CN105825992A - Cooling structure for high-temperature superconduction current lead wire - Google Patents
Cooling structure for high-temperature superconduction current lead wire Download PDFInfo
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- CN105825992A CN105825992A CN201610266937.2A CN201610266937A CN105825992A CN 105825992 A CN105825992 A CN 105825992A CN 201610266937 A CN201610266937 A CN 201610266937A CN 105825992 A CN105825992 A CN 105825992A
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- copper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/04—Cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
- H01F6/065—Feed-through bushings, terminals and joints
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- Containers, Films, And Cooling For Superconductive Devices (AREA)
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Abstract
The invention belongs to the field of current lead wire cooling technology research, and particularly relates to a cooling structure for a high-temperature superconduction current lead wire. The cooling structure comprises an uncharged copper insert and a charged copper insert which are made of high-pure copper and are completely matched, as well as multiple insulation sheets which are positioned between the uncharged copper insert and the charged copper insert. After the multiple insulation sheets are placed between the uncharged copper insert and the charged copper insert, the two copper inserts are inserted into each another, and then are brazed and molded to form a complete heat-conduction insulation structural component. The high-temperature superconduction lead wire is connected with a copper current lead wire through the charged copper insert structure, the charged copper insert is in contact with the uncharged copper insert structure through the multiple insulation sheets, and the uncharged copper insert structure is in direct contact with a cold conduction plate. According to the cooling structure, the heat transfer area is increased by means of the insert structures, and the high-temperature superconduction current lead wire cooling effect is improved. The cooling structure has the beneficial effects of better cooling effect and safe and reliable whole structure operation, and can be used for providing certain protection to the high-temperature superconduction current lead wire under an accident condition.
Description
Technical field
The invention belongs to the cooling technology research field of current feed, be specifically related to a kind of for high-temperature superconductive lead wire cooling structure.
Background technology
Superconducting magnet needs to run in low temperature environment, generally uses liquid helium to cool down, and running temperature is about subzero 270 degrees Celsius.Carrying out excitation for superconducting magnet and maintain the power supply of its stable operation to need to run on room temperature environment, running temperature is about 25 degrees Celsius above freezing.Connection wire between magnet and electric current, the temperature upper end having a section lead is room temperature, and lower end is low temperature, and this section lead is typically special is referred to as current feed.Current feed upper end connects normal cable, then connects with power supply.Current feed lower end connects with low-temperature superconducting line, accesses superconducting magnet winding.
In superconducting magnet normally operation, constantly having heat to be entered cryogenic system by the conduction of heat of current feed, the Joule heat simultaneously produced in current feed also enters cryogenic system.Current feed needs to reduce the heat of entrance cryogenic system by optimizing design.Electric current in early days generally uses high purity copper manufacture.Being the heat reducing further and entering superconducting magnet in recent years, high-temperature superconductor band is applied to current feed technology.High-temperature superconductor band is applied to the liquid helium temperature current feed section to liquid nitrogen temperature interval, the current feed section employing high purity copper manufacture that liquid nitrogen temperature to ambient temperature is interval, so constitutes the binary current lead being made up of copper current lead-in wire with high-temperature superconductive lead wire.
High-temperature superconductive lead wire temperature end in binary current lead needs effectively cooling, to prevent its temperature too high.The cooling cold of the temperature end of high-temperature superconductive lead wire is typically derived from the conduction cooling plate of liquid nitrogen temperature.So need to design effective cooling structure between conduction cooling plate and high temperature current feed temperature end, for cooling high-temperature superconducting current feed.
Cooling structure requires to reduce as far as possible the temperature difference between conduction cooling plate and high-temperature superconductive lead wire, ensures electric insulation between the two simultaneously, and this structure is a high conductive structure of high insulation.This structure has employing aluminium nitride to realize, aluminium nitride good heat conductivity and insulation, but aluminium nitride belongs to ceramic-like materials, and operation pressure is the most broken.This structure also has insulating thin or the thin film using high score subclass, and such material insulation property is good, safe and reliable in operating process, but such material thermal conductivity is low, and heat-transfer effect is poor.
