CN105780077A - Plating device - Google Patents
Plating device Download PDFInfo
- Publication number
- CN105780077A CN105780077A CN201610008856.2A CN201610008856A CN105780077A CN 105780077 A CN105780077 A CN 105780077A CN 201610008856 A CN201610008856 A CN 201610008856A CN 105780077 A CN105780077 A CN 105780077A
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- Prior art keywords
- plating
- removal mechanism
- plating solution
- carboxylic acid
- alcohol
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/22—Regeneration of process solutions by ion-exchange
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
A plating device equipped with a plating tank and an impurity removal mechanism disposed so as to remove impurities from a plating solution in the plating tank or a plating solution to be supplied to the plating tank, in which the impurity removal mechanism includes at least one of a carboxylic acid removal mechanism and an alcohol removal mechanism.
Description
Technical field
The present invention relates to a kind of plating apparatus (platingdevice).More particularly it relates to a kind of plating apparatus for manufacturing the conductive pattern being used in various electronic unit, particularly relate to a kind of for passing through to electroplate the plating apparatus forming planar coil.
Background technology
In recent years, along with the miniaturization of electronic equipment, slimming and lightweight, for the shape of the planar coil parts that they use, it is also desirable to miniaturization, slimming, lightweight, in properties of product, also strongly it is expected in its volume and improves coil performance.The representatively manufacture method of coil, it is possible to enumerate the manufacture method undertaken by etching and plating.But, in recent years, it is desirable to narrow and high occupation efficiency coil that space is few between line, therefore, plating mode the manufacture method carried out is indispensable.As plating mode, the manufacture method of following half addition (semiadditive) is widely known by the people.
In semi-additive process, on the surface of the base conductor layer being previously formed in insulative substrate, in the way of covering the part beyond coil portion, form resist, using base conductor layer as substrate, electroplate by utilizing DC current to carry out and form conductor layer.Afterwards, after peeling off corrosion-resisting pattern, remove by etching the useless base conductor layer stripping due to corrosion-resisting pattern exposed.
For the formation of common planar coil, adopt copper sulfate plating.Copper sulfate bath is that as main constituent, mixed dissolution, in solvent, is added to the solution of additive and chlorine using sulphuric acid and copper sulfate.
Fig. 4 represents the skeleton diagram of existing plating apparatus.As shown in Figure 4, existing plating apparatus 1 possesses the coating bath 2 for plated body 10 carries out plating, stores the management groove 4 of the plating solution 3 overflowed from coating bath 2, plating solution 3 circulates to coating bath 2 from management groove 4 plating solution delivery system 5 and the anode electrode 9 of transport.
Plating solution delivery system 5 is made up of the effusion meter 17 of the pump 6 transporting plating solution 3, the flow valve 7 of the flow regulating plating solution 3, the filter 8 of the impurity removed in plating solution and the flow of measuring plating solution 3.
Fig. 3 represents the structure example (profile) of plated body 10.Plated body 10 is to form base conductor layer 12 plated body being patterned by resist 13 on the surface of substrate 11, has the contact portion 14 supplying electric current for basad conductor layer 12.
Then, the action of existing plating apparatus is illustrated.First, plated body 10 is impregnated in plating solution 3.By making electric current flow from the basad conductor layer 12 of anode electrode 9 such that it is able to make metal precipitate out on base conductor layer 12 surface.Base conductor layer 12 can be made current flow through via contact portion 14.
Now, at anode electrode surface, constitute the metal ejected electron of anode electrode and become ion, liquate in plating solution 3.Being formed with base conductor layer 12 on the surface of substrate 11, the metal ion in its surface, plating solution 3 receives electronics, thus metal precipitates out on the surface of base conductor layer 12.Plating solution 3 automatically supplies mouth 18 and supplies to coating bath 2, and overflows from coating bath 2.
In the existing plating apparatus 1 of said structure, if resist 13 impregnated in plating solution 3, then the organic principle of the trace that resist 13 comprises in plating solution 3 by liquate.Plating solution 3 circulation between coating bath 2 and management groove 4 is transported and Reusability, but, if using existing plating apparatus 1 for a long time, then in plating solution 3, above-mentioned resist liquate thing increases, and the undesirable condition producing to send out mist or projection etc. at plated film can become problem.
