JP2019052989A - Physical quantity sensor manufacturing method and physical quantity sensor device manufacturing method - Google Patents

Abstract

To provide a physical quantity sensor and physical quantity sensor device manufacturing method with which it is possible to improve a manufacturing yield and reduce production costs.SOLUTION: Provided is a method for manufacturing a physical quantity sensor 1 comprising forming a base substrate 2, an element piece 3 including fixed electrode parts 38, 39 fixed on the base substrate 2 and movable electrode parts 36, 37 displaceably provided on the base substrate 2, and wirings 41, 42, 43 arranged on the base substrate 2. This manufacturing method includes the steps of: forming, on a substrate 102, wirings 41, 42, 43 and a common wiring 47 electrically connected to the wirings 41, 42, 43; joining a substrate 103 to the substrate 102 and electrically connecting the substrate 103 to the wirings 41, 42, 43; etching the substrate 103 and thereby forming an element piece 3; separating the wirings 41, 42, 43 from the common wiring 47; inspecting the element piece 3 on the substrate 102 via the wirings 41, 42, 43 for each element piece 3; and dividing the substrate 102 into individual pieces.SELECTED DRAWING: Figure 21

Description

  The present invention relates to a method for manufacturing a physical quantity sensor and a method for manufacturing a physical quantity sensor device.

  The physical quantity sensor includes a movable electrode provided so as to be displaceable, and a fixed electrode that is opposed to the movable electrode with a space therebetween and is fixedly disposed, and electrostatic capacitance between the movable electrode and the fixed electrode is provided. 2. Description of the Related Art A physical quantity sensor that detects physical quantities such as acceleration and angular velocity based on capacitance is known (see, for example, Patent Document 1). The physical quantity sensor described in Patent Document 1 includes a wafer on which a plurality of chip portions having movable electrodes are formed, and a plurality of sealing portions that have fixed electrodes that are arranged to face the movable electrodes and seal each chip portion. After joining the sealing glass, it is obtained by cutting along a scribe line and dividing into pieces. In order to prevent static electricity from being generated between the movable electrode and the fixed electrode when the wafer and the sealing glass are bonded to each other, the common connection between the movable electrode and the fixed electrode for each chip portion is prevented. Conductive wiring is provided. The shared conductive wiring is provided within the line width of the scribe line, and is removed when it is separated into individual pieces.

JP 2010-145264 A

  However, in the physical quantity sensor described in Patent Document 1, until the individual pieces from the wafer are separated, the movable electrode and the fixed electrode are electrically connected (short-circuited) by the shared conductive wiring. The inspection cannot be performed. That is, when the physical quantity sensor is separated into pieces, it cannot be determined whether or not the physical quantity sensor operates normally. Therefore, for example, when inspection is performed in a state where the physical quantity sensor is connected to an electronic component and molded or packaged in a later process, a physical quantity sensor that does not operate normally is also subject to the subsequent process, resulting in a decrease in manufacturing yield. And production costs may increase.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A manufacturing method of a physical quantity sensor according to this application example includes a base substrate, a fixed electrode portion fixed on the base substrate, and a displacement provided on the base substrate so as to face the fixed electrode portion. And a movable electrode portion disposed on the base substrate and electrically connected to the movable electrode portion and a first wiring electrically connected to the fixed electrode portion. A physical quantity sensor manufacturing method including a second wiring, wherein the first wiring, the second wiring, the first wiring, and the second wiring are formed on a first substrate that is a base material of the base substrate. A conductive pattern forming step for forming a shared wiring electrically connected to the wiring, a second substrate serving as a base material of the element piece is bonded to the first substrate, and the second substrate is connected to the first substrate. A bonding step of electrically connecting the wiring and the second wiring; By etching the second substrate, an element piece forming step for forming the element piece having the fixed electrode portion and the movable electrode portion, and the first wiring and the second wiring are separated from the shared wiring. A dividing step, an inspection step for inspecting the element piece on the first substrate for each element piece via the first wiring and the second wiring, and the first substrate for each element piece. And a singulation process for obtaining a plurality of the physical quantity sensors.

  According to the manufacturing method according to this application example, the fixed electrode portion that is electrically connected to the first wiring and the movable electrode portion that is electrically connected to the second wiring in the element piece formed from the second substrate. In the joining step of joining the second substrate to the first substrate and the element piece forming step of forming the element piece from the second substrate, the movable electrode portion has the same potential as the shared wiring formed on the first substrate. Can be prevented from sticking to the first substrate. Further, before the physical quantity sensor is obtained by separating the first substrate in the individualization step, the first wiring and the second wiring are separated from the shared wiring in the inspection step and each element piece is inspected. It is possible to select a physical quantity sensor that normally operates at the time of conversion to a physical quantity sensor that does not normally operate.

  Application Example 2 A method of manufacturing a physical quantity sensor according to this application example, wherein in the dividing step, the first wiring and the second wiring are preferably cut with a laser beam.

  According to the manufacturing method according to this application example, the first wiring and the second wiring are cut by the laser beam and separated from the shared wiring, so that dust generated from the first substrate can be suppressed and the positional accuracy of the cut portion can be increased. Can be improved.

  [Application Example 3] A method of manufacturing a physical quantity sensor according to this application example, further comprising a lid portion arranging step of joining a lid member covering the element piece on the base substrate before the dividing step. Is preferred.

  According to the manufacturing method according to this application example, the lid member covering the element piece is bonded to the base substrate before the first wiring and the second wiring are cut, so that the element piece is protected from being damaged in the dividing step. it can. Further, even when dust or the like is generated in the dividing step, it is possible to prevent the dust or the like from adhering to the element piece.

  Application Example 4 A manufacturing method of a physical quantity sensor device according to this application example includes a step of electrically connecting a physical quantity sensor manufactured by the manufacturing method of the physical quantity sensor and an electronic component, and the physical quantity sensor and the electronic component. And a step of molding or packaging.

  According to the manufacturing method according to this application example, since the physical quantity sensor device is manufactured for the physical quantity sensor that has been normally operated in the inspection, the physical quantity sensor is connected to the electronic component and then molded or packaged, and then compared with the inspection. Thus, the production yield can be improved and the production cost can be reduced.

The perspective view which shows schematic structure of the physical quantity sensor which concerns on 1st Embodiment. The top view of the physical quantity sensor which concerns on 1st Embodiment. FIG. 3 is a cross-sectional view taken along line A-A ′ in FIG. 2. B-B 'line sectional drawing in FIG. FIG. 3 is a sectional view taken along line C-C ′ in FIG. 2. 1 is a schematic cross-sectional view illustrating an example of a physical quantity sensor device according to a first embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. The figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. Schematic which shows typically the example of the electronic device to which the physical quantity sensor which concerns on this embodiment is applied. Schematic which shows typically the example of the electronic device to which the physical quantity sensor which concerns on this embodiment is applied. Schematic which shows typically the example of the electronic device to which the physical quantity sensor which concerns on this embodiment is applied. Schematic which shows typically the example of the mobile body to which the physical quantity sensor which concerns on this embodiment is applied. The top view of the physical quantity sensor which concerns on 2nd Embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a physical quantity sensor and a manufacturing method thereof, and a physical quantity sensor device and a manufacturing method thereof according to the present invention will be described with reference to the accompanying drawings.

<First Embodiment>
FIG. 1 is a perspective view illustrating a schematic configuration of the physical quantity sensor according to the first embodiment. FIG. 2 is a plan view of the physical quantity sensor according to the first embodiment. 3 is a cross-sectional view taken along line AA ′ in FIG. 4 is a cross-sectional view taken along line BB ′ in FIG. 5 is a cross-sectional view taken along the line CC ′ in FIG.

  In the following, for convenience of explanation, the front side of the paper in FIG. 2 is referred to as “up”, the back side of the paper is referred to as “down”, the right side is referred to as “right”, and the left side is referred to as “left”. 1 to 5 show an X axis, a Y axis, and a Z axis as three axes orthogonal to each other. In the following, the direction parallel to the X-axis (left-right direction) is referred to as “X-axis direction”, the direction parallel to the Y-axis is referred to as “Y-axis direction”, and the direction parallel to the Z-axis (vertical direction) is referred to as “Z-axis direction”. say. Further, viewing the physical quantity sensor from the upper side in the Z-axis direction is called “plan view”.

[Physical quantity sensor]
In the present embodiment, an example in which a physical quantity sensor is used as a physical quantity sensor element for measuring physical quantities such as acceleration and angular velocity will be described. As shown in FIG. 1, the physical quantity sensor 1 according to the first embodiment includes a base substrate 2, an element piece 3 bonded and supported to the base substrate 2, a conductor pattern 4 provided on the base substrate 2, And a lid member 5 provided so as to cover the element piece 3. In FIG. 1, a part of the lid member 5 is seen through.

  Although details will be described later, the lid member 5 has a recess that opens downward (see FIG. 3). Thereby, an internal space is formed between the base substrate 2 and the lid member 5, and the element piece 3 is accommodated in the internal space. The conductor pattern 4 has wirings 41, 42, 43, electrodes 44, 45, 46, and isolated patterns 41a, 42a, 43a. The wiring 41 and the wiring 42 are first wirings in the present embodiment. Further, the wiring 43 is the second wiring in the present embodiment.

  The wirings 41, 42, and 43 are arranged so as to extend from an area covered with the lid member 5 on the base substrate 2 to an area not covered with the lid member 5. The electrodes 44, 45, and 46 are disposed on the base substrate 2 that is not covered with the lid member 5. The electrodes 44, 45, and 46 are electrically connected to the wirings 41, 42, and 43, respectively, and can be electrically connected to an external device. The isolated patterns 41a, 42a, 43a are arranged on the base substrate 2 that is not covered with the lid member 5 so as to face the electrodes 44, 45, 46, respectively.

  Hereinafter, each part which comprises the physical quantity sensor 1 is demonstrated in detail sequentially with reference to FIGS. In FIG. 2, the lid member 5 is seen through.

(Base substrate)
The base substrate 2 has a function of supporting the element piece 3. The base substrate 2 is an insulating substrate. The base substrate 2 is formed by dicing one substrate 102 (see FIG. 7) that serves as a base material in a manufacturing process described later. The base substrate 2 has a plate shape, and a cavity 21 is provided on the upper surface (one surface) (see FIGS. 3 to 5).

  As shown in FIGS. 3 to 5, the cavity portion 21 includes a movable portion 33, movable electrode portions 36 and 37, and connecting portions 34 and 35 of the element piece 3 to be described later when the base substrate 2 is viewed in plan. And has an inner bottom. The cavity 21 constitutes an escape portion that prevents the movable portion 33, the movable electrode portions 36 and 37, and the coupling portions 34 and 35 of the element piece 3 from contacting the base substrate 2. Thereby, the displacement of the movable part 33 of the element piece 3 can be permitted.

  The escape portion may be an opening that penetrates the base substrate 2 in the thickness direction instead of the cavity portion 21 (concave portion). In the present embodiment, the shape of the cavity 21 in plan view is a quadrangle (specifically, a rectangle), but is not limited thereto.

  As shown in FIG. 2, recesses 22, 23, and 24 are provided on the upper surface of the base substrate 2 along the outer periphery of the cavity portion 21. The recesses 22, 23, 24 have a shape corresponding to the conductor pattern 4 in plan view. Specifically, the concave portion 22 has a shape corresponding to the wiring 41, the electrode 44, and the isolated pattern 41a, the concave portion 23 has a shape corresponding to the wiring 42, the electrode 45, and the isolated pattern 42a, and the concave portion 24 has the shape corresponding to the wiring 43. The electrode 46 has a shape corresponding to the isolated pattern 43a.

  Further, as shown in FIG. 5, the depth of the portion of the recess 24 where the electrode 46 is provided is deeper than the portion of the recess 24 where the wiring 43 is provided. Although not shown, similarly, the depth of the portion where the electrode 44 is provided in the recess 22 is deeper than the portion where the wiring 41 is provided, and the depth of the portion where the electrode 45 is provided in the recess 23 is the wiring. It is deeper than the part where 42 is provided.

  Thus, by deepening a part of the recesses 22, 23, 24, when the substrate 103 serving as a base material of the element piece 3 is bonded to the substrate 102 in the manufacturing process of the physical quantity sensor 1 described later (FIG. 13), it is possible to prevent the substrate 103 from being bonded to the electrodes 44, 45, and 46.

  Specifically, as the constituent material of the base substrate 2, it is preferable to use a high-resistance silicon material or glass material. In particular, when the element piece 3 is composed of a silicon material as a main material, alkali metal ions ( It is preferable to use a glass material containing a mobile ion (for example, a borosilicate glass such as Pyrex (registered trademark) glass). Thereby, when the element piece 3 is composed of silicon as a main material, the base substrate 2 and the element piece 3 can be anodically bonded.

  Further, it is preferable that the constituent material of the base substrate 2 has as little difference in thermal expansion coefficient as that of the constituent material of the element piece 3. Specifically, the heat between the constituent material of the base substrate 2 and the constituent material of the element piece 3 is preferable. Those having a difference in expansion coefficient of 3 ppm / ° C. or less are preferred. As a result, even if the base substrate 2 and the element piece 3 are subjected to a high temperature during bonding, the residual stress between the base substrate 2 and the element piece 3 can be reduced.

(Element piece)
As shown in FIG. 2, the element piece 3 includes fixed portions 31 and 32, a movable portion 33, connecting portions 34 and 35, movable electrode portions 36 and 37, and fixed electrode portions 38 and 39. Yes. The connecting portions 34 and 35 and the movable electrode portions 36 and 37 are included in the movable portion 33.

  The element piece 3 has an X-axis direction (+ X direction or −X) while the movable portion 33 and the movable electrode portions 36 and 37 elastically deform the connecting portions 34 and 35 according to changes in physical quantities such as acceleration and angular velocity. Displacement in the X direction). With such a displacement, the size of the gap between the movable electrode portion 36 and the fixed electrode portion 38 and the size of the gap between the movable electrode portion 37 and the fixed electrode portion 39 change. That is, in accordance with such displacement, the magnitude of the capacitance between the movable electrode portion 36 and the fixed electrode portion 38 and the magnitude of the capacitance between the movable electrode portion 37 and the fixed electrode portion 39. Changes. Therefore, the physical quantity sensor 1 can detect physical quantities such as acceleration and angular velocity based on these capacitances.

  The fixed parts 31, 32, the movable part 33, the connecting parts 34, 35, and the movable electrode parts 36, 37 are integrally formed. The fixing portions 31 and 32 are respectively joined to the upper surface of the base substrate 2. Specifically, the fixing portion 31 is joined to a portion on the −X direction side (left side in FIG. 2) with respect to the cavity portion 21 on the upper surface of the base substrate 2, and the fixing portion 32 is a cavity on the upper surface of the base substrate 2. The portion 21 is joined to the portion on the + X direction side (right side in FIG. 2).

  The fixed portions 31 and 32 are provided so as to straddle the outer peripheral edge of the cavity portion 21 when viewed in plan. The positions and shapes of the fixing portions 31 and 32 are determined according to the positions and shapes of the connecting portions 34 and 35, the conductor pattern 4, etc., and are not limited to those described above.

  A movable portion 33 is provided between the fixed portion 31 and the fixed portion 32. In the present embodiment, the movable part 33 has a longitudinal shape extending in the X-axis direction. The shape of the movable portion 33 is determined according to the shape, size, etc. of each portion constituting the element piece 3 and is not limited to the above-described one.

  The movable portion 33 is connected to the fixed portion 31 via the connecting portion 34 and is connected to the fixed portion 32 via the connecting portion 35. More specifically, the left end (−X direction side) of the movable portion 33 is connected to the fixed portion 31 via the connecting portion 34, and the right end (+ X direction side) of the movable portion 33 is connected to the fixed portion 31. It is connected to the fixed part 32 via the connecting part 35.

  The connecting portions 34 and 35 connect the movable portion 33 to the fixed portions 31 and 32 so as to be displaceable. In the present embodiment, the connecting portions 34 and 35 are configured to be able to displace the movable portion 33 in the X-axis direction (+ X direction or −X direction) as indicated by an arrow a in FIG.

  Specifically, the connecting portion 34 is composed of two beams 341 and 342. Each of the beams 341 and 342 has a shape extending in the X-axis direction while meandering in the Y-axis direction. In other words, each of the beams 341 and 342 has a shape that is folded back a plurality of times (three times in the present embodiment) in the Y-axis direction. Note that the number of times the beams 341 and 342 are folded may be one or two times, or four or more times.

  Similarly, the connecting portion 35 is composed of two beams 351 and 352 having a shape extending in the X-axis direction while meandering in the Y-axis direction. The connecting parts 34 and 35 are not limited to those described above as long as they support the movable part 33 so as to be displaceable with respect to the base substrate 2. You may be comprised with a pair of beam each extended in a Y direction.

  Thus, the movable electrode portion 36 is provided on one side (+ Y direction side) in the width direction of the movable portion 33 supported so as to be displaceable in the X-axis direction with respect to the base substrate 2, and the other side (−Y On the direction side, a movable electrode portion 37 is provided.

  The movable electrode portion 36 includes a plurality of movable electrode fingers 361 to 365 that protrude in the + Y direction from the movable portion 33 and are arranged in a comb-teeth shape. The movable electrode fingers 361, 362, 363, 364, 365 are arranged in this order from the −X direction side to the + X direction side. Similarly, the movable electrode portion 37 includes a plurality of movable electrode fingers 371 to 375 that protrude from the movable portion 33 in the −Y direction and are arranged in a comb-teeth shape. The movable electrode fingers 371, 372, 373, 374, and 375 are arranged in this order from the −X direction side to the + X direction side.

  Thus, the plurality of movable electrode fingers 361 to 365 and the plurality of movable electrode fingers 371 to 375 are provided side by side in the direction in which the movable portion 33 is displaced (that is, the X-axis direction). As a result, the electrostatic capacitance between the fixed electrode fingers 382, 384, 386, and 388 and the movable electrode portion 36, which will be described later, and the static electricity between the fixed electrode fingers 381, 383, 385, 387, and the movable electrode portion 36, are described. The electric capacity can be changed efficiently according to the displacement of the movable portion 33.

  Similarly, the electrostatic capacitance between the fixed electrode fingers 392, 394, 396, 398 and the movable electrode portion 36, which will be described later, and the static electricity between the fixed electrode fingers 391, 393, 395, 397 and the movable electrode portion 36 are described. The electric capacity can be changed efficiently according to the displacement of the movable portion 33. Therefore, when the physical quantity sensor 1 is used as a physical quantity sensor element, the detection accuracy can be excellent.

  The movable electrode part 36 is opposed to the fixed electrode part 38 with an interval. Further, the movable electrode portion 37 faces the fixed electrode portion 39 with a space therebetween. The fixed electrode unit 38 includes a plurality of fixed electrode fingers 381 to 388 arranged so as to form a comb tooth shape that is engaged with the plurality of movable electrode fingers 361 to 365 of the movable electrode unit 36 with a space therebetween. The ends of the plurality of fixed electrode fingers 381 to 388 on the side opposite to the movable portion 33 are respectively joined to the + Y direction side portion with respect to the cavity portion 21 on the upper surface of the base substrate 2. The fixed electrode fingers 381 to 388 each have a fixed end as a fixed end and a free end extending in the −Y direction.

  The fixed electrode fingers 381 to 388 are arranged in this order from the −X direction side to the + X direction side. The fixed electrode fingers 381 and 382 make a pair, and between the movable electrode fingers 361 and 362, and the fixed electrode fingers 383 and 384 make a pair, and the fixed electrode finger 385 between the movable electrode fingers 362 and 363. , 386 are paired, and the fixed electrode fingers 387, 388 are paired and faced between the movable electrode fingers 364, 365.

  Here, the fixed electrode fingers 382, 384, 386, and 388 are first fixed electrode fingers, respectively, and the fixed electrode fingers 381, 383, 385, and 387 are respectively the first fixed electrode fingers on the base substrate 2. The second fixed electrode fingers are spaced apart from each other via a gap (gap). As described above, the plurality of fixed electrode fingers 381 to 388 are composed of a plurality of first fixed electrode fingers and a plurality of second fixed electrode fingers arranged alternately. In other words, the first fixed electrode finger is arranged on one side of the movable electrode fingers 361 to 365, and the second fixed electrode finger is arranged on the other side.

  The first fixed electrode fingers 382, 384, 386, and 388 and the second fixed electrode fingers 381, 383, 385, and 387 are separated from each other on the base substrate 2. In other words, the first fixed electrode fingers 382, 384, 386, and 388 and the second fixed electrode fingers 381, 383, 385, and 387 are not connected to each other on the base substrate 2 and are isolated in an island shape. ing. Thereby, the 1st fixed electrode finger 382,384,386,388 and the 2nd fixed electrode finger 381,383,385,387 can be electrically insulated. Therefore, the capacitance between the first fixed electrode fingers 382, 384, 386 and 388 and the movable electrode portion 36, and between the second fixed electrode fingers 381, 383, 385 and 387 and the movable electrode portion 36 The capacitance can be measured separately, and the physical quantity can be detected with high accuracy based on the measurement results.

  In the present embodiment, the fixed electrode fingers 381 to 388 are separated from each other on the base substrate 2. In other words, the fixed electrode fingers 381 to 388 are not connected to each other on the base substrate 2 and are isolated in an island shape. Accordingly, the lengths of the fixed electrode fingers 381 to 388 in the Y-axis direction can be made uniform. Therefore, it is possible to reduce the size of the fixed electrode fingers 381 to 388 while securing an area necessary for obtaining a sufficient bonding strength of each bonded portion between the fixed electrode fingers 381 to 388 and the base substrate 2. Thereby, the physical quantity sensor 1 can be downsized while the impact resistance of the physical quantity sensor 1 is excellent.

  Similarly, the fixed electrode unit 39 includes a plurality of fixed electrode fingers 391 to 398 arranged in a comb-teeth shape that meshes with the plurality of movable electrode fingers 371 to 375 of the movable electrode unit 37 at intervals. The ends of the plurality of fixed electrode fingers 391 to 398 on the side opposite to the movable portion 33 are respectively joined to the portion on the −Y direction side with respect to the cavity portion 21 on the upper surface of the base substrate 2. Each fixed electrode finger 391 to 398 has a fixed end as a fixed end and a free end extending in the + Y direction.

  The fixed electrode fingers 391 to 398 are arranged in this order from the −X direction side to the + X direction side. The fixed electrode fingers 391 and 392 form a pair and the movable electrode fingers 371 and 372 form a pair, and the fixed electrode fingers 393 and 394 form a pair and the movable electrode fingers 372 and 373 form a fixed electrode finger 395. , 396 form a pair, and the fixed electrode fingers 397, 398 are paired and face each other between the movable electrode fingers 374, 375.

  Here, the fixed electrode fingers 392, 394, 396, and 398 are first fixed electrode fingers, respectively, and the fixed electrode fingers 391, 393, 395, and 397 are respectively the first fixed electrode fingers on the base substrate 2. The second fixed electrode fingers are spaced apart from each other via a gap (gap). As described above, the plurality of fixed electrode fingers 391 to 398 are composed of a plurality of first fixed electrode fingers and a plurality of second fixed electrode fingers arranged alternately. In other words, the first fixed electrode finger is arranged on one side of the movable electrode finger, and the second fixed electrode finger is arranged on the other side.

  The first fixed electrode fingers 392, 394, 396, 398 and the second fixed electrode fingers 391, 393, 395, 397 are separated from each other on the base substrate 2 like the fixed electrode portion 38. As a result, the capacitance between the first fixed electrode fingers 392, 394, 396, 398 and the movable electrode portion 37, and the gap between the second fixed electrode fingers 391, 393, 395, 397 and the movable electrode portion 37 are obtained. Can be measured separately, and the physical quantity can be detected with high accuracy based on the measurement results.

  In the present embodiment, the plurality of fixed electrode fingers 391 to 398 are separated from each other on the base substrate 2 like the fixed electrode portion 38. Accordingly, it is possible to reduce the size of the fixed electrode fingers 391 to 398 while ensuring a sufficient area of each joint between the fixed electrode fingers 391 to 398 and the base substrate 2. Therefore, the physical quantity sensor 1 can be downsized while the impact resistance of the physical quantity sensor 1 is excellent.

  The element piece 3 (that is, the fixed portions 31 and 32, the movable portion 33, the connecting portions 34 and 35, the plurality of fixed electrode fingers 381 to 388 and 391 to 398, and the plurality of movable electrode fingers 361 to 365 and 371 to 375) are It is formed by etching one substrate 103 (see FIG. 13) that serves as a base material in a manufacturing process described later.

  Accordingly, the thicknesses of the fixed portions 31 and 32, the movable portion 33, the connecting portions 34 and 35, the plurality of fixed electrode fingers 381 to 388 and 391 to 398, and the plurality of movable electrode fingers 361 to 365 and 371 to 375 are increased. be able to. Also, these thicknesses can be easily and accurately aligned. For this reason, it is possible to increase the sensitivity of the physical quantity sensor 1 and to improve the impact resistance of the physical quantity sensor 1.

  In addition, the constituent material of the element piece 3 is not particularly limited as long as the physical quantity can be detected based on the change in capacitance as described above, but a semiconductor is preferable, and specifically, for example, single crystal silicon It is preferable to use a silicon material such as polysilicon. That is, the fixed portions 31 and 32, the movable portion 33, the connecting portions 34 and 35, the plurality of fixed electrode fingers 381 to 388 and 391 to 398, and the plurality of movable electrode fingers 361 to 365 and 371 to 375 are mainly made of silicon. It is preferable to be configured as a material.

  Silicon can be processed with high accuracy by etching. Therefore, the element piece 3 is made of silicon as a main material, whereby the dimensional accuracy of the element piece 3 is improved, and as a result, the physical quantity sensor 1 that is a physical quantity sensor element can be highly sensitive. Since silicon is less fatigued, the durability of the physical quantity sensor 1 can be improved. The silicon material constituting the element piece 3 is preferably doped with an impurity such as phosphorus or boron. Thereby, the electroconductivity of the element piece 3 can be made excellent.

  Further, as described above, the element piece 3 is supported by the base substrate 2 by bonding the fixed portions 31 and 32 and the fixed electrode portions 38 and 39 to the upper surface of the base substrate 2. In this embodiment, the base substrate 2 and the element piece 3 are joined via an insulating film (not shown) except for portions where projections 471, 472, 481, 482, and 50, which will be described later, are arranged.

  The bonding method of the element piece 3 (specifically, the fixing portions 31 and 32 and the fixed electrode fingers 381 to 388 and 391 to 398) and the base substrate 2 is not particularly limited, but an anodic bonding method is preferably used. . Accordingly, the fixed portions 31 and 32 and the fixed electrode portions 38 and 39 (respective fixed electrode fingers 381 to 388 and 391 to 398) can be firmly bonded to the base substrate 2. Therefore, the impact resistance of the physical quantity sensor 1 can be improved.

  Further, the fixed portions 31 and 32 and the fixed electrode portions 38 and 39 (respective fixed electrode fingers 381 to 388 and 391 to 398) can be bonded to desired positions on the base substrate 2 with high accuracy. Therefore, it is possible to increase the sensitivity of the physical quantity sensor 1 that is a physical quantity sensor element. In this case, as described above, the element piece 3 is made of silicon as a main material, and the base substrate 2 is made of a glass material containing alkali metal ions.

(Conductor pattern)
The conductor pattern 4 is provided on the upper surface of the base substrate 2 (the surface on the side that supports the element piece 3). The conductor pattern 4 includes wirings 41, 42, 43, electrodes (terminals) 44, 45, 46, and isolated patterns 41a, 42a, 43a.

  The wiring 41 is provided outside the cavity 21 of the base substrate 2 and is formed along the outer periphery of the cavity 21. The wiring 41 is electrically connected to the fixed electrode fingers 382, 384, 386, 388 and the fixed electrode fingers 392, 394, 396, 398 which are the first fixed electrode fingers of the element piece 3. The wiring 41 is electrically connected to the electrode 44 on the outer peripheral portion (the outer portion of the lid member 5) on the upper surface of the base substrate 2. The wiring 41 may extend from the electrode 44 to the end side of the base substrate 2 (on the side opposite to the lid member 5).

  Further, the wiring 42 is provided along the outer peripheral edge inside the wiring 41 and outside the hollow portion 21 of the base substrate 2. The wiring 42 is electrically connected to the fixed electrode fingers 381, 383, 385, 387 and the fixed electrode fingers 391, 393, 395, 397, which are the second fixed electrode fingers of the element piece 3. The wiring 42 is electrically connected to an electrode 45 arranged on the outer peripheral portion (the outer portion of the lid member 5) on the upper surface of the base substrate 2 so as to be arranged at a distance from the electrode 44. The wiring 42 may extend from the electrode 45 to the end portion side of the base substrate 2.

  The wiring 43 is provided so as to extend from the joint portion with the fixing portion 31 on the base substrate 2 to the outer peripheral portion (the outer portion of the lid member 5) on the upper surface of the base substrate 2. The wiring 43 is electrically connected to the fixed portion 31 formed integrally with the movable portion 33 (movable electrode portions 36 and 37) of the element piece 3. The wiring 43 is arranged on the opposite side of the fixed portion 31 on the outer peripheral portion of the upper surface of the base substrate 2 (the portion outside the lid member 5 on the base substrate 2) with a gap from the electrodes 44 and 45. Thus, the electrodes 46 are electrically connected. The wiring 43 may extend from the electrode 46 to the end side of the base substrate 2.

The constituent materials of the wirings 41 to 43 are not particularly limited as long as they have conductivity, and various electrode materials can be used. For example, oxides (transparent electrode materials) such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), In ₃ O ₃ , SnO ₂ , Sb-containing SnO ₂ , Al-containing ZnO, Au, Pt, Ag, Cu, Al or an alloy containing these may be used, and one or more of these may be used in combination.

  As a constituent material of the wirings 41 to 43, it is preferable to use a transparent electrode material (especially ITO). When the wirings 41 and 42 are each made of a transparent electrode material, when the base substrate 2 is a transparent substrate, foreign matter or the like existing on the surface of the base substrate 2 on the fixed electrode portions 38 and 39 side is removed from the base substrate 2. It can be easily visually recognized from the surface opposite to the fixed electrode portions 38 and 39. Therefore, the physical quantity sensor 1 can be provided more reliably as a highly sensitive physical quantity sensor element.

  In addition, the constituent materials of the electrodes 44, 45, and 46 are not particularly limited as long as they have electrical conductivity, similarly to the wirings 41 to 43, and various electrode materials can be used. In the present embodiment, the same material as that of projections 471, 472, 481, and 482 described later is used as the material of the electrodes 44, 45, and 46.

  Since the wiring 41 is provided on the upper surface of the base substrate 2, the capacitance between the first fixed electrode fingers 382, 384, 386 and 388 and the movable electrode portion 36 and the first fixed electrode via the wiring 41 are provided. The capacitance between the fingers 392, 394, 396, 398 and the movable electrode part 37 can be measured. Since the wiring 42 is provided on the upper surface of the base substrate 2, the capacitance between the second fixed electrode fingers 381, 383, 385, and 387 and the movable electrode portion 36 and the second capacitance are provided via the wiring 42. The electrostatic capacitance between the fixed electrode fingers 391, 393, 395, 397 and the movable electrode portion 37 can be measured.

  In the present embodiment, by using the electrode 44 and the electrode 46, the capacitance between the first fixed electrode fingers 382, 384, 386, 388 and the movable electrode portion 36 and the first fixed electrode fingers 392, 394, 396 are displayed. , 398 and the movable electrode portion 37 can be measured. Further, by using the electrode 45 and the electrode 46, the capacitance between the second fixed electrode fingers 381, 383, 385, 387 and the movable electrode portion 36 and the second fixed electrode fingers 391, 393, 395, 397 The capacitance between the movable electrode portion 37 can be measured.

  As shown in FIGS. 3 to 5, the wirings 41 and 42 are provided on the upper surface of the base substrate 2 (that is, on the surface on the fixed electrode portions 38 and 39 side), so that the fixed electrode portions 38 and 39 are provided. The electrical connection to and positioning thereof are easy. Therefore, the reliability (especially impact resistance and detection accuracy) of the physical quantity sensor 1 can be improved.

  The wiring 41 and the electrode 44 are provided in the recess 22 of the base substrate 2, the wiring 42 and the electrode 45 are provided in the recess 23 of the base substrate 2, and the wiring 43 and the electrode 46 are provided in the recess of the base substrate 2. 24 (see FIG. 5). Thereby, it is possible to prevent the wirings 41 to 43 from protruding upward from the plate surface of the base substrate 2.

  Thereby, the fixed electrode fingers 382 to 388, 391 to 398 and the base substrate 2 can be reliably joined (fixed), and the fixed electrode fingers 382, 384, 386, 388, 392, 394, 396, and 398 The electrical connection with the wiring 41 and the electrical connection between the fixed electrode fingers 381, 383, 385, 387, 391, 393, 395, 397 and the wiring 42 can be performed. Similarly, the fixing part 31 and the wiring 43 can be electrically connected while ensuring the bonding (fixing) between the fixing part 31 and the base substrate 2. Here, the relationship of d> t is satisfied, where t is the thickness of each of the wirings 41 to 43 and d is the depth of each of the recesses 22 to 24 where the wiring 41 is provided.

  As illustrated in FIG. 2, a plurality of conductive protrusions 481 and a plurality of protrusions 482 are provided on the wiring 41. The plurality of protrusions 481 are provided corresponding to the fixed electrode fingers 382, 384, 386, and 388 that are the plurality of first fixed electrode fingers, and the plurality of protrusions 482 are the fixed electrode fingers that are the plurality of first fixed electrode fingers. 392, 394, 396 and 398 are provided.

  The fixed electrode fingers 382, 384, 386 and 388 and the wiring 41 are electrically connected via the plurality of protrusions 481, and the fixed electrode fingers 392, 394, 396 and 398 are connected via the plurality of protrusions 482. The wiring 41 is electrically connected. As a result, the electrical connection between the fixed electrode fingers 382, 384, 386, 388, 392, 394, 396, and 398 and the wiring 41 is prevented while preventing unintentional electrical connection (short circuit) between the wiring 41 and other parts. Connection can be made.

  Similarly, a plurality of conductive protrusions 471 and a plurality of protrusions 472 are provided on the wiring 42 (see FIG. 4). The plurality of protrusions 471 are provided corresponding to the fixed electrode fingers 381, 383, 385, and 387 that are a plurality of second fixed electrode fingers, and the plurality of protrusions 472 are the fixed electrode fingers that are a plurality of second fixed electrode fingers. 391, 393, 395, 397 are provided.

  The fixed electrode fingers 381, 383, 385, 387 and the wiring 42 are electrically connected via the plurality of protrusions 471, and the fixed electrode fingers 391, 393, 395, 397 are connected via the plurality of protrusions 472. The wiring 42 is electrically connected. Thus, the electrical connection between the fixed electrode fingers 381, 383, 385, 387, 391, 393, 395, 397 and the wiring 42 is prevented while preventing the unintentional electrical connection (short circuit) between the wiring 42 and other parts. Connection can be made.

  The constituent material of the projections 471, 472, 481, 482 is not particularly limited as long as it has conductivity, and various electrode materials can be used. For example, Au, Pt, Ag Metals such as simple metals such as Cu, Al, and alloys containing these metals are preferably used. By forming the protrusions 471, 472, 481, 482 using such a metal, the contact resistance between the wirings 41, 42 and the fixed electrode portions 38, 39 can be reduced.

  Further, the thickness of each of the wirings 41 to 43 is t, the depth of each of the recesses 22 to 24 where the wiring 41 is provided is d, and the height of each of the protrusions 471, 472, 481, and 482 is h. Then, the relationship d≈t + h is satisfied.

  A conductive protrusion 50 is provided on the wiring 43 (see FIG. 5). The fixing portion 31 and the wiring 43 are electrically connected through the protrusion 50. As the constituent material of the protrusion 50, the same constituent material as the protrusions 471, 472, 481, 482 can be used.

  The isolated patterns 41 a, 42 a, 43 a are provided in regions not covered with the lid member 5 of the base substrate 2. The isolated patterns 41a, 42a, and 43a are isolated in an island shape on the end side of the base substrate 2 and are disposed so as to face the electrodes 44, 45, and 46, respectively. The isolated patterns 41a, 42a, 43a are electrically insulated from the wirings 41, 42, 43 and the electrodes 44, 45, 46, and are electrically insulated from each other.

  In the isolated pattern 41a, 42a, 43a, in the manufacturing process of the physical quantity sensor 1 to be described later, the wirings 41, 42, 43 extending to the end side of the base substrate 2 from the electrodes 44, 45, 46 are cut in the middle. , Part of it remains.

  Note that an insulating film (not shown) is provided on the wirings 41 to 43. This insulating film has a function of preventing unintentional electrical connection (short circuit) between the conductor pattern 4 and the element piece 3. This insulating film is not formed on the protrusions 471, 472, 481, 482, 50, and the surfaces of the protrusions 471, 472, 481, 482, 50 are exposed.

  By this insulating film, the first fixed electrode fingers 382, 384, 386, 388, 392, 394 are more reliably prevented while preventing unintentional electrical connection (short circuit) between the wirings 41, 42 and other parts. The electrical connection between 396, 398 and the wiring 41 and the electrical connection between each of the second fixed electrode fingers 381, 383, 385, 385, 387, 391, 393, 395, 397 and the wiring 42 can be performed. In addition, the electrical connection between the fixed portion 31 and the wiring 43 can be performed while more reliably preventing the unintentional electrical connection (short circuit) between the wiring 43 and other parts.

  In the present embodiment, the insulating film is formed over substantially the entire upper surface of the base substrate 2 except for the formation regions of projections 471, 472, 481, 482, 50 and electrodes 44, 45, 46 described later. . The insulating film formation region is not limited to this as long as it can cover the wirings 41 to 43, and excludes, for example, a bonding portion with the element piece 3 on the upper surface of the base substrate 2 and a bonding portion with the lid member 5. Such a shape may be formed.

  As described above, the relationship of d> t is satisfied, where t is the thickness of each of the wirings 41 to 43 and d is the depth of each of the recesses 22 to 24 where the wiring 41 is provided. Thereby, for example, a gap is formed between the fixed electrode finger 391 and the insulating film on the wiring 41. Although not shown, a gap similar to this gap is also formed between the other fixed electrode fingers and the insulating films on the wirings 41 and 42. Such a gap is similarly formed between the substrate 102 and the substrate 103 in the manufacture of the physical quantity sensor 1 to be described later, and gas generated during anodic bonding can be discharged.

  Although not shown, a gap is also formed between the lid member 5 and the insulating film on the wiring 43. A gap similar to this gap is also formed between the lid member 5 and the insulating film on the wirings 41 and 42. With these gaps, the inside of the lid member 5 can be depressurized or filled with an inert gas. Note that these gaps may be closed with an adhesive when the lid member 5 and the base substrate 2 are bonded together with an adhesive.

The constituent material of the insulating film is not particularly limited, and various insulating materials can be used, but the base substrate 2 is made of a glass material (particularly, a glass material to which alkali metal ions are added). In this case, it is preferable to use silicon dioxide (SiO ₂ ). As a result, unintentional electrical connection as described above can be prevented, and the base substrate 2 and the element piece 3 can be connected to each other even if an insulating film is present at the junction with the element piece 3 on the upper surface of the base substrate 2. Anodic bonding is possible.

(Cover member)
The lid member 5 has a function of protecting the element piece 3. As shown in FIGS. 3 to 5, the lid member 5 has a plate shape, and a concave portion 51 is provided on one surface (lower surface) thereof. The recess 51 is formed to allow displacement of the movable portion 33 and the movable electrode portions 36 and 37 of the element piece 3. The constituent material of the lid member 5 is not particularly limited as long as it can exhibit the functions as described above. For example, a silicon material, a glass material, or the like can be suitably used.

  A portion of the lower surface of the lid member 5 outside the recess 51 is bonded to the upper surface of the base substrate 2. In the present embodiment, the base substrate 2 and the lid member 5 are joined via the insulating film described above. The method for bonding the lid member 5 and the base substrate 2 is not particularly limited, and for example, a bonding method using an adhesive, an anodic bonding method, a direct bonding method, or the like can be used.

[Physical quantity sensor device]
Next, a physical quantity sensor device including the physical quantity sensor of the first embodiment will be described. FIG. 6 is a schematic cross-sectional view illustrating an example of the physical quantity sensor device according to the first embodiment. As shown in FIG. 6, the physical quantity sensor device 200 according to the present embodiment includes a substrate 201, a physical quantity sensor 1, and an IC chip 202 as an electronic component.

  Although it does not specifically limit as a constituent material of the board | substrate 201, For example, a silicon material, a glass material, a ceramic material, a resin material, a glass substrate, a glass epoxy material etc. can be used. The surface of the substrate 201 on which the physical quantity sensor 1 is placed is the upper surface, and the opposite surface is the lower surface. A plurality of terminals 207 are arranged on the upper surface of the substrate 201, and mounting terminals 208 are arranged on the lower surface. The mounting terminal 208 is connected to the terminal 207 via an internal wiring (not shown).

  The physical quantity sensor 1 is fixed to the upper surface of the substrate 201 through an adhesive layer 203. The IC chip 202 is fixed to the upper surface of the physical quantity sensor 1 through the adhesive layer 204. As the adhesive layers 203 and 204, for example, solder, silver paste, resin adhesive (die attach agent) or the like can be used.

  In the IC chip 202, for example, a drive circuit that drives the physical quantity sensor 1, a detection circuit that detects acceleration and angular velocity based on a signal from the physical quantity sensor 1, and a signal from the detection circuit are converted into a predetermined signal. An output circuit for outputting is included. The IC chip 202 is electrically connected to the electrodes 44, 45, and 46 of the physical quantity sensor 1 through the bonding wire 205, and is electrically connected to the terminal 207 of the substrate 201 through the bonding wire 206.

  The physical quantity sensor 1 and the IC chip 202 are molded with a molding material 209. As the molding material 209, for example, a thermosetting epoxy resin can be used, and for example, it can be molded by a transfer molding method. Instead of molding with the molding material 209, the physical quantity sensor 1 and the IC chip 202 may be packaged with a ceramic material or the like.

[Method of manufacturing physical quantity sensor]
Next, a method for manufacturing the physical quantity sensor according to the first embodiment will be described. Hereinafter, an example of manufacturing the above-described physical quantity sensor 1 will be described.

  7-22 is a figure explaining the manufacturing method of the physical quantity sensor which concerns on 1st Embodiment. 7 to 9, FIG. 13 to FIG. 16, FIG. 18 and FIG. 21 show cross sections corresponding to the cross sectional view taken along the line A-A 'in FIG. FIG. 10 shows a cross section corresponding to the cross-sectional view taken along line B-B ′ in FIG. 2. 11, FIG. 12, FIG. 17, FIG. 19, FIG. 20, and FIG. 22 show planes corresponding to FIG. Hereinafter, a case where the base substrate 2 is made of a glass material containing alkali metal ions and the element piece 3 is made of silicon will be described as an example.

  In the physical quantity sensor manufacturing method according to the present embodiment, the base substrate 2, the element piece 3, and the lid member 5 are processed with a base material (so-called mother substrate) from which a plurality of each can be obtained. Then, a plurality of physical quantity sensors 1 are obtained by finally cutting out from the base material and dividing it into pieces.

[1] Base Substrate Manufacturing Process First, as shown in FIG. 7, a substrate 102 as a first substrate is prepared. The substrate 102 is a base material from which a plurality of base substrates 2 can be taken. The substrate 102 is made of a glass material containing an alkali metal. Subsequently, as shown in FIG. 8, the upper surface of the substrate 102 is etched to form the cavity 21 and the recesses 22 and 23 for each region to be the base substrate 2. At this time, although not shown in FIG. 8, the recess 24 (see FIG. 5) is also formed by the etching.

  The formation method (etching method) of the cavity 21 and the recesses 22 to 24 is not particularly limited. For example, physical etching methods such as plasma etching and beam etching, reactive ion etching, photo-assisted etching, wet etching, and the like. These chemical etching methods and the like can be used alone or in combination. Note that the same method can be used for etching in the following steps.

  In the etching as described above, for example, a mask formed by a photolithography method can be preferably used. Further, the cavity 21 and the recesses 22 to 24 can be formed in order by repeating mask formation, etching, and mask removal a plurality of times. The mask is removed after etching. As a method for removing the mask, for example, when the mask is made of a resist material, a resist stripping solution is used. When the mask is made of a metal material, a metal stripping solution such as a phosphoric acid solution is used. Can do. In addition, you may form the cavity part 21 and the recessed parts 22-24 (a several recessed part from which depth differs) collectively, for example by using a gray scale mask.

[2] Conductive Pattern Formation Step Next, the conductive pattern 4 is formed on the upper surface of the substrate 102. When forming the conductor pattern 4, first, as shown in FIG. 9, the wiring 41 (first wiring) is formed in the recess 22 and the wiring 42 (first wiring) is formed in the recess 23. At this time, although not shown in FIG. 9, the wiring 43 (second wiring) is formed in the recess 24, and the shared wiring 47 is formed on the upper surface of the substrate 102 (see FIG. 11).

  FIG. 11 is a plan view of the substrate 102 on which the conductor pattern 4 is formed. A range indicated by a two-dot chain line in FIG. 11 is a region that is cut out in a later singulation process and becomes the base substrate 2 (that is, a region that becomes the physical quantity sensor 1). As shown in FIG. 11, the wirings 41, 42, and 43 are formed for each region that becomes the base substrate 2. The shared wiring 47 is formed over a region to be a plurality of base substrates 2 outside a region to be the base substrate 2 on the substrate 102. A plurality of shared wirings 47 are formed on the substrate 102. Note that the plurality of shared wirings 47 may be electrically connected to each other.

  The wirings 41, 42, 43 formed for each region to be the base substrate 2 extend to the outside of the region to be the base substrate 2 and are connected to the shared wiring 47. To the shared wiring 47, wirings 41, 42, and 43 of a plurality of base substrates 2 arranged on the substrate 102 (cut out from one substrate 102) are electrically connected. Accordingly, the wirings 41, 42, and 43 of all the base substrates 2 connected to the shared wiring 47 have the same potential as the shared wiring 47.

  The formation method (film formation method) of the wirings 41, 42, 43 and the shared wiring 47 is not particularly limited. For example, dry plating methods such as vacuum evaporation, sputtering (low temperature sputtering), ion plating, electrolytic plating, Examples thereof include wet plating methods such as electrolytic plating, thermal spraying methods, thin film bonding, and the like. Note that the same method can be used for film formation in the following steps.

  Subsequently, electrodes 44, 45, 46 and protrusions 471, 472, 481, 482, 50 are formed (film formation) on the wirings 41, 42, 43. A plurality of protrusions 471 and 472 are formed on the wiring 42 in the cross section corresponding to the cross-sectional view taken along line B-B ′ in FIG. 2 shown in FIG. 10. At this time, as shown in FIG. 12, the electrode 45 is formed on the wiring 42 together with the plurality of protrusions 471 and 472. A plurality of protrusions 481 and 482 and an electrode 44 are formed on the wiring 41. Then, the protrusion 50 and the electrode 46 are formed on the wiring 43.

  Thereafter, although not shown, an insulating film is formed (deposited) on the upper surface of the substrate 102 so as to cover the conductor pattern 4. Then, portions of the formed insulating film corresponding to the electrodes 44, 45, 46 and the protrusions 471, 472, 481, 482, 50 are removed. As a result, an insulating film is obtained in which the electrodes 44, 45, and 46 are exposed and the protrusions 471, 472, 481, 482, and 50 are exposed.

[3] Joining process (second substrate mounting process)
Next, as shown in FIG. 13, a substrate 103 as a second substrate is prepared and placed on the upper surface of the substrate 102. The substrate 103 is a base material that can take a plurality of element pieces 3 corresponding to each of the base substrates 2 obtained from the substrate 102. In the present embodiment, the substrate 103 is a silicon substrate. The thickness of the substrate 103 is, for example, larger than the thickness of the element piece 3. Thereby, the handleability of the substrate 103 in the manufacturing process can be improved.

  Subsequently, the substrate 103 is bonded to the substrate 102 by an anodic bonding method through an insulating film (not shown). Thereby, the substrate 103 is connected to the protrusions 471, 472, 481, 482, 50 (see FIG. 12) exposed from the insulating film. Therefore, the substrate 103 is electrically connected to the wirings 41, 42, 43 through the protrusions 471, 472, 481, 482, 50.

  And as shown in FIG. 14, the board | substrate 103 is thinned from the upper surface side. This thinning is performed so that the thickness of the substrate 103 is the same as the thickness of the element piece 3. A method for thinning the substrate 103 is not particularly limited, but for example, a CMP method or a dry polishing method can be preferably used. Note that the thickness of the substrate 103 when placed on the substrate 102 may be the same as the thickness of the element piece 3. In this case, the aforementioned thinning step can be omitted.

[4] Element piece forming step (etching step)
Next, as shown in FIG. 15, the element piece 3 is formed by etching the substrate 103. Accordingly, as shown in FIG. 17, the fixed portions 31, 32, the movable portion 33, the connecting portions 34, 35, and the movable electrode portion that are integrally formed for each base substrate 2 (that is, for each physical quantity sensor 1). The element piece 3 provided with 36 and 37 and the fixed electrode portions 38 and 39 formed in a state separated from these is obtained.

  The integrally formed fixed portions 31, 32, movable portion 33, connecting portions 34, 35, and movable electrode portions 36, 37 are electrically connected to the wiring 43 through the protrusions 50 connected to the fixed portion 31. Is done. Of the fixed electrode portions 38 and 39, the first fixed electrode fingers (382, 384, 386, 388, 392, 394, 396, and 398 shown in FIG. 2) are electrically connected to the wiring 41 through the protrusions 481 and 482. The second fixed electrode fingers (381, 383, 385, 387, 391, 393, 395, 397 shown in FIG. 2) are electrically connected to the wiring 42 through the protrusions 471, 472.

  The etching method is not particularly limited. For example, one or two of physical etching methods such as plasma etching and beam etching, and chemical etching methods such as reactive ion etching, photo-assisted etching, and wet etching are used. A combination of more than one species can be used. Among these etching methods, reactive ion etching can be preferably used from the viewpoint of processing accuracy.

  Here, it is assumed that the conductor pattern does not have the shared wiring 47, that is, the wirings 41, 42, and 43 are not electrically connected to each other. In the substrate 302 shown in FIG. 16, the wirings 41 and 42 and the wiring 43 (not shown in FIG. 16) are electrically insulated from each other. In the bonding step described above, when the substrate 103 is bonded to such a substrate 302 by an anodic bonding method, the substrate 302 is charged by static electricity generated during bonding.

  When reactive ion etching is used in the etching step, the element piece 3 in which the movable portion 33 and the fixed electrode portions 38 and 39 (the fixed electrode fingers 381 to 388 and 391 to 398) are separated from the substrate 103 by etching. Is formed, plasma is irradiated onto the substrate 302 through the gap between the movable portion 33 and the fixed electrode portions 38 and 39, and the substrate 302 is charged.

  When the substrate 302 is charged, the movable portion 33 of the element piece 3 formed by etching and the substrate 302 are electrically insulated, so that a potential difference is generated between the movable portion 33 and the substrate 302. Due to this potential difference, as shown in FIG. 16, the movable portion 33 is attracted to the substrate 302 and contacts the bottom surface of the cavity portion 21, and the movable portion 33 (movable electrode portions 36, 37) becomes the substrate 302 (the bottom surface of the cavity portion 21). ) Sticking (so-called sticking) may occur.

  On the other hand, in this embodiment, as shown in FIG. 17, the fixed portion 31 formed integrally with the movable portion 33 (movable electrode portions 36 and 37) is electrically connected to the wiring 43 through the protrusion 50. It is connected to the. The fixed electrode portions 38 and 39 are electrically connected to the wirings 41 and 42 through the protrusions 471, 472, 481 and 482. The wirings 41, 42, and 43 are electrically connected to the shared wiring 47.

  Accordingly, the fixed electrode portions 38 and 39 of the formed element piece 3, the movable portion 33 (movable electrode portions 36 and 37) separated from the fixed electrode portions 38 and 39, and the shared wiring 47 disposed on the substrate 102. And have the same potential. Thereby, since the charging of the substrate 102 is suppressed, it is possible to prevent the movable portion 33 (movable electrode portions 36 and 37) from sticking to the substrate 102.

[5] Lid Arrangement Step Next, as shown in FIG. 18, the lid member 105 is joined to the upper surface of the substrate 102 by anodic bonding. The lid member 105 is a base material that can take a plurality of lid members 5 (see FIGS. 3 to 5). As shown in FIG. 19, a plurality of recesses 51 are formed in the lid member 105 for each base substrate 2 (that is, for each physical quantity sensor 1), and each recess 51 corresponds to each cavity 21 and each element piece 3. It arrange | positions so that it may correspond. Thereby, the joined body 101 is obtained in which the substrate 102 and the lid member 105 are joined so as to accommodate the element piece 3.

  Also in this lid portion arranging step, in the conventional physical quantity sensor manufacturing method, the substrate 302 is charged by static electricity generated when the substrate 302 and the lid member 105 are joined, and the movable portion 33 is attracted to the substrate 302. There were cases where sticking occurred. On the other hand, in the present embodiment, the fixed electrode portions 38 and 39 and the movable portion 33 (movable electrode portions 36 and 37) of the element piece 3 and the shared portion disposed on the substrate 102 are also provided in the lid portion arranging step. Since the wiring 47 has the same potential and charging of the substrate 102 is suppressed, the occurrence of sticking of the movable portion 33 (movable electrode portions 36 and 37) can be suppressed.

[6] Cutting process (wiring cutting process)
Next, as shown in FIG. 19, the wirings 41, 42, and 43 are separated from the shared wiring 47 in the state of the bonded body 101. In the dividing step, portions of the wirings 41, 42, 43 that extend from the electrodes 44, 45, 46 to the shared wiring 47 side are cut along a cutting line 92 shown in FIG. Examples of the cutting method include a method using laser light (laser patterning). By using laser patterning, generation of dust from the substrate 102 can be suppressed and the wirings 41, 42, and 43 can be selectively cut. Further, by using laser patterning, the wirings 41, 42, and 43 can be accurately cut at a desired cutting position.

  In this embodiment, since the separation step is performed after the lid member 105 covering the element piece 3 is bonded to the upper surface of the substrate 102 in the lid portion arranging step, the element piece 3 is protected from being damaged in the division step. it can. Further, even when dust or the like is generated in the dividing step, it is possible to prevent the dust or the like from adhering to the element piece 3.

  FIG. 20 is a plan view showing a state in which the wirings 41, 42, 43 are cut. As illustrated in FIG. 20, the wirings 41, 42, and 43 are cut between the electrodes 44, 45, and 46 and the shared wiring 47 and are separated from the shared wiring 47. Therefore, in each base substrate 2, the wirings 41, 42, and 43 are electrically insulated from each other. Further, in the wirings 41, 42, and 43 shown in FIG. 19, the portions 41b, 42b, and 43b on the shared wiring 47 side from the cutting line 92 remain. Of the wirings 41, 42, and 43, some of the portions extending from the electrodes 44, 45, and 46 to the shared wiring 47 side may remain.

  Accordingly, the movable electrode portions 36 and 37 electrically connected to the wiring 43 and the first fixed electrode fingers 382 electrically connected to the wiring 41 for each base substrate 2 (that is, for each physical quantity sensor 1). , 384, 386, 388, 392, 394, 396, 398 (see FIG. 2) and the second fixed electrode fingers 381, 383, 385, 387, 391, 393, 395, 397 electrically connected to the wiring 42 (See FIG. 2) are electrically insulated from each other.

[7] Inspection Step Next, although not shown, in the state of the bonded body 101, the element piece 3 is inspected for each base substrate 2 (that is, each physical quantity sensor 1). Examples of the inspection here include inspection of electrical characteristics. For example, an inspection drive signal is applied to the electrodes 44, 45, and 46 by an inspection device, the amount of change in electrostatic capacitance between the movable electrode portion 36 and the fixed electrode portion 38 of the element piece 3, and the movable electrode portion 37. Whether or not to normally operate as a physical quantity sensor is determined by detecting the amount of change in capacitance between the sensor and the fixed electrode unit 39.

  In the present embodiment, in each physical quantity sensor 1 included in the bonded body 101, the wirings 41, 42, and 43 are separated from the shared wiring 47 in the separation process and electrically insulated from each other. The inspection for each physical quantity sensor 1 can be performed in the state of the bonded body 101 in which 1 is arranged. Therefore, compared with the case where inspection is performed for each physical quantity sensor 1 after being separated from the bonded body 101, handling during inspection such as setting to an inspection apparatus is easier, and automation of inspection is also easier. In the inspection process, when something that does not operate normally is detected, the target physical quantity sensor 1 is specified and stored in the inspection apparatus.

[8] Dividing Step Next, the bonded body 101 is divided into pieces (dicing). As shown in FIG. 21, the lid member 105 and the substrate 102 are cut along a scribe line (dicing groove) 94, and the joined body 101 is separated into pieces to obtain the physical quantity sensor 1.

  As shown in FIG. 22, the scribe line 94 is set so as to overlap with the shared wiring 47 and a part of the remaining portions 41b, 42b, and 43b of the wirings 41, 42, and 43 in the dividing step in a plan view. Accordingly, the shared wiring 47 and a part of the remaining portions 41b, 42b, 43b of the wirings 41, 42, 43 are removed by dicing, and the separated physical quantity sensor 1 has an area within the base substrate 2 region. Of the remaining portions 41b, 42b, and 43b, portions that have not been removed remain as isolated patterns 41a, 42a, and 43a.

  Note that the scribe line 94 may be set so as to overlap the entire remaining portions 41b, 42b, and 43b of the wirings 41, 42, and 43 in the dividing step in a plan view. In other words, the scribe line 94 may be set so as to overlap at least a part of the cutting line 92 (see FIG. 19) in the dividing step. In this case, the isolated patterns 41a, 42a, and 43a do not remain in the region of the base substrate 2 of the physical quantity sensor 1 that has been separated.

  According to the physical quantity sensor manufacturing method according to the present embodiment, since each physical quantity sensor 1 is inspected before the individualization step, the inspection process is performed on each physical quantity sensor 1 separated from the joined body 101. In this case, it is possible to select the one determined to operate normally and the one determined not to operate normally. That is, the physical quantity sensor 1 determined not to operate normally in the inspection process can be excluded from the processing target in the subsequent manufacturing process of the physical quantity sensor device.

[Method for Manufacturing Physical Quantity Sensor Device]
Next, a manufacturing method of the physical quantity sensor device 200 according to the first embodiment will be described with reference to FIG. As shown in FIG. 6, a substrate 201 having a plurality of terminals 207 arranged on the upper surface and mounting terminals 208 arranged on the lower surface is prepared. Then, the physical quantity sensor 1 manufactured by the above-described manufacturing method is fixed to the upper surface of the substrate 201 via the adhesive layer 203, and the IC chip 202 is fixed to the upper surface of the physical quantity sensor 1 via the adhesive layer 204.

  Subsequently, the IC chip 202 is electrically connected to the electrodes 44, 45, 46 of the physical quantity sensor 1 through the bonding wire 205 and is electrically connected to the terminal 207 of the substrate 201 through the bonding wire 206. I do. Then, a process of molding the physical quantity sensor 1 and the IC chip 202 with the molding material 209 is performed. Thereby, the physical quantity sensor device 200 is obtained. Instead of molding with the molding material 209, the physical quantity sensor 1 and the IC chip 202 may be packaged with a ceramic material or the like.

  By the way, in the physical quantity sensor described in Patent Document 1, since it is not checked whether the physical quantity sensor operates normally at the time when the physical quantity sensor is singulated, it is necessary to perform an inspection after the singulation process. is there. When inspecting the physical quantity sensor device, the physical quantity sensor is fixed to the physical quantity sensor that does not operate normally, and the electronic part is fixed and electrically connected via a bonding wire. There is a possibility that the manufacturing yield of the apparatus is reduced and the production cost is increased. In addition, when an individual inspection is performed on a physical quantity sensor that has been singulated before the physical quantity sensor device is manufactured, handling at the time of the inspection may be complicated, and man-hours may increase.

  In the present embodiment, since the physical quantity sensor 1 is inspected in the state of the joined body 101 before being singulated, the physical quantity sensor 1 determined to be easy to handle during inspection and not to operate normally is singulated. Can be excluded at the time. Therefore, compared with the physical quantity sensor manufacturing method described in Patent Document 1, the physical quantity sensor device 200 can be manufactured for the physical quantity sensor 1 determined to operate normally in the inspection process. The production yield can be improved and the production cost can be reduced.

  Next, examples of electronic devices and moving objects to which the physical quantity sensor 1 according to this embodiment is applied will be described. 23, 24, and 25 are schematic views schematically illustrating examples of electronic devices to which the physical quantity sensor according to this embodiment is applied. FIG. 26 is a schematic diagram schematically illustrating an example of a moving object to which the physical quantity sensor according to this embodiment is applied.

[Electronics]
As shown in FIG. 23, a personal computer 1100 as an example of an electronic device includes a main body 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display unit 1108. The display unit 1106 is supported so as to be rotatable with respect to the main body 1104 via a hinge structure. The personal computer 1100 incorporates the physical quantity sensor 1 of the above embodiment.

  As shown in FIG. 24, a mobile phone 1200 as an example of an electronic device includes a plurality of operation buttons 1202, an earpiece 1204 and a mouthpiece 1206, and between the operation buttons 1202 and the earpiece 1204, A display unit 1208 is arranged. The cellular phone 1200 incorporates the physical quantity sensor 1 of the above embodiment.

  As shown in FIG. 25, a digital still camera 1300 as an example of an electronic device includes a case (body) 1302, a light receiving unit 1304, and a display unit 1310. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver salt photographic film with a light image of a subject, whereas a digital still camera 1300 captures a light image of a subject by photoelectrically converting it with an image sensor such as a CCD (Charge Coupled Device). A signal (image signal) is generated.

  The light receiving unit 1304 is provided on the front side (back side in the drawing) of the case 1302 and includes an optical lens (imaging optical system), a CCD, and the like. The display unit 1310 is provided on the back surface of the case 1302 and is configured to perform display based on an imaging signal from the CCD, and functions as a finder that displays an object as an electronic image.

  When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302.

  A television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication, as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. The digital still camera 1300 incorporates the physical quantity sensor 1 of the above embodiment.

  Note that the physical quantity sensor 1 of the above embodiment includes, for example, an ink jet type ejection device (for example, an ink jet printer), a laptop personal computer, a television, a video camera, a video tape recorder, and a car navigation device in addition to the above electronic devices. , Pager, electronic organizer (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, video phone, crime prevention TV monitor, electronic binoculars, POS terminal, medical device (eg electronic thermometer, blood pressure monitor) , Blood glucose meter, electrocardiogram measurement device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring instruments, instruments (eg, vehicles, aircraft, ship instruments), flight simulators, etc. can do.

[Moving object]
As shown in FIG. 26, an automobile 1500 as an example of a moving body includes a vehicle body 1502 and a tire 1506, and an electronic control unit 1504 that controls the tire 1506 and the like is mounted on the vehicle body 1502. The electronic control unit 1504 incorporates the physical quantity sensor 1 of the above embodiment.

  The physical quantity sensor 1 of the above embodiment includes a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an anti-lock brake system (ABS), an air bag, a tire pressure monitoring system ( The present invention can be applied to electronic control units (ECUs) such as TPMS (Tire Pressure Monitoring System), engine control, battery monitors of hybrid vehicles and electric vehicles, and vehicle body attitude control systems.

Second Embodiment
[Physical quantity sensor]
Next, a physical quantity sensor according to the second embodiment will be described. The physical quantity sensor according to the second embodiment is substantially the same as the configuration of the physical quantity sensor according to the first embodiment except that the configuration of the element pieces is different and that some configurations such as the conductor pattern are different accordingly. It has the composition of. Here, differences from the first embodiment will be described, and the same reference numerals are given to components common to the first embodiment, and description thereof will be omitted.

  FIG. 27 is a plan view of a physical quantity sensor according to the second embodiment. As shown in FIG. 27, the physical quantity sensor 6 according to the second embodiment includes a base substrate 2A, an element piece 7 bonded to and supported by the base substrate 2A, a conductor pattern 4A provided on the base substrate 2A, And a lid member 5 provided so as to cover the element piece 7. The physical quantity sensor 6 is an acceleration sensor that can measure acceleration in the Z-axis direction (vertical direction). In FIG. 27, the lid member 5 is seen through.

  As in the first embodiment, the base substrate 2A is provided with a cavity 21 on the upper surface thereof. The element piece 7 is provided above the base substrate 2A. The element piece 7 includes a movable portion 73, connecting portions 74 and 75 that support the movable portion 73 so as to be swingable, and support portions 71 and 72 that support the connecting portions 74 and 75. The movable portion 73 can swing the seesaw with respect to the support portions 71 and 72 while twisting and deforming the connecting portions 74 and 75 about the connecting portions 74 and 75.

  The movable portion 73 has a longitudinal shape extending in the X direction. The −X direction (one side) side of the connecting portions 74 and 75 is the first movable portion 731, and the + X direction (the other side) is more than the connecting portions 74 and 75. The side is a second movable portion 732. The second movable portion 732 is longer in the X-axis direction than the first movable portion 731, and the rotational moment when the acceleration in the vertical direction (Z-axis direction) is applied is larger than that of the first movable portion 731. . When vertical acceleration is applied due to the difference in rotational moment, the movable portion 73 swings around the connecting portions 74 and 75 that serve as axes.

  Note that the shapes of the first and second movable parts 731 and 732 are not particularly limited as long as they have different rotational moments. For example, the shapes in plan view are the same and the thicknesses are different. May be. Moreover, it is the same shape, Comprising: The weight part may be arrange | positioned in either one. In order to reduce resistance when the seesaw is rocked, slits (through holes penetrating in the thickness direction) may be formed in the first and second movable parts 731 and 732.

A conductive film (not shown) is provided on the lower surface of the movable portion 73 (the surface facing the bottom surface of the cavity portion 21). This conductive film is electrically connected to the movable portion 73 and has the same potential as the movable portion 73. In this embodiment, the movable part 73 is a movable electrode part. This conductive film is made of, for example, Pt (platinum). Other constituent materials for the conductive film include Au, Ag, Cu, Al, and other metal materials other than Pt (including alloys), ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), In ₃ O ₃ , Examples thereof include oxide conductive materials such as SnO ₂ , Sb-containing SnO ₂ , and Al-containing ZnO, and one or more of these can be used in combination.

  The support parts 71 and 72 are disposed on both sides of the movable part 73 and are joined to the upper surface of the base substrate 2A. The connecting portions 74 and 75 extend along the Y axis, the connecting portion 74 connects the support portion 71 and the movable portion 73, and the connecting portion 75 connects the support portion 72 and the movable portion 73. Yes. In addition, as a structure of the support parts 71 and 72 and the connection parts 74 and 75, if the movable part 73 can be rock | fluctuated by a seesaw, it will not specifically limit.

  Similarly to the first embodiment, the element piece 7 according to the second embodiment is preferably made of silicon as a main material. According to such a configuration, each part of the element piece 7 can be processed with high accuracy by etching.

  The conductor pattern 4A includes a first detection electrode 411, a second detection electrode 421, a dummy electrode 431, wirings 412, 422, 432, electrodes (terminals) 413, 423, 433, and isolated patterns 412a, 422a, 432a. And have. The first detection electrode 411 and the second detection electrode 421 are fixed electrode portions in the present embodiment. The wirings 412 and 422 are the first wirings in the present embodiment. The wiring 432 is the second wiring in the present embodiment.

  The first detection electrode 411 and the second detection electrode 421 are provided on the bottom surface of the cavity portion 21. The first detection electrode 411 is disposed to face the first movable portion 731, and thereby, a capacitance is formed between the first detection electrode 411 and the first movable portion 731. The second detection electrode 421 is disposed to face the second movable part 732, and thereby, a capacitance is formed between the second detection electrode 421 and the second movable part 732. These first and second detection electrodes 411 and 421 are arranged symmetrically with respect to the connecting portions 74 and 75 in a plan view as viewed from the Z-axis direction, and each capacitance in a state where no acceleration is applied. Are substantially equal to each other.

  The dummy electrode 431 is disposed so as to spread over a region of the bottom surface of the cavity portion 21 where the first and second detection electrodes 411 and 421 are not disposed. The dummy electrode 431 has the same potential as that of the movable portion 73, thereby anodic bonding of the silicon substrate (substrate 103 shown in FIG. 13) to be the element piece 7 and the base substrate 2 A (substrate 102 shown in FIG. 13). In this case, charging of the substrate 102 can be suppressed. Thereby, sticking to the base substrate 2A of the movable part 73 formed from the silicon substrate can be effectively suppressed.

  The wiring 412 as the first wiring is electrically connected to the first detection electrode 411. The wiring 422 as the first wiring is electrically connected to the second detection electrode 421. The wiring 432 as the second wiring is electrically connected to the dummy electrode 431 and is electrically connected to the element piece 7 (movable portion 73) through a conductive bump. The electrode 413 is electrically connected to the wiring 412, the electrode 423 is electrically connected to the wiring 422, and the electrode 433 is electrically connected to the wiring 432.

  The electrodes 413, 423, and 433 are arranged on the outer peripheral portion (the outer portion of the lid member 5 on the base substrate 2A) of the upper surface of the base substrate 2A, and can be electrically connected to an external device. ing. The isolated patterns 412a, 422a, and 432a are disposed on the base substrate 2A that is not covered with the lid member 5 so as to face the electrodes 413, 423, and 433, respectively.

  In the physical quantity sensor 6 according to the second embodiment, vertical acceleration can be detected as follows. When the acceleration in the vertical direction is not applied to the physical quantity sensor 6, the movable unit 73 maintains a horizontal state. When the acceleration G1 in the vertical direction (+ Z-axis direction) is applied to the physical quantity sensor 6, the movable portion 73 swings seesaw clockwise with the connecting portions 74 and 75 as axes. On the contrary, when the acceleration G2 in the vertical direction (−Z axis direction) is applied to the physical quantity sensor 6, the movable portion 73 swings the seesaw counterclockwise about the connecting portions 74 and 75 as axes.

  By such seesaw swinging of the movable portion 73, the separation distance between the first movable portion 731 and the first detection electrode 411 and the separation distance between the second movable portion 732 and the second detection electrode 421 are changed. Accordingly, the capacitance between the first movable portion 731 and the first detection electrode 411 and the capacitance between the second movable portion 732 and the second detection electrode 421 change. Thereby, the magnitude and direction of acceleration can be detected based on the difference between the magnitudes of both capacitances (by the differential detection method). In particular, acceleration can be detected with higher accuracy by using a differential detection method.

[Method of manufacturing physical quantity sensor]
Since the physical quantity sensor 6 according to the second embodiment is also manufactured by the same manufacturing method as that of the physical quantity sensor according to the first embodiment, description of each process is omitted.

  Although not shown, also in the physical quantity sensor 6 according to the second embodiment, when the conductor pattern 4A is formed on the upper surface of the substrate 102 in the conductor pattern forming step, the shared wiring 47 (FIG. 11) is formed. The wirings 412, 422, and 432 are formed so as to extend outside the region to be the base substrate 2 </ b> A and to be connected to the shared wiring 47. Therefore, the wirings 412, 422, and 432 are electrically connected to the shared wiring 47 until they are cut in the dividing step. That is, not only the dummy electrode 431 but also the first detection electrode 411, the second detection electrode 421, and the shared wiring 47 provided on the base substrate 2A have the same potential in the movable portion 73 of the element piece 7.

  The wirings 412, 422, and 432 are disconnected from the shared wiring 47 by being cut between the electrodes 413, 423, and 433 and the shared wiring 47 in the dividing process. As a result, the wirings 412, 422, and 432 are electrically insulated from each other, and the isolated patterns 412a, 422a, and 432a remain.

  Also in the physical quantity sensor 6 according to the second embodiment, the first detection electrode 411, the second detection electrode 421, and the dummy electrode 431 formed on the substrate 102 in the bonding process, the etching process, and the lid placement process, Since the movable portion 73 disposed opposite to these electrodes has the same potential and charging of the substrate 102 is suppressed, occurrence of sticking of the movable portion 73 can be suppressed.

  In addition, since the wirings 412, 422, and 432 are electrically insulated from each other in the dividing process, before being separated into the physical quantity sensor 6, it is determined that the wiring is not normally operated and the one that is determined to operate normally in the inspection process. Can be selected. Therefore, since the physical quantity sensor device can be manufactured using the physical quantity sensor 6 that is determined to operate normally in the inspection process, it is possible to improve the manufacturing yield of the physical quantity sensor device and reduce the production cost.

  The above-described embodiments merely show one aspect of the present invention, and can be arbitrarily modified and applied within the scope of the present invention. As modifications, for example, the following can be considered.

(Modification 1),
The configuration of the movable part and the fixed electrode part is not limited to the above embodiment. For example, the fixed electrode unit is the first embodiment if at least one fixed electrode finger of a plurality of fixed electrode fingers arranged in a comb-like shape is separated from the other fixed electrode fingers on the base substrate. It may be a different form. In addition, the number, arrangement, size, and the like of the plurality of fixed electrode fingers of the fixed electrode portion and the plurality of movable electrode fingers of the movable electrode portion provided so as to mesh with the fixed electrode fingers are different from those of the first embodiment. Also good. Furthermore, the movable part may be configured to be displaced in the Y-axis direction, or the movable part may be configured to be rotated around an axis parallel to the X-axis. In this case, the physical quantity may be detected based on the change in capacitance due to the change in the facing area between the movable electrode finger and the fixed electrode finger.

(Modification 2)
In the above embodiment, the wiring 41, 42, 43 or the wiring 412, 422, 432 is cut by the laser beam in the dividing step, but the present invention is not limited to such a form. In the dividing step, the wires 41, 42, 43 or the wires 412, 422, 432 may be cut by half dicing. In the half dicing, the wiring 41, 42, 43 or the wiring 412, 422, 432 can be cut by cutting halfway along the thickness direction of the substrate 102. Further, even when dust or the like is generated by half dicing in the dividing step, it is possible to prevent the dust or the like from adhering to the element pieces 3 and 7.

  DESCRIPTION OF SYMBOLS 1 ... Physical quantity sensor, 2 and 2A ... Base substrate, 5 ... Cover member, 6 ... Physical quantity sensor, 33 ... Movable part, 36 ... Movable electrode part, 37 ... Movable electrode part, 38 ... Fixed electrode part, 39 ... Fixed electrode part , 41 ... wiring (first wiring), 42 ... wiring (first wiring), 43 ... wiring (second wiring), 47 ... shared wiring, 73 ... movable part, 102 ... substrate (first substrate), 103 ... substrate (Second substrate), 200 ... physical quantity sensor device, 202 ... IC chip (electronic component), 411 ... first detection electrode (fixed electrode portion), 412 ... wiring (first wiring), 421 ... second detection electrode (fixed) Electrode portion), 422... Wiring (first wiring), 432... Wiring (second wiring).

Claims (4)

A base substrate;
An element piece having a fixed electrode portion fixed on the base substrate, and a movable electrode portion provided on the base substrate so as to be displaceable and disposed to face the fixed electrode portion;
A method of manufacturing a physical quantity sensor, comprising: a first wiring disposed on the base substrate and electrically connected to the fixed electrode portion; and a second wiring electrically connected to the movable electrode portion. ,
A conductor that forms the first wiring, the second wiring, and the shared wiring electrically connected to the first wiring and the second wiring on the first substrate that is a base material of the base substrate A pattern forming process;
A bonding step of bonding a second substrate serving as a base material of the element piece to the first substrate, and electrically connecting the second substrate to the first wiring and the second wiring;
An element piece forming step of forming the element piece having the fixed electrode portion and the movable electrode portion by etching the second substrate;
A dividing step of dividing the first wiring and the second wiring from the shared wiring;
An inspection step of inspecting the element pieces on the first substrate for each of the element pieces via the first wiring and the second wiring;
A method of manufacturing a physical quantity sensor, comprising: dividing the first substrate into individual element pieces to obtain a plurality of physical quantity sensors.   2. The method of manufacturing a physical quantity sensor according to claim 1, wherein in the dividing step, the first wiring and the second wiring are cut with a laser beam.   The method of manufacturing a physical quantity sensor according to claim 1, further comprising a lid portion arranging step of joining a lid member that covers the element piece on the base substrate before the dividing step. Electrically connecting the physical quantity sensor manufactured by the physical quantity sensor manufacturing method according to any one of claims 1 to 3 and an electronic component;
A method of manufacturing a physical quantity sensor device, comprising: molding or packaging the physical quantity sensor and the electronic component.

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