, it is achieved to workpiece significantly
Degree three-dimensional welding.
2. laser system is combined by present system with motor system, it is achieved PC control swashs
The function of photoswitch.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the embodiment of the present invention one；
Fig. 2 is the top view of Fig. 1；
Fig. 3 is the structural representation of laser head motion in the embodiment of the present invention one；
Fig. 4 is the structural representation of laser head motion in the embodiment of the present invention one；
Fig. 5 is the schematic diagram of reflecting mirror two dimensional motion structure in the embodiment of the present invention one；
Fig. 6 is the three-dimensional motion system structural representation of the embodiment of the present invention two；
Fig. 7 is the schematic diagram of laser head motion in the embodiment of the present invention two；
Fig. 8 is the schematic diagram of reflecting mirror two dimensional motion structure in the embodiment of the present invention two；
Fig. 9 is the bottom surface welding schematic diagram of the embodiment of the present invention.
Detailed description of the invention
See Fig. 1～Fig. 9, a kind of 3 D semiconductor laser plastic welding system of the present invention, including,
Host computer 1, Laser Diode System 2, single-chip computer control system 3；It also includes allowing laser head
Do the laser head motion 4 of D translation motion, make reflecting mirror do two-dimentional putting down in X, Y plane
The mirror body 5 of shifting movement and make workpiece rotatable work stage clockwise or counterclockwise
6；Host computer by sending motor message to laser head motion to single-chip computer control system, thus
Control laser head, reflecting mirror and the motion of workpiece；Host computer is sharp by sending to single-chip computer control system
The signal of photoswitch is to described Laser Diode System, thus controls the switch of laser；Laser head,
Reflecting mirror and work stage three's routing motion, ensure to realize the three-dimensional welding to workpiece.
Further, described 3 D semiconductor laser plastic welding system, it includes,
Workbench 100；
Laser head motion 4, is arranged at the side of described workbench 100；Including,
Two Y-direction guide rails 401,401 ', parallel by two Y-direction columns 402,402 ' respectively
It is arranged on described workbench 100, this two Y-directions guide rail 401,401 ' sets first, second
Slide block 403,404 and corresponding driving means 405,405 '；
A piece X-direction guide rail 406, its two ends connect described two Y-direction guide rails 401,401 ' respectively
On first, second slide block 403,404, make X-direction guide rail 406 and Y-direction guide rail 401,
401 ' is vertical；The 3rd slide block 407 and corresponding driving means 408 is set on this X-direction guide rail 406；
Two Z-direction columns 409, are arranged at the upper and lower end face of described 3rd slide block 407, and Z-direction is stood
Post 409 is vertical with X-direction guide rail 406；
Z-direction guide rail 410, its two ends are respectively by contiguous block 411 and two Z-direction columns 409
Outer end connect, make Z-direction guide rail 410 vertical with X-direction guide rail 406；
Laser head fixture 412 and corresponding driving means 413, be slidedly arranged on described Z-direction guide rail 410
On；
Mirror body 5, is arranged at the opposite side of described workbench 100；Including,
Two Y-direction tracks 51,51 ', are set in parallel on workbench 100, this two Y-directions rail
Four-slider the 52, the 5th slide block 53 and corresponding driving means 54,54 ' are set on road 51,51 '；
X-direction track 55, its two ends connect described four, the 5th slide blocks 52,53, with Y-direction
Track 51,51 ' is vertical；The 6th slide block 56 and corresponding driving means is set on X-direction track 55
57；
Reflector mount 58, is arranged on described 6th slide block 56；
Reflecting mirror 59, is arranged on described reflector mount 58, and reflecting mirror 59 and horizontal direction are 45
Degree angle；
Rotatable work stage 6 and control its rotate reversible electric machine 61, be arranged at described laser head
Workbench 100 central authorities of motion 4；
Described Laser Diode System 2, including laser head 21, this laser head 21 is installed on described
On laser head fixture 412；The described corresponding driving means of each slide block and reversible electric machine are electrically connected with
Single-chip computer control system 3.
In the present embodiment, described Laser Diode System 2 also include power supply 22,
MOSFET23, diverter 24, control power supply 25, refrigeration power supply 26, L-type laser instrument 27.
Host computer by sending the signal of laser switch to single-chip computer control system, and combines potentiometer
With drive power supply by this signal on described Laser Diode System, thus control the switch of laser；
Laser head, reflecting mirror and work stage three's routing motion, it is achieved the three-dimensional welding to workpiece 200.