In order to solve this problem, generally by active carbon filter, plating solution is filtered, removes the resist liquate thing in plating solution, plating solution is regenerated.But, the filtration of active carbon filter is difficult to optionally removal resist liquate thing.
In plating solution, add organic solvent invention to solve this problem, it is proposed that a kind of, the Organic substance in plating solution is extracted the method (patent documentation 1) being removed to this organic solvent.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 4-272200 publication
But, in above-mentioned patent documentation 1, it is impossible to the specifically Organic substance of specific generation undesirable condition, extract in removal organic, the concentration of the effective Organic substance of plating (such as additive) also can be reduced., there is the problem that the film quality making plated film due to the concentration change of additive is unstable in its result.
Summary of the invention
The present invention is the invention completed to release the problems referred to above, its object is to, a kind of plating apparatus is provided, its Organic substance producing undesirable condition not reducing useful additive concentration and optionally removing in plating solution, even if using plating apparatus for a long time, produce to send out mist or projection without at plated film.
In order to solve above-mentioned problem, conduct in-depth research, its result, the present inventors is found that, the Organic substance producing undesirable condition in plating solution is the analyte of the solvent composition (hereinafter also referred to as resist solvent composition) that resist comprises, thus completing the present invention.
The analyte of so-called resist solvent composition, specifically, the analyte that during plating solution that the organic solvent with ester bond, the resist that such as comprises propylene glycol methyl ether acetate (PMA) or ethyl lactate or butyl acetate etc. impregnated in acidity, the ester bond of organic solvent is generated by hydrolyzable is referred to.The analyte of so-called organic solvent, specifically, is carboxylic acid and alcohol.
The plating apparatus of the present invention possesses coating bath and the Impurity removal mechanism to be configured in the way of removal by impurity from the plating solution in coating bath or supply to the plating solution of coating bath, and Impurity removal mechanism includes at least one in carboxylic acid removal mechanism and alcohol removal mechanism.Thus, even if using plating apparatus for a long time, it is also possible to suppress to produce to send out mist or projection at plated film.
It addition, the plating apparatus of the present invention can also be also equipped with being received from the plating solution of coating bath supply and the plating solution of reception supplying the management groove to described coating, carboxylic acid removal mechanism or alcohol removal mechanism again being connected with this management groove.
Thereby, it is possible to the concentration change in plating solution in suppression coating bath, and then the plated film that film quality is stable can be obtained.
By using above-mentioned plating apparatus such that it is able to the Organic substance producing undesirable condition not reducing useful additive concentration and optionally removing in plating solution, and can not produced to send out the plated film of mist or projection steadily in the long term.
Accompanying drawing explanation
Fig. 1 indicates that the skeleton diagram of the plating apparatus of the first embodiment.
Fig. 2 indicates that the skeleton diagram of the plating apparatus of the second embodiment.
Fig. 3 is the profile of plated body.
Fig. 4 is the skeleton diagram of existing plating apparatus.
The explanation of symbol
1: existing plating apparatus, 2: coating bath, 3: plating solution, 4: management groove, 5: plating solution delivery system, 6: pump, 7: flow valve, 8: filter, 9: anode electrode, 10: plated body, 11: substrate, 12: base conductor layer, 13: resist, 14: contact portion, 15: carboxylic acid removal mechanism (ion chromatography apparatus), 16: alcohol removal mechanism (distilling apparatus), 17: effusion meter, 18: supply mouth, 19: Impurity removal mechanism, plating apparatus in 20: the first embodiments, plating apparatus in 21: the second embodiments.
Detailed description of the invention
(the first embodiment)
Hereinafter, the preferred mode being used for implementing the present invention is illustrated.But, the technological thought of the present invention is not limited to following embodiment.
Fig. 1 represents the skeleton diagram of the plating apparatus 20 of the first embodiment.The plating apparatus 20 of present embodiment possesses: plated body 10 carries out the coating bath 2 of plating；Store the management groove 4 of the plating solution 3 overflowed from coating bath 2；Plating solution 3 is circulated from management groove 4 to coating bath 2 the plating solution delivery system 5 of transport；Anode electrode 9；It is connected with coating, the Impurity removal mechanism 19 that impurity is removed from plating solution 3.Impurity removal mechanism 19 is divided into carboxylic acid removal mechanism 15 and alcohol removal mechanism 16.
