CN105780069A - Chloride 1-hexyl-3-methyl glyoxaline/ferric chloride system electroplating solution - Google Patents
Chloride 1-hexyl-3-methyl glyoxaline/ferric chloride system electroplating solution Download PDFInfo
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- CN105780069A CN105780069A CN201511016505.8A CN201511016505A CN105780069A CN 105780069 A CN105780069 A CN 105780069A CN 201511016505 A CN201511016505 A CN 201511016505A CN 105780069 A CN105780069 A CN 105780069A
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- Prior art keywords
- chlorination
- methylimidazole
- hexyl
- iron chloride
- chloride
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
Abstract
A chloride 1-hexyl-3-methyl glyoxaline/ferric chloride system electroplating solution (g.kg<-1>) is composed of 611-614 parts of chloride 1-hexyl-3-methyl glyoxaline, 35-39 parts of ferric chloride, 315-319 parts of nickel chloride, 4-5 parts of ethanediol, 3-4 parts of dextrin, and 21-25 parts of sodium chloride (NaCl). The chloride 1-hexyl-3-methyl glyoxaline/ferric chloride system electroplating solution has a wide electrochemical window, metal and alloy which can only be obtained in high-temperature molten salt through electro-deposition can be obtained at the low temperature, but high corrosion of the high-temperature molten salt is avoided. The electroplating solution is free of aquation, hydrolysis, hydrogen involvement and the like, and the electroplating solution has the properties, required by green solvents, of being small in corrosion and small in pollution. Meanwhile, most metal which is obtained in aqueous solutions can be obtained through electro-deposition, side reactions are avoided, and therefore the obtained metal is better in quality.
Description
Technical field: the present invention relates to a kind of electroplate liquid, chlorination 1-hexyl-3-Methylimidazole ./chlorine
Change ferrum system plating solution.
Background technology: ferronickel itself has been good magnetic material, over the years at this coating
Much work has been done in research.First control structure it is intended to, because the physical characteristics such as magnetic, magnetic
The behaviors on farmland etc. are in close relations with material structure.Electro-plating method controls essence so that it is distinctive simple
Really facilitate, be used to form all special constructions, such as, form three-dimensional ladder.Utilize not
The different feed sides such as the superposition of same additive, employing pulse or the current of commutation and alternating current-direct current
Case, can effectively regulate structure and the orientation of coating, therefore can prepare with electro-plating method
Magnetics.
For achieving the above object, the technical solution used in the present invention is: chlorination 1-hexyl-3-first
The formula of base imidazoles/iron chloride system plating solution:
Chlorination 1-amyl group-3-Methylimidazole.: 611～624g kg-1
Iron chloride: 35～39g kg-1
Nickel dichloride.: 315～319g kg-1
Ethylene glycol: 4～5g kg-1
Dextrin: 3～4g kg-1
Sodium chloride (NaCl): 21～25g kg-1
Ferrum is typically one of modal impurity in nickel plating solution, and ferrum is from steely plating piece
Easily entering plating solution, when iron content is atomic, impact is the most little, but plates when building up to a certain amount of
Layer turns yellow, the crisp thus pH to be adjusted that has to, oxidation and filter except ferrum with activated carbon.
But, if the amount of ferrum is the most a lot of, then there will be another situation, electrode realizes different
Often co-deposit and plate out the ferro-nickel alloy plating of function admirable.
Chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution, has wider electrification
Learn window, the most i.e. can get ability electro-deposition obtains in high-temperature molten salt metal and conjunction
Gold, but there is no severe corrosive as high-temperature molten salt.This electroplate liquid do not exist aquation, hydrolysis,
The problems such as liberation of hydrogen, have that corrosion is little, pollute the character that the green solvent such as little should possess.Meanwhile,
Electro-deposition can obtain the metal that obtains in aqueous of great majority, not side reaction, thus
The metal quality obtained is more preferable.
Detailed description of the invention:
Use raw material: chlorination 1-hexyl-3-Methylimidazole., iron chloride, Nickel dichloride., ethylene glycol,
Dextrin, sodium chloride.
Embodiment 1:
Chlorination 1-amyl group-3-Methylimidazole.: 611g kg-1
Iron chloride: 39g kg-1
Nickel dichloride.: 319g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride (NaCl): 22g kg-1
Take said components, be mixed into the chlorination 1-hexyl-3-Methylimidazole ./iron chloride of 1000 grams
System plating solution.
Embodiment 2:
Chlorination 1-amyl group-3-Methylimidazole.: 611g kg-1
Iron chloride: 38g kg-1
Nickel dichloride.: 318g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride (NaCl): 24g kg-1
Take said components, be mixed into the chlorination 1-hexyl-3-Methylimidazole ./iron chloride of 1000 grams
System plating solution.
