CN105792603A - Cooling apparatus - Google Patents
Cooling apparatus Download PDFInfo
- Publication number
- CN105792603A CN105792603A CN201610012310.4A CN201610012310A CN105792603A CN 105792603 A CN105792603 A CN 105792603A CN 201610012310 A CN201610012310 A CN 201610012310A CN 105792603 A CN105792603 A CN 105792603A
- Authority
- CN
- China
- Prior art keywords
- section
- cooling element
- flow
- chiller
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
This invention relates to a cooling apparatus. The cooling apparatus comprises a first cooling element (5) with first channels (6) extending between a first manifold (1) and a second manifold (2) and with a base plate (9) with a first surface (10) for receiving a heat load from an electric component (11), and a second cooling element (14) with second channels (16) extending between a third manifold (3) and a fourth manifold (4). A first section (21) of the second cooling element (14) is provided with openings (19) for allowing an airflow (18) to pass through the first section (21). The second cooling element (14) comprises a second section (22) provided with openings (19), and the cooling apparatus is configured to conduct the airflow (18) which has passed through the first section (21) through the openings (19) of the second section (22).
Description
Technical field
The present invention relates to the chiller for cooling down electric component.
Background technology
Currently, it is known that a kind of radiator, electric component can be attached to this radiator so that electric component cools down.This radiator is provided with surface area big as far as possible so that as efficiently as possible by the dissipation of heat to ambient air.The problem of this radiator is that electric component is likely to produce heat load more more than the heat load that radiator can dissipate.This problem generally occurs when the surface area of available limited space and therefore radiator can not increase to sufficient size.
Currently it is known that a kind of chiller, this chiller utilizes a fluid to the heat load that place's reason electric component produces.In this chiller, electric component is attached to vaporizer, and the fluid heated is supplied to condenser by this vaporizer.Heat is dissipated to ambient air by condenser from fluid.
If it is known that chiller can be used to replace known radiator will be advantageous for obtaining more effective cooling in existing electric device.But, in many existing electric devices, chiller that the space at radiator place is circulated for above-mentioned employing fluid and Yan Tai little.
Summary of the invention
It is an object of the invention to provide a kind of chiller, this chiller can use to provide effective cooling in numerous applications.This purpose is by realizing according to the chiller of independent claims 1.
Use and there is the first section and the second section air-flow is guided through the chiller of this first section and the second section and makes it possible to obtain compact and effective chiller.
It is disclosed in the dependent claims the preferred embodiment of the present invention.
Accompanying drawing explanation
Hereinafter, incite somebody to action in an illustrative manner and be explained in more detail with reference to accompanying drawing to the present invention, in the accompanying drawings:
Figures 1 and 2 show that the first embodiment of chiller,
Fig. 3 and Fig. 4 illustrates the second embodiment of chiller, and
Fig. 5 illustrates the 3rd embodiment of chiller.
Detailed description of the invention
Figures 1 and 2 show that the first embodiment of chiller.Chiller includes the first cooling element 5, and this first cooling element 5 has the first path 6 extended between the first manifold 1 and the second manifold 2.In example shown in Fig. 1 and Fig. 2, use multiple pipe 7 to house path 6.Pipe 7 shown in each includes, by the first path 6 longitudinal side wall 8 separated from one another of a pipe 7, illustrating in greater detail in Fig. 5.Described pipe can be such as MPE pipe (porous extruding flat tube).
First element 5 also includes substrate 9.The first surface 10 of substrate is provided with electric component 11 (or more than one electric component).Producing thermic load during electric component 11 uses, this thermic load is received via first surface by substrate.In the example presented in the figure, the second surface 12 of substrate 9 is provided with groove 13, and the pipe 7 with the first path 6 is arranged in described groove 13.Therefore, the heat being derived from electric component 11 is efficiently transmitted to the fluid in the first path 6.
First cooling element 5 is operable as vaporizer, and in this case, fluid evaporates owing to being derived from the heat of electric component and therefore fluid is passed up to the second manifold 2 in fig. 1 and 2.First path 6 of each pipe 7 is connected to elongate tube each other in the upper end that may be included in the first cooling element 5 similar to the manifold shown in other by the second manifold 2.
