CN105846789A

CN105846789A - Low-pass filter and preparation method thereof

Info

Publication number: CN105846789A
Application number: CN201610169478.6A
Authority: CN
Inventors: 罗洪梁; 林亚梅; 黄寒寒; 朱建华; 刘季超; 胡志明
Original assignee: Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd; China Zhenhua Group Science and Technology Co Ltd
Current assignee: Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd; China Zhenhua Group Science and Technology Co Ltd
Priority date: 2016-03-23
Filing date: 2016-03-23
Publication date: 2016-08-10
Anticipated expiration: 2036-03-23
Also published as: CN105846789B

Abstract

The invention relates to a low-pass filter and a preparation method thereof. A ceramic body of the low-pass filter comprises a base plate, and multiple first capacitance layers, multiple inductance layers and multiple second capacitance layers which are successively arranged on the base plate. At least one first capacitance is formed by a second electrode pattern of the first capacitance layer and a first electrode pattern of the base plate, and each first capacitance is jointly formed by the first electrode pattern and the second electrode pattern ; multiple electrodes of the multiple inductance layers are connected to form multiple inductances in series connection, one electrode of multiple inductance layers is in series connection to form a inductance, and each first capacitance is in series connection with an inductance; at least one second capacitance is jointly formed by third electrode patterns of the multiple second capacitance layers, and each second capacitance is formed by the third electrode patterns of the second capacitance layers jointly, and each second capacitance is in parallel connection with the inductance. The above low-pass filter has high 3dB cut-off frequency, wide working frequency range, and high out-of-band inhibitive ability; the microwave frequency band usage consistency is good and the filter is easy to be miniaturized.

Description

Low pass filter and preparation method thereof

Technical field

The present invention relates to filter field, particularly relate to a kind of low pass filter and preparation method thereof.

Background technology

Wave filter is a kind of two-port network with selecting frequency characteristic, and it is the most all played the part of in the filtering clutter signal of the communications industry Indispensable role.LTCC (Low Temperature Co-fired Ceramic, LTCC) wave filter is a kind of novel filter Ripple device, it is via Tape-casting Technology for Ceramic Materials technique, in high precision printing technology, laminates forming technique and low-temperature sintering technology Be prepared from etc. multiple technologies, due to it have that volume is little, filter with low insertion loss passband and the characteristic such as Wide stop bands and high suppression, by extensively The systems such as satellite communication, radar navigation, automotive electronics that are applied to, and be widely used in VHF/UHF emitter/receiver, In the functional modules such as harmonic shutter, digital-to-analogue converter, it is indispensable important devices in microwave system, the quality of its performance Often directly affect the performance indications of whole communication system.But, along with the development of mechanics of communication, a new generation's mobile communication technology Appearance and the demand of new-type weapon and equipment so that people are high to operating frequency range width, 3dB cut-off frequency, Out-of-band rejection Property high, microwave frequency band use concordance preferably and the demand of low pass filter of miniaturization is more and more obvious.Therefore, it is badly in need of research A kind of operating frequency range width, 3dB cut-off frequency height, Out-of-band rejection height, microwave frequency band use concordance preferably and can be little The low pass filter of type.

Summary of the invention

In consideration of it, be necessary to provide that a kind of 3dB cut-off frequency is higher, operating frequency range is wider, Out-of-band rejection is higher, micro- Ripple frequency range uses concordance preferably and is prone to the low pass filter of miniaturization.

Additionally, also provide for the preparation method of a kind of low pass filter.

A kind of low pass filter, including ceramic body, described ceramic body includes base plate and the first electricity stacking gradually on described base plate Hold layer, multiple inductor layer and multiple second capacitor layers, wherein:

Described base plate includes first medium layer and is formed at the first electrode pattern on described first medium layer；

Described first capacitor layers is laminated on described first medium layer, and described first capacitor layers includes second dielectric layer and is formed at institute Stating the second electrode pattern in second dielectric layer, described second electrode pattern and described first electrode pattern are collectively forming at least one First electric capacity, and each described first electric capacity is that described first electrode pattern is collectively forming with described second electrode pattern；

Multiple described inductor layers stack gradually in described second dielectric layer, and each described inductor layer includes the 3rd dielectric layer and formation The electrode at the multiple intervals on described 3rd dielectric layer, the multiple described electrode of multiple described inductor layers is electrically connected to form multiple string The inductance of connection, and described electrode series connection one described inductance of formation of multiple described inductor layer, wherein, each described first Electric capacity and a described inductance series connection；

Multiple described second capacitor layers stack gradually on described threeth dielectric layer farthest from described first capacitor layers, each Described second capacitor layers includes the 4th dielectric layer and is formed at the 3rd electrode pattern on described 4th dielectric layer, multiple described second Described 3rd electrode pattern of capacitor layers is collectively forming at least one the second electric capacity, and each described second electric capacity is multiple described Described 3rd electrode pattern of two capacitor layers is collectively forming, each described second electric capacity and a described inductance in parallel.

Wherein in an embodiment, each described inductor layer also includes multiple the first electrical connection being arranged in described 3rd dielectric layer Post, a described electrode of multiple described inductor layers is sequentially connected in series one described inductance of formation by described first electric binding post, described One described electrode of the two of furthest apart described inductor layers is electrically connected so that adjacent two described inductance strings by the first electric binding post Connection, and described first electric binding post is by each described first electric capacity and a described inductance series connection；Each described second capacitor layers is also Including multiple the second electric binding posts being arranged in described 4th dielectric layer, described second electric binding post is by multiple described second capacitor layers Described 3rd electrode pattern and described inductance be electrically connected so that each described second electric capacity and a described inductance in parallel.

Wherein in an embodiment, described first capacitor layers is multiple, and multiple described first capacitor layers stack gradually in described On one dielectric layer, described second electrode pattern of multiple described first capacitor layers is collectively forming with the first electrode pattern of described base plate At least one described first electric capacity, each described first electric capacity is described second electrode pattern and the institute of multiple described first capacitor layers Stating the first electrode pattern to be collectively forming, wherein, multiple described inductor layers stack gradually in one described farthest from described base plate In the described second dielectric layer of one capacitor layers.

Wherein in an embodiment, described 4th dielectric layer, described 3rd dielectric layer, described second dielectric layer and described first The material of dielectric layer is identical ceramic material.

Wherein in an embodiment, described 4th dielectric layer, described 3rd dielectric layer, described second dielectric layer and described first The tangent value of the dielectric loss angle of dielectric layer is respectively less than or equal to 6 × 10^-4。

Wherein in an embodiment, described 4th dielectric layer, described 3rd dielectric layer, described second dielectric layer and described first The dielectric constant of dielectric layer is 3～96.

The preparation method of a kind of low pass filter, comprises the steps:

First medium green body layer is provided, a surface of described first medium green body layer forms the first electrode pattern, obtain on earth Slab body；

Second medium green body layer, stacking institute in the one side that described first medium green body layer is formed with described first electrode pattern are provided State second medium green body layer, and in described second medium green body layer, form the second electrode pattern, and make described second electrode pattern It is collectively forming at least one the first electric capacity with described first electrode pattern, and each described first electric capacity is described first electrode pattern It is collectively forming with described second electrode pattern of described first electric capacity green body layer, obtains the first electric capacity green body layer；

Multiple 3rd medium green body layer is provided, in the one side that described second medium green body layer is formed with described second electrode pattern, According to the described 3rd medium green body layer of stacking one layer, then form multiple spaced electrode in described 3rd medium green body layer Sequentially repetitive operation, to form the inductance green body layer of multiple stacking, and makes the multiple described electrode electricity of multiple described inductance green body layer Connecting the inductance forming multiple series connection, a described electrode series connection of multiple described inductance green body layer forms a described inductance, and Make each described first electric capacity and a described inductance series connection；

There is provided multiple 4th medium green body layer, in a described threeth medium green body layer shape farthest from described first electric capacity green body layer Become to have in the one side of described electrode, according to the described 4th medium green body layer of stacking one layer, then shape in described 4th medium green body layer Become the order repetitive operation of the 3rd electrode pattern, to form the second electric capacity green body layer of multiple stacking, and make multiple described second electricity Described 3rd electrode pattern holding layer is collectively forming at least one the second electric capacity, and each described second electric capacity is multiple described second electricity Described 3rd electrode pattern holding green body layer is collectively forming, and makes each described second electric capacity and a described inductance in parallel, obtains Laminated construction；

Described laminated construction is laminated, obtains laminate；

Described laminate is sintered, obtains ceramic body；And

Described ceramic body is formed external electrode, obtains low pass filter.

Wherein in an embodiment, described 3rd medium green body layer and described 4th medium green body layer all offer multiple being electrically connected Connect hole；Wherein, while described 3rd medium green body layer is formed the step of multiple spaced described electrode, described The described electrical connection hole of the 3rd medium green body layer is filled the first conductive material, and makes to be filled in the institute of described 3rd medium green body layer One described electrode of multiple described inductance green body layer is sequentially connected in series formation one by described first conductive material stated in electrical connection hole Described inductance, and a described electrode of the two of furthest apart described inductance green body layer is electrically connected so that adjacent two described electricity Sense series connection, and make described first conductive material being filled in the described electrical connection hole of described 3rd medium green body layer by each described First electric capacity and a described inductance series connection；Described 4th medium green body layer is formed step same of described 3rd electrode pattern Time, in the described electrical connection hole of described 4th medium green body layer, fill the second conductive material, so that being filled in described 4th medium Described 3rd electrode pattern is electrically connected so that each with described inductance by described second conductive material in the described electrical connection hole of base substrate Described second electric capacity and a described inductance in parallel.

Wherein in an embodiment, obtain the step of described first electric capacity green body layer particularly as follows: provide multiple described second medium Green body layer, in the one side that described first medium green body layer is formed with described first electrode pattern, according to stacking one layer described second Medium green body layer, then in described second medium green body layer, form the order repetitive operation of described second electrode pattern, many to be formed Individual the first electric capacity green body layer stacked gradually in the one side that described first medium green body layer is formed with described first electrode pattern, and Described second electrode pattern making multiple described first electric capacity green body layer is collectively forming described at least one with described first electrode pattern First electric capacity, and described second electrode pattern that each described first electric capacity is multiple described first capacitor layers and described first electrode Pattern is collectively forming；Wherein, it is formed with described second in a described second medium green body layer farthest from described base plate green body layer In the one side of electrode pattern, according to the described 3rd medium green body layer of stacking one layer, then formed many in described 3rd medium green body layer The order repetitive operation of individual spaced described electrode.

Wherein in an embodiment, the step being laminated by described laminated construction is particularly as follows: use the method for isostatic pressed by described folded Rotating fields pressurize 3～35 minutes under conditions of 45～93 DEG C, 18～45MPa.

The ceramic body of above-mentioned low pass filter includes base plate and the first capacitor layers stacking gradually on base plate, multiple inductor layer and many Individual second capacitor layers, and multiple inductor layer forms the inductance of multiple series connection, the first electrode pattern of base plate and the of the first capacitor layers Two electrode patterns are collectively forming the first electric capacity connected with inductance, and multiple second capacitor layers are collectively forming the second electricity with inductance in parallel Hold and inductance, thus introduce " resonance zero point " effectively to improve the Out-of-band rejection of low pass filter；And above-mentioned low-pass filtering Multiple electrodes of multiple inductor layers of device are electrically connected to form the inductance of multiple series connection, and an electrode series connection of multiple inductor layer is formed One electrode, the first electrode pattern and the second electrode pattern are collectively forming at least one the first electric capacity, and each first electric capacity is first One the second electrode pattern of electrode pattern and the first capacitor layers is collectively forming, and the 3rd electrode pattern of multiple second capacitor layers is common Forming at least one second electric capacity, each second electric capacity is that the electrode pattern of multiple second capacitor layers is collectively forming, and each first Electric capacity and the series connection of inductance, each second electric capacity and an inductance in parallel, thus form that " many electric capacity+many inductance+connection in series-parallel are humorous Shake " multistage cascade structure form, the stray inductance of parasitic capacitance and electric capacity to make full use of inductance, by under microwave frequency The impact of microwave device electric performance stablity is down to minimum by " ghost effect ", be conducive to improving low pass filter 3dB cut-off frequency, Operating frequency range and the use under microwave frequency band so that above-mentioned low pass filter has higher 3dB cut-off frequency, wider Working range and microwave frequency band use concordance good, and 3dB cut-off frequency reaches as high as 15000MHz；Meanwhile, above-mentioned low Multiple electrodes of multiple inductor layers of bandpass filter are electrically connected to form the inductance of multiple series connection, and each inductance is multiple inductor layer One electrode series connection is formed, so that the electrical interconnection of inductance is three-dimensional spiral structure, and under identical effective inductance value, on The inductance cabling layout stating three-dimensional spiral structure has higher self-resonant frequency and product than the inductance cabling layout of planar spiral structures The miniaturization of prime factor, beneficially low pass filter.

Accompanying drawing explanation

Fig. 1 is the structural representation of the low pass filter of an embodiment；

Fig. 2 is the exploded view that the low pass filter shown in Fig. 1 eliminates cover plate and external electrode；

Fig. 3 is the structural representation of three inductor layers of the low pass filter shown in Fig. 2；

Fig. 4 is a kind of circuit connection diagram of the low pass filter shown in Fig. 1；

Fig. 5 is the another kind of circuit connection diagram of the low pass filter shown in Fig. 1；

Fig. 6 is the preparation flow figure of the low pass filter of an embodiment；

Fig. 7 is the insertion loss curve chart of the low pass filter of embodiment 1；

Fig. 8 is the insertion loss curve chart of the low pass filter of embodiment 2；

Fig. 9 is the insertion loss curve chart of the low pass filter of embodiment 3；

Figure 10 is the insertion loss curve chart of the low pass filter of embodiment 4；

Figure 11 is the insertion loss curve chart of the low pass filter of embodiment 5；

Figure 12 is the insertion loss curve chart of the low pass filter of embodiment 6；

Figure 13 is the insertion loss curve chart of the low pass filter of comparative example 1.

Detailed description of the invention

For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Accompanying drawing gives The preferred embodiment of the present invention.But, the present invention can realize in many different forms, however it is not limited to described herein Embodiment.On the contrary, providing the purpose of these embodiments is to make the understanding to the disclosure more thorough comprehensively.

Unless otherwise defined, the technology people of all of technology used herein and scientific terminology and the technical field belonging to the present invention The implication that member is generally understood that is identical.The term used the most in the description of the invention is intended merely to describe concrete enforcement The purpose of example, it is not intended that in limiting the present invention.

As it is shown in figure 1, the low pass filter 10 of an embodiment includes ceramic body 100 and is formed at the dispatch from foreign news agency on ceramic body 100 Pole 200.

See also Fig. 2, ceramic body 100 substantially cuboid-type.Wherein, ceramic body 100 includes base plate the 110, first electricity Hold layer 120, multiple inductor layer 130, multiple second capacitor layers 140 and cover plate (not shown).

Base plate 110 includes first medium layer 112 and the first electrode pattern 114 being formed on first medium layer 112.Concrete, First electrode pattern 114 is formed on a surface of first medium layer 112.

Wherein, the material of first medium layer 112 is ceramic material, and the tangent value of the dielectric loss angle of first medium layer 112 is little In or equal to 6 × 10^-4.And the dielectric constant of ceramic material is 3～96.

Preferably, the material of first medium layer 112 is alumina-based ceramic.Such as, first medium layer 112 can be mainly with as follows Ceramic powder prepares: the model that Shenzhen Zhenhuafu Electronics Co., Ltd. produces is LFA and dielectric constant is respectively 4.0,7.1 With the ceramic powder of 13.6, or model is LFD and dielectric constant is the ceramic powder of 18.3.

Wherein, the dielectric constant of first medium layer 112 can select according to the 3dB cut-off frequency of prepared low pass filter 10 Select, such as, when the 3dB cut-off frequency of required low pass filter 10 is less than 350MHz, selecting dielectric constant is 18～53 Ceramic material；When the 3dB cut-off frequency of required low pass filter 10 is 350～990MHz, selecting dielectric constant is 9～18 Ceramic material；When the 3dB cut-off frequency of required low pass filter 10 is 990～2800MHz, selecting dielectric constant is 5～9 Ceramic material；When the 3dB cut-off frequency of required low pass filter 10 is more than 2800MHz, selecting dielectric constant is 5 Following ceramic material.

The material of the first electrode pattern 114 is silver electrode pattern.

First capacitor layers 120 is laminated on first medium layer 112.Concrete, the first capacitor layers 120 is laminated in first medium layer In 112 one sides being formed with the first electrode pattern 114.Wherein, the first capacitor layers 120 includes second dielectric layer 122 and is formed The second electrode pattern 124 in second dielectric layer 122.Wherein, the second electrode pattern 124 and the first electrode pattern 114 are altogether With forming at least one first electric capacity, each first electric capacity is the second electrode pattern 124 of the first electrode pattern 114 and the first electric capacity It is collectively forming.

Wherein, the first capacitor layers 120 can be one, it is also possible to for multiple.When the first capacitor layers 120 is one, first The second electrode pattern 124 in capacitor layers 120 and the first electrode pattern 114 are collectively forming at least one the second electric capacity, now, Each second electric capacity is that the first electrode pattern 114 is collectively forming with the second electrode pattern 124；When the first capacitor layers 120 is multiple Time, multiple first capacitor layers 120 stack gradually on first medium layer 112, the second electrode figure of multiple first capacitor layers 120 Case 124 and the first electrode pattern 114 are collectively forming at least one the first electric capacity, and each first electric capacity is multiple first capacitor layers Second electrode pattern 124 of 120 is collectively forming with the first electrode pattern 114.

Such as, in the embodiment shown in Fig. 2, the first capacitor layers 120 is two, two the first capacitor layers 120 stack gradually in First medium layer 112 is formed in the one side of the first electrode pattern 114.Away from the first capacitor layers 120 of base plate 110 second Electrode pattern 124 is identical with the shape of the first electrode pattern 114 of base plate 110, and position is corresponding.Near base plate 110 Second electrode pattern 124 of the first capacitor layers 120 is made up of three spaced electrodes, and the position of these three electrodes all with The position of the first electrode pattern 114 is corresponding, in order to form three the first electric capacity.The most each first electric capacity is the first electrode pattern 114, one near base plate 110 the first capacitor layers 120 the second electrode pattern 124 an electrode and away from base plate 110 The second electrode pattern 124 of the first capacitor layers 120 be collectively forming.

Wherein, the material of second dielectric layer 122 is identical with the material of first medium layer 112.

Wherein, the thickness of first medium layer 112 is more than the thickness of second dielectric layer 122.Such as, the thickness of first medium layer 112 Spending substantially 240 microns, the thickness of second dielectric layer 122 is 35 microns.

Concrete, the second electrode pattern 124 is formed in the second dielectric layer 122 one side away from base plate 110.Wherein, second Electrode pattern 124 is silver electrode pattern.

Multiple inductor layers 130 stack gradually in second dielectric layer 122.Concrete, multiple inductor layers 130 stack gradually in the Second medium layer 122 is formed on the side of the second electrode pattern 124.Concrete, when the first capacitor layers 120 is multiple, multiple Inductor layer 130 stacks gradually in the second dielectric layer 122 of first capacitor layers 120 farthest from base plate 110.Wherein, Each inductor layer 130 includes the 3rd dielectric layer 132 and multiple spaced 132 electrodes being formed on the 3rd dielectric layer 132. Multiple electrodes 132 of multiple inductor layers 130 are electrically connected to form the inductance of multiple series connection, and an electrode of multiple inductor layer 130 Series connection forms an inductance, wherein, each first electric capacity and an inductance series connection.

Wherein, the material of the 3rd dielectric layer 132 is identical with the material of first medium layer 112.

Preferably, the thickness near the 3rd dielectric layer 132 of an inductor layer 130 of the first capacitor layers 120 is more than remaining The thickness of the 3rd dielectric layer 132 of inductor layer 130, thus reduce the coupling between inductance and the first electric capacity and interference.And remaining The thickness of the 3rd dielectric layer 132 of inductor layer 130 the most equal.Such as, near an inductor layer of the first capacitor layers 120 The thickness of the 3rd dielectric layer 132 of 130 is about 220 microns, and the thickness of remaining the 3rd dielectric layer 132 is 35 microns. Being appreciated that in other embodiments, the thickness of the 3rd dielectric layer 132 of multiple inductor layers 130 can also be the most equal.

Concrete, electrode 132 is formed on the 3rd dielectric layer 132 surface away from the first capacitor layers 120.Wherein, electrode 132 For silver electrode.

Wherein, multiple electrodes 132 of multiple inductor layers 130 are electrically connected to form the inductance of multiple series connection, and multiple inductor layer 130 The series connection of electrode 132 form an inductance, it is possible to the cabling layout making inductance is three-dimensional spiral structure so that identical Under effective inductance value, the inductance cabling layout of above-mentioned three-dimensional spiral structure has higher than the inductance cabling layout of planar spiral structures Self-resonant frequency and quality factor, the beneficially miniaturization of low pass filter 10.

Concrete, each inductor layer 130 also includes multiple the first electric binding post being arranged in the 3rd dielectric layer 132, and first is electrically connected Connecing post and one electrode 132 of multiple inductor layers 130 is sequentially connected in series one inductance of formation, the first electric binding post is by furthest apart One electrode 132 of two inductor layers 130 is electrically connected so that adjacent two inductance series connection.One electricity of the most multiple inductor layers 130 Pole 132 is sequentially connected electrically to form an inductance；Near the first capacitor layers 120 an inductor layer 130 electrode and from The electrode 132 of the inductor layer 130 that one capacitor layers 120 is farthest electrically connects to realize the series connection between two inductance, it is thus possible to Enough cabling layouts preferably making inductance are three-dimensional spiral structure.

Such as, as in figure 2 it is shown, concrete, inductor layer 130 is three the most in the illustrated embodiment, first inductor layer 130 ( Near an inductor layer 130 of base plate 110) and second inductor layer 130 be respectively provided with four electrodes, the 3rd inductor layer 130 There are three electrodes 132, an electrode 132 of 132, second inductor layer 130 of an electrode of first inductor layer 130 and One electrode 132 of three inductor layers 130 is sequentially connected in series one inductance of formation.The most in figure 3, A1 and A2, E1 and E2, And H1 and H2 represents the two ends of three electrodes 132 of a uppermost inductor layer 130 respectively, B1 and B2, F1 and F2, I1 and I2 and K1 and K2 represent the two ends of four electrodes 132 of middle inductor layer 130 respectively, D1 and D2, G1 and G2 and J1 and J2 represents the two ends of wherein three electrodes 132 of a undermost inductor layer 130 respectively, its In, A2 and B1 electrically connects, B2 with D1 electrically connects, and forms an inductance；E2 and F1 electrically connects, F2 with G1 electrically connects, Form an inductance；H2 with I1 electrically connects, I2 with J1 electrically connects, and forms an inductance；Wherein, D2 with E1 electrically connects, G2 and H1 electrically connects, with by two adjacent inductance series connection.

Concrete, the first electric binding post is by each first electric capacity and an inductance series connection.I.e. when the first capacitor layers 120 is one, The electrode 132 of the second electrode pattern 124 with inductor layer 130 is electrically connected so that each first electric capacity and one by the first electric binding post Inductance is connected；When the first capacitor layers 120 is multiple, each second dielectric layer 122 is also equipped with the electrical connector of column, Now, electrical connector and the first electric binding post electrically connect and will make each first electric capacity and an inductance series connection.

Concrete, the material of the first electric binding post and electrical connector is silver.

Multiple second capacitor layers 140 stack gradually in the 3rd dielectric layer of an inductor layer 130 farthest from the first capacitor layers 120 On 132.Concrete, multiple second capacitor layers 140 stack gradually in threeth dielectric layer farthest from the first capacitor layers 120 132 are formed in the one side of electrode.Wherein, each second capacitor layers 140 includes the 4th dielectric layer 142 and is formed at the 4th Jie The 3rd electrode pattern 144 on matter layer 142.Wherein, the 3rd electrode pattern 144 of multiple second capacitor layers 140 is collectively forming At least one second electric capacity, and the 3rd electrode pattern 144 that each second electric capacity is multiple second capacitor layers 140 is collectively forming. Wherein, each second electric capacity and an inductance in parallel.And multiple second electric capacity is in parallel.

Such as, in the embodiment shown in Fig. 2, the second capacitor layers 140 is three, and the 3rd electricity of each second capacitor layers 140 Pole pattern 144 is formed by three spaced electrodes, and each second electric capacity is a common shape of electrode of three the second electric capacity Become.The most each second electric capacity by an electrode of the second capacitor layers 140 near inductor layer 130, be positioned at centre second electricity Hold an electrode of layer 140 and be collectively forming from an electrode of farthest the second capacitor layers 140 of inductor layer 130.

Wherein, first electric capacity, an inductance and second electric capacity form a resonant tank.Such as, Fig. 4 is one The circuit connection diagram of the low pass filter 10 of embodiment, wherein, the first electric capacity is three, and the second electric capacity is two, and inductance is three Individual, three the first electric capacity represent with C1, C3 and C5 respectively, and two the second capacitor layers 140 represent with C2 and C4 respectively, Three inductor layers 130 L1, L2 and L3 respectively represent, L1, L2 and L3 connect, C1 with L1 connects, C3 and L2 connects, C5 and L3 connects, C2 and L1 is in parallel, C4 and L2 is in parallel.Wherein, C2 and C4 is parallel resonance electric capacity, L1, C1 Forming a resonant tank with C2, L2, C3 and C4 form a resonant tank.It is appreciated that the quantity of the second electric capacity not Being limited to less than the quantity of the first electric capacity, in other embodiments, the quantity of the second electric capacity can also be equal to the quantity of the first electric capacity, Such as, in another embodiment, as it is shown in figure 5, the circuit connection diagram shown in the circuit connection diagram of this embodiment and Fig. 4 Difference be Fig. 5 has 3 the second electric capacity and 4 inductance, another second electric capacity C6 represent, another inductance Representing with L4, now, C6 with L3 is in parallel, and L3, C5 and C6 form a resonant tank, now, go between and draw from L4.

Concrete, each second capacitor layers 140 also includes multiple the second electric binding post being arranged in the 4th dielectric layer 142, second Electric binding post is by each second electric capacity and an inductance in parallel.Wherein, the material of the second electric binding post is silver.

Concrete, the material of the 4th dielectric layer 142 is identical with the material of first medium layer 112.Preferably, near inductor layer The thickness of the 4th dielectric layer 142 of one second capacitor layers 140 of 130 is more than the 4th medium of remaining the second capacitor layers 140 The thickness of layer 142, thus reduce the coupling between inductance and the second electric capacity and interference.The thickness of remaining the 4th dielectric layer 142 The most equal.Such as, the thickness near the 4th dielectric layer 142 of the second capacitor layers 140 of inductor layer 130 is 220 microns, 4th dielectric layer 142 thickness of remaining the second capacitor layers 140 is 45 microns.

3rd electrode pattern 144 is silver electrode pattern.Concrete, first electrode pattern the 114, second electrode pattern 124, each The electrode of inductor layer 130 and the thickness of the 3rd electrode pattern 144 are the most equal.

Wherein, the quantity of the first electric capacity is less than or equal to the quantity of inductance, and the quantity of the first electric capacity differs not with the quantity of inductance More than 1, the quantity of the second electric capacity is less than the quantity of inductance, so that the function of low pass filter 10 is better achieved.

The 4th dielectric layer 142 that cover layer is laminated on from inductor layer 130 is farthest is formed in the one side of the 3rd electrode pattern 144.And Cover plate covers the 3rd electrode pattern 144 on the 4th dielectric layer 142 that inductor layer 130 is farthest.Wherein, the material of cover plate with The material of first medium layer 112 is identical.

External electrode 200 is four.Two of which external electrode 200 lays respectively at the two ends of ceramic body 100, and wraps up ceramic body 100 Two ends.This two external electrodes 200 also referred to as termination electrode.Two termination electrodes are respectively the positive pole of the input of low pass filter 10 Positive pole with outfan.Wherein, two inductance being positioned at two ends of multiple inductance of series connection electrically connect with two termination electrodes respectively.

Wherein, each termination electrode includes the silver layer being laminated on ceramic body 100.In order to meet the welding requirements of low pass filter 10, Termination electrode also includes nickel dam and the tin layers stacking gradually on silver layer.Nickel dam is for heat insulation, and tin layers is easy to welding.And on silver layer Nickel dam and tin layers are set.

Two other external electrode 200 is positioned at the middle part of ceramic body 100, and is relatively arranged on the both sides of ceramic body 100.These are two years old Individual external electrode 200 also referred to as central electrode.The two central electrode is in the common ground end of low pass filter 10, and these two Heart electrode electrically connects with electric capacity.Wherein, two central electrodes are silver electrode.

Above-mentioned low pass filter 10 at least has the advantage that

(1) ceramic body 100 of above-mentioned low pass filter 10 includes base plate 110 and the first electricity stacking gradually on base plate 110 Hold layer 120, multiple inductor layer 130 and multiple second capacitor layers 140, and multiple inductor layer 130 form the inductance of multiple series connection, First electrode pattern 114 of base plate 110 is collectively forming with the second electrode pattern 124 of the first capacitor layers 120 connects with inductance First electric capacity, multiple second capacitor layers 140 are collectively forming the inductance in parallel with the second electric capacity, thus introduce " resonance zero point " with Effectively improve the Out-of-band rejection of low pass filter 10；And multiple electricity of multiple inductor layers 130 of above-mentioned low pass filter 10 Pole 132 is electrically connected to form the inductance of multiple series connection, and electrode 132 series connection of multiple inductor layer 130 forms an electrode, First electrode pattern 114 and the second electrode pattern 124 are collectively forming at least one the first electric capacity, and each first electric capacity is the first electricity Pole pattern 114 is collectively forming with second electrode pattern 124 of the first capacitor layers 120, the of multiple second capacitor layers 140 Three electrode patterns 144 are collectively forming at least one the second electric capacity, and each second electric capacity is the electrode figure of multiple second capacitor layers 140 Case is collectively forming, and each first electric capacity and an inductance are connected, each second electric capacity and an inductance in parallel, thus is formed " many Electric capacity+many inductance+series parallel resonances " multistage cascade structure form, the parasitism of parasitic capacitance and electric capacity to make full use of inductance Inductance, is down to minimum by " ghost effect " under microwave frequency on the impact of microwave device electric performance stablity, is conducive to improving low pass The 3dB cut-off frequency of wave filter 10, operating frequency range and the use under microwave frequency band so that above-mentioned low pass filter 10 Having higher 3dB cut-off frequency, wider working range and microwave frequency band uses concordance good, and 3dB cut-off frequency is the highest Up to 15000MHz；Meanwhile, multiple electrodes 132 of multiple inductor layers 130 of above-mentioned low pass filter 10 are electrically connected to form many The inductance of individual series connection, and the electrode 132 series connection formation that each inductance is multiple inductor layer 130, so that the electrical connection of inductance Circuit is three-dimensional spiral structure, and under identical effective inductance value, the inductance cabling layout of above-mentioned three-dimensional spiral structure compares plane The inductance cabling layout of helical structure has higher self-resonant frequency and quality factor, and beneficially low pass filter 10 is small-sized Change.

(2) the 4th dielectric layer the 142, the 3rd dielectric layer 132 of above-mentioned low pass filter 10, second dielectric layer 122 and first are situated between The material of matter layer 112 is identical ceramic material, and the tangent value of the dielectric loss angle of ceramic material is less than or equal to 6 × 10^-4, I.e. electric capacity uses the material of identical high-frequency low-consumption to separate with inductance, beneficially coupling and interference between small electric sense and electric capacity, And completely avoid dissimilar materials and do not mate and the relatively low problem of the reliability that causes, thus substantially increase low pass filter 10 can By property so that above-mentioned low pass filter 10 has higher reliability.

(3) above-mentioned low pass filter 10 has two central electrodes, and two central electrodes are that the public of low pass filter 10 connects Ground end, it is possible to the interference of shielding extraneous signal, it is ensured that the stability of low pass filter 10 electrical property.

As shown in Figure 6, the preparation method of the low pass filter of an embodiment, for a kind of preparation method of above-mentioned low pass filter, The preparation method of this low pass filter comprises the steps:

Step S310: first medium green body layer is provided, forms the first electrode pattern on a surface of first medium green body layer, Obtain base plate base substrate.

Wherein, first medium green body layer is prepared by ceramic size, and ceramic size includes ceramic powder, and ceramic powder sintering After the tangent value of dielectric loss angle less than or equal to 6 × 10^-4, and the dielectric constant of ceramic powder is 3～96.Wherein, ceramics The particle surface of material is positively charged.Preferably, ceramic powder is alumina-based ceramic powder, and such as, Shenzhen Zhenhua electron rich has The model that limit company produces is the ceramic powder that LFA and dielectric constant are respectively 4.0,7.1 and 13.6, or model is LFD And dielectric constant is the ceramic powder of 18.3.

Concrete, ceramic size also includes solvent, plasticizer, binding agent and dispersant.Wherein, according to mass percent, pottery Porcelain slurry includes 35～the binding agent of the plasticizer of the solvent of the ceramic powder of 60%, 34.4～55%, 1.0～4.0%, 4.41～8.5% With 0.09～the dispersant of 0.9%.The ceramic size that this proportioning makes is uniformly dispersed, good stability, nothing settle and do not reunite, from And ensure its in molding, printing and lamination process bubble-free, easy demoulding, easily bond and there is suitable ductility.

Wherein, solvent can be the mixture of ethanol and ethyl acetate, and wherein, ethanol is 3:7 with the mass ratio of ethyl acetate.Increase Moulding agent can be Polyethylene Glycol.Binding agent can be polyvinyl butyral.Dispersant can be oleic acid.

The preparation process of above-mentioned ceramic size is specific as follows: by ceramic powder, solvent, plasticizer and dispersant ball milling 10～20 Hour, it being subsequently adding binding agent, continuation ball milling 15～35 hours, ball milling frequency is 50～190Hz, obtains ceramic size.

Wherein, first medium green body layer can use the method for flow casting molding to prepare.It is configured to ceramic size according to said components After, ceramic size is stood 30～90 minutes or froth in vacuum, then flow casting molding, in order to eliminate the bubble in ceramic size.

First electrode pattern is formed in first medium green body layer for using silver slurry silk screen printing.The thickness of the first electrode pattern is 5 Micron～12 microns.

Step S320: second medium green body layer, stacking in the one side that first medium green body layer is formed with the first electrode pattern are provided Second medium green body layer, and in second medium green body layer, form the second electrode pattern, and make the second electrode pattern and the first electrode Pattern is collectively forming at least one the first electric capacity, and each first electric capacity is the first electrode pattern and the second electrode pattern is collectively forming, Obtain the first electric capacity green body layer.

Wherein, the thickness of first medium base substrate is more than the thickness of second medium base substrate.Such as, the thickness of first medium green body layer is 240 microns, the thickness of second medium green body layer is 43 microns.

Wherein, the preparation method of second medium base substrate is identical with first medium base substrate.And the ceramic slurry that second medium green body layer uses Expect identical with the ceramic size of first medium green body layer.

Wherein it is possible to one the first electric capacity green body layer of preparation, it is also possible to prepare multiple first electric capacity green body layer.When the first electric capacity base When body layer is multiple, obtain the step of the first electric capacity green body layer particularly as follows: provide multiple second medium green body layer, at first medium Green body layer is formed in the one side of the first electrode pattern, according to one layer of second medium green body layer of stacking, then in second medium green body layer The order repetitive operation of upper formation the second electrode pattern, with formed multiple stack gradually in first medium green body layer be formed first electricity The first electric capacity green body layer in the one side of pole pattern, now, the second electrode pattern of multiple first electric capacity green body layer and the first electrode Pattern is collectively forming at least one the first electric capacity, and second electrode pattern that each first electric capacity is multiple first capacitor layers with First electrode pattern is collectively forming.

Step S330: multiple 3rd medium green body layer is provided, in the one side that second medium green body layer is formed with the second electrode pattern, According to one layer of the 3rd medium green body layer of stacking, then the order forming multiple spaced electrode in the 3rd medium green body layer repeats Operation, to form the inductance green body layer of multiple stacking, and makes multiple electrodes of multiple inductance green body layer be electrically connected to form multiple series connection Inductance, electrode series connection of multiple inductance green body layer forms an inductance, and makes each first electric capacity connect with an inductance.

Wherein, when step S320 being prepared the first electric capacity green body layer and being multiple, one second Jie farthest from base plate green body layer Matter green body layer is formed in the one side of the second electrode pattern, according to one layer of the 3rd medium green body layer of stacking, then at the 3rd medium base substrate The order repetitive operation of multiple spaced electrodes is formed on layer.

Wherein, the preparation method of the 3rd medium green body layer is identical with the preparation method of second medium green body layer.And the 3rd medium base substrate The ceramic size that layer uses is identical with the ceramic size of second medium green body layer.

Concrete, the thickness near the 3rd medium green body layer of the inductance green body layer of the first electric capacity green body layer is more than remaining inductance The thickness of the 3rd medium green body layer of green body layer.And the thickness of the 3rd medium base substrate of remaining inductance green body layer is the most equal.Such as, Thickness near the 3rd medium green body layer of the inductance green body layer of the first electric capacity green body layer is 220 microns, remaining inductor layer The thickness of the 3rd dielectric layer 35 microns.

The method forming multiple spaced electrode in the 3rd medium green body layer uses silver slurry silk screen in the 3rd medium green body layer Printing forms electrode.The thickness of each electrode is 5 microns～12 microns.

Concrete, the 3rd medium green body layer offers multiple electrical connection hole.Wherein, the 3rd medium green body layer is formed multiple While the step of spaced electrode, in the electrical connection hole of the 3rd medium green body layer, fill the first conductive material, so that filling out One electrode of multiple inductance green body layer is sequentially connected in series shape by the first conductive material filled in the electrical connection hole of the 3rd medium green body layer Become an inductance, an electrode of the two of furthest apart inductance green body layer is electrically connected so that adjacent two inductance series connection, and makes The first conductive material being filled in the electrical connection hole of the 3rd medium green body layer is by each first electric capacity and an inductance series connection.I.e. fill out Fill the first conductive material in the electrical connection hole of the 3rd medium green body layer the electrode of the first electric capacity with inductance green body layer electrically connected and Make each first electric capacity and an inductance series connection.

When the first electric capacity green body layer is one, it is filled in the first conductive material in the electrical connection hole of the 3rd medium green body layer by the Two electrode patterns are electrically connected so that with electrode each first electric capacity and an inductance are connected.When the first electric capacity green body layer is multiple, Each second medium green body layer also offers multiple electrical connection hole, now, second medium green body layer forms multiple second While the step of electrode pattern, the electrical connection hole of second medium green body layer is filled silver slurry, now, is filled in the 3rd medium The first conductive material in the electrical connection hole of green body layer and the silver slurry in being filled in the electrical connection hole of second medium green body layer are by each the One electric capacity and an inductance series connection.

Concrete, the first conductive material is silver slurry.

Step S340: provide multiple 4th medium green body layer, in a threeth medium green body layer farthest from the first electric capacity green body layer It is formed in the one side of electrode, according to one layer of the 4th medium green body layer of stacking, then in the 4th medium green body layer, forms the 3rd electrode The order repetitive operation of pattern, to form the second electric capacity green body layer of multiple stacking, and makes the 3rd electrode of multiple second capacitor layers Pattern is collectively forming at least one the second electric capacity, and each second electric capacity is that the 3rd electrode pattern of multiple second electric capacity green body layer is common Formed, and make each second electric capacity and an inductance in parallel, obtain laminated construction.

Wherein, the preparation method of the 4th medium green body layer is identical with the preparation method of first medium green body layer.And the 4th medium base substrate The ceramic size that layer uses is identical with the ceramic size of first medium green body layer.

Wherein, the thickness near the 4th medium green body layer of the second electric capacity green body layer of inductance green body layer is more than remaining second electricity Hold the thickness of the 4th medium green body layer of green body layer.Such as, near the 4th medium of the second electric capacity green body layer of inductance green body layer The thickness of green body layer is 220 microns, the thickness 45 microns of the 4th medium green body layer of remaining the second electric capacity green body layer.

The method forming the 3rd electrode pattern in the 4th medium green body layer is: use silver slurry silk screen printing.3rd electrode pattern Thickness is 5 microns～12 microns.

Concrete, the 4th medium green body layer also offers multiple electrical connection hole, now, the 4th medium green body layer forms the While the step of three electrode patterns, in the electrical connection hole of the 4th medium green body layer, fill the second conductive material, so that being filled in The second conductive material in the electrical connection hole of the 4th medium base substrate is by each second electric capacity and an inductance in parallel.I.e. it is filled in the 4th 3rd electrode pattern is electrically connected by the second conductive material in the electrical connection hole of medium base substrate with the electrode of inductance, so that each second Electric capacity and an inductance in parallel.

Wherein, the second conductive material is silver slurry.

Concrete, in order to realize second medium green body layer, the 3rd medium green body layer and the accurate para-position of the 4th medium green body layer, can First medium green body layer, second medium green body layer, the 3rd medium green body layer and the 4th medium green body layer all offer registration holes.

Step S350: laminated construction is laminated, obtains laminate.

Wherein, by laminated construction be laminated step particularly as follows: use isostatic pressed method by laminated construction in 45～93 DEG C, Pressurize 3～35 minutes in 18～45MPa.

Further, by laminated construction be laminated step before, also include: provide cover plate base substrate, cover plate green body layer is laminated on from Farthest the 4th medium green body layer of inductance green body layer is formed in the one side of the 3rd electrode pattern, and cover plate base substrate covers from electricity The 3rd electrode pattern in a 4th medium green body layer that sense green body layer is farthest.Wherein, the preparation method of lid base substrate and first The preparation method of medium base substrate is identical.And prepare the ceramic size of lid base substrate and prepare the ceramic size phase of first medium green body layer With.I.e. base plate green body layer, the first electric capacity green body layer, inductance green body layer, the second electric capacity green body layer and lid base substrate collectively constitutes folded Rotating fields.

Step S360: laminate is sintered, obtains ceramic body.

Further, by the step of the sintering of laminate particularly as follows: laminate is heated up with the heating rate of 0.45～0.5 DEG C/min To 200 DEG C be incubated 5～6 hours, then with the heating rate of 0.45～0.5 DEG C/min be warming up to 490 DEG C be incubated 10～12 hours, then, It is warming up to 790～900 DEG C with the heating rate of 2 DEG C/min, and heat preservation sintering 2～3 hours.Wherein, by laminate with 0.45～0.5 DEG C / minute heating rate be warming up to 200 DEG C and be incubated 5～6 hours, then be warming up to 490 DEG C with the heating rate of 0.45～0.5 DEG C/min Being incubated 10～12 hours is the process of binder removal, and the process of binder removal is particularly significant to low pass filter, and the insufficient meeting of binder removal makes follow-up Sintering low pass filter bubble, deform or be layered；If binder removal is excessive, it is likely that can result at first medium base substrate Electrode and the 4th in the first electrode pattern on layer, the second electrode pattern in second medium green body layer, the 3rd medium green body layer The 3rd electrode pattern in medium green body layer comes off.And due to sintering process be the ceramic body of low pass filter one-tenth porcelain densification, And the common burning process of interior electrode and dielectric layer, this sintering schedule ensure that the synchronous of interior electrode and dielectric layer, prevents from locating There is " inside contracting " phenomenon in interior electrode in edge, with the matching co-firing of electrode in realizing with pottery.

Step S370: form external electrode on ceramic body, obtain low pass filter.

Wherein, ceramic body forms the step of external electrode particularly as follows: form the first silver layer at the two ends of ceramic body, and at pottery The relative both sides of the centre of body form the second silver layer, sintered formation external electrode on ceramic body respectively.First silver layer uses and " dips in Silver " method formed.Second silver layer uses painting silver wheel rolling to be coated with silver-colored method and is formed.

In order to meet the welding requirements of low pass filter, after forming external electrode, it is additionally included on the first silver layer and forms layer successively It is laminated on the nickel dam on the first silver layer and tin layers.Nickel dam is for heat insulation, and tin layers is easy to welding.Wherein, nickel dam can use the side of nickel plating Method obtains.

Owing to can produce glass phase after being attached with impurity or silver ink firing after silver slurry sintering, influence whether nickel dam is coated with effect Really, therefore, before forming nickel dam, the residue being positioned at the first silver layer surface is first removed.Such as, ethanol or water is used to clean The surface of the first silver layer.

The preparation method technique of above-mentioned low pass filter is simple, it is easy to industrialized production.And low pass filter prepared by said method 3dB cut-off frequency higher, operating frequency range is wider, Out-of-band rejection is higher and microwave frequency band uses concordance preferable, and 3dB cut-off frequency reaches as high as 20000MHz.And the said method low pass filter prepared also help low pass filter Miniaturization.

It is below specific embodiment part:

Embodiment 1

The preparation process of the low pass filter of the present embodiment is as follows:

(1) weigh according to following mass percent: the ceramic powder of 50%, the solvent of 42%, the plasticizer of 2%, 5.5% viscous Knot agent and the dispersant of 0.5%, wherein, ceramic powder be the tangent value of the dielectric loss angle after sintering be 3.53 × 10^-4, and be situated between Electric constant is the alumina-based ceramic powder of 27.8, and the specific surface area of ceramic powder is 5.7m²/ g, the particle surface of ceramic powder Positively charged characteristic；Solvent is the mixture of ethanol and ethyl acetate, and the mass ratio of ethanol and ethyl acetate is 3:7；Plasticizer For Polyethylene Glycol；Binding agent is polyvinyl butyral, and dispersant is oleic acid.

(2) by above-mentioned ceramic powder, solvent, plasticizer and dispersant ball milling 20 hours, it is subsequently adding binding agent, continues Continuous ball milling 35 hours, ball milling frequency is 100Hz, obtains ceramic size.

(3) this ceramic size being stood 60 minutes, flow casting molding, one thickness of formation is the first medium of 240 microns respectively The 3rd medium green body layer that the second medium green body layer that green body layer, two thickness are 43 microns, thickness are 220 microns, two Individual thickness be the 3rd medium green body layer of 35 microns, thickness be that the 4th medium green body layer of 220 microns, two thickness are The 4th medium green body layer of 45 microns and thickness are 240 trifling lid base substrates, and at second medium green body layer, the 3rd medium base Multiple electrical connection hole is all offered, first medium base substrate, second medium green body layer, the 3rd Jie on body layer and the 4th medium green body layer Registration holes is all offered in matter green body layer and the 4th medium green body layer.

(4) using silver slurry silk screen printing on a surface of the first medium green body layer that thickness is 240 microns to form thickness is 9 First electrode pattern of micron, obtains base plate base substrate.

(5) the first medium green body layer at base plate base substrate is formed with one thickness of stacking in the one side of the first electrode pattern is 43 micro- The second medium green body layer of rice, then in this second medium green body layer away from using silver slurry screen printing scopiform in the one side of base plate base substrate The second electrode pattern that Cheng Yousan interval setting and the electrode that thickness is 9 microns are formed, and at the electricity of this second medium green body layer Connecting hole is filled silver slurry, obtains first the first electric capacity green body layer；Then, second Jie of first the first electric capacity green body layer It is the second medium green body layer of 43 microns that matter green body layer is formed with another thickness of stacking in the one side of the second electrode pattern, then, It is 9 micro-in this second medium green body layer away from using silver slurry silk screen printing to form thickness in the one side of first the first electric capacity green body layer Second electrode pattern of rice, and in the electrical connection hole of this second medium green body layer, fill silver slurry, obtain second the first electric capacity base Body layer, under the effect being filled in the silver slurry in electrical connection hole of second medium green body layer, the first electrode pattern and two the first electric capacity Second electrode pattern of green body layer is collectively forming three the first electric capacity, and each first electric capacity be the first electrode pattern, first One electrode of one electric capacity green body layer and the second electrode pattern of second electric capacity base substrate are collectively forming；Wherein, by with registration holes On the basis of hole to realize the accurate para-position of multiple second medium green body layer and first medium green body layer.

(6) first stacking thickness it is formed with in the one side of the second electrode pattern in a second medium green body layer farthest from base plate base substrate It is the 3rd medium green body layer of 220 microns, uses silver slurry in the 3rd medium green body layer away from the surface of the first capacitor cell base substrate Upper silk screen printing thickness is four spaced electrodes of 9 microns, simultaneously electrical connection hole in the 3rd medium green body layer Fill silver slurry, obtain first inductance green body layer；Then, the second medium base substrate first inductance green body layer is formed with electrode One side on stacking a layer thickness be the 3rd medium green body layer of 35 microns, and use silver slurry silk screen in the 3rd medium green body layer Print thickness is four spaced electrodes of 9 microns, fills silver slurry in the electrical connection hole of the 3rd medium green body layer simultaneously, Obtain second inductance green body layer；Then, the second medium base substrate second inductance green body layer is formed with the one side upper strata of electrode Another layer thickness folded is the 3rd medium green body layer of 35 microns, and uses silver slurry silk screen printing thickness in the 3rd medium green body layer It is four spaced electrodes of 9 microns, meanwhile, the electrical connection hole of the 3rd medium green body layer is filled silver slurry, obtains 3rd inductance green body layer, is filled in the electrical connection Kong Zhongyin slurry of the 3rd medium green body layer by the electrode of three the 3rd inductance green body layer It is electrically connected to form the inductance of four series connection, and the electrode that each inductance is three inductance green body layer is sequentially connected in series formation, and fill out Fill and starch an electrode of first inductance green body layer and the 3rd inductance green body layer in the electrical connection Kong Zhongyin of the 3rd medium green body layer An electrode series connection and by adjacent two inductance series connection, and each first electric capacity is connected with an inductance.Wherein, pass through On the basis of registration holes, hole realizes the accurate para-position of the 3rd medium green body layer lamination process.

(7) in a threeth medium green body layer farthest from the first electric capacity green body layer, stacking thickness is the 4th medium of 220 microns Green body layer, uses silver slurry to be by thickness away from silk screen printing formation in the one side of inductance unit base substrate in the 4th medium green body layer 9 microns and the 3rd electrode pattern of spaced three electrodes composition, meanwhile, in the electrical connection hole of the 4th medium base substrate Fill silver slurry, obtain first the second electric capacity green body layer；The 4th medium green body layer first the second electric capacity green body layer is formed again Having stacking a layer thickness in the one side of the 3rd electrode pattern is the 4th medium green body layer of 35 microns, and uses silver slurry the 4th Jie In matter green body layer, silk screen printing is formed and is 9 microns by thickness and the 3rd electrode pattern that spaced three electrodes form, with Time in the electrical connection hole of the 4th medium green body layer fill silver slurry, obtain second the second electric capacity green body layer；Then, second It is 35 micro-that 4th medium green body layer of individual second electric capacity green body layer is formed with another layer thickness of stacking in the one side of the 3rd electrode pattern Rice the 4th medium green body layer, and use silver slurry in the 4th medium green body layer silk screen printing formed by thickness be 9 microns and 3rd electrode pattern of spaced three electrodes composition, meanwhile, fills silver in the electrical connection hole of the 4th medium green body layer Slurry, obtains the 3rd the second electric capacity green body layer, and the silver slurry being filled in the electrical connection hole of the 4th medium green body layer is by three second electricity The 3rd electrode pattern holding green body layer is electrically connected to form three the second electric capacity, and each second electric capacity is three the second electric capacity green body layer An electrode be collectively forming, be filled in the 4th medium green body layer electrical connection hole in silver slurry make each second electric capacity and an electricity Sense parallel connection.Wherein, the accurate para-position of the 4th medium green body layer lamination process is realized by hole on the basis of registration holes.

(8) the 4th medium green body layer in the second electric capacity green body layer farthest from inductor layer is formed on the side of the 3rd electrode pattern Stacking lid base substrate, and make lid base substrate cover the 3rd electrode figure in the 4th medium green body layer of the 3rd the second electric capacity green body layer Case, obtains laminated construction.

(9) laminated construction uses the method for isostatic pressed in 70 DEG C, pressurize 15 minutes in 28MPa, obtains laminate.

(10) laminate is warming up to 200 DEG C with the heating rate of 0.5 DEG C/min and is incubated 5 hours, then the liter with 0.5 DEG C/min Temperature ramp is incubated 10 hours to 490 DEG C, carries out binder removal, is then warming up to 500 DEG C with the heating rate of 1 DEG C/min, then It is warming up to 890 DEG C with the heating rate of 2 DEG C/min, and heat preservation sintering 2 hours, natural cooling is lowered the temperature, and obtains length, width and height respectively Ceramic body for 3.2mm, 1.6mm and 0.9mm.Then, ceramic body and zirconia cylindrical body common rotation are ground 20 little Time, and rotational frequency is 80Hz, with by ceramic body chamfering.

(11) method that the two ends of ceramic body are respectively adopted " dipping in silver " forms the first silver layer, and makes two the first silver layers respectively Electrically connect with the two ends of four inductance connected；And use the method being coated with silver wheel rolling painting silver to form two in the both sides, center of ceramic body Individual the second silver layer being oppositely arranged；Then will be formed with ceramic body heat treatment in continuous tunnel furnace of the first silver layer and the second silver layer, After, remove the residue of first silver layer surface at two ends, and on the silver electrode at two ends, be coated with nickel dam and tin layers the most successively, To low pass filter.

The 3dB cut-off frequency of the low pass filter of the present embodiment tested by employing radio frequency network analyser；And use radio frequency network analysis Instrument test obtains the insertion loss curve of the low pass filter of the present embodiment, to determine operating frequency range and the stopband of the present embodiment Suppression.Wherein, Fig. 7 is the insertion loss curve of the low pass filter of the present embodiment, as can be drawn from Figure 7 the present embodiment The stopband suppression scope of the operating frequency range of low pass filter, the stopband suppression scope of more than 30dB and more than 20dB, Wherein, the 3dB cut-off frequency of the low pass filter of the present embodiment, operating frequency range, more than 30dB stopband suppression scope, And the stopband suppression scope of more than 20dB is shown in Table 1.

Embodiment 2

(1) weigh according to following mass percent: the ceramic powder of 51%, the solvent of 40%, the plasticizer of 2.5%, 6% viscous Knot agent and the dispersant of 0.5%, wherein, ceramic powder be the tangent value of the dielectric loss angle after sintering be 1.67 × 10^-4, and be situated between Electric constant is the alumina-based ceramic powder of 13.6, and the specific surface area of ceramic powder is 6m²/ g, the particle surface of ceramic powder Positively charged characteristic；Solvent is the mixture of ethanol and ethyl acetate, and the mass ratio of ethanol and ethyl acetate is 3:7；Plasticizer For Polyethylene Glycol；Binding agent is polyvinyl butyral, and dispersant is oleic acid.

(2) by above-mentioned ceramic powder, solvent, plasticizer and dispersant ball milling 15 hours, it is subsequently adding binding agent, continues Continuous ball milling 35 hours, ball milling frequency is 90Hz, obtains ceramic size.

(3) this ceramic size being stood 30 minutes, flow casting molding, one thickness of formation is the first medium of 240 microns respectively The 3rd medium green body layer that the second medium green body layer that green body layer, two thickness are 43 microns, thickness are 220 microns, two Individual thickness be the 3rd medium green body layer of 35 microns, thickness be that the 4th medium green body layer of 220 microns, two thickness are The 4th medium green body layer of 45 microns and thickness are 240 trifling lid base substrates, and at second medium green body layer, the 3rd medium base Multiple electrical connection hole is all offered, first medium base substrate, second medium green body layer, the 3rd Jie on body layer and the 4th medium green body layer Registration holes is all offered in matter green body layer and the 4th medium green body layer.

(4) employing silver slurry silk screen printing formation thickness on a surface of the first medium green body layer that thickness is 240 microns is First electrode pattern of 10 microns, obtains base plate base substrate.

(5) the first medium green body layer at base plate base substrate is formed with one thickness of stacking in the one side of the first electrode pattern is 43 micro- The second medium green body layer of rice, then in this second medium green body layer away from using silver slurry screen printing scopiform in the one side of base plate base substrate The second electrode pattern that Cheng Yousan interval setting and the electrode that thickness is 10 microns form, and at the electricity of this second medium green body layer Connecting hole is filled silver slurry, obtains first the first electric capacity green body layer；Then, second Jie of first the first electric capacity green body layer It is the second medium green body layer of 43 microns that matter green body layer is formed with another thickness of stacking in the one side of the second electrode pattern, then, Starch silk screen printing forming thickness away from employing silver in the one side of first the first electric capacity green body layer in this second medium green body layer is 10 Second electrode pattern of micron, and in the electrical connection hole of this second medium green body layer, fill silver slurry, obtain second the first electric capacity Green body layer, under the effect being filled in the silver slurry in electrical connection hole of second medium green body layer, the first electrode pattern and two first electricity The second electrode pattern holding green body layer is collectively forming three the first electric capacity, and each first electric capacity be the first electrode pattern, first One electrode of the first electric capacity green body layer and the second electrode pattern of second electric capacity base substrate are collectively forming；Wherein, by with para-position On the basis of hole, hole is to realize the accurate para-position of multiple second medium green body layer and first medium green body layer.

(6) first stacking thickness it is formed with in the one side of the second electrode pattern in a second medium green body layer farthest from base plate base substrate It is the 3rd medium green body layer of 220 microns, uses silver slurry in the 3rd medium green body layer away from the surface of the first capacitor cell base substrate Upper silk screen printing thickness is three spaced electrodes of 10 microns, simultaneously electrical connection hole in the 3rd medium green body layer Fill silver slurry, obtain first inductance green body layer；Then, the second medium base substrate first inductance green body layer is formed with electrode One side on stacking a layer thickness be the 3rd medium green body layer of 35 microns, and use silver slurry silk screen in the 3rd medium green body layer Print thickness is three spaced electrodes of 10 microns, fills silver in the electrical connection hole of the 3rd medium green body layer simultaneously Slurry, obtains second inductance green body layer；Then, the second medium base substrate second inductance green body layer is formed with the one side of electrode Another layer thickness of upper stacking is the 3rd medium green body layer of 35 microns, and uses silver slurry silk screen printing in the 3rd medium green body layer Thickness is three spaced electrodes of 10 microns, meanwhile, fills silver slurry in the electrical connection hole of the 3rd medium green body layer, Obtaining the 3rd inductance green body layer, the electrical connection Kong Zhongyin being filled in the 3rd medium green body layer starches three the 3rd inductance green body layer Electrode is electrically connected to form the inductance of three series connection, and the electrode that each inductance is three inductance green body layer is sequentially connected in series formation, By an electrode of first inductance green body layer and the series connection of an electrode of the 3rd inductance green body layer and by two adjacent inductance Connect, and each first electric capacity and an inductance are connected.Wherein, the 3rd medium green body layer is realized by hole on the basis of registration holes The accurate para-position of lamination process.

(7) in a threeth medium green body layer farthest from the first electric capacity green body layer, stacking thickness is the 4th medium of 220 microns Green body layer, uses silver slurry to be by thickness away from silk screen printing formation in the one side of inductance unit base substrate in the 4th medium green body layer 10 microns and the 3rd electrode pattern of spaced three electrodes composition, meanwhile, in the electrical connection hole of the 4th medium base substrate Fill silver slurry, obtain first the second electric capacity green body layer；The 4th medium green body layer first the second electric capacity green body layer is formed again Having stacking a layer thickness in the one side of the 3rd electrode pattern is the 4th medium green body layer of 35 microns, and uses silver slurry the 4th Jie In matter green body layer, silk screen printing is formed and is 10 microns by thickness and the 3rd electrode pattern that spaced three electrodes form, with Time in the electrical connection hole of the 4th medium green body layer fill silver slurry, obtain second the second electric capacity green body layer；Then, second It is 35 micro-that 4th medium green body layer of individual second electric capacity green body layer is formed with another layer thickness of stacking in the one side of the 3rd electrode pattern Rice the 4th medium green body layer, and use silver slurry in the 4th medium green body layer silk screen printing formed by thickness be 10 microns and Spaced three electrodes composition the 3rd electrode pattern, meanwhile, fills silver slurry in the electrical connection hole of the 4th medium green body layer, Obtaining the 3rd the second electric capacity green body layer, the silver slurry being filled in the electrical connection hole of the 4th medium green body layer is by three the second electric capacity bases 3rd electrode pattern of body layer is electrically connected to form three the second electric capacity, and that each second electric capacity is three the second electric capacity green body layer Individual electrode is collectively forming, and the silver slurry being filled in the electrical connection hole of the 4th medium green body layer makes each second electric capacity and an inductance also Connection.Wherein, the accurate para-position of the 4th medium green body layer lamination process is realized by hole on the basis of registration holes.

(9) laminated construction uses the method for isostatic pressed in 65 DEG C, pressurize 12 under conditions of 30MPa, obtains laminate.

(10) laminate is warming up to 200 DEG C with the heating rate of 0.45 DEG C/min and is incubated 6 hours, then with 0.45 DEG C/min Heating rate is warming up to 490 DEG C and is incubated 12 hours, carries out binder removal, is then warming up to 500 DEG C with the heating rate of 1 DEG C/min, It is warming up to 870 DEG C again with the heating rate of 2 DEG C/min, and heat preservation sintering 3 hours, natural cooling is lowered the temperature, is obtained length and width high score Wei the ceramic body of 3.2mm, 1.6mm and 0.9mm.Then, ceramic body is ground 30 with zirconia cylindrical body common rotation Hour, and rotational frequency is 70Hz, with by ceramic body chamfering.

(11) method that the two ends of ceramic body are respectively adopted " dipping in silver " forms the first silver layer, and makes two the first silver layers respectively Electrically connect with the two ends of three inductance connected；And use the method being coated with silver wheel rolling painting silver to form two in the both sides, center of ceramic body Individual the second silver layer being oppositely arranged；Then will be formed with ceramic body heat treatment in continuous tunnel furnace of the first silver layer and the second silver layer, After, remove the residue of first silver layer surface at two ends, and on the silver electrode at two ends, be coated with nickel dam and tin layers the most successively, To low pass filter.

The method of testing using embodiment 1 identical obtains the 3dB cut-off frequency of low pass filter of the present embodiment, operating frequency model Enclosing and suppress with stopband, wherein, Fig. 8 is the insertion loss curve of the low pass filter of the present embodiment, as can be drawn from Figure 8 originally The stopband of the operating frequency range of the low pass filter of embodiment, the stopband suppression scope of more than 30dB and more than 20dB presses down Scope processed, wherein, the 3dB cut-off frequency of the low pass filter of the present embodiment, operating frequency range, the stopband of more than 30dB press down The stopband suppression scope of scope processed and more than 20dB is shown in Table 1.

Embodiment 3

(1) weigh according to following mass percent: the ceramic powder of 52%, the solvent of 39%, the plasticizer of 2.9%, 5.7% Binding agent and the dispersant of 0.4%, wherein, ceramic powder be the tangent value of dielectric loss angle after sintering be 1.13 × 10^-4, and Dielectric constant is the alumina-based ceramic powder of 3.9, and the specific surface area of ceramic powder is 5.3m²/ g, the granule table of ceramic powder Wear positive charge characteristic；Solvent is the mixture of ethanol and ethyl acetate, and the mass ratio of ethanol and ethyl acetate is 3:7；Plasticising Agent is Polyethylene Glycol；Binding agent is polyvinyl butyral.Dispersant is oleic acid.

(2) by above-mentioned ceramic powder, solvent, plasticizer and dispersant ball milling 10 hours, it is subsequently adding binding agent, continues Continuous ball milling 35 hours, ball milling frequency is 90Hz, obtains ceramic size.

(3) this ceramic size being stood 90 minutes, flow casting molding, one thickness of formation is the first medium of 240 microns respectively The 3rd medium green body layer that the second medium green body layer that green body layer, two thickness are 43 microns, thickness are 220 microns, two Individual thickness be the 3rd medium green body layer of 35 microns, thickness be that the 4th medium green body layer of 220 microns, two thickness are The 4th medium green body layer of 45 microns and thickness are 240 trifling lid base substrates, and at second medium green body layer, the 3rd medium base Multiple electrical connection hole is all offered, first medium base substrate, second medium green body layer, the 3rd Jie on body layer and the 4th medium green body layer Registration holes is all offered in matter green body layer and the 4th medium green body layer.

(5) the first medium green body layer at base plate base substrate is formed with one thickness of stacking in the one side of the first electrode pattern is 43 micro- The second medium green body layer of rice, then in this second medium green body layer away from using silver slurry screen printing scopiform in the one side of base plate base substrate Cheng Yousi interval setting and thickness are the second electrode pattern of the electrode composition of 10 microns, and in this second medium green body layer Electrical connection hole is filled silver slurry, obtains first the first electric capacity green body layer；Then, in the second of first the first electric capacity green body layer It is the second medium green body layer of 43 microns that medium green body layer is formed with another thickness of stacking in the one side of the second electrode pattern, so After, forming thickness in this second medium green body layer away from employing silver slurry silk screen printing in the one side of first the first electric capacity green body layer is Second electrode pattern of 10 microns, and in the electrical connection hole of this second medium green body layer, fill silver slurry, obtain second first electricity Hold green body layer, under the effect being filled in the silver slurry in electrical connection hole of second medium green body layer, the first electrode pattern and two first Second electrode pattern of electric capacity green body layer is collectively forming four the first electric capacity, and each first electric capacity be the first electrode pattern, first One electrode of individual first electric capacity green body layer and the second electrode pattern of second electric capacity base substrate are collectively forming；Wherein, by with right On the basis of hole, position, hole is to realize the accurate para-position of multiple second medium green body layer and first medium green body layer.

(6) first stacking thickness it is formed with in the one side of the second electrode pattern in a second medium green body layer farthest from base plate base substrate It is the 3rd medium green body layer of 220 microns, uses silver slurry in the 3rd medium green body layer away from the surface of the first capacitor cell base substrate Upper silk screen printing thickness is four spaced electrodes of 10 microns, simultaneously electrical connection hole in the 3rd medium green body layer Fill silver slurry, obtain first inductance green body layer；Then, the second medium base substrate first inductance green body layer is formed with electrode One side on stacking a layer thickness be the 3rd medium green body layer of 35 microns, and use silver slurry silk screen in the 3rd medium green body layer Print thickness is four spaced electrodes of 10 microns, fills silver in the electrical connection hole of the 3rd medium green body layer simultaneously Slurry, obtains second inductance green body layer；Then, the second medium base substrate second inductance green body layer is formed with the one side of electrode Another layer thickness of upper stacking is the 3rd medium green body layer of 35 microns, and uses silver slurry silk screen printing in the 3rd medium green body layer Thickness is four spaced electrodes of 10 microns, meanwhile, fills silver slurry in the electrical connection hole of the 3rd medium green body layer, Obtaining the 3rd inductance green body layer, the electrical connection Kong Zhongyin being filled in the 3rd medium green body layer starches three the 3rd inductance green body layer Electrode is electrically connected to form the inductance of four series connection, and the electrode that each inductance is three inductance green body layer is sequentially connected in series formation, And it is filled in the electrical connection Kong Zhongyin slurry of the 3rd medium green body layer by an electrode of first inductance green body layer and the 3rd inductance base The series connection of one electrode of body layer and by two adjacent inductance series connection, and each first electric capacity is connected with an inductance.Wherein, The accurate para-position of the 3rd medium green body layer lamination process is realized by hole on the basis of registration holes.

(7) in a threeth medium green body layer farthest from the first electric capacity green body layer, stacking thickness is the 4th medium of 220 microns Green body layer, uses silver slurry to be by thickness away from silk screen printing formation in the one side of inductance unit base substrate in the 4th medium green body layer 10 microns and the 3rd electrode pattern of spaced two electrodes composition, meanwhile, in the electrical connection hole of the 4th medium base substrate Fill silver slurry, obtain first the second electric capacity green body layer；The 4th medium green body layer first the second electric capacity green body layer is formed again Having stacking a layer thickness in the one side of the 3rd electrode pattern is the 4th medium green body layer of 35 microns, and uses silver slurry the 4th Jie In matter green body layer, silk screen printing is formed and is 10 microns by thickness and the 3rd electrode pattern that spaced two electrodes form, with Time in the electrical connection hole of the 4th medium green body layer fill silver slurry, obtain second the second electric capacity green body layer；Then, second It is 35 micro-that 4th medium green body layer of individual second electric capacity green body layer is formed with another layer thickness of stacking in the one side of the 3rd electrode pattern Rice the 4th medium green body layer, and use silver slurry in the 4th medium green body layer silk screen printing formed by thickness be 10 microns and 3rd electrode pattern of spaced two electrodes composition, meanwhile, fills silver in the electrical connection hole of the 4th medium green body layer Slurry, obtains the 3rd the second electric capacity green body layer, and the silver slurry being filled in the electrical connection hole of the 4th medium green body layer is by three second electricity The 3rd electrode pattern holding green body layer is electrically connected to form second electric capacity of two, and each second electric capacity is three the second electric capacity base substrates One electrode of layer is collectively forming, and the silver slurry being filled in the electrical connection hole of the 4th medium green body layer makes each second electric capacity and one Inductance in parallel.Wherein, the accurate para-position of the 4th medium green body layer lamination process is realized by hole on the basis of registration holes.

(9) laminated construction uses the method for isostatic pressed in 80 DEG C, pressurize 16 minutes under conditions of 25MPa, obtains laminate.

(10) laminate is warming up to 200 DEG C with the heating rate of 0.45 DEG C/min and is incubated 5 hours, then with 0.45 DEG C/min Heating rate is warming up to 490 DEG C and is incubated 10 hours, carries out binder removal, is then warming up to 500 DEG C with the heating rate of 1 DEG C/min, It is warming up to 895 DEG C again with the heating rate of 2 DEG C/min, and heat preservation sintering 2 hours, natural cooling is lowered the temperature, is obtained length and width high score Wei the ceramic body of 3.2mm, 1.6mm and 0.9mm.Then, ceramic body is ground 30 with zirconia cylindrical body common rotation Hour, and rotational frequency is 70Hz, with by ceramic body chamfering.

The method of testing using embodiment 1 identical obtains the 3dB cut-off frequency of low pass filter of the present embodiment, operating frequency model Enclosing and suppress with stopband, wherein, Fig. 9 is the insertion loss curve of the low pass filter of the present embodiment, as can be drawn from Figure 9 originally The stopband of the operating frequency range of the low pass filter of embodiment, the stopband suppression scope of more than 30dB and more than 20dB presses down Scope processed, wherein, the 3dB cut-off frequency of the low pass filter of the present embodiment, operating frequency range, the stopband of more than 30dB press down The stopband suppression scope of scope processed and more than 20dB is shown in Table 1.

Embodiment 4

(1) weigh according to following mass percent: the ceramic powder of 36%, the solvent of 55%, the plasticizer of 1.0%, 7.5% Binding agent and the dispersant of 0.5%, wherein, ceramic powder be the tangent value of dielectric loss angle after sintering be 6 × 10^-4, and dielectric Constant is the alumina-based ceramic powder of 3, and the specific surface area of ceramic powder is 5.9m²/ g, the particle surface band of ceramic powder is just Charge characteristic；Solvent is the mixture of ethanol and ethyl acetate, and the mass ratio of ethanol and ethyl acetate is 3:7；Plasticizer is poly- Ethylene glycol；Binding agent is polyvinyl butyral, and dispersant is oleic acid.

(2) by above-mentioned ceramic powder, solvent, plasticizer and dispersant ball milling 15 hours, it is subsequently adding binding agent, continues Continuous ball milling 15 hours, ball milling frequency is 190Hz, obtains ceramic size.

(3) this ceramic size being stood 45 minutes, flow casting molding, one thickness of formation is the first medium of 240 microns respectively The 3rd medium green body layer that the second medium green body layer that green body layer, two thickness are 43 microns, thickness are 220 microns, one Individual thickness be the 3rd medium green body layer of 35 microns, thickness be that the 4th medium green body layer of 220 microns, a thickness are The 4th medium green body layer of 45 microns and thickness are 240 trifling lid base substrates, and at second medium green body layer, the 3rd medium base Multiple electrical connection hole is all offered, first medium base substrate, second medium green body layer, the 3rd Jie on body layer and the 4th medium green body layer Registration holes is all offered in matter green body layer and the 4th medium green body layer.

(4) using silver slurry silk screen printing on a surface of the first medium green body layer that thickness is 240 microns to form thickness is 5 First electrode pattern of micron, obtains base plate base substrate.

(5) the first medium green body layer at base plate base substrate is formed with one thickness of stacking in the one side of the first electrode pattern is 43 micro- The second medium green body layer of rice, then in this second medium green body layer away from using silver slurry screen printing scopiform in the one side of base plate base substrate The second electrode pattern that the electrode that one-tenth is arranged by two intervals and thickness is 5 microns forms, and at the electricity of this second medium green body layer Connecting hole is filled silver slurry, obtains first the first electric capacity green body layer；Then, second Jie of first the first electric capacity green body layer It is the second medium green body layer of 43 microns that matter green body layer is formed with another thickness of stacking in the one side of the second electrode pattern, then, It is 5 micro-in this second medium green body layer away from using silver slurry silk screen printing to form thickness in the one side of first the first electric capacity green body layer Second electrode pattern of rice, and in the electrical connection hole of this second medium green body layer, fill silver slurry, obtain second the first electric capacity base Body layer, the second electrode pattern of the first electrode pattern and two the first electric capacity green body layer is collectively forming two the first electric capacity, and each First electric capacity is the first electrode pattern, an electrode of first the first electric capacity green body layer and the second electrode of second electric capacity base substrate Pattern is collectively forming；Wherein, by hole on the basis of registration holes to realize multiple second medium green body layer and first medium green body layer Accurate para-position.

(6) first stacking thickness it is formed with in the one side of the second electrode pattern in a second medium green body layer farthest from base plate base substrate It is the 3rd medium green body layer of 220 microns, uses silver slurry in the 3rd medium green body layer away from the surface of the first capacitor cell base substrate Upper silk screen printing thickness is three spaced electrodes of 5 microns, simultaneously electrical connection hole in the 3rd medium green body layer Fill silver slurry, obtain first inductance green body layer；Then, the second medium base substrate first inductance green body layer is formed with electrode One side on stacking a layer thickness be the 3rd medium green body layer of 35 microns, and use silver slurry silk screen in the 3rd medium green body layer Print thickness is three spaced electrodes of 5 microns, fills silver slurry in the electrical connection hole of the 3rd medium green body layer simultaneously, Obtaining second inductance green body layer, the electrical connection Kong Zhongyin being filled in the 3rd medium green body layer starches two the 3rd inductance green body layer Electrode is electrically connected to form the inductance of three series connection, and the electrode that each inductance is two inductance green body layer is sequentially connected in series formation, And it is filled in the electrical connection Kong Zhongyin slurry of the 3rd medium green body layer by an electrode of first inductance green body layer and the 3rd inductance base The series connection of one electrode of body layer and by two adjacent inductance series connection, and each first electric capacity is connected with an inductance.Wherein, The accurate para-position of the 3rd medium green body layer lamination process is realized by hole on the basis of registration holes.

(7) in a threeth medium green body layer farthest from the first electric capacity green body layer, stacking thickness is the 4th medium of 220 microns Green body layer, uses silver slurry to be by thickness away from silk screen printing formation in the one side of inductance unit base substrate in the 4th medium green body layer 5 microns and the 3rd electrode pattern of spaced two electrodes composition, meanwhile, in the electrical connection hole of the 4th medium base substrate Fill silver slurry, obtain first the second electric capacity green body layer；The 4th medium green body layer first the second electric capacity green body layer is formed again Having stacking a layer thickness in the one side of the 3rd electrode pattern is the 4th medium green body layer of 35 microns, and uses silver slurry the 4th Jie In matter green body layer, silk screen printing is formed and is 5 microns by thickness and the 3rd electrode pattern that spaced two electrodes form, with Time in the electrical connection hole of the 4th medium green body layer fill silver slurry, obtain second the second electric capacity green body layer, be filled in the 4th Jie 3rd electrode pattern of three the second electric capacity green body layer is electrically connected to form two second electricity by the silver slurry in the electrical connection hole of matter green body layer Hold, and the electrode that each second electric capacity is two the second electric capacity green body layer is collectively forming, and is filled in the 4th medium green body layer Silver slurry in electrical connection hole makes each second electric capacity and an inductance in parallel.Wherein, the 4th is realized by hole on the basis of registration holes The accurate para-position of medium green body layer lamination process.

(9) laminated construction uses the method for isostatic pressed in 45 DEG C, pressurize 3 minutes under conditions of 45MPa, obtains laminate.

The method of testing using embodiment 1 identical obtains the 3dB cut-off frequency of low pass filter of the present embodiment, operating frequency model Enclosing and suppress with stopband, wherein, Figure 10 is the insertion loss curve of the low pass filter of the present embodiment, as can be drawn from Figure 10 The operating frequency range of the low pass filter of the present embodiment, the stopband suppression scope of more than 30dB and the stopband of more than 20dB Suppression scope, wherein, the 3dB cut-off frequency of the low pass filter of the present embodiment, operating frequency range, the stopband of more than 30dB The stopband suppression scope of suppression scope and more than 20dB is shown in Table 1.

Embodiment 5

(1) weigh according to following mass percent: the ceramic powder of 60%, the solvent of 34.5%, the plasticizer of 1.0%, 4.41% Binding agent and the dispersant of 0.09%, wherein, ceramic powder be the tangent value of dielectric loss angle after sintering be 3 × 10^-4, and Dielectric constant is the alumina-based ceramic powder of 96, and the specific surface area of ceramic powder is 6.3m²/ g, the granule table of ceramic powder Wear positive charge characteristic；Solvent is the mixture of ethanol and ethyl acetate, and the mass ratio of ethanol and ethyl acetate is 3:7；Plasticising Agent is Polyethylene Glycol；Binding agent is polyvinyl butyral, and dispersant is oleic acid.

(2) by above-mentioned ceramic powder, solvent, plasticizer and dispersant ball milling 16 hours, it is subsequently adding binding agent, continues Continuous ball milling 30 hours, ball milling frequency is 50Hz, obtains ceramic size.

(3) this ceramic size being stood 90 minutes, flow casting molding, one thickness of formation is the first medium of 240 microns respectively The 3rd medium green body layer that the second medium green body layer that green body layer, thickness are 43 microns, thickness are 220 microns, four Individual thickness be the 3rd medium green body layer of 35 microns, thickness be that the 4th medium green body layer of 220 microns, a thickness are The 4th medium green body layer of 45 microns and thickness are 240 trifling lid base substrates, and at the 3rd medium green body layer and the 4th medium base All offer multiple electrical connection hole on body layer, be situated between first medium base substrate, second medium green body layer, the 3rd medium green body layer and the 4th Registration holes is all offered in matter green body layer.

(4) employing silver slurry silk screen printing formation thickness on a surface of the first medium green body layer that thickness is 240 microns is First electrode pattern of 12 microns, obtains base plate base substrate.

(5) the first medium green body layer at base plate base substrate is formed with one thickness of stacking in the one side of the first electrode pattern is 43 micro- The second medium green body layer of rice, then in this second medium green body layer away from using silver slurry screen printing scopiform in the one side of base plate base substrate The second electrode pattern that Cheng Youliu interval setting and the electrode that thickness is 12 microns form, obtains the first electric capacity green body layer, is filling out Fill under the effect of the silver slurry in the electrical connection hole of second medium green body layer, the first electrode pattern and the second electricity of the first electric capacity green body layer Pole pattern is collectively forming six the first electric capacity in parallel, and each first electric capacity is the first electrode pattern and the first electric capacity green body layer One electrode is collectively forming；Wherein, by hole on the basis of registration holes to realize second medium green body layer and first medium green body layer Accurate para-position.

(6) first stacking thickness it is formed with in the one side of the second electrode pattern in a second medium green body layer farthest from base plate base substrate It is the 3rd medium green body layer of 220 microns, uses silver slurry in the 3rd medium green body layer away from the surface of the first capacitor cell base substrate Upper silk screen printing thickness is seven spaced electrodes of 12 microns, simultaneously electrical connection hole in the 3rd medium green body layer Fill silver slurry, obtain first inductance green body layer；Then, the second medium base substrate first inductance green body layer is formed with electrode One side on stacking a layer thickness be the 3rd medium green body layer of 35 microns, and use silver slurry silk screen in the 3rd medium green body layer Print thickness is seven spaced electrodes of 12 microns, fills silver in the electrical connection hole of the 3rd medium green body layer simultaneously Slurry, obtains second inductance green body layer；Then, the second medium base substrate second inductance green body layer is formed with the one side of electrode Another layer thickness of upper stacking is the 3rd medium green body layer of 35 microns, and uses silver slurry silk screen printing in the 3rd medium green body layer Thickness is seven spaced electrodes of 12 microns, meanwhile, fills silver slurry in the electrical connection hole of the 3rd medium green body layer, Obtain the 3rd inductance green body layer；To be formed with stacking in the one side of electrode another for second medium base substrate the 3rd inductance green body layer again A layer thickness is the 3rd medium green body layer of 35 microns, and use silver slurry in the 3rd medium green body layer silk screen printing thickness be Seven spaced electrodes of 12 microns, meanwhile, fill silver slurry in the electrical connection hole of the 3rd medium green body layer, obtain the Four inductance green body layer；Finally, the second medium base substrate the 4th inductance green body layer be formed in the one side of electrode stacking another Layer thickness is the 3rd medium green body layer of 35 microns, and use silver slurry in the 3rd medium green body layer silk screen printing thickness be 12 Seven spaced electrodes of micron, meanwhile, fill silver slurry in the electrical connection hole of the 3rd medium green body layer, obtain the 5th Individual inductance green body layer, wherein, is filled in the electrical connection Kong Zhongyin slurry of the 3rd medium green body layer by the electricity of five the 3rd inductance green body layer Pole is electrically connected to form the inductance of seven series connection, and the electrode that each inductance is five inductance green body layer is sequentially connected in series formation, and It is filled in the electrical connection Kong Zhongyin slurry of the 3rd medium green body layer by an electrode of first inductance green body layer and the 3rd inductance base substrate The series connection of one electrode of layer and by adjacent two inductance series connection, and each first electric capacity is connected with an inductance.Wherein, logical Cross hole on the basis of registration holes and realize the accurate para-position of the 3rd medium green body layer lamination process.

(7) in a threeth medium green body layer farthest from the first electric capacity green body layer, stacking thickness is the 4th medium of 220 microns Green body layer, uses silver slurry to form thickness in the 4th medium green body layer away from silk screen printing in the one side of inductance unit base substrate and is 12 Micron and the 3rd electrode pattern of spaced three electrodes composition, fill out in the electrical connection hole of the 4th medium base substrate meanwhile Fill silver slurry, obtain first the second electric capacity green body layer；The 4th medium green body layer first the second electric capacity green body layer is formed again In the one side of the 3rd electrode pattern, stacking a layer thickness is the 4th medium green body layer of 35 microns, and uses silver slurry at the 4th medium In green body layer, silk screen printing is formed and is 12 microns by thickness and the 3rd electrode pattern that spaced three electrodes form, simultaneously In the electrical connection hole of the 4th medium green body layer, fill silver slurry, obtain second the second electric capacity green body layer, be filled in the 4th medium 3rd electrode pattern of two the second electric capacity green body layer is electrically connected to form three second electricity by the silver slurry in the electrical connection hole of green body layer Hold, and the electrode that each second electric capacity is three the second electric capacity green body layer is collectively forming, and is filled in the 4th medium green body layer Silver slurry in electrical connection hole makes each second electric capacity and an inductance in parallel.Wherein, the 4th is realized by hole on the basis of registration holes The accurate para-position of medium green body layer lamination process.

(9) laminated construction uses the method for isostatic pressed in 93 DEG C, pressurize 35 minutes under conditions of 18MPa, obtains laminate.

(10) laminate is warming up to 200 DEG C with the heating rate of 0.5 DEG C/min and is incubated 5 hours, then the liter with 0.5 DEG C/min Temperature ramp is incubated 10 hours to 490 DEG C, carries out binder removal, is then warming up to 500 DEG C with the heating rate of 1 DEG C/min, then It is warming up to 950 DEG C with the heating rate of 2 DEG C/min, and heat preservation sintering 2 hours, natural cooling is lowered the temperature, and obtains length, width and height respectively Ceramic body for 3.2mm, 1.6mm and 0.9mm.Then, ceramic body and zirconia cylindrical body common rotation are ground 20 little Time, and rotational frequency is 80Hz, with by ceramic body chamfering.

(11) method that the two ends of ceramic body are respectively adopted " dipping in silver " forms the first silver layer, and makes two the first silver layers respectively Electrically connect with the two ends of seven inductance connected；And use the method being coated with silver wheel rolling painting silver to form two in the both sides, center of ceramic body Individual the second silver layer being oppositely arranged；Then will be formed with ceramic body heat treatment in continuous tunnel furnace of the first silver layer and the second silver layer, After, remove the residue of first silver layer surface at two ends, and on the silver electrode at two ends, be coated with nickel dam and tin layers the most successively, To low pass filter.

The method of testing using embodiment 1 identical obtains the 3dB cut-off frequency of low pass filter of the present embodiment, operating frequency model Enclosing and suppress with stopband, wherein, Figure 11 is the insertion loss curve of the low pass filter of the present embodiment, can draw from Figure 11 The operating frequency range of the low pass filter of the present embodiment, the stopband suppression scope of more than 30dB and the stopband of more than 20dB Suppression scope, wherein, the 3dB cut-off frequency of the low pass filter of the present embodiment, operating frequency range, the stopband of more than 30dB The stopband suppression scope of suppression scope and more than 20dB is shown in Table 1.

Embodiment 6

(1) weigh according to following mass percent: the ceramic powder of 36%, the solvent of 50.6%, the plasticizer of 4.0%, 8.5% Binding agent and the dispersant of 0.9%, wherein, ceramic powder be the tangent value of dielectric loss angle after sintering be 5 × 10^-4, and be situated between Electric constant is the alumina-based ceramic powder of 50；Solvent is the mixture of ethanol and ethyl acetate, and the matter of ethanol and ethyl acetate Amount ratio is 3:7；Plasticizer is Polyethylene Glycol；Binding agent is polyvinyl butyral, and dispersant is oleic acid.

(2) by above-mentioned ceramic powder, solvent, plasticizer and dispersant ball milling 15 hours, it is subsequently adding binding agent, continues Continuous ball milling 25 hours, ball milling frequency is 150Hz, obtains ceramic size.

(3) this ceramic size being stood 80 minutes, flow casting molding, one thickness of formation is the first medium of 240 microns respectively The 3rd medium green body layer that the second medium green body layer that green body layer, two thickness are 43 microns, thickness are 220 microns, three Individual thickness be the 3rd medium green body layer of 35 microns, thickness be that the 4th medium green body layer of 220 microns, two thickness are The 4th medium green body layer of 45 microns and thickness are 240 trifling lid base substrates, and at second medium green body layer, the 3rd medium base Multiple electrical connection hole is all offered, first medium base substrate, second medium green body layer, the 3rd Jie on body layer and the 4th medium green body layer Registration holes is all offered in matter green body layer and the 4th medium green body layer.

(4) using silver slurry silk screen printing on a surface of the first medium green body layer that thickness is 240 microns to form thickness is 8 First electrode pattern of micron, obtains base plate base substrate.

(5) the first medium green body layer at base plate base substrate is formed with one thickness of stacking in the one side of the first electrode pattern is 43 micro- The second medium green body layer of rice, then in this second medium green body layer away from using silver slurry screen printing scopiform in the one side of base plate base substrate The second electrode pattern becoming thickness to be 8 microns, and in the electrical connection hole of this second medium green body layer, fill silver slurry, obtain first Individual first electric capacity green body layer；Then, the second medium green body layer first the first electric capacity green body layer is formed with the second electrode pattern One side on another thickness of stacking be the second medium green body layer of 43 microns, then, in this second medium green body layer away from first Using silver slurry silk screen printing to form thickness in the one side of individual first electric capacity green body layer is second electrode pattern of 8 microns, and this Filling silver slurry in the electrical connection hole of second medium green body layer, obtain second the first electric capacity green body layer, the first electrode pattern and two the Second electrode pattern of one electric capacity green body layer is collectively forming first electric capacity, and the first electric capacity is the first electrode pattern, the first electricity Second electrode pattern of the second electrode pattern and second electric capacity base substrate that hold green body layer is collectively forming；Wherein, by with registration holes On the basis of hole to realize the accurate para-position of second medium green body layer and first medium green body layer.

(6) first stacking thickness it is formed with in the one side of the second electrode pattern in a second medium green body layer farthest from base plate base substrate It is the 3rd medium green body layer of 220 microns, uses silver slurry in the 3rd medium green body layer away from the surface of the first capacitor cell base substrate Upper silk screen printing thickness is two spaced electrodes of 8 microns, simultaneously electrical connection hole in the 3rd medium green body layer Fill silver slurry, obtain first inductance green body layer；Then, the second medium base substrate first inductance green body layer is formed with electrode One side on stacking a layer thickness be the 3rd medium green body layer of 35 microns, and use silver slurry silk screen in the 3rd medium green body layer Print thickness is two spaced electrodes of 8 microns, fills silver slurry in the electrical connection hole of the 3rd medium green body layer simultaneously, Obtain second inductance green body layer；Then, the second medium base substrate second inductance green body layer is formed with the one side upper strata of electrode Another layer thickness folded is the 3rd medium green body layer of 35 microns, and uses silver slurry silk screen printing thickness in the 3rd medium green body layer It is two spaced electrodes of 8 microns, meanwhile, the electrical connection hole of the 3rd medium green body layer is filled silver slurry, obtains 3rd inductance green body layer；Second medium base substrate the 3rd inductance green body layer is formed with another layer of stacking in the one side of electrode again Thickness is the 3rd medium green body layer of 35 microns, and use silver slurry in the 3rd medium green body layer silk screen printing thickness be 8 microns Two spaced electrodes, meanwhile, in the electrical connection hole of the 3rd medium green body layer fill silver slurry, obtain the 4th electricity Sense green body layer, wherein, is filled in the electrical connection Kong Zhongyin slurry electrode electricity by four the 3rd inductance green body layer of the 3rd medium green body layer Connect the inductance forming two series connection, and the electrode that each inductance is five inductance green body layer is sequentially connected in series formation, the first electricity Hold and connect with an inductance.Wherein, the accurate para-position of the 3rd medium green body layer lamination process is realized by hole on the basis of registration holes.

(7) in a threeth medium green body layer farthest from the first electric capacity green body layer, stacking thickness is the 4th medium of 220 microns Green body layer, it is 8 micro-for using silver slurry to form thickness in the 4th medium green body layer away from silk screen printing in the one side of inductance unit base substrate 3rd electrode pattern of rice, meanwhile, fills silver slurry in the electrical connection hole of the 4th medium base substrate, obtains first the second electric capacity Green body layer；The 4th medium green body layer first the second electric capacity green body layer is formed with stacking one in the one side of the 3rd electrode pattern again Layer thickness is the 4th medium green body layer of 35 microns, and use silver slurry in the 4th medium green body layer silk screen printing formed thickness be 8 micron of the 3rd electrode pattern, fills silver slurry simultaneously in the electrical connection hole of the 4th medium green body layer, obtains second second electricity Hold green body layer；Then, the 4th medium green body layer second the second electric capacity green body layer is formed in the one side of the 3rd electrode pattern Another layer thickness of stacking is the 4th medium green body layer of 35 microns, and uses silver slurry screen printing scopiform in the 4th medium green body layer The 3rd electrode pattern becoming thickness to be 8 microns, meanwhile, fills silver slurry in the electrical connection hole of the 4th medium green body layer, obtains 3rd the second electric capacity green body layer, the silver slurry being filled in the electrical connection hole of the 4th medium green body layer is by three the second electric capacity green body layer The 3rd electrode pattern be electrically connected to form second electric capacity, wherein, be filled in the silver in the electrical connection hole of the 4th medium green body layer Slurry makes the second electric capacity and an inductance in parallel.Wherein, the 4th medium green body layer lamination process is realized by hole on the basis of registration holes Accurate para-position.

(9) laminated construction uses the method for isostatic pressed in 60 DEG C, pressurize 10 minutes under conditions of 40MPa, obtains laminate.

(10) laminate is warming up to 200 DEG C with the heating rate of 0.45 DEG C/min and is incubated 5 hours, then with 0.45 DEG C/min Heating rate is warming up to 490 DEG C and is incubated 10 hours, carries out binder removal, is then warming up to 500 DEG C with the heating rate of 1 DEG C/min, It is warming up to 790 DEG C again with the heating rate of 2 DEG C/min, and heat preservation sintering 2 hours, natural cooling is lowered the temperature, is obtained length and width high score Wei the ceramic body of 3.2mm, 1.6mm and 0.85mm.Then, ceramic body is ground 30 with zirconia cylindrical body common rotation Hour, and rotational frequency is 70Hz, with by ceramic body chamfering.

(11) method that the two ends of ceramic body are respectively adopted " dipping in silver " forms the first silver layer, and makes two the first silver layers respectively Electrically connect with the two ends of two inductance connected；And use the method being coated with silver wheel rolling painting silver to form two in the both sides, center of ceramic body Individual the second silver layer being oppositely arranged；Then will be formed with ceramic body heat treatment in continuous tunnel furnace of the first silver layer and the second silver layer, After, remove the residue of first silver layer surface at two ends, and on the silver electrode at two ends, be coated with nickel dam and tin layers the most successively, To low pass filter.

The method of testing using embodiment 1 identical obtains the 3dB cut-off frequency of low pass filter of the present embodiment, operating frequency model Enclosing and suppress with stopband, wherein, Figure 12 is the insertion loss curve of the low pass filter of the present embodiment, can draw from Figure 12 The operating frequency range of the low pass filter of the present embodiment, the stopband suppression scope of more than 30dB and the stopband of more than 20dB Suppression scope, wherein, the 3dB cut-off frequency of the low pass filter of the present embodiment, operating frequency range, the stopband of more than 30dB The stopband suppression scope of suppression scope and more than 20dB is shown in Table 1.

Comparative example 1

The preparation process of the low pass filter of comparative example 1 is as follows:

The ceramic powder of (1) 36%, the solvent of 50.6%, the plasticizer of 4.0%, the binding agent of 8.5% and the dispersant of 0.9%, Wherein, the tangent value of the dielectric loss angle after ceramic powder is sintering is 5 × 10^-4, and alumina base that dielectric constant is 50 pottery Ceramic powder；Solvent is the mixture of ethanol and ethyl acetate, and the mass ratio of ethanol and ethyl acetate is 3:7；Plasticizer is poly-second Glycol；Binding agent is polyvinyl butyral, and dispersant is oleic acid.

(3) this ceramic size being stood 80 minutes, flow casting molding, one thickness of formation is the first medium of 240 microns respectively The 3rd medium green body layer that the second medium green body layer that green body layer, two thickness are 43 microns, thickness are 220 microns, three Individual thickness is the 3rd medium green body layer of 35 microns and thickness is 240 trifling lid base substrates, and in second medium green body layer and Multiple electrical connection hole is all offered, in first medium base substrate, second medium green body layer and the 3rd medium green body layer in three medium green body layer On all offer registration holes.

(7) upper strata, the side imbrication body base of electrode it is formed with in the 3rd medium green body layer that the base plate base substrate farthest from inductor layer is farthest Body, and make lid base substrate cover the electrode in the 3rd medium green body layer of the 4th the 3rd medium green body layer, obtain laminated construction.

(8) laminated construction uses the method for isostatic pressed in 60 DEG C, pressurize 10 minutes under conditions of 40MPa, obtains laminate.

(9) laminate is warming up to 200 DEG C with the heating rate of 0.45 DEG C/min and is incubated 5 hours, then with 0.45 DEG C/min Heating rate is warming up to 490 DEG C and is incubated 10 hours, carries out binder removal, is then warming up to 500 DEG C with the heating rate of 1 DEG C/min, It is warming up to 790 DEG C again with the heating rate of 2 DEG C/min, and heat preservation sintering 2 hours, natural cooling is lowered the temperature, is obtained length and width high score Wei the ceramic body of 3.2mm, 1.6mm and 0.85mm.Then, ceramic body is ground 30 with zirconia cylindrical body common rotation Hour, and rotational frequency is 70Hz, with by ceramic body chamfering.

(10) method that the two ends of ceramic body are respectively adopted " dipping in silver " forms the first silver layer, and makes two the first silver layers respectively Electrically connect with the two ends of two inductance connected；And use the method being coated with silver wheel rolling painting silver to form two in the both sides, center of ceramic body Individual the second silver layer being oppositely arranged；Then will be formed with ceramic body heat treatment in continuous tunnel furnace of the first silver layer and the second silver layer, After, remove the residue of first silver layer surface at two ends, and on the silver electrode at two ends, be coated with nickel dam and tin layers the most successively, To low pass filter.

The method of testing using embodiment 1 identical obtains the 3dB cut-off frequency of low pass filter of comparative example 1, operating frequency model Enclosing and suppress with stopband, wherein, Figure 13 is the insertion loss curve of the low pass filter of comparative example 1, can draw from Figure 13 The operating frequency range of the low pass filter of comparative example 1,30dB suppress the stopband of scope and more than 20dB to suppress with stopband Scope, wherein, the 3dB cut-off frequency of the low pass filter of comparative example 1, operating frequency range, the stopband suppression of more than 30dB The stopband suppression scope of scope and more than 20dB is shown in Table 1.

Embodiment 1 that what table 1 represented is～6 and the 3dB cut-off frequency of low pass filter of comparative example 1, operating frequency range, 30dB The stopband suppression scope of above stopband suppression scope and more than 20dB.

Table 1

As can be seen from Table 1: comparative example 1 is 270MHz with the 3dB cut-off frequency of embodiment 6, and comparative example 1 arrives Frequency when reaching initial 20dB is 990MHz, and frequency when embodiment 6 reaches initial 20dB is only 370MHz.Therefore, real The intermediate zone executed between passband and the stopband of the low pass filter of example 6 has more precipitous attenuation characteristic.

The low pass filter of comparative example 1 is 990～7800MHz more than 20dB stopband suppression frequency range；And embodiment 6 Low pass filter is 3700～12000MHz more than 20dB stopband suppression frequency range.Therefore, the low pass filter of embodiment 6 Stopband suppression frequency range wider.

Being computed, the minima of stopband suppression of the 20dB of the low pass filter of comparative example 1 with the ratio of 3dB cut-off frequency is 3.67, and the ratio of the minima of the stopband of the 20dB of the low pass filter of embodiment 6 suppression and 3dB cut-off frequency is 1.37, Much smaller than comparative example 1, illustrating that the stopband of embodiment 6 suppresses, i.e. the low pass filter of embodiment 6 is at the beginning of 3dB dot frequency reaches The slope of beginning 20dB dot frequency is the steepest, and the intermediate zone between passband and stopband has more precipitous attenuation characteristic, and scope is wider Stopband suppression frequency, more excellent stopband rejection characteristic.And the stopband suppression of the 20dB of the low pass filter of embodiment 1～5 The ratio of minima and 3dB cut-off frequency be respectively 1.55,1.12,1.07,1.07 and 1.5, i.e. the low pass of embodiment 1～5 The slope that wave filter reaches initial 20dB dot frequency from 3dB dot frequency is the steepest, and the intermediate zone between passband and stopband also has more Precipitous attenuation characteristic, scope broader stopband suppression frequency, more excellent stopband rejection characteristic.

Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not in above-described embodiment The all possible combination of each technical characteristic be all described, but, as long as there is not contradiction in the combination of these technical characteristics, All it is considered to be the scope that this specification is recorded.

Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and in detail, but can not be because of This and be construed as limiting the scope of the patent.It should be pointed out that, for the person of ordinary skill of the art, not On the premise of departing from present inventive concept, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.Cause This, the protection domain of patent of the present invention should be as the criterion with claims.

Claims

1. a low pass filter, it is characterised in that include that ceramic body, described ceramic body include base plate and depend on Secondary the first capacitor layers, multiple inductor layer and multiple second capacitor layers being laminated on described base plate, wherein:

Described first capacitor layers is laminated on described first medium layer, and described first capacitor layers includes second medium Layer and the second electrode pattern being formed in described second dielectric layer, described second electrode pattern and described first Electrode pattern is collectively forming at least one the first electric capacity, and each described first electric capacity is described first electrode figure Case is collectively forming with described second electrode pattern；

Multiple described inductor layers stack gradually in described second dielectric layer, and each described inductor layer includes the 3rd Dielectric layer and the electrode at multiple intervals being formed on described 3rd dielectric layer, multiple described inductor layers multiple Described electrode is electrically connected to form the inductance of multiple series connection, and a described electrode series connection of multiple described inductor layer Form a described inductance, wherein, each described first electric capacity and a described inductance series connection；

Multiple described second capacitor layers stack gradually in described threeth Jie farthest from described first capacitor layers On matter layer, each described second capacitor layers includes the 4th dielectric layer and be formed on described 4th dielectric layer Three electrode patterns, described 3rd electrode pattern of multiple described second capacitor layers is collectively forming at least one second Electric capacity, and the described 3rd common shape of electrode pattern that each described second electric capacity is multiple described second capacitor layers Become, each described second electric capacity and a described inductance in parallel.

Low pass filter the most according to claim 1, it is characterised in that each described inductor layer also wraps Including multiple the first electric binding post being arranged in described 3rd dielectric layer, described first electric binding post is by multiple described One described electrode of inductor layer is sequentially connected in series one described inductance of formation, and described first electric binding post will be separated by One described electrode of two farthest described inductor layers is electrically connected so that adjacent two described inductance series connection, and Described first electric binding post is by each described first electric capacity and a described inductance series connection；Each described second electricity Holding layer and also include multiple the second electric binding post being arranged in described 4th dielectric layer, described second electric binding post will Described 3rd electrode pattern of multiple described second capacitor layers and described inductance are electrically connected so that each described second Electric capacity and a described inductance in parallel.

Low pass filter the most according to claim 1, it is characterised in that described first capacitor layers is many Individual, multiple described first capacitor layers stack gradually on described first medium layer, multiple described first capacitor layers The first electrode pattern of described second electrode pattern and described base plate be collectively forming at least one described first electricity Holding, each described first electric capacity is described second electrode pattern and described first of multiple described first capacitor layers Electrode pattern is collectively forming, and wherein, multiple described inductor layers stack gradually in one farthest from described base plate In the described second dielectric layer of described first capacitor layers.

Low pass filter the most according to claim 1, it is characterised in that described 4th dielectric layer, institute Stating the 3rd dielectric layer, described second dielectric layer is identical ceramic material with the material of described first medium layer.

Low pass filter the most according to claim 1, it is characterised in that described 4th dielectric layer, institute State the 3rd dielectric layer, described second dielectric layer the least with the tangent value of the dielectric loss angle of described first medium layer In or equal to 6 × 10^-4。

Low pass filter the most according to claim 1, it is characterised in that described 4th dielectric layer, institute State the 3rd dielectric layer, described second dielectric layer is 3～96 with the dielectric constant of described first medium layer.

7. the preparation method of a low pass filter, it is characterised in that comprise the steps:

First medium green body layer is provided, a surface of described first medium green body layer forms the first electrode Pattern, obtains base plate base substrate；

Second medium green body layer is provided, is formed with described first electrode pattern in described first medium green body layer Second medium green body layer described in stacking in one side, and in described second medium green body layer, form the second electrode figure Case, and make described second electrode pattern and described first electrode pattern be collectively forming at least one the first electric capacity, And described second electricity that each described first electric capacity is described first electrode pattern and described first electric capacity green body layer Pole pattern is collectively forming, and obtains the first electric capacity green body layer；

Multiple 3rd medium green body layer is provided, is formed with described second electrode figure in described second medium green body layer In the one side of case, according to the described 3rd medium green body layer of stacking one layer, then in described 3rd medium green body layer Form the order repetitive operation of multiple spaced electrode, to form the inductance green body layer of multiple stacking, and The multiple described electrode making multiple described inductance green body layer is electrically connected to form the inductance of multiple series connection, multiple described One described electrode series connection of inductance green body layer forms a described inductance, and make each described first electric capacity with One described inductance series connection；

There is provided multiple 4th medium green body layer, at one the described 3rd farthest from described first electric capacity green body layer Medium green body layer is formed in the one side of described electrode, according to the described 4th medium green body layer of stacking one layer, then Described 4th medium green body layer forms the order repetitive operation of the 3rd electrode pattern, to form multiple stacking The second electric capacity green body layer, and make described 3rd electrode pattern of multiple described second capacitor layers together form at Few second electric capacity, each described second electric capacity is described 3rd electricity of multiple described second electric capacity green body layer Pole pattern is collectively forming, and makes each described second electric capacity and a described inductance in parallel, obtains laminated construction；

Described laminated construction is laminated, obtains laminate；

Described laminate is sintered, obtains ceramic body；And

Described ceramic body is formed external electrode, obtains low pass filter.

The preparation method of low pass filter the most according to claim 7, it is characterised in that the described 3rd Multiple electrical connection hole is all offered in medium green body layer and described 4th medium green body layer；Wherein, described While forming the step of multiple spaced described electrode in three medium green body layer, at described 3rd medium The described electrical connection hole of green body layer is filled the first conductive material, and makes to be filled in described 3rd medium green body layer Described electrical connection hole in described first conductive material by a described electrode of multiple described inductance green body layer It is sequentially connected in series one described inductance of formation, and by described in one of the two of furthest apart described inductance green body layer Electrode is electrically connected so that adjacent two described inductance series connection, and makes to be filled in the institute of described 3rd medium green body layer State described first conductive material in electrical connection hole by each described first electric capacity and a described inductance series connection； While described 4th medium green body layer is formed the step of described 3rd electrode pattern, it is situated between the described 4th The second conductive material is filled in the described electrical connection hole of matter green body layer, so that being filled in described 4th medium base substrate Described electrical connection hole in described second conductive material described 3rd electrode pattern is electrically connected with described inductance And make each described second electric capacity and a described inductance in parallel.

The preparation method of low pass filter the most according to claim 7, it is characterised in that obtain described The step of the first electric capacity green body layer, particularly as follows: provide multiple described second medium green body layer, is situated between described first Matter green body layer is formed in the one side of described first electrode pattern, according to the described second medium base substrate of stacking one layer Layer, then in described second medium green body layer, form the order repetitive operation of described second electrode pattern, with shape Become multiple stack gradually in the one side that described first medium green body layer is formed with described first electrode pattern One electric capacity green body layer, and make described second electrode pattern and described first of multiple described first electric capacity green body layer Electrode pattern is collectively forming at least one described first electric capacity, and each described first electric capacity is multiple described Described second electrode pattern of one capacitor layers is collectively forming with described first electrode pattern；Wherein, from described The farthest described second medium green body layer of base plate green body layer is formed with the one side of described second electrode pattern On, according to the described 3rd medium green body layer of stacking one layer, then formed multiple in described 3rd medium green body layer The order repetitive operation of spaced described electrode.

Low pass filter the most according to claim 7, it is characterised in that by described laminated structural layers Pressure step particularly as follows: use isostatic pressed method by described laminated construction in 45～93 DEG C, 18～45MPa Under the conditions of pressurize 3～35 minutes.