Summary of the invention
It is an object of the invention to provide a kind of for high-temperature superconductive lead wire cooling structure for the problems referred to above, this cooling structure does not contains frangible ceramic-like materials, heat transfer area is increased by inserted sheet design, thus reduce the heat transfer temperature difference between coldplate and high temperature current feed, improve cooling effect.
The technical scheme is that a kind of high-temperature superconductive lead wire cooling structure, including without electrolytic copper inserted sheet, charged copper plug and without the multilayer insulation thin slice between electrolytic copper inserted sheet and charged copper plug；
Described inserted sheet without electrolytic copper includes that multiple the first copper coins stacked, one end of the first copper coin are connected by soldering, and the other end is opening, forms the first groove between the first adjacent copper coin；
Described charged copper plug includes that multiple the second copper coins stacked, one end of the second copper coin are connected by soldering, and the other end is opening, forms the second groove between the second adjacent copper coin；
Described multilayer insulation thin slice is arc type, including multilayer insulation thin slice, forms the 3rd groove between adjacent heat insulating lamella, and the opening of adjacent described 3rd groove is towards on the contrary；
First copper coin of described inserted sheet without electrolytic copper inserts in the 3rd groove of described multilayer insulation thin slice side respectively, and the second copper coin of described charged copper plug inserts in the 3rd groove of described multilayer insulation thin slice opposite side respectively.
In such scheme, one end of undermost second copper coin of described charged copper plug is welded with high-temperature superconductive lead wire adapter plate.
In such scheme, the other end of undermost second copper coin of described charged copper plug is welded with copper current pigtail splice plate.
In such scheme, the first copper coin width of the described the superiors of inserted sheet without electrolytic copper more than first copper coin of other layer, the first copper coin of the superiors wider than other layer the first copper coin go out position be provided with bolt hole.
In such scheme, the thickness of every layer of heat insulating lamella of described multilayer insulation thin slice is less than or equal to 0.2 millimeter.
The invention has the beneficial effects as follows: compared with prior art, the present invention is used for high-temperature superconductive lead wire cooling structure, owing to have employed blade inserting structure, in identical space, add heat exchange area, improve heat-transfer capability, improve high-temperature superconductive lead wire cooling effect.The present invention is used for high-temperature superconductive lead wire cooling structure, operates more safe and reliable, does not use the ceramic material of aluminium nitride class in whole device, avoid the frangible feature of these structures, owing to have employed multilayer insulation thin slice, the most integral braze-welded sizing, the operation of whole device is more safe and reliable.The present invention is used for high-temperature superconductive lead wire cooling structure, under accident conditions, high temperature current feed can be provided certain protected effect, when system has an accident, system is shut down at once, refrigeration system can not provide cold for conduction cooling plate, high-temperature superconductive lead wire can not be effectively cooled, now high-temperature superconductive lead wire is still connected with big electric current, it is likely to be broken, and the cooling structure of the present invention, have employed more copper product, these copper materials serve Cryoprecipitation effect, in structure, the cold of copper storage can suppress high-temperature superconductive lead wire temperature to rise after the system failure, thus protect high-temperature superconductive lead wire.
Accompanying drawing explanation
Fig. 1 is that the high-temperature superconductive lead wire cooling structure of an embodiment of the present invention splits schematic diagram；
Fig. 2 is that the high-temperature superconductive lead wire cooling structure of an embodiment of the present invention assembles schematic diagram；
Fig. 3 is the temperature super-conducting magnet system principle schematic of the high-temperature superconductive lead wire cooling structure using the present invention；
Fig. 4 is the numerical simulation result of the cooling effect using existing copper coin cooling structure；
Fig. 5 is the cooling effect numerical simulation result of the blade inserting cooling structure using an embodiment of the present invention.