Chiller also includes the second cooling element 14, and this second cooling element 14 has the alternate path 16 extending to the 4th manifold 4 from the 3rd manifold 3.Similar with the first path, alternate path 16 may also be arranged in the pipe 17 having longitudinal interior wall separated from one another for alternate path 16.It practice, pipe 17 can be similar with the pipe 7 shown in Fig. 5.
Air-flow 18 is provided to pass through between the second manifold 16 in different pipes 17 in shown example via oral area 19, to cool down the fluid in the alternate path 16 of the second cooling element.Second cooling element 14 may be operative to condenser, and in this case, fluid can be condensed into liquid while being moved towards the 4th manifold 4 by alternate path 16.Pipe 15 provides the fluid communication between the 4th manifold 4 and the first manifold 1 so that the fluid having been cooled by can enter the bottom of the first manifold 1.When chiller keeps the stand up position being in shown in Fig. 1 and Fig. 2, it is possible to achieve circulated without pump by the fluid of chiller.By utilizing first path 6 with capillary size even can also strengthen fluid circulation further in the first cooling element 5.
In order to obtain effective cooling, chiller is configured to air-guiding 18 through the oral area 19 in the first section 21 of the second cooling element 14, and also extends through the second section 22 of the second cooling element 14 subsequently.In the example shown, same air-flow also extends through the 3rd section 23 of the second cooling element 14.But, not all embodiment is required for the 3rd section.The fact that due to same air-flow through the more than one section of the second cooling element 14, can effectively utilize the cooling capacity of air-flow 18, this gives the cooling performance that chiller is fabulous, regardless of whether the fact that chiller is likely to be implemented as how compact and space-saving chiller.If being provided with the radiating fin 24 extended between alternate path 16 (and pipe 17) as shown in Figures 1 and 2 at oral area, then cooling capacity can become better.
In the example of fig. 1 and 2, the first section 21 and the second section 22 stacked on top and be connected to each other by additional manifold 26.Air-flow 18 is directed through forward the oral area 19 of the first section and the second section straight, and does not have any substantial change in the flowing direction.Chiller can be provided with produce air-flow fan 25 or alternatively air-flow can derive from the external fan of the part not being cooling element.The direction of air-flow can be opposite direction as shown in the drawings or alternatively.
From fig. 2 it can be seen that the second surface 12 of substrate 9 is provided to ensure that along being correctly oriented air-guiding 18 along the part of the flow path of air-flow 18.Thus, the second surface 12 of substrate 9 and air flow contacts are so that the second surface 12 of substrate 9 makes the heat being derived from electric component 11 directly be dissipated in air-flow 18.
Fig. 3 and Fig. 4 illustrates the second embodiment of chiller.The chiller of Fig. 3 and Fig. 4 is very similar with the chiller set forth in conjunction with Fig. 1 and Fig. 2.Therefore, below by mainly through pointing out that difference between these embodiments is to describe the embodiment of Fig. 3 and Fig. 4.
Fig. 3 is the side view of cooling element.But, it is shown that by separated from one another for the first path 6 in pipe 7 and usual sightless longitudinal interior wall 8 from the outside of pipe.Similarly, further it is shown that the path 16 in pipe 17.
Fig. 4 illustrates the cross-sectional view of first cooling element 5 line IV-IV along Fig. 3.In figure 3, the groove 13 in the second surface 12 of substrate 9 is visible.Similarly, in the diagram it can be seen that by the first separated longitudinal interior wall 8 of path 6 of pipe 7.
In the embodiment of Fig. 3 and Fig. 4, the second cooling element 14 ' is provided with the first section 21 ' and the second section 22 ', described first section 21 ' and the second section 22 ' and has oral area, air-flow 18 this oral area of traverse.But, the first section 21 ' and the second section 22 ' that are attached to one another by additional manifold 26 so that obtaining the such configuration of intermediate space 27 ' and arranging rather than stacked on top between the first cooling element 5 and the second cooling element 14 '.The air-flow having already passed through the first section 21 ' enters this intermediate space, and at this intermediate space place, the direction of air-flow 18 changes because of the shape of intermediate space so that air-flow 19 is guided towards the second section 22 '.It practice, the second surface 12 of substrate makes air-flow turn to towards the second section 22 ' and air-guiding is towards the second section 22 '.Meanwhile, heat is directly dissipated to air-flow 18 from the second surface 12 of substrate.
