CN105778508A - Thermal-conductive silicone rubber composite material substrate and preparation method thereof - Google Patents
Thermal-conductive silicone rubber composite material substrate and preparation method thereof Download PDFInfo
- Publication number
- CN105778508A CN105778508A CN201610130501.0A CN201610130501A CN105778508A CN 105778508 A CN105778508 A CN 105778508A CN 201610130501 A CN201610130501 A CN 201610130501A CN 105778508 A CN105778508 A CN 105778508A
- Authority
- CN
- China
- Prior art keywords
- weight
- silicone rubber
- percentage
- nickel
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a thermal-conductive silicone rubber composite material substrate and a preparation method thereof.A nickel-plated carbon nanotube and nickel-plated graphene are adopted to compose a high-thermal-conductive main cluster body, and the excellent thermal-conductive property of the material in the horizontal direction can be effectively guaranteed; silicone oil filler is adopted as a main structure material, good physical and chemical indexes of the material are guaranteed, and therefore the silicone rubber material which has the good thermal-conductive property and maintains the inherent insulativity, resilience and flexibility of the material is prepared on the technology more easily.
Description
Technical field
Disclosure one silica gel material, particularly a kind of thermally conductive silicone rubber composite material base material and preparation method thereof.
Background technology
Development along with commercial production and science and technology, in field of electronics, electronic product develops towards networking, intellectuality, microminiaturized direction, electronic component, logic circuit are developed to complete, light, thin, little direction, and along with the integrated Chengdu of electronic device is more and more higher, its caloric value is consequently increased, thus causing that the working environment of electronic devices and components sharply changes to high temperature direction.Research shows, general electronic devices and components temperature often raises 2 DEG C, and its reliability will decline 10%, and therefore heat dissipation problem has also just become the key issue whether equipment can be properly functioning.At present, the main method solving heat dissipation problem is to need just by the material of high heat conduction, the effective heat removing electronic equipment generation, the reliability of this service life being related to product and quality.
In prior art, solving electronic equipment dissipating heat is solved by various forms of radiators a bit, but in the electronic device, many contact surfaces are had between various electronic components and radiator, space is there is between them, cause that hot-fluid is not smooth, in order to solve this problem, between contact surface, generally fill heat-conducting silicon rubber sheet, utilize the flexibility of heat-conducting silicon rubber its material of sheet and the elastic module under low compressing power effect, closely sealed contact is constructed for its rough surface, so that by microprocessor, the heat that painting processor and other important chip produce is taken away, reduce or even eliminate the air thermal resistance at contact surface place between kind of electronic component and radiator.
At present, in the industry the radiating mode of heat-conducting silicon rubber is selected following manner mostly:
1, the overwhelming majority is all select the Inorganic Non-metallic Materials such as metal-oxide, nitride and carbide (such as: aluminium oxide, aluminium nitride etc.) as filler, polymer to be filled with in the industry, prepare insulated type heat-conducting silicon rubber material, but there is heat conductivility difference, the of home make heat-conducting silicon rubber material of China, its heat conductivity is typically in 1.5-3W/m about k, is not suitable for the radiating requirements of high performance components.Thus the silicone rubber sheet material developing a kind of high heat conduction just becomes a kind of objective demand.
2, another kind of is exactly select the carbon-based material such as metal-powder or carbon fiber, Graphene, CNT, as filler, polymer is filled with, the heat-conducting silicon rubber heat conductivility prepared has and significantly promotes, its heat conductivity can accomplish 5.0-8W/m k or higher, but its electric conductivity is also significantly high for it simultaneously, its safety is subject to very big restriction, thus having significant limitation in actual application, major part abandons the program, is only used in very special less demanding heat conduction field and applies.How keeping high heat conductivity, and electric conductivity is controlled in rational scope, this is a technological difficulties.
At present, solution in the industry generally exactly tries every possible means to increase more Inorganic Non-metallic Materials to improve its heat conductivity, but the too much words of addition affect again its mobility, increase the difficulty of preparation.This technique is easy for causing mixing uneven, solidifies difficulty, and the easy fragmentation of product made, mechanical strength does not pass a test, and causes that product quality is low.