Seeing Fig. 6, the first corresponding driving means of slide block 403 405 of the present invention is (sliding with first
As a example by block 403, lower same) include servomotor 4051, pulley 4052 and be connected on both
Transmission band 4053, described first slide block 403 is connected on transmission band 4053.
Further, described single-chip computer control system 3 include single-chip microcomputer gripper shoe 31, insulated column 32,
Single-chip microcomputer 33 and peripheral circuit (relay 34, driving power supply 35) thereof；Described single-chip microcomputer gripper shoe
31 are fixed on workbench 100；Described single-chip microcomputer 33 is fixed on single-chip microcomputer by insulated column 32 and props up
On fagging 31；Realized the control of laser plastic welding by host computer 1, wherein, host computer 1 is pre-
First set the cephalomotor track of laser, be then communicated in single-chip microcomputer 33, through Single-chip Controlling system
After system 3 process, control the corresponding driving means of each slide block and the motion of reversible electric machine, so that swashing
Shaven head 21 is according to set orbiting motion.
Host computer by sending the signal of laser switch to Single Chip Microcomputer (SCM) system, and combine potentiometer and drive
Galvanic electricity source is by this signal to described Laser Diode System, thus controls the switch of laser.
Preferably, described Laser Diode System is the laser of the LASER Light Source that an output collimates
Device system, the collimated light of output focuses on work pieces process face by described laser head.
Preferably, described Laser Diode System is the laser of the LASER Light Source that an optical fiber exports
Device system, optical fiber Output of laser focuses on work pieces process face by described laser head.
When needs switch laser when, host computer sends signal to single-chip microcomputer, processes through relay
After reach Laser Diode System, thus realize the on-off control to laser instrument.Described quasiconductor swashs
The laser of light device system output is to be transmitted by optical fiber, passes through optical fiber from the laser of laser instrument output
After transmission, it is adapted to distance working environment.Laser at optical fiber connector collimates through collimating lens,
And focus on work pieces process face eventually through described laser head.
3 D semiconductor laser plastic welding system of the present invention, laser head fixture is at each slide block and corresponding
Move in the X, Y, Z direction under the control of servomotor.When side surface of workpiece is welded by needs
Time, can ensure that laser straight down is through reflective vertical with the reflecting mirror that horizontal direction is 45 degree of angles
Penetrate on the side of workpiece.Reflecting mirror can do the motion of X, Y-direction under the control of servomotor；
Reflecting mirror movement in the X direction simultaneously can be joined plus the movement in z-direction of laser head fixture
Share and focus.Workpiece turntable can rotate under the control of reversible electric machine, to ensure workpiece
Side can weld completely.I.e. achieve the three-dimensional welding to plastics part.Described servomotor and
Reversible electric machine is connected with single-chip computer control system respectively, is finally controlled by host computer.In host computer
The figure set, by double end USB transmission to single-chip computer control system, controls the fortune of laser head
Dynamic track.Optical Maser System is combined by the present invention with motor system, disclosure satisfy that laser simultaneously
All the time it is perpendicular to workpiece machining surface, and the significantly three-dimensional welding to workpiece can be completed.
There is USB interface on single-chip microcomputer, be connected with host computer by a double end USB line.Upper
In machine, the figure needing welding is imported, and sets speed of welding, be then input to single-chip microcomputer control
System processed processes.This single-chip computer control system mainly has two aspect functions, and on the one hand function is
Control servomotor and reversible electric machine controls laser head motion in three dimensions, the fortune of reflecting mirror
Move and the motion of work stage；On the other hand it is the switch controlling laser.
When welding workpiece surface, have only to weld in X/Y plane according to welding track
Time, single-chip microcomputer output signal can make reflecting mirror move to the leftmost side of Y-direction guide rail to the left, to protect
Card does not affect welding process；Control laser head to move on X/Y plane simultaneously.
When welding workpiece side surface, according to welding track needs, single-chip microcomputer output signal can make reflection
Mirror moves right, and makes laser head move in the Z-axis direction according to required welding track simultaneously.Wherein
Reflecting mirror and horizontal plane all the time in 45 degree of angles, with this ensure laser head when being on vertical direction,
The laser of output can vertically be penetrated on workpiece surface to be welded.Meanwhile, single-chip microcomputer can be according to welding
The needs of track, control reversible electric machine, so that work stage carries out rotarily driving the rotation of workpiece, come
Coordinate the whole side ensureing welding workpiece.Along with the change of welding track, single-chip microcomputer can control reflection
The movement in the Z-axis direction of mirror mobile cooperation laser head in the X-axis direction is focused or protects
Demonstrate,prove constant defocusing amount, thus ensure welding effect.When welding track is downward, single-chip microcomputer can control
Laser head moves downward, and control reflecting mirror is to left movement simultaneously, and such guarantee focuses on or makes out of focus
Measure constant.
