CN105802562A - High-conductivity and heat-resisting silver adhesive and preparing method thereof - Google Patents
High-conductivity and heat-resisting silver adhesive and preparing method thereof Download PDFInfo
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- CN105802562A CN105802562A CN201610235868.9A CN201610235868A CN105802562A CN 105802562 A CN105802562 A CN 105802562A CN 201610235868 A CN201610235868 A CN 201610235868A CN 105802562 A CN105802562 A CN 105802562A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Health & Medical Sciences (AREA)
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Abstract
The invention discloses a high-conductivity and heat-resisting silver adhesiveThe high-conductivity and heat-resisting silver adhesive comprises, by weight, 30-50 parts of modified epoxide resin, 80-120 parts of metal silver powder, 1.5-3.5 parts of m-xylylenediamine, 2-4 parts of p-phenyl diphenyl ether, 3-6 parts of trimellitic anhydride, 4-9 parts of terephthalic acid, 2-5 parts of hydroxypropyl methyl cellulose, 2-6 parts of hydrogenated butadiene-acrylonitrile rubber, 1-4 parts of nanosilicon dioxide, 3-5 parts of magnesium oxide, 3-6 parts of silane coupling agent KH-550, 4-8 parts of dispersing agent and 2-4 parts of anti-aging agent. The invention further discloses a preparing method of the high-conductivity and heat-resisting silver adhesive. The high-conductivity and heat-resisting silver adhesive is good in conductivity and high in heat resistance.
Description
Technical field
The present invention relates to conductive silver glue field, particularly relate to a kind of heat-resisting elargol of high conductivity and preparation method thereof.
Background technology
Conductive silver glue is, it is generally thought mainly, by the bonding effect of matrix resin, conducting particles is combined
Together, conductive path is formed, it is achieved by being conductively connected of viscous material.Conductive silver glue generally uses asphalt mixtures modified by epoxy resin
Fat or Polyurethane, as the matrix resin of conductive silver glue, add the flexible macromole such as rubber, utilize long-chain flexible
Amine improves the fragility of epoxy resin as firming agent and obtains the conductive silver glue of soft elasticity.
Conductive silver glue of the prior art mainly improves on electric conductivity, then due to conductive silver glue
Using environment to be mostly under high temperature, therefore the heat resistance of elargol is also to feel the big of conductive silver glue quality
Key factor, the demand when heat resistance of conductive silver glue of the prior art cannot meet actually used, because of
This needs a kind of conductive silver glue with superior heat resistance performance of exploitation badly.
Summary of the invention
For solving technical problem present in background technology, the present invention propose a kind of heat-resisting elargol of high conductivity and
Its preparation method, the conductive silver glue electric conductivity prepared is excellent, and heat resistance is strong.
The heat-resisting elargol of a kind of high conductivity that the present invention proposes, its raw material includes by weight: modified epoxy tree
Fat 30-50 part, silver powder 80-120 part, m-xylene diamine 1.5-3.5 part, to phenyl diphenyl ether 2-4
Part, trimellitic anhydride 3-6 part, p-phthalic acid 4-9 part, carboxylic propyl methocel 2-5 part, hydrogenation
Nitrile rubber 2-6 part, nano silicon 1-4 part, magnesium oxide 3-5 part, silane resin acceptor kh-550 3-6
Part, dispersant 4-8 part, age resistor 2-4 part.
Preferably, modified epoxy is prepared by following technique: by epoxy resin E-51 and epoxy resin
AFG-90 mix homogeneously, obtains material a after 50-60 DEG C of mechanical agitation 1-3h, then adds in material a
Enter nanometer silicon carbide, mechanical agitation 2-4h, ultrasound wave dispersion 1-3h, add modified amine after being cooled to room temperature solid
Agent and altax P-30, stir and be placed on vacuum defoamation in vacuum drying oven, obtain modified epoxy
Resin.
