CN105825992B - A kind of cooling structure for high-temperature superconductive lead wire - Google Patents
A kind of cooling structure for high-temperature superconductive lead wire Download PDFInfo
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- CN105825992B CN105825992B CN201610266937.2A CN201610266937A CN105825992B CN 105825992 B CN105825992 B CN 105825992B CN 201610266937 A CN201610266937 A CN 201610266937A CN 105825992 B CN105825992 B CN 105825992B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/04—Cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
- H01F6/065—Feed-through bushings, terminals and joints
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
One kind the invention belongs to the cooling technology research field of current feed is used for high-temperature superconductive lead wire cooling structure, using complete matched no electrolytic copper inserted sheet and powered copper plug made of high purity copper, and the multilayer insulation thin slice between no electrolytic copper inserted sheet and powered copper plug.Interfix is carried out after placing multilayer insulation thin slice among the no electrolytic copper inserted sheet and powered copper plug, soldering sizing is carried out after the completion of interfix, forms a complete heat conductive insulating structural member.High-temperature superconductive lead wire is connected by powered copper plug structure with copper current lead, and powered copper plug is in contact by multilayer insulation thin slice with no electrolytic copper plate-inserting structure, and no electrolytic copper plate-inserting structure is directly contacted with conduction cooling plate.The present invention increases heat transfer area by plate-inserting structure, improves high-temperature superconductive lead wire cooling effect.The invention has the beneficial effects that cooling effect is more preferable, overall structure safe operation is reliable, and certain protecting effect can be provided high-temperature superconductive lead wire under accident conditions.
Description
Technical field
The invention belongs to the cooling technology research field of current feed, and in particular to one kind is used for high-temperature superconductive lead wire
Cooling structure.
Background technology
Superconducting magnet needs to run in low temperature environment, and generally use liquid helium is cooled down, and running temperature is about subzero 270
Degree Celsius.Excitation is carried out for superconducting magnet and maintains the power supply of its stable operation to need to run on room temperature environment, running temperature
It is 25 degrees Celsius about above freezing.Connecting wire between magnet and electric current, the temperature upper end for having a section lead are room temperature, and lower end is low
Temperature, the general special referred to as current feed of this section lead.Current feed upper end connects normal cable, then connects with power supply.Electric current draws
Line lower end connects with low-temperature superconducting line, accesses superconducting magnet winding.
Superconducting magnet is normally in operation, constantly has heat to enter cryogenic system by the conduction of heat of current feed,
The Joule heat produced at the same time in current feed also enters cryogenic system.Current feed needs to reduce into low by optimization design
The heat of warm system.The electric current generally use high purity copper manufacture of early stage.Enter the heat of superconducting magnet for further reduction in recent years
Amount, high-temperature superconductor band are applied to current feed technology.High-temperature superconductor band is applied to liquid helium temperature to liquid nitrogen temperature section
Current feed section, the current feed section of liquid nitrogen temperature to ambient temperature section manufactured using high purity copper, so formed electric by copper
Flow the binary current lead of lead and high-temperature superconductive lead wire composition.
High-temperature superconductive lead wire temperature end in binary current lead needs effectively cooling, to prevent its temperature excessive.
The cooling cold of the temperature end of high-temperature superconductive lead wire is typically derived from the conduction cooling plate of liquid nitrogen temperature.So conduction cooling plate and high temperature
Need to design effective cooling structure between current feed temperature end, for cooling high-temperature superconducting current feed.
Cooling structure requirement reduces the temperature difference between conduction cooling plate and high-temperature superconductive lead wire as far as possible, while ensures both
Between electric insulation, and the structure is the one high high heat conduction structure that insulate.The structure has to be realized using aluminium nitride, aluminium nitride heat conduction
Performance is good and insulate, but aluminium nitride belongs to ceramic-like materials, and operating pressure is not broken at that time.The structure also has using high score
The insulating thin or film of subclass, such material insulation property is good, safe and reliable in operating process, but such material conducts heat system
Number is low, and heat-transfer effect is poor.