When welding workpiece bottom, according to welding track needs, reflecting mirror and laser emitting light can be changed
Angle so that emergent light straight down changes direction and beats on workpiece bottom (see Fig. 9).
Owing to now laser is not vertically to beat at surface of the work, therefore spot size can change, and now needs
Defocusing amount to be adjusted or replacing camera lens ensure the unified size of weld seam.
The switch wherein controlling laser is achieved in that
When opening laser, then need two pin conductings of LASER ENABLE, otherwise, only
The two of LASER ENABLE pin need to be disconnected；Meanwhile, according to the welding rail set
Mark, needs the place that laser is opened, can be by wherein two lead-in wires defeated on PC control single-chip microcomputer
Going out pressure reduction is 5V, otherwise, the output voltage of these two lead-in wires is 0.Therefore, by these two lead-in wires
Receive on the relay of a 5V, then receive those two pins on LASER ENABLE.Just
Can realize being controlled the function of laser switch by host computer.
In the present embodiment, described driving power supply, relay, its objective is motor system and laser
System combination is together.Described driving power supply provides the voltage of 5V and 24V simultaneously；Relay is
5V relay.Described single-chip computer control system self needs the supply voltage of 24V, single-chip microcomputer be by
Driving power supply is powered；Meanwhile, laser opened by needs when, single-chip microcomputer one interface is drawn by 5V output
As little as 0V.Additionally, another interface of single-chip microcomputer is always maintained at the voltage output of 5V.Accordingly, profit
By this phenomenon, the two interface is received on the relay of 5V, then receive the LASER on laser instrument
ENABLE interface, realizes being controlled the function of laser switch by host computer.
During Optical Maser System Output of laser, LASER ENABLE interface thereon there are two pins
It is to need short circuit, otherwise, two interfaces are in off state.
The present invention can carry out the three-dimensional welding in larger amplitude face, and maximum operating range is 5m*5m*5m,
Maximum sweep rate is 200mm/s.
Part that the present invention does not relate to is the most same as the prior art maybe can use prior art to be realized.
In the case of without departing from the principle of the invention, any amendment made, the substitute mode such as simplification,
Within being included in protection scope of the present invention.
Claims (6)
1. a 3 D semiconductor laser plastic welding system, including, host computer, semiconductor laser system
System, single-chip computer control system；It is characterized in that, also include allowing laser head do D translation motion
Laser head motion, make reflecting mirror do in X, Y plane two-dimension translational motion reflection
Illuminating apparatus structure and make workpiece rotatable work stage clockwise or counterclockwise；Host computer passes through
Send motor message to laser head motion to single-chip computer control system, thus control laser head,
Reflecting mirror and the motion of workpiece；Host computer is by sending laser switch to single-chip computer control system
Signal is to described Laser Diode System, thus controls the switch of laser；Laser head, reflection
Mirror and work stage three's routing motion, it is achieved the three-dimensional welding to workpiece.
2. 3 D semiconductor laser plastic welding system as claimed in claim 1, it is characterised in that bag
Include,
Workbench；
Described laser head motion, is arranged at the side of described workbench；Including,
Two Y-direction guide rails, are set in parallel in described work by two Y-direction columns respectively
On platform, this two Y-directions guide rail sets first, second slide block and corresponding driving means；
A piece X-direction guide rail, its two ends connect on described two Y-direction guide rails respectively
First, second slide block, makes X-direction guide rail vertical with Y-direction guide rail；This X-direction is led
The 3rd slide block and corresponding driving means is set on rail；
Two Z-direction columns, are arranged at the upper and lower end face of described 3rd slide block, and Z-direction is stood
Post is vertical with X-direction guide rail；
Z-direction guide rail, outside its two ends are respectively by a contiguous block and two Z-direction columns
End connects, and makes Z-direction guide rail vertical with X-direction guide rail；
Laser head fixture and corresponding driving means, be slidedly arranged on described Z-direction guide rail；
Mirror body, is arranged at the opposite side of described workbench；Including,
Two Y-direction tracks, are set in parallel on workbench, and this two Y-directions track sets
Put the four, the 5th slide blocks and corresponding driving means；
X-direction track, its two ends connect described four, the 5th slide blocks, with Y-direction rail
Road is vertical；The 6th slide block and corresponding driving means is set on X-direction track；
Reflector mount, is arranged on described 6th slide block；
Reflecting mirror, is arranged on described reflector mount, and reflecting mirror and horizontal direction are 45 degree
Angle；
Rotatable work stage and control its rotate reversible electric machine, be arranged at described laser head fortune
The workbench central authorities of motivation structure；
Laser Diode System, including laser head, this laser head is installed on described laser head-clamp
On tool；
The described corresponding driving means of each slide block and reversible electric machine are electrically connected with Single-chip Controlling
System.