Preferably, in the preparation process of modified epoxy, epoxy resin E-51, epoxy resin AFG-90,
The weight ratio of nanometer silicon carbide, modified amine curing agent and altax P-30 is 2-8:3-9:1-3:2-4:
1-4。
Preferably, the weight ratio of modified epoxy and silver powder is 35-45:85-115.
Preferably, modified epoxy, m-xylene diamine, to phenyl diphenyl ether, trimellitic anhydride, to benzene
Dioctyl phthalate, carboxylic propyl methocel 2-5 part, hydrogenated nitrile-butadiene rubber, nano silicon, magnesium oxide and
The weight ratio of silane resin acceptor kh-550 is 35-45:1.8-3.2:2.5-3.5:3.5-5.5:5-8:3-5:
2-3:3.5-4.5:4-5.
Preferably, its raw material includes by weight: modified epoxy 35-45 part, silver powder 85-115
Part, m-xylene diamine 1.8-3.2 part, to phenyl diphenyl ether 2.5-3.5 part, trimellitic anhydride 4-5 part,
P-phthalic acid 5-8 part, carboxylic propyl methocel 2.5-4.5 part, hydrogenated nitrile-butadiene rubber 3-5 part, receive
Rice silicon dioxide 2-3 part, magnesium oxide 3.5-4.5 part, silane resin acceptor kh-550 4-5 part, dispersant 5-7
Part, age resistor 2.5-3.5 part.
Preferably, its raw material includes by weight: modified epoxy 40 parts, silver powder 100 part,
Benzene dimethylamine 2.5 parts, to phenyl diphenyl ether 3 parts, trimellitic anhydride 4.5 parts, p-phthalic acid 6.5 parts,
Carboxylic propyl methocel 3.5 parts, hydrogenated nitrile-butadiene rubber 4 parts, nano silicon 2.5 parts, magnesium oxide 4
Part, silane resin acceptor kh-550 4.5 parts, dispersant 6 parts, 3 parts of age resistor.
The preparation method of the heat-resisting elargol of a kind of high conductivity that the present invention proposes, comprises the steps:
S1, under the water bath with thermostatic control of 85-95 DEG C, hydrogenated nitrile-butadiene rubber is added in dispersant heated and stirred extremely
Be completely dissolved, the most again by modified epoxy, silver powder, m-xylene diamine, to phenyl diphenyl ether,
Trimellitic anhydride, p-phthalic acid, carboxylic propyl methocel, nano silicon, magnesium oxide, silane
Coupling agent KH-550 and age resistor add slowly, are heated with stirring to be completely dissolved, and obtain conductive silver after cooling
Gum base body；
S2, silver powder is mixed with the conductive silver glue matrix obtained in S1, roll after grinding distribution and become equal
Even paste object, i.e. obtains the heat-resisting elargol of described high conductivity.
The heat-resisting elargol of a kind of high conductivity of the present invention, its raw material include modified epoxy, silver powder,
M-xylene diamine, to phenyl diphenyl ether, trimellitic anhydride, p-phthalic acid, carboxylic propyl methocel,
Hydrogenated nitrile-butadiene rubber, nano silicon, magnesium oxide, silane resin acceptor kh-550, dispersant and age resistor,
Wherein resin based on modified epoxy, using m-xylene diamine and to phenyl diphenyl ether as firming agent,
Using trimellitic anhydride and p-phthalic acid as curing accelerator, using silver powder as conducting particles, with hydrogen
Change nitrile rubber as flexible additive, and add nano silicon and magnesium oxide as heat-resistant filler, and
It is grafted to filler modified on hydrogenated nitrile-butadiene rubber by silane resin acceptor kh-550, improves hydrogenated butyronitrile rubber
The heat resistance of glue and antiseptic property, the carboxylic propyl methocel of interpolation improves conductive silver glue of the present invention
Toughness.In raw material of the present invention, modified epoxy is with epoxy resin E-51, epoxy resin AFG-90, nano-sized carbon
SiClx, modified amine curing agent and altax P-30 are as raw material, with epoxy resin E-51 and epoxy resin
AFG-90, as major ingredient, adds nanometer silicon carbide and carries out mixed and modified, and the modified epoxy obtained can not only
Enough it is effectively improved the electric conductivity of conductive silver glue of the present invention, further improves heat resistance.The present invention's
Conducting electricity very well of conductive silver glue, heat resistance is strong.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail, it should be appreciated that embodiment is served only for
The bright present invention rather than be used for limiting the invention, any made on the basis of the present invention amendment,
Equivalents etc. are the most within the scope of the present invention.
