CN105776126A - 用于制造排列成大面积单域的有机分子的柱状或层状结构的方法 - Google Patents
用于制造排列成大面积单域的有机分子的柱状或层状结构的方法 Download PDFInfo
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- CN105776126A CN105776126A CN201610024064.4A CN201610024064A CN105776126A CN 105776126 A CN105776126 A CN 105776126A CN 201610024064 A CN201610024064 A CN 201610024064A CN 105776126 A CN105776126 A CN 105776126A
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Abstract
本发明涉及用于制造排列成大面积单域的有机分子的柱状或层状结构的方法,更具体地,涉及用于制造排列成大面积单域的有机分子的柱状或层状结构的方法,其中将由于其多域结构而具有随机排列的有机分子在空间上限制于下基板与上基板之间,然后在高于有机分子的各向同性转变温度加热,从而允许有机分子具有不同于原始排列的新排列。由本发明制造方法制造的排列成大面积单域的有机分子的柱状或层状结构,为完美柱状的大面积单域。另外,因为有机分子不论基板性质如何在空间上都限制在平面基板之间,并且进行热处理工艺,所以与使用高温或溶剂的排列方法相比,根据本发明的制造方法能够以迅速并且有效的方式形成纳米结构。
Description
技术领域
本发明涉及用于制造排列成大面积单域的有机分子的柱状或层状结构的方法,更具体地,涉及用于制造排列成大面积单域(singledomain)的有机分子的柱状或层状结构的方法,其中将由于其多域结构而具有随机排列的有机分子在空间上限制于下基板与上基板之间,然后在至少有机分子的各向同性转变温度加热。
背景技术
已经对由软质材料分子自组装形成纳米结构进行了长时间研究,所述软质材料分子例如胶体、嵌段共聚物、表面活性剂、超分子等。可以基于分子自身的结构、形状、相互作用等形成各种纳米结构,并且使用纳米结构的优势在于:能够开发有效的纳米图案化技术。已经对使用这种软质材料分子中的嵌段共聚物形成纳米结构进行了积极研究。但是,在现有技术中,在大面积上制造有序结构的工艺复杂并且耗时长(数小时),因此在商业应用方面存在局限性。
在学术界内,已经对锥形有机超分子的自组装性质进行了积极研究,从而克服嵌段共聚物缓慢重取向的缺点,得到尺寸较小(约5nm或更小)的稳定结构。另一方面,使用液晶分子的自组装方法具有常规图案化技术的优势,包括容易制造、在大面积上的有序排列、各种尺寸等,并且明显的优势还在于,由于液晶分子的特征性高迁移率和液晶分子对外部场域的快速响应,因此液晶分子的加工速度为先前研究的其它自组装材料的加工速度的数十倍,因而可容易地控制结构。
对具有热致液晶性质的树状超分子进行自组装,在很短时间内形成圆柱状结构,并且其纳米结构的特征尺寸为几纳米(<5nm),这远小于嵌段共聚物纳米结构的特征尺寸(几十纳米到几百纳米)。因此,期望的是当具有这种优势的树状超分子纳米结构用作光刻模板时,所述树状超分子纳米结构将克服嵌段共聚物的局限性。
特别地,垂直排列在基板上的这种圆柱状结构已经受到极大的关注,因为这些结构可用作光电子材料、选择性隔膜和纳米图案化模板。对于这种实际应用,重要的是大面积内有序排列有机超分子圆柱状结构,但在产生大面积单域的垂直排列方面存在困难。
韩国专利号1252506披露了对铅离子具有选择性的聚乙炔超分子筛。该韩国专利披露了使用聚乙炔超分子筛检测铅离子的方法,但并未披露排列超分子的方法。
韩国专利登记号0778011披露了使用自组装超分子制造金属纳米线的方法。该韩国专利披露了使用超分子六方纳米结构制造金属纳米线的方法,但缺点在于不能使用非金属超分子,因为柱状结构是使用金属离子和超分子的组合形成的。
因此,本发明人已经作出广泛努力来克服上述问题,结果已经发现,可如下获得排列成大面积单域的有机分子的柱状或层状结构:将有机分子附接到下基板(bottomsubstrate)上,然后用上基板(uppersubstrate)覆盖有机分子,以将有机分子在空间上限制于所述下基板与所述上基板之间,在高于所述有机分子的各向同性转变温度加热所述空间受限的有机分子,从而完成本发明。
发明内容
本发明的目的是提供用于制造排列成大面积单域的有机分子的柱状或层状结构的方法。
本发明的另一个目的是提供包含上述有机分子柱状或层状结构的光刻模板,以及其制造方法。
本发明的再一个目的是提供包含使用上述光刻模板制造的大面积排列纳米结构的信息存储装置,以及其制造方法。
本发明的又一个目的是提供包含使用上述光刻模板制造的大面积排列纳米结构的显示装置,以及其制造方法。
本发明的其它目的是提供包含使用上述光刻模板制造的大面积排列纳米结构的太阳能电池装置,以及其制造方法。
本发明的再一个其它目的是提供包含使用上述光刻模板制造的大面积排列纳米结构的有机半导体装置,以及其制造方法。
本发明的又一个其它目的是提供使用排列成大面积单域的有机分子柱状或层状结构制造的透明电极,以及其制造方法。
本发明的另一个其它目的是提供使用由上述方法制造的排列成大面积单域的有机分子柱状或层状结构所制造的隔膜,以及其制造方法。
为实现上述目的,本发明提供用于制造排列成大面积单域的有机分子柱状或层状结构的方法,所述方法包括以下步骤:(a)将有机分子在空间上限制于下基板与上基板之间;和(b)将所述在空间上限制于下基板与上基板之间的有机分子在至少所述有机分子的各向同性转变温度的温度加热,然后冷却所述有机分子,从而将所述有机分子垂直排列在所述下基板与所述上基板之间。
本发明也提供包含由上述方法制造的排列成大面积单域的有机分子柱状或层状结构的光刻模板,以及其制造方法。
本发明也提供包含使用上述光刻模板制造的大面积排列纳米结构的信息存储装置,以及其制造方法。
本发明也提供包含使用上述光刻模板制造的大面积排列纳米结构的显示装置,以及其制造方法。
本发明也提供包含使用上述光刻模板制造的大面积排列纳米结构的太阳能电池装置,以及其制造方法。
本发明也提供包含使用上述光刻模板制造的大面积排列纳米结构的太阳能电池装置,以及其制造方法。
本发明也提供包含使用上述光刻模板制造的大面积排列纳米结构的有机半导体装置,以及其制造方法。
本发明也提供使用由上述方法制造的排列成大面积单域的有机分子柱状或层状结构所制造的透明电极,以及其制造方法。
本发明也提供使用由上述方法制造的排列成大面积单域的有机分子柱状或层状结构所制造的隔膜,以及其制造方法。
附图说明
图1为显示有机分子自组装形成六方柱状结构的工艺的示意图。
图2为显示用于制造排列成大单域的有机分子柱状体的方法的示意图。
图3显示垂直排列在下基板与上基板之间的有机分子。
图4显示通过向蒸馏水逐滴加入有机分子溶液形成薄膜的工艺。
图5为有机分子垂直排列的单域柱状体(下基板:CF200-Cu;上表面:PDMS;超分子厚度:100nm;冷却条件:从81℃以-0.1℃/min冷却到室温)的TEM图像。
图6为有机分子垂直排列的单域柱状体的SAED(选区电子衍射)图像。
图7为有机分子垂直排列的单域柱状体的高倍率TEM图像。
图8显示低倍率TEM格栅图像(gridimage)(比例尺:20μm)和观测位置。
图9显示在12个位置的FFT(快速傅立叶变换)图案(约100x100μm2)。
图10显示12个位置之间的旋转角度的差异。
图11显示在基板上形成的有机分子垂直排列单域柱状体的GISAXS(掠入射小角散射)分析结果。
具体实施方式
除非另有定义,否则本申请所用的所有技术和科学术语具有本发明所属领域技术人员通常所理解的含义。通常,本申请所用的系统命名法在本领域中是众所周知和常用的。
本发明中,发现当将在空间上限制于下基板与上基板之间的有机分子在高于其各向同性转变温度加热时,形成排列成大面积单域的有机分子柱状体。
本发明中,将有机分子溶解在氯仿中,向蒸馏水逐滴加入所述溶液形成薄膜,然后将所述薄膜转移到下基板上。接着,将薄膜用上基板覆盖以在空间上限制有机分子。接着,将所述在空间上受限的有机分子在高于其各向同性转变温度加热,然后冷却,移除所述上基板,从而得到相对于所述下基板垂直排列的柱状结构。因而,所述柱状结构在大面积内是均匀的和垂直排列的。
因此,在一个方面,本发明涉及用于制造排列成大面积单域的有机分子柱状或层状结构的方法,所述方法包括以下步骤:(a)将有机分子在空间上限制于下基板与上基板之间;和(b)将在空间上限制于下基板与上基板之间的有机分子在高于有机分子的各向同性转变温度的温度加热,然后冷却所述有机分子,从而将所述有机分子垂直排列在下基板与上基板之间。
本申请所用的术语“单域”是指形状单一的嵌段共聚物、石墨烯、超分子或结晶材料沿着单一方向有序排列,也指形状为圆柱状、六方柱状、方柱状、五方柱状或椭圆柱状的基本单元沿着某个方向均匀排列。另外,球状胶体可以沿着三维方向中的某一方向排列。
本申请所用的术语“大面积单域”是指所述单域的尺寸为0.1mmX0.1mm至1mX1m。因此,根据本发明,可以在大面积内形成单域,而不像常规技术形成的单域尺寸为0.1mmX0.1mm或更小。根据本发明方法制造的排列成大面积单域的有机分子柱状或层状结构具有的尺寸可以优选为0.1mmX0.1mm至1mX1m,更优选为1mmX1mm至10cmX10cm。
本申请所用的术语“各向同性转变温度”是指当对这些分子加热时分子变为各向同性时的温度。通常,所述术语是指用于控制液晶的温度。具体地,热致液晶材料在高于其各向同性温度液化,从而形成液相;嵌段共聚物在高于其玻璃化转变温度液化,使得嵌段共聚物的无定形嵌段变为可流动。各向同性转变温度因材料不同而不同,下表1显示各种材料的各向同性转变温度。
[表1]各向同性转变温度
式1 | 78℃ |
式2 | 111℃ |
式3 | 83.2℃ |
式4 | 203℃ |
式5 | 135℃ |
式6 | 66℃ |
式7 | 171℃ |
式8 | 64.9℃ |
式9 | 86℃ |
式10 | 107℃ |
本发明中,步骤(b)可以为下述步骤:将在空间上限制于下基板与上基板之间的有机分子在高于有机分子的各向同性转变温度加热,将经加热的有机分子冷却,然后使有机分子垂直排列在下基板与上基板之间。本申请中,将有机分子在高于其各向同性转变温度加热,从而使有机分子有序排列,由各式所示的各种化合物的各向同性转变温度如上表1中所示。另外,如果将有机分子在远远高于其各向同性转变温度的温度加热,则将增加有机分子的迁移率,使得难以形成均匀的膜。为此,优选将有机分子在比其各向同性转变温度高约1-2℃的温度加热,但不限于此。
本申请所用的术语“层状结构”通常是指由磷脂形成的双层结构,其中疏水部分形成所述双层的核,亲水部分形成壳,从而形成球状分子聚集体或双层结构。这种层状结构在磷脂中最常观察到,但液晶分子或嵌段共聚物也可形成双层层状结构。
本发明中,步骤(a)可以为下列步骤(i)至(iii)之一:步骤(i),在下基板上形成有机分子的薄膜,然后用上基板覆盖以使有机分子在空间上限制于下基板与上基板之间;步骤(ii),使所述有机分子在所述下基板与所述上基板之间通过毛细现象以所述下基板与所述上基板彼此间隔开的状态形成薄膜,从而将所述有机分子在空间上限制于所述下基板与所述上基板之间;或步骤(iii),在下基板上形成有机分子的薄膜,然后通过(1)聚合物溶液旋涂(2)碳溅射或(3)诱导化学气相沉积(iCVD)在薄膜上形成上基板,从而将有机分子在空间上限制于下基板与上基板之间。将有机分子在空间上限制于下基板与上基板之间的方法可以通过各种方法进行,但优选下列方法(i)至(iii)中的一种:方法(i),在下基板上形成有机分子的薄膜,然后用上基板覆盖以使有机分子在空间上限制于下基板与上基板之间;方法(ii),使所述有机分子在所述下基板与所述上基板之间通过毛细现象以所述下基板与所述上基板彼此间隔开的状态形成薄膜,从而将所述有机分子在空间上限制于所述下基板与所述上基板之间;和方法(iii),在下基板上形成有机分子的薄膜,然后通过(1)聚合物溶液旋涂(2)碳溅射或(3)诱导化学气相沉积(iCVD)在薄膜上形成上基板,从而将有机分子在空间上限制于下基板与上基板之间。更优选地,可以使用下述方法:在下基板上形成有机分子的薄膜,然后用上基板覆盖以使有机分子在空间上限制于下基板与上基板之间。
本发明中,有机分子可以具有由下式1至10中的任一种表示的结构,但不限于此:
式1
式2
式3
式4
式5
式6
式7
式8
式9
式10
用于本发明的有机分子是现有技术已知的。本发明中,将这些有机分子根据常规方法合成并且用于大面积排列。如上式1中所示,该有机分子包含三个半氟化末端(semi-fluorinatedtails)、两个苯基和一个中心冠醚基团,并且具有通过在分子中微相分离而形成的锥形树状单体单元(monodendron)。据报道这种锥形的树状单体单元自组装形成柱状体,最后这种柱状体聚集形成稳定的柱状结构(图1)。但是,这种柱状结构非常稳定地形成,而不是在大面积内沿着相同方向排列,这种柱状结构形成多域。
本发明中,步骤(a)可以为下述步骤,在下基板上形成有机分子的薄膜并用上基板覆盖。本申请中,薄膜可通过流延、旋涂、喷墨打印或沉积法形成,但可以优选通过下述方法形成,所述方法包括:将有机分子溶解在有机溶剂中,向蒸馏水逐滴加入所述溶液以形成薄膜,将所述薄膜转移到下基板上。
本发明中,用于制造柱状或层状结构的方法可以进一步包括,在步骤(b)之后的步骤(c):移除上基板从而得到相对于下基板垂直排列的有机分子。使用上基板以在空间上限制有机分子,所述上基板优选为可在有机分子垂直排列之后移除使得可使用垂直排列的有机分子的基板。
本发明中,所述下基板可以为硅片、玻璃基板、ITO基板、聚合物膜基板或具有用聚合物或碳涂布的均匀表面的基板。用于本发明的下基板可以为硅片基板、玻璃基板、聚合物膜基板等,但优选为用聚合物或碳涂布从而赋予下基板各种表面性质的基板。更优选地,下基板可以为通过将氟化树脂和聚乙烯亚胺涂布于碳表面上得到的基板。特别地,下基板表面必须非常均匀,下基板优选为下述基板,其与有机分子保持良好接触,从而有机分子具有的迁移率使得当将有机分子在高于其各向同性转变温度加热时其不会从基板去湿(dewet)。可以用于本发明的聚合物膜可以由醋酸三纤维素、丙烯酸树脂、聚氨酯或聚酰亚胺制成,但不限于此。用于涂布基板的聚合物可以为聚乙烯酰亚胺、聚四氟乙烯树脂、聚甲基丙烯酸甲酯或聚乙酸乙烯酯,但不限于此。
本发明中,上基板可以由聚氨酯、聚丁二烯、聚氯丁橡胶、聚二甲基硅氧烷或全氟聚醚制成。用于本发明的上基板可以由下述的任何材料制成,所述材料具有均匀表面并且不论其表面性质如何都可与有机分子薄膜保持共形接触(conformalcontact)。优选地,上基板可以由聚氨酯、聚丁二烯、聚氯丁橡胶、聚二甲基硅氧烷或全氟聚醚制成。更优选地,上基板可以由聚二甲基硅氧烷制成。甚至更优选地,上基板可以为下列基板(i)至(iv)之一:(i)通过将经洗涤的硅片用有机硅弹性体基底和固化剂的混合物涂布,然后热固化得到的基板;(ii)通过在用紫外臭氧灯预处理的表面上涂布氟化树脂和聚乙烯亚胺得到的基板;(iii)通过在表面上借助于溅射来涂布无定形碳所得到的基板;和(iv)通过在硅片上涂布全氟聚醚-二甲基丙烯酸脲烷酯和光引发剂的混合物并在氩气气氛下用紫外光将涂层固化所得到的基板。
本发明中,上基板与下基板的组合可以为下述材料的任何组合,所述材料不论表面性质如何都均匀平滑并且防止有机分子在热处理过程中从上基板和下基板去湿。优选地,可以使用表2中所示组合的任一种。更优选地,可以使用聚二甲基硅氧烷作为上基板和碳膜作为下基板,只要有机分子可在热处理过程中被稳定地限制在上基板与下基板之间即可。
[表2]上基板与下基板的组合
上基板 | 下基板 | |
聚二甲基硅氧烷 | 碳 | |
聚二甲基硅氧烷 | 聚四氟乙烯 | |
用碳涂布的聚二甲基硅氧烷 | 碳 | |
用碳涂布的聚二甲基硅氧烷 | 用聚四氟乙烯涂布的碳膜 | |
用聚四氟乙烯涂布的聚二甲基硅氧烷 | 碳 | |
用聚四氟乙烯涂布的聚二甲基硅氧烷 | 用聚乙烯亚胺涂布的碳膜 | |
用聚乙烯亚胺涂布的聚二甲基硅氧烷 | 用聚乙烯亚胺涂布的碳膜 | |
用聚乙烯亚胺涂布的聚二甲基硅氧烷 | 用聚四氟乙烯涂布的碳膜 | |
用聚乙烯亚胺涂布的聚二甲基硅氧烷 | 用聚甲基丙烯酸甲酯涂布的碳膜 | |
聚二甲基硅氧烷 | 用聚甲基丙烯酸甲酯涂布的碳膜 | |
全氟聚醚 | 碳 | |
全氟聚醚 | 用聚四氟乙烯涂布的碳膜 | |
全氟聚醚 | 用聚乙烯亚胺涂布的碳膜 | |
全氟聚醚 | 用聚甲基丙烯酸甲酯涂布的碳膜 |
本发明中,下基板与上基板之间的间距可以为1nm至100μm,优选10nm至1000nm。将在空间上限制于下基板与上基板之间的有机分子通过热处理进行垂直排列。如果下基板与上基板之间的间距小于1nm,则有机分子将不会垂直排列,因为其间的间距不足,如果下基板与上基板之间的间距大于100μm,则有机分子将排列成多域,而不是单域或层状结构。
另外,本发明涉及使用由上述方法制造的排列成大面积单域的有机分子柱状或层状结构的光刻模板,以及其制造方法。
本发明也涉及电子装置,其包含使用上述光刻模板制造大面积排列的纳米结构,以及所述电子装置的制造方法。
本发明中,电子装置可以通过包括下列步骤的方法制造:
(i)(1)将所述光刻模板用紫外光照射,以选择性除去一部分有机分子,从而形成图案,然后通过反应离子刻蚀将所述图案转印到硅片上,从而形成纳米结构;或
(2)将金属前体或无机前体选择性结合到一部分有机分子上,将所述有机分子进行氧化、还原或有机分子除去过程,从而形成金属纳米结构或无机纳米结构;和
(ii)使用所述纳米结构形成电子装置。
本发明中,电子装置可以为显示装置和太阳能电池装置中的任一种。
本发明也涉及使用由上述方法制造的排列成大面积单域的有机分子柱状或层状结构所制造的隔膜,以及其制造方法。排列成大面积单域的有机分子柱状或层状结构的核的尺寸为1nm或更小。本申请中,当将有机分子的柱状或层状结构的核进行改性以赋予所述结构功能性时,柱状或层状结构可以用作各种隔膜。
本发明中,所述隔膜的特征可以在于,排列成大面积单域的有机分子柱状或层状结构的核可与离子或重金属结合或是离子导电的。如果所述核可与离子结合,则其可用作用于除去某些离子(脱盐过程)的隔膜,如果所述核可与重金属结合,则其可用作用于除去重金属的隔膜。另外,如果所述核是离子导电的,则其可用作离子通道。
本发明也涉及使用由上述方法制造的排列成大面积单域的有机分子柱状或层状结构的透明电极,以及其制造方法。
本发明中,用于制造透明电极的方法可以包括下列步骤:
(i)使金属盐附接于排列成大面积单域的有机分子柱状或层状结构的核;
(ii)将所述柱状或层状结构氧化,得到有序金属氧化物,使用所述有序金属氧化物生长有序碳纳米管;和
(iii)使用所述有序碳纳米管形成透明电极。
实施例
下文中,将参考实施例进一步详细描述本发明。对于本领域技术人员来说,明显的是,这些实施例仅为说明性目的,而不应认为其限制本发明的范围。因此,本发明的实质范围将由所附权利要求及其等同物来限定。
实施例1:制备有机超分子薄膜、下基板和上基板
如图4中所示,将具有由式1表示的结构的有机分子溶解在氯仿中,然后在室温逐滴加入到蒸馏水中形成薄膜。将所形成的薄膜(100-200nm)转移到待使用的下基板上,通过在50℃的电热板上蒸发而将残留的水除去。
为赋予下基板各种性质,在透射电子显微镜格栅(TEM格栅)上将氟化树脂(0.1wt%TeflonAF,Dupont,溶剂FluorinertFC-77,3M)和聚乙烯亚胺(1wt%PEI,Aldrich,溶剂去离子水)旋涂在碳表面上,从而制备下基板。
上基板通过如下制备:将有机硅弹性体基底(Sylgard184,DowCorning)和有机硅弹性体固化剂(Sylgard184,DowCorning)按10:1的重量比混合,将混合物放置到经洗涤的硅片表面上,随后在80℃固化2小时。为赋予上基板各种表面性质,将氟化树脂(0.1wt%TeflonAF,Dupont,溶剂FluorinertFC-77,3M)和聚乙烯亚胺(1wt%PEI,Aldrich,溶剂去离子水)旋涂在用紫外臭氧灯固化的表面上。
实施例2:制备超分子六方柱状体的大面积单域
如图2中所示,将实施例1的有机分子薄膜转移到实施例1的下基板上,然后用上基板覆盖。在该步骤中,如图2(ii)中所示,有机分子具有多个域和随机的取向。接着,将在空间上限制于下基板与上基板之间的有机分子在高于其各向同性转变温度加热,然后以-0.1℃/min的速率冷却至室温。本申请中,冷却速率不影响有机分子柱状体的排列。实际上,在-0.1至-30℃/min的冷却速率范围中,形成相同结构。另外,进行加热和冷却过程,使得有机分子会必然限制于下基板与上基板之间。
通过所述加热和冷却过程,有机分子的排列完全不同于初始排列。如图3中所示,在两个平面基板(下基板和上基板)之间,有机分子柱状体具有垂直排列(homeotropicalignment),其中有机分子柱状体相对于两个基板垂直排列。接着,将有机分子冷却,从有机分子除去上基板,从而得到与下基板垂直排列的大面积柱状结构。
实验实施例1:分析有机分子的柱状结构
垂直排列的大面积柱状结构可通过TEM分析。对于TEM分析,碳载TEM格栅(CF200-Cu)用作下基板,进行与上述相同的过程,从而制备垂直排列的柱状体。除去上基板,此后将柱状体暴露于RuO4(5wt%在水中的溶液)蒸气并且用RuO4(5wt%在水中的溶液)蒸气染色3分钟,然后通过透射电子显微镜(TEM)分析。通过溶液流延形成的有机分子膜的厚度为100-150nm。为使TEM分析进行流畅,100nm的膜厚度是合适的,但在制备垂直排列的大面积柱状体中有机分子膜的厚度不明显受限。
如图5中所示,通过TEM分析观测到垂直排列的有机分子的完美六方柱状结构(下基板:CF200-Cu;上表面:PDMS;有机分子膜厚度:100nm;冷却条件:从81℃以-0.1℃/min冷却到室温)。如图6中所示,有机分子柱状体为完全六方堆积的(completelyhexagonallypacked)。图7中的高倍率TEM图像更清楚显示有机分子的六方柱状阵列。TEM图像中的黑色部分为有机分子的核中苯基和冠醚部分的RuO4染色的部分,对应于有机分子柱状体的核。TEM图像分析结果表明,所形成的有机分子柱状体的直径为4.57nm,核尺寸为3.42nm。
实验实施例2:观察有机分子柱状体的单域的形成
图5仅显示小面积结构从而显示清晰图像。但是,实际上,所述结构形成为大面积内的单域。图8显示TEM格栅单元,其大小为100μmx100μm。TEM格栅单元的整个面积对应于单域,并且为证明所述事实,获取12个不同点(1至12)的TEM图像,检查12个点的FFT图案。结果,这12个点显示相同的图案(图9)。另外,如图9中所示,水平线与a-线之间的角度定义为旋转角度(Φ),检查点1至12的旋转角度。结果,如图10中所示,所述位置之间的旋转角度之差小于角度测量误差,表明在图5的整个面积内形成单域。另外,通过GISAXS(掠入射小角散射)分析在碳涂布的硅片基板上形成的垂直排列的有机分子的柱状结构。因此,如图11中所示,有机分子柱状体在大面积内与下基板垂直排列。
如上所述,根据本发明制造方法制造的排列成大面积单域的有机分子柱状或层状结构,为具有完美柱状形状的大面积单域。因此,这些柱状或层状结构用于制造显示装置、太阳能电池装置、隔膜、有机半导体装置、光刻模板或透明电极。
虽然已经参考特定特征详细描述了本发明,但对于本领域技术人员来说,显而易见的是,所述描述仅为优选的实施方式,并不限制本发明的范围。因此,本发明的实质范围将由所附权利要求及其等同物来限定。
Claims (19)
1.用于制造排列成大面积单域的有机分子柱状或层状结构的方法,所述方法包括以下步骤:
(a)将有机分子在空间上限制于下基板与上基板之间;和
(b)将所述在空间上限制于下基板与上基板之间的有机分子在至少所述有机分子的各向同性转变温度的温度加热,然后冷却所述有机分子,从而将所述有机分子垂直排列在所述下基板与所述上基板之间。
2.权利要求1的方法,其中所述步骤(a)为下列步骤(i)至(iii)之一:
(i)在所述下基板上形成所述有机分子的薄膜,然后将所述有机分子的薄膜用所述上基板覆盖,从而将所述有机分子在空间上限制于所述下基板与所述上基板之间;
(ii)在所述下基板与所述上基板之间通过毛细现象以所述下基板与所述上基板彼此间隔开的状态形成所述有机分子的薄膜,从而将所述有机分子在空间上限制于所述下基板与所述上基板之间;或
(iii)在所述下基板上形成所述有机分子的薄膜,然后在所述薄膜上通过聚合物溶液旋涂、碳溅射或诱导化学气相沉积(iCVD)形成所述上基板,从而将所述有机分子在空间上限制于所述下基板与所述上基板之间。
3.权利要求1的方法,其中所述有机分子选自下式1至10:
4.权利要求1的方法,其进一步包括步骤(c):移除所述上基板,从而得到相对于所述下基板垂直排列的有机分子。
5.权利要求1的方法,其中所述下基板为硅片、玻璃基板、ITO基板、聚合物膜基板或涂布有聚合物或碳的基板。
6.权利要求1的方法,其中所述下基板与所述上基板之间的间距为1nm至100μm。
7.制造光刻模板的方法,所述方法使用由权利要求1的方法制造的排列成大面积单域的有机分子的柱状或层状结构。
8.由权利要求7的方法制造的排列在大面积单域中的光刻模板。
9.制造电子装置的方法,其使用权利要求8的光刻模板。
10.权利要求9的方法,其中所述电子装置为显示装置和太阳能电池装置中的任一种。
11.权利要求9的方法,其包括下列步骤:
(i)(1)将所述光刻模板用紫外光照射,以选择性除去一部分有机分子,从而形成图案,然后通过反应离子刻蚀将所述图案转印到硅片上,从而形成纳米结构;或
(2)将金属前体或无机前体选择性结合到一部分有机分子上,将所述有机分子进行氧化、还原或有机分子除去过程,从而形成金属纳米结构或无机纳米结构;和
(ii)使用所述纳米结构形成电子装置。
12.包含大面积排列的纳米结构的电子装置,其由权利要求9的方法制造。
13.权利要求12的电子装置,其中所述电子装置为显示装置和太阳能电池装置中的任一种。
14.用于制造透明电极的方法,其使用权利要求1的方法制造的排列成大面积单域的有机分子的柱状或层状结构。
15.权利要求14的方法,其包括下列步骤:
(i)使金属盐附接于排列成大面积单域的有机分子柱状或层状结构的核;
(ii)将所述柱状或层状结构氧化,得到有序金属氧化物,使用所述有序金属氧化物生长有序碳纳米管;和
(iii)使用所述有序碳纳米管形成透明电极。
16.包含有序碳纳米管的透明电极,其由权利要求14的方法制造。
17.用于制造隔膜的方法,其使用由权利要求1的方法制造的排列成大面积单域的有机分子的柱状或层状结构。
18.权利要求17的方法,其中有机分子的柱状或层状结构的核能够与离子或重金属结合或是离子导电的。
19.由权利要求17的方法制造的隔膜,其中核能够与重金属结合或是离子导电的。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998030318A2 (en) * | 1997-01-08 | 1998-07-16 | The Regents Of The University Of California | Compounds for producing nanoporous polymers, nanocomposite and membranes thereof |
WO2000021689A1 (en) * | 1998-10-09 | 2000-04-20 | The Trustees Of Princeton University | Microscale patterning and articles formed thereby |
WO2004027078A2 (en) * | 2002-09-18 | 2004-04-01 | The Trustees Of The University Of Pennsylvania | Fluorinated dendrons and self-organizing ultrahigh density nanocylinder compositions |
KR100523765B1 (ko) * | 2003-06-12 | 2005-10-26 | 한국과학기술원 | 유기초분자의 나노패턴을 이용한 탄소나노튜브 어레이의제작방법 |
CN101202213A (zh) * | 2006-10-30 | 2008-06-18 | 国际商业机器公司 | 用于对准衬底上的嵌段共聚物的层状微畴的方法和结构 |
US20130209757A1 (en) * | 2012-02-10 | 2013-08-15 | Board Of Regents, The University Of Texas System | Using chemical vapor deposited films to control domain orientation in block copolymer thin films |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998030318A2 (en) * | 1997-01-08 | 1998-07-16 | The Regents Of The University Of California | Compounds for producing nanoporous polymers, nanocomposite and membranes thereof |
WO2000021689A1 (en) * | 1998-10-09 | 2000-04-20 | The Trustees Of Princeton University | Microscale patterning and articles formed thereby |
WO2004027078A2 (en) * | 2002-09-18 | 2004-04-01 | The Trustees Of The University Of Pennsylvania | Fluorinated dendrons and self-organizing ultrahigh density nanocylinder compositions |
KR100523765B1 (ko) * | 2003-06-12 | 2005-10-26 | 한국과학기술원 | 유기초분자의 나노패턴을 이용한 탄소나노튜브 어레이의제작방법 |
CN101202213A (zh) * | 2006-10-30 | 2008-06-18 | 国际商业机器公司 | 用于对准衬底上的嵌段共聚物的层状微畴的方法和结构 |
US20130209757A1 (en) * | 2012-02-10 | 2013-08-15 | Board Of Regents, The University Of Texas System | Using chemical vapor deposited films to control domain orientation in block copolymer thin films |
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