3. 3 D semiconductor laser plastic welding system as claimed in claim 1, it is characterised in that institute
State single-chip computer control system and include single-chip microcomputer gripper shoe, insulated column, single-chip microcomputer and peripheral circuit thereof；
Described single-chip microcomputer gripper shoe is fixing on the table；Described single-chip microcomputer is fixed on list by insulated column
In sheet machine gripper shoe；The control of laser plastic welding, wherein, host computer is realized by host computer
Preset the cephalomotor track of laser, be then communicated in single-chip microcomputer, through Single-chip Controlling
After system processes, control the corresponding driving means of each slide block and the motion of reversible electric machine, thus
Make laser head according to set orbiting motion.
4. 3 D semiconductor laser plastic welding system as claimed in claim 2 or claim 3, it is characterised in that
The described corresponding driving means of each slide block includes servomotor, pulley and is connected on both
Transmission band, described slide block is connected on transmission band.
5. 3 D semiconductor laser plastic welding system as claimed in claim 1 or 2, it is characterised in that
Described Laser Diode System is the Optical Maser System of the LASER Light Source of an exportable collimation,
The collimated light of output focuses on work pieces process face by described laser head.
6. 3 D semiconductor laser plastic welding system as claimed in claim 1 or 2, it is characterised in that
Described Laser Diode System is the Optical Maser System of the LASER Light Source of an optical fiber output, light
Fine Output of laser focuses on work pieces process face by described laser head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610402715.9A CN105856553B (en) | 2016-06-08 | 2016-06-08 | A kind of 3 D semiconductor laser plastic welding system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610402715.9A CN105856553B (en) | 2016-06-08 | 2016-06-08 | A kind of 3 D semiconductor laser plastic welding system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105856553A true CN105856553A (en) | 2016-08-17 |
| CN105856553B CN105856553B (en) | 2018-12-04 |
Family
ID=56677359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610402715.9A Active CN105856553B (en) | 2016-06-08 | 2016-06-08 | A kind of 3 D semiconductor laser plastic welding system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105856553B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106273415A (en) * | 2016-08-19 | 2017-01-04 | 万国强 | A kind of plastics laser-beam welding machine |
| CN107225330A (en) * | 2017-07-19 | 2017-10-03 | 云南电网有限责任公司电力科学研究院 | A kind of high voltage alive equipment laser rust-removing device |
| CN109367028A (en) * | 2018-10-15 | 2019-02-22 | 武汉博联特科技有限公司 | A kind of laser soldering automatic processing apparatus for plastics welding |
| CN111061302A (en) * | 2018-10-17 | 2020-04-24 | 杨斌堂 | Displacement structure, control method thereof and computer readable storage medium |
| CN112828467A (en) * | 2020-12-29 | 2021-05-25 | 孙永超 | Intelligent laser spot welding equipment for chip processing and chip processing technology |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05131282A (en) * | 1991-11-11 | 1993-05-28 | Amada Co Ltd | Method and device for laser beam welding |
| CN201164931Y (en) * | 2008-03-14 | 2008-12-17 | 中国科学院上海光学精密机械研究所 | Numerical control radiator laser welding machine |
| CN101342637A (en) * | 2008-03-05 | 2009-01-14 | 上海海事大学 | Multi-shaft, numerical control, double-workbench laser processing system |
| CN205705288U (en) * | 2016-06-08 | 2016-11-23 | 嘉兴九硕激光科技有限公司 | A kind of 3 D semiconductor laser plastic welding system |
-
2016
- 2016-06-08 CN CN201610402715.9A patent/CN105856553B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05131282A (en) * | 1991-11-11 | 1993-05-28 | Amada Co Ltd | Method and device for laser beam welding |
| CN101342637A (en) * | 2008-03-05 | 2009-01-14 | 上海海事大学 | Multi-shaft, numerical control, double-workbench laser processing system |