In detailed description of the invention, the weight portion of modified epoxy can be 30 parts, 31 parts, 32 parts, 33
Part, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts, 40 parts, 41 parts, 42 parts, 43 parts,
44 parts, 45 parts, 46 parts, 47 parts, 48 parts, 49 parts, 50 parts；The weight portion of silver powder can be
80 parts, 81 parts, 82 parts, 83 parts, 84 parts, 85 parts, 86 parts, 87 parts, 88 parts, 89 parts, 90 parts,
91 parts, 92 parts, 93 parts, 94 parts, 95 parts, 96 parts, 97 parts, 98 parts, 99 parts, 100 parts, 101
Part, 102 parts, 103 parts, 104 parts, 105 parts, 106 parts, 107 parts, 108 parts, 109 parts, 110 parts,
111 parts, 112 parts, 113 parts, 114 parts, 115 parts, 116 parts, 117 parts, 118 parts, 119 parts, 120
Part；The weight portion of m-xylene diamine can be 1.5 parts, 1.6 parts, 1.7 parts, 1.8 parts, 1.9 parts, 2.0
Part, 2.1 parts, 2.2 parts, 2.3 parts, 2.4 parts, 2.5 parts, 2.6 parts, 2.7 parts, 2.8 parts, 2.9 parts
3.0 parts, 3.1 parts, 3.2 parts, 3.3 parts, 3.4 parts, 3.5 parts；Permissible to the weight portion of phenyl diphenyl ether
Be 2 parts, 2.1 parts, 2.2 parts, 2.3 parts, 2.4 parts, 2.5 parts, 2.6 parts, 2.7 parts, 2.8 parts,
2.9 parts, 3 parts, 3.1 parts, 3.2 parts, 3.3 parts, 3.4 parts, 3.5 parts, 3.6 parts, 3.7 parts, 3.8
Part, 3.9 parts, 4 parts；The weight portion of trimellitic anhydride can be 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5
Part, 5.5 parts, 6 parts；The weight portion of p-phthalic acid can be 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6
Part, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts；The weight portion of carboxylic propyl methocel can
Think 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts；The weight portion of hydrogenated nitrile-butadiene rubber
It can be 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 6 parts；Nano silicon
Weight portion can be 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts；The weight of magnesium oxide
Amount part can be 3 parts, 3.1 parts, 3.2 parts, 3.3 parts, 3.4 parts, 3.5 parts, 3.6 parts, 3.7 parts,
3.8 parts, 3.9 parts, 4.0 parts, 4.1 parts, 4.2 parts, 4.3 parts, 4.4 parts, 4.5 parts, 4.6 parts, 4.7
Part, 4.8 parts, 4.9 parts, 5 parts；The weight portion of silane resin acceptor kh-550 can be 3 parts, 3.5 parts,
4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts；The weight portion of dispersant can be 4 parts, 4.5 parts, 5 parts,
5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts；The weight portion of age resistor can be 2 parts, 2.1
Part, 2.2 parts, 2.3 parts, 2.4 parts, 2.5 parts, 2.6 parts, 2.7 parts, 2.8 parts, 2.9 parts, 3 parts,
3.1 parts, 3.2 parts, 3.3 parts, 3.4 parts, 3.5 parts, 3.6 parts, 3.7 parts, 3.8 parts, 3.9 parts, 4
Part.