The content of the invention
The purpose of the present invention is provide one kind regarding to the issue above to be used for high-temperature superconductive lead wire cooling structure, the cooling
Frangible ceramic-like materials are not contained in structure, heat transfer area are increased by inserted sheet design, so as to reduce coldplate and height
Heat transfer temperature difference between warm current feed, improves cooling effect.
The technical scheme is that：A kind of high-temperature superconductive lead wire cooling structure, high-temperature superconductive lead wire cooling
Structure does not use ceramic material, including without electrolytic copper inserted sheet, powered copper plug and positioned at no electrolytic copper inserted sheet and powered copper plug it
Between multilayer insulation thin slice；
The no electrolytic copper inserted sheet includes multiple first copper coins stacked, and one end of the first copper coin is another by soldering connection
Hold as opening, the first straight slot is formed between the first adjacent copper coin；
The powered copper plug includes multiple second copper coins stacked, and one end of the second copper coin is another by soldering connection
Hold as opening, the second straight slot is formed between the second adjacent copper coin；
The multilayer insulation thin slice is in arc type, forms the 3rd straight slot between adjacent heat insulating lamella, and adjacent described the
The opening of three straight slots is towards conversely；
First copper coin of the no electrolytic copper inserted sheet is inserted into the 3rd straight slot of the multilayer insulation thin slice side respectively, described
Second copper coin of powered copper plug is inserted into the 3rd straight slot of the multilayer insulation thin slice opposite side respectively.
In such scheme, one end of powered undermost second copper coin of copper plug is welded with high-temperature superconductive lead wire
Adapter plate.
In such scheme, the other end of powered undermost second copper coin of copper plug is welded with copper current pigtail splice
Plate.
In such scheme, the first copper coin width of the no electrolytic copper inserted sheet the superiors is more than other layers of the first copper coin, most
First copper coin on upper strata it is wider than other the first copper coins of layer go out position be provided with bolt hole.
In such scheme, the thickness of every layer of heat insulating lamella of the multilayer insulation thin slice is less than or equal to 0.2 millimeter.
The beneficial effects of the invention are as follows：Compared with prior art, the present invention is used for high-temperature superconductive lead wire cooling structure,
As a result of blade inserting structure, in identical space, heat exchange area is added, improves heat-transfer capability, improves high temperature
Superconductive current lead cooling effect.The present invention is used for high-temperature superconductive lead wire cooling structure, and operation is more safe and reliable, entirely
There is no the ceramic material using aluminium nitride class in device, the frangible feature of these structures is avoided, as a result of multilayer insulation
Thin slice, then integral braze-welded sizing, whole device operation are more safe and reliable.The present invention is used for high-temperature superconductive lead wire and cools down
Structure, can provide high temperature current feed under accident conditions certain protecting effect, when accident occurs for system, system is at once
Shut down, refrigeration system cannot provide cold for conduction cooling plate, and high-temperature superconductive lead wire cannot be effectively cooled, at this time high-temperature superconductor
Current feed is still connected with high current, is likely to be broken, and the cooling structure of the present invention, employs more copper product, these
It is cold heavy that copper material plays the role of, and the cold that copper stores in structure can suppress high-temperature superconductive lead wire temperature after the system failure
Rise, so as to protect high-temperature superconductive lead wire.
Brief description of the drawings
Fig. 1 is that the high-temperature superconductive lead wire cooling structure of an embodiment of the present invention splits schematic diagram；
Fig. 2 is the high-temperature superconductive lead wire cooling structure assembling schematic diagram of an embodiment of the present invention；
Fig. 3 is that the temperature super-conducting magnet system principle of high-temperature superconductive lead wire cooling structure using the present invention is illustrated
Figure；
Fig. 4 is the numerical simulation result using the cooling effect of existing copper coin cooling structure；
Fig. 5 is the cooling effect numerical simulation result using the blade inserting cooling structure of an embodiment of the present invention.