Plating solution 3 can comprise the existing known composition being used in electrolysis plating, it is possible to comprises metallized metal ion to be plated, organic acid or mineral acid and additive.Additive can use existing known additive, for example, it is possible to enumerate the dye leveller etc. of the sulfur-containing compound class plating accelerator of the plating inhibitor of the non-ionic surfactant of chloride ion, Polyethylene Glycol etc., double; two (3-sulfopropyl) disulphide etc., Janus green B etc..The form of the metallized metal ion to be plated salt to comprise this metal ion is added to plating solution, when plating solution 3 is copper electrolyte, it is possible to enumerate copper sulfate, copper chloride, Copper pyrophosphate. etc..When plating solution 3 is copper electrolyte, as organic acid or mineral acid, it is possible to use alkanesulfonic acid, sulphuric acid etc..
For the resist being formed at plated body 10, comprise the organic solvent with above-mentioned ester bond.As such organic solvent with ester bond, for instance propylene glycol methyl ether acetate (PMA), ethyl lactate or butyl acetate etc. can be enumerated.Carboxylic acid and alcohol that these organic solvents with ester bond are generated by hydrolyzable when impregnated in the plating solution of acidity become the reason producing to send out mist or projection when using plating apparatus for a long time at plated film.Concrete example as this carboxylic acid, for instance acetic acid, formic acid etc. can be enumerated.Concrete example as this alcohol, for instance 1-methoxy-2-propanol, 2-methoxy-2-propanol etc. can be enumerated.
Carboxylic acid removal mechanism 15 uses the mechanism of the carboxylic acid can optionally removed in plating solution.For example, it is possible to enumerate ion chromatography apparatus, distilling apparatus etc..It is particularly preferably the ion chromatography apparatus that can optionally remove carboxylic acid.As ion chromatography apparatus, it is possible to use known arbitrary ion chromatography apparatus.The device that be commonly called doubtful moving bed is preferably used.As distilling apparatus, as long as the device carboxylic acid contained as impurity can removed, then have no particular limits, it is however preferred to have until the distilling apparatus of the heating function of 150～160 DEG C.Carboxylic acid removal mechanism 15 is preferably the carboxylic acid removal mechanism substantially above-mentioned to be plated metallized metal ion, organic acid or mineral acid and additive not removed from plating solution 3, with compared with the plating solution before carboxylic acid removal mechanism, the concentration change having passed through these compositions in the plating solution 3 of carboxylic acid removal mechanism is preferably below 10 mass %.
Alcohol removal mechanism 16 uses the mechanism of the alcohol can optionally removed in plating solution.For example, it is possible to enumerate distilling apparatus, can optionally remove the active carbon filter etc. of alcohol.At this, activated carbon can be preferably used the activated carbon of the metallic catalyst being supported with platinum etc..As distilling apparatus, it is particularly preferred to for can optionally remove the distilling apparatus of alcohol.Distilling apparatus can use common distilling apparatus, it is however preferred to have until the distilling apparatus of the heating function of 150～160 DEG C.Alcohol removal mechanism 16 is preferably the alcohol removal mechanism substantially above-mentioned to be plated metallized metal ion, organic acid or mineral acid and additive not removed from plating solution 3, with compared with the plating solution 3 before alcohol removal mechanism 16, the concentration change having passed through these compositions in the plating solution 3 of alcohol removal mechanism 16 is preferably below 10 mass %.
Then, the plating action plating apparatus 20 illustrated in Fig. 1 carried out illustrates.First, plated body 10 is impregnated in plating solution 3.Plated body 10 is identical with the plated body shown in above-mentioned Fig. 3.Plated body 10 is by making electric current flow through substrate 11 from anode electrode 9 such that it is able to make metal precipitate out on substrate 11 surface.Plating solution 3 automatically supplies mouth 18 and supplies, and overflows at coating bath 2.
At the plating solution 3 overflowed, liquate has the organic principle of the trace of resist 13 liquate from plated body 10.If this organic principle accumulate in plating solution 3 and make its amount exceed certain is a certain amount of, then produce to send out the undesirable condition of mist or projection etc. at plated film.
