CN105802531A - Electric-heating flame-retardant conductive silver adhesive for circuit board - Google Patents
Electric-heating flame-retardant conductive silver adhesive for circuit board Download PDFInfo
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- CN105802531A CN105802531A CN201610235707.XA CN201610235707A CN105802531A CN 105802531 A CN105802531 A CN 105802531A CN 201610235707 A CN201610235707 A CN 201610235707A CN 105802531 A CN105802531 A CN 105802531A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The invention discloses an electric-heating flame-retardant conductive silver adhesive for a circuit board. The electric-heating flame-retardant conductive silver adhesive is prepared from, by weight, 30-50 parts of modified epoxy resin, 12-24 parts of polyurethane, 2-9 parts of organic silicon resin, 80-120 parts of flake silver powder, 3-9 parts of dibutyltin dilaurate, 4-8 parts of poly methyl phenyl siloxane, 1.5-3.5 parts of m-xylylenediamine, 2-4 parts of p-phenyl diphenyl ether, 3-6 parts of trimellitic anhydride, 4-9 parts of terephthalic acid, 2-5 parts of hydroxypropyl methyl cellulose, 1-4 parts of nanosilicon dioxide, 3-5 parts of magnesium oxide, 3-6 parts of a silane coupling agent KH-550, 4-8 parts of a dispersant and 2-4 parts of an antiager. The conductive silver adhesive is good in conductive performance and flame-retardant performance.
Description
Technical field
The present invention relates to conductive silver glue field, particularly relate to a kind of circuit board electrothermal resistance and fire conductive silver glue.
Background technology
At present, traditional commercial production uses lead/ashbury metal as each built-up circuit of solder connection, make each portion
Part is divided to can get the sufficient support of electric power, it is possible to stably to transmit signal.But, lead/tin solder in recent years
Gradually expose many shortcomings.Lead has serious harm to human body and environment.Many countries are to electronics work
Industry lead proposes clear stipulaties, forbids that the electronic goods of new production uses lead-containing materials；It addition, in recent years send a telegram here
One development trend of sub-product is to miniaturization, portability development, improving constantly of device integration.High
Input/output density requirements connecting material has high linear resolution, and the linear resolution of lead/tin solder is too low,
Can be only applied to the connection of below 0.065mm pitch.Meanwhile, lead/tin-welding process temperature is up to 230 DEG C,
The easy damage device of thermal stress produced and substrate, if the parts containing non-refractory in product, cannot enter
Row welding.Therefore, micro-nano connectivity problem effective ways are solved during the use of conducting resinl becomes electronics industry industry.
In prior art, for improving the electric conductivity of conductive silver glue, fire resistance will reduce, therefore invent
A kind of conduct electricity very well and conductive silver glue that fire resistance is strong is the problem needing solution in currently available technology badly.
Summary of the invention
For solving technical problem present in background technology, the present invention proposes a kind of circuit board electrothermal resistance combustion and leads
Electricity elargol, electric conductivity is strong, and fire resistance is good.
A kind of circuit board electrothermal resistance that the present invention proposes fires conductive silver glue, and its raw material includes by weight: change
Property epoxy resin 30-50 part, polyurethane 12-24 part, organic siliconresin 2-9 part, flake silver powder 80-120
Part, dibutyl tin dilaurate 3-9 part, PSI 4-8 part, m-xylene diamine 1.5-3.5
Part, to phenyl diphenyl ether 2-4 part, trimellitic anhydride 3-6 part, p-phthalic acid 4-9 part, carboxylic propyl group first
Base cellulose 2-5 part, nano silicon 1-4 part, magnesium oxide 3-5 part, silane resin acceptor kh-550 3-6
Part, dispersant 4-8 part, age resistor 2-4 part.
Preferably, modified epoxy is prepared by following technique: by epoxy resin E-44, silane coupled
Agent KH-570 and ethanol mix homogeneously, obtain material a, then to thing after 50-60 DEG C of mechanical agitation 1-3h
Material a adds CNT, mechanical agitation 2-4h, ultrasound wave dispersion 1-3h, after being cooled to room temperature, adds first
Base carbic anhydride and altax P-30, stir and be placed on vacuum defoamation in vacuum drying oven, obtain
Modified epoxy.
Preferably, in the preparation technology of modified epoxy, epoxy resin E-44, Silane coupling reagent KH-570,
The weight ratio of ethanol, CNT, methylnadic anhydride and altax P-30 is 2-12:3-9:2-8:
1-6:2-5:1-4.