In figure：1st, helium liquid pipe；2nd, low-temperature superconducting line；3rd, high-temperature superconductive lead wire；4th, high-temperature superconductive lead wire cools down
Device；5th, conduction cooling plate, 6, copper current lead；7th, Cryo Refrigerator；8th, cryogenic magnet；9th, liquid helium vessel；10th, helium tube；
11st, cold screen；12nd, refrigeration machine two level cold header heat exchanger；13rd, refrigeration machine level-one cold header heat exchanger；14th, vacuum tank；15th, bursting tube
Road；16th, without electrolytic copper inserted sheet；17th, multilayer insulation thin slice；18th, powered copper plug；19th, high-temperature superconductive lead wire adapter plate；20、
Copper current pigtail splice plate；21st, the first copper coin；22nd, the first straight slot；23rd, the second copper coin；24th, the second straight slot；25th, the 3rd straight slot.
Embodiment
Embodiment is described in further detail the present invention below in conjunction with the accompanying drawings, but protection scope of the present invention is simultaneously
Not limited to this.
Fig. 1 and Fig. 2 show a kind of embodiment for being used for high-temperature superconductive lead wire cooling structure, a kind of high temperature
Superconductive current lead cooling structure, including using complete matched no electrolytic copper inserted sheet 16 and powered copper plug made of high purity copper
18, and the multilayer insulation thin slice 17 between no electrolytic copper inserted sheet 16 and powered copper plug 18.
The no electrolytic copper inserted sheet 16 includes multiple first copper coins 21 stacked, and one end of the first copper coin 21 concordantly passes through soldering
Connection, the other end is opening, and the first straight slot 22 is formed between the first adjacent copper coin 21.The powered copper plug 18 includes multiple
The second copper coin 23 stacked, concordantly by soldering connection, the other end is opening for one end of the second copper coin 23, the second adjacent copper coin
The second straight slot 24 is formed between 23.The multilayer insulation thin slice 17 is in arc type, including multilayer insulation thin slice, adjacent insulation are thin
The 3rd straight slot 25 is formed between piece, the opening of adjacent the 3rd straight slot 25 is towards on the contrary, the multilayer insulation thin slice 17
The thickness of every layer of heat insulating lamella is less than or equal to 0.2 millimeter.The no electrolytic copper inserted sheet 16 and powered copper plug 18 are matching completely
Two pieces of copper plug structures, the first copper coin 21 of the no electrolytic copper inserted sheet 16 is inserted into 17 side of multilayer insulation thin slice respectively
In 3rd straight slot 25, the second copper coin 23 of the powered copper plug 18 is inserted into the of 17 opposite side of multilayer insulation thin slice respectively
In three straight slots 25,17 the superiors of multilayer insulation thin slice to the left side extend, orlop to the right extend, with no electrolytic copper inserted sheet
16 and the position that contacts with each other of when powered 18 interfix of copper plug have heat insulating lamella, after finishing assembly, it is ensured that the portion of contact
State of the position all in insulation.The number of copper coin is more more in specific device more is conducive to conduct heat, but its number by installation space and
The limitation of installation site load-bearing capacity.Structure integrally carries out soldering sizing after the completion of interfix, forms a complete heat conductive insulating
Structural member.
