CN105806684B - A kind of abrasive polishing method of hardness heterogeneous material - Google Patents
A kind of abrasive polishing method of hardness heterogeneous material Download PDFInfo
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- CN105806684B CN105806684B CN201610163259.7A CN201610163259A CN105806684B CN 105806684 B CN105806684 B CN 105806684B CN 201610163259 A CN201610163259 A CN 201610163259A CN 105806684 B CN105806684 B CN 105806684B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
Abstract
The invention discloses a kind of non-uniform material abrasive polishing methods of hardness, belong to field of metallographic sample preparation.The method of grinding and polishing of the present invention is to be coated on diamond disk that sand paper is replaced to be ground using the paraffin of addition polyolefin.Automatic grinding and polishing is used when grinding, before each grinding and polishing, using ultrasonic cleaning sample, control load force, milling time and grinding rate, guarantee that the material of different hardness in process of lapping is ground simultaneously, there is good ground flatness at interface, while avoiding the particle studded and scuffing soft material fallen in process of lapping.Keep sample smooth, bright using the lubricating fluid for adding alkalinity in diamond suspension polishing liquid.This method mainly solves the problems, such as interface out-of-flatness when two-phase hardness differs great material simultaneous grinding.Grinding and polishing efficiency is substantially increased, the waste of abrasive is reduced.
Description
Technical field
The present invention relates to the preparation methods of metallographic sample grinding and polishing, and in particular to a kind of hard and soft material combine
Two phase material surface treatment.
Background technique
Currently, in the preparation process of metallographic sample, traditional method be using silicon carbide silicon carbide paper from slightly to carefully into
Row grinding, is then mechanically polished using aluminium oxide antiscuffing paste or polishing powder, and essence keeps sample surfaces as bright as a sixpence after throwing, for leading
The sample of electricity, electrobrightening is also common means.However, these methods are only applicable to homogeneous material, for two-phase hardness phase
Poor very big and non electrically conductive material is not appropriate for.Such as the two phase material together with being inlayed by aluminium oxide ceramics with fine aluminium, wherein
Aluminium oxide ceramics is mutually non-conductive, and its Mohs' hardness has been more than 9, and the Mohs' hardness of fine aluminium phase is only 2.75.The two hardness phase
It is poor very big, can be haveed the shortcomings that using traditional metallographic technology of preparing following:
1. the entire process time is too long, and mostly manual operation, pilot process poor controllability, it is easy mill tiltedly, and occur
Problem needs to correct repeatedly, wastes a large amount of energy and resource.
2. the hardness of soft material is too low, when grinding, the particle that the particle and hard phase fallen on sand paper is ground off is easy pair
Soft phase is caused to scratch or be inlayed.Cause after finally polishing, big scratch or hole occurs in soft phase.
2. the hardness of hard material is too high, almost close to the Mohs' hardness of common sand paper, sand paper is very weak to its grinding capacity,
Grinding effect is not achieved.
4. hard and the great material of soft two kinds of hardness difference are combined together, the small easy grinding of hardness, hardness
Big is difficult to be ground, and thus causes ground fast of soft material, ground slow of hard material.The sample that essence obtains after throwing
Product have relief, i.e. soft material side is relatively low, and hard material side is higher.It, cannot be same in the same visual field in metallographic observation
When focus, to soft and hard material interface observe it is very unfavorable.
Summary of the invention
In order to solve the above problem in traditional technology, the present invention using the diamond disk of coated with paraffin replace sand paper into
Row grinding has higher adhesiveness and flexibility, fallen after absorption grinding using the paraffin after addition polyolefin additive
Particle in grain and mill, so as not to be mounted in soft phase, while soft phase is not easy to scratch.Diamond disk has very high
Hardness and flatness, hard and soft material can be ground well, can guarantee the flatness of soft or hard two-phase interface.It applies
The diamond disk for covering paraffin has the comprehensive performance of the two, not only can guarantee the flatness of soft or hard two-phase interface, but also will not be to soft
Material is caused to scratch and be inlayed.One kind is provided for the great bond material interface observation of two-phase hardness difference reliably to handle
Method.
The invention mainly solves the technical problem of providing a kind of two-phase hardness to differ great material abrasive polishing method,
Symmetrical edge sample is carried out to sample first, to guarantee to be not easy to occur tilting to one side during sample grinding and polishing.
