CN105788698A - 一种铜包铝复合线材 - Google Patents

一种铜包铝复合线材 Download PDF

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CN105788698A
CN105788698A CN201610321527.3A CN201610321527A CN105788698A CN 105788698 A CN105788698 A CN 105788698A CN 201610321527 A CN201610321527 A CN 201610321527A CN 105788698 A CN105788698 A CN 105788698A
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copper
composite wire
cuprum
cladding
layers
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谢国锋
谢晓雯
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Jiangsu Greenshine Wire&cable Co Ltd
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Priority to US15/206,564 priority patent/US10202692B2/en
Priority to KR1020160088550A priority patent/KR20160091294A/ko
Publication of CN105788698A publication Critical patent/CN105788698A/zh
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    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C23C28/025Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only with at least one zinc-based layer
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    • C25D3/00Electroplating: Baths therefor
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    • C25D3/38Electroplating: Baths therefor from solutions of copper
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    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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Abstract

本发明公开了一种可减少铜的用量的铜包铝复合线材,其结构包括:铝质线材,所述的铝质线材的表面依次设置有中间金属层和铜层;设:铜层的厚度为t1、比重为ρ1,中间金属层的厚度为t2、比重为ρ2,铝质线材的半径为R、比重为ρ3,则0.02≤K1≤0.12。该铜包铝复合线材可广泛地应用于通信行业中。

Description

一种铜包铝复合线材
技术领域
本发明涉及到一种用于通信行业中的复合线材,尤其涉及到一种铜包铝复合线材。
背景技术
目前,传统的铜包铝复合线材,是将铜带直接包覆在作为芯线的铝线或铝镁合金线材上,并采用氩弧焊对铜带接缝进行焊接,然后,经过多道次拉拨而成。众所周知,铜与铝的机械性能相差较大,虽然经过了超过80%减面率的多道次拉拔,铜带与芯线也无法达到冶金结合紧密的程度;而且,为了多次拉拔顺利,铜带需要有足够的厚度,通常情况下,铜占所述复合线材的质量百分比含量通常在25%以上,这样就增加了铜的用量,从而增加了生产成本,降低了产品的竞争力。
发明内容
本发明所要解决的技术问题是:提供一种可以减少铜的用量、并能使铜与铝质线材结合紧密的用于馈线同轴电缆内导体的铜包铝复合线材。
为解决上述技术问题,本发明所采用的技术方案为:一种铜包铝复合线材,包括:铝质线材,该铝质线材的表面依次设置有中间金属层和铜层;
设:铜层的厚度为t1、比重为ρ1,中间金属层的厚度为t2、比重为ρ2,铝质线材的半径为R、比重为ρ3,则:
t 1 = ( R + t 2 ) 2 + K 1 × ( t 2 2 + 2 t 2 × R ) ρ 2 + K 1 × R 2 ρ 3 ( 1 - K 1 ) × ρ 1 - R - t 2 , 0.02 ≤ K 1 ≤ 0.12 ;
其中,比重的单位是克/立方厘米,厚度和半径的单位为毫米。
作为一种优选方案,在所述的一种铜包铝复合线材中,所述的中间金属层为锌层或镍层;
t 2 = R × 1 + K 2 × ρ 3 ( 1 - K 2 ) × ρ 2 - R , K 2 ≤ 0.005.
作为一种优选方案,在所述的一种铜包铝复合线材中,所述的铝质线材为铝线,铝的质量百分比含量在99%以上即铝的纯度在99%以上;作为进一步的优选方案,所述铝的纯度在99.8%以上。
作为一种优选方案,在所述的一种铜包铝复合线材中,所述铜层中铜的质量百分比含量在99%以上即铜的纯度在99%以上;作为进一步的优选方案,所述铜的纯度在99.9%以上。
作为一种优选方案,在所述的一种铜包铝复合线材中,所述的铜层和中间金属层均通过电镀的方法依次覆盖在所述铝质线材的表面。
作为一种优选方案,在所述的一种铜包铝复合线材中,所述的中间金属层先通过化学镀的方法覆盖在所述铝质线材的表面,然后再通过电镀的方式将铜层覆盖在中间金属层的表面。
本发明的有益效果是:本发明通过中间金属层将铜层设置在铝质线材上,使得铜层可以非常紧密地包裹在铝质线材上,达到冶金结合紧密的程度;此外,通过将铜的质量百分比含量(占整体线材)控制在12%以下,大幅减小了铜的用量,降低了产品的制造成本,而且,该铜包铝复合线材的电气参数完全达到标准要求。
附图说明
图1是本发明所述铜包铝复合线材的一种实施方式的结构示意图。
图2是本发明所述铜包铝复合线材的另一种实施方式的结构示意图。
图1、图2中的附图标记:1、铝线,2、锌层,3、镍层,4、铜层;R为铝线的横截面半径,t2为锌层或镍层的厚度,t1为铜层的厚度。
具体实施方式
下面结合附图,详细描述本发明所述的一种铜包铝复合线材的具体实施方案:
如图1所示,本发明所述的一种铜包铝复合线材,其结构包括:将质量百分比含量在99%以上即铝的纯度在99%以上的铝线1作为铝质线材,然后,在该铝线1的表面依次电镀有锌层2和质量百分比含量在99%以上即铜的纯度在99%以上的铜层4;
设:铜层4的厚度为t1、比重为ρ1,锌层2的厚度为t2、比重为ρ2,铝线1的半径即其横截面的半径为R、比重为ρ3,则
t 2 = R × 1 + K 2 × ρ 3 ( 1 - K 2 ) × ρ 2 - R , K 2 ≤ 0.005 ;
t 1 = ( R + t 2 ) 2 + K 1 × ( t 2 2 + 2 t 2 × R ) ρ 2 + K 1 × R 2 ρ 3 ( 1 - K 1 ) × ρ 1 - R - t 2 , 0.02 ≤ K 1 ≤ 0.12 ;
其中,比重的单位是克/立方厘米,厚度和半径的单位为毫米。
实际应用时,铝线1中铝的质量百分比含量通常在99.8%以上,铜层4中铜的质量百分比含量通常在99.9%以上。
作为本发明的另一种实施方式,如图2所示,也可以在铝线1的表面先电镀镍形成镍层3(中间金属层),然后,再在镍层3的表面电镀铜,形成铜层4。镍层3和铜层4的厚度的计算方式与图1所示的铜包铝复合线材中相对应的锌层2和铜层4的计算方式完全一致,在此不再赘述。
当然,本发明也可以采用化学镀的方式将锌或镍先镀在铝线1的表面,形成锌层2或镍层3(中间金属层),然后,再在锌层2或镍层3的表面采用电镀的方式将铜镀在锌层2或镍层3的表面,形成铜层4,得到本发明所述的铜包铝复合线材。
本发明所述的铜包铝复合线材的电气参数完全达到标准要求,主要的电气参数见下表:
综上所述,仅为本发明的较佳实施例而已,并非用来限定本发明实施的范围,凡依本发明权利要求范围所述的形状、构造、特征及精神所作的等同变化与修饰,均应包括在本发明的权利要求范围内。