Fig. 3 show the temperature super-conducting magnet system principle using high-temperature superconductive lead wire cooling structure of the present invention
Schematic diagram, whole superconducting magnet are divided into three parts by warm area from outside to inside：Vacuum tank 14, cold screen 11 and liquid helium vessel 9.Entirely
The cold of superconducting magnet operation is provided by small-sized Cryo Refrigerator 7.Cryogenic magnet 8 is placed in liquid helium vessel 9, magnet fortune
In row by thermal evaporation helium by helium tube 10, into refrigeration machine two level cold header heat exchanger 12, pass through helium liquid after helium condensation
Pipe 1 is sent into the bottom of liquid helium vessel 9.Cold screen 11 is cooled down by conduction cooling plate 5, and the cold of conduction cooling plate 5 comes from refrigeration machine level-one cold head
Heat exchanger 13.Safety line 15, for preventing helium system pressure excessive.Cryogenic magnet 8 pass sequentially through low-temperature superconducting line 2,
High-temperature superconductive lead wire 3 and copper current lead 6 connect external power supply.3 upper end of high-temperature superconductive lead wire passes through high-temperature superconductor
Current feed cooling structure 4, is cooled down by conduction cooling plate 5.Preferably, the one of undermost second copper coin 23 of the powered copper plug 18
End is welded with high-temperature superconductive lead wire adapter plate 19；The powered copper plug 18 passes through the high-temperature superconductive lead wire connector
Plate 19 and one end of high-temperature superconductive lead wire 3 are bolted.Undermost second copper coin 23 of powered copper plug 18
The other end be welded with copper current pigtail splice plate 20；The powered copper plug 18 by the copper current pigtail splice plate 20 with
One end of copper current lead 6 is bolted.21 width of the first copper coin of no 16 the superiors of electrolytic copper inserted sheet is more than other
First copper coin 21 of layer, the first copper coin 21 of the superiors it is wider than other the first copper coins of layer 21 go out position be provided with bolt hole, most
First copper coin 21 and the conduction cooling plate 5 on upper strata are bolted.
Fig. 4 is the numerical simulation result for the cooling effect for using existing copper coin cooling structure, Fig. 5 blade inserting cooling structures
The first copper coin 21 and 23 thickness of the second copper coin used in cooling effect numerical simulation result, Fig. 4 and Fig. 5 is 12 millimeters, absolutely
Edge sheet thickness is 0.2 millimeter, and the heating amount at 6 access of copper current lead is 10 watts, and 5 upper surface temperature of conduction cooling plate is 60 Kai Er
Text, the thermal conductivity factor of copper for 258 watts/(rice * Kelvins), the thermal conductivity factor of heat insulating lamella for 0.29 watt/(rice * Kelvins), adopt
With existing individual layer copper coin cooling structure, cooling structure maximum temperature is 66.3 Kelvins.Blade inserting cooling knot using the present invention
Structure, cooling structure maximum temperature are 64.6 Kelvins, and corresponding 3 upper end temperature of high-temperature superconductive lead wire also decreases.
After the completion of the copper coin of heretofore described no electrolytic copper inserted sheet 16 and powered copper plug 18 stacks, shaped by being brazed,
It is concordant that one end is formed after the completion of soldering, the copper plug structure of one end open.In the no electrolytic copper inserted sheet 16 and powered copper plug 18
Between place multilayer insulation thin slice after carry out interfix, structure integrally carries out soldering sizing after the completion of interfix, forms one and completely leads
Thermal insulation structure part.Heat is continuous by the heat conductive insulating structure from high-temperature superconductive lead wire 3 in superconducting magnet operational process
Into conduction cooling plate 5.The cooling effect of high-temperature superconductive lead wire cooling structure 4 shows as 3 temperature end of high-temperature superconductive lead wire
With the temperature difference between conduction cooling plate 5, which depends on the heat transfer resistance between conduction cooling plate 5 and high-temperature superconductive lead wire 3
And heat exchange area.The high-temperature superconductive lead wire cooling structure 4 uses blade inserting structure, and heat exchange is added in same space
Area, therefore exchange capability of heat has been improved in the case where ensureing to insulate, improve the cooling effect of high-temperature superconductive lead wire 3
Fruit.
It should be appreciated that although this specification is described according to each embodiment, not each embodiment only includes one
A independent technical solution, this narrating mode of specification is only that those skilled in the art will should say for clarity
Bright book is as an entirety, and the technical solutions in the various embodiments may also be suitably combined, and forming those skilled in the art can be with
The other embodiment of understanding.
Those listed above is a series of to describe illustrating only for possible embodiments of the invention in detail,
They simultaneously are not used to limit the scope of the invention, all equivalent embodiments made without departing from skill spirit of the present invention or change
It should all be included in the protection scope of the present invention.