Summary of the invention
Heat conductivity for heat-conducting silicon rubber of the prior art mentioned above is low or electric conductivity is strong, or heat conductivity is high, mechanical property difference the shortcoming present invention a kind of thermally conductive silicone rubber composite material base material and preparation method thereof is provided, it adopts nickel-plating carbon nanotube and Ni-coated graphite alkene to form high heat conduction master bunch body, the outstanding heat conductivility of material can be effectively ensured, adopt silicone oil filler as main structure material, ensure that the physics that material is good, chemical index, thus preparing one in technique more simply there is good heat conductivility, and maintain its intrinsic insulating properties, the silastic material of resilience and compliance.
This invention address that its technical problem the technical scheme is that a kind of thermally conductive silicone rubber composite material base material, base material includes heat filling base material and auxiliary agent, heat filling includes accounting for the Ni-coated graphite alkene sheet that percentage by weight is 0.5-1.2%, account for nickel-plating carbon nanotube that percentage by weight is 0.5-6% and account for the carbon fiber that percentage by weight is 0.5-6%, base material includes accounting for the methyl vinyl silicone rubber that percentage by weight is 5-15%, account for dimethicone that percentage by weight is 60～80% and account for the hydroxy silicon oil that percentage by weight is 3-15%, auxiliary agent is account for the vulcanizing agent that percentage by weight is 1-5%.
The manufacture method of a kind of hot silicon rubber composite material, its preparation method comprises the steps:
(1) prepared by silicone rubber matrix: methyl vinyl silicone rubber and dimethicone is carried out mixed grinding so that it is mix homogeneously, obtains silicone rubber matrix；
(2) vacuum kneading: silicone rubber matrix obtained in step 1 adds hydroxy silicon oil, then the dispensing in heat filling it is sequentially added into, add to successively in silicone rubber matrix according to packing quality component order from less to more, carry out mixing, vacuum kneading 30-40 minute, obtains heat-conducting silicon rubber elastomeric compound；
(3), the heat-conducting silicon rubber elastomeric compound obtained in step 2 is filled in mould, mould wraps around magnet exciting coil, the size of current regulated in magnet exciting coil controls the intensity in magnetic field in magnetic loop, making the carrying magnetic carbon based particles being originally randomly dispersed within silicone rubber matrix, under the action of a magnetic field, these particles become chain or meshy arrangement；
(4), hot setting: the mould of the mixture led equipped with magnetic field is put in baking box, solidifies 15-25 minute at 120-160 DEG C of temperature, obtain the sheet silicone rubber composite of forming.
This invention address that the technical scheme that its technical problem adopts further comprises:
The rare length of described Ni-coated graphite is 3-20 μm, the lamellar structure of thickness 20nm.
On described nickel-plating carbon nanotube, nickel coating thickness is 8～15nm, and in nickel-plating carbon nanotube, nickel content is more than 60%, the OD particle diameter of interpolation: 8-15nm, ID particle diameter: 3-5nm, length 10-50um, content of carbon nanotubes > the nickel plating multi-walled carbon nano-tubes of 38%.
The molecular weight of described methyl vinyl silicone rubber is 50-70 ten thousand, and wherein, contents of ethylene is 0.07-0.15mo1%.
Described hydroxy silicon oil is micromolecular hydroxyl silicone oil, and wherein hydroxy radical content is the 8% of hydroxy silicon oil weight.
Described vulcanizing agent adopts 2,5-dimethyl-2, and 5-bis-(t-butylperoxy) hexane, molecular formula is: C16H34O4.
The invention has the beneficial effects as follows: the present invention takes full advantage of electronics, phonon thermal conduction function simultaneously, well solve heat conduction and nonconducting equilibrium point.Material of the present invention can reach the heat conductivity of more than 5w/m k self by special formulation and technological means, and material conducts heat performance is significantly increased.Multinomial filler and combined influence are studied by the present invention, the particle diameter of every kind of material, form are chosen, surface wettability processes, doping mark regulates, Balance Treatment in conjunction with himself heat conductivility and electric conductivity, filler variety classes is carried out science collocation, makes its heat conductivility reach ultimate attainment as far as possible, and maintain the safety of material itself, resilience and compliance.
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
Accompanying drawing explanation
Fig. 1 is the hysteresis curve figure of Ni-coated graphite alkene in the present invention.
Fig. 2 is the Electronic Speculum figure of lamellar Ni-coated graphite alkene in the present invention.
Fig. 3 is the hysteresis curve figure of nickel-plating carbon nanotube in the present invention.
Fig. 4 is the Electronic Speculum figure of nickel-plating carbon nanotube in the present invention.
Fig. 5 is the Electronic Speculum figure of carbon fiber in the present invention.
Fig. 6 is the mechanical property figure of carbon fiber in the present invention.