In figure: 1, helium liquid pipe；2, low-temperature superconducting line；3, high-temperature superconductive lead wire；4, high-temperature superconductive lead wire chiller；5, conduction cooling plate, 6, copper current lead-in wire；7, Cryo Refrigerator；8, cryogenic magnet；9, liquid helium vessel；10, helium tube；11, cold screen；12, two grades of cold header heat exchangers of refrigeration machine；13, refrigeration machine one-level cold header heat exchanger；14, Dewar vessel；15, safety line；16, without electrolytic copper inserted sheet；17, multilayer insulation thin slice；18, charged copper plug；19, high-temperature superconductive lead wire adapter plate；20, copper current pigtail splice plate；21, the first copper coin；22, the first groove；23, the second copper coin；24, the second groove；25, the 3rd groove.
Detailed description of the invention
The present invention is described in further detail by detailed description of the invention below in conjunction with the accompanying drawings, but protection scope of the present invention is not limited to this.
Fig. 1 and Fig. 2 show described a kind of embodiment for high-temperature superconductive lead wire cooling structure, a kind of high-temperature superconductive lead wire cooling structure, including the inserted sheet without electrolytic copper mated completely 16 using high purity copper to make and charged copper plug 18, and without the multilayer insulation thin slice 17 between electrolytic copper inserted sheet 16 and charged copper plug 18.
Described inserted sheet without electrolytic copper 16 includes multiple the first copper coins 21 stacked, and one end of the first copper coin 21 is concordant to be connected by soldering, and the other end is opening, forms the first groove 22 between the first adjacent copper coin 21.Described charged copper plug 18 includes multiple the second copper coins 23 stacked, and one end of the second copper coin 23 is concordant to be connected by soldering, and the other end is opening, forms the second groove 24 between the second adjacent copper coin 23.Described multilayer insulation thin slice 17 is in arc type, including multilayer insulation thin slice, forming the 3rd groove 25 between adjacent heat insulating lamella, the opening of adjacent described 3rd groove 25 is towards on the contrary, and the thickness of every layer of heat insulating lamella of described multilayer insulation thin slice 17 is less than or equal to 0.2 millimeter.Described inserted sheet without electrolytic copper 16 and charged copper plug 18 are the two pieces of copper plug structures mated completely, first copper coin 21 of described inserted sheet without electrolytic copper 16 inserts in the 3rd groove 25 of described multilayer insulation thin slice 17 side respectively, second copper coin 23 of described charged copper plug 18 inserts in the 3rd groove 25 of described multilayer insulation thin slice 17 opposite side respectively, described multilayer insulation thin slice 17 the superiors extend to the left side, orlop extends to the right, having heat insulating lamella with the position contacted with each other during without electrolytic copper inserted sheet 16 and charged copper plug 18 interfix, after finishing assembly, the position state all in insulation of contact can be ensured.In concrete device, the number of copper coin is the most more is conducive to heat transfer, but its number is limited by installing space and installation site weight capacity.After interfix completes, structure entirety carries out soldering sizing, forms a complete heat conductive insulating structural member.
Fig. 3 show the temperature super-conducting magnet system principle schematic using high-temperature superconductive lead wire cooling structure of the present invention, and whole superconducting magnet is divided into three parts by warm area from outside to inside: Dewar vessel 14, cold screen 11 and liquid helium vessel 9.The cold that whole superconducting magnet is run is provided by small-sized Cryo Refrigerator 7.Cryogenic magnet 8 is placed in liquid helium vessel 9, and magnet is passed through helium liquid pipe 1 after condensing by the helium of thermal evaporation sent into the bottom of liquid helium vessel 9 by helium tube 10, entrance two grades of cold header heat exchangers 12 of refrigeration machine, helium in running.Cold screen 11 is cooled down by conduction cooling plate 5, and the cold of conduction cooling plate 5 is from refrigeration machine one-level cold header heat exchanger 13.Safety line 15, is used for preventing helium system pressure too high.Cryogenic magnet 8 passes sequentially through low-temperature superconducting line 2, high-temperature superconductive lead wire 3 and copper current lead-in wire 6 connection external power source.High-temperature superconductive lead wire cooling structure 4 is passed through in high-temperature superconductive lead wire 3 upper end, conduction cooling plate 5 cool down.Preferably, one end of undermost second copper coin 23 of described charged copper plug 18 is welded with high-temperature superconductive lead wire adapter plate 19；Described charged copper plug 18 is bolted by one end of described high-temperature superconductive lead wire adapter plate 19 with high-temperature superconductive lead wire 3.The other end of undermost second copper coin 23 of described charged copper plug 18 is welded with copper current pigtail splice plate 20；Described charged copper plug 18 is bolted by one end of described copper current pigtail splice plate 20 with copper current lead-in wire 6.First copper coin 21 width of described inserted sheet without electrolytic copper 16 the superiors more than first copper coin 21 of other layer, the first copper coin 21 of the superiors wider than other layer the first copper coin 21 go out position be provided with bolt hole, the first copper coin 21 of the superiors is bolted with conduction cooling plate 5.
Fig. 4 is the numerical simulation result of the cooling effect using existing copper coin cooling structure, the cooling effect numerical simulation result of Fig. 5 blade inserting cooling structure, the first copper coin 21 and the second copper coin 23 thickness that use in Fig. 4 and Fig. 5 are 12 millimeters, heat insulating lamella thickness is 0.2 millimeter, the heat that adds that copper current goes between at 6 accesses is 10 watts, conduction cooling plate 5 upper surface temperature is 60 Kelvins, the heat conductivity of copper is 258 watts/(rice * Kelvin), the heat conductivity of heat insulating lamella is 0.29 watt/(rice * Kelvin), use existing monolayer copper coin cooling structure, cooling structure maximum temperature is 66.3 Kelvins.Using the blade inserting cooling structure of the present invention, cooling structure maximum temperature is 64.6 Kelvins, and corresponding high-temperature superconductive lead wire 3 upper end temperature also decreases.
After the copper coin of heretofore described inserted sheet without electrolytic copper 16 and charged copper plug 18 has stacked, being shaped by soldering, it is concordant that soldering forms one end after completing, the copper plug structure of one end open.Carrying out interfix after placing multilayer insulation thin slice in the middle of described inserted sheet without electrolytic copper 16 and charged copper plug 18, after interfix completes, structure entirety carries out soldering sizing, forms a complete heat conductive insulating structural member.In superconducting magnet running, heat constantly enters conduction cooling plate 5 from high-temperature superconductive lead wire 3 by this heat conductive insulating structure.The cooling effect of high-temperature superconductive lead wire cooling structure 4 shows as the temperature difference between high-temperature superconductive lead wire 3 temperature end and conduction cooling plate 5, and this cooling effect depends on the heat transfer resistance between conduction cooling plate 5 and high-temperature superconductive lead wire 3 and heat exchange area.This high-temperature superconductive lead wire cooling structure 4 uses blade inserting structure, adds heat exchange area in same space, has therefore been improved exchange capability of heat in the case of ensureing insulation, has improved the cooling effect of high-temperature superconductive lead wire 3.
It is to be understood that, although this specification describes according to each embodiment, but the most each embodiment only comprises an independent technical scheme, this narrating mode of description is only for clarity sake, those skilled in the art should be using description as an entirety, technical scheme in each embodiment can also form, through appropriately combined, other embodiments that it will be appreciated by those skilled in the art that.
The a series of detailed description of those listed above is only for illustrating of the possible embodiments of the present invention; they also are not used to limit the scope of the invention, and all Equivalent embodiments or changes made without departing from skill of the present invention spirit should be included within the scope of the present invention.