Then, the regeneration of the plating solution 3 that the plating apparatus 20 illustrated in Fig. 1 carries out is illustrated.First, by pump 6, the plating solution 3 comprising resist liquate thing is delivered to the carboxylic acid removal mechanism 15 being arranged on coating bath 2.When carboxylic acid removal mechanism 15 is ion chromatography apparatus, it is filled with storng-acid cation exchange resin in the post (column) of ion chromatography apparatus, by making plating solution 3 pass through in storng-acid cation exchange resin, thus the carboxylic acid adsorbing, removing in plating solution 3.Storng-acid cation exchange resin is used in styrene diethylene benzene copoly mer and is bonded with sulfonic acid type strong-acid ion exchange resin sulfonic, gel-type.
Then, the plating solution eliminating carboxylic acid is delivered to alcohol removal mechanism 16.When alcohol removal mechanism 16 is distilling apparatus, in distilling apparatus, by heater, plating solution 3 is regulated to the evaporating temperature of alcohol.At this, the alcohol in plating solution 3 becomes steam, and steam is by cooling tube and is liquefied, removes.Become the plating solution 3 of high temperature by regulating to the cooling tube of the temperature of regulation and returning coating bath 2.
Even if using such plating apparatus with regeneration sector for a long time, also seldom produce to send out the undesirable condition of mist or projection etc. at plated film.This is because, the reason material that plated film gives undesirable condition is only selectively removed by above-mentioned Impurity removal mechanism 19.
(the second embodiment)
Fig. 2 indicates that the figure of the structure of the plating apparatus 21 in the second embodiment.In fig. 2, Impurity removal mechanism 19 is connected with management groove 4.In addition, identical with the plating apparatus 20 described in the first embodiment.
By Impurity removal mechanism 19 is connected with management groove 4 such that it is able to the concentration change making plating solution 3 in coating bath 2 is more uniform.There is the effect that the plated film making thus to obtain is stable.
Embodiment
Hereinafter, by reference example and embodiment, the present invention is further illustrated.
(function of Impurity removal mechanism confirms)
By reference example 1～3, the effect of the Impurity removal mechanism in copper sulfate bath is illustrated.As copper sulfate bath, to become copper sulphate pentahydrate 200g/ liter, sulphuric acid 100g/ liter, hydrochloric acid 50mg/ liter, to modulate plating solution in the way of Polyethylene Glycol (PEG) the 100mg/ liter of additive, double; two (3-sulfopropyl) disulphide (SPS) 8mg/ liter, Janus green B (JGB) 10mg/ liter.Impregnated in above-mentioned copper sulfate bath by amounting to four pieces of substrates being coated with resist in the way of becoming thickness 30 μm on the Silicon Wafer of diameter 6 inches, place 7 days and make impurity liquate, thus as sample solution.It is acetic acid that the impurity of liquate confirms carboxylic acid by use ion chromatography apparatus, IR analysis and NMR, and alcohol is 1-methoxy-2-propanol.
(reference example 1)
Removed the carboxylic acid in said sample solution by ion chromatography apparatus (THERMO company system, trade name DX500), and removed alcohol by distilling apparatus.The removal of the carboxylic acid obtained by ion chromatography apparatus is that AS20 (post footpath 4mm), flow carry out when being 1 ml/min using post.It addition, the removal of the alcohol obtained by distilling apparatus carries out when setting heating-up temperature as 150 DEG C.The removal of carboxylic acid and alcohol is once carried out by ion chromatography apparatus and distilling apparatus by making all sample solutions.
(reference example 2)
Said sample solution is removed carboxylic acid and alcohol by active carbon filter.By making all sample solutions once be carried out the removal of carboxylic acid and alcohol by active carbon filter.
(reference example 3)
Said sample solution is not removed carboxylic acid and alcohol.
Table 1 represents the concentration measurement result of each composition of plating solution handled in reference example 1～3.As shown in Table 1, the carboxylic acid concentration of reference example 1 and determining alcohol step-down compared with reference example 2 and 3.It addition, additive concentration reduces in reference example 2, but, do not reduce in reference example 1.
[table 1]
(function of plating apparatus confirms)
Then, by embodiment and comparative example, the effect of the plating apparatus of the technical scope belonging to the present invention has been inquired into.Specifically, the change of plated film is confirmed by the operation continuously of this plating apparatus.As copper sulfate bath, to become copper sulphate pentahydrate 200g/ liter, sulphuric acid 100g/ liter, hydrochloric acid 50mg/ liter, to modulate plating solution in the way of the Polyethylene Glycol 100mg/ liter of additive, double; two (3-sulfopropyl) disulphide 8mg/ liter, Janus green B 10mg/ liter.
(embodiment 1)
The plating solution of above-mentioned modulation is fed into the plating apparatus being connected to ion chromatography apparatus as Impurity removal mechanism at coating bath, carries out plating.Condition when the use condition of ion chromatography apparatus confirms with the function of above-mentioned Impurity removal mechanism is identical.
(embodiment 2)
The plating solution of above-mentioned modulation is fed into the plating apparatus being connected to distilling apparatus as Impurity removal mechanism at coating bath, carries out plating.Condition when the use condition of distilling apparatus confirms with the function of above-mentioned Impurity removal mechanism is identical.
(embodiment 3)
The plating solution of above-mentioned modulation is fed into as shown in Figure 1 and is connected to ion chromatography apparatus (carboxylic acid removal mechanism) and the plating apparatus of distilling apparatus (alcohol removal mechanism) at coating bath, carry out plating.Condition when the use condition of ion chromatography apparatus and distilling apparatus confirms with the function of above-mentioned Impurity removal mechanism is identical.
(embodiment 4)
The plating solution of above-mentioned modulation is fed into as shown in Figure 2 and is connected to ion chromatography apparatus (carboxylic acid removal mechanism) and the plating apparatus of distilling apparatus (alcohol removal mechanism) at management groove, carry out plating.Condition when the use condition of ion chromatography apparatus and distilling apparatus confirms with the function of above-mentioned Impurity removal mechanism is identical.
(comparative example 1)
As comparative example, the plating solution of above-mentioned modulation is put into the existing plating apparatus shown in Fig. 4, carries out plating.
In embodiment 1～4 and comparative example 1, it is used on Si wafer in the way of becoming thickness 18 μm painting erosion resistant agent, and the substrate patterned by known photolithographic technology.By embodiment 1, embodiment 2, embodiment 3, embodiment 4, comparative example 1 device, by electroplating method, aforesaid substrate is carried out plating so that plating thickness becomes 15 μm.Each for its every day 10 pieces of ground are carried out, the outward appearance of the plating tunicle after confirming 1 day, after 30 days, after 60 days and after 90 days.
The results are shown in table 2, from the result shown in table 2 it can be seen that compared with comparative example 1, any one embodiment all can obtain not sending out the plating tunicle of mist relative to continuous operation for a long time.If comparing embodiment 1 and embodiment 2, then embodiment 1 more can obtain not sending out the plating tunicle of mist relative to continuous operation for a long time.If it addition, comparing embodiment 3 and embodiment 4, then embodiment 4 more can obtain not sending out the plating tunicle of mist relative to continuous operation for a long time.
[table 2]
Claims (4)
1. a plating apparatus, it is characterised in that
Possess:
Coating bath；And
By the Impurity removal mechanism that impurity is connected in the way of removal from the plating solution in described coating bath or supply to the plating solution of described coating bath,
Described Impurity removal mechanism includes at least one in carboxylic acid removal mechanism and alcohol removal mechanism.
2. plating apparatus as claimed in claim 1, it is characterised in that
Being also equipped with: management groove, it is received from the plating solution of described coating bath supply, and again supplies the plating solution of reception to described coating,
At least one in described carboxylic acid removal mechanism and alcohol removal mechanism is connected with described management groove.
3. plating apparatus as claimed in claim 1, it is characterised in that
Described Impurity removal mechanism includes carboxylic acid removal mechanism and alcohol removal mechanism the two mechanism.
4. plating apparatus as claimed in claim 2, it is characterised in that
Described Impurity removal mechanism includes carboxylic acid removal mechanism and alcohol removal mechanism the two mechanism.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-002992 | 2015-01-09 | ||
| JP2015002992 | 2015-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105780077A true CN105780077A (en) | 2016-07-20 |
Family
ID=56367120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610008856.2A Pending CN105780077A (en) | 2015-01-09 | 2016-01-07 | Plating device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20160201213A1 (en) |
| JP (1) | JP2016130363A (en) |
| CN (1) | CN105780077A (en) |
| TW (1) | TWI586847B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10711366B2 (en) | 2017-12-28 | 2020-07-14 | Lam Research Corporation | Removal of electroplating bath additives |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2434191A (en) * | 1942-02-02 | 1948-01-06 | Du Pont | Removing organic impurities from copper-cyanide electroplating baths |
| BE860506A (en) * | 1976-11-06 | 1978-03-01 | Richard Tscherwitschke G M B H | PROCESS FOR REMOVING HARMFUL AND DISRUPTIVE ORGANIC MATERIALS FROM ELECTROLYTIC TREATMENT BATHS |
| JPS5322829A (en) * | 1976-08-16 | 1978-03-02 | Suzuki Motor Co | Method of removing impurities in composite plating solution |
| JPH0499199A (en) * | 1990-08-07 | 1992-03-31 | Hitachi Aic Inc | Treatment for recovery of copper plating liquid |
| CN1300882A (en) * | 1999-12-21 | 2001-06-27 | 住友特珠金属株式会社 | Apparatus and method for electroplating treatment |
| CN1637171A (en) * | 2003-09-02 | 2005-07-13 | 日本爱铝美克斯株式会社 | Plating apparatus and method |
| CN201660705U (en) * | 2010-04-12 | 2010-12-01 | 上海新阳半导体材料股份有限公司 | Plating device |
| CN102312270A (en) * | 2010-07-06 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Electroplating system and application method thereof |
| CN102899707A (en) * | 2012-11-12 | 2013-01-30 | 上海华力微电子有限公司 | Electroplating apparatus equipped with electroplating solution recovery device |
| CN103993346A (en) * | 2014-05-31 | 2014-08-20 | 奚经龙 | Impurity removing and regenerating method for electronickelling solution |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2091129A (en) * | 1935-05-11 | 1937-08-24 | Mathieson Alkali Works Inc | Electrochemical production of peroxides |
| TWM492323U (en) * | 2014-08-27 | 2014-12-21 | Jun-Yi Wu | Apparatus of converting waste aluminum electrolyte into boehmite |
-
2015
- 2015-12-25 JP JP2015254508A patent/JP2016130363A/en active Pending
- 2015-12-28 US US14/980,610 patent/US20160201213A1/en not_active Abandoned
- 2015-12-30 TW TW104144521A patent/TWI586847B/en active
-
2016
- 2016-01-07 CN CN201610008856.2A patent/CN105780077A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2434191A (en) * | 1942-02-02 | 1948-01-06 | Du Pont | Removing organic impurities from copper-cyanide electroplating baths |
| JPS5322829A (en) * | 1976-08-16 | 1978-03-02 | Suzuki Motor Co | Method of removing impurities in composite plating solution |
| BE860506A (en) * | 1976-11-06 | 1978-03-01 | Richard Tscherwitschke G M B H | PROCESS FOR REMOVING HARMFUL AND DISRUPTIVE ORGANIC MATERIALS FROM ELECTROLYTIC TREATMENT BATHS |
| JPH0499199A (en) * | 1990-08-07 | 1992-03-31 | Hitachi Aic Inc | Treatment for recovery of copper plating liquid |
| CN1300882A (en) * | 1999-12-21 | 2001-06-27 | 住友特珠金属株式会社 | Apparatus and method for electroplating treatment |
| CN1637171A (en) * | 2003-09-02 | 2005-07-13 | 日本爱铝美克斯株式会社 | Plating apparatus and method |
| CN201660705U (en) * | 2010-04-12 | 2010-12-01 | 上海新阳半导体材料股份有限公司 | Plating device |
| CN102312270A (en) * | 2010-07-06 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Electroplating system and application method thereof |
| CN102899707A (en) * | 2012-11-12 | 2013-01-30 | 上海华力微电子有限公司 | Electroplating apparatus equipped with electroplating solution recovery device |
| CN103993346A (en) * | 2014-05-31 | 2014-08-20 | 奚经龙 | Impurity removing and regenerating method for electronickelling solution |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201634763A (en) | 2016-10-01 |
| TWI586847B (en) | 2017-06-11 |
| US20160201213A1 (en) | 2016-07-14 |
| JP2016130363A (en) | 2016-07-21 |
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