The sample process of lapping:
A. polyolefin and atoleine are chosen and prepares mixed solution (A) by 1:2 volume ratio, is uniformly applied to different grain size
Ground diamond disk, coating with a thickness of 10-15 μm.
B. granularity is chosen as 45 μm and the diamond disk for smearing mixed solution (A) roughly grinds sample, grinding load
Power 15-20N, milling time 2-5min.150-200 revs/min of polished machine revolving speed.
C. granularity is chosen as 30 μm and the diamond disk for being coated with mixed solution (A) roughly grinds sample, and grinding is negative
Carry power 15-20N, milling time 2-5min.150-200 revs/min of polished machine revolving speed.
D. granularity is chosen as 15 μm and the diamond disk for being coated with mixed solution (A) roughly grinds sample, and grinding is negative
Carry power 15-20N, milling time 2-5min.150-200 revs/min of polished machine revolving speed.
E. granularity is chosen as 9 μm and the diamond disk for being coated with mixed solution (A) roughly grinds sample, grinding load
Power 15-20N, milling time 2-5min.150-200 revs/min of polished machine revolving speed.
F. granularity is chosen as 3 μm and the diamond disk for being coated with mixed solution (A) roughly grinds sample, grinding load
Power 15-20N, milling time 2-5min.150-200 revs/min of polished machine revolving speed.
G. granularity is chosen as 1 μm and the diamond disk for being coated with mixed solution (A) roughly grinds sample, grinding load
Power 15-20N, milling time 2-5min.150-200 revs/min of polished machine revolving speed.
H. granularity is chosen as 0.5 μm and the diamond disk for being coated with mixed solution (A) roughly grinds sample, and grinding is negative
Carry power 15-20N, milling time 2-5min.150-200 revs/min of polished machine revolving speed.
The sample polishing process:
A. the polishing lubricating fluid (B) for preparing alkalinity uses concentration for 30% hydrogen peroxide, and glycerine and ethylene glycol press volume
Ratio 0.05:1:2 prepares polishing lubrication solution (B).
B. final polishing cloth is selected, the 0.25 μm of polycrystalline diamond suspension for the 0.5-1mL that arranges in pairs or groups carries out rough polishing, load force
14-16N, polishing time 4-6min, 100-150 revs/min of polished machine revolving speed.Just addition 0.3-0.5mL lubricates since polishing
Liquid (B) hereafter adds 0.1-0.2mL every 1min, until polishing terminates.
C. final polishing cloth is selected, the 0.1 μm of polycrystalline diamond suspension for the 0.5-1mL that arranges in pairs or groups carries out half essence and throws, load force
8-12N, polishing time 6-10min, 100-150 revs/min of polished machine revolving speed.Just addition 0.3-0.5mL lubricates since polishing
Liquid (B) hereafter adds 0.1-0.2mL every 1min, until polishing terminates.
D. final polishing cloth is selected, the 0.05 μm of polycrystalline diamond suspension for the 0.5-1mL that arranges in pairs or groups carries out smart throwing, load force
5-8N, polishing time 10-15min, 100-150 revs/min of polished machine revolving speed.Just addition 0.3-0.5mL lubricates since polishing
Liquid (B) hereafter adds 0.1-0.2mL every 1min, until polishing terminates.
During the above grinding and polishing, before carrying out next step grinding and polishing, it is necessary to be cleaned by ultrasonic to sample.Sample is put into dress
There is the beaker of ethyl alcohol, beaker is then moved into ultrasonic cleaning equipment, is cleaned by ultrasonic 2-3min, is rinsed after having cleaned with clear water.Essence
After throwing cleaning at once, it should dry up sample.
The present invention successfully solves the problems, such as that hardness is uneven and non electrically conductive material grinding and polishing irregularities.This method behaviour
Make simple, saving energy and resource and repeatability height.Example interface obtained is smooth bright, and planarization is good.
Detailed description of the invention
Fig. 1 is that sample symmetrically inlays sample loading mode in embodiment 1.
Fig. 2 is the metallograph of aluminium oxide ceramics and fine aluminium under 50 times in embodiment 1.
Fig. 3 is the metallograph of aluminium oxide ceramics and fine aluminium under 200 times in embodiment 1.
Fig. 4 is the metallograph of aluminium oxide ceramics and fine aluminium interface under 500 times in embodiment 1.
Each number is expressed as follows in Fig. 1-4:
1. the cold edge resin of 2. aluminium oxide ceramics of fine aluminium 3..
Specific embodiment
The following describes the present invention in detail with reference to examples:
Embodiment 1
Specific step is as follows:
A. epoxy resin and curing agent are used, is set by the cold edge of the proportional arrangement 15g of epoxy resin and curing agent quality 2:1
Rouge.
B. after ten minutes with glass bar stirring, place and vacuumized in vacuum oven, taken out after 15 minutes.
C. the material sample by aluminium oxide in conjunction with fine aluminium is symmetrically disposed in the edge original mold tool that diameter is 30mm, taking-up
Cold edge resin pour into mold, and stand 8 hours, wait resin be fully cured.Shape after solidification is as shown in Fig. 1,
Wherein number 1 is fine aluminium, and 2 be aluminium oxide ceramics, and 3 be cold edge resin.
D. polyolefin A PAO and atoleine are chosen and prepares 20mL mixed solution (A) by 1:2 volume ratio, is uniformly applied to
Different grain size ground diamond disk.Coating with a thickness of 12 μm.The polishing lubricating fluid (B) in alkalinity is prepared, uses concentration for 30%
Hydrogen peroxide, example 0.05:1:2 prepares polishing lubrication solution (B) by volume for glycerine and ethylene glycol.
E. automatic grinding and polishing machine is used, grinding efficiency is improved, saves abrasive material, and guarantees that grinding and polishing is stablized.
F. granularity is chosen as 45 μm and the diamond disk for smearing mixed solution (A) roughly grinds sample, grinding load
Power 20N, milling time 2min, 150 revs/min of polished machine revolving speed.
G. granularity is chosen as 30 μm and the diamond disk for smearing mixed solution (A) roughly grinds sample, grinding load
Power 20N, milling time 2min, 150 revs/min of polished machine revolving speed.
H. granularity is chosen as 15 μm and the diamond disk for smearing mixed solution (A) roughly grinds sample, grinding load
Power 20N, milling time 2min, 150 revs/min of polished machine revolving speed.
I. granularity is chosen as 9 μm and the diamond disk for smearing mixed solution (A) roughly grinds sample, grinds load force
20N, milling time 3min, 150 revs/min of polished machine revolving speed.
J. granularity is chosen as 3 μm and the diamond disk for smearing mixed solution (A) roughly grinds sample, grinds load force
20N, milling time 3min, 150 revs/min of polished machine revolving speed.
K. granularity is chosen as 1 μm and the diamond disk for smearing mixed solution (A) roughly grinds sample, grinds load force
20N, milling time 4min, 150 revs/min of polished machine revolving speed.
L. granularity is chosen as 0.05 μm and the diamond disk for smearing mixed solution (A) roughly grinds sample, and grinding is negative
Carry power 20N, milling time 5min, 150 revs/min of polished machine revolving speed.
M. use final polishing cloth, the 0.25 μm of polycrystalline diamond suspension for the 1mL that arranges in pairs or groups, carry out rough polishing, load force 15N,
Polishing time 5min, 100 revs/min of polished machine revolving speed.Just addition 0.5mL lubricating fluid (B) since polishing, hereafter every 1min
0.2mL is added, until polishing terminates.
N. final polishing cloth is used, the 0.1 μm of polycrystalline diamond suspension for the 1mL that arranges in pairs or groups carries out half essence and throws, load force 10N,
Polishing time 8min, 100 revs/min of polished machine revolving speed.Just addition 0.5mL lubricating fluid (B) since polishing, hereafter every 1min
0.2mL is added, until polishing terminates.
O. final polishing cloth is used, the 0.05 μm of polycrystalline diamond suspension for the 1mL that arranges in pairs or groups carries out smart throwing, and load force 8N is thrown
12min between light time, 100 revs/min of polished machine revolving speed.Just addition 0.5mL lubricating fluid (B) since polishing, hereafter every 1min
0.2mL is added, until polishing terminates.
During the above grinding and polishing, sample is cleaned by ultrasonic before carrying out next step grinding and polishing, sample is put into equipped with second
Then beaker is moved into ultrasonic cleaning equipment by the beaker of alcohol, be cleaned by ultrasonic 2min, and cleaning is intact to be rinsed with clear water.Essence throws cleaning
Afterwards, sample is dried up.
Example described above is merely to the preferred embodiment for absolutely proving the present invention and being lifted, protection model of the invention
It encloses without being limited thereto.Those skilled in the art on the basis of the present invention made by same substitution and transformation, directly or
The other technologies field that is used in is connect, it is within the scope of the present invention.Protection scope of the present invention is with claims
It is quasi-.
Claims (8)
1. a kind of abrasive polishing method of hardness heterogeneous material, it is characterised in that: using the diamond disk generation of coated with paraffin
For sand paper, ground on automatic grinding and polishing machine, using the diamond suspension polishing liquid for being uniformly applied to polishing cloth in advance and
The alkaline lubricating fluid of addition of having a rest replaces common antiscuffing paste or polishing powder to be polished on automatic grinding and polishing machine, obtains smooth
Two-phase interface, so that differing great bond material interface observation for two-phase hardness provides a kind of reliably processing method；Gold
Hard rock mill has very high hardness and flatness, can be ground well to hard and soft material, can guarantee soft or hard two
The flatness of phase interface has higher adhesiveness and flexibility using the paraffin after addition liquid polishing polyolefin additive, adsorbs
The particle in particle and mill fallen after grinding, can be avoided and soft material is caused to scratch and be inlayed.
2. the abrasive polishing method of hardness heterogeneous material according to claim 1, which is characterized in that in the paraffin
Added with polyolefin additive, the ratio of polyolefin and paraffin is volume ratio 1:2, configures mixed solution, is uniformly applied to difference
On the diamond disk of granularity, the paraffin thickness of coating is 10-15 μm.
3. the abrasive polishing method of hardness heterogeneous material according to claim 2, which is characterized in that load force when grinding
Take 15-20N, milling time 2-5min, 150-200 revs/min of polished machine revolving speed.
4. the abrasive polishing method of hardness heterogeneous material according to claim 2, which is characterized in that diamond disk grain
Degree is 45 μm, 30 μm, 15 μm, 9 μm, 3 μm, 1 μm, 0.5 μm；The smallest granularity of diamond disk reaches 0.5 μm.
5. the abrasive polishing method of hardness heterogeneous material according to claim 4, it is characterised in that: be when choosing granularity
0.5 μm and when being coated with the diamond disk of mixed solution and roughly grinding to sample, grind load force 15-20N, milling time 2-
5min, 150-200 revs/min of polished machine revolving speed.
6. the abrasive polishing method of hardness heterogeneous material according to claim 1, it is characterised in that: carrying out sample throwing
In photoreduction process, prepare the polishing lubricating fluid of alkalinity: use concentration for 30% hydrogen peroxide, glycerine and ethylene glycol example by volume
0.05:1:2 prepares polishing lubrication solution；Diamond disk granularity of arranging in pairs or groups is 0.25 μm, 0.1 μm, 0.05 μm of polycrystalline diamond
Suspension is all cleaned by ultrasonic after each grinding and polishing, scavenging period 2-3min.
7. the abrasive polishing method of hardness heterogeneous material according to claim 6, it is characterised in that: polish profit when polishing
Synovia is most initially added into 0.3-0.5mL, adds primary, additive amount 0.1-0.2mL at interval of 1min later.
8. the abrasive polishing method of hardness heterogeneous material according to claim 6, it is characterised in that: for different systems
Material: selecting final polishing cloth, the 0.25 μm of polycrystalline diamond suspension for the 0.5-1mL that arranges in pairs or groups, when carrying out rough polishing, load force
14-16N, polishing time 4-6min, 100-150 revs/min of polished machine revolving speed；Final polishing cloth is being selected, as collocation 0.5-1mL
0.1 μm of polycrystalline diamond suspension, when carrying out half essence and throwing, load force 8-12N, polishing time 6-10min, polished machine revolving speed
100-150 revs/min；Final polishing cloth is being selected, the 0.05 μm of polycrystalline diamond suspension for the 0.5-1mL that arranges in pairs or groups carries out smart throwing
When, load force 5-8N, polishing time 10-15min, 100-150 revs/min of polished machine revolving speed.
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| CN109794821B (en) * | 2019-01-19 | 2020-06-23 | 常德市佳鸿机械有限责任公司 | Rotating device for polishing edge covering of cylinder cover of oil cylinder of excavator |
| CN111521462B (en) * | 2020-05-06 | 2023-07-18 | 中国航发成都发动机有限公司 | Metallographic preparation method of coating |
| CN113740129A (en) * | 2021-08-27 | 2021-12-03 | 中铝材料应用研究院有限公司 | Metallographic phase sample preparation method for aluminum alloy |
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