Claims (2)
1. a kind of high-temperature superconductive lead wire cooling structure, it is characterised in that high-temperature superconductive lead wire cooling structure is not adopted
With ceramic material, including without electrolytic copper inserted sheet (16), powered copper plug (18) and positioned at no electrolytic copper inserted sheet (16) and powered copper plug
(18) the multilayer insulation thin slice (17) between；
The no electrolytic copper inserted sheet (16) and powered copper plug (18) are complete matched two pieces of copper plug structures,
The no electrolytic copper inserted sheet (16) includes multiple first copper coins (21) stacked, and one end of the first copper coin (21) passes through the company of soldering
Connect, the other end is opening, and the first straight slot (22) is formed between adjacent the first copper coin (21)；
The powered copper plug (18) includes multiple second copper coins (23) stacked, and one end of the second copper coin (23) passes through the company of soldering
Connect, the other end is opening, and the second straight slot (24) is formed between adjacent the second copper coin (23)；Multilayer insulation thin slice (17) is in bow word
Type, forms the 3rd straight slot (25) between adjacent heat insulating lamella, and the opening of adjacent the 3rd straight slot (25) is towards opposite；
The first copper coin (21) of the no electrolytic copper inserted sheet (16) is inserted into the threeway of multilayer insulation thin slice (17) side respectively
In groove (25), the second copper coin (23) of the powered copper plug (18) is inserted into multilayer insulation thin slice (17) opposite side respectively
In 3rd straight slot (25)；Soldering sizing is carried out after the completion of the no electrolytic copper inserted sheet (16) and powered copper plug (18) interfix；
One end of undermost second copper coin (23) of powered copper plug (18) is welded with high-temperature superconductive lead wire adapter plate
(19)；
The other end of undermost second copper coin (23) of powered copper plug (18) is welded with copper current pigtail splice plate (20)；
The first copper coin (21) width of no electrolytic copper inserted sheet (16) the superiors is more than other layers of the first copper coin (21), and the of the superiors
One copper coin (21) is provided with bolt hole than the position that other the first copper coins of layer (21) width goes out.
2. high-temperature superconductive lead wire cooling structure according to claim 1, it is characterised in that the multilayer insulation thin slice
(17) thickness of every layer of heat insulating lamella is less than or equal to 0.2 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610266937.2A CN105825992B (en) | 2016-04-26 | 2016-04-26 | A kind of cooling structure for high-temperature superconductive lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610266937.2A CN105825992B (en) | 2016-04-26 | 2016-04-26 | A kind of cooling structure for high-temperature superconductive lead wire |
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| CN105825992A CN105825992A (en) | 2016-08-03 |
| CN105825992B true CN105825992B (en) | 2018-04-24 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106450992B (en) * | 2016-09-19 | 2021-01-15 | 中国科学院合肥物质科学研究院 | Liquid nitrogen conduction cooling type high-temperature superconducting current lead structure |
| GB2574210B (en) | 2018-05-30 | 2022-09-28 | Siemens Healthcare Ltd | Superconducting joints |
| CN113257514B (en) * | 2021-05-28 | 2021-10-26 | 潍坊新力超导磁电科技有限公司 | Full-automatic plug-in current lead device |
| CN117894546B (en) * | 2024-03-14 | 2024-05-10 | 能量奇点能源科技(上海)有限公司 | High-temperature superconductive current lead cooling device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201435457Y (en) * | 2009-07-06 | 2010-03-31 | 中国科学院高能物理研究所 | Binary lead structure used for superconducting device and superconducting device therewith |
| CN102142312B (en) * | 2010-12-24 | 2012-12-19 | 中国科学院等离子体物理研究所 | Lamination type efficient air-cooled resistive heat exchanger for high-temperature superconducting large current lead |
| JP6239397B2 (en) * | 2014-02-07 | 2017-11-29 | 古河電気工業株式会社 | Superconducting conductor cooling structure |
| CN105047353B (en) * | 2015-08-18 | 2017-04-12 | 奥泰医疗系统有限责任公司 | Low-temperature electrical-insulating heat transfer component |
| CN205582654U (en) * | 2016-04-26 | 2016-09-14 | 江苏大学 | A cooling structure for high -temperature superconductor current lead |
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