Preferably, modified epoxy, polyurethane, organic siliconresin, flake silver powder, carboxylic hydroxypropyl methyl fibre
The weight ratio of dimension element, nano silicon, magnesium oxide and silane resin acceptor kh-550 is 35-45:14-22:
3-8:85-115:3-4:2-3:3.5-4.5:3.5-5.5.
Preferably, modified epoxy, polyurethane, organic siliconresin, dibutyl tin dilaurate, poly-first
Base phenyl siloxane, m-xylene diamine, weight to phenyl diphenyl ether, trimellitic anhydride and p-phthalic acid
Ratio is 35-45:14-22:3-8:4-8:5-7:1.8-3.2:2.5-3.5:3.5-5.5:5-8.
Preferably, polyurethane, organic siliconresin, flake silver powder, dibutyl tin dilaurate, epoxy resin
E-44, Silane coupling reagent KH-570, ethanol, CNT, methylnadic anhydride and altax P-30
Weight ratio be 14-22:3-8:85-115:4-8:4-10:4-8:3-7:2-5:3-4:2-3.
Preferably, its raw material includes by weight: modified epoxy 35-45 part, polyurethane 14-22 part,
Organic siliconresin 3-8 part, flake silver powder 85-115 part, dibutyl tin dilaurate 4-8 part, polymethyl-benzene
Radical siloxane 5-7 part, m-xylene diamine 1.8-3.2 part, to phenyl diphenyl ether 2.5-3.5 part, inclined benzene three
Anhydride 4-5 part, p-phthalic acid 5-8 part, carboxylic propyl methocel 3-4 part, nano silicon 2-3
Part, magnesium oxide 3.5-4.5 part, silane resin acceptor kh-550 4-5 part, dispersant 5-7 part, age resistor 2.5-3.5
Part.
Preferably, its raw material includes by weight: modified epoxy 40 parts, polyurethane 18 parts, organic
Silicones 5.5 parts, flake silver powder 100 parts, dibutyl tin dilaurate 6 parts, PSI 6
Part, m-xylene diamine 2.5 parts, to phenyl diphenyl ether 3 parts, trimellitic anhydride 4.5 parts, p-phthalic acid
6.5 parts, carboxylic propyl methocel 3.5 parts, nano silicon 2.5 parts, magnesium oxide 4 parts, silane even
Connection agent KH-550 4.5 parts, dispersant 6 parts, 3 parts of age resistor.
A kind of circuit board electrothermal resistance of the present invention fires conductive silver glue, and its raw material includes modified epoxy, gathers
Urethane, organic siliconresin, flake silver powder, dibutyl tin dilaurate, PSI, isophthalic
Dimethylamine, to phenyl diphenyl ether, trimellitic anhydride, p-phthalic acid, carboxylic propyl methocel, nanometer
Silicon dioxide, magnesium oxide, silane resin acceptor kh-550, dispersant and age resistor, wherein with modified epoxy tree
Resin based on fat, polyurethane and organic siliconresin, with flake silver powder as conductive particle, with dibutyl tin
Cinnamic acid stannum, as the catalyst of polyurethane, controls modified epoxy and the proportioning of polyurethane, through polyurethane
Catalytic action, and to make it mix more uniform by adding PSI, and by controlling sheet
Shape argentum powder is as conducting particles, while ensure that the fire resistance that base resin has excellence, it is ensured that
To conductive pin have excellence electric conductivity；Add m-xylene diamine, to phenyl diphenyl ether, inclined benzene
Three anhydride and p-phthalic acid as firming agent, interpolation.The nano silicon wherein added and magnesium oxide
As fire-retardant filler, under the effect of silane resin acceptor kh-550, it is effectively increased the conductive silver glue of the present invention
Fire resistance；The modified epoxy added in the conductive silver glue of the present invention is with epoxy resin E-44, silane
Coupling agent kh-570, ethanol, CNT, methylnadic anhydride and altax P-30 are raw material, logical
Cross Silane coupling reagent KH-570 to be grafted on epoxy resin E-44 by compliant conductive material carbon nano-tube modification,
It is effectively increased the electric conductivity of epoxy resin, and improves ring by adding fire retardant methylnadic anhydride
The fire resistance of epoxy resins so that modified epoxy resin has conduction and the fire resistance of excellence.This
The bright conductive silver glue prepared conducts electricity very well, and fire resistance is strong.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail, it should be appreciated that embodiment is served only for
The bright present invention rather than be used for limiting the invention, any made on the basis of the present invention amendment,
Equivalents etc. are the most within the scope of the present invention.
In detailed description of the invention, the weight portion of modified epoxy can be 30 parts, 31 parts, 32 parts, 33
Part, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts, 40 parts, 41 parts, 42 parts, 43 parts,
44 parts, 45 parts, 46 parts, 47 parts, 48 parts, 49 parts, 50 parts；The weight portion of polyurethane can be 12
Part, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts,
23 parts, 24 parts；The weight portion of organic siliconresin can be 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts,
4.5 parts, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts；Lamellar
The weight portion of argentum powder can be 80 parts, 85 parts, 90 parts, 95 parts, 100 parts, 105 parts, 110 parts, 115
Part, 120 parts；The weight portion of dibutyl tin dilaurate can be 3 parts, 4 parts, 5 parts, 6 parts, 7 parts,
8 parts, 9 parts；The weight portion of PSI can be 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6
Part, 6.5 parts, 7 parts, 7.5 parts, 8 parts；The weight portion of m-xylene diamine can be 1.5 parts, 2 parts, 2.5
Part, 3 parts, 3.5 parts；Can be 2 parts to the weight portion of phenyl diphenyl ether, 2.5 parts, 3 parts, 3.5 parts,
4 parts；The weight portion of trimellitic anhydride can be 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts,
6 parts；The weight portion of p-phthalic acid can be 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts, 6.5 parts,
7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts；The weight portion of carboxylic propyl methocel can be 2 parts, 2.5
Part, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts；The weight portion of nano silicon can be 1 part, 1.5
Part, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts；The weight portion of magnesium oxide can be 3 parts, 3.5 parts,
4 parts, 4.5 parts, 5 parts；The weight portion of silane resin acceptor kh-550 can be 3 parts, 3.5 parts, 4 parts,
4.5 parts, 5 parts, 5.5 parts, 6 parts；The weight portion of dispersant can be 4 parts, 5 parts, 6 parts, 7 parts, 8
Part；The weight portion of age resistor can be 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts.
Embodiment 1
A kind of circuit board electrothermal resistance that the present invention proposes fires conductive silver glue, and its raw material includes by weight: change
Property epoxy resin 40 parts, polyurethane 18 parts, organic siliconresin 5.5 parts, flake silver powder 100 parts, two fourths
6 parts of base tin dilaurate stannum, PSI 6 parts, m-xylene diamine 2.5 parts, to phenyl hexichol
3 parts of ether, trimellitic anhydride 4.5 parts, p-phthalic acid 6.5 parts, carboxylic propyl methocel 3.5 parts,
Nano silicon 2.5 parts, magnesium oxide 4 parts, silane resin acceptor kh-550 4.5 parts, dispersant 6 parts,
3 parts of age resistor.
Modified epoxy is prepared by following technique: by weight by 7 parts of epoxy resin E-44s, 6 parts
Silane coupling reagent KH-570 and 5 parts of ethanol mix homogeneously, obtain material a after 55 DEG C of mechanical agitation 2h,
Then in material a, add 3.5 parts of CNTs, mechanical agitation 3h, ultrasound wave dispersion 2h, be cooled to room
Add 3.5 parts of methylnadic anhydride and 2.5 parts of altax P-30 after temperature, stir and be placed on vacuum
Vacuum defoamation in drying baker, obtains modified epoxy.
Embodiment 2
A kind of circuit board electrothermal resistance that the present invention proposes fires conductive silver glue, and its raw material includes by weight: change
Property epoxy resin 30 parts, polyurethane 24 parts, organic siliconresin 2 parts, flake silver powder 120 parts, dibutyl
3 parts of tin dilaurate stannum, PSI 8 parts, m-xylene diamine 1.5 parts, to phenyl diphenyl ether 4
Part, trimellitic anhydride 3 parts, p-phthalic acid 9 parts, carboxylic propyl methocel 2 parts, nanometer titanium dioxide
Silicon 4 parts, magnesium oxide 3 parts, silane resin acceptor kh-550 6 parts, dispersant 4 parts, 4 parts of age resistor.
Modified epoxy is prepared by following technique: by weight by 2 parts of epoxy resin E-44s, 9 parts
Silane coupling reagent KH-570 and 2 parts of ethanol mix homogeneously, obtain material a after 60 DEG C of mechanical agitation 1h,
Then in material a, add 6 parts of CNTs, mechanical agitation 2h, ultrasound wave dispersion 3h, be cooled to room temperature
2 parts of methylnadic anhydride of rear addition and 4 parts of altax P-30, stir and be placed on vacuum drying oven
Middle vacuum defoamation, obtains modified epoxy.
Embodiment 3
A kind of circuit board electrothermal resistance that the present invention proposes fires conductive silver glue, and its raw material includes by weight: change
Property epoxy resin 50 parts, polyurethane 12 parts, organic siliconresin 9 parts, flake silver powder 80 parts, dibutyl two
Tin laurate 9 parts, PSI 4 parts, m-xylene diamine 3.5 parts, to phenyl diphenyl ether 2
Part, trimellitic anhydride 6 parts, p-phthalic acid 4 parts, carboxylic propyl methocel 5 parts, nanometer titanium dioxide
Silicon 1 part, magnesium oxide 5 parts, silane resin acceptor kh-550 3 parts, dispersant 8 parts, 2 parts of age resistor.
Modified epoxy is prepared by following technique: by weight by 12 parts of epoxy resin E-44s, 3 parts
Silane coupling reagent KH-570 and 8 parts of ethanol mix homogeneously, obtain material a after 50 DEG C of mechanical agitation 3h,
Then in material a, add 1 part of CNT, mechanical agitation 4h, ultrasound wave dispersion 1h, be cooled to room temperature
5 parts of methylnadic anhydride of rear addition and 1 part of altax P-30, stir and be placed on vacuum drying oven
Middle vacuum defoamation, obtains modified epoxy.
Embodiment 4
A kind of circuit board electrothermal resistance that the present invention proposes fires conductive silver glue, and its raw material includes by weight: change
Property epoxy resin 35 parts, polyurethane 22 parts, organic siliconresin 3 parts, flake silver powder 115 parts, dibutyl
4 parts of tin dilaurate stannum, PSI 7 parts, m-xylene diamine 1.8 parts, to phenyl diphenyl ether
3.5 parts, trimellitic anhydride 4 parts, p-phthalic acid 8 parts, carboxylic propyl methocel 3 parts, nano-silica
SiClx 3 parts, magnesium oxide 3.5 parts, silane resin acceptor kh-550 5 parts, dispersant 5 parts, age resistor 3.5
Part.
Modified epoxy is prepared by following technique: by weight by 4 parts of epoxy resin E-44s, 8 parts
Silane coupling reagent KH-570 and 3 parts of ethanol mix homogeneously, obtain material a after 58 DEG C of mechanical agitation 1.5h,
Then in material a, add 5 parts of CNTs, mechanical agitation 2.5h, ultrasound wave dispersion 2.5h, be cooled to
Adding 3 parts of methylnadic anhydride and 3 parts of altax P-30 after room temperature, stirring, it is dry to be placed on vacuum
Vacuum defoamation in dry case, obtains modified epoxy.
Embodiment 5
A kind of circuit board electrothermal resistance that the present invention proposes fires conductive silver glue, and its raw material includes by weight: change
Property epoxy resin 45 parts, polyurethane 14 parts, organic siliconresin 8 parts, flake silver powder 85 parts, dibutyl two
Tin laurate 8 parts, PSI 5 parts, m-xylene diamine 3.2 parts, to phenyl diphenyl ether 2.5
Part, trimellitic anhydride 5 parts, p-phthalic acid 5 parts, carboxylic propyl methocel 4 parts, nanometer titanium dioxide
Silicon 2 parts, magnesium oxide 4.5 parts, silane resin acceptor kh-550 4 parts, dispersant 7 parts, 2.5 parts of age resistor.
Modified epoxy is prepared by following technique: by weight by 10 parts of epoxy resin E-44s, 4 parts
Silane coupling reagent KH-570 and 7 parts of ethanol mix homogeneously, obtain material a after 52 DEG C of mechanical agitation 2.5h,
Then in material a, add 2 parts of CNTs, mechanical agitation 3.5h, ultrasound wave dispersion 1.5h, be cooled to
Adding 4 parts of methylnadic anhydride and 2 parts of altax P-30 after room temperature, stirring, it is dry to be placed on vacuum
Vacuum defoamation in dry case, obtains modified epoxy.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention not office
Being limited to this, any those familiar with the art is in the technical scope that the invention discloses, according to this
The technical scheme of invention and inventive concept thereof in addition equivalent or change, all should contain the protection in the present invention
Within the scope of.
Claims (8)
1. a circuit board electrothermal resistance fires conductive silver glue, it is characterised in that its raw material includes by weight:
Modified epoxy 30-50 part, polyurethane 12-24 part, organic siliconresin 2-9 part, flake silver powder 80-120
Part, dibutyl tin dilaurate 3-9 part, PSI 4-8 part, m-xylene diamine 1.5-3.5
Part, to phenyl diphenyl ether 2-4 part, trimellitic anhydride 3-6 part, p-phthalic acid 4-9 part, carboxylic propyl group first
Base cellulose 2-5 part, nano silicon 1-4 part, magnesium oxide 3-5 part, silane resin acceptor kh-550 3-6
Part, dispersant 4-8 part, age resistor 2-4 part.
Circuit board electrothermal resistance the most according to claim 1 fires conductive silver glue, it is characterised in that modified
Epoxy resin is prepared by following technique: by epoxy resin E-44, Silane coupling reagent KH-570 and ethanol
Mix homogeneously, obtains material a after 50-60 DEG C of mechanical agitation 1-3h, then adds carbon in material a and receives
Mitron, mechanical agitation 2-4h, ultrasound wave dispersion 1-3h, be cooled to after room temperature to add methylnadic anhydride and
Altax P-30, stirs and is placed on vacuum defoamation in vacuum drying oven, obtain modified epoxy.
Circuit board electrothermal resistance the most according to claim 1 and 2 fires conductive silver glue, it is characterised in that
In the preparation technology of modified epoxy, epoxy resin E-44, Silane coupling reagent KH-570, ethanol, carbon are received
The weight ratio of mitron, methylnadic anhydride and altax P-30 is 2-12:3-9:2-8:1-6:2-5:
1-4。
4. firing conductive silver glue according to the circuit board electrothermal resistance described in any one of claim 1-3, its feature exists
In, modified epoxy, polyurethane, organic siliconresin, flake silver powder, carboxylic propyl methocel, receive
The weight ratio of rice silicon dioxide, magnesium oxide and silane resin acceptor kh-550 is 35-45:14-22:3-8:
85-115:3-4:2-3:3.5-4.5:3.5-5.5.
5. firing conductive silver glue according to the circuit board electrothermal resistance described in any one of claim 1-4, its feature exists
In, modified epoxy, polyurethane, organic siliconresin, dibutyl tin dilaurate, polymethyl-benzene base silicon
Oxygen alkane, m-xylene diamine, weight ratio to phenyl diphenyl ether, trimellitic anhydride and p-phthalic acid are 35-45:
14-22:3-8:4-8:5-7:1.8-3.2:2.5-3.5:3.5-5.5:5-8.
6. firing conductive silver glue according to the circuit board electrothermal resistance described in any one of claim 1-5, its feature exists
In, polyurethane, organic siliconresin, flake silver powder, dibutyl tin dilaurate, epoxy resin E-44, silicon
Alkane coupling agent kh-570, ethanol, CNT, methylnadic anhydride and the weight of altax P-30
Ratio is 14-22:3-8:85-115:4-8:4-10:4-8:3-7:2-5:3-4:2-3.
7. firing conductive silver glue according to the circuit board electrothermal resistance described in any one of claim 1-6, its feature exists
In, its raw material includes by weight: modified epoxy 35-45 part, polyurethane 14-22 part, organosilicon
Resin 3-8 part, flake silver powder 85-115 part, dibutyl tin dilaurate 4-8 part, polymethyl-benzene base silica
Alkane 5-7 part, m-xylene diamine 1.8-3.2 part, to phenyl diphenyl ether 2.5-3.5 part, trimellitic anhydride 4-5
Part, p-phthalic acid 5-8 part, carboxylic propyl methocel 3-4 part, nano silicon 2-3 part, oxygen
Change magnesium 3.5-4.5 part, silane resin acceptor kh-550 4-5 part, dispersant 5-7 part, age resistor 2.5-3.5
Part.
8. firing conductive silver glue according to the circuit board electrothermal resistance described in any one of claim 1-7, its feature exists
In, its raw material includes by weight: modified epoxy 40 parts, polyurethane 18 parts, organic siliconresin 5.5
Part, flake silver powder 100 parts, dibutyl tin dilaurate 6 parts, PSI 6 parts, isophthalic
Dimethylamine 2.5 parts, to phenyl diphenyl ether 3 parts, trimellitic anhydride 4.5 parts, p-phthalic acid 6.5 parts,
Carboxylic propyl methocel 3.5 parts, nano silicon 2.5 parts, magnesium oxide 4 parts, silane resin acceptor kh-550
4.5 parts, dispersant 6 parts, 3 parts of age resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610235707.XA CN105802531A (en) | 2016-04-15 | 2016-04-15 | Electric-heating flame-retardant conductive silver adhesive for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610235707.XA CN105802531A (en) | 2016-04-15 | 2016-04-15 | Electric-heating flame-retardant conductive silver adhesive for circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN105802531A true CN105802531A (en) | 2016-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610235707.XA Pending CN105802531A (en) | 2016-04-15 | 2016-04-15 | Electric-heating flame-retardant conductive silver adhesive for circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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