Fig. 7 is the sheet resistance performance map of carbon fiber in the present invention.
Detailed description of the invention
The present embodiment is the preferred embodiment for the present invention, and other its principles all are identical with the present embodiment or approximate with basic structure, all within scope.
The invention mainly comprises heat filling (present invention is defined as component A), base material and auxiliary agent (present invention is defined as component B), wherein, heat filling (i.e. component A) includes accounting for the weight (gross weight of material, including component A and component B) percentage ratio is the Ni-coated graphite alkene sheet of 0.5-1.2%, account for nickel-plating carbon nanotube that percentage by weight is 0.5-6% and account for the carbon fiber that percentage by weight is 0.5-6%, base material and auxiliary agent (i.e. component B) include accounting for the methyl vinyl silicone rubber that percentage by weight is 5-15%, account for the dimethicone that percentage by weight is 60-80%, account for hydroxy silicon oil that percentage by weight is 3-15% and account for the vulcanizing agent that percentage by weight is 1-5%.
In the present embodiment, Ni-coated graphite alkene sheet adopts chemical plating method to cover one layer of nickel granule at graphenic surface, nickel granule deposition distribution is uniform, particle diameter unification, tiny (thickness is at about 40nm), wherein, nickel content (weight ratio) in Ni-coated graphite alkene sheet is more than 60%, and Ni-coated graphite alkene remanent magnetization reaches 21.57Am2/kg.What adopt in the present embodiment is 3-20 μm for the rare length of Ni-coated graphite, the lamellar structure of thickness 20nm, it can be made when addition is few, heat just can be made to conduct more quickly in the horizontal direction, thus improving the heat conductivity of material greatly, refer to the hysteresis curve figure that accompanying drawing 1, Fig. 1 is Ni-coated graphite alkene.The basic feature of Ni-coated graphite alkene sheet is: high surface area: 2675m2/g, and density is low: 1.89-2.1g/cm3, pyroconductivity 5300W/m k, refer to the Electronic Speculum figure that accompanying drawing 2, Fig. 2 is the lamellar Ni-coated graphite alkene adopted in invention.In the present embodiment, nickel-plating carbon nanotube adopts the method for chemical plating that CNT is carried out plating nickel on surface, CNT has been overplated with nickel dam, thickness of coating is 8～15nm about, in nickel-plating carbon nanotube, nickel content (weight ratio) is more than 60%, nickel-plating carbon nanotube saturation magnetization reaches 13.067Am2/kg, and remanent magnetization (Mr) is 2.238Am2/kg.In the present embodiment, nickel-plating carbon nanotube is thimble tube structure, wherein, OD (i.e. external diameter) particle diameter of additive is: 8-15nm, ID (i.e. internal diameter) particle diameter is: 3-5nm, length 10-50um, wherein, the content of carbon nanotubes in nickel-plating carbon nanotube is more than the 38% of nickel-plating carbon nanotube gross weight.Owing to nickel-plating carbon nanotube has the draw ratio of super large, it is possible to make it when addition is few, just increase substantially heat conductivity and the mechanical strength of material.Refer to the hysteresis curve figure that accompanying drawing 3, Fig. 3 is nickel-plating carbon nanotube.In the present embodiment, the basic feature of nickel-plating carbon nanotube is: specific surface area > 233m2/g, bulk density: 0.27g/cm3, pyroconductivity 3000W/m k, refer to the Electronic Speculum figure that accompanying drawing 4, figure is the lamellar Ni-coated graphite alkene adopted in invention.In the present embodiment, the interpolation length of carbon fiber (i.e. CF) is 100-300 μm, diameter 10 μm, wherein, and the carbon fiber of carbon content > 99%；Heat conductivity the mechanical property of reinforcing material can be improved.The basic feature of the carbon fiber in the present embodiment is: the density of carbon fiber: 1.5～2.0g/cm3, and this carbon fiber heat conductivity in machine direction can exceed copper, the highest can reach 700W/mk；Having heat conduction and the heat loss through radiation ability of good mechanical performance, electric conductivity and excellence, the Electronic Speculum figure of carbon fiber refer to accompanying drawing 5 simultaneously.Carbon fiber adds the relation such as Fig. 6 (mechanical property of carbon fiber) between mass fraction and relevant mechanical property and shown in accompanying drawing 7 (the sheet resistance performance of carbon fiber).
In the present embodiment, the molecular weight of methyl vinyl silicone rubber (i.e. VMQ) is 50-70 ten thousand, and wherein, contents of ethylene is (0.07-0.15mo1%), and its processing characteristics and incompressible permanent deformation performance are pretty good.In the present embodiment, dimethicone (molecular formula: CH3) 3SiO [(CH3) 2SiO] n-Si (CH3) 3 adopted) viscosity is 50～500cps.In the present embodiment, the hydroxy silicon oil (molecular formula: HO [(CH3) 2SiO] nH) adopted is micromolecular hydroxyl silicone oil, viscosity (under 25 DEG C of conditions): 25～30cps, wherein hydroxy radical content is the 8% of hydroxy silicon oil weight.In the present embodiment, vulcanizing agent adopts 2,5-dimethyl-2, and 5-bis-(t-butylperoxy) hexane (molecular formula: C16H34O4), this vulcanizing agent adopted abnormal smells from the patient after curing is more small in alkyl peroxide.
The preparation method that the present invention protects a kind of thermally conductive silicone rubber composite material simultaneously, concrete preparation process comprises the steps:
1, prepared by silicone rubber matrix: methyl vinyl silicone rubber and dimethicone is joined and carries out mixed grinding in grinder so that it is mix homogeneously, obtains silicone rubber matrix.
2, vacuum kneading: silicone rubber matrix obtained in step 1 is put in vacuum kneader, add hydroxy silicon oil at first, secondly the heat filling of addO-on therapy A, add to successively in silicone rubber matrix according to packing quality component order from less to more, vacuum kneader carry out mixing, vacuum kneading 30-40 minute, obtains heat-conducting silicon rubber elastomeric compound.
3, mould molding: the heat-conducting silicon rubber elastomeric compound obtained in step 2 is filled in the mould setting thickness, and this mold thickness is set as 0.5-12MM.Mould wraps around magnet exciting coil, according to research metal magnetic particles when magnetic field intensity is 200kA/m, its dynamic yield stress reaches magnetic saturation, the intensity in magnetic field in magnetic loop is controlled by regulating the size of current in magnet exciting coil, the best results when exciting current is transferred to 1.5A, exciting current can be set as 1.5A, by the magnetic field that magnet exciting coil produces, the carrying magnetic example generation order arrangement that about about 5 minutes can make in heat-conducting silicon rubber elastomeric compound.These magnetic carbon based particles original are randomly dispersed within silicone rubber matrix, under the action of a magnetic field, these particles become chain or meshy arrangement, and along with the enhancing of magnetic field intensity, spacing between granule diminishes, contact is more closely (150～800), utilize the feature of the draw ratio of material self simultaneously, be easier in the direction of horizontal and vertical become a three-dimensional thermal conducting path.
4, hot setting: the mould of the mixture led equipped with magnetic field is put in baking box, solidifies 15-25 minute at 120-160 DEG C of temperature, obtains the sheet silicone rubber composite of forming.
With several instantiations, the present invention will be specifically described below:
Embodiment one: the percentage by weight of Ni-coated graphite alkene sheet is 0.5%, the percentage by weight of nickel-plating carbon nanotube is 3%, the percentage by weight of carbon fiber is 4%, the percentage by weight of methyl vinyl silicone rubber is 6.5%, the percentage by weight of dimethicone is 78%, the percentage by weight of hydroxy silicon oil is 6%, the percentage by weight of vulcanizing agent is 2%, recording heat conductivity under this proportioning is 2.2W/m k, hardness is 10 (shore00), and specific insulation is 1012(Ω.cm)。
Embodiment two: the percentage by weight of Ni-coated graphite alkene sheet is 0.9%, the percentage by weight of nickel-plating carbon nanotube is 4.5%, the percentage by weight of carbon fiber is 5%, the percentage by weight of methyl vinyl silicone rubber is 12.6%, the percentage by weight of dimethicone is 73%, the percentage by weight of hydroxy silicon oil is 3%, the percentage by weight of vulcanizing agent is 1%, recording heat conductivity under this proportioning is 3.8W/m k, hardness is 16 (shore00), and specific insulation is 1011(Ω.cm)。
Embodiment three: the percentage by weight of Ni-coated graphite alkene sheet is 1.2%, the percentage by weight of nickel-plating carbon nanotube is 5.4%, the percentage by weight of carbon fiber is 4.4%, the percentage by weight of methyl vinyl silicone rubber is 10.5%, the percentage by weight of dimethicone is 70%, the percentage by weight of hydroxy silicon oil is 7%, the percentage by weight of vulcanizing agent is 1.5%, recording heat conductivity under this proportioning is 4.5W/m k, hardness is 20 (shore00), and specific insulation is 1010(Ω.cm)。
Embodiment four: the percentage by weight of Ni-coated graphite alkene sheet is 1.0%, the percentage by weight of nickel-plating carbon nanotube is 6.0%, the percentage by weight of carbon fiber is 6.0%, the percentage by weight of methyl vinyl silicone rubber is 10.0%, the percentage by weight of dimethicone is 70%, the percentage by weight of hydroxy silicon oil is 6.0%, the percentage by weight of vulcanizing agent is 1.0%, recording heat conductivity under this proportioning is 5.0W/m k, hardness is 18 (shore00), and specific insulation is 109(Ω.cm)。
Embodiment five: the percentage by weight of Ni-coated graphite alkene sheet is 1.0%, the percentage by weight of nickel-plating carbon nanotube is 0.5%, the percentage by weight of carbon fiber is 6.0%, the percentage by weight of methyl vinyl silicone rubber is 10%, the percentage by weight of dimethicone is 75.5%, the percentage by weight of hydroxy silicon oil is 6.0%, the percentage by weight of vulcanizing agent is 1.0%, recording heat conductivity under this proportioning is 3.2W/m k, hardness is 14 (shore00), and specific insulation is 1011(Ω.cm)。
Embodiment six: the percentage by weight of Ni-coated graphite alkene sheet is 1.0%, the percentage by weight of nickel-plating carbon nanotube is 6.0%, the percentage by weight of carbon fiber is 0.5%, the percentage by weight of methyl vinyl silicone rubber is 5.0%, the percentage by weight of dimethicone is 76.5%, the percentage by weight of hydroxy silicon oil is 10.0%, the percentage by weight of vulcanizing agent is 1.0%, recording heat conductivity under this proportioning is 3.1W/m k, hardness is 12 (shore00), and specific insulation is 1012(Ω.cm)。
Embodiment seven: the percentage by weight of Ni-coated graphite alkene sheet is 1.0%, the percentage by weight of nickel-plating carbon nanotube is 5.0%, the percentage by weight of carbon fiber is 6.0%, the percentage by weight of methyl vinyl silicone rubber is 15%, the percentage by weight of dimethicone is 62%, the percentage by weight of hydroxy silicon oil is 10.0%, the percentage by weight of vulcanizing agent is 1.0%, recording heat conductivity under this proportioning is 4.8W/m k, hardness is 25 (shore00), and specific insulation is 109(Ω.cm)。
Embodiment eight: the percentage by weight of Ni-coated graphite alkene sheet is 1.0%, the percentage by weight of nickel-plating carbon nanotube is 4.0%, the percentage by weight of carbon fiber is 5.0%, the percentage by weight of methyl vinyl silicone rubber is 10%, the percentage by weight of dimethicone is 60%, the percentage by weight of hydroxy silicon oil is 15.0%, the percentage by weight of vulcanizing agent is 5.0%, recording heat conductivity under this proportioning is 4.2W/m k, hardness is 28 (shore00), and specific insulation is 1010(Ω.cm)。
Embodiment nine: the percentage by weight of Ni-coated graphite alkene sheet is 1.0%, the percentage by weight of nickel-plating carbon nanotube is 2.0%, the percentage by weight of carbon fiber is 6.0%, the percentage by weight of methyl vinyl silicone rubber is 10%, the percentage by weight of dimethicone is 73%, the percentage by weight of hydroxy silicon oil is 5.0%, the percentage by weight of vulcanizing agent is 3.0%, recording heat conductivity under this proportioning is 3.0W/m k, hardness is 15 (shore00), and specific insulation is 1010(Ω.cm)。
Embodiment ten: the percentage by weight of Ni-coated graphite alkene sheet is 1.0%, the percentage by weight of nickel-plating carbon nanotube is 6.0%, the percentage by weight of carbon fiber is 5.0%, the percentage by weight of methyl vinyl silicone rubber is 12%, the percentage by weight of dimethicone is 69%, the percentage by weight of hydroxy silicon oil is 6.0%, the percentage by weight of vulcanizing agent is 1.0%, recording heat conductivity under this proportioning is 4.9W/m k, hardness is 21 (shore00), and specific insulation is 109(Ω.cm)。
Hardness measurement in above-described embodiment: use shoreoo durometer to carry out hardness measurement.
Measured Results of Thermal Conductivity in above-described embodiment: use the hotdisk2500S thermal conductivity test instrument of Kai Genasi company limited of Sweden to be measured.
Claims (7)
1. a thermally conductive silicone rubber composite material base material, it is characterized in that: described base material includes heat filling base material and auxiliary agent, heat filling includes accounting for Ni-coated graphite alkene sheet that percentage by weight is 0.5-1.2%, account for nickel-plating carbon nanotube that percentage by weight is 0.5-6% and account for the carbon fiber that percentage by weight is 0.5-6%, base material includes accounting for methyl vinyl silicone rubber that percentage by weight is 5-15%, account for dimethicone that percentage by weight is 60-80% and account for the hydroxy silicon oil that percentage by weight is 3-15%, and auxiliary agent is account for the vulcanizing agent that percentage by weight is 1-5%.
2. thermally conductive silicone rubber composite material base material according to claim 1, is characterized in that: the rare length of described Ni-coated graphite is 3-20 μm, the lamellar structure of thickness 20nm.
3. thermally conductive silicone rubber composite material base material according to claim 1, it is characterized in that: on described nickel-plating carbon nanotube, nickel coating thickness is 8～15nm, in nickel-plating carbon nanotube, nickel content is more than 60%, nickel-plating carbon nanotube is thimble tube structure, wherein, the OD particle diameter of additive is: 8-15nm, ID particle diameter is: 3-5nm, length 10-50um, the content of carbon nanotubes in nickel-plating carbon nanotube is more than or equal to the 38% of nickel-plating carbon nanotube gross weight.
4. thermally conductive silicone rubber composite material base material according to claim 1, is characterized in that: the molecular weight of described methyl vinyl silicone rubber is 50-70 ten thousand, and wherein, contents of ethylene is 0.07-0.15mol%.
5. thermally conductive silicone rubber composite material base material according to claim 1, is characterized in that: described hydroxy silicon oil is micromolecular hydroxyl silicone oil, and wherein hydroxy radical content is the 8% of hydroxy silicon oil weight.
6. thermally conductive silicone rubber composite material base material according to claim 1, is characterized in that: described vulcanizing agent adopts 2,5-dimethyl-2, and 5-bis-(t-butylperoxy) hexane, molecular formula is: C16H34O4.
7. a manufacture method for hot silicon rubber composite material, is characterized in that: described preparation method comprises the steps:
(1) prepared by silicone rubber matrix: methyl vinyl silicone rubber and dimethicone is carried out mixed grinding so that it is mix homogeneously, obtains silicone rubber matrix；
(2) vacuum kneading: silicone rubber matrix obtained in step 1 adds hydroxy silicon oil, then the dispensing in heat filling it is sequentially added into, add to successively in silicone rubber matrix according to packing quality component order from less to more, carry out mixing, vacuum kneading 30～40 minutes, obtains heat-conducting silicon rubber elastomeric compound；
(3), the heat-conducting silicon rubber elastomeric compound obtained in step 2 is filled in mould, mould wraps around magnet exciting coil, the size of current regulated in magnet exciting coil controls the intensity in magnetic field in magnetic loop, making the carrying magnetic carbon based particles being originally randomly dispersed within silicone rubber matrix, under the action of a magnetic field, these particles become chain or meshy arrangement；
(4), hot setting: the mould of the mixture led equipped with magnetic field is put in baking box, solidifies 15-25 minute at 120-160 DEG C of temperature, obtain the sheet silicone rubber composite of forming.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105232 | 2016-02-25 | ||
| CN2016101052322 | 2016-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105778508A true CN105778508A (en) | 2016-07-20 |
Family
ID=56388251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610130501.0A Pending CN105778508A (en) | 2016-02-25 | 2016-03-08 | Thermal-conductive silicone rubber composite material substrate and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105778508A (en) |
| WO (1) | WO2017143625A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108841182A (en) * | 2018-05-25 | 2018-11-20 | 国网江苏省电力有限公司电力科学研究院 | A kind of graphene conductive thermally conductive silicone rubber composite material and preparation method |
| CN111269575A (en) * | 2018-12-04 | 2020-06-12 | 青岛海信激光显示股份有限公司 | Heat-conducting silicon rubber, preparation method thereof and laser projection equipment |
| CN111607365A (en) * | 2020-06-03 | 2020-09-01 | 彗晶新材料科技(深圳)有限公司 | Flake graphite heat conduction material, preparation method thereof and electronic equipment |
| CN114426774A (en) * | 2022-03-19 | 2022-05-03 | 南京冠旭新材料科技有限公司 | High-thermal-conductivity gasket and preparation method thereof |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108192352B (en) * | 2018-02-01 | 2022-04-22 | 深圳沃尔提莫电子材料有限公司 | Heat conducting fin with carbon nano tubes in staggered orientation and preparation method thereof |
| CN110218362A (en) * | 2018-03-04 | 2019-09-10 | 盐城增材科技有限公司 | A kind of graphene/aluminium oxide/aluminium nitride interface thermal conductivity enhancing rubber and preparation method thereof |
| CN111393856B (en) * | 2020-04-20 | 2022-03-04 | 苏州锦富技术股份有限公司 | Graphene-based high-thermal-conductivity low-thermal-resistance thermal conductive paste and preparation method thereof |
| CN112266618B (en) * | 2020-10-13 | 2022-06-10 | 无锡吉仓纳米材料科技有限公司 | Heat-conducting silica gel of composite heat-conducting network and preparation method thereof |
| CN113088205A (en) * | 2021-04-01 | 2021-07-09 | 固德威电源科技(广德)有限公司 | Manufacturing process of high-thermal-conductivity silica gel insulating sheet |
| CN113493676B (en) * | 2021-07-19 | 2022-12-20 | 深圳市新泰盈电子材料有限公司 | Condensed type two-component organic silicon pouring sealant and preparation method thereof |
| CN114085530B (en) * | 2021-11-10 | 2023-06-06 | 华东理工大学 | Graphene silicon rubber composite material with low thermal resistance and high thermal conductivity and preparation method thereof |
| CN114106559B (en) * | 2021-11-11 | 2023-05-23 | 华东理工大学 | Preparation method of high-heat-conductivity high-insulation silicon rubber composite material |
| CN114133740B (en) * | 2021-11-23 | 2022-11-08 | 华南理工大学 | Heat-conducting wave-absorbing silicone rubber composite material and preparation method thereof |
| CN115246994B (en) * | 2021-12-31 | 2024-04-05 | 浙江师范大学 | Heat conduction-wave absorption integrated flexible material and preparation method and application thereof |
| CN114539783B (en) * | 2022-03-11 | 2023-07-28 | 南京冠旭新材料科技有限公司 | High-heat-conductivity high-insulation gasket and preparation method thereof |
| CN115044353A (en) * | 2022-05-17 | 2022-09-13 | 深圳市黑能科技有限公司 | Manufacturing method of heat conduction interface material and heat conduction interface structure |
| CN114806424B (en) * | 2022-05-20 | 2023-07-04 | 浙江师范大学 | Heat conduction and wave absorption integrated material and preparation method and application thereof |
| CN114736522A (en) * | 2022-05-24 | 2022-07-12 | 无锡市百合花胶粘剂厂有限公司 | High-heat-conductivity silica gel sheet and preparation method thereof |
| CN114891353B (en) * | 2022-06-28 | 2023-11-03 | 北京科技大学广州新材料研究院 | Composite gasket, preparation method and application thereof, and electronic device |
| CN117264420A (en) * | 2022-07-23 | 2023-12-22 | 苏州汇美包装制品有限公司 | Heat-conducting wave-absorbing gasket material |
| CN115488332B (en) * | 2022-08-26 | 2023-08-18 | 雅安百图高新材料股份有限公司 | Nickel-coated graphite powder and application thereof in electromagnetic shielding material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102924923A (en) * | 2012-10-24 | 2013-02-13 | 江苏大学 | High thermal conductive magnetic metal fiber/silicon rubber composite material and preparation method thereof |
| CN103554921A (en) * | 2013-10-23 | 2014-02-05 | 深圳市东维丰电子科技股份有限公司 | Heat-conducting and electromagnetic shielding elastic material, and preparation method thereof |
| CN104327515A (en) * | 2014-10-20 | 2015-02-04 | 中国科学院金属研究所 | Graphene-containing silicon rubber heat-conducting composite material and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3807995B2 (en) * | 2002-03-05 | 2006-08-09 | ポリマテック株式会社 | Thermally conductive sheet |
| CN105315672A (en) * | 2015-12-07 | 2016-02-10 | 德阳烯碳科技有限公司 | Preparation method of silicone rubber mat composite material containing carbon nanomaterial |
-
2016
- 2016-03-02 WO PCT/CN2016/075381 patent/WO2017143625A1/en active Application Filing
- 2016-03-08 CN CN201610130501.0A patent/CN105778508A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102924923A (en) * | 2012-10-24 | 2013-02-13 | 江苏大学 | High thermal conductive magnetic metal fiber/silicon rubber composite material and preparation method thereof |
| CN103554921A (en) * | 2013-10-23 | 2014-02-05 | 深圳市东维丰电子科技股份有限公司 | Heat-conducting and electromagnetic shielding elastic material, and preparation method thereof |
| CN104327515A (en) * | 2014-10-20 | 2015-02-04 | 中国科学院金属研究所 | Graphene-containing silicon rubber heat-conducting composite material and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108841182A (en) * | 2018-05-25 | 2018-11-20 | 国网江苏省电力有限公司电力科学研究院 | A kind of graphene conductive thermally conductive silicone rubber composite material and preparation method |
| CN111269575A (en) * | 2018-12-04 | 2020-06-12 | 青岛海信激光显示股份有限公司 | Heat-conducting silicon rubber, preparation method thereof and laser projection equipment |
| CN111269575B (en) * | 2018-12-04 | 2022-12-20 | 青岛海信激光显示股份有限公司 | Heat-conducting silicon rubber, preparation method thereof and laser projection equipment |
| CN111607365A (en) * | 2020-06-03 | 2020-09-01 | 彗晶新材料科技(深圳)有限公司 | Flake graphite heat conduction material, preparation method thereof and electronic equipment |
| CN111607365B (en) * | 2020-06-03 | 2021-04-27 | 彗晶新材料科技(深圳)有限公司 | Flake graphite heat conduction material, preparation method thereof and electronic equipment |
| CN114426774A (en) * | 2022-03-19 | 2022-05-03 | 南京冠旭新材料科技有限公司 | High-thermal-conductivity gasket and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017143625A1 (en) | 2017-08-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105778508A (en) | Thermal-conductive silicone rubber composite material substrate and preparation method thereof | |
| Dang et al. | Enhanced thermal conductivity of polymer composites via hybrid fillers of anisotropic aluminum nitride whiskers and isotropic spheres | |
| Choi et al. | Synthesis of silica-coated graphite by enolization of polyvinylpyrrolidone and its thermal and electrical conductivity in polymer composites | |
| JP6214094B2 (en) | Thermally conductive sheet | |
| JP2015122499A (en) | Oriented flexible heat-conducting material, forming process and application thereof | |
| Weng et al. | Preparation and properties of boron nitride/epoxy composites with high thermal conductivity and electrical insulation | |
| JP6613462B2 (en) | Thermally conductive sheet | |
| CN104559061B (en) | A kind of high heat conductive insulating carbon filler and high heat conductive insulating epoxy resin composite material and preparation method | |
| CN105754341A (en) | Heat-conducting composite material, heat-conducting piece prepared from heat-conducting composite material and preparation method of heat-conducting piece | |
| JP7220150B2 (en) | Low dielectric constant thermal conductive heat dissipation material | |
| CN103772992A (en) | Thermal conductive composite material and preparation method thereof | |
| CN108943921A (en) | A kind of multilayer insulation thermal interfacial material and preparation method thereof | |
| WO2020116057A1 (en) | Cured product of thermally conductive silicone composition | |
| WO2021256391A1 (en) | Silicone composition and thermally conductive silicone cured product having high thermal conductivity | |
| CN103694706B (en) | High heat conduction magnetic composite and preparation method thereof | |
| Li et al. | High-performance epoxy resin/silica coated flake graphite composites for thermal conductivity and electrical insulation | |
| CN108276612B (en) | Preparation and application of graphene/silicon composite heat-conducting silicone grease | |
| JP6675543B2 (en) | Heat conductive member, method for manufacturing heat conductive member, and silicone mixture | |
| JP3340112B2 (en) | Thermal conductive material and manufacturing method thereof | |
| CN111117259A (en) | Double-component heat-conducting interface material and use method and application thereof | |
| Ji et al. | Understanding the thermal impedance of silicone rubber/hexagonal boron nitride composites as thermal interface materials | |
| JP2003105108A (en) | Heat conductive sheet | |
| JP2004315761A (en) | Heat radiator | |
| JP2023073998A (en) | Thermally conductive sheet and method for manufacturing thermally conductive sheet | |
| WO2022054479A1 (en) | Thermally conductive sheet and production method for thermally conductive sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160720 |
|
| RJ01 | Rejection of invention patent application after publication |