CN113088205A - Manufacturing process of high-thermal-conductivity silica gel insulating sheet - Google Patents
Manufacturing process of high-thermal-conductivity silica gel insulating sheet Download PDFInfo
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- CN113088205A CN113088205A CN202110358134.0A CN202110358134A CN113088205A CN 113088205 A CN113088205 A CN 113088205A CN 202110358134 A CN202110358134 A CN 202110358134A CN 113088205 A CN113088205 A CN 113088205A
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- Prior art keywords
- jig
- silica gel
- insulating sheet
- glue
- manufacturing process
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 239000000741 silica gel Substances 0.000 title claims abstract description 30
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 32
- 239000000084 colloidal system Substances 0.000 claims abstract description 18
- 238000003756 stirring Methods 0.000 claims abstract description 18
- 238000009413 insulation Methods 0.000 claims abstract description 9
- 238000004804 winding Methods 0.000 claims abstract description 9
- 238000007790 scraping Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 239000011231 conductive filler Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 abstract description 6
- 229920001971 elastomer Polymers 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000012212 insulator Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 229940070527 tourmaline Drugs 0.000 description 3
- 229910052613 tourmaline Inorganic materials 0.000 description 3
- 239000011032 tourmaline Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004939 coking Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 210000002489 tectorial membrane Anatomy 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
Abstract
The utility model discloses a high heat conduction silica gel insulating piece preparation technology belongs to heat conduction silica gel insulating piece preparation field, manufacturing process includes following step: s1: uniformly stirring the multi-component colloid for manufacturing the required insulation sheet to obtain a mixed colloid; s2: attaching the winding film to the surface of the jig; s3: pouring the mixed colloid obtained in the step S1 into a jig; s4: scraping the glue in the jig; s5: placing the jig with the glue scraped off into a high-temperature oven for baking and curing to form an insulating sheet; s6: and separating the baked insulating sheet from the jig. Through adding the thin layer on the tool, make high viscosity colloid not with the tool contact when having solved production high viscosity glue and having separated the easy damage of rubber with the tool, just deposit the problem that still can not pile up.
Description
Technical Field
The utility model belongs to heat conduction silica gel insulating piece preparation field, concretely relates to high heat conduction silica gel insulating piece preparation technology.
Background
The heat-conducting silica gel gasket is used for filling an air gap between the heating device and the radiating fin or the metal base and can be used for covering a very uneven surface. The heat is conducted to metal casing or radiator from the device that generates heat through heat conduction silica gel gasket to can improve the efficiency and the life of the electronic component that generates heat.
The new inductance technology of the inverter requires that the heat conductivity coefficient of the double-component AB glue is 1.5W/m.K, and the use of the AB glue with the heat conductivity coefficient lower than that can cause the inverter to be easy to explode when the temperature rises in the use process; in addition, a rubber sheet with the thickness of about 2mm needs to be manufactured in the production process of the inductor, and the insulation of the product is increased in the process of cutting the glue-filled product with the corresponding size (the inductor is wrapped to avoid the leakage of the inductor);
when present heat conduction silica gel gasket equipment was on the device that generates heat, in order to prevent when radiator or casing relative slip, heat conduction silica gel gasket produced the offset, need glue the one side of heat conduction silica gel gasket on the device that generates heat usually. Therefore, when the heat-conducting silica gel gasket is prepared, the pressure-sensitive adhesive needs to be adhered to one surface of the heat-conducting silica gel gasket so as to be used for better fixing the heat-conducting silica gel gasket on the heating device. The surface of the heat-conducting silica gel gasket is composed of inert polymer silica gel, the surface activity is extremely low, the heat-conducting silica gel gasket is insoluble in water and any solvent, and the direct bonding capability with the pressure-sensitive adhesive is poor.
The high-viscosity glue is produced according to the original process, the glue sheets are torn down when the jig is separated, the glue sheets are completely damaged and cannot be stacked during storage, the glue sheets are stuck together and cannot be torn, and the manufacturing process for producing the heat-conducting silica gel insulating sheet aiming at the high-viscosity glue is provided.
BRIEF SUMMARY OF THE PRESENT DISCLOSURE
To the not enough of prior art, this disclosed aim at provides a high heat conduction silica gel insulating piece preparation technology, has solved among the prior art production high viscosity glue and has torn the rubber damage when the tool separates, and deposits the problem that still can not pile up.
The purpose of the disclosure can be realized by the following technical scheme:
a manufacturing process of a high-thermal-conductivity silica gel insulating sheet comprises the following steps:
s1: uniformly stirring the multi-component colloid for manufacturing the required insulation sheet to obtain a mixed colloid;
s2: attaching the winding film to the surface of the jig;
s3: pouring the mixed colloid obtained in the step S1 into a jig;
s4: scraping the glue in the jig;
s5: placing the jig with the glue scraped off into a high-temperature oven for baking and curing to form an insulating sheet;
s6: and separating the baked insulating sheet from the jig.
Further, the step S1 is to gradually add materials in equal proportion, firstly add 50% of the materials according to the mixture ratio and stir them fully, and then add 10% of the materials in turn and stir them fully until all the materials are added, and then continue to stir them for 10 minutes.
Further, the baking and curing in step S5 are performed by a stepwise temperature increase.
Further, the thickness of the glue in the step S4 is 2mm after being scraped, the baking and curing temperature in the step S5 is 45 ℃ for baking for 5min, then the temperature is raised to 50 ℃ for baking for 5min, and finally the temperature is raised to 60 ℃ for baking for 20 min.
Further, the winding film thickness in the step S2 is 0.02 mm.
Further, the step S1 is to stir the mixture to add the following additives: heat-conducting filler and graphite powder.
Further, the thermally conductive filler may be copper powder or silver powder.
The beneficial effect of this disclosure:
through adding the thin layer on the tool, make high viscosity colloid not with the tool contact when having solved production high viscosity glue and having separated the easy damage of rubber with the tool, just deposit the problem that still can not pile up.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a flow chart of an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
Example 1
As shown in fig. 1, a manufacturing process of a high thermal conductive silica gel insulation sheet includes the following steps:
s1: uniformly stirring the multi-component colloid for manufacturing the required insulation sheet to obtain a mixed colloid;
s2: attaching the winding film to the surface of the jig;
s3: pouring the mixed colloid obtained in the step S1 into a jig;
s4: scraping the glue in the jig;
s5: placing the jig with the glue scraped off into a high-temperature oven for baking and curing to form an insulating sheet;
s6: and separating the baked insulating sheet from the jig.
Further, the step S1 of stirring adopts an equal proportion to gradually feed materials, firstly 50% of the materials are added according to the proportion and stirred fully, then 10% of the materials are added in sequence and stirred fully until all the materials are added, and then the stirring is continued for 10 minutes; through such design, can guarantee the intensive mixing of material, guarantee the uniformity of the coefficient of heat conductivity of every insulating piece of production.
Furthermore, step S5 toasts the solidification and adopts the mode of the rising temperature of ladder nature to go on, through so design, can avoid leading to producing the cavity at colloid temperature change too big and lead to insulating piece heat dissipation effect can't reach the prediction requirement.
Further, the thickness of the glue in the step S4 is 2mm after being scraped, the baking and curing temperature in the step S5 is 45 ℃ for baking for 5min, then the temperature is raised to 50 ℃ for baking for 5min, and finally the temperature is raised to 60 ℃ for baking for 20 min.
Further, the winding film thickness in the step S2 is 0.02 mm.
In some disclosures, the step S1 is performed by stirring to add the following additives: heat-conducting filler and graphite powder; the graphene powder and the heat-conducting filler are designed in such a way, so that the heat-conducting silica gel gasket has excellent heat-conducting performance, and is suitable for various occasions with high heat dissipation requirements; the accelerant can cooperate with tourmaline powder to promote the cross-linking reaction, so that the vulcanization efficiency is improved, and the high-temperature treatment time is favorably shortened; the coking protective agent can play a role in resisting oxidation and aging in the thermal forming process, and inhibit the aging of the silicon rubber. Further, the thermally conductive filler may be copper powder or silver powder.