Embodiment 3:
Chlorination 1-amyl group-3-Methylimidazole.: 612g kg-1
Iron chloride: 39g kg-1
Nickel dichloride.: 319g kg-1
Ethylene glycol: 4g kg-1
Dextrin: 3g kg-1
Sodium chloride (NaCl): 23g kg-1
Take said components, be mixed into the chlorination 1-hexyl-3-Methylimidazole ./iron chloride of 1000 grams
System plating solution.
Embodiment 4:
Chlorination 1-amyl group-3-Methylimidazole.: 612g kg-1
Iron chloride: 38g kg-1
Nickel dichloride.: 318g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride (NaCl): 23g kg-1
Take said components, be mixed into the chlorination 1-hexyl-3-Methylimidazole ./iron chloride of 1000 grams
System plating solution.
Embodiment 5:
Chlorination 1-amyl group-3-Methylimidazole.: 612g kg-1
Iron chloride: 37g kg-1
Nickel dichloride.: 317g kg-1
Ethylene glycol: 4g kg-1
Dextrin: 5g kg-1
Sodium chloride (NaCl): 25g kg-1
Take said components, be mixed into the chlorination 1-hexyl-3-Methylimidazole ./iron chloride of 1000 grams
System plating solution.
Embodiment 6:
Chlorination 1-amyl group-3-Methylimidazole.: 613g kg-1
Iron chloride: 38g kg-1
Nickel dichloride.: 319g kg-1
Ethylene glycol: 4g kg-1
Dextrin: 3g kg-1
Sodium chloride (NaCl): 23g kg-1
Take said components, be mixed into the chlorination 1-hexyl-3-Methylimidazole ./iron chloride of 1000 grams
System plating solution.
Embodiment 7:
Chlorination 1-amyl group-3-Methylimidazole.: 613g kg-1
Iron chloride: 37g kg-1
Nickel dichloride.: 318g kg-1
Ethylene glycol: 4g kg-1
Dextrin: 3g kg-1
Sodium chloride (NaCl): 25g kg-1
Take said components, be mixed into the chlorination 1-hexyl-3-Methylimidazole ./iron chloride of 1000 grams
System plating solution.
Embodiment 8:
Chlorination 1-amyl group-3-Methylimidazole.: 614g kg-1
Iron chloride: 35g kg-1
Nickel dichloride.: 319g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride (NaCl): 23g kg-1
Take said components, be mixed into the chlorination 1-hexyl-3-Methylimidazole ./iron chloride of 1000 grams
System plating solution.
Embodiment 9:
Chlorination 1-amyl group-3-Methylimidazole.: 614g kg-1
Iron chloride: 38g kg-1
Nickel dichloride.: 318g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride (NaCl): 21g kg-1
Take said components, be mixed into the chlorination 1-hexyl-3-Methylimidazole ./iron chloride of 1000 grams
System plating solution.
When electroplating by the present invention, it is desirable to pH value of solution: 3.1～3.5, solution temperature (DEG C): 120～
130, electric current density (A/dm2): 2.6～2.9.
Claims (10)
1. chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution, it is characterised in that:
The formula of chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution consists of:
Chlorination 1-amyl group-3-Methylimidazole.: 611～614g kg-1
Iron chloride: 35～39g kg-1
Nickel dichloride.: 315～319g kg-1
Ethylene glycol: 4～5g kg-1
Dextrin: 3～4g kg-1
Sodium chloride: 21～25g kg-1。
2. chlorination 1-hexyl-3-Methylimidazole. as claimed in claim 1/iron chloride system electricity
Plating solution, it is characterised in that: chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution
Formula consists of:
Chlorination 1-amyl group-3-Methylimidazole.: 611g kg-1
Iron chloride: 39g kg-1
Nickel dichloride.: 319g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride: 22g kg-1。
3. chlorination 1-hexyl-3-Methylimidazole. as claimed in claim 1/iron chloride system electricity
Plating solution, it is characterised in that: chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution
Formula consists of:
Chlorination 1-amyl group-3-Methylimidazole.: 611g kg-1
Iron chloride: 38g kg-1
Nickel dichloride.: 318g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride: 24g kg-1。
4. chlorination 1-hexyl-3-Methylimidazole. as claimed in claim 1/iron chloride system electricity
Plating solution, it is characterised in that: chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution
Formula consists of:
Chlorination 1-amyl group-3-Methylimidazole.: 612g kg-1
Iron chloride: 39g kg-1
Nickel dichloride.: 319g kg-1
Ethylene glycol: 4g kg-1
Dextrin: 3g kg-1
Sodium chloride: 23g kg-1。
5. chlorination 1-hexyl-3-Methylimidazole. as claimed in claim 1/iron chloride system electricity
Plating solution, it is characterised in that: chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution
Formula consists of:
Chlorination 1-amyl group-3-Methylimidazole.: 612g kg-1
Iron chloride: 38g kg-1
Nickel dichloride.: 318g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride: 23g kg-1。
6. chlorination 1-hexyl-3-Methylimidazole. as claimed in claim 1/iron chloride system electricity
Plating solution, it is characterised in that: chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution
Formula consists of:
Chlorination 1-amyl group-3-Methylimidazole.: 612g kg-1
Iron chloride: 37g kg-1
Nickel dichloride.: 317g kg-1
Ethylene glycol: 4g kg-1
Dextrin: 5g kg-1
Sodium chloride: 25g kg-1。
7. chlorination 1-hexyl-3-Methylimidazole. as claimed in claim 1/iron chloride system electricity
Plating solution, it is characterised in that: chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution
Formula consists of:
Chlorination 1-amyl group-3-Methylimidazole.: 613g kg-1
Iron chloride: 38g kg-1
Nickel dichloride.: 319g kg-1
Ethylene glycol: 4g kg-1
Dextrin: 3g kg-1
Sodium chloride: 23g kg-1。
8. chlorination 1-hexyl-3-Methylimidazole. as claimed in claim 1/iron chloride system electricity
Plating solution, it is characterised in that: chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution
Formula consists of:
Chlorination 1-amyl group-3-Methylimidazole.: 613g kg-1
Iron chloride: 37g kg-1
Nickel dichloride.: 318g kg-1
Ethylene glycol: 4g kg-1
Dextrin: 3g kg-1
Sodium chloride: 25g kg-1。
9. chlorination 1-hexyl-3-Methylimidazole. as claimed in claim 1/iron chloride system electricity
Plating solution, it is characterised in that: chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution
Formula consists of:
Chlorination 1-amyl group-3-Methylimidazole.: 614g kg-1
Iron chloride: 35g kg-1
Nickel dichloride.: 319g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride: 23g kg-1。
10. chlorination 1-hexyl-3-Methylimidazole ./iron chloride system as claimed in claim 1
Electroplate liquid, it is characterised in that: chlorination 1-hexyl-3-Methylimidazole ./iron chloride system plating solution
Formula consist of:
Chlorination 1-amyl group-3-Methylimidazole.: 614g kg-1
Iron chloride: 38g kg-1
Nickel dichloride.: 318g kg-1
Ethylene glycol: 5g kg-1
Dextrin: 4g kg-1
Sodium chloride: 21g kg-1。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511016505.8A CN105780069A (en) | 2015-12-29 | 2015-12-29 | Chloride 1-hexyl-3-methyl glyoxaline/ferric chloride system electroplating solution |
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|---|---|---|---|
| CN201511016505.8A CN105780069A (en) | 2015-12-29 | 2015-12-29 | Chloride 1-hexyl-3-methyl glyoxaline/ferric chloride system electroplating solution |
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| CN105780069A true CN105780069A (en) | 2016-07-20 |
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| CN201511016505.8A Pending CN105780069A (en) | 2015-12-29 | 2015-12-29 | Chloride 1-hexyl-3-methyl glyoxaline/ferric chloride system electroplating solution |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110670096A (en) * | 2019-11-17 | 2020-01-10 | 沈阳师范大学 | Novel practical electroplating solution for plating nickel iron |
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| CN101270490A (en) * | 2008-04-11 | 2008-09-24 | 沈阳师范大学 | Dissipated metal indium chloride/chloridization 1-methyl-3-butyl imidazole system plating solution |
| US20090242414A1 (en) * | 2004-12-10 | 2009-10-01 | Urs Welz-Biermann | Electronchemical deposition of tantalum and/or copper in ionic liquids |
| CN101876082A (en) * | 2010-05-13 | 2010-11-03 | 沈阳师范大学 | Ionic liquid gallium chloride/1-methyl-3-ethylimidazole chloride system electroplating solution |
| CN101994139A (en) * | 2010-12-08 | 2011-03-30 | 沈阳师范大学 | Scattered metal gallium chloride/1-methyl-3-butyliminazole chloride system electroplating solution |
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Patent Citations (9)
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| US20090242414A1 (en) * | 2004-12-10 | 2009-10-01 | Urs Welz-Biermann | Electronchemical deposition of tantalum and/or copper in ionic liquids |
| CN101270490A (en) * | 2008-04-11 | 2008-09-24 | 沈阳师范大学 | Dissipated metal indium chloride/chloridization 1-methyl-3-butyl imidazole system plating solution |
| CN102191517A (en) * | 2010-03-10 | 2011-09-21 | 中国科学院过程工程研究所 | Method of electroplating zinc, nickel, molybdenum and their alloys by using ionic liquid |
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| CN104313655A (en) * | 2014-10-16 | 2015-01-28 | 昆明理工大学 | Method for electroplating Ni-Fe alloy with ionic liquid |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110670096A (en) * | 2019-11-17 | 2020-01-10 | 沈阳师范大学 | Novel practical electroplating solution for plating nickel iron |
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Application publication date: 20160720 |