Claims (8)

1.一种铜包铝复合线材,包括:铝质线材,其特征在于:所述铝质线材的表面依次设置有中间金属层和铜层;
设:铜层的厚度为t1、比重为ρ1,中间金属层的厚度为t2、比重为ρ2,铝质线材的半径为R、比重为ρ3,则:
t 1 = ( R + t 2 ) 2 + K 1 ( t 2 2 + 2 t 2 × R ) ρ 2 + K 1 × R 2 ρ 3 ( 1 - K 1 ) × ρ 1 - R - t 2 , 0.02 ≤ K 1 ≤ 0.12
其中,比重的单位是克/立方厘米,厚度和半径的单位为毫米。
2.根据权利要求1所述的铜包铝复合线材,其特征在于:所述的中间金属层为锌层或镍层;
t 2 = R × 1 + K 2 × ρ 3 ( 1 - K 2 ) × ρ 2 - R , K 2 ≤ 0.005.
3.根据权利要求1所述的铜包铝复合线材,其特征在于:所述的铝质线材为铝线,铝的质量百分比含量在99%以上。
4.根据权利要求3所述的铜包铝复合线材,其特征在于:铝的质量百分比含量在99.8%以上。
5.根据权利要求1所述的铜包铝复合线材,其特征在于:所述铜层中铜的质量百分比含量在99%以上。
6.根据权利要求5所述的铜包铝复合线材,其特征在于:铜的质量百分比含量在99.9%以上。
7.根据权利要求1至6之一所述的铜包铝复合线材,其特征在于:所述的铜层和中间金属层均通过电镀的方法依次覆盖在所述铝质线材的表面。
8.根据权利要求1至6之一所述的铜包铝复合线材,其特征在于:所述的中间金属层先通过化学镀的方法覆盖在所述铝质线材的表面,然后再通过电镀的方式将铜层覆盖在中间金属层的表面。
CN201610321527.3A 2016-05-16 2016-05-16 一种铜包铝复合线材 Pending CN105788698A (zh)

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CN201610321527.3A CN105788698A (zh) 2016-05-16 2016-05-16 一种铜包铝复合线材
US15/206,564 US10202692B2 (en) 2016-05-16 2016-07-11 Copper-clad aluminum composite wire
KR1020160088550A KR20160091294A (ko) 2016-05-16 2016-07-13 구리 피복 알루미늄 복합 선재

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