Fig. 5 illustrates the 3rd embodiment of chiller.The chiller of Fig. 5 is very similar with in conjunction with Fig. 3 and Fig. 4 chiller described.Therefore, below by mainly through pointing out that difference between these embodiments is to describe the embodiment of Fig. 5.
In Figure 5, the second cooling element 14 " include the pipe 17 of bending " and the path 16 that therefore bends ".First section 21 " and the second section 22 " include bending the second cooling element 14 " different piece.In the example shown, the first section 21 " include the second cooling element 14 " bottom and the second section 22 " include the second cooling element 14 " top.
It is to be understood that above description and accompanying drawing are only intended to illustrate the present invention.For a person skilled in the art it will be apparent that the present invention can make changes and modifications when without departing substantially from the scope of the present invention.
Claims (10)
1. a chiller, including:
First cooling element (5), described first cooling element (5) has the first path (6) extended between the first manifold (1) and the second manifold (2) and has substrate (9), described substrate (9) has for receiving the first surface (10) from the heat load of electric component (11) and the fluid for being delivered in described first path (6) by described heat load, and
nullSecond cooling element (14、14’、14”)，Described second cooling element (14、14’、14 ") there is the alternate path (16 extended between the 3rd manifold (3) and the 4th manifold (4)、16”)，Described second cooling element (14、14’、14 " described 3rd manifold (3)) is configured to receive the fluid of described second manifold (2) from described first cooling element (5) and is arranged to the fluid that receives via described alternate path (16、16 ") it is transferred to described 4th manifold (4)，Described second cooling element (14、14’、14 " the first section (21)、21’、21 " oral area (19)) it is provided with to allow air-flow (18) described first section (21 of traverse、21’、21”)，It is characterized in that，
Described second cooling element (14,14 ', 14 ") includes being provided with second section (22,22 ', 22 ") of oral area (19), and
Described chiller is configured to be directed through the described air-flow (18) having already passed through described first section (21,21 ', 21 ") the described oral area (19) of described second section (22,22 ', 22 ").
2. chiller according to claim 1, wherein, described second cooling element (14 ") is bending; and wherein, the different piece of described second cooling element that described first section of described second cooling element (21 ") and described second section (22 ") include bending (14 ").
3. chiller according to claim 1, wherein, described first section (21,21 ') of described second cooling element and described second section (22,22 ') are via one or more additional manifold (26) fluid communication with each other.
4. chiller according to claim 1, wherein, described first section (21) of described second cooling element (14) and described second section (22) stacked on top, the thus described oral area (19) of described oral area (19) and described second section (22) that described air-flow (18) is directed through forward described first section (21) straight, and there is no any substantial variation in the flowing direction.
5. chiller according to claim 1, wherein,
Described chiller is provided with intermediate space (27 '), once described air-flow has already passed through described first section (21 ', 21 "), then described air-flow (18) enters described intermediate space (27 '), and
Described intermediate space (27 ') is shaped as change flow direction to guide described air-flow (18) towards described second section (22 ', 22 ").
6. chiller according to claim 1, wherein, described substrate (9) includes the second surface (12) that a part for the flow path along described air-flow (18) is arranged, so that heat is directly dissipated to described air-flow (18) from described substrate (9).
7. chiller according to claim 1, wherein, the described second surface (12) of described substrate (9) is by changing air-flow (18) described in the direction guiding of described air-flow (18) towards described second section (22 ', 22 ").
8. chiller according to claim 1, wherein, at least one in the described alternate path (16,16 ') of described first path (6) of described first cooling element (5) or described second cooling element (14,14 ', 14 ") is arranged in multiple pipe (7,17) so that longitudinal wall (8) of described pipe (7,17) is by separated from one another to described first path (6) of a pipe (7,17) or described alternate path (16,16 ").
9. chiller according to claim 1, wherein, the described oral area (19) of described second cooling element (14,14 ', 14 ") is provided with the radiating fin (24) extended between described alternate path (16,16 ").
10. chiller according to claim 1, wherein, described chiller is provided with the fan (25) for producing described air-flow (18).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15150632.6 | 2015-01-09 | ||
| EP15150632.6A EP3043380B1 (en) | 2015-01-09 | 2015-01-09 | Cooling apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105792603A true CN105792603A (en) | 2016-07-20 |
| CN105792603B CN105792603B (en) | 2019-05-31 |
Family
ID=52347161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610012310.4A Active CN105792603B (en) | 2015-01-09 | 2016-01-08 | Cooling device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20160201993A1 (en) |
| EP (1) | EP3043380B1 (en) |
| CN (1) | CN105792603B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6665604B2 (en) * | 2016-03-15 | 2020-03-13 | 富士電機株式会社 | Semiconductor module and method of manufacturing semiconductor module |
| JP6981307B2 (en) * | 2018-02-28 | 2021-12-15 | 株式会社デンソー | Power converter |
| WO2023076093A1 (en) * | 2021-10-25 | 2023-05-04 | Lam Research Corporation | Microchannel assembly cooled power circuits for power boxes of substrate processing systems |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070012245A1 (en) * | 2005-07-14 | 2007-01-18 | Samsung Electronics Co., Ltd. | Semiconductor manufacturing apparatus and coolant circulating method using the same |
| CN101377392A (en) * | 2007-08-27 | 2009-03-04 | Abb研究有限公司 | Heat exchanger |
| CN102237322A (en) * | 2010-04-29 | 2011-11-09 | Abb公司 | Mounting base |
| CN103363818A (en) * | 2012-03-28 | 2013-10-23 | Abb研究有限公司 | Heat exchanger for traction converters |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3033440A (en) * | 1958-06-25 | 1962-05-08 | Hughes Aircraft Co | Cooling device for electronic apparatus |
| JPS5929985A (en) * | 1982-08-11 | 1984-02-17 | Hitachi Ltd | Constant pressure type boiling and cooling device |
| US5529116A (en) * | 1989-08-23 | 1996-06-25 | Showa Aluminum Corporation | Duplex heat exchanger |
| US6360814B1 (en) * | 1999-08-31 | 2002-03-26 | Denso Corporation | Cooling device boiling and condensing refrigerant |
| JP2003318341A (en) * | 2002-04-25 | 2003-11-07 | Matsushita Electric Ind Co Ltd | Cooling device for semiconductor element |
| EP2246654B1 (en) * | 2009-04-29 | 2013-12-11 | ABB Research Ltd. | Multi-row thermosyphon heat exchanger |
| RU2524058C2 (en) * | 2009-09-28 | 2014-07-27 | Абб Рисерч Лтд | Cooling module for cooling of electronic elements |
| AU2012232968B2 (en) * | 2011-10-31 | 2014-11-13 | Abb Technology Ag | Thermosiphon cooler arrangement in modules with electric and/or electronic components |
-
2015
- 2015-01-09 EP EP15150632.6A patent/EP3043380B1/en active Active
-
2016
- 2016-01-05 US US14/988,225 patent/US20160201993A1/en not_active Abandoned
- 2016-01-08 CN CN201610012310.4A patent/CN105792603B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070012245A1 (en) * | 2005-07-14 | 2007-01-18 | Samsung Electronics Co., Ltd. | Semiconductor manufacturing apparatus and coolant circulating method using the same |
| CN101377392A (en) * | 2007-08-27 | 2009-03-04 | Abb研究有限公司 | Heat exchanger |
| CN102237322A (en) * | 2010-04-29 | 2011-11-09 | Abb公司 | Mounting base |
| CN103363818A (en) * | 2012-03-28 | 2013-10-23 | Abb研究有限公司 | Heat exchanger for traction converters |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3043380B1 (en) | 2021-09-22 |
| EP3043380A1 (en) | 2016-07-13 |
| US20160201993A1 (en) | 2016-07-14 |
| CN105792603B (en) | 2019-05-31 |
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| C06 | Publication | ||
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| TA01 | Transfer of patent application right |
Effective date of registration: 20190411 Address after: Baden, Switzerland Applicant after: ABB TECHNOLOGY LTD. Address before: Helsinki Applicant before: ABB T & D Technology Ltd. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |