CN105776120A - Electronic Device, Method Of Manufacturing Electronic Device - Google Patents
Electronic Device, Method Of Manufacturing Electronic Device Download PDFInfo
- Publication number
- CN105776120A CN105776120A CN201511019808.5A CN201511019808A CN105776120A CN 105776120 A CN105776120 A CN 105776120A CN 201511019808 A CN201511019808 A CN 201511019808A CN 105776120 A CN105776120 A CN 105776120A
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- groove portion
- outer edge
- groove
- sensor element
- substrate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Pressure Sensors (AREA)
- Gyroscopes (AREA)
- Manufacturing & Machinery (AREA)
Abstract
A physical quantity sensor includes a first sensor element, an outer edge portion arranged on at least a portion of the outer periphery of the first sensor element, in which a first groove portion extending in a first direction is provided on the outer edge portion when the outer edge portion is seen in plan view.
Description
Technical field
The present invention relates to electronic installation, the manufacture method of electronic installation, physical quantity transducer, electronic equipment and moving body.
Background technology
Generally, it is known to as the physical quantity transducer of the electro-mechanical system structure possessing the movable structure of mechanical type.As physical quantity transducer, such as known have following capacitance type sensor, its electrostatic capacitance carried out based on the effect according to physical quantity (acceleration, angular velocity etc.) between the fixed electrode that the movable electrode of displacement is opposed with this movable electrode detects physical quantity (such as, the quasiconductor mechanics sensor described in patent documentation 1).This capacitance type sensor is such as consisted of the substrate supported, the sensor element being arranged on this substrate (fixed electrode, fixed part (grappling (anchor) portion), the support extended from fixed part, the movable electrode etc. that is supported by the way of separating with substrate by support) etc..It addition, sensor element such as obtains by utilizing photoetching etc. that the semiconductor substrate (silicon substrate etc.) being bonded on substrate (glass substrate etc.) is carried out Precision Machining.
In such capacitance type sensor, have the situation that the parasitic capacitance formed in the structure of sensor element makes the sensitivity decrease of sensor.To this, in the quasiconductor mechanics sensor described in patent documentation 2, it is proposed that by possessing the unit (bucking electrode) that the current potential of the peripheral part of the periphery by being configured at sensor element is fixed, thus preventing the technology of the reduction of transducer sensitivity.
But, possessing in the physical quantity transducer of peripheral part in the periphery of sensor element as the quasiconductor mechanics sensor described in patent documentation 2 described above, have the detection characteristic as sensor according to the temperature environment used the problem of change.Specifically, the interference etc. that the movable part (movable electrode) from peripheral part to sensor element transmits sews vibration, sew power impacts the displacement of the movable part (movable electrode) of sensor element, causes detection characteristic change.
Patent documentation 1: Japanese Unexamined Patent Publication 9-211022 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2007-279056 publication
Summary of the invention
The present invention completes to solve at least some of of above-mentioned problem, it is possible to realize as applications below example or mode.
Application examples 1
Should be characterised by possessing by electronic installation involved by use-case: the first function element；And outer edge, its at least some of of periphery being configured in described first function element locates, when outer edge described in top view, described outer edge is provided with groove and extends in a first direction or the first groove portion to be arranged in the way of described first direction.
According to should use-case, electronic installation possesses the first function element and be configured in the periphery of the first function element outer edge of (periphery during top view electronic installation).Additionally, have on outer edge groove extend in a first direction or in the way of along a first direction and the first groove portion being arranged.In such a configuration, outer edge such as by groove be set on outer edge extend in a first direction or in the way of along a first direction and the first groove portion being arranged so that the interference transmitted to the first function element from outer edge etc. are sewed vibration, are sewed passing through the first groove portion and being alleviated of power.Inhibit owing to sewing vibration externally to the interference etc. of the first function element transmission therefore, it is possible to provide, sew power and the variation of electrical characteristics that causes, electronic installation that electrical characteristics are more stable.
Additionally, groove both can be through the groove of outer edge, it is also possible to be groove with the end.
Application examples 2
In the electronic installation involved by above-mentioned application examples, it is preferably, when outer edge described in top view, described outer edge is provided with described groove and upwardly extends or the second groove portion to be arranged in the way of described second direction in the second party intersected with described first direction.
According to should use-case, electronic installation is on the outer edge of the first function element, except the first groove portion, also has groove and upwardly extends or the second groove portion to be arranged in the way of second direction in the second party intersected with first direction.The interference etc. transmitted to the first function element from outer edge sews vibration, sew power is at least broken down into the vector components on any direction first direction or the second direction intersected with first direction.As should use-case, by arranging the first groove portion and the second groove portion, so that acting on the passing through groove of stress on groove on the direction that the bearing of trend with groove intersects and being alleviated.Inhibit owing to sewing vibration externally to the interference etc. of the first function element transmission therefore, it is possible to provide, sew power and the variation of electrical characteristics that causes, electronic installation that electrical characteristics are more stable.
Application examples 3
In the electronic installation involved by above-mentioned application examples, it is preferred to, described first groove portion and described second groove portion are arranged at least side of the periphery being configured at described first function element.
According to should use-case, the second groove portion that groove extends in a first direction or the first groove portion of arranging and groove upwardly extend in the second party intersected with first direction or arrange is arranged configuration.By this first groove portion and the second groove portion such that it is able to more effectively suppress the interference transmitted to the first function element from outer edge etc. in the both direction intersected with the first groove portion and the second groove portion to sew vibration, sew power or the transmission of stress (deformation) etc..Inhibit owing to sewing vibration externally to the interference etc. of the first function element transmission therefore, it is possible to provide, sew power and the variation of electrical characteristics that causes, electronic installation that electrical characteristics are more stable.
Application examples 4
In the electronic installation involved by above-mentioned application examples, it is preferably, when outer edge described in top view, described outer edge is provided with the 3rd groove portion that described groove upwardly extends in the side orthogonal with the centrage at the center through described first function element or is arranged.
According to should use-case, by the 3rd groove portion that groove upwardly extends in the side orthogonal with the centrage of the first function element or is arranged such that it is able to arrange and trend towards central part from the corner that deformation is relatively larger and change the groove portion of angle successively.Thereby, it is possible to suppress the interference transmitted to the first function element from outer edge etc. to sew vibration efficiently, sew power or the transmission of stress (deformation) etc..
Application examples 5
In the electronic installation involved by above-mentioned application examples, it is preferred to, described outer edge is rectangular shape, and in described 3rd groove portion, described groove upwardly extends in the side orthogonal with the cornerwise described centrage as described outer edge or is arranged.
According to should use-case, it is arranged on groove portion (the 3rd groove portion) set on the direction orthogonal with diagonal such that it is able to alleviate efficiently, suppress the deformational stress from first direction and second direction applying by the corner portion of the outer edge relatively larger in the deformation applied from first direction and second direction.
Distance owing to being provided with the center from the first function element, the corner of cornerwise outer edge is relatively big, and the deformation (warpage) therefore produced due to thermal expansion etc. is bigger.It addition, apply deformation (stress) from first direction and second direction twocouese to the corner of outer edge.To this, owing to the 3rd groove portion is arranged on the direction orthogonal with diagonal, therefore, it is possible to disperse and alleviate efficiently, suppressing the deformation (stress) from first direction and second direction applying.
Additionally, the 3rd groove portion being arranged on centered by above-mentioned diagonal+-scope of (positive and negative) about 10 degree in time, can have equal effect.
Application examples 6
In the electronic installation involved by above-mentioned application examples, it is preferred to, described first function element possesses: fixed part；Support, it extends from described fixed part；And movable part, its by described support can be supported by the way of displacement.
According to should use-case, electronic installation is being configured on the outer edge of periphery of the first function element and is having at least one in the first groove portion, the second groove portion and the 3rd groove portion.Therefore, even if possessing movable part (movable electrode) in the first function element, and when outer edge place create the interference etc. that the movable part (movable electrode) to the first function element transmits sew vibration, sew power etc., alleviate this and sew vibration also by least one in the first groove portion, the second groove portion and the 3rd groove portion, sew power, thus suppressing the impact of the displacement on movable part, thus suppress the variation of the electrical characteristics of the first function element.In other words, according to should use-case, in the electronic installation possessing movable part, it is possible to suppress the variation of electrical characteristics, thus so as to more stable.
Application examples 7
In the electronic installation involved by above-mentioned application examples, it is preferred to, possess the second function element, at least one in described first groove portion, described second groove portion and described 3rd groove portion is arranged between described first function element and described second function element.
According to should use-case, electronic installation, except the first function element, is also equipped with the second function element.It addition, electronic installation is by the outer edge at least one region being arranged between the first function element with the second function element in the first groove portion, the second groove portion and the 3rd groove portion and at least one party in the region overlapping with outer edge of substrate.Therefore, act on the stress between the first function element and the second function element, at least one groove portion sewed in the vibration first groove portion that passes through of homenergic, the second groove portion and the 3rd groove portion of direction the opposing party transmission from the first function element and the second function element and alleviated such that it is able to suppress the impact that characteristic is caused.Specifically, can suppressing when electronic installation possesses multiple function element, the function element of the opposing party such as is impacted at the mutual vibration of so-called multiple function element by the noise produced due to the function element of a side interferes and the deterioration of the electrical characteristics of electronic installation that produces.This noise is more than the noise of electricity, there is also because of interference etc. sew vibration, mechanical energy of sewing power or vibration etc. and situation about producing.Specifically, have structure generation or the thermal stress having, the residual stress of function element, (" noise " set forth below is such too, is therefore omitted in the following description) is sewed etc. in the inferior vibration to adjacent function element transmission of the situation with movable part.
Application examples 8
Should possess by the electronic installation involved by use-case: the first function element；Outer edge, its at least some of of periphery being configured in described first function element locates；And substrate, described first function element is arranged on the interarea of described substrate, when substrate described in top view, at least one party in the region overlapping with described outer edge of described outer edge and described substrate is provided with the first groove portion, at least one in second groove portion and the 3rd groove portion, in described first groove portion, groove extends in a first direction or is arranged, in described second groove portion, described groove upwardly extends in the second party intersected with described first direction or is arranged, in described 3rd groove portion, described groove upwardly extends in the side orthogonal with the centrage at the center through described first function element or is arranged.
According to should use-case, electronic installation possesses substrate, the first function element of being arranged on the interarea of substrate, the outer edge of periphery (periphery during top view substrate) that is configured in the first function element.Additionally, at least one party in the region overlapping with outer edge of outer edge and substrate has the first groove portion that groove extends in a first direction or be arranged, groove upwardly extends in the side orthogonal with the centrage at the center passing the first function element or at least one in the 3rd groove portion that is arranged at the second party intersected with first direction upwardly extend or be arranged the second groove portion and groove.In such a configuration, outer edge such as by being provided with at least one in the first groove portion, the second groove portion and the 3rd groove portion on outer edge such that it is able to suppresses the interference etc. transmitted to the first function element from outer edge to sew vibration, sew the transmission of power.Inhibit owing to sewing vibration externally to the interference etc. of the first function element transmission therefore, it is possible to provide, sew power and the variation of the electrical characteristics that cause or the variation of electrical characteristics that causes due to the variations in temperature of environment of use, electronic installation that electrical characteristics are more stable.
Additionally, the groove of the groove at least one party that both can be through in outer edge and substrate, it is also possible to it is groove with the end.
Specifically, the thermal stress produced between the outer edge on the interarea of substrate and substrate is alleviated also by least one the groove portion in the first groove portion, the second groove portion and the 3rd groove portion.Such as, when causing substrate warp due to thermal stress, this warpage is alleviated by least one in the first groove portion, the second groove portion and the 3rd groove portion.Its result is, inhibit the situation that the thermal stress produced due to the difference of thermal coefficient of expansion causes the first function element to deform or the displacement of movable part is impacted by described thermal stress when the first function element has movable part (movable electrode), thus inhibiting the variations in temperature of the environment used due to the first function element and the variation of detection characteristic that causes.In other words, according to should use-case, using the teaching of the invention it is possible to provide block or decrease the sewing and inhibiting the variations in temperature of environment owing to using of signal of the first function element detection and the variation of electrical characteristics that causes, electronic installation that electrical characteristics are more stable.
Application examples 9
In the electronic installation involved by above-mentioned application examples, it is preferred to, described first function element possesses: fixed part；Support, it extends from described fixed part；And movable part, its by described support can be supported by the way of displacement.
According to should use-case, electronic installation is being configured on the outer edge of periphery of the first function element and is having at least one in the first groove portion, the second groove portion and the 3rd groove portion.Therefore, even if possessing movable part (movable electrode) in the first function element, and when outer edge place create the interference etc. that the movable part (movable electrode) to the first function element transmits sew vibration, sew power etc., alleviate this and sew vibration also by least one the groove portion in the first groove portion, the second groove portion and the 3rd groove portion, sew power, thus suppressing the impact of the displacement on movable part, thus suppress the variation of the electrical characteristics of the first function element.In other words, according to should use-case, in the electronic installation possessing movable part, it is possible to suppress the variation of electrical characteristics, thus so as to more stable.
Application examples 10
In the electronic installation involved by above-mentioned application examples, it is preferred to, described fixed part is fixed on the interarea of described substrate, described movable part by described support to separate from described substrate and can be supported by the way of displacement.
According to should use-case, the outer edge that the periphery of the first function element being supported in by support on substrate is configured has at least one in the first groove portion, the second groove portion and the 3rd groove portion.Therefore, even if when the first function element have movable part (movable electrode) and create thermal stress, the deformation etc. that causes due to thermal stress, this warpage, thermal stress is alleviated also by least one the groove portion in the first groove portion, the second groove portion and the 3rd groove portion, thus suppressing the impact on the displacement of movable part, thus suppress the variations in temperature of the environment used due to the first function element and the variation of electrical characteristics that causes.In other words, according to should use-case, in the electronic installation possessing movable part, it is possible to suppress the variations in temperature of environment owing to using and the variation of electrical characteristics that causes, thus so as to more stable.
Application examples 11
In the electronic installation involved by above-mentioned application examples, it is preferably, being provided with described second function element on the interarea of described substrate, at least one in described first groove portion, described second groove portion and described 3rd groove portion is arranged between described first function element and described second function element.
According to should use-case, electronic installation, except the first function element on the interarea being arranged at substrate, also has the second function element.It addition, at least one party that electronic installation is by the outer edge at least one region being arranged between the first function element with the second function element in the first groove portion, the second groove portion and the 3rd groove portion and the region overlapping with outer edge of substrate.Therefore, act on the stress between the first function element and the second function element, alleviated from least one groove portion sewed the vibration first groove portion that passes through of homenergic, the second groove portion and the 3rd groove portion of direction the opposing party transmission such that it is able to suppress the impact that characteristic is caused.Specifically, it is possible to when suppressing possess multiple function element on common substrate, the noise produced due to the function element of a side impacts to the function element of the opposing party, and makes situation about worsening as the electrical characteristics of electronic installation.
Application examples 12
In the electronic installation involved by above-mentioned application examples, it is preferred to, described first function element and described outer edge are identical material.
According to should use-case, by being formed with identical material in the first function element, outer edge such that it is able to the first function element and outer edge is formed in same operation, it is possible to realize the simplification of manufacture.
Application examples 13
In the electronic installation involved by above-mentioned application examples, it is preferred to, the direction of displacement of described movable part when described first direction is the first function element described in top view.
According to should use-case, first direction is the direction of displacement (direction of displacement during top view substrate) of the movable part that the first function element possesses.In other words, the outer edge of the periphery being configured at the first function element possesses: when top view the first function element, upwardly extending first groove portion of the side identical in the direction carrying out displacement with the movable part that the first function element possesses；The upwardly extending second groove portion of side that the direction of displacement intersects is carried out at the movable part possessed with the first function element；The 3rd groove portion that groove upwardly extends in the side orthogonal with the centrage at the center through the first function element or is arranged.Thereby, it is possible to suppress the interference etc. transmitted to the movable part (movable electrode) of the first function element from outer edge to sew vibration, sew the transmission of power by least one in the first groove portion, the second groove portion and the 3rd groove portion.Thus, the sewing of signal blocking or decreasing the first function element detection can be provided, from the externally applied noise to the first function element, and inhibit owing to sewing vibration externally to the interference etc. of the first function element transmission, sew power and the variation of electrical characteristics that causes, electronic installation that electrical characteristics are more stable.
Additionally, when outer edge has the thermal coefficient of expansion different from the thermal coefficient of expansion of substrate, owing to outer edge possesses the upwardly extending second groove portion of side that the direction of displacement at the movable part possessed with the first function element intersects, therefore, it is possible to more effectively alleviated the thermal stress produced on the direction of displacement of movable part by the second groove portion.Particularly, when the second groove portion is when being perpendicular on the direction of direction of displacement of movable part to intersect extension, can more effectively relief of thermal stress.It addition, possess the first groove portion by outer edge, thus substrate can be suppressed from outer edge thermal stress itself.Specifically, outer edge possesses the first groove portion extended on the direction of displacement of the movable part possessed in the first function element, thus on the direction of displacement of movable part, the bonding area of substrate and outer edge reduces, and therefore inhibits the thermal stress itself produced on the direction of displacement of movable part that substrate is subject to from outer edge.Its result is, the thermal stress produced due to the difference of thermal coefficient of expansion is inhibited to cause the first function element to deform, or the situation that the displacement of movable part is impacted by described thermal stress when the first function element possesses movable part (movable electrode).Thus, it is suppressed that the variations in temperature of the environment used due to the first function element and the electrical characteristics of electronic installation that cause change.
Application examples 14
In the electronic installation involved by above-mentioned application examples, it is preferred to, when the first function element described in top view, the figure being made up of described first groove portion, described second groove portion and described 3rd groove portion is to configure in rotational symmetric mode.
According to should use-case, by when top view the first function element, it is that rotational symmetric mode configures the first groove portion, the second groove portion and the 3rd groove portion with the figure being made up of the first groove portion, the second groove portion and the 3rd groove portion, it is thus possible to more effectively suppress the interference etc. transmitted to the movable part (movable electrode) of the first function element from outer edge to sew vibration, sew the transmission of power, and can more effectively suppress the variation of the detection characteristic caused due to variations in temperature.
Specifically, when top view the first function element, the figure being made up of the first groove portion that can alleviate external stress, thermal stress etc. and the second groove portion is to configure in rotational symmetric mode.That is, the effect alleviating external stress, thermal stress etc. at least obtains in rotationally symmetrical fashion and the region of overlap balance to each other.Therefore, even if such as create warpage etc. on substrate, it is also possible to reduce stress equilibrium and destroyed, thus producing the situation of unexpected deformation etc. such that it is able to alleviate stress more stablely.Additionally, with the implication that configures in rotational symmetric mode for, when natural number n, to configure in n+1 rotational symmetric mode.
Application examples 15
In the electronic installation involved by above-mentioned application examples, it is preferred to, at least one in described first groove portion, described second groove portion and described 3rd groove portion, on the thickness direction of described first function element, runs through described outer edge or described substrate.
As should use-case, by at least one in the first groove portion, the second groove portion and the 3rd groove portion is arranged in the way of running through outer edge or substrate on the thickness direction of the first function element such that it is able to more effectively suppress the variation of the detection characteristic caused due to variations in temperature.Specifically, such as in above-mentioned stress remission effect, groove (at least one in the first groove portion, the second groove portion and the 3rd groove portion) owing to alleviating stress is formed as the groove running through outer edge or substrate, therefore the outer edge not existing as the bottom of groove and remain or substrate (residual bottom), therefore, the stress of transmission bottom this residual is eliminated.It addition, by making groove run through, so that the bonding area of substrate and outer edge reduces, therefore, it is possible to make the size of thermal stress itself produced due to the difference of substrate and the thermal coefficient of expansion of outer edge less.Its result is, it is possible to more effectively relief of thermal stress such that it is able to more effectively suppress the variation of the electrical characteristics of the electronic installation caused due to variations in temperature.
Application examples 16
In the electronic installation involved by above-mentioned application examples, it is preferred to, described outer edge is fixed potential.
According to should use-case, owing to outer edge is constituted with fixed potential, therefore, it is possible to more effectively obtain shield effectiveness.
Application examples 17
In the electronic installation involved by above-mentioned application examples, it is preferred to, described groove portion is the groove group comprising multiple described groove.
According to should use-case, even if groove portion is made up of multiple grooves, it is also possible to suppress owing to interference etc. is sewed vibration, sewed power and the variation of electrical characteristics that causes.
Application examples 18
Should the manufacture method of electronic installation involved by use-case be characterised by, including: on substrate, form the operation of depressed part；Function element substrate in the way of opposed with described depressed part and is engaged operation on the substrate；Described function element substrate is carried out pattern and forms processing, thus forming function element, outer edge, and on described outer edge, form the first groove portion and the operation in the second groove portion, in described first groove portion, groove extends in a first direction or is arranged, in described second groove portion, described groove upwardly extends in the second party intersected with described first direction or is arranged.
According to should use-case, function element substrate in the way of opposed with the depressed part being formed on substrate and is bonded on substrate, subsequently function element substrate is carried out pattern and forms processing, thus forming function element, outer edge, and on outer edge, form the second groove portion that groove extends in a first direction or the first groove portion of being arranged and groove upwardly extend in the second party intersected with first direction or are arranged.In such manner, it is possible in same operation, form function element, outer edge, the first groove portion, the second groove portion from the function element substrate being engaged in substrate.In other words, it is possible to be readily formed function element, outer edge, the first groove portion, the second groove portion.
Application examples 19
Should be characterised by possessing by physical quantity transducer involved by use-case: first sensor element；And outer edge, its at least some of of periphery being configured in described first sensor element locates, when outer edge described in top view, described outer edge is provided with groove and extends in a first direction or the first groove portion to be arranged in the way of described first direction.
According to should use-case, physical quantity transducer possesses first sensor element, is configured in the outer edge of the periphery of first sensor element (periphery during top view substrate).Additionally, possess on outer edge groove extend in a first direction or in the way of along a first direction and the first groove portion being arranged.In such a configuration, outer edge such as can be configured to have the sewing of the signal that blocks or reduce first sensor element testing, from the bucking electrode of the effect of the externally applied noise to first sensor element.When outer edge is configured to bucking electrode, with the periphery of bigger area encirclement first sensor element more effectively.As should use-case, the first groove portion extending in a first direction by arranging groove on outer edge or being arranged, thus sew vibration from outer edge to the interference etc. of first sensor element transmission, sew the passing through the first groove portion of power and alleviated.Therefore, it is possible to surround the periphery of first sensor element with bigger area.Inhibit owing to the interference etc. transmitted externally to first sensor element is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer that electrical characteristics are more stable thereby, it is possible to provide.
Additionally, groove both can be through the groove of outer edge, it is also possible to be groove with the end.
Application examples 20
In the physical quantity transducer involved by above-mentioned application examples, it is preferably, when outer edge described in top view, described outer edge is provided with described groove and upwardly extends or the second groove portion to be arranged in the way of described second direction in the second party intersected with described first direction.
According to should use-case, physical quantity transducer is on the outer edge of first sensor element, except groove extends or in a first direction with along a first direction and except the first groove portion being arranged, also there is the second groove portion that groove upwardly extends in the second party intersected with first direction or is arranged.The interference etc. transmitted from outer edge to first sensor element sews vibration, sew power is at least broken down into the vector components on any direction first direction or the second direction intersected with first direction.As should use-case, by the second groove portion that the first groove portion arranging groove and extending in a first direction or be arranged, groove upwardly extend in the second party intersected with first direction or are arranged, so that the direction intersected in the direction or orientation with the extension of groove acts on the passing through groove of stress in the first groove portion or the second groove portion and alleviated.Inhibit owing to the interference etc. transmitted externally to first sensor element is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer that electrical characteristics are more stable therefore, it is possible to provide.
Application examples 21
In the physical quantity transducer involved by above-mentioned application examples, it is preferred to, described first groove portion and described second groove portion are arranged at least side of the periphery being configured at described first sensor element.
According to should use-case, the second groove portion that groove is extended by physical quantity transducer in a first direction or the first groove portion of arranging and groove upwardly extend in the second party intersected with first direction or arrange is arranged.By this first groove portion and the second groove portion such that it is able to suppress interference etc. in the both direction intersected with the first groove portion and the second groove portion, that transmit to first sensor element from outer edge to sew vibration, sew power or the transmission of stress (deformation) etc..Inhibit owing to the interference etc. transmitted externally to first sensor element is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer that electrical characteristics are more stable therefore, it is possible to provide.
Application examples 22
In the physical quantity transducer involved by above-mentioned application examples, it is preferably, when outer edge described in top view, described outer edge is provided with the 3rd groove portion that described groove upwardly extends in the side orthogonal with the centrage at the center through described first sensor element or is arranged.
According to should use-case, the 3rd groove portion that physical quantity transducer is upwardly extended by groove in the side orthogonal with the centrage of first sensor element or is arranged such that it is able to arrange and trend towards central part from the corner that deformation is relatively larger and change the groove portion of angle successively.Thereby, it is possible to suppress efficiently to sew vibration from outer edge to the interference etc. of first sensor element transmission, sew power or the transmission of stress (deformation) etc..
Application examples 23
In the physical quantity transducer involved by above-mentioned application examples, it is preferred to, described groove portion is the groove group comprising multiple described groove.
According to should use-case, even if groove portion is made up of multiple grooves, it is also possible to obtain and block or reduce from the externally applied shield effectiveness to the noise of sensor element.
Application examples 24
Should be characterised by possessing by physical quantity transducer involved by use-case: first sensor element；Outer edge, its at least some of of periphery being configured in described first sensor element locates；And substrate, described first sensor element is arranged on the interarea of described substrate, when substrate described in top view, at least one party in the region overlapping with described outer edge of described outer edge and described substrate is provided with the first groove portion, at least one in second groove portion and the 3rd groove portion, in described first groove portion, groove extends in a first direction or is arranged, in described second groove portion, described groove upwardly extends in the second party intersected with described first direction or is arranged, in described 3rd groove portion, described groove upwardly extends in the side orthogonal with the centrage at the center through described first sensor element or is arranged.
According to should use-case, physical quantity transducer possesses substrate, the first sensor element that is arranged on the interarea of substrate, the outer edge of periphery (periphery during top view substrate) that is configured in first sensor element.Additionally, at least one party in the region overlapping with outer edge of outer edge and substrate has the first groove portion that groove extends in a first direction or be arranged, groove upwardly extends in the side orthogonal with the centrage at the center through described first sensor element or at least one in the 3rd groove portion that is arranged at the second groove portion upwardly extended with the second party that described first direction intersects or be arranged and described groove.Structure according to such groove portion, it is possible to suppress to sew vibration from outer edge to the interference etc. of first sensor element transmission, sew the transmission of power, or alleviate the thermal stress produced when outer edge has different thermal coefficient of expansions from substrate.Inhibit owing to the interference etc. transmit externally to first sensor element is sewed vibration, sewed power and the variation of the electrical characteristics changing or causing due to the variations in temperature of environment of use of the electrical characteristics that cause, physical quantity transducer that electrical characteristics are more stable thereby, it is possible to provide.
Specifically, for instance the thermal stress produced between the outer edge on the interarea of substrate and substrate is alleviated by least one the groove portion in the first groove portion, the second groove portion and the 3rd groove portion.Such as, when making substrate produce warpage due to thermal stress, this warpage is alleviated by least one in the first groove portion, the second groove portion and the 3rd groove portion.Its result is, the thermal stress produced due to the difference of thermal coefficient of expansion is inhibited to cause first sensor element to deform upon, or the situation that the displacement of this movable part is impacted by described thermal stress when first sensor element has movable part (movable electrode), thus inhibit the variations in temperature of the environment used due to first sensor element and the variation of detection characteristic that causes.In other words, according to should use-case, using the teaching of the invention it is possible to provide block or reduce the sewing of signal of first sensor element testing, and the variation of the electrical characteristics suppressing the variations in temperature of environment owing to using and producing, physical quantity transducer that electrical characteristics are more stable.
Additionally, the groove of the groove at least one party that both can be through in outer edge and substrate, it is also possible to it is groove with the end.
Application examples 25
In the physical quantity transducer involved by above-mentioned application examples, it is preferably, possessing the second sensor element on the interarea being arranged at described substrate, at least one in described first groove portion, described second groove portion and described 3rd groove portion is arranged between described first sensor element and described second sensor element.
According to should use-case, physical quantity transducer, except first sensor element, is also equipped with the second sensor element.It addition, the outer edge place in physical quantity transducer region that the first groove portion, the second groove portion and the 3rd groove portion are arranged between first sensor element and the second sensor element.Therefore, act on the stress between first sensor element and the second sensor element, be suppressed from least one groove sewed the vibration first groove portion that passes through of homenergic, the second groove portion and the 3rd groove portion of first sensor element and direction the opposing party transmission of the second sensor element such that it is able to reduce the impact that characteristic is caused.In detail, can suppressing when physical quantity transducer possesses multiple sensor element, the noise produced due to the sensor element of a side the mutual vibration of so-called multiple sensor elements such as impacts to the sensor element of the opposing party interferes and the deterioration of the electrical characteristics of physical quantity transducer that produces.
Application examples 26
Should be characterised by possessing the electronic installation involved by above-mentioned application examples by electronic equipment involved by use-case.
According to should use-case, as electronic equipment, by possessing the variation inhibiting the caused detection characteristic such as variations in temperature due to the environment used and the electronic installation making detection characteristic more stable such that it is able to the electronic equipment that offer temperature characterisitic is more stable.
Application examples 27
Should be characterised by possessing the electronic installation involved by above-mentioned application examples by moving body involved by use-case.
According to should use-case, as moving body, the electronic installation making detection characteristic more stable by possessing the caused detection characteristic variation of the variations in temperature etc. inhibiting the environment owing to using such that it is able to the moving body that the environmental characteristics of offer variations in temperature etc. is more stable.
Accompanying drawing explanation
The schematic diagram of (a) in Fig. 1～(c) physical quantity transducer involved by the embodiment 1 of expression electronic installation.
(a) in Fig. 2～(c) is for schematically showing the top view of the change example 1～3 of the physical quantity transducer involved by the embodiment 1 of electronic installation.
(a), (b) in Fig. 3 is for schematically showing the top view of the change example 4,5 of the physical quantity transducer involved by the embodiment 1 of electronic installation, and (c) is the top view of the change example of the shape representing groove.
The schematic diagram of (a) in Fig. 4～(c) physical quantity transducer involved by the embodiment 2 of expression electronic installation.
(a) in Fig. 5 is for representing the schematic diagram of state substrate and silicon substrate fit together of the physical quantity transducer involved by embodiment 2, the B-B sectional view that (b) is Fig. 4 (a).
(a) in Fig. 6～(d) is for schematically showing the main sectional view of the manufacture method of the physical quantity transducer involved by embodiment 2.
(a) in Fig. 7～(c) is for schematically showing the top view of the change example 6～8 of the physical quantity transducer involved by the embodiment 2 of electronic installation.
(a), (b) in Fig. 8 is for schematically showing the top view of the change example 9,10 of the physical quantity transducer involved by the embodiment 2 of electronic installation.
(a) in Fig. 9～(c) is for schematically showing the top view of the change example 11～13 of the physical quantity transducer involved by the embodiment 2 of electronic installation.
(a), (b) in Figure 10 is for schematically showing the top view of the change example 14,15 of the physical quantity transducer involved by the embodiment 2 of electronic installation.
Figure 11 is the sectional view of the physical quantity transducer involved by embodiment 3 representing electronic installation.
(a) in Figure 12 is for representing the top view of the change example 16 in the first groove portion of outer edge, the second groove portion and the 3rd groove portion, and (b) is the top view of the change example 17 representing the first groove portion of outer edge, the second groove portion and the 3rd groove portion.
(a) in Figure 13 is for being denoted as the axonometric chart of the structure of the mobile personal computer of an example of electronic equipment, and (b) is the axonometric chart of the structure of the mobile phone of the example being denoted as electronic equipment.
Figure 14 is the axonometric chart of the structure of the digital camera of the example being denoted as electronic equipment.
Figure 15 is the axonometric chart of the automobile schematically showing an example as moving body.
Detailed description of the invention
Hereinafter, illustrate by the embodiment that the present invention embodies with reference to accompanying drawing.It is below an embodiment of the invention, does not limit the present invention.Additionally, in following each figure, for the ease of illustrating, exist and carry out situation about recording with the scale different from practical situation.
Embodiment 1
First, the physical quantity transducer involved by the embodiment 1 of electronic installation is illustrated.The schematic diagram of Fig. 1 (a)～Fig. 1 (c) physical quantity transducer involved by the embodiment 1 of expression electronic installation, Fig. 1 (a) is top view, the top view of the Fig. 1 (b) the first sensor element of sensor part for possessing as physical quantity transducer, the A-A sectional view that Fig. 1 (c) is Fig. 1 (b).In addition, hereinafter for the ease of explanation, in the XYZ axle marked in the drawings, X-direction to be set to right direction, X-direction (± X-direction) is set to transverse direction, Y-direction is set to depth direction, Y direction (± Y-direction) is set to fore-and-aft direction, Z-direction is set to upper direction, Z-direction (± Z-direction) be set to above-below direction in the way of and illustrate.
The structure of physical quantity transducer
Physical quantity transducer 1 possesses the first sensor element (the first function element) 98 as sensor part and outer edge 90 etc..First sensor element 98 possesses sensing detection portion 2, wiring 30 etc..Sensing detection portion 2 possesses as the movable electrode 50 of movable part, fixed electrode 60 etc..Movable electrode 50 possesses fixed part 41,42, and from the support 51,52 that fixed part 41 extends, movable electrode refers to 53,54, movable base portion 55 etc..Additionally, the first sensor element (the first function element) 98 of composition sensor part and outer edge 90 are formed from the same material.The structure that first sensor element (the first function element) 98 and outer edge 90 are formed with identical material with first sensor element (the first function element) 98 compared with the structure that outer edge 90 is formed respectively, it is possible to be more easily formed physical quantity transducer 1.Additionally, physical quantity transducer 1 can also engage with the substrate 3 of the plate body as engaging member.Substrate 3 is as being provided with depressed part 70 on the upper surface of interarea.When this depressed part 70 is preferably in top view first sensor element 98, it is formed in the region of movable electrode 50 (support 51,52, movable electrode refers to 53,54, movable base portion 55) in storage sensing detection portion 2.Depressed part 70 is formed as the relief portion being used for making movable electrode 50 (support 51,52, movable electrode refers to 53,54, movable base portion 55) to separate from substrate 3.
Movable base portion 55 is the long side direction rectangular plate body towards X-direction, is supported by via support 51,52 between itself and outer edge 90.More specifically, in the figure of movable base portion 55, the end in left side is linked to outer edge 90 via support 51, and in the figure of movable base portion 55, the end on right side is linked to outer edge 90 via support 52.
The movable electrode of multiple (being 3 in the present embodiment) beam-like refers to that 53 divide from the long leg of+Y side of movable base portion 55 and extend towards +Y direction, and the movable electrode of multiple (being 3 in the present embodiment) beam-like refers to that 54 divide from the long leg of-Y side of movable base portion 55 and extend towards-Y direction.
Support 51,52 by movable base portion 55 so that outer edge 90 can be linked in the way of displacement.In the present embodiment, support 51,52 is configured to, and in Fig. 1 (b) as shown in arrow a, can make movable base portion 55 displacement in the X-axis direction.The multiple movable electrodes extended in the Y-axis direction refer to 53 and multiple movable electrode refer to that 54 carry out spread configuration in the X-direction of displacement at movable electrode 50 respectively.
Specifically, support 51 is made up of 2 (a pair) beams, is respectively formed as the shape wriggled in the Y-axis direction and extend towards +X direction.In other words, each beam is formed as turning back in the Y-axis direction repeatedly the shape of (being 3 times in the present embodiment).Additionally, the number of turns of each beam both can be 1 time or 2 times, it is also possible to be more than 4 times.
Support 52 is same, is made up of a pair beam of the shape being formed as wriggling in the Y-axis direction and extending towards-X direction.
Fixed electrode 60 possesses multiple fixed electrode and refers to 61,62, and multiple fixed electrodes refer to that 61,62 and arrange in the way of being formed as referring to 53,54 comb teeth-shapeds engaged at spaced intervals relative to multiple movable electrodes of movable electrode 50.
Fixed electrode refers to that 61 clip the both sides that a movable electrode refers to be opposed to configure in the X-axis direction in the way of in the of 53 by interval, i.e. refer to that 53 are configured with pair of stationary electrodes and refer to 61 for each movable electrode.In other words, pair of stationary electrodes refer to 61, namely 2 fixed electrodes refer to that 61 are configured in 3 positions, place.It addition, same, fixed electrode refers to that 62 clip a movable electrode and refer to be opposed to be arranged in the both sides of X-direction in the way of in the of 54 by interval, namely refers to that 54 are configured with pair of stationary electrodes and refer to 62 for each movable electrode.In other words, pair of stationary electrodes refer to 62, namely 2 fixed electrodes refer to that 62 are configured in 3 positions, place.
On the interarea of first sensor element 98 (physical quantity transducer 1), when top view first sensor element 98, fixed electrode refers to that 61,62 respective one end engage with the region of the side, outer edge 90 of first sensor element 98.Specifically, fixed electrode refer to the end of the side contrary with movable electrode 50 side (being+Y side relative to movable electrode 50) of 61 respectively with outer edge 90 side engagement of first sensor element 98.It addition, each fixed electrode refers to that the end of 61 sides it fixed is as fixing end, free end extends towards-Y direction.Equally, fixed electrode refer to the end of the side contrary with movable electrode 50 side (being-Y side relative to movable electrode 50) of 62 respectively with outer edge 90 side engagement of first sensor element 98, and the end of the side it fixed is as fixing end, free end extends towards +Y direction.
By such structure, the movable electrode that is positioned at that fixed electrode refers in 61 can be made to refer to that the fixed electrode of+X side of 53 refers to the electrostatic capacitance that 61 (referring to hereinafter referred to as the first fixed electrode) and movable electrode refer between 53, and the movable electrode that is positioned at that fixed electrode refers in 61 refers to that the fixed electrode of-X side of 53 refers to that the electrostatic capacitance that 61 (referring to hereinafter referred to as the second fixed electrode) and movable electrode refer between 53 changes according to the displacement of movable electrode 50.
Equally, the movable electrode that is positioned at that fixed electrode refers in 62 can be made to refer to that the fixed electrode of+X side of 54 refers to that 62 is (following, refer to also referred to as the first fixed electrode) and the movable electrode electrostatic capacitance that refers between 54, and the electrostatic capacitance that movable electrode refers to that the fixed electrode of-X side of 54 refers to that 62 (following, to refer to also referred to as the second fixed electrode) and movable electrode refer between 54 that is positioned at that fixed electrode refers in 62 changes according to the displacement of movable electrode 50.
First fixed electrode refers to refer to be separated from each other with the second fixed electrode, thus being electrically insulated.Therefore, the first fixed electrode can be measured respectively and refer to the electrostatic capacitance between movable electrode 50 (movable electrode refers to 53,54) and the second fixed electrode refers to and electrostatic capacitance between movable electrode 50 (movable electrode refers to 53,54), and detect physical quantity accurately based on this measurement result.
In other words, in sensing detection portion 2, the such as change according to the physical quantity such as acceleration, angular velocity, while making support 51,52 elastic deformation, movable electrode 50 (movable electrode refers to 53,54) is at X-direction (+X direction or-X direction) enterprising line displacement.First sensor element 98 can detect the physical quantity such as acceleration, angular velocity based on the electrostatic capacitance changed with such displacement.In other words, first sensor element 98 is capacitance acceleration transducer.
Additionally, the shape of movable electrode 50 and fixed electrode 60 is determined according to constituting the shape in each portion in sensing detection portion 2, size etc., it is not limited to above-mentioned structure.
Wiring 30 is for detecting the electrical connection of above-mentioned electrostatic capacitance wiring, and is laid along the recess 71 on the interarea (interarea of first sensor element 98) being formed on physical quantity transducer 1.Wiring 30 is respectively arranged with: the first fixed electrode refers to line and is connected to the wiring of electrode 31a for being connected with external circuit；Second fixed electrode is referred to line and is connected to the wiring of electrode 31b for being connected with external circuit；It is connected to the wiring of the electrode 31c being connected for same movable electrode 50 with external circuit.Insulating barrier can be had between wiring 30 and recess 71.As insulating barrier, for instance there is silicon dioxide (SiO2) etc..I.e., it is possible to will wiring 30 and outer edge 90 electric insulation.
Recess 71, in the region of the side, outer edge 90 of first sensor element 98, is set to lay the region of wiring 30.That is, recess 71 is formed, and when top view first sensor element 98, makes the region of laying wiring 30 be accommodated in the region of recess 71.The depth dimensions (size on the thickness direction of first sensor element 98) of recess 71 is when excluding contact portion described later outside, more than the gauge of wiring 30.The line that wiring 30 and first, second fixed electrode refer to is undertaken by contact portion 80.
As the constituent material of wiring 30, as long as have the material of electric conductivity, without particular determination, various electrode material can be used, such as can enumerate ITO (IndiumTinOxide, tin indium oxide), IZO (Indiumzincoxide, indium zinc oxide), In2O3、SnO2, SnO containing Sb2, oxide (transparent electrode material), Au, Pt, Ag, Cu, Al or the alloy etc. containing these metals such as ZnO containing Al, it is possible to use a kind or two or more combination is used therein.
Outer edge 90 is containing having as the sewing of signal blocking or reducing first sensor element 98 detection, from the function of the bucking electrode of the effect of the externally applied noise to first sensor element 98.Outer edge 90 is as shown in Fig. 1 (a), on the interarea of physical quantity transducer 1, when top view physical quantity transducer 1, is configured in the outer region of first sensor element 98.
Specifically, the central part on the interarea of physical quantity transducer 1, first sensor element 98 is configured to occupy region rectangular during top view.It addition, the central part on the interarea of physical quantity transducer 1, outer edge 90 is formed frame shape in the way of surrounding first sensor element 98.On outer edge 90, it is applied with the fixed potentials such as such as earthing potential by connecting up (diagram is omitted).By so outer edge 90 being formed as the fixed potential such as earthing potential or constant potential, so that outer edge 90 has the effect as bucking electrode.
It addition, outer edge 90 has when top view physical quantity transducer 1, as the multiple first groove portions 92 extended in the X-direction of first direction.In other words, the direction of displacement that first direction is movable part (movable electrode 50) that the first groove portion 92 extends.First groove portion 92 is the hole slot (groove) that the upper surface from outer edge 90 extends through lower surface, length W1 in X-direction is about the 70% of the width of frame WL1 of the outer edge 90 in frame shape, the size of about 10% of the width of frame WL2 that width W2 is outer edge 90 in Y direction.Additionally, for the width of width of frame, hole slot (groove), carry out same definition in the following description.First groove portion 92 is by the region of frame being configured at outer edge 90 at substantially equal intervals.Additionally, the size in the first groove portion 92, number are not limited to foregoing.For example, it is possible to make length or width less, to configure more groove portion.But, it is necessary to arrange not damaging in as the scope of the effect of bucking electrode.As the manner, by making multiple first groove portion 92 arrange in the way of having predetermined interval, compared with the structure that a groove is set along outer edge, it is possible to prevent the intensity of outer edge 90a from reducing, and it is prevented from weakening of the effect as bucking electrode.
Constitute the materials'use silicon of physical quantity transducer 1 using as preference.So, by being formed with identical material in first sensor element 98, outer edge 90 such that it is able to during fabrication, make them such as be formed by a silicon substrate carries out pattern form processing integratedly, it is possible to the simplification realizing manufacturing.
It addition, silicon substrate can be processed accurately by etching.Therefore, by being constituted physical quantity transducer 1 with silicon substrate for main material, so that the dimensional accuracy of sensing detection portion 2 grade is excellent, its result is, it is possible to realize the high-sensitivity of first sensor element 98.
It is preferably doped with the impurity such as phosphorus, boron it addition, constitute in the silicon materials of physical quantity transducer 1.Thus, physical quantity transducer 1 can make the shielding as bucking electrode of the electric conductivity of first sensor element 98 (sensing detection portion 2) and outer edge 90 comparatively excellent.
Additionally, the constituent material as physical quantity transducer 1 is not limited to silicon substrate, as long as be capable of the material of the detection of the physical quantity of the change based on electrostatic capacitance.
As it has been described above, the physical quantity transducer 1 according to present embodiment, following effect can be obtained.
Physical quantity transducer 1 possesses the outer edge 90 of the periphery (periphery during top view physical quantity transducer 1) being configured in the first sensor element 98 as the first function element.Additionally, be disposed with the first groove portion 92 extended in a first direction on outer edge 90.In such a configuration, outer edge 90 such as can become there is blocking-up or reduce the sewing of signal of first sensor element 98 detection, from the bucking electrode of the effect of the externally applied noise to first sensor element 98.When outer edge 90 is configured to bucking electrode, the periphery surrounding first sensor element 98 with bigger area is more efficiently.As should use-case, by arranging the first groove portion 92 on outer edge 90, thus the interference etc. transmitted to first sensor element 98 from outer edge 90 is sewed vibration, sewed passing through the first groove portion 92 and being alleviated of power.Therefore, it is possible to surround the periphery of first sensor element 98 with bigger area.Thus, be obtained in that there is blocking-up or reduce the sewing of signal of first sensor element 98 detection, from the shield effectiveness of the externally applied noise to first sensor element 98, and inhibit owing to the interference etc. transmitted externally to first sensor element 98 is sewed vibration, sewed power and the variation of electrical characteristics that causes, the physical quantity transducer 1 as electronic installation that electrical characteristics are more stable.
Additionally, by by first sensor element 98, outer edge 90, outer edge 90 the first groove portion 92 formed with identical material, thus during fabrication, it is possible to such as formed by a silicon substrate carries out pattern form processing integratedly, it is possible to be easily manufactured physical quantity transducer 1.
The change example of embodiment 1
Herein, with reference to Fig. 2 and Fig. 3, the change example of the physical quantity transducer 1 involved by embodiment 1 is illustrated.Fig. 2 is the top view of the change example 1～change example 3 schematically showing the physical quantity transducer 1 involved by embodiment 1, and Fig. 2 (a) represents that changing example 1, Fig. 2 (b) represents that changing example 2, Fig. 2 (c) expression changes example 3.Fig. 3 is the top view schematically showing the change example 4 of the physical quantity transducer 1 involved by embodiment 1, change example 5, Fig. 3 (a) represents change example 4, Fig. 3 (b) represents the change example changing the shape that example 5, Fig. 3 (c) represents groove.Physical quantity transducer 1d, 1e of change example shown in physical quantity transducer 1a, 1b, 1c and Fig. 3 (a) of change example shown in Fig. 2 (a)～Fig. 2 (c), Fig. 3 (b) and the physical quantity transducer 1 of embodiment 1 are distinctive in that, are arranged at the structure of the groove portion on outer edge 90 (being the first groove portion 92 in physical quantity transducer 1).Hereinafter, in the explanation changing example 1～5, by with the difference of the physical quantity transducer 1 of aforesaid embodiment 1 centered by illustrate, identical symbol omitting the description is marked for identical structure.
Change example 1
Physical quantity transducer 1a shown in Fig. 2 (a) is identical with aforesaid physical quantity transducer 1, possesses the first sensor element (the first function element) 98 as sensor part and outer edge 90 etc..Additionally, due to first sensor element 98 is identical with aforesaid physical quantity transducer 1, therefore omit the description.
On the outer edge 90 of outer region being configured in first sensor element 98, have when top view physical quantity transducer 1a, as the multiple first groove portions 92 extended in the X-direction of first direction and the multiple second groove portions 93 extended in the Y direction as the second direction intersected with first direction (X-direction).Additionally, the direction of displacement that the first direction that the first groove portion 92 extends is movable part (movable electrode 50: with reference to Fig. 1).
First groove portion 92 is the hole slot (groove) that the upper surface from outer edge 90 extends through lower surface, length in X-direction is about the 70% of the width of frame of the outer edge 90 in frame shape, and the width in Y direction is the size of about the 10% of the width of frame of outer edge 90.First groove portion 92 is by the region of frame being configured at outer edge 90 at substantially equal intervals.
Second groove portion 93 is all, with the first groove portion 92 phase, the hole slot (groove) running through outer edge 90, and the length in Y direction is about the 70% of the width of frame of the outer edge 90 in frame shape, and the width in X-direction is the size of about the 10% of the width of frame of outer edge 90.Second groove portion 93 between the first groove portion 92 substantially to configure at equal intervals or the side in the first groove portion 92, is configured at substantially equal intervals in the way of alternately arranged with the first groove portion 92.So, by the first groove portion 92 and the second groove portion 93 are arranged such that it is able to more effectively suppress interference etc. to sew vibration, sew the transmission of power.
It addition, the first groove portion 92 and the second groove portion 93 are configured to, when top view physical quantity transducer 1a, the figure being made up of the first groove portion 92 and the second groove portion 93 be 2 times rotationally symmetrical.
Additionally, the first groove portion 92 and the size in the second groove portion 93, number are not limited to above-mentioned content.For example, it is possible to make length or width less, to configure more groove portion.Alternatively, it is also possible to make the first groove portion 92 and the second groove portion 93 be configured to such as cross, T-shaped or L-shaped continuously.But, it is necessary to arrange not damaging in as the scope of the effect of bucking electrode.Additionally, it is preferred that be configured to, the figure being made up of the first groove portion 92 and the second groove portion 93 is rotationally symmetrical.
Physical quantity transducer 1a according to such change example 1, on the outer edge 90 of first sensor element 98, except the first groove portion 92 extended in a first direction, also has in second groove portion 93 upwardly extending with the second party that first direction intersects.The interference etc. transmitted from outer edge 90 to first sensor element 98 sews vibration, sew power is at least broken down into the vector components on any direction first direction or the second direction intersected with first direction.As should use-case, by arranging the first groove portion 92 and the second groove portion 93, so that acting on the passing through groove of stress on groove on the direction that the bearing of trend with groove intersects and being alleviated.Therefore, be obtained in that have stop or reduce first sensor element 98 detection the sewing of signal, from the shield effectiveness of the externally applied noise to first sensor element 98, and inhibit owing to the interference etc. transmitted externally to first sensor element 98 is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer 1a that electrical characteristics are more stable.
Change example 2
Physical quantity transducer 1b shown in Fig. 2 (b) is identical with aforesaid physical quantity transducer 1, possesses the first sensor element (the first function element) 98 as sensor part and outer edge 90 etc..Additionally, due to first sensor element 98 is identical with aforesaid physical quantity transducer 1, therefore omit the description.
On the outer edge 90 of outer region being configured in first sensor element 98, have when top view physical quantity transducer 1b, the second groove group 93 ' that the groove 9 of point-like is arranged in the Y direction as the second direction intersected with first direction (X-direction) at the groove 9 as the first groove group 92 ' being arranged in the X-direction of first direction and point-like.Additionally, the first groove group 92 ' and the second groove group 93 ' are set to multiple.It addition, the direction of displacement that the first direction that the first groove group 92 ' extends is movable part (movable electrode 50: with reference to Fig. 1).It addition, the first groove group 92 ' could alternatively be the first groove portion 92, the second groove group 93 ' could alternatively be the second groove portion 93.
Constitute the groove 9 of the point-like of the first groove group 92 ' and the second groove group 93 ' be the upper surface from outer edge 90 extend through lower surface, top view shape be the hole slot (groove) of circular.Length in the X-direction of the first groove group 92 ' being made up of the groove 9 of multiple point-like is about the 70% of the width of frame of the outer edge 90 in frame shape, and the width in Y direction is the size of about the 10% of the width of frame of outer edge 90.First groove group 92 ' is by the region of frame being configured at outer edge 90 at substantially equal intervals.
The the second groove group 93 ' being made up of the groove 9 of multiple point-like and the first groove group 92 ' are identical, and the length in Y direction is about the 70% of the width of frame of the outer edge 90 in frame shape, and the width in X-direction is the size of about the 10% of the width of frame of outer edge 90.Second groove group 93 ' between the first groove group 92 ' substantially to configure at equal intervals or the side of the first groove group 92 ', is configured at substantially equal intervals in the way of alternately arranged with the first groove group 92 '.
It addition, the first groove group 92 ' and the second groove group 93 ' are configured to, when top view physical quantity transducer 1b, the figure being made up of the first groove group 92 ' and the second groove group 93 ' be 2 times rotationally symmetrical.
Additionally, the number of groove 9 of point-like, the first groove group 92 ' and the size of the second groove group 93 ', number are not limited to above-mentioned content.For example, it is possible to reduce the number of groove 9 of point-like to shorten the length of the first groove group 92 ' and the second groove group 93 ', or reduce the diameter of groove 9 of point-like with the width of constriction the first groove group 92 ' and the second groove group 93 ', thus configuring more groove portion.It addition, identical with changing example 1, it is possible to make the first groove group 92 ' and the second groove group 93 ' be thus configured to such as cross, T-shaped or L-shaped continuously.But need do not damage in as the scope of the effect of bucking electrode arrange.Additionally, it is preferred that the figure being configured to be made up of the first groove group 92 ' and the second groove group 93 ' is rotationally symmetrical.
Physical quantity transducer 1b according to such change example 2, has the second groove group 93 ' that the groove 9 of the first groove group 92 ' that the groove 9 of point-like is arranged in a first direction and point-like is arranged in the second direction intersected with first direction on the outer edge 90 of first sensor element 98.By arranging the first groove group 92 ' and the second groove group 93 ' of such structure, example 1 is identical with changing, and acts on passing through this first groove group 92 ' and the second groove group 93 ' and being alleviated of the stress on groove on the direction that the bearing of trend with groove intersects.Therefore, be obtained in that have stop or reduce first sensor element 98 detection the sewing of signal, from the shield effectiveness of the externally applied noise to first sensor element 98, and inhibit owing to the interference etc. transmitted externally to first sensor element 98 is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer 1b that electrical characteristics are more stable.
Change example 3
Physical quantity transducer 1c shown in Fig. 2 (c) is identical with aforesaid physical quantity transducer 1, possesses the first sensor element (the first function element) 98 as sensor part and outer edge 90 etc..Additionally, due to first sensor element 98 is identical with aforesaid physical quantity transducer 1, therefore omit the description.
The physical quantity transducer 1c changing example 3 possesses the outer edge 90 of top view shape rectangular shaped, except, except identical for the physical quantity transducer 1a first groove portion 92 and the second groove portion 93 of aforesaid change example 1, being additionally provided with the 3rd groove portion 91 on this outer edge 90.
When top view physical quantity transducer 1c, the 3rd groove portion 91 upwardly extends in the side orthogonal with two articles of diagonal CL1, CL2 of the corner through outer edge 90.Additionally, diagonal CL1, CL2 can rename as the centrage of the center G through physical quantity transducer 1c.Additionally, the 3rd groove portion 91 is in the corner of outer edge 90, it is configured to substantially symmetric shape relative to diagonal CL1, CL2.
3rd groove portion 91 and the first groove portion 92 and the second groove portion 93 are identical, for extending through the hole slot (groove) of lower surface from the upper surface of outer edge 90.Additionally, length, width on the bearing of trend in the 3rd groove portion 91 are set to and the first groove portion 92 and the second groove portion 93 equal extent.It addition, the 3rd groove portion 91 can also be the 3rd groove group 91 ' (not shown) being made up of the groove 9 of multiple point-like.
Additionally, the 3rd groove portion 91 being configured in centered by diagonal CL1, CL2+-scope of (positive and negative) about 10 degree in time, can have equal effect.
It addition, the 92, second groove portion of the first groove portion 93 and the 3rd groove portion 91 are set to, when top view physical quantity transducer 1c, the figure being made up of the 92, second groove portion of the first groove portion 93 and the 3rd groove portion 91 be 2 times rotationally symmetrical.
It addition, the 3rd groove portion 91 can be formed as arc-shaped, for instance use a part etc. overlapping with the center G of the physical quantity transducer 1c concentric circular being benchmark.
Physical quantity transducer 1c according to such change example 3, on the outer edge 90 of first sensor element 98, except the first groove portion 92 extended in a first direction and except second groove portion 93 upwardly extending with the second party that first direction intersects, it is additionally provided with in the side upwardly extending threeth groove portion 91 orthogonal with two articles of diagonal CL1, CL2 of the corner through outer edge 90.Therefore, example 1 is identical with changing, and acts on passing through this first groove portion 92 and the second groove portion 93 and being alleviated of the stress on groove on the direction that the bearing of trend with groove intersects.
Additionally, in addition, utilize the 3rd groove portion 91 of the corner being arranged at outer edge 90, it is possible to alleviate and suppress the such as thermal deformation etc. from first direction and second direction to concentrate thus producing the deformational stress in the corner (four corners) of relatively larger deformational stress efficiently.Distance owing to being provided with the corner (corner) of the outer edge 90 of diagonal CL1, CL2 center G from first sensor element 98 is relatively big, and the deformation (warpage) therefore produced due to thermal expansion etc. is bigger.It addition, on the corner (corner) of outer edge 90, be applied with deformation (stress) from first direction (X-direction) and second direction (Y direction) twocouese.To this, owing to the 3rd groove portion 91 is arranged on the direction orthogonal with diagonal, therefore, it is possible to dispersion and alleviate efficiently, suppress the deformation (stress) that applies from first direction (X-direction) and second direction (Y direction).
Thus, be obtained in that have stop or reduce first sensor element 98 detection the sewing of signal, from the shield effectiveness of the externally applied noise to first sensor element 98, and inhibit owing to the interference etc. transmitted externally to first sensor element 98 is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer 1c that electrical characteristics are more stable.
Change example 4
Physical quantity transducer 1d shown in Fig. 3 (a) is identical with aforesaid physical quantity transducer 1, possesses the first sensor element (the first function element) 98 as sensor part and outer edge 90 etc..Additionally, due to first sensor element 98 is identical with aforesaid physical quantity transducer 1, therefore omit the description.
The physical quantity transducer 1d changing example 4 is provided with when top view physical quantity transducer 1d, is configured in first groove portion 92 and the second groove portion 93 identical with changing example 1 on the outer edge 90 on long side direction.It addition, similarly, on the outer edge 90 opposed with short side direction, be provided with orthogonal for the centre line C L 1～CL5 upwardly extending 3rd groove portion 91 of side at the center through first sensor element, 91a, 91b.Herein, in the 3rd groove portion 91 that the side upwardly extending groove portion orthogonal with two articles of centrages (diagonal) CL1, CL2 of the corner through outer edge 90 is illustrated in changing example 3.It addition, be provided with the second groove portion 93 in the centre line C L 4 along the direction (X-direction) orthogonal with the bearing of trend of outer edge 90.
3rd groove portion 91,91a, 91b and the first groove portion 92 and the second groove portion 93 are identical, for extending through the hole slot (groove) of lower surface from the upper surface of outer edge 90.Additionally, the 3rd groove portion 91,91a, 91b bearing of trend on length, width is set to and the first groove portion 92 and the second groove portion 93 equal extent.
Additionally, the 3rd groove portion 91,91a, 91b being arranged on centered by centrage (diagonal) CL1, CL2+-scope of (positive and negative) about 10 degree in time, can have equal effect.
It addition, the 92, second groove portion of the first groove portion 93 and the 3rd groove portion 91,91a, 91b are configured to, when top view physical quantity transducer 1d, the figure being made up of the 92, second groove portion of the first groove portion 93 and the 3rd groove portion 91,91a, 91b be 2 times rotationally symmetrical.
It addition, the 3rd groove portion 91,91a, 91b can be formed as arc-shaped, for instance use a part etc. overlapping with the center G of the physical quantity transducer 1d concentric circular being benchmark.
Physical quantity transducer 1d according to such change example 4, on the outer edge 90 of first sensor element 98, except the first groove portion 92 extended in a first direction and except second groove portion 93 upwardly extending with the second party that first direction intersects, it is additionally provided with at two articles of centrage (diagonal) CL1, the CL2 and centre line C L 3, upwardly extending 3rd groove portion 91 of side orthogonal for CL5,91a, 91b with the corner through outer edge 90.Therefore, example 1 is identical with changing, and acts on passing through this first groove portion 92 and the second groove portion 93 and being alleviated of the stress relative to groove on the direction that the bearing of trend with groove intersects.
Additionally, in addition, utilize the 3rd groove portion 91 and other the 3rd groove portion 91a, 91b of the corner being arranged at outer edge 90, it is possible to alleviate and suppress the such as thermal deformation etc. from first direction and second direction to concentrate thus producing the deformational stress in the corner (four corners) of relatively larger deformational stress further efficiently.Thus, be obtained in that there is blocking-up or reduce the sewing of signal of first sensor element 98 detection, from the shield effectiveness of the externally applied noise to first sensor element 98, and inhibit owing to the interference etc. transmitted externally to first sensor element 98 is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer 1d that electrical characteristics are more stable.
Change example 5
Physical quantity transducer 1e shown in Fig. 3 (b) is identical with aforesaid physical quantity transducer 1, possesses the first sensor element (the first function element) 98 as sensor part and outer edge 90 etc..Owing to first sensor element 98 is identical with aforesaid physical quantity transducer 1, therefore omit the description.
The physical quantity transducer 1e changing example 5 is provided with when top view physical quantity transducer 1e, is configured in the first groove group 92 ' on the outer edge 90 on long side direction and the second groove group 93 ' on the outer edge 90 being configured on short side direction.First groove group 92 ' of the manner is configured to, and the groove 9 of point-like is being arranged as in the X-direction of first direction.It addition, the second groove group 93 ' is configured to, the groove 9 of point-like is arranged in the Y direction as the second direction intersected with first direction (X-direction).It addition, the direction of displacement that the first direction that the first groove group 92 ' extends is movable part (movable electrode 50: with reference to Fig. 1).
Additionally, the number of groove 9 of point-like, the first groove group 92 ' and the size of the second groove group 93 ', number are not limited to above-mentioned content.For example, it is possible to reduce the number of groove 9 of point-like to shorten the length of the first groove group 92 ' and the second groove group 93 ', or reduce the diameter of groove 9 of point-like with the width of constriction the first groove group 92 ' and the second groove group 93 '.It addition, the row of the groove 9 of point-like such as can be formed as multiple row, or it is randomly formed the groove 9 of point-like and the interval of the groove 9 of adjacent point-like.But need do not damage in as the scope of the effect of bucking electrode arrange.
Physical quantity transducer 1e according to such change example 5, long side in the outer edge 90 of first sensor element 98, there is the first groove group 92 ' being arranged on the groove 9 (X-direction) in a first direction of point-like, at the short brink of outer edge 90, there is the second groove group 93 ' that the groove 9 of point-like is arranged in the second direction intersected with first direction.By arranging the first groove group 92 ' and the second groove group 93 ' of such structure, example 1 is identical with changing, relative to the orientation (bearing of trend of the first groove group 92 ' and the second groove group 93 ') of the groove 9 of point-like, on the direction that the orientation with the groove 9 of point-like intersects, the stress of effect passes through this first groove group 92 ' and the second groove group 93 ' and is alleviated.Therefore, be obtained in that have stop or reduce first sensor element 98 detection the sewing of signal, from the shield effectiveness of the externally applied noise to first sensor element 98, and inhibit owing to the interference etc. transmitted externally to first sensor element 98 is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer 1e that electrical characteristics are more stable.
In addition, although the structure about the first groove portion 92 (or first groove group 92 ') of above-mentioned change example, the second groove portion 93 (or second groove group 93 ') and the 3rd groove portion 91 (or the 3rd groove group 91 '), divide into structure that the groove 9 of structure that groove extends and point-like is arranged and illustrate, but be not limited thereto.The structure in the groove portion for being made up of the first groove portion 92 (or first groove group 92 '), the second groove portion 93 (or second groove group 93 ') and the 3rd groove portion 91 (or the 3rd groove group 91 ') etc., it is possible to the structure that the structure that a groove extends is arranged with the groove 9 of point-like is mixed setting.
The change example of the shape of groove
The top view shape of the groove 9 of above-mentioned point-like is not limited to circle, it is also possible to be other shapes.The top view shape of the groove 9 of point-like except being the groove 9 of rounded point-like as shown in Fig. 3 (c), can also be the such as square groove 9a of point-like, point-like triangular in shape groove 9b, be rectangle the polygon such as groove 9d of the groove 9c of the point-like of (tetragon), hexagonal point-like, or ellipse etc. has the shape of curve part.It addition, the groove of the point-like using different top view shapes or the groove of elongated hole-shape such as can also be combined in the structure in the first groove portion 92 (or first groove group 92 ').
Embodiment 2
First, the physical quantity transducer involved by the embodiment 2 of electronic installation is illustrated.The schematic diagram of Fig. 4 (a)～Fig. 4 (c) physical quantity transducer involved by the embodiment 2 of expression electronic installation, Fig. 4 (a) is top view, the top view of the sensor element that Fig. 4 (b) possesses for physical quantity transducer, the A-A sectional view that Fig. 4 (c) is Fig. 4 (b).In addition, for convenient explanation, in the XYZ axle marked in the drawings, so that X-direction to be set to right direction, X-direction (± X-direction) is set to transverse direction, Y-direction is set to depth direction, Y direction (± Y-direction) is set to fore-and-aft direction, Z-direction is set to upper direction, Z-direction (± Z-direction) illustrates in the way of being set to above-below direction.
The structure of physical quantity transducer
Physical quantity transducer 100 possesses substrate 10, first sensor element (the first function element) 99 and outer edge 90 etc. as sensor part.Substrate 10 is the plate body supporting physical quantity transducer 100 as substrate, the rectangular shape when top view.It addition, first sensor element 99 is arranged on the interarea of substrate 10.Substrate 10 doubles as the substrate of first sensor element 99.First sensor element 99 possesses sensing detection portion 20, wiring 30 etc..Sensing detection portion 20 possess fixed part 41,42, as the movable electrode 50 of movable part, fixed electrode 60 etc..Movable electrode 50 possesses support 51,52, and movable electrode refers to 53,54, movable base portion 55 etc..Additionally, the first sensor element (the first function element) 99 of composition sensor part and outer edge 90 can be formed respectively, but it is formed from the same material and is more highly preferred to.The structure that first sensor element (the first function element) 99 and outer edge 90 are formed from the same material with first sensor element (the first function element) 99 compared with the structure that outer edge 90 is formed respectively, it is possible to be more easily formed sensor part.
Substrate 10 is as being provided with depressed part 70 on the upper surface of interarea.This depressed part 70, when top view substrate 10, is formed in the region of movable electrode 50 (support 51,52, movable electrode refers to 53,54, movable base portion 55) in storage sensing detection portion 20.
When top view substrate 10, fixed part 41,42 engages with the interarea of substrate 10 and is arranged in the region in the outside in the region of depressed part 70.Specifically, fixed part 41 is engaged with in the part in-X direction side (in figure left side) relative to the depressed part 70 of the interarea of substrate 10, and fixed part 42 is engaged with in the part on +X direction side (in figure right side) relative to depressed part 70.It addition, when top view, fixed part 41,42 is set respectively in the way of crossing over the edge, periphery of depressed part 70.
Movable base portion 55 is the long side direction rectangular plate body towards X-direction, is supported by the way of separating with substrate 10 via support 51,52 between its with fixed part 41,42.More specifically, in the figure of movable base portion 55, the end in left side is linked to fixed part 41 via support 51, and in the figure of movable base portion 55, the end on right side is linked to fixed part 42 via support 52.
The movable electrode of multiple (in the present embodiment 3) beam-like refers to that 53 divide from the long leg of+Y side of movable base portion 55 and extend towards +Y direction, and the movable electrode of multiple (in the present embodiment 3) beam-like refers to that 54 divide from the long leg of-Y side of movable base portion 55 and extend towards-Y direction.
Depressed part 70 is formed as the relief portion being used for making movable electrode 50 (support 51,52, movable electrode refers to 53,54, movable base portion 55) to separate from substrate 10.Additionally, in the present embodiment, the plan view shape of depressed part 70 is rectangular, but is not limited thereto.
Support 51,52 by movable base portion 55 so that fixed part 41,42 can be linked in the way of displacement.In the present embodiment, support 51,52 is configured to, and in Fig. 4 (b) as shown in arrow a, can make movable base portion 55 displacement in the X-axis direction.
The multiple movable electrodes extended in the Y-axis direction refer to 53 and multiple movable electrode refer to that 54 carry out spread configuration in the X-direction of displacement at movable electrode 50 respectively.
Specifically, support 51 is made up of 2 (a pair) beams, is respectively formed as the shape wriggled in the Y-axis direction and extend towards +X direction.In other words, each beam is formed as turning back in the Y-axis direction repeatedly the shape of (in the present embodiment 3 times).Additionally, the number of turns of each beam both can be 1 time or 2 times, it is also possible to be more than 4 times.
Support 52 is same, is made up of a pair beam of the shape being formed as wriggling in the Y-axis direction and extending towards-X direction.
Fixed electrode 60 possesses multiple fixed electrode and refers to 61,62, and multiple fixed electrodes refer to that 61,62 and arrange in the way of being formed as referring to 53,54 comb teeth-shapeds engaged at spaced intervals relative to multiple movable electrodes of movable electrode 50.
Fixed electrode refers to that 61 clip a movable electrode and refer to be opposed to be arranged in the both sides of X-direction in the way of in the of 53 by interval, i.e. refer to that 53 are configured with pair of stationary electrodes and refer to 61 for each movable electrode.In other words, pair of stationary electrodes refer to 61, namely 2 fixed electrodes refer to that 61 are configured in 3 positions, place.It addition, same, fixed electrode refers to that 62 refer to be opposed to be arranged in the both sides of X-direction in the way of in the of 54 clipping a movable electrode at spaced intervals, i.e. refer to that 54 are configured with pair of stationary electrodes and refer to 62 for each movable electrode.In other words, pair of stationary electrodes refer to 62, namely 2 fixed electrodes refer to that 62 are configured in 3 positions, place.
On the interarea of substrate 10, during top view substrate 10, fixed electrode refers in the region that 61,62 respective one end engaged and be arranged on the outside in the region of depressed part 70 with interarea.Specifically, fixed electrode refers to that the end of the side contrary with movable electrode 50 side (being+Y side relative to movable electrode 50) of 61 leans on the upper surface of the substrate 10 of +Y direction side to engage with relative to depressed part 70 respectively.It addition, each fixed electrode refers to that the end of 61 sides it fixed is as fixing end, free end extends towards-Y direction.Equally, fixed electrode refers to that the end of the side contrary with movable electrode 50 side (being-Y side relative to movable electrode 50) of 62 leans on the upper surface of the substrate 10 of-Y direction side to engage with relative to depressed part 70 respectively, and the end of the side it fixed is set to fixing end, free end extends towards +Y direction.
According to such structure, it is possible to make fixed electrode refer in 61 be positioned at electrostatic capacitance that movable electrode refers to that the fixed electrode of+X side of 53 refers to that 61 (referring to hereinafter referred to as the first fixed electrode) and movable electrode refer between 53 and fixed electrode refers to that the movable electrode that is positioned at of 61 refers to that the fixed electrode of-X side of 53 refers to that the electrostatic capacitance that 61 (referring to hereinafter referred to as the second fixed electrode) and movable electrode refer between 53 changes according to the displacement of movable electrode 50.
Equally, the movable electrode that is positioned at that fixed electrode refers in 62 can be made to refer to that the fixed electrode of+X side of 54 refers to that 62 is (following, refer to also referred to as the first fixed electrode) and the movable electrode electrostatic capacitance that refers between 54, and the electrostatic capacitance that movable electrode refers to that the fixed electrode of-X side of 54 refers to that 62 (following, to refer to also referred to as the second fixed electrode) and movable electrode refer between 54 that is positioned at that fixed electrode refers in 62 changes according to the displacement of movable electrode 50.
First fixed electrode refers to refer to be separated from each other on the substrate 10 with the second fixed electrode, thus being electrically insulated.Therefore, the first fixed electrode can be measured respectively and refer to the electrostatic capacitance between movable electrode 50 (movable electrode refers to 53,54) and the second fixed electrode refers to and electrostatic capacitance between movable electrode 50 (movable electrode refers to 53,54), and detect physical quantity accurately based on this measurement result.
In other words, in sensing detection portion 20, the such as change according to the physical quantity such as acceleration, angular velocity, while making support 51,52 elastic deformation, movable electrode 50 (movable electrode refers to 53,54) is at X-direction (+X direction or-X direction) enterprising line displacement.First sensor element 99 can detect the physical quantity such as acceleration, angular velocity based on the electrostatic capacitance changed with such displacement.In other words, first sensor element 99 is capacitance acceleration transducer.
Additionally, the shape of movable electrode 50 and fixed electrode 60 is determined according to constituting the shape in each portion in sensing detection portion 20, size etc., it is not limited to above-mentioned structure.
Wiring 30 is for detecting the electrical connection of above-mentioned electrostatic capacitance wiring, and is laid along the recess 71 on the interarea being formed on substrate 10.Wiring 30 is respectively arranged with: the first fixed electrode refers to line and is connected to the wiring of electrode 31a for being connected with external circuit；Second fixed electrode is referred to line and is connected to the wiring of electrode 31b for being connected with external circuit；It is connected to the wiring of the electrode 31c being connected for same movable electrode 50 with external circuit.
Recess 71, in the region in the outside of depressed part 70, is set to lay the region of wiring 30.That is, recess 71 is formed, and when top view substrate 10, makes the region of laying wiring 30 be accommodated in the region of recess 71.The depth dimensions (size on the thickness direction of substrate 10) of recess 71 is when excluding contact portion described later outside, more than the gauge of wiring 30, and little less than the depth dimensions of depressed part 70
As mentioned above, on the interarea of substrate 10, recess 71 is formed by adopting, the structure of the wiring 30 of depth as shallow than recess 71 is laid, thus avoiding contacting of the wiring 30 in region beyond predetermined electrical connection section and the sensing detection portion 20 on the upper strata being laminated in substrate 10 in the region of recess 71.
In the way of predetermined electrical connection section refers to the part to cover wiring 30, stacking is constituted the upper strata in sensing detection portion 20, and abuts with wiring 30 and this upper strata, so that the contact portion that wiring 30 electrically connects with this upper strata.
As shown in Fig. 4 (b), undertaken by connecting up line that 30 first, second fixed electrodes that carry out refer to or wiring 30 and the connecting through contact portion 81 of fixed part 41.Movable electrode 50 electrically connects with wiring 30 via fixed part 41.Additionally, due to the constituent material of wiring 30 is identical with aforesaid embodiment 1, therefore omit the description.
It addition, except the contact portion abutted with the upper strata of wiring 30 and composition sensing detection portion 20, it is also possible in wiring 30, dielectric film is set.This dielectric film has the function avoiding wiring 30 with the electrical connection (short circuit) in the disconnected portion in sensing detection portion 20.Constituent material as dielectric film, be not particularly limited, it is possible to use there are the various materials of insulating properties, when substrate 10 by glass material (particularly, it is added with the glass material of alkali metal ion) when constituting, it is preferred to use silicon dioxide (SiO2)。
Outer edge 90 is containing having as the sewing of signal blocking or reducing first sensor element 99 detection, from the function of the bucking electrode of the effect of the externally applied noise to first sensor element 99.Outer edge 90 is as shown in Fig. 4 (a), on the interarea of substrate 10, when top view substrate 10, is configured in the outer region of first sensor element 99.
Specifically, the central part on the interarea of substrate 10, first sensor element 99 is configured to occupy region rectangular during top view.It addition, the central part on the interarea of substrate 10, outer edge 90 is formed frame shape in the way of surrounding first sensor element 99.On outer edge 90, it is applied with the fixed potentials such as such as earthing potential by connecting up (diagram is omitted).By so outer edge 90 being formed as the fixed potentials such as earthing potential, so that outer edge 90 has the effect as bucking electrode.
Additionally, outer edge 90 has when top view substrate 10, as the multiple first groove portions 92 extended in the X-direction of first direction and the multiple second groove portions 93 extended in the Y direction as the second direction intersected with first direction (X-direction).In other words, the direction of displacement that first direction is movable part (movable electrode 50) that the first groove portion 92 extends.
First groove portion 92 is the hole slot (groove) that the upper surface from outer edge 90 extends through lower surface, length in X-direction is about the 70% of the width of frame of the outer edge 90 in frame shape, and the width in Y direction is the size of about the 10% of the width of frame of outer edge 90.First groove portion 92 is arranged in the region of frame of outer edge 90 substantially at equal intervals.
Second groove portion 93 and the first groove portion 92 are identical, for running through the hole slot (groove) of outer edge 90, length in Y direction is about the 70% of the width of frame of the outer edge 90 in frame shape, and the width in X-direction is the size of about the 10% of the width of frame of outer edge 90.Second groove portion 93 between the first groove portion 92 substantially to configure at equal intervals or the side in the first groove portion 92, is configured at substantially equal intervals in the way of alternately arranged with the first groove portion 92.It addition, the first groove portion 92 and the second groove portion 93 are configured to, when top view substrate 10, the figure being made up of the first groove portion 92 and the second groove portion 93 be 2 times rotationally symmetrical.
Additionally, the first groove portion 92 and the size in the second groove portion 93, number are not limited to above-mentioned content.For example, it is possible to make length, width less, to configure more groove portion.Alternatively, it is also possible to make the first groove portion 92 and the second groove portion 93 be thus configured to such as cross, T-shaped or L-shaped continuously.But need do not damage in as the scope of the effect of bucking electrode arrange.Additionally, it is preferred that the figure being configured to be made up of the first groove portion 92 and the second groove portion 93 is rotationally symmetrical.
Constitute the materials'use silicon of sensing detection portion 20 (movable electrode refers to 53,54 for fixed part 41,42, support 51,52, movable base portion 55, and fixed electrode refers to 61,62) and outer edge 90 using as preference.When manufacturing preferably in it, them are made such as to be formed by a silicon substrate carries out pattern form processing integratedly.
Silicon substrate can be processed accurately by etching.Therefore, by being constituted sensing detection portion 20 with silicon substrate for main material, so that the dimensional accuracy in sensing detection portion 20 is excellent, its result is, it is possible to realize the high-sensitivity of first sensor element 99.
Additionally, it is preferred that constitute sensing detection portion 20, outer edge 90 silicon materials in the impurity such as Doping Phosphorus, boron.Thus, first sensor element 99 can make the shielding as bucking electrode of the electric conductivity in sensing detection portion 20 and outer edge 90 comparatively excellent.
Additionally, the constituent material as sensing detection portion 20 is not limited to silicon substrate, as long as be capable of the material of the detection of the physical quantity of the change based on electrostatic capacitance.
The constituent material of substrate 10 uses the glass material with insulating properties using as preference.It addition, particularly when sensing detection portion 20 is made up of silicon substrate, it is preferred to use the glass material (such as, the pyrex of Pyrex (registered trade mark) glass etc) containing alkali metal ion (mobile ion).Thus, first sensor element 99 can be constituted by substrate 10 (glass substrate) is carried out anodic bonding with sensing detection portion 20 (silicon substrate).
Fig. 5 (a) is for representing the schematic diagram of the state fit together by the silicon substrate of glass substrate with composition outer edge, sensing detection portion.
As mentioned above, having constituting sensing detection portion, the layer (silicon substrate etc.) of outer edge (bucking electrode) fits in the physical quantity transducer of the stepped construction on substrate (glass substrate etc.), exist the detection characteristic as sensor according to the temperature environment of use the problem of change.Specifically, as shown in Fig. 5 (a), the thermal stress produced due to glass substrate and the difference of the thermal coefficient of expansion of the silicon substrate being laminated on glass substrate causes glass substrate to produce warpage, so that sensor element deforms or the displacement of the movable part (movable electrode) of sensor element is impacted, the problem that therefore there is detection characteristic change.
To this, as in the present embodiment, by arranging the first groove portion 92 and the second groove portion 93 on outer edge 90 (silicon substrate), from can relief of thermal stress.
The B-B sectional view that Fig. 5 (b) is Fig. 4 (a), it is illustrated that be provided with the state in the first groove portion 92 and the second groove portion 93 on outer edge 90.It may be seen that by being formed there through the 92, second groove portion 93 of the first groove portion on outer edge 90 such that it is able to make the thermal stress of generation itself be eased, or inhibit the transmission of the thermal stress of generation.In other words, by reducing the bonding area of substrate 10 and outer edge 90, thus alleviating the thermal stress that (decreasing) produces, further, since outer edge 90 is discontinuous, thus the transmission of thermal stress is disconnected.Its result is, it is suppressed that the generation of the warpage shown in Fig. 5 (a).
The manufacture method of physical quantity transducer
It follows that the manufacture method of the physical quantity transducer 100 involved by the embodiment 2 of electronic installation is illustrated.Fig. 6 (a)～Fig. 6 (d) is for schematically showing the main sectional view of the manufacture method of the physical quantity transducer 100 involved by the embodiment 2 of electronic installation.
First, as shown in Fig. 6 (a), form depressed part 70 and recess 71 on the surface of the substrate 10.The material of substrate 10 is insulator, for instance for glass.The formation of depressed part 70 and recess 71 uses photoetching process to carry out, for instance by being formed using not shown chromium (Cr) layer, gold (Au) layer as the etching and processing of mask pattern.Thus, formed from the depressed part 70 sinking above and recess 71.Etching and processing is such as by utilizing the Wet-type etching carried out containing the solution of fluoric acid or utilizing the dry-etching that plasma carries out to carry out.
It addition, the electric conductor of composition wiring 30, contact portion 81 to be carried out film forming, pattern formation on the bottom surface of recess 71.As the conductive material forming electric conductor, it is not particularly limited, such as can use the metal materials such as gold (Au), billon, platinum (Pt), aluminum (Al), aluminium alloy, silver (Ag), silver alloy, chromium (Cr), evanohm, copper (Cu), molybdenum (Mo), niobium (Nb), tungsten (W), ferrum (Fe), titanium (Ti), cobalt (Co), zinc (Zn), zirconium (Zr), the electrode material such as ITO, ZnO.
It follows that as shown in Fig. 6 (b), the function element substrate 40 constituting sensor part is fitted on substrate 10.Function element substrate 40 is silicon substrate, and the laminating of substrate 10 is such as undertaken by anodic bonding.Function element substrate 40 is bonded on the planar section except depressed part 70 and recess 71 of substrate 10.
It follows that as shown in Fig. 6 (c), utilize and use photolithographic etching and processing and function element substrate 40 is formed as sensor part.About etching and processing, use dry-etching or Wet-type etching, after resist layer 48 is carried out pattern formation by predetermined position, the part of the function element substrate 40 exposed is etched, thus form fixed part 41, movable electrode that support 51, fixed electrode refer in 62 refers to 54, movable base portion 55 and outer edge 90 etc..Now, outer edge 90 is also formed in the lump the first groove portion 92 running through outer edge 90 and (X-direction) upper extension in a first direction and in the second groove portion 93 that extend upper with the second direction (Y direction) that first direction intersects.Additionally, in this operation, it is also possible to form the 3rd groove portion 91 in the lump.
By above operation, as shown in Fig. 6 (d), it is possible to formed and possess substrate 10 and be formed as the physical quantity transducer 100 of first sensor element (the first function element) 99 of sensor part by the function element substrate 40 being bonded on substrate 10.
Manufacture method according to above-mentioned physical quantity transducer 100, engagement function device substrate 40 is bonded on substrate in the way of opposed with the depressed part 70 being formed on substrate 10, subsequently function element substrate 40 is carried out pattern and forms processing, form the first groove portion 92 and the second groove portion 93 of first sensor element (the first function element) 99, outer edge 90, outer edge 90.In such manner, it is possible to form the first groove portion 92 and the second groove portion 93 of first sensor element (the first function element) 99, outer edge 90, outer edge 90 in same operation from the function element substrate 40 being engaged in substrate 10.In other words, it is possible to be readily formed the first groove portion 92 and the second groove portion 93 of first sensor element (the first function element) 99, outer edge 90, outer edge 90.
As it has been described above, the physical quantity transducer 100 according to present embodiment, it is possible to obtain following effect.Physical quantity transducer 100 possesses: substrate 10, the first sensor element 99 being arranged on the interarea of substrate 10, the outer edge 90 of periphery (periphery during top view substrate 10) that is configured in first sensor element 99.Outer edge 90 possesses in a first direction (X-direction) upper first groove portion 92 extended and in the second groove portion 93 that extend upper with the second direction (Y direction) that first direction intersects.Therefore, the thermal stress produced when outer edge 90 has the thermal coefficient of expansion different from the thermal coefficient of expansion of substrate 10 is alleviated at least through any one in these grooves.
Specifically, the direction that the bearing of trend with groove intersects acts on the passing through groove of stress on groove is alleviated.Therefore, the thermal stress produced between the outer edge 90 on the interarea of substrate 10 and substrate 10 is alleviated also by these grooves (groove of the first groove portion 92 and the second groove portion 93 or one of them side).Such as, when causing substrate 10 to produce warpage due to thermal stress, this warpage is alleviated by these grooves.Its result is, the thermal stress produced due to the difference of thermal coefficient of expansion is inhibited to cause first sensor element 99 to deform, or the situation that the displacement of the movable part that first sensor element 99 is possessed (movable electrode 50) impacts, thus inhibit the variations in temperature of the environment used due to first sensor element 99 and the variation of detection characteristic that causes.Additionally, owing to the first groove portion 92 and the second groove portion 93 of outer edge 90, outer edge 90 can be formed in same operation, therefore, it is possible to be readily formed the first groove portion 92 and the second groove portion 93 of first sensor element (the first function element) 99, outer edge 90, outer edge 90.
In other words, it is possible to be readily formed and provide the variations in temperature of environment inhibited owing to using and the variation of detection characteristic that causes, detect the physical quantity transducer that characteristic is more stable.
It addition, the direction of displacement that first direction is the movable part that first sensor element 99 possesses (direction of displacement during top view substrate 10).In other words, the outer edge 90 being configured at the periphery of first sensor element 99 possesses when top view substrate 10, upwardly extending first groove portion 92 of the side identical in the direction carrying out displacement with the movable part that first sensor element 99 possesses and carry out the upwardly extending second groove portion 93 of side that the direction of displacement intersects at the movable part possessed with first sensor element 99.
When outer edge 90 has the thermal coefficient of expansion different from the thermal coefficient of expansion of substrate 10, owing to outer edge 90 possesses the upwardly extending second groove portion 93 of side that the direction of displacement at the movable part possessed with first sensor element 99 intersects, therefore, it is possible to utilize the second groove portion 93 and more effectively alleviate the thermal stress that produces on the direction of displacement of movable part.Especially since the second groove portion 93 be approximately perpendicular to movable part direction of displacement direction on intersect extension, therefore can more effectively relief of thermal stress.
It addition, outer edge 90 possesses the first groove portion 92, thereby inhibiting substrate 10 from outer edge 90 thermal stress itself.Outer edge 90 possesses the first groove portion 92 extended on the direction of displacement of the movable part possessed at first sensor element 99, thereby inhibiting the thermal stress itself produced on the direction of displacement of movable part that substrate 10 is subject to from outer edge 90.
Result, the thermal stress produced due to the difference of thermal coefficient of expansion is inhibited to cause first sensor element 99 to deform, or the situation that the displacement of the movable part that first sensor element 99 is possessed (movable electrode 50) impacts, thus inhibit the variations in temperature of the environment used due to first sensor element 99 and the variation of detection characteristic that causes.
Change example 6～13
It follows that the change example 6～15 of the physical quantity transducer involved by embodiment 2 is illustrated with reference to Fig. 7～Figure 10.Additionally, when illustrating, use identical symbol for the structure position identical with above-mentioned embodiment 2, and the repetitive description thereof will be omitted.In addition, in following change example 6～15, for convenient explanation, in Fig. 7～Figure 10 in the XYZ axle of mark, so that X-direction to be set to right direction, X-direction (± X-direction) is set to transverse direction, Y-direction is set to depth direction, Y direction (± Y-direction) is set to fore-and-aft direction, Z-direction is set to upper direction, Z-direction (± Z-direction) is set to above-below direction or the mode for the thickness direction of substrate 10 described later illustrates.
Change example 6
First, use Fig. 7 (a) that the physical quantity transducer changed involved by example 6 is illustrated.Fig. 7 (a) is for representing the top view of the summary changing the physical quantity transducer 101 involved by example 6.
The physical quantity transducer 101 of the change example 6 shown in Fig. 7 (a) is characterised by, in the structure of sensor part, except the first function element (first sensor element 99), it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b), the outer edge in the region between each sensor element possesses the first groove portion 92.
Physical quantity transducer 101 possess substrate 10, first sensor element 99, as the second sensor element 99a of the second function element and the 3rd sensor element 99b, outer edge 90a etc..
Second sensor element 99a is such as the structure identical with first sensor element 99, and be setting direction (towards) different capacitance acceleration transducer.First sensor element 99 detects the acceleration of X-direction, in contrast, the second sensor element 99a with detect the acceleration of Y direction towards and be configured.
3rd sensor element 99b is such as the gyro sensor of detection angular velocity.Oscillator is possessed using as movable part in inside.
First sensor element the 99, second sensor element 99a, the 3rd sensor element 99b are such as shown in Fig. 7 (a), to stay spaced mode to be arranged on the interarea of substrate 10 each other.Specifically, the figure of the substrate 10 of rectangular shape is configured with first sensor element 99 in lower right area (region of+X ,-Y side), the region (+X of depth direction in the figure, the region of+Y side) in be configured with the 3rd sensor element 99b, in the figure of first sensor element 99 and the 3rd sensor element 99b left field (-X side Y direction central authorities regions) in be configured with the second sensor element 99a.
It is configured with outer edge 90a in the periphery of each sensor element.In other words, the region beyond the region occupied by each sensor element on the interarea of substrate 10 is formed with outer edge 90a.On the 90a of outer edge, it is applied with such as earthing potential by connecting up (diagram is omitted).
The outer edge 90a in the region between each sensor element is provided with the first groove portion 92.Specifically, the outer edge 90a in the region between first sensor element 99 and the 3rd sensor element 99b is provided with the groove row 94 that the first groove portion 92 arranges in the X-axis direction.It addition, the outer edge 90a in region between first sensor element 99 and the second sensor element 99a and between the 3rd sensor element 99b and the second sensor element 99a arranges the groove row 95 that the first groove portion 92 arranges in the Y-axis direction.
Additionally, be not necessarily to arrange groove row 94 and groove row 95 both sides, arrange as long as arranging groove in the region needing to alleviate the stress produced each other at sensor element.
As it has been described above, the physical quantity transducer 101 according to this change example 6, it is possible to obtain following effect.
Except the physical quantity transducer 101 first function element (first sensor element 99) on the interarea being arranged at substrate 10, it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b).So, common substrate possesses multiple sensor element, there is the noise that the sensor element of a side produces and the situation making the detection characteristic degradation as physical quantity transducer such as the sensor element of the opposing party is impacted.This noise is more than electrical noise, there is also situation about producing due to the mechanical energy such as stress, vibration.Specifically, the situation that the detection characteristic of adjacent sensor element is impacted by thermal stress that presence sensor element structure produces or has, residual stress to adjacent sensor element transmission, additionally there are the situation having movable part inferior, situation about the detection characteristic of adjacent sensor element being impacted to adjacent sensor element transmission is sewed in the vibration of movable part.
According to this change example 6, the first groove portion 92 is provided at least on the outer edge 90a of any region between first sensor element 99 and the second sensor element 99a, between first sensor element 99 and the 3rd sensor element 99b, between the second sensor element 99a and the three sensor element 99b.Therefore, act on the stress between each sensor element, alleviated from the sewing vibration the passing through the first groove portion 92 of homenergic of direction the opposing party transmission such that it is able to suppress the impact that characteristic is caused.
Change example 7
It follows that use Fig. 7 (b) that the physical quantity transducer changed involved by example 7 is illustrated.Fig. 7 (b) is for representing the top view of the summary changing the physical quantity transducer 102 involved by example 7.
The physical quantity transducer 102 involved by change example 7 shown in Fig. 7 (b) is characterised by, example 6 is identical with changing, except the first function element (first sensor element 99), it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b), the outer edge 90a between each sensor element possesses the first groove portion 92 and the second groove portion 93.
Additionally, the structure of the first function element (first sensor element 99) and the second function element (the second sensor element 99a, the 3rd sensor element 99b), configuration and change example 6 are identical, therefore omit the description.
It is configured with outer edge 90a in the periphery of each sensor element.In other words, the region beyond the region occupied by each sensor element on the interarea of substrate 10 is formed with outer edge 90a.On the 90a of outer edge, it is applied with such as earthing potential by connecting up (diagram is omitted).
The outer edge 90a in the region between each sensor element arranges the first groove portion 92 and the second groove portion 93.Specifically, the outer edge 90a in the region between first sensor element 99 and the 3rd sensor element 99b is provided with the groove row 94 being made up of the row that the first groove portion 92 and the second groove portion 93 are alternately arranged in the X-axis direction.
Additionally, on the outer edge 90a in the region between first sensor element 99 and the second sensor element 99a and between the 3rd sensor element 99b and the second sensor element 99a, the groove row 95 being made up of the row that the first groove portion 92 and the second groove portion 93 are alternately arranged in the Y-axis direction are set.
In each groove of groove row 94 and groove row 95 arranges, when top view substrate 10, the figure being made up of the first groove portion 92 and the second groove portion 93 is configured in 2 times rotationally symmetrical.
Additionally, be not necessarily to arrange groove row 94 and groove row 95 both sides, only groove need to be set in the region needing to alleviate the stress produced each other at sensor element and arrange.
As it has been described above, the physical quantity transducer 102 according to present embodiment, it is possible to obtain following effect.Except the physical quantity transducer 102 first function element (first sensor element 99) on the interarea being arranged on substrate 10, it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b).So, common substrate possesses multiple sensor element, there is the noise that the sensor element of a side produces and the situation making the detection characteristic degradation as physical quantity transducer such as the sensor element of the opposing party is impacted.This noise is more than electrical noise, there is also situation about producing due to the mechanical energy such as stress, vibration.Specifically, the situation that the detection characteristic of adjacent sensor element is impacted by thermal stress that presence sensor element structure produces or has, residual stress to adjacent sensor element transmission, additionally there are the situation having movable part inferior, situation about the detection characteristic of adjacent sensor element being impacted to adjacent sensor element transmission is sewed in the vibration of movable part.
According to present embodiment, the first groove portion 92 and the second groove portion 93 are provided at least on the outer edge 90a of any region between first sensor element 99 and the second sensor element 99a, between first sensor element 99 and the 3rd sensor element 99b, between the second sensor element 99a and the three sensor element 99b.Therefore, act on the stress between each sensor element, alleviated from the groove passing through the first groove portion 92 and the second groove portion 93 or at least one party of the energy sewing vibration etc. of direction the opposing party transmission such that it is able to suppress the impact that characteristic is caused.
Change example 8
It follows that the physical quantity transducer changed involved by example 8 is illustrated.Fig. 7 (c) is for representing the top view of the summary changing the physical quantity transducer 103 involved by example 8.
Fig. 7 (c) is for representing the top view of the summary changing the physical quantity transducer 103 involved by example 8.The physical quantity transducer 103 of the change example 8 shown in Fig. 7 (c) is characterised by, example 7 is identical with changing, possess the first function element and the second function element, and the whole region (whole face) of the outer edge 90a throughout the periphery surrounding each sensor element and possess the first groove portion 92 and the second groove portion 93.
Physical quantity transducer 103 is except outer edge 90a the first groove portion 92 possessed and the position in the second groove portion 93, number difference, identical with physical quantity transducer 102.As shown in Fig. 7 (c), in physical quantity transducer 103, the first groove portion 92 and the second groove portion 93 are in the way of alternately arranged in X-direction, Y direction and are arranged in the whole region of outer edge 90a.It addition, the first groove portion 92 and the second groove portion 93 are configured to, when top view substrate 10, the figure being made up of the first groove portion 92 and the second groove portion 93 be 2 times rotationally symmetrical.
Physical quantity transducer 103 according to this change example, it is possible to obtain following effect.
When outer edge 90a has the thermal coefficient of expansion different from the thermal coefficient of expansion of substrate 10, produced thermal stress is alleviated by these grooves (groove of the first groove portion 92 and the second groove portion 93 or wherein a side).It addition, the thermal stress produced between outer edge 90a on the interarea of substrate 10 and substrate 10 is alleviated also by these grooves.Its result is, the thermal stress produced due to the difference of thermal coefficient of expansion is inhibited to cause the sensor element (first sensor element the 99, second sensor element 99a, the 3rd sensor element 99b) on the interarea being arranged on substrate 10 to deform, or the situation that the displacement of the movable part that sensor element is possessed impacts, thus inhibit the variations in temperature of the environment used due to sensor element and the variation of detection characteristic that causes.
Additionally, act on the stress between multiple sensor element, alleviated from the groove passing through the first groove portion 92 and the second groove portion 93 or one of them side of the energy sewing vibration etc. of direction the opposing party transmission such that it is able to suppress the impact that characteristic is caused.
So, it is configured in the whole region of outer edge 90a by the first groove portion 92 and the second groove portion 93 in the way of alternately arranged in X-direction, Y direction such that it is able to more effectively realize the stabilisation of detection characteristic.
Change example 9
It follows that use Fig. 8 (a) that the physical quantity transducer 104 changed involved by example 9 is illustrated.Fig. 8 (a) is for representing the top view of the summary changing the physical quantity transducer 104 involved by example 9.
The physical quantity transducer 104 involved by change example 9 shown in Fig. 8 (a) is identical with change example 6, except the first function element (first sensor element 99), it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b), the outer edge 90a in the region between each sensor element possesses the groove row 94 that the row arranged in the X-axis direction by the first groove portion 92 are constituted.Additionally, in addition, physical quantity transducer 104 is characterised by, possesses the 3rd groove portion 91 (91e) on the outer edge 90a of the first function element (first sensor element 99) and the second function element (the 3rd sensor element 99b).In the explanation of this change example 9, for the symbol that the structure mark identical with changing example 6 is identical, and omit the description.
3rd groove portion 91 is when top view physical quantity transducer 104, on the direction orthogonal with four articles of diagonal CL1a, CL2a, CL3a, CL4a through first sensor element 99 and the 3rd respective corner of sensor element 99b, extend to both sides across diagonal CL1a, CL2a, CL3a, CL4a.Additionally, diagonal CL1a, CL2a, CL3a, CL4a can rename as the centrage through first sensor element 99 and the respective center G of the 3rd sensor element 99b.Additionally, the 3rd groove portion 91 is at the corner place of first sensor element 99 and the respective outer edge 90a of the 3rd sensor element 99b, it is configured to the substantially symmetric shape relative to diagonal CL1a, CL2a, CL3a, CL4a.It addition, the 3rd groove portion 91e of shape (this example is V shape) that two groove portions (the 3rd groove portion 91) that the 3rd groove portion 91 can also be formed as such as being arranged on the diagonal CL1 and diagonal CL4 of the opposed side of first sensor element 99 and the 3rd sensor element 99b are connected.
3rd groove portion 91 (91e) is identical with the first groove portion 92, for extending through the hole slot (groove) of lower surface from the upper surface of outer edge 90a.Additionally, length, width on the bearing of trend in the 3rd groove portion 91 (91e) can be both equal extent with the first groove portion 92, it is also possible to different.
Additionally, the 3rd groove portion 91 (91e) being arranged on centered by diagonal CL1a, CL2a, CL3a, CL4a+-scope of (positive and negative) about 10 degree in time, can have equal effect.
It addition, the first groove portion 92 and the 3rd groove portion 91 (91e) are configured to, when top view physical quantity transducer 104, the figure being made up of the first groove portion 92 and the 3rd groove portion 91 (91e) be 2 times rotationally symmetrical.
It addition, the 3rd groove portion 91 (91e) can also be arranged on the outer edge 90a of the second sensor element 99a.
It addition, the 3rd groove portion 91 (91e) can also be formed arc-shaped, for instance use a part etc. overlapping with the concentric circular being benchmark with the center of each sensor element.
Physical quantity transducer 104 according to this change example 9, except the effect of the physical quantity transducer 101 of aforesaid change example 6, also has following effect.
Physical quantity transducer 104, except the first groove portion 92, is also equipped with the 3rd groove portion 91 (91e) on the outer edge 90a of first sensor element 99 and the corner of the 3rd sensor element 99b.By the 3rd groove portion 91 (91e), it is possible to alleviate and suppress the such as thermal deformation etc. from first direction (X-direction) and second direction (Y direction) to concentrate thus producing the deformational stress in the corner (four corners) of relatively larger deformational stress efficiently.
Distance owing to being provided with the center from first sensor element 99, the corner (corner) of the outer edge 90a of diagonal CL1a, CL2a, CL3a, CL4a is relatively big, and the deformation (warpage) that therefore produces due to thermal expansion etc., the deformation (stress) produced due to the difference of substrate 10 and the thermal expansion of outer edge 90a are bigger.It addition, on the corner (corner) of outer edge 90a, be applied with deformation (stress) from first direction (X-direction) and second direction (Y direction) twocouese.To this, owing to the 3rd groove portion 91 (91e) is arranged on the direction orthogonal with diagonal, therefore, it is possible to dispersion and alleviate efficiently, suppress the deformation (stress) that applies from first direction (X-direction) and second direction (Y direction).Thus, be obtained in that have stop or reduce first sensor element the 99, the 3rd sensor element 99b detection the sewing of signal, from the shield effectiveness of the externally applied noise to first sensor element the 99, the 3rd sensor element 99b, and inhibit owing to sewing vibration externally to the interference etc. of first sensor element 99, the 3rd sensor element 99b transmission, sew power and the variation of electrical characteristics that causes, physical quantity transducer 104 that electrical characteristics are more stable.
Additionally, when being arranged on the outer edge 90a of the second sensor element 99a in the 3rd groove portion 91 (91e), effect same as described above will be played.
Change example 10
It follows that use Fig. 8 (b) that the physical quantity transducer 105 changed involved by example 10 is illustrated.Fig. 8 (b) is for representing the top view of the summary changing the physical quantity transducer 105 involved by example 10.
The physical quantity transducer 105 involved by change example 10 shown in Fig. 8 (b) is identical with change example 7, except the first function element (first sensor element 99), it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b), the outer edge 90a in the region between each sensor element possesses the groove row 94 being made up of the row that the first groove portion 92 and the second groove portion 93 are alternately arranged in the X-axis direction.Additionally, physical quantity transducer 105 is characterised by, example 9 is identical with changing, and possesses the 3rd groove portion 91 (91b, 91d) on the outer edge 90a of the first function element (first sensor element 99) and the second function element (the 3rd sensor element 99b).In the explanation of this change example 9, the symbol identical to the structure mark identical with change example 7 and change example 9 also omits the description.
3rd groove portion 91 is when top view physical quantity transducer 105, on the direction orthogonal with four articles of diagonal CL1b, CL2b, CL3b, CL4b through first sensor element 99 and the 3rd respective corner of sensor element 99b, extend to both sides across diagonal CL1b, CL2b, CL3b, CL4b.Additionally, diagonal CL1b, CL2b, CL3b, CL4b can rename as the centrage through first sensor element 99 and the respective center G of the 3rd sensor element 99b.Additionally, be arranged on the 3rd groove portion 91 at eight angles, at the corner place of first sensor element 99 and the respective outer edge 90a of the 3rd sensor element 99b, it is configured to the substantially symmetric shape relative to diagonal CLb1, CL2b, CL3b, CL4b.In addition, in physical quantity transducer 105, on the direction orthogonal with two articles of centre line C L 5b, CL6b between the diagonal CL1b being configured at first sensor element 99 and diagonal CL2b and two articles of centre line C L 7b, CL8b between being configured at the diagonal CL3b and diagonal CL4b of the 3rd sensor element 99b, it is provided with other the 3rd groove portion 91b, the 91d extended across centre line C L 5b, CL6b, CL7b, CL8b to both sides.
3rd groove portion 91 (91b, 91d) is identical with the first groove portion 92 and the second groove portion 93, for extending through the hole slot (groove) of lower surface from the upper surface of outer edge 90a.Additionally, length, width on the bearing of trend in the 3rd groove portion 91 (91b, 91d) can be both equal extent with the first groove portion 92 and the second groove portion 93, it is also possible to different.
In addition, 3rd groove portion 91 (91b, 91d) being arranged on centered by diagonal CL1b, CL2b, CL3b, CL4b or centre line C L 5b, CL6b, CL7b, CL8b+-scope of (positive and negative) about 10 degree in time, can have equal effect.
It addition, the 92, second groove portion of the first groove portion 93 and the 3rd groove portion 91 (91b, 91d) are configured to, when top view physical quantity transducer 104, the figure being made up of the 92, second groove portion of the first groove portion 93 and the 3rd groove portion 91 be 2 times rotationally symmetrical.
It addition, the 3rd groove portion 91 (91b, 91d) can also be arranged on the outer edge 90a of the second sensor element 99a.
It addition, the 3rd groove portion 91 (other the 3rd groove portion 91b, 91d) can also be formed as arc-shaped, for instance use a part etc. overlapping with the concentric circular being benchmark with the center of each sensor element.
Physical quantity transducer 105 according to this change example 10, except the effect of the physical quantity transducer 102 of aforesaid change example 7, also has following effect.
Physical quantity transducer 105 is except the first groove portion 92 and the second groove portion 93, the outer edge 90a of first sensor element 99 and the corner of the 3rd sensor element 99b is also equipped with the 3rd groove portion 91, outer edge 90a within it is also equipped with other the 3rd groove portion 91b, 91d.By the 3rd groove portion 91 (91b, 91d), it is possible to alleviate and suppress the such as thermal deformation etc. from first direction (X-direction) and second direction (Y direction) to concentrate thus producing the deformational stress in the corner (four corners) of relatively larger deformational stress efficiently.Thus, be obtained in that have stop or reduce first sensor element the 99, the 3rd sensor element 99b detection the sewing of signal, from the shield effectiveness of the externally applied noise to first sensor element the 99, the 3rd sensor element 99b, and inhibit owing to sewing vibration externally to the interference etc. of first sensor element 99, the 3rd sensor element 99b transmission, sew power and the variation of electrical characteristics that causes, physical quantity transducer 105 that electrical characteristics are more stable.
Additionally, when being arranged on the outer edge 90a of the second sensor element 99a in the 3rd groove portion 91 (91b, 91d), effect same as described above will be obtained.
Change example 11
It follows that use Fig. 9 (a) that the physical quantity transducer 106 changed involved by example 11 is illustrated.Fig. 9 (a) is for representing the top view of the summary changing the physical quantity transducer 106 involved by example 11.
The physical quantity transducer 106 involved by change example 11 shown in Fig. 9 (a) is identical with change example 6, except the first function element (first sensor element 99), it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b), the outer edge 90a in the region between each sensor element possesses the groove row 94 that the row arranged in the X-axis direction by the first groove portion 92 constitute and the groove row 95 that the row arranged in the Y-axis direction by the first groove portion 92 is constituted.
This change example 11 is different in that with changing example 6, and the first groove portion 92 changing example 11 becomes the first groove group 92 ' being arranged in the X-axis direction by the groove 9 (being three grooves 9 in this example) of multiple point-like.Therefore, in the explanation of this change example 11, the symbol identical to the structure mark identical with changing example 6 also omits the description, according to physical quantity transducer 106, it is possible to play the effect identical with the physical quantity transducer 101 of aforesaid change example 6.Additionally, the number constituting the groove 9 of the point-like of the first groove group 92 ' is unrestricted.
Change example 12
It follows that use Fig. 9 (b) that the physical quantity transducer 107 changed involved by example 12 is illustrated.Fig. 9 (b) is for representing the top view of the summary changing the physical quantity transducer 107 involved by example 12.
The physical quantity transducer 107 involved by change example 12 shown in Fig. 9 (b) is identical with change example 7, except the first function element (first sensor element 99), it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b), the outer edge 90a in the region between each sensor element possesses the first groove group 92 ' suitable with the first groove portion 92 changing example 7 and the second groove group 93 ' suitable with the second groove portion 93 changing example 7.Specifically, the outer edge 90a in the region between first sensor element 99 and the 3rd sensor element 99b is provided with the groove row 94 being made up of at the row that X-direction is alternately arranged the first groove group 92 ' and the second groove group 93 ', the outer edge 90a in the region between first sensor element 99 and the second sensor element 99a and between the 3rd sensor element 99b and the second sensor element 99a is provided with the groove row 95 that the first groove group 92 ' and the second groove group 93 ' are constituted at the row that Y direction is alternately arranged.
This change example 12 is different in that with changing example 7, and the first groove group 92 ' and the second groove group 93 ' are the structure being arranged in X-direction or Y direction by the groove 9 (being three grooves 9 in this example) of multiple point-like.Therefore, in the explanation of this change example 12, the symbol identical for the structure mark identical with changing example 7 also omits the description, according to physical quantity transducer 107, it is possible to play the effect identical with the physical quantity transducer 102 of aforesaid change example 7.
Additionally, groove 9 number constituting the point-like of the first groove group 92 ' and the second groove group 93 ' is unrestricted, it is possible to for arbitrarily individual.
Change example 13
It follows that use Fig. 9 (c) that the physical quantity transducer 108 changed involved by example 13 is illustrated.Fig. 9 (c) is for representing the top view of the summary changing the physical quantity transducer 108 involved by example 13.
The physical quantity transducer 108 involved by change example 13 shown in Fig. 9 (c) is identical with change example 8, except the first function element (first sensor element 99), it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b), and the whole region (whole face) of the outer edge 90a throughout the periphery surrounding each sensor element, and possess the first groove group 92 ' suitable with the first groove portion 92 changing example 8 and the second groove group 93 ' suitable with the second groove portion 93 changing example 8.
This change example 13 is different in that with changing example 8, and the first groove portion 92 and the second groove portion 93 that change example 13 become the first groove group 92 ' and the second groove group 93 ' being arranged in X-direction or Y direction by the groove 9 (being three grooves 9 in this example) of multiple point-like.Therefore, in the explanation of this change example 13, the symbol identical for the structure mark identical with changing example 8 also omits the description, according to physical quantity transducer 108, it is possible to play the effect identical with the physical quantity transducer 103 of aforesaid change example 8.
Additionally, groove 9 number constituting the point-like of the first groove group 92 ' and the second groove group 93 ' is unrestricted, it is possible to for arbitrarily individual.
Change example 14
It follows that use Figure 10 (a) that the physical quantity transducer 109a changed involved by example 14 is illustrated.Figure 10 (a) is for representing the top view of the summary changing the physical quantity transducer 109a involved by example 14.
The physical quantity transducer 109a involved by change example 14 shown in Figure 10 (a) is identical with change example 6, except the first function element (first sensor element 99), it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b), the outer edge 90a in the region between each sensor element possesses the groove row 94 that the row arranged in the X-axis direction by the first groove portion 92 are constituted.Additionally, physical quantity transducer 109a is characterised by, possesses the 3rd groove portion 91 on the outer edge 90a of encirclement the first function element (first sensor element 99) overlapping with the peripheral part of substrate 10 and the second function element (the second sensor element 99a, the 3rd sensor element 99b).In the explanation of this change example 14, the symbol identical for the structure mark identical with changing example 6 also omits the description.
3rd groove portion 91 is when top view physical quantity transducer 104, in the region surrounding first sensor element the 99, second sensor element 99a and the 3rd sensor element 99b, the direction orthogonal with two diagonal CL11, CL12 of the corner through outer edge 90a extends to both sides across diagonal CL11, CL12.Additionally, diagonal CL11, CL12 can rename as the centrage at the center through physical quantity transducer 109a.Additionally, the 3rd groove portion 91 is configured to the substantially symmetric shape relative to diagonal CL11, CL12.3rd groove portion 91 and the first groove portion 92 are identical, for extending through the hole slot (groove) of lower surface from the upper surface of outer edge 90a.Additionally, length, width on the bearing of trend in the 3rd groove portion 91 can be both equal extent with the first groove portion 92, it is also possible to different.
Additionally, the 3rd groove portion 91 being arranged on centered by diagonal CL11, CL12+-scope of (positive and negative) about 10 degree in time, can have equal effect.
It addition, the first groove portion 92 and the 3rd groove portion 91 are configured to, when top view physical quantity transducer 109a, the figure being made up of the first groove portion 92 and the 3rd groove portion 91 be 2 times rotationally symmetrical.
It addition, the 3rd groove portion 91 such as can also be formed as arc-shaped, for instance use a part etc. overlapping with the concentric circular being benchmark with the center of physical quantity transducer 109a.
It addition, the first groove portion 92 and the 3rd groove portion 91 can also be arranged the structure of configuration for groove.
Physical quantity transducer 109a according to this change example 14, except the effect of the physical quantity transducer 101 of aforesaid change example 6, also has following effect.
Physical quantity transducer 109a possesses the 3rd groove portion 91 in the corner of the outer edge 90a overlapping with the peripheral part of substrate 10.By the 3rd groove portion 91, it is possible to alleviate and suppress the such as thermal deformation etc. from first direction (X-direction) and second direction (Y direction) to concentrate thus producing the deformational stress in the corner (four corners) of relatively larger deformational stress efficiently.
The distance at the center from physical quantity transducer 109a, the corner (corner) of the outer edge 90a that the peripheral part with substrate 10 owing to being provided with diagonal CL11, CL12 is overlapping is relatively big, the deformation (warpage) that therefore produces due to thermal expansion etc., due to substrate 10 bigger with the deformation (stress) of the difference of the thermal expansion of outer edge 90a generation.It addition, on the corner (corner) of outer edge 90a, be applied with deformation (stress) from first direction (X-direction) and second direction (Y direction) twocouese.To this, owing to the 3rd groove portion 91 is arranged on the direction orthogonal with diagonal, therefore, it is possible to dispersion and alleviate efficiently, suppress the deformation (stress) that applies from first direction (X-direction) and second direction (Y direction).
Thus, there is the shield effectiveness sewing, being applied to from substrate 10 side the noise of first sensor element the 99, second sensor element 99a and the 3rd sensor element 99b of the signal stopping or reducing first sensor element the 99, second sensor element 99a and the 3rd sensor element 99b detection.Inhibit owing to the interference etc. transmitted externally to first sensor element the 99, second sensor element 99a and the 3rd sensor element 99b is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer 109a that electrical characteristics are more stable thereby, it is possible to obtain.
Change example 15
It follows that use Figure 10 (b) that the physical quantity transducer 109b changed involved by example 15 is illustrated.Figure 10 (b) is for representing the top view of the summary changing the physical quantity transducer 109b involved by example 15.
The physical quantity transducer 109b changing example 15 is identical with change example 7, except the first function element (first sensor element 99), it is also equipped with the second function element (the second sensor element 99a, the 3rd sensor element 99b), the outer edge 90a between each sensor element possesses the first groove portion 92 and the second groove portion 93.Additionally, physical quantity transducer 109b is characterised by, possess the 3rd groove portion 91 in the corner of the outer edge 90a overlapping with the peripheral part of substrate 10, in the region of the outer edge 90a of periphery, possess the 92, second groove portion 93 of the first groove portion and other the 3rd groove portion 91a, 91b, 91c, 91d outside.Such physical quantity transducer 109b is characterised by, on the outer edge 90a overlapping with the peripheral part of substrate 10, possesses each groove portion in the way of surrounding first sensor element the 99, second sensor element 99a and the 3rd sensor element 99b.In the explanation of this change example 15, for the symbol that the structure mark that the first groove portion 92 arranged on the outer edge 90a in the region between first sensor element 99 and the 3rd sensor element 99b and the second groove portion 93 etc. are identical with changing example 7 is identical, and omit the description.
It is arranged on the 3rd groove portion 91 of corner of the outer edge 90a overlapping with the peripheral part of substrate 10 when top view physical quantity transducer 104, in the region surrounding first sensor element the 99, second sensor element 99a and the 3rd sensor element 99b, the direction orthogonal with two diagonal CL11, CL12 of the corner through physical quantity transducer 109b extends to both sides across diagonal CL11, CL12.Additionally, it is arranged on other the 3rd groove portion 91a, 91b, 91c, 91d on the outer edge 90a overlapping with the peripheral part of substrate 10 on the direction orthogonal with the centre line C L 13 being arranged between diagonal CL11 with diagonal CL12, CL15, CL16, CL18, extend to both sides across centre line C L 13, CL15, CL16, CL18, and be each provided with a pair other the 3rd groove portion 91a, 91b, 91c, 91d.It addition, on the outer edge 90a that diagonal CL11 is overlapping with the peripheral part with substrate 10 on the centre line C L 14 of diagonal CL12 decile, CL17, be provided with the first groove portion 92 or the second groove portion 93.
3rd groove portion 91, other the 3rd groove portion 91a, 91b, 91c, 91d and the first groove portion 92 and the second groove portion 93 are identical, for extending through the hole slot (groove) of lower surface from the upper surface of outer edge 90a.Additionally, the 3rd groove portion 91, other the 3rd groove portion 91a, 91b, 91c, 91d bearing of trend on length, width can be both equal extent with the first groove portion 92 or the second groove portion 93, it is also possible to different.
In addition, 3rd groove portion 91, other the 3rd groove portion 91a, 91b, 91c, 91d being arranged on centered by diagonal CL11, CL12 or centre line C L 13, CL15, CL16, CL18+-scope of (positive and negative) about 10 degree in time, can have equal effect.
It addition, the 92, second groove portion of the first groove portion 93 and the 3rd groove portion 91 (other the 3rd groove portion 91a, 91b, 91c, 91d) are configured to, when top view physical quantity transducer 109b, the figure being made up of these groove portions be 2 times rotationally symmetrical.
Additionally, it is arranged on the 92, the second groove portion of the first groove portion 93 on the outer edge 90a overlapping with substrate 10 and the 3rd groove portion 91 (other the 3rd groove portion 91a, 91b, 91c, 91d) can also be formed as arc-shaped, for instance use a part etc. overlapping with the concentric circular being benchmark with the center of physical quantity transducer 109b.
It addition, the 92, second groove portion of the first groove portion 93 and the 3rd groove portion 91 (other the 3rd groove portion 91a, 91b, 91c, 91d) can also be arranged the structure of configuration as changed example 10 for groove.
Physical quantity transducer 109b according to this change example 15, except the effect of the physical quantity transducer 102 of aforesaid change example 7, also has following effect.
Physical quantity transducer 109b possesses the 3rd groove portion 91 in the corner of the outer edge 90a overlapping with the peripheral part of substrate 10, and the region of the outer edge 90a of periphery possesses the 92, second groove portion 93 of the first groove portion and other the 3rd groove portion 91a, 91b, 91c, 91d outside.By like this on the outer edge 90a overlapping with the peripheral part of substrate 10 to surround first sensor element 99, the mode of the second sensor element 99a and the 3rd sensor element 99b and each groove portion is set, it is thus possible to alleviate efficiently and suppress from first direction (X-direction) and second direction (Y direction) subjected to stress, such as the thermal deformation of the outer edge 90a of substrate 10 and each sensor element etc. are concentrated thus being subject to the corner (four corners) of the substrate 10 of relatively larger deformational stress, i.e. first sensor element 99, the deformational stress of the outer edge 90a of the second sensor element 99a and the 3rd sensor element 99b.Thereby, it is possible to obtain the shield effectiveness sewing, being applied to from substrate 10 side the noise of first sensor element the 99, second sensor element 99a and the 3rd sensor element 99b with the signal stopping or reducing first sensor element the 99, second sensor element 99a and the 3rd sensor element 99b detection.Inhibit owing to the interference etc. transmitted externally to first sensor element the 99, second sensor element 99a and the 3rd sensor element 99b is sewed vibration, sewed power and the variation of electrical characteristics that causes, physical quantity transducer 109b that electrical characteristics are more stable thereby, it is possible to obtain.
In addition, although in above-mentioned change example 6～15, it is illustrated with the structure of the first function element (first sensor element 99) possessed in the structure of sensor part illustrated by embodiment 2 and the second function element (the second sensor element 99a, the 3rd sensor element 99b) increased on the basis of this first function element, but is not limited thereto.The structure of sensor part can also adopt the function element replacing embodiment 2, then possesses in embodiment 1 illustrated the first function element (first sensor element 98) and the structure of the second function element (the second sensor element 98a, the 3rd sensor element 98b) increased on the basis of this first function element.Specifically, it is possible to first sensor element 99 is replaced with first sensor element 98, the second sensor element 99a is replaced with the second sensor element 98a, the 3rd sensor element 99b is replaced with the 3rd sensor element 98b.
Additionally, although in embodiment 1 and embodiment 2, to the second groove portion 93 between the first groove portion 92 substantially to configure at equal intervals or on the side in the first groove portion 92, situation about being configured at substantially equal intervals in the way of alternately arranged with the first groove portion 92 is illustrated, but is not necessarily to alternately arranged to the first groove portion 92 and the second groove portion 93.It addition, be also not necessarily intended to, they are configured at equal intervals.It is preferably, the configuration of the top view shape of outer edge, size or the sensor element that are configured according to the 92, second groove portion 93 of the first groove portion, the effect alleviated towards, the stress that supposes, and is properly carried out layout.
It addition, sensor element is not necessarily limited to the sensor of above-mentioned structure.Structure as physical quantity transducer, it can be the structure of the layer that stacking constitutes sensor element and outer edge on the interarea of substrate, if the thermal stress produced for the difference due to the thermal coefficient of expansion of outer edge and substrate, via be configured between sensor element outer edge transmission stress the detection characteristic of sensor element is impacted when structure, just can obtain identical effect.
Embodiment 3
Figure 11 is the sectional view representing the physical quantity transducer 110 involved by embodiment 3, and is the sectional view of the position suitable with the section B-B in Fig. 4 (a).Although additionally, in embodiment 2, for the 92, the second groove portion of the first groove portion 93 or the 3rd groove portion 91 for alleviating stress is illustrated when being arranged on the outer edge on the interarea of substrate 10 but it also may these grooves are arranged on substrate 10.Additionally, in present embodiment 3, the structure to be not provided with the 3rd groove portion 91 illustrates.
Physical quantity transducer 110 does not arrange the 92, second groove portion 93 of the first groove portion on outer edge 90.Replace, the 3rd groove the 96, the 4th groove 97 is set on the substrate 10.In addition, physical quantity transducer 110 is identical with the physical quantity transducer 100 of embodiment 2.Additionally, the 3rd groove 96 and the first groove portion are suitable, the 4th groove 97 and the second groove portion are suitable.
3rd groove 96 is the hole slot that the interarea from substrate 10 extends through lower surface, when top view substrate 10, is configured in the position identical with the first groove portion 92 of physical quantity transducer 100.It addition, the 4th groove 97 is the hole slot that the interarea from substrate 10 extends through lower surface too, when top view substrate 10, it is configured in the position identical with the second groove portion 93 of physical quantity transducer 100.In other words, the 3rd groove the 96, the 4th groove 97 is all arranged in the region overlapping with outer edge 90.
Physical quantity transducer 110 according to present embodiment, substrate 10 has the 3rd groove 96 extended in a first direction and at fourth groove 97 upwardly extending with the second party that first direction intersects in the region overlapping with outer edge 90.Therefore, when substrate 10 has the thermal coefficient of expansion different from the thermal coefficient of expansion of outer edge 90, produced thermal stress is alleviated at least through the arbitrary groove in these grooves.Its result is, the thermal stress produced due to the difference of thermal coefficient of expansion is inhibited to cause first sensor element 99 to deform, or the situation that the displacement of the movable part (movable electrode 50) that first sensor element 99 possessed impacts, thus inhibit the variations in temperature of the environment used due to first sensor element 99 and the variation of detection characteristic that causes.
In other words, even if when arranging the groove alleviating stress on the substrate 10 as in the present embodiment, it is also possible to the variations in temperature of environment inhibited owing to using is provided and the variation of detection characteristic that causes, detect the physical quantity transducer 110 that characteristic is more stable.
Additionally, by as the manner, 3rd groove 96 and the 4th groove 97 are arranged on substrate 10, from without edge 90 outside arranges the 92, second groove portion of the first groove portion 93 or the 3rd groove portion 91, or the area that groove portion occupies on outer edge 90 can be reduced, therefore, it is possible to obtain the effect as bucking electrode of bigger outer edge 90.
Additionally, the invention is not limited in above-mentioned embodiment and change example, it is possible to above-mentioned embodiment and change example in addition various changes, improvement etc..Hereinafter, other change example is entered narration.Herein, identical symbol is used for the structure position identical with above-mentioned embodiment and change example, and the repetitive description thereof will be omitted.
Other change example
It follows that other change example of the configuration in the first groove portion and the second groove portion is illustrated.Additionally, when illustrating, use identical symbol for the structure position identical with above-mentioned embodiment, and the repetitive description thereof will be omitted.Figure 12 (a) is for representing the top view of the change example 16 in the first groove portion and the second groove portion, and Figure 12 (b) is the top view of the change example 17 representing the first groove portion and the second groove portion.Additionally, change example 16 and change example 17 are distinctive in that with the structure shown in aforesaid embodiment 2, the arrangement in the first groove portion 92 and the second groove portion 93 is different.
Change example 16
The physical quantity transducer 110 of the change example 16 shown in Figure 12 (a) is identical with embodiment 2, and the outer edge 90a in the region between first sensor element 99 and the 3rd sensor element 99b is provided with the groove row 94 being made up of at the row that X-direction arranges the first groove portion 92 and the second groove portion 93.It addition, the outer edge 90a in region between first sensor element 99 and the second sensor element 99a and between the 3rd sensor element 99b and the second sensor element 99a is provided with the groove row 95 being made up of the row that the first groove portion 92 and the second groove portion 93 are alternately arranged in the Y-axis direction.The first groove portion 92 in groove row 94 and in the arrangement in the second groove portion 93, the groove group 85 configuring the second groove portion 93a and the second groove portion 93b across the first groove portion 92 arranges in the X-axis direction.It addition, in the arrangement in the first groove portion 92 in groove row 95 and the second groove portion 93, the groove group 86 configuring the first groove portion 92a and the first groove portion 92b across the second groove portion 93 arranges in the Y-axis direction.
Change example 17
The physical quantity transducer 111 of the change example 17 shown in Figure 12 (b) is identical with embodiment 2, and the outer edge 90a in the region between first sensor element 99 and the 3rd sensor element 99b is provided with the groove row 94 being made up of at the row that X-direction arranges the first groove portion 92 and the second groove portion 93.It addition, the outer edge 90a in region between first sensor element 99 and the second sensor element 99a and between the 3rd sensor element 99b and the second sensor element 99a is provided with the groove row 95 being made up of the row that the first groove portion 92 and the second groove portion 93 are alternately arranged in the Y-axis direction.In groove row 94 and groove row 95, it is arranged with the first groove portion 92 and the shape that the second groove portion 93 intersects, so-called criss-cross groove group 87 in substantial middle.Change in groove row 94 and the groove row 95 of example 17, should arrange in X-direction and Y direction in criss-cross groove group 87.
In the first groove portion 92 changing example 16 and the change such arrangement of example 17 described above and the second groove portion 93, identical with embodiment 2, when outer edge 90a has the thermal coefficient of expansion different from the thermal coefficient of expansion of substrate 10, produced thermal stress is alleviated at least through the arbitrary groove portion in these the first groove portions 92 and the second groove portion 93.It addition, first groove portion 92 and the second groove portion 93 of first sensor element (the first function element) 99, outer edge 90a, outer edge 90a can easily be formed in same operation.In other words, it is possible to be readily formed and provide the variations in temperature of environment inhibited owing to using and the variation of detection characteristic that causes, detect the physical quantity transducer that characteristic is more stable.
In addition, although in above-mentioned change example 16 and change example 17, it is illustrated with the structure of the first function element (first sensor element 99) possessed in the structure of sensor part illustrated by embodiment 2 and the second function element (the second sensor element 99a, the 3rd sensor element 99b) increased on the basis of this first function element, but is not limited thereto.The structure of sensor part can also adopt the function element replacing embodiment 2, then possesses in embodiment 1 illustrated the first function element (first sensor element 98) and the structure of the second function element (the second sensor element 98a, the 3rd sensor element 98b) increased on the basis of this first function element.Specifically, it is possible to first sensor element 99 is replaced with first sensor element 98, the second sensor element 99a is replaced with the second sensor element 98a, the 3rd sensor element 99b is replaced with the 3rd sensor element 98b.
It addition, the first illustrated groove portion 92 and the second groove portion 93 can also be arranged the structure of configuration as changed example 11 for groove 9 in above-mentioned change example 16 and change example 17.
Additionally, although in above-mentioned embodiment 1～3, it is illustrated to be provided with the structure of groove row 94 and groove row 95 both sides, but is not necessarily intended to and groove row 94 and groove row 95 both sides are set, only groove need to be set in the region needing to alleviate the stress produced each other at sensor element and arrange.
It addition, outer edge 90 can not also surround sensor element 99 throughout complete cycle.That is, as long as effect at least some of of the present invention can be played, then a part for outer edge 90 can also be opened.
Although it addition, in above-mentioned embodiment 1～3, direction of displacement that is X-direction with first direction for movable part (movable electrode 50) and be illustrated, but be not limited thereto.Such as, it is also possible to Y direction is set to first direction, and X-direction is set to second direction.
Although it addition, in embodiment 1～3, for the 92, second groove portion of the first groove portion 93 and the 3rd groove portion 91 be the upper surface from outer edge 90,90a extend through lower surface hole slot in the case of be illustrated, but be not necessarily to run through.In other words, the 92, second groove portion 93 of the first groove portion and the 3rd groove portion 91 all or wherein one can think the groove not through outer edge 90,90a with bottom.It addition, both may be at lower face side (substrate 10 side) bottom this, it is also possible to be in upper surface side on the contrary mutually.
Electronic equipment
It follows that the electronic equipment applying the physical quantity transducer 100 as the electronic installation involved by an embodiment of the invention is illustrated based on Figure 13 (a), Figure 13 (b), Figure 14.Although additionally, in the following description, the example to apply physical quantity transducer 100 illustrates but it also may for physical quantity transducer 1,101～108,109a, 109b, 110,111.
Figure 13 (a) is for representing the axonometric chart of the summary of the structure of the personal computer of the movable type as electronic equipment (or notebook type) possessing the electronic installation involved by an embodiment of the invention.In the figure, personal computer 1100 is by the main part 1404 possessing keyboard 1102 and possesses the display unit 1106 of display part 1000 and constitutes, display unit 1106 via articulated structure portion can be supported by the way of rotating relative to main part 1104.In such personal computer 1100 built-in as wave filter, resonator, reference clock etc. the physical quantity transducer 100 of an example as electronic installation of function.
Figure 13 (b) is for representing the axonometric chart of the summary of the structure of the mobile phone as electronic equipment (also including PHS:PersonalHandy-phoneSystem, personal handhold telephone system) possessing the electronic installation involved by an embodiment of the invention.In the figure, mobile phone 1200 possesses multiple operation button 1202, receiver 1204 and microphone 1206, is configured with display part 1000 between operation button 1202 and receiver 1204.Such mobile phone 1200 is built-in with as wave filter, resonator, reference clock etc. the physical quantity transducer 100 of an example as electronic installation of function.
Figure 14 is the axonometric chart of the summary of the structure representing the digital camera as electronic equipment possessing the electronic installation involved by an embodiment of the invention.Additionally, in the figure, the connection between external equipment is also shown simply.The optical imagery of subject is carried out opto-electronic conversion by imaging apparatuss such as CCD (ChargeCoupledDevice, charge coupled device) and is generated image pickup signal (picture signal) by digital camera 1300.
The back side of the housing (main body) 1302 of digital camera 1300 is provided with display part 1000, and becoming the structure displayed based on the image pickup signal generated by CCD, display part 1000 is as subject being shown as the view finder of electronic image and function.It addition, the face side (in figure rear side) at housing 1302 is provided with the light receiving unit 1304 including optical lens (image pickup optical system), CCD etc..
Photographer, the shot object image being shown in display part 1000 is confirmed, and when pressing shutter release button 1306, the image pickup signal of the CCD of this time point will be transmitted to memorizer 1308 and store.It addition, in digital camera 1300, the side of housing 1302 is provided with the input and output terminal 1314 of signal of video signal lead-out terminal 1312 and data communication.Additionally, as it can be seen, as required, and on signal of video signal lead-out terminal 1312, it is connected to imaging monitoring device 1430, the input and output terminal 1314 of data communication is connected to personal computer 1440.And, become the structure being made the image pickup signal being stored in memorizer 1308 export by predetermined operation to imaging monitoring device 1430, personal computer 1440.Such digital camera 1300 is built-in with as wave filter, resonator, angular transducer etc. the physical sensors 100 of an example as electronic installation of function.
As it has been described above, as electronic equipment, by possessing the physical quantity transducer 100 of the decline that further suppress accuracy of detection such that it is able to provide the electronic equipment that operation precision is higher.
nullIn addition，Physical quantity transducer 100 involved by an embodiment of the invention is except being applied to the personal computer (mobile personal computer) of Figure 13 (a)、The mobile phone of Figure 13 (b)、Outside in the digital camera of Figure 14，Can also be applied to such as，Ink jet type blowoff (such as ink-jet printer)、Laptop PC、Television set、Video camera、Vehicle navigation apparatus、Pager、Electronic notebook (also includes the product being accompanied with communication function)、Electronic dictionary、Electronic calculator、Electronic game station、Word processor、Work station、Videophone、Tamper-proof video-frequency monitor、Electronics binoculars、POS (PointofSale: point of sale) terminal、Armarium (such as electronic clinical thermometer、Sphygomanometer、Blood-glucose meter、Electrocardiogram measuring device、Diagnostic ultrasound equipment、Video endoscope)、Fish finder、Various measurement devices、Metrical instrument class is (such as，Vehicle、Airborne vehicle、The metrical instrument class of boats and ships)、In the electronic equipments such as aviation simulator.
Moving body
It follows that the moving body based on the Figure 15 physical quantity transducer 100 to applying involved by an embodiment of the invention illustrates.Although additionally, in the following description, the example to apply the situation of physical quantity transducer 100 is illustrated but it also may for physical quantity transducer 1,101～108,109a, 109b, 110,111.
Figure 15 is the axonometric chart schematically showing the automobile 1400 as moving body possessing physical quantity transducer 100.Automobile 1400 is equipped with the physical quantity transducer 100 including the present invention and the gyro sensor constituted.Such as, as shown in the drawing, the electronic control unit 1402 being equipped with built-in to this gyro sensor that tire 1401 is controlled in as the automobile 1400 of moving body.Additionally, as other example, physical quantity transducer 100 can be widely used in the electronic control unit (ECU:electroniccontrolunit) of keyless access system, anti-theft locking system of engine, auto-navigation system, vehicle air conditioner, anti-lock braking system (ABS), air bag, system for monitoring pressure in tyre (TPMS:TirePressureMonitoringSystem), engine control system, hybrid vehicle or the battery monitor of electric automobile, attitude of bodywork control system etc..
As it has been described above, as moving body, further suppress, by possessing, the physical quantity transducer 100 that precision reduces such that it is able to provide the moving body that the environmental characteristicses such as variations in temperature are more stable.
Symbol description
1,100～108,109a, 109b, 110,111 ... as the physical quantity transducer of electronic installation；3 ... as the substrate of engaging member；10 ... substrate；20 ... sensing detection portion；30 ... wiring；31a, 31b, 31c ... electrode；40 ... function element substrate；41,42 ... fixed part；50 ... movable electrode；51,52 ... support；53,54 ... movable electrode refers to；55 ... movable base portion；60 ... fixed electrode；61,62 ... fixed electrode refers to；70 ... depressed part；71 ... recess；81 ... contact portion；85,86,87 ... groove group；90,90a ... outer edge；91,91a, 91b, 91c, 91d, 91e ... the 3rd groove portion；92,92a, 92b ... the first groove portion；93,93a, 93b ... the second groove portion；94,95 ... groove arranges；96 ... the 3rd groove；97 ... the 4th groove；98,99 ... as the first sensor element of the first function element；98a, 99a ... as the second sensor element of the second function element；98b, 99b ... as the 3rd sensor element of the second function element.
Claims (27)
1. an electronic installation, it is characterised in that possess:
First function element；And
Outer edge, its at least some of of periphery being configured in described first function element locates,
When outer edge described in top view, described outer edge is provided with groove and extends in a first direction or the first groove portion to be arranged in the way of described first direction.
2. electronic installation as claimed in claim 1, it is characterised in that
When outer edge described in top view, described outer edge is provided with described groove and upwardly extends or the second groove portion to be arranged in the way of described second direction in the second party intersected with described first direction.
3. electronic installation as claimed in claim 2, it is characterised in that
Described first groove portion and described second groove portion are arranged at least side of the periphery being configured at described first function element.
4. electronic installation as claimed in claim 1, it is characterised in that
When outer edge described in top view, described outer edge is provided with the 3rd groove portion that described groove upwardly extends in the side orthogonal with the centrage at the center through described first function element or is arranged.
5. electronic installation as claimed in claim 4, it is characterised in that
Described outer edge is rectangular shape,
In described 3rd groove portion, described groove upwardly extends in the side orthogonal with the cornerwise described centrage as described outer edge or is arranged.
6. electronic installation as claimed in claim 1, it is characterised in that
Described first function element possesses:
Fixed part；
Support, it extends from described fixed part；And
Movable part, its by described support can be supported by the way of displacement.
7. electronic installation as claimed in claim 5, it is characterised in that
Possess the second function element,
At least one in described first groove portion, described second groove portion and described 3rd groove portion is arranged between described first function element and described second function element.
8. an electronic installation, it is characterised in that possess:
First function element；
Outer edge, its at least some of of periphery being configured in described first function element locates；And
Substrate,
Described first function element is arranged on the interarea of described substrate,
When substrate described in top view, at least one party in the region overlapping with described outer edge of described outer edge and described substrate is provided with at least one in the first groove portion, the second groove portion and the 3rd groove portion,
In described first groove portion, groove extends in a first direction or is arranged,
In described second groove portion, described groove upwardly extends in the second party intersected with described first direction or is arranged,
In described 3rd groove portion, described groove upwardly extends in the side orthogonal with the centrage at the center through described first function element or is arranged.
9. electronic installation as claimed in claim 8, it is characterised in that
Described first function element possesses:
Fixed part；
Support, it extends from described fixed part；And
Movable part, its by described support can be supported by the way of displacement.
10. electronic installation as claimed in claim 8, it is characterised in that
Described fixed part is fixed on the interarea of described substrate,
Described movable part by described support to separate from described substrate and can be supported by the way of displacement.
11. electronic installation as claimed in claim 8, it is characterised in that
The interarea of described substrate is provided with described second function element,
At least one in described first groove portion, described second groove portion and described 3rd groove portion is arranged between described first function element and described second function element.
12. electronic installation as claimed in claim 1, it is characterised in that
Described first function element and described outer edge are identical material.
13. electronic installation as claimed in claim 6, it is characterised in that
The direction of displacement of described movable part when described first direction is the first function element described in top view.
14. electronic installation as claimed in claim 1, it is characterised in that
When the first function element described in top view, the figure being made up of described first groove portion, described second groove portion and described 3rd groove portion is to configure in rotational symmetric mode.
15. electronic installation as claimed in claim 1, it is characterised in that
At least one in described first groove portion, described second groove portion and described 3rd groove portion, on the thickness direction of described first function element, runs through described outer edge or described substrate.
16. electronic installation as claimed in claim 1, it is characterised in that
Described outer edge is fixed potential.
17. electronic installation as claimed in claim 1, it is characterised in that
Described groove portion is the groove group comprising multiple described groove.
18. the manufacture method of an electronic installation, it is characterised in that including:
Substrate is formed the operation of depressed part；
Function element substrate in the way of opposed with described depressed part and is engaged operation on the substrate；
Described function element substrate is carried out pattern and forms processing, thus forming function element, outer edge, and on described outer edge, form the first groove portion and the operation in the second groove portion, in described first groove portion, groove extends in a first direction or is arranged, in described second groove portion, described groove upwardly extends in the second party intersected with described first direction or is arranged.
19. a physical quantity transducer, it is characterised in that possess:
First sensor element；And
Outer edge, its at least some of of periphery being configured in described first sensor element locates,
When outer edge described in top view, described outer edge is provided with groove and extends in a first direction or the first groove portion to be arranged in the way of described first direction.
20. physical quantity transducer as claimed in claim 19, it is characterised in that
When outer edge described in top view, described outer edge is provided with described groove and upwardly extends or the second groove portion to be arranged in the way of described second direction in the second party intersected with described first direction.
21. physical quantity transducer as claimed in claim 20, it is characterised in that
Described first groove portion and described second groove portion are arranged at least side of the periphery being configured at described first sensor element.
22. the physical quantity transducer as described in claim 20 or 21, it is characterised in that
When outer edge described in top view, described outer edge is provided with the 3rd groove portion that described groove upwardly extends in the side orthogonal with the centrage at the center through described first sensor element or is arranged.
23. physical quantity transducer as claimed in claim 19, it is characterised in that
Described groove portion is the groove group comprising multiple described groove.
24. a physical quantity transducer, it is characterised in that possess:
First sensor element；
Outer edge, its at least some of of periphery being configured in described first sensor element locates；And
Substrate,
Described first sensor element is arranged on the interarea of described substrate,
When substrate described in top view, at least one party in the region overlapping with described outer edge of described outer edge and described substrate is provided with at least one in the first groove portion, the second groove portion and the 3rd groove portion,
In described first groove portion, groove extends in a first direction or is arranged,
In described second groove portion, described groove upwardly extends in the second party intersected with described first direction or is arranged,
In described 3rd groove portion, described groove upwardly extends in the side orthogonal with the centrage at the center through described first sensor element or is arranged.
25. physical quantity transducer as claimed in claim 24, it is characterised in that
Possess the second sensor element on the interarea being arranged at described substrate,
At least one in described first groove portion, described second groove portion and described 3rd groove portion is arranged between described first sensor element and described second sensor element.
26. an electronic equipment, it is characterised in that
Possesses the electronic installation described in claim 1.
27. a moving body, it is characterised in that
Possesses the electronic installation described in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910027541.6A CN110058050A (en) | 2015-01-06 | 2015-12-29 | Electronic device, electronic equipment and moving body |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-000681 | 2015-01-06 | ||
| JP2015000681A JP6476869B2 (en) | 2015-01-06 | 2015-01-06 | Electronic devices, electronic devices, and moving objects |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910027541.6A Division CN110058050A (en) | 2015-01-06 | 2015-12-29 | Electronic device, electronic equipment and moving body |
Publications (2)
| Publication Number | Publication Date |
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| CN105776120A true CN105776120A (en) | 2016-07-20 |
| CN105776120B CN105776120B (en) | 2019-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910027541.6A Pending CN110058050A (en) | 2015-01-06 | 2015-12-29 | Electronic device, electronic equipment and moving body |
| CN201511019808.5A Expired - Fee Related CN105776120B (en) | 2015-01-06 | 2015-12-29 | The manufacturing method of electronic device, electronic device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910027541.6A Pending CN110058050A (en) | 2015-01-06 | 2015-12-29 | Electronic device, electronic equipment and moving body |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10408856B2 (en) |
| JP (1) | JP6476869B2 (en) |
| CN (2) | CN110058050A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109387191A (en) * | 2018-09-28 | 2019-02-26 | 清华大学 | A kind of high-temperature adaptability MEMS planar resonant gyroscope structure |
| CN111417594A (en) * | 2017-11-30 | 2020-07-14 | 应美盛股份有限公司 | Asymmetric plane external accelerometer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6572603B2 (en) * | 2015-04-13 | 2019-09-11 | セイコーエプソン株式会社 | Physical quantity sensor, electronic device and mobile object |
| WO2017069939A1 (en) * | 2015-10-20 | 2017-04-27 | Carrier Corporation | Biodegradable parameter monitor |
| US10595951B2 (en) * | 2016-08-15 | 2020-03-24 | Covidien Lp | Force sensor for surgical devices |
| JP6816603B2 (en) * | 2017-03-27 | 2021-01-20 | セイコーエプソン株式会社 | Physical quantity sensors, electronics, and mobiles |
| JP6943122B2 (en) * | 2017-09-29 | 2021-09-29 | セイコーエプソン株式会社 | Physical quantity sensor, inertial measurement unit, mobile positioning device, electronic device and mobile |
| WO2020213213A1 (en) * | 2019-04-18 | 2020-10-22 | 株式会社村田製作所 | Resonance device and method for manufacturing resonance device |
| CN116134625A (en) | 2020-07-21 | 2023-05-16 | 株式会社村田制作所 | Pressure sensor structure, pressure sensor device, and method for manufacturing pressure sensor structure |
| US11490186B2 (en) | 2020-08-31 | 2022-11-01 | Invensense, Inc. | Edge patterns of microelectromechanical systems (MEMS) microphone backplate holes |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000187040A (en) * | 1998-12-22 | 2000-07-04 | Matsushita Electric Works Ltd | Acceleration sensor and its manufacture |
| CN1656382A (en) * | 2001-05-15 | 2005-08-17 | 霍尼韦尔国际公司 | Accelerometer strain isolator |
| US20080236292A1 (en) * | 2007-03-30 | 2008-10-02 | Elmos Advanced Packaging B.V. | Sensor element and sensor assembly provided with a casing |
| CN101545919A (en) * | 2008-03-28 | 2009-09-30 | Oki半导体株式会社 | Acceleration sensor configuration and its manufacturing method |
| CN101611337A (en) * | 2007-01-26 | 2009-12-23 | 松下电工株式会社 | Optical scanning mirror, semiconductor structure and manufacture method thereof |
| US20100064808A1 (en) * | 2008-09-18 | 2010-03-18 | Rohm Co., Ltd. | Acceleration sensor and method of manufacturing acceleration sensor |
| CN102998479A (en) * | 2012-12-31 | 2013-03-27 | 哈尔滨理工大学 | Two-dimensional wind speed and wind direction sensor of aluminum nitride based integrated array structure and manufacture method of sensor |
| CN103534195A (en) * | 2011-04-14 | 2014-01-22 | 罗伯特·博世有限公司 | Method of forming membranes with modified stress characteristics |
| CN104280051A (en) * | 2013-07-09 | 2015-01-14 | 精工爱普生株式会社 | Electronic device, method of manufacturing electronic device, physical quantity sensor, electronic apparatus, moving object |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3430771B2 (en) | 1996-02-05 | 2003-07-28 | 株式会社デンソー | Method of manufacturing semiconductor dynamic quantity sensor |
| JP4003326B2 (en) | 1998-02-12 | 2007-11-07 | 株式会社デンソー | Semiconductor dynamic quantity sensor and manufacturing method thereof |
| JP4665942B2 (en) * | 1998-02-12 | 2011-04-06 | 株式会社デンソー | Semiconductor dynamic quantity sensor |
| US6257060B1 (en) * | 1999-06-22 | 2001-07-10 | Alliedsignal Inc. | Combined enhanced shock load capability and stress isolation structure for an improved performance silicon micro-machined accelerometer |
| US7251520B2 (en) * | 2003-07-08 | 2007-07-31 | General Electric Company | Method and apparatus of slice selective magnetization preparation for moving table MRI |
| US8250921B2 (en) * | 2007-07-06 | 2012-08-28 | Invensense, Inc. | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics |
| JP2008185369A (en) | 2007-01-26 | 2008-08-14 | Sony Corp | Angular velocity sensor, its manufacturing method, electronic apparatus, and circuit board |
| JP4957414B2 (en) * | 2007-07-04 | 2012-06-20 | 株式会社デンソー | Capacitive semiconductor acceleration sensor |
| JP5076986B2 (en) | 2008-03-14 | 2012-11-21 | 株式会社デンソー | Capacitive physical quantity sensor |
| US8468887B2 (en) * | 2008-04-14 | 2013-06-25 | Freescale Semiconductor, Inc. | Resonant accelerometer with low sensitivity to package stress |
| US8256290B2 (en) * | 2009-03-17 | 2012-09-04 | Minyao Mao | Tri-axis angular rate sensor |
| JP5652775B2 (en) | 2009-05-29 | 2015-01-14 | トレックス・セミコンダクター株式会社 | Acceleration sensor element and acceleration sensor having the same |
| US8584522B2 (en) | 2010-04-30 | 2013-11-19 | Qualcomm Mems Technologies, Inc. | Micromachined piezoelectric x-axis gyroscope |
| JP2013062339A (en) * | 2011-09-13 | 2013-04-04 | Seiko Epson Corp | Composite substrate, electronic device, and electronic apparatus |
| JP5477434B2 (en) | 2012-08-23 | 2014-04-23 | 株式会社デンソー | Capacitive physical quantity sensor |
| JP2014107433A (en) * | 2012-11-28 | 2014-06-09 | Ibiden Co Ltd | Multiple piece forming substrate |
| JP2015206746A (en) * | 2014-04-23 | 2015-11-19 | セイコーエプソン株式会社 | Electronic device, method for manufacturing electronic device, physical quantity sensor, electronic equipment, and mobile object |
-
2015
- 2015-01-06 JP JP2015000681A patent/JP6476869B2/en not_active Expired - Fee Related
- 2015-12-29 CN CN201910027541.6A patent/CN110058050A/en active Pending
- 2015-12-29 CN CN201511019808.5A patent/CN105776120B/en not_active Expired - Fee Related
-
2016
- 2016-01-04 US US14/987,186 patent/US10408856B2/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000187040A (en) * | 1998-12-22 | 2000-07-04 | Matsushita Electric Works Ltd | Acceleration sensor and its manufacture |
| CN1656382A (en) * | 2001-05-15 | 2005-08-17 | 霍尼韦尔国际公司 | Accelerometer strain isolator |
| CN101611337A (en) * | 2007-01-26 | 2009-12-23 | 松下电工株式会社 | Optical scanning mirror, semiconductor structure and manufacture method thereof |
| US20080236292A1 (en) * | 2007-03-30 | 2008-10-02 | Elmos Advanced Packaging B.V. | Sensor element and sensor assembly provided with a casing |
| CN101545919A (en) * | 2008-03-28 | 2009-09-30 | Oki半导体株式会社 | Acceleration sensor configuration and its manufacturing method |
| US20100064808A1 (en) * | 2008-09-18 | 2010-03-18 | Rohm Co., Ltd. | Acceleration sensor and method of manufacturing acceleration sensor |
| CN103534195A (en) * | 2011-04-14 | 2014-01-22 | 罗伯特·博世有限公司 | Method of forming membranes with modified stress characteristics |
| CN102998479A (en) * | 2012-12-31 | 2013-03-27 | 哈尔滨理工大学 | Two-dimensional wind speed and wind direction sensor of aluminum nitride based integrated array structure and manufacture method of sensor |
| CN104280051A (en) * | 2013-07-09 | 2015-01-14 | 精工爱普生株式会社 | Electronic device, method of manufacturing electronic device, physical quantity sensor, electronic apparatus, moving object |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111417594A (en) * | 2017-11-30 | 2020-07-14 | 应美盛股份有限公司 | Asymmetric plane external accelerometer |
| CN111417594B (en) * | 2017-11-30 | 2021-07-27 | 应美盛股份有限公司 | Asymmetric plane external accelerometer |
| CN109387191A (en) * | 2018-09-28 | 2019-02-26 | 清华大学 | A kind of high-temperature adaptability MEMS planar resonant gyroscope structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105776120B (en) | 2019-07-09 |
| CN110058050A (en) | 2019-07-26 |
| JP6476869B2 (en) | 2019-03-06 |
| US10408856B2 (en) | 2019-09-10 |
| US20160195567A1 (en) | 2016-07-07 |
| JP2016125927A (en) | 2016-07-11 |
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