Embodiment 1
The heat-resisting elargol of a kind of high conductivity that the present invention proposes, its raw material includes by weight: modified epoxy tree
40 parts of fat, silver powder 100 parts, m-xylene diamine 2.5 parts, to phenyl diphenyl ether 3 parts, trimellitic acid
Acid anhydride 4.5 parts, p-phthalic acid 6.5 parts, carboxylic propyl methocel 3.5 parts, hydrogenated nitrile-butadiene rubber 4 parts,
Nano silicon 2.5 parts, magnesium oxide 4 parts, silane resin acceptor kh-550 4.5 parts, dispersant 6 parts,
3 parts of age resistor.
Modified epoxy is prepared by following technique: by weight by 5 parts of epoxy resin E-51 and 6 parts
Epoxy resin AFG-90 mix homogeneously, obtains material a, then to material a after 55 DEG C of mechanical agitation 2h
2 parts of nanometer silicon carbides of middle addition, mechanical agitation 3h, ultrasound wave dispersion 2h, add 3 parts after being cooled to room temperature
Modified amine curing agent and 2.5 parts of altax P-30, stir and be placed on vacuum defoamation in vacuum drying oven,
Obtain modified epoxy.
The preparation method of the heat-resisting elargol of a kind of high conductivity that the present invention proposes, comprises the steps:
S1, under the water bath with thermostatic control of 90 DEG C, hydrogenated nitrile-butadiene rubber is added in dispersant heated and stirred to the completeest
CL, the most again by modified epoxy, silver powder, m-xylene diamine, to phenyl diphenyl ether, partially
Benzenetricarboxylic anhydride, p-phthalic acid, carboxylic propyl methocel, nano silicon, magnesium oxide, silane are even
Connection agent KH-550 and age resistor add slowly, are heated with stirring to be completely dissolved, obtain conductive silver glue after cooling
Matrix；
S2, silver powder is mixed with the conductive silver glue matrix obtained in S1, roll after grinding distribution and become equal
Even paste object, i.e. obtains the heat-resisting elargol of described high conductivity.
Embodiment 2
The heat-resisting elargol of a kind of high conductivity that the present invention proposes, its raw material includes by weight: modified epoxy tree
30 parts of fat, silver powder 120 parts, m-xylene diamine 1.5 parts, to phenyl diphenyl ether 4 parts, trimellitic acid
Acid anhydride 3 parts, p-phthalic acid 9 parts, carboxylic propyl methocel 2 parts, hydrogenated nitrile-butadiene rubber 6 parts, nanometer
Silica 1 part, magnesium oxide 5 parts, silane resin acceptor kh-550 3 parts, dispersant 8 parts, age resistor 2
Part.
Modified epoxy is prepared by following technique: by weight by 2 parts of epoxy resin E-51 and 9 parts
Epoxy resin AFG-90 mix homogeneously, obtains material a, then to material a after 50 DEG C of mechanical agitation 3h
1 part of nanometer silicon carbide of middle addition, mechanical agitation 4h, ultrasound wave dispersion 1h, add 4 parts after being cooled to room temperature
Modified amine curing agent and 1 part of altax P-30, stir and be placed on vacuum defoamation in vacuum drying oven,
Obtain modified epoxy.
The preparation method of the heat-resisting elargol of a kind of high conductivity that the present invention proposes, comprises the steps:
S1, under the water bath with thermostatic control of 85 DEG C, hydrogenated nitrile-butadiene rubber is added in dispersant heated and stirred to the completeest
CL, the most again by modified epoxy, silver powder, m-xylene diamine, to phenyl diphenyl ether, partially
Benzenetricarboxylic anhydride, p-phthalic acid, carboxylic propyl methocel, nano silicon, magnesium oxide, silane are even
Connection agent KH-550 and age resistor add slowly, are heated with stirring to be completely dissolved, obtain conductive silver glue after cooling
Matrix；
S2, silver powder is mixed with the conductive silver glue matrix obtained in S1, roll after grinding distribution and become equal
Even paste object, i.e. obtains the heat-resisting elargol of described high conductivity.
Embodiment 3
The heat-resisting elargol of a kind of high conductivity that the present invention proposes, its raw material includes by weight: modified epoxy tree
50 parts of fat, silver powder 80 parts, m-xylene diamine 3.5 parts, to phenyl diphenyl ether 2 parts, trimellitic acid
Acid anhydride 6 parts, p-phthalic acid 4 parts, carboxylic propyl methocel 5 parts, hydrogenated nitrile-butadiene rubber 2 parts, nanometer
Silicon dioxide 4 parts, magnesium oxide 3 parts, silane resin acceptor kh-550 6 parts, dispersant 4 parts, age resistor 4
Part.
Modified epoxy is prepared by following technique: by weight by 8 parts of epoxy resin E-51 and 3 parts
Epoxy resin AFG-90 mix homogeneously, obtains material a, then to material a after 60 DEG C of mechanical agitation 1h
3 parts of nanometer silicon carbides of middle addition, mechanical agitation 2h, ultrasound wave dispersion 3h, add 2 parts after being cooled to room temperature
Modified amine curing agent and 4 parts of altax P-30, stir and be placed on vacuum defoamation in vacuum drying oven,
Obtain modified epoxy.
The preparation method of the heat-resisting elargol of a kind of high conductivity that the present invention proposes, comprises the steps:
S1, under the water bath with thermostatic control of 95 DEG C, hydrogenated nitrile-butadiene rubber is added in dispersant heated and stirred to the completeest
CL, the most again by modified epoxy, silver powder, m-xylene diamine, to phenyl diphenyl ether, partially
Benzenetricarboxylic anhydride, p-phthalic acid, carboxylic propyl methocel, nano silicon, magnesium oxide, silane are even
Connection agent KH-550 and age resistor add slowly, are heated with stirring to be completely dissolved, obtain conductive silver glue after cooling
Matrix；
S2, silver powder is mixed with the conductive silver glue matrix obtained in S1, roll after grinding distribution and become equal
Even paste object, i.e. obtains the heat-resisting elargol of described high conductivity.
Embodiment 4
The heat-resisting elargol of a kind of high conductivity that the present invention proposes, its raw material includes by weight: modified epoxy tree
35 parts of fat, silver powder 115 parts, m-xylene diamine 1.8 parts, to phenyl diphenyl ether 3.5 parts, inclined benzene three
4 parts of anhydride, p-phthalic acid 8 parts, carboxylic propyl methocel 2.5 parts, hydrogenated nitrile-butadiene rubber 5 parts,
Nano silicon 2 parts, magnesium oxide 4.5 parts, silane resin acceptor kh-550 4 parts, dispersant 7 parts, anti-
Old agent 2.5 parts.
Modified epoxy is prepared by following technique: by weight by 4 parts of epoxy resin E-51 and 7 parts
Epoxy resin AFG-90 mix homogeneously, obtains material a, then to material a after 54 DEG C of mechanical agitation 2.2h
1.8 parts of nanometer silicon carbides of middle addition, mechanical agitation 3.2h, ultrasound wave dispersion 1.8h, add after being cooled to room temperature
Enter 3.2 parts of modified amine curing agents and 2.2 parts of altax P-30, stir and be placed in vacuum drying oven
Vacuum defoamation, obtains modified epoxy.
The preparation method of the heat-resisting elargol of a kind of high conductivity that the present invention proposes, comprises the steps:
S1, under the water bath with thermostatic control of 88 DEG C, hydrogenated nitrile-butadiene rubber is added in dispersant heated and stirred to the completeest
CL, the most again by modified epoxy, silver powder, m-xylene diamine, to phenyl diphenyl ether, partially
Benzenetricarboxylic anhydride, p-phthalic acid, carboxylic propyl methocel, nano silicon, magnesium oxide, silane are even
Connection agent KH-550 and age resistor add slowly, are heated with stirring to be completely dissolved, obtain conductive silver glue after cooling
Matrix；
S2, silver powder is mixed with the conductive silver glue matrix obtained in S1, roll after grinding distribution and become equal
Even paste object, i.e. obtains the heat-resisting elargol of described high conductivity.
Embodiment 5
The heat-resisting elargol of a kind of high conductivity that the present invention proposes, its raw material includes by weight: modified epoxy tree
45 parts of fat, silver powder 85 parts, m-xylene diamine 3.2 parts, to phenyl diphenyl ether 2.5 parts, inclined benzene three
5 parts of anhydride, p-phthalic acid 5 parts, carboxylic propyl methocel 4.5 parts, hydrogenated nitrile-butadiene rubber 3 parts,
Nano silicon 3 parts, magnesium oxide 3.5 parts, silane resin acceptor kh-550 5 parts, dispersant 5 parts, anti-
Old agent 3.5 parts.
Modified epoxy is prepared by following technique: by weight by 6 parts of epoxy resin E-51 and 5 parts
Epoxy resin AFG-90 mix homogeneously, obtains material a, then to material a after 56 DEG C of mechanical agitation 1.8h
2.2 parts of nanometer silicon carbides of middle addition, mechanical agitation 2.8h, ultrasound wave dispersion 2.2h, add after being cooled to room temperature
Enter 2.8 parts of modified amine curing agents and 2.8 parts of altax P-30, stir and be placed in vacuum drying oven
Vacuum defoamation, obtains modified epoxy.
The preparation method of the heat-resisting elargol of a kind of high conductivity that the present invention proposes, comprises the steps:
S1, under the water bath with thermostatic control of 92 DEG C, hydrogenated nitrile-butadiene rubber is added in dispersant heated and stirred to the completeest
CL, the most again by modified epoxy, silver powder, m-xylene diamine, to phenyl diphenyl ether, partially
Benzenetricarboxylic anhydride, p-phthalic acid, carboxylic propyl methocel, nano silicon, magnesium oxide, silane are even
Connection agent KH-550 and age resistor add slowly, are heated with stirring to be completely dissolved, obtain conductive silver glue after cooling
Matrix；
S2, silver powder is mixed with the conductive silver glue matrix obtained in S1, roll after grinding distribution and become equal
Even paste object, i.e. obtains the heat-resisting elargol of described high conductivity.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention not office
Being limited to this, any those familiar with the art is in the technical scope that the invention discloses, according to this
The technical scheme of invention and inventive concept thereof in addition equivalent or change, all should contain the protection in the present invention
Within the scope of.
Claims (8)
1. the heat-resisting elargol of high conductivity, it is characterised in that its raw material includes by weight: modified epoxy
Resin 30-50 part, silver powder 80-120 part, m-xylene diamine 1.5-3.5 part, to phenyl diphenyl ether
2-4 part, trimellitic anhydride 3-6 part, p-phthalic acid 4-9 part, carboxylic propyl methocel 2-5 part,
Hydrogenated nitrile-butadiene rubber 2-6 part, nano silicon 1-4 part, magnesium oxide 3-5 part, silane resin acceptor kh-550
3-6 part, dispersant 4-8 part, age resistor 2-4 part.
The heat-resisting elargol of high conductivity the most according to claim 1, it is characterised in that modified epoxy
It is prepared by following technique: by epoxy resin E-51 and epoxy resin AFG-90 mix homogeneously, in 50-60 DEG C
Obtain material a after mechanical agitation 1-3h, in material a, then add nanometer silicon carbide, mechanical agitation 2-4h,
Ultrasound wave dispersion 1-3h, adds modified amine curing agent and altax P-30 after being cooled to room temperature, stirs
It is placed on vacuum defoamation in vacuum drying oven, obtains modified epoxy.
The heat-resisting elargol of high conductivity the most according to claim 1 and 2, it is characterised in that modified epoxy
In the preparation process of resin, epoxy resin E-51, epoxy resin AFG-90, nanometer silicon carbide, modified amine are solid
The weight ratio of agent and altax P-30 is 2-8:3-9:1-3:2-4:1-4.
4. according to the heat-resisting elargol of high conductivity described in any one of claim 1-3, it is characterised in that modified
The weight ratio of epoxy resin and silver powder is 35-45:85-115.
5. according to the heat-resisting elargol of high conductivity described in any one of claim 1-4, it is characterised in that modified
Epoxy resin, m-xylene diamine, to phenyl diphenyl ether, trimellitic anhydride, p-phthalic acid, carboxylic propyl group first
Base cellulose 2-5 part, hydrogenated nitrile-butadiene rubber, nano silicon, magnesium oxide and silane resin acceptor kh-550
Weight ratio be 35-45:1.8-3.2:2.5-3.5:3.5-5.5:5-8:3-5:2-3:3.5-4.5:
4-5。
6. according to the heat-resisting elargol of high conductivity described in any one of claim 1-5, it is characterised in that it is former
Material includes by weight: modified epoxy 35-45 part, silver powder 85-115 part, m-xylene diamine
1.8-3.2 part, to phenyl diphenyl ether 2.5-3.5 part, trimellitic anhydride 4-5 part, p-phthalic acid 5-8
Part, carboxylic propyl methocel 2.5-4.5 part, hydrogenated nitrile-butadiene rubber 3-5 part, nano silicon 2-3
Part, magnesium oxide 3.5-4.5 part, silane resin acceptor kh-550 4-5 part, dispersant 5-7 part, age resistor
2.5-3.5 part.
7. according to the heat-resisting elargol of high conductivity described in any one of claim 1-6, it is characterised in that it is former
Material include by weight: modified epoxy 40 parts, silver powder 100 parts, m-xylene diamine 2.5 parts,
To phenyl diphenyl ether 3 parts, trimellitic anhydride 4.5 parts, p-phthalic acid 6.5 parts, carboxylic hydroxypropyl methyl fiber
Element 3.5 parts, hydrogenated nitrile-butadiene rubber 4 parts, nano silicon 2.5 parts, magnesium oxide 4 parts, silane coupled
Agent KH-550 4.5 parts, dispersant 6 parts, 3 parts of age resistor.
8. according to a preparation method for the heat-resisting elargol of high conductivity described in any one of claim 1-7, its
It is characterised by, comprises the steps:
S1, under the water bath with thermostatic control of 85-95 DEG C, hydrogenated nitrile-butadiene rubber is added heated and stirred in dispersant
To being completely dissolved, the most again by modified epoxy, silver powder, m-xylene diamine, to phenyl diphenyl ether,
Trimellitic anhydride, p-phthalic acid, carboxylic propyl methocel, nano silicon, magnesium oxide, silane
Coupling agent KH-550 and age resistor add slowly, are heated with stirring to be completely dissolved, and obtain conductive silver after cooling
Gum base body；
S2, silver powder is mixed with the conductive silver glue matrix obtained in S1, roll after grinding distribution and become equal
Even paste object, i.e. obtains the heat-resisting elargol of described high conductivity.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114702909A (en) * | 2022-05-05 | 2022-07-05 | 上海本诺电子材料有限公司 | UV-thermal dual-curing adhesive and preparation method thereof |
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| CN103484047A (en) * | 2012-06-13 | 2014-01-01 | 东莞市佳忠电子有限公司 | Conductive silver adhesive for ceramic capacitor and preparation method thereof |
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2016
- 2016-04-15 CN CN201610235868.9A patent/CN105802562A/en not_active Withdrawn
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| CN103484047A (en) * | 2012-06-13 | 2014-01-01 | 东莞市佳忠电子有限公司 | Conductive silver adhesive for ceramic capacitor and preparation method thereof |
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| 张玉龙等: "《粘接技术手册》", 31 August 2001, 中国轻工业出版社 * |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114702909A (en) * | 2022-05-05 | 2022-07-05 | 上海本诺电子材料有限公司 | UV-thermal dual-curing adhesive and preparation method thereof |
| CN114702909B (en) * | 2022-05-05 | 2023-09-15 | 上海本诺电子材料有限公司 | UV-thermal dual-curing adhesive and preparation method thereof |
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