Example 2
The heat conductivity coefficient of the two-component AB glue is 1.5W/m.K according to the technical requirements of the new inverter inductor, and the use of the AB glue with the heat conductivity coefficient lower than that can cause the inverter to be easy to explode when the temperature rises in the use process; in addition, a rubber sheet with the thickness of about 2mm needs to be manufactured in the production process of the inductor, and the glue-filled product is placed in a corresponding size by cutting to increase the product insulation;
a manufacturing process of a high-thermal-conductivity silica gel insulating sheet comprises the following steps:
s1: a, B the two colloids are mixed according to 1; 1 to obtain mixed colloid with the parameter of 1.5W/m.K glue density of 2.55g/cm3；
A. B, glue parameters:
adhesive A viscosity 3500-
B viscosity 3000-4000mPa s
Mixing viscosity 3000-4000mPa s
Firstly, adding 50% of materials according to the proportion, fully stirring, then sequentially adding 10% of materials, fully stirring until all the materials are added, and then continuing stirring for 10 minutes; through such design, can guarantee the intensive mixing of material, guarantee the uniformity of the coefficient of heat conductivity of every insulating piece of production.
Influence of sequential charging on the percent of pass of thermal conductivity of insulators table 1
As can be seen from the data in Table 1, the sequential feeding mode can better ensure the uniformity of the mixture of the materials and the consistency of the insulator, thereby ensuring the qualified rate of the heat conductivity coefficient of the insulator.
Furthermore, tourmaline powder is added during mixing, infrared rays are released in the thermal forming process by tourmaline powder, and molecular activity is increased, so that crosslinking reaction is fully, uniformly and efficiently performed in a vulcanizing agent-silicon rubber system, vulcanizing agent residue is reduced, physical and mechanical properties of the prepared heat-conducting silicon rubber gasket product are improved, and the insulating sheet is prevented from being broken when the insulating sheet is separated from the jig.
S2: attaching a winding film with the thickness of 0.02mm to the surface of the jig;
s3: pouring the mixed colloid obtained in the step S1 into a jig;
s4: scraping the glue in the jig, wherein the thickness of the glue is 2mm after scraping;
s5: placing the jig with the glue scraped off into a high-temperature oven for baking and curing to form an insulating sheet;
the thickness of the glue in the step S4 is 2mm after being scraped, the baking and curing temperature in the step S5 is 45 ℃ for baking for 5min, then the temperature is raised to 50 ℃ for baking for 5min, and finally the temperature is raised to 60 ℃ for baking for 20 min.
Influence of baking curing temperature change on yield of thermal conductivity coefficient of insulator table 2
As can be seen from the data in Table 2, the stepped heating and baking mode can reduce the holes and air holes in the insulating sheet, and ensure the consistency of the insulator, thereby ensuring the qualified rate of the thermal conductivity coefficient of the insulator.
S6: separating the baked insulating sheet from the jig;
influence of winding film attachment on insulation sheet and jig separation table 3
It can be seen through the data that table 3, carry out the tectorial membrane to the tool at the in-process of heat conduction silica gel insulating piece preparation and can have obviously to follow up to the complete separation of insulating piece and tool.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the disclosure. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing illustrates and describes the general principles, principal features, and advantages of the present disclosure. It will be understood by those skilled in the art that the present disclosure is not limited to the embodiments described above, which are presented solely for purposes of illustrating the principles of the disclosure, and that various changes and modifications may be made to the disclosure without departing from the spirit and scope of the disclosure, which is intended to be covered by the claims.
Claims (7)
1. The manufacturing process of the high-thermal-conductivity silica gel insulating sheet is characterized by comprising the following steps of:
s1: uniformly stirring the multi-component colloid for manufacturing the required insulation sheet to obtain a mixed colloid;
s2: attaching the winding film to the surface of the jig;
s3: pouring the mixed colloid obtained in the step S1 into a jig;
s4: scraping the glue in the jig;
s5: placing the jig with the glue scraped off into a high-temperature oven for baking and curing to form an insulating sheet;
s6: and separating the baked insulating sheet from the jig.
2. The manufacturing process of the high thermal conductivity silica gel insulating sheet according to claim 1, wherein the step S1 is performed by adding materials gradually in equal proportion, first adding 50% of the materials according to the ratio, stirring sufficiently, then adding 10% of the materials in sequence, stirring sufficiently until all the materials are added, and then continuing stirring for 10 minutes.
3. The manufacturing process of the high thermal conductive silica gel insulating sheet according to claim 1, wherein the baking and curing of step S5 are performed by a stepwise temperature rise.
4. The manufacturing process of the high thermal conductive silica gel insulating sheet according to claim 2, wherein the thickness of the glue in the step S4 is 2mm after being scraped off, and the baking and curing temperature in the step S5 is 45 ℃ for 5min, then 50 ℃ for 5min, and finally 60 ℃ for 20 min.
5. The process of claim 1, wherein the thickness of the winding film in step S2 is 0.02 mm.
6. The manufacturing process of the high thermal conductivity silica gel insulating sheet according to claim 2, wherein the step S1 is performed by stirring to add the following additives: heat-conducting filler and graphite powder.
7. The manufacturing process of the high thermal conductivity silica gel insulation sheet according to claim 6, wherein the thermal conductive filler is copper powder or silver powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110358134.0A CN113088205A (en) | 2021-04-01 | 2021-04-01 | Manufacturing process of high-thermal-conductivity silica gel insulating sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110358134.0A CN113088205A (en) | 2021-04-01 | 2021-04-01 | Manufacturing process of high-thermal-conductivity silica gel insulating sheet |
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| Publication Number | Publication Date |
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| CN113088205A true CN113088205A (en) | 2021-07-09 |
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| CN202110358134.0A Pending CN113088205A (en) | 2021-04-01 | 2021-04-01 | Manufacturing process of high-thermal-conductivity silica gel insulating sheet |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017143625A1 (en) * | 2016-02-25 | 2017-08-31 | 深圳市欧姆阳科技有限公司 | High thermal conductive composite material, thermal conductive sheet prepared from material, and preparation method therefor |
| US20180198099A1 (en) * | 2017-01-12 | 2018-07-12 | Shenzhen Meixin Electronics Co., Ltd. | Anti-explosive easy-to-dissemble safe adhesive tape and manufacturing method thereof |
| CN110229367A (en) * | 2019-05-22 | 2019-09-13 | 深圳市鸿富诚屏蔽材料有限公司 | A kind of anisotropy insulating heat-conductive sheet material and preparation method thereof |
| CN110358308A (en) * | 2019-08-17 | 2019-10-22 | 苏州汇美包装制品有限公司 | Thermal conductive silicon rubber mat and its manufacturing process |
-
2021
- 2021-04-01 CN CN202110358134.0A patent/CN113088205A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017143625A1 (en) * | 2016-02-25 | 2017-08-31 | 深圳市欧姆阳科技有限公司 | High thermal conductive composite material, thermal conductive sheet prepared from material, and preparation method therefor |
| US20180198099A1 (en) * | 2017-01-12 | 2018-07-12 | Shenzhen Meixin Electronics Co., Ltd. | Anti-explosive easy-to-dissemble safe adhesive tape and manufacturing method thereof |
| CN110229367A (en) * | 2019-05-22 | 2019-09-13 | 深圳市鸿富诚屏蔽材料有限公司 | A kind of anisotropy insulating heat-conductive sheet material and preparation method thereof |
| CN110358308A (en) * | 2019-08-17 | 2019-10-22 | 苏州汇美包装制品有限公司 | Thermal conductive silicon rubber mat and its manufacturing process |
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Application publication date: 20210709 |