Claims (5)
1. a high-temperature superconductive lead wire cooling structure, it is characterized in that, including without electrolytic copper inserted sheet (16), charged copper plug (18) be positioned at without the multilayer insulation thin slice (17) between electrolytic copper inserted sheet (16) and charged copper plug (18)；
Described inserted sheet without electrolytic copper (16) includes multiple the first copper coins (21) stacked, one end of first copper coin (21) is connected by soldering, the other end is opening, forms the first groove (22) between adjacent the first copper coin (21)；
Described charged copper plug (18) includes multiple the second copper coins (23) stacked, one end of second copper coin (23) is connected by soldering, the other end is opening, forms the second groove (24) between adjacent the second copper coin (23)；
Described multilayer insulation thin slice (17) is in arc type, including multilayer insulation thin slice, forms the 3rd groove (25) between adjacent heat insulating lamella, and the opening of adjacent described 3rd groove (25) is towards on the contrary；
First copper coin (21) of described inserted sheet without electrolytic copper (16) inserts in the 3rd groove (25) of described multilayer insulation thin slice (17) side respectively, and second copper coin (23) of described charged copper plug (18) inserts in the 3rd groove (25) of described multilayer insulation thin slice (17) opposite side respectively.
High-temperature superconductive lead wire cooling structure the most according to claim 1, it is characterised in that one end of described undermost second copper coin of charged copper plug (18) (23) is welded with high-temperature superconductive lead wire adapter plate (19).
High-temperature superconductive lead wire cooling structure the most according to claim 1, it is characterised in that the other end of described undermost second copper coin of charged copper plug (18) (23) is welded with copper current pigtail splice plate (20).
High-temperature superconductive lead wire cooling structure the most according to claim 1, it is characterized in that, first copper coin (21) width of described inserted sheet without electrolytic copper (16) the superiors is more than first copper coin (21) of other layer, and the position that first copper coin (21) of the superiors goes out than other layer the first copper coin (21) width is provided with bolt hole.
High-temperature superconductive lead wire cooling structure the most according to claim 1, it is characterised in that the thickness of every layer of heat insulating lamella of described multilayer insulation thin slice (17) is less than or equal to 0.2 millimeter.
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| CN201610266937.2A CN105825992B (en) | 2016-04-26 | 2016-04-26 | A kind of cooling structure for high-temperature superconductive lead wire |
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| CN201610266937.2A CN105825992B (en) | 2016-04-26 | 2016-04-26 | A kind of cooling structure for high-temperature superconductive lead wire |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106450992A (en) * | 2016-09-19 | 2017-02-22 | 中国科学院合肥物质科学研究院 | Liquid-nitrogen conducting cooling type high-temperature superconducting current lead structure |
| CN113257514A (en) * | 2021-05-28 | 2021-08-13 | 潍坊新力超导磁电科技有限公司 | Full-automatic plug-in current lead device |
| US11769615B2 (en) | 2018-05-30 | 2023-09-26 | Siemens Healthcare Limited | Superconducting joints |
| CN117894546A (en) * | 2024-03-14 | 2024-04-16 | 能量奇点能源科技(上海)有限公司 | High-temperature superconductive current lead cooling device |
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| CN205582654U (en) * | 2016-04-26 | 2016-09-14 | 江苏大学 | A cooling structure for high -temperature superconductor current lead |
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| CN201435457Y (en) * | 2009-07-06 | 2010-03-31 | 中国科学院高能物理研究所 | Binary lead structure used for superconducting device and superconducting device therewith |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106450992A (en) * | 2016-09-19 | 2017-02-22 | 中国科学院合肥物质科学研究院 | Liquid-nitrogen conducting cooling type high-temperature superconducting current lead structure |
| CN106450992B (en) * | 2016-09-19 | 2021-01-15 | 中国科学院合肥物质科学研究院 | Liquid nitrogen conduction cooling type high-temperature superconducting current lead structure |
| US11769615B2 (en) | 2018-05-30 | 2023-09-26 | Siemens Healthcare Limited | Superconducting joints |
| CN113257514A (en) * | 2021-05-28 | 2021-08-13 | 潍坊新力超导磁电科技有限公司 | Full-automatic plug-in current lead device |
| CN117894546A (en) * | 2024-03-14 | 2024-04-16 | 能量奇点能源科技(上海)有限公司 | High-temperature superconductive current lead cooling device |
| CN117894546B (en) * | 2024-03-14 | 2024-05-10 | 能量奇点能源科技(上海)有限公司 | High-temperature superconductive current lead cooling device |
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