| CN201164931Y (en) * | 2008-03-14 | 2008-12-17 | 中国科学院上海光学精密机械研究所 | Numerical control radiator laser welding machine |
| CN205705288U (en) * | 2016-06-08 | 2016-11-23 | 嘉兴九硕激光科技有限公司 | A kind of 3 D semiconductor laser plastic welding system |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106273415A (en) * | 2016-08-19 | 2017-01-04 | 万国强 | A kind of plastics laser-beam welding machine |
| CN106273415B (en) * | 2016-08-19 | 2018-06-01 | 上海三束实业有限公司 | A kind of plastics laser-beam welding machine |
| CN107225330A (en) * | 2017-07-19 | 2017-10-03 | 云南电网有限责任公司电力科学研究院 | A kind of high voltage alive equipment laser rust-removing device |
| CN109367028A (en) * | 2018-10-15 | 2019-02-22 | 武汉博联特科技有限公司 | A kind of laser soldering automatic processing apparatus for plastics welding |
| CN111061302A (en) * | 2018-10-17 | 2020-04-24 | 杨斌堂 | Displacement structure, control method thereof and computer readable storage medium |
| CN112828467A (en) * | 2020-12-29 | 2021-05-25 | 孙永超 | Intelligent laser spot welding equipment for chip processing and chip processing technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105856553B (en) | 2018-12-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105856553A (en) | Three-dimensional semiconductor laser plastic welding system | |
| CN101518855B (en) | Multifunctional laser processing device | |
| CN205271144U (en) | Four -axis linkage laser welding device | |
| CN206065685U (en) | Cut and 3D printing free switching processing unit (plant) | |
| CN101898419B (en) | Plastic laser welding method | |
| CN201889584U (en) | High-power laser remote flying processing head | |
| CN112264718B (en) | Laser plate cutting machine | |
| CN110039194A (en) | A kind of laser cutting device | |
| CN202528467U (en) | Laser plastic welding device | |
| CN103273233A (en) | Object shelf tray self-adaptation welding device based on laser vision | |
| CN101502916A (en) | Laser multi-point automatic welding and sealing method as well as welding device of metallized fiber optic sensor | |
| CN201320841Y (en) | Optical-fiber laser welding device based on thermoplastics scanned through vibration mirrors | |
| CN104139237A (en) | Five-axis friction stir welding system capable of implementing three-dimensional path | |
| CN205705288U (en) | A kind of 3 D semiconductor laser plastic welding system | |
| CN205097540U (en) | A laser dualbeam soldered connection for plastics both sides welding | |
| CN205342233U (en) | Multi -functional laser surely welds all -in -one | |
| CN100455428C (en) | Multiple dimension plastic welding laser device | |
| CN108247200A (en) | For the optical beam scanning system and beam scanning method of laser micropore processing | |
| CN104625437A (en) | Scanning mechanism for precision processing of laser drilling and cutting of special-shaped hole | |
| TWI741448B (en) | Laser device with synchronous optical path delay | |
| CN203831801U (en) | Welding device | |
| CN206216118U (en) | A kind of 5 axle three-dimensional processing apparatus for optical-fiber laser cutting machine | |
| CN105467583A (en) | A small-scope laser translational scanning mirror apparatus | |
| CN106536122A (en) | Laser machining system and laser machining method | |
| CN205218361U (en) | Small -size automatic laser welding equipment of integration |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211213 Address after: 315400 Yuyao City Economic Development Zone, Ningbo City, Zhejiang Province Patentee after: NINGBO JIUTIAN LASER TECHNOLOGY Co.,Ltd. Address before: 314000 room 417, block a, Venture Center, Guigu Park, Luoxing street, Jiashan County, Jiaxing City, Zhejiang Province Patentee before: Jiaxing Jiushuo Laser Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240708 Address after: Zone G, 3rd Floor, Building 5, No. 2201 Yongsheng Road, Jiading District, Shanghai, 201821 Patentee after: OPPTON, Inc. Country or region after: China Address before: 315400 Yuyao City Economic Development Zone, Ningbo City, Zhejiang Province Patentee before: NINGBO JIUTIAN LASER TECHNOLOGY Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |