CN105772946A - CO2 laser beam polishing device - Google Patents
CO2 laser beam polishing device Download PDFInfo
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- CN105772946A CN105772946A CN201610135735.4A CN201610135735A CN105772946A CN 105772946 A CN105772946 A CN 105772946A CN 201610135735 A CN201610135735 A CN 201610135735A CN 105772946 A CN105772946 A CN 105772946A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
Abstract
A CO2 laser beam polishing device comprises a pulse or continuous CO2 laser device, a laser power control system, a light beam shaping system, an automatic focusing system, a scanning system, and a temperature control and four-dimensional platform linkage system. According to the device, the laser machining technology and the automatic control technology are combined, and an optical element is subject to high-precision polishing. The CO2 laser beam polishing device can be widely applied to optical elements in various surface shapes, such as the plane shape, the spherical shape and the non-spherical shape, and particularly the small complex surface shape.
Description
Technical field
The present invention relates to the polishing of optical element, particularly a kind of CO2 laser beam burnishing device, can be widely applied to the fine polishing of the optical element of various shapes, such as plane, sphere, aspheric surface etc., particularly small complex optical element.
Background technology
At present, the method for optical element polishing mainly there are underhand polish, pressing mold molding, numerical control turning and the numerical control small tool polishing that the Computer Control Technology being representative with small abrasive nose polishing, strain disc polishing, MRF, ion beam polishing etc. is core.The development of these polishing technologies constantly promotes the development of optical processing technology, but the problems such as the subsurface defect that polishing powder (liquid) embeds pollution, processing brings, intermediate frequency error, the finishing method remaining commercial at present is very severe, key technical problem to be solved.
Laser polishing is as a kind of new numerical control polishing technology, it is based on CO2 high-order harmonics spectrum, the Research foundations such as optical element Ultra-precision Turning and detection technique, by laser shaping, focal spot shaping, the fast automatic focusing of laser, light source optimization process, and the beam scanning path based on surface shape measurement feedback designs and four-degree-of-freedom high accuracy platform coordinated signals, realize the system integration of laser polishing technology and automated control technology, optical element is realized high accuracy polishing.Laser polishing is contactless polishing, without subsurface defect；Motility is high, and consuming time short, polishing time is independent of morphology, is suitable for the polishing of plane, sphere, free form surface element；Without advantages such as polishing fluid, safety non-pollutions.
Summary of the invention
A kind of CO2Laser beam burnishing device, is characterized in that including pulse or continuous CO2Laser instrument and Laser energy attenuation system, beam shaping system, autofocus system, scanning system, temperature control and four-dimensional platform linked system；
Described pulse or continuously CO2Laser instrument and Laser energy attenuation system are by continuous or pulse CO2nullLaser light source、Aperture、Attenuator、Shutter and lens composition，Described beam shaping system is by beam expanding lens、Spatial light modulator、First pair of glued achromat、Second pair of glued achromat、It is positioned at the pin hole on this spatial light modulator Fourier spectrum face and the first reflecting mirror composition，Described autofocus system is by focusing objective len、Spectroscope、Off-axis two quadrant signal sensor、The signal processor being connected with this off-axis two quadrant signal sensor、The microdisplacement actuator composition being connected with this signal processor，Described scanning system includes the second reflecting mirror、Beam expanding lens、F θ lens and the scanning device being made up of the rotatable illuminator of X-axis and the rotatable illuminator of Y-axis，Described temperature control and four-dimensional platform linked system include four-dimensional platform、It is placed on the temperature controller on this four-dimension platform、And control the coordinated control system that this four-dimension platform moves；
Said elements position relationship is as follows:
Described pulse or continuously CO2The Output of laser of laser instrument sequentially passes through the aperture of same optical axis, attenuator, shutter, lens, beam expanding lens and spatial light modulator, the light beam reflected through this spatial light modulator sequentially passes through first pair of glued achromat of same optical axis, pin hole, second pair of glued achromat and the first reflecting mirror, the light path reflected through this first reflecting mirror incides the second described reflecting mirror, and reflected by this second reflecting mirror, this reflection light beam sequentially passes through f θ lens and the beam expanding lens of the same optical axis of vertical direction, incide the rotatable illuminator of described X-axis, through the rotatable mirror reflection of this X-axis, enter the rotatable illuminator of Y-axis, through the rotatable mirror reflection of this Y-axis, vertically sequentially enter spectroscope and focusing objective len, this focusing objective len is by beam orthogonal radiation to the sample being positioned over described temperature controller；Reflect through sample surfaces, after reflection light line focus object lens successively and spectroscope (3-2), gathered by off-axis dual-quadrant detector, and transmit to signal processor, produce to drive signal through signal processor computing, thus driving the fine motion up and down of microdisplacement actuator, this driving microdisplacement actuator is connected with focusing objective len (3-1), thus driving this focusing objective len to carry out dynamic defocusing compensation.
Described beam shaping system is by beam expanding lens, spatial light modulator, first pair of glued achromat, pin hole, second pair of glued achromat, first reflecting mirror composition, wherein said spatial light modulator is for can compile reflective pure phase position LCD space light modulator, spatial light modulator, the pupil plane of focusing objective len and the first achromatic doublet, second achromatic doublet one 4f system of composition, the pin hole being positioned on spatial light modulator Fourier spectrum face only allows first-order diffraction light pass through, the phase diagram in spatial light modulator is dynamically changed by computer programming, in the process of laser polishing and ablation, the needs based on the processing of not coplanar type carry out spatial beam shaping in real time.
Described autofocus system is made up of focusing objective len, spectroscope, off-axis two quadrant signal sensor, signal processor, microdisplacement actuator, after collimated light enters object lens, reflect through sample surfaces, sequentially pass through focusing objective len and spectroscope to be accepted by off-axis dual-quadrant detector, the result that two signals do division arithmetic sends into signal processor, and produce the driving signal of microdisplacement actuator, thus driving the fine motion up and down of microdisplacement actuator, this driving microdisplacement actuator drives the focusing objective len being connected to move into the defocusing compensation of Mobile state.Off-axis dual-quadrant detector and relevant light paths thereof constitute the input system of focusing system, are that the defocus signal to system carries out dynamic monitoring, and microdisplacement actuator is as the actuator of system balance, to ensure that system is in focus state.
Described scanning system includes the second reflecting mirror, f θ lens, beam expanding lens and the scanning device being made up of the rotatable illuminator of X-axis, the rotatable illuminator of Y-axis, scanning device is by the light beam projecting plane to four-dimensional platform, form a scanning element, wherein f θ lens are for the linear distortion in the focusing of laser beam and compensated scanning system, the distortion of scanned picture is corrected, the method compensating plan employing software correction of scanning field distortion.
Described temperature control and four-dimensional platform linked system are made up of temperature controller, four-dimensional platform, coordinated control system (5-3), wherein temperature controller is aluminum temperature controller, four-dimensional platform is mechanical type screw drive system, it is made up of rotatable accurate lead screw, dynamo-electric reforming unit, sliding friction guide rail, control computer, control computer and the signal of telecommunication is transferred to dynamo-electric reforming unit, dynamo-electric reforming unit controls screw mandrel and rotates, it is achieved be accurately positioned.
The control system of described scanning system and temperature control and four-dimensional platform linkage subsystem by controlling computer, PLC electric control system, motion servo control system, hand-held box control system, power-supply system form, the structure adopting layering is controlled, wherein, cooperation layer is for the display of path planning, resolving, the scheduling of processing tasks and duty；Each movable joint is then carried out SERVO CONTROL by motion controller by execution level；Drive layer to control for the driving realizing motor, and realize the effective control to electrically point system by PLC control system.
The invention have the advantage that
What apparatus of the present invention were laser processing technologys with automated control technology is integrated, and employing is a kind of contactless polishing mode, will not bring subsurface defect；Assist without polishing powder (liquid), be absent from polishing fluid and pollute.Can be widely applied to the optical element of various shapes, such as plane, sphere, aspheric surface etc., particularly small complex face shape.May be used for solving the technical problems such as the encountered polishing fluid pollution of current polishing technology and subsurface defect.
Accompanying drawing explanation
Fig. 1 is CO2 laser beam burnishing device schematic diagram
Fig. 2 is continuously or pulse CO2 light source and energy management system schematic diagram
Fig. 3 is the schematic diagram of beam shaping system
Fig. 4 is the schematic diagram of autofocus system
Fig. 5 is the schematic diagram of scanning system
Fig. 6 is temperature control and four-dimensional platform linked system schematic diagram
Detailed description of the invention
Below in conjunction with example and accompanying drawing, the present invention will be further described.
Consulting Fig. 1, Fig. 1 is described CO2Laser beam burnishing device schematic diagram.As seen from the figure, a kind of CO2Laser beam burnishing device, is characterized in that including pulse or continuous CO2Laser instrument and Laser energy attenuation system 1, beam shaping system 2, autofocus system 3, scanning system 4, temperature control and four-dimensional platform linked system 5；
Described pulse or continuously CO2Laser instrument and Laser energy attenuation system 1 are by continuous or pulse CO2nullLaser light source 1-1、Aperture 1-2、Attenuator 1-3、Shutter 1-4 and lens 1-5 composition，Described beam shaping system 2 is by beam expanding lens 2-1、Spatial light modulator 2-2、First couple of glued achromat 2-3、Second couple of glued achromat 2-4、It is positioned at the pin hole 2-5 on this spatial light modulator 2-2 Fourier spectrum face and the first reflecting mirror 2-6 composition，Described autofocus system 3 is by focusing objective len 3-1、Spectroscope 3-2、Off-axis two quadrant signal sensor 3-3、With this off-axis two quadrant signal sensor 3-3 signal processor 3-4 being connected、Form with this signal processor 3-4 microdisplacement actuator 3-5 being connected，Described scanning system 4 includes the second reflecting mirror 4-1、Beam expanding lens 4-2、F θ lens 4-4 and the scanning device 4-3 being made up of the rotatable illuminator 4-3-2 of X-axis rotatable illuminator 4-3-1 and Y-axis，Described temperature control and four-dimensional platform linked system 5 include four-dimensional platform 5-2、It is placed on the temperature controller 5-1 on this four-dimension platform 5-2、And control this four-dimension platform 5-2 coordinated control system 5-3 moved；
Said elements position relationship is as follows:
Described pulse or continuously CO2nullThe Output of laser of laser instrument 1-1 sequentially passes through the aperture 1-2 of same optical axis、Attenuator 1-3、Shutter 1-4、Lens 1-5、Beam expanding lens 2-1 and spatial light modulator 2-2，First couple of glued achromat 2-3 of same optical axis is sequentially passed through through this spatial light modulator 2-2 light beam reflected、Pin hole 2-5、Second couple of glued achromat 2-4 and the first reflecting mirror 2-6，The second described reflecting mirror 4-1 is incided through this first reflecting mirror 2-6 light path reflected，And reflected by this second reflecting mirror 4-1，This reflection light beam sequentially passes through the f θ lens 4-4 and beam expanding lens 4-2 of the same optical axis of vertical direction，Incide the rotatable illuminator 4-3-1 of described X-axis，Through the rotatable illuminator 4-3-1 reflection of this X-axis，Enter the rotatable illuminator 4-3-2 of Y-axis，Through the rotatable illuminator 4-3-2 reflection of this Y-axis，Vertically sequentially enter spectroscope 3-2 and focusing objective len 3-1，This focusing objective len 3-1 is by beam orthogonal radiation to the sample being positioned over described temperature controller 5-1；Reflect through sample surfaces, after reflection light line focus object lens 3-1 successively and spectroscope 3-2, gathered by off-axis dual-quadrant detector 3-3, and transmit to signal processor 3-4, produce to drive signal through signal processor 3-4 computing, thus driving the fine motion up and down of microdisplacement actuator 3-5, this driving microdisplacement actuator 3-5 is connected with focusing objective len 3-1, thus driving this focusing objective len 3-1 to carry out dynamic defocusing compensation.
Continuous or pulse CO as described in Figure 22LASER Light Source and energy management system 1 form as it can be seen, successively by continuous or pulse CO2Laser beam source 1-1, aperture 1-2, attenuator 1-3, shutter 1-4, lens 1-5 form, and for axial light path of sharing the same light.
nullBeam shaping system 2 as described in Figure 3 forms as shown in the figure，By beam expanding lens 2-1、Spatial light modulator 2-2、First couple of glued achromat 2-3、Pin hole 2-5、Second couple of glued achromat 2-4、First reflecting mirror 2-6 composition，Wherein said spatial light modulator 2-2 is for can compile reflective pure phase position LCD space light modulator，Spatial light modulator 2-2、The pupil plane of focusing objective len 3-1 and the first achromatic doublet 2-3，Second achromatic doublet 2-4 forms a 4f system，The pin hole 2-5 being positioned on spatial light modulator 2-2 Fourier spectrum face only allows first-order diffraction light pass through，The phase diagram on spatial light modulator 2-2 is dynamically changed by computer programming，In the process of laser polishing and ablation, the needs based on the processing of not coplanar type carry out spatial beam shaping in real time.
As Fig. 4 autofocus system 3 forms as shown in the figure, by focusing objective len 3-1, spectroscope 3-2, off-axis two quadrant signal sensor 3-3, signal processor 3-4, microdisplacement actuator 3-5 forms, after collimated light enters object lens 3-1, reflect through sample surfaces, sequentially pass through focusing objective len 3-1 and spectroscope 3-2 to be accepted by off-axis dual-quadrant detector 3-3, the result that two signals do division arithmetic sends into signal processor 3-4, and produce the driving signal of microdisplacement actuator, thus driving the fine motion up and down of microdisplacement actuator 3-5, this driving microdisplacement actuator 3-5 drives the focusing objective len 3-1 being connected to move into the defocusing compensation of Mobile state.Off-axis dual-quadrant detector 3-3 and relevant light paths thereof constitute the input system of focusing system, are that the defocus signal to system carries out dynamic monitoring, and microdisplacement actuator 3-5 is as the actuator of system balance, to ensure that system is in focus state.
Scanning system 4 as described in Figure 5 forms as shown in the figure, including second reflecting mirror 4-1, f θ lens 4-4, beam expanding lens 4-2 and the scanning device 4-3 that is made up of X-axis rotatable illuminator 4-3-1, the rotatable illuminator 4-3-2 of Y-axis, scanning device 4-3 is by the light beam projecting plane to four-dimensional platform 5-2, form a scanning element, wherein f θ lens 4-4 is for the linear distortion in the focusing of laser beam and compensated scanning system, the distortion of scanned picture is corrected, the method compensating plan employing software correction of scanning field distortion.
Temperature control and four-dimensional platform linked system form as shown in the figure as described in Figure 6, it is made up of temperature controller 5-1, four-dimensional platform 5-2, coordinated control system 5-3, wherein temperature controller 5-1 is aluminum temperature controller, four-dimensional platform 5-2 is mechanical type screw drive system, it is made up of rotatable accurate lead screw, dynamo-electric reforming unit, sliding friction guide rail, control computer, controlling computer and the signal of telecommunication is transferred to dynamo-electric reforming unit, dynamo-electric reforming unit controls screw mandrel and rotates, it is achieved be accurately positioned.
The control system of described scanning system 4 and temperature control and four-dimensional platform linkage subsystem 5 by controlling computer, PLC electric control system, motion servo control system, hand-held box control system, power-supply system form, the structure adopting layering is controlled, wherein, cooperation layer is for the display of path planning, resolving, the scheduling of processing tasks and duty；Each movable joint is then carried out SERVO CONTROL by motion controller by execution level；Drive layer to control for the driving realizing motor, and realize the effective control to electrically point system by PLC control system.
Claims (6)
1. a CO2Laser beam burnishing device, is characterized in that including pulse or continuous CO2Laser instrument and Laser energy attenuation system (1), beam shaping system (2), autofocus system (3), scanning system (4), temperature control and four-dimensional platform linked system (5)；
Described pulse or continuously CO2Laser instrument and Laser energy attenuation system (1) are by continuous or pulse CO2nullLaser light source (1-1)、Aperture (1-2)、Attenuator (1-3)、Shutter (1-4) and lens (1-5) composition，Described beam shaping system (2) is by beam expanding lens (2-1)、Spatial light modulator (2-2)、First pair of glued achromat (2-3)、Second pair of glued achromat (2-4)、It is positioned at the pin hole (2-5) on this spatial light modulator (2-2) Fourier spectrum face and the first reflecting mirror (2-6) composition，Described autofocus system (3) is by focusing objective len (3-1)、Spectroscope (3-2)、Off-axis two quadrant signal sensor (3-3)、The signal processor (3-4) being connected with this off-axis two quadrant signal sensor (3-3)、Microdisplacement actuator (3-5) composition being connected with this signal processor (3-4)，Described scanning system (4) includes the second reflecting mirror (4-1)、Beam expanding lens (4-2)、F θ lens (4-4) and the scanning device (4-3) being made up of the rotatable illuminator of X-axis (4-3-1) and the rotatable illuminator of Y-axis (4-3-2)，Described temperature control and four-dimensional platform linked system (5) include four-dimensional platform (5-2)、It is placed on the temperature controller (5-1) on this four-dimension platform (5-2)、And control the coordinated control system (5-3) of this four-dimension platform (5-2) movement；
Said elements position relationship is as follows:
Described pulse or continuously CO2nullThe Output of laser of laser instrument (1-1) sequentially passes through the aperture (1-2) of same optical axis、Attenuator (1-3)、Shutter (1-4)、Lens (1-5)、Beam expanding lens (2-1) and spatial light modulator (2-2)，The light beam reflected through this spatial light modulator (2-2) sequentially passes through first pair of glued achromat (2-3) of same optical axis、Pin hole (2-5)、Second pair of glued achromat (2-4) and the first reflecting mirror (2-6)，The light path reflected through this first reflecting mirror (2-6) incides described the second reflecting mirror (4-1)，And reflected by this second reflecting mirror (4-1)，This reflection light beam sequentially passes through f θ lens (4-4) and the beam expanding lens (4-2) of the same optical axis of vertical direction，Incide the rotatable illuminator of described X-axis (4-3-1)，Reflect through the rotatable illuminator of this X-axis (4-3-1)，Enter the rotatable illuminator of Y-axis (4-3-2)，Reflect through the rotatable illuminator of this Y-axis (4-3-2)，Vertically sequentially enter spectroscope (3-2) and focusing objective len (3-1)，This focusing objective len (3-1) is by beam orthogonal radiation to the sample being positioned over described temperature controller (5-1)；Reflect through sample surfaces, after reflection light line focus object lens (3-1) successively and spectroscope (3-2), gathered by off-axis dual-quadrant detector (3-3), and transmit to signal processor (3-4), produce to drive signal through signal processor (3-4) computing, thus driving the fine motion up and down of microdisplacement actuator (3-5), this driving microdisplacement actuator (3-5) is connected with focusing objective len (3-1), thus driving this focusing objective len (3-1) to carry out dynamic defocusing compensation.
2. CO according to claim 12nullLaser beam burnishing device，It is characterized in that described beam shaping system (2) is by beam expanding lens (2-1)、Spatial light modulator (2-2)、First pair of glued achromat (2-3)、Pin hole (2-5)、Second pair of glued achromat (2-4)、First reflecting mirror (2-6) forms，Wherein said spatial light modulator (2-2) is for can compile reflective pure phase position LCD space light modulator，Spatial light modulator (2-2)、The pupil plane of focusing objective len (3-1) and the first achromatic doublet (2-3)，Second achromatic doublet (2-4) forms a 4f system，The pin hole (2-5) being positioned on spatial light modulator (2-2) Fourier spectrum face only allows first-order diffraction light pass through，The phase diagram in spatial light modulator (2-2) is dynamically changed by computer programming，In the process of laser polishing and ablation, the needs based on the processing of not coplanar type carry out spatial beam shaping in real time.
3. CO according to claim 12Laser beam burnishing device, it is characterized in that described autofocus system (3) is by focusing objective len (3-1), spectroscope (3-2), off-axis two quadrant signal sensor (3-3), signal processor (3-4), microdisplacement actuator (3-5) forms, after collimated light enters object lens (3-1), reflect through sample surfaces, sequentially pass through focusing objective len (3-1) and spectroscope (3-2) to be accepted by off-axis dual-quadrant detector (3-3), the result that two signals do division arithmetic sends into signal processor (3-4), and produce the driving signal of microdisplacement actuator, thus driving the fine motion up and down of microdisplacement actuator (3-5), this driving microdisplacement actuator (3-5) drives the focusing objective len (3-1) being connected to move into the defocusing compensation of Mobile state.Off-axis dual-quadrant detector (3-3) and relevant light paths thereof constitute the input system of focusing system, it is that the defocus signal to system carries out dynamic monitoring, microdisplacement actuator (3-5) is as the actuator of system balance, to ensure that system is in focus state.
4. CO according to claim 12Laser beam burnishing device, it is characterized in that described scanning system (4) includes the second reflecting mirror (4-1), f θ lens (4-4), beam expanding lens (4-2) and by the rotatable illuminator of X-axis (4-3-1), the scanning device (4-3) that the rotatable illuminator of Y-axis (4-3-2) forms, scanning device (4-3) is by the light beam projecting plane to four-dimensional platform (5-2), form a scanning element, wherein f θ lens (4-4) are for the linear distortion in the focusing of laser beam and compensated scanning system, the distortion of scanned picture is corrected, the method compensating plan employing software correction of scanning field distortion.
5. CO according to claim 12Laser beam burnishing device, it is characterized in that described temperature control and four-dimensional platform linked system (5) are made up of temperature controller (5-1), four-dimensional platform (5-2), coordinated control system (5-3), wherein temperature controller (5-1) is aluminum temperature controller, four-dimensional platform (5-2) is mechanical type screw drive system, it is made up of rotatable accurate lead screw, dynamo-electric reforming unit, sliding friction guide rail, control computer, control computer and the signal of telecommunication is transferred to dynamo-electric reforming unit, dynamo-electric reforming unit controls screw mandrel and rotates, it is achieved be accurately positioned.
6. CO according to claim 12Laser beam burnishing device, it is characterized in that the control system of described scanning system (4) and temperature control and four-dimensional platform linkage subsystem (5) by controlling computer, PLC electric control system, motion servo control system, hand-held box control system, power-supply system form, the structure adopting layering is controlled, wherein, cooperation layer is for the display of path planning, resolving, the scheduling of processing tasks and duty；Each movable joint is then carried out SERVO CONTROL by motion controller by execution level；Drive layer to control for the driving realizing motor, and realize the effective control to electrically point system by PLC control system.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106769881A (en) * | 2016-12-16 | 2017-05-31 | 中国科学院工程热物理研究所 | A kind of thermal conductivity scanning system that heat reflection technology is detected based on pumping |
| CN106940481A (en) * | 2017-05-18 | 2017-07-11 | 华中科技大学 | A kind of reflective laser light-beam forming unit |
| CN107199401A (en) * | 2017-04-24 | 2017-09-26 | 和品（香港）公司 | A kind of laser polishing machine and the polishing method using the laser polishing machine |
| CN108817674A (en) * | 2018-06-26 | 2018-11-16 | 深圳信息职业技术学院 | A kind of dual-beam five-shaft numerical control laser polishing method |
| CN109079313A (en) * | 2018-09-07 | 2018-12-25 | 中国工程物理研究院激光聚变研究中心 | Laser polishing device and method |
| CN110146991A (en) * | 2019-04-18 | 2019-08-20 | 珠海达明科技有限公司 | A kind of laser facula shaping optical system |
| CN110355473A (en) * | 2019-07-04 | 2019-10-22 | 江苏省徐州华泰工具有限责任公司 | Equipment suitable for tool surface finish |
| CN110900015A (en) * | 2020-01-02 | 2020-03-24 | 北京理工大学重庆创新中心 | Multi-laser composite precision machining method for free-form surface optical lens |
| CN111375897A (en) * | 2018-12-29 | 2020-07-07 | 中国科学院长春光学精密机械与物理研究所 | Optical device for polishing metal surface |
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2016
- 2016-03-10 CN CN201610135735.4A patent/CN105772946B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106769881A (en) * | 2016-12-16 | 2017-05-31 | 中国科学院工程热物理研究所 | A kind of thermal conductivity scanning system that heat reflection technology is detected based on pumping |
| CN107199401A (en) * | 2017-04-24 | 2017-09-26 | 和品（香港）公司 | A kind of laser polishing machine and the polishing method using the laser polishing machine |
| CN106940481A (en) * | 2017-05-18 | 2017-07-11 | 华中科技大学 | A kind of reflective laser light-beam forming unit |
| CN106940481B (en) * | 2017-05-18 | 2022-12-02 | 华中科技大学 | Reflective laser beam shaping device |
| CN108817674A (en) * | 2018-06-26 | 2018-11-16 | 深圳信息职业技术学院 | A kind of dual-beam five-shaft numerical control laser polishing method |
| CN109079313A (en) * | 2018-09-07 | 2018-12-25 | 中国工程物理研究院激光聚变研究中心 | Laser polishing device and method |
| CN111375897A (en) * | 2018-12-29 | 2020-07-07 | 中国科学院长春光学精密机械与物理研究所 | Optical device for polishing metal surface |
| CN111375897B (en) * | 2018-12-29 | 2021-06-15 | 中国科学院长春光学精密机械与物理研究所 | Optical device for polishing metal surface |
| CN110146991A (en) * | 2019-04-18 | 2019-08-20 | 珠海达明科技有限公司 | A kind of laser facula shaping optical system |
| CN110355473A (en) * | 2019-07-04 | 2019-10-22 | 江苏省徐州华泰工具有限责任公司 | Equipment suitable for tool surface finish |
| CN110900015A (en) * | 2020-01-02 | 2020-03-24 | 北京理工大学重庆创新中心 | Multi-laser composite precision machining method for free-form surface optical lens |
| CN110900015B (en) * | 2020-01-02 | 2022-02-01 | 北京理工大学重庆创新中心 | Multi-laser composite precision machining method for free-form surface optical lens |
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