CN105764278A - Electronic device and alignment method thereof - Google Patents

Electronic device and alignment method thereof Download PDF

Info

Publication number
CN105764278A
CN105764278A CN201610112987.5A CN201610112987A CN105764278A CN 105764278 A CN105764278 A CN 105764278A CN 201610112987 A CN201610112987 A CN 201610112987A CN 105764278 A CN105764278 A CN 105764278A
Authority
CN
China
Prior art keywords
overlapping
described part
mark
component
para
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610112987.5A
Other languages
Chinese (zh)
Other versions
CN105764278B (en
Inventor
冯明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianma Microelectronics Co Ltd
Shanghai Tianma Microelectronics Co Ltd
Original Assignee
Tianma Microelectronics Co Ltd
Shanghai Tianma Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianma Microelectronics Co Ltd, Shanghai Tianma Microelectronics Co Ltd filed Critical Tianma Microelectronics Co Ltd
Priority to CN201610112987.5A priority Critical patent/CN105764278B/en
Publication of CN105764278A publication Critical patent/CN105764278A/en
Application granted granted Critical
Publication of CN105764278B publication Critical patent/CN105764278B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0017Casings, cabinets or drawers for electric apparatus with operator interface units

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The application provides an electronic device and an alignment method thereof. The electronic device comprises a first member and a second member. A first identifier is disposed on the first member, and a second identifier is disposed on the second member. The first identifier at least comprises a first part and a second part. The second identifier at least comprises a third part and a fourth part. The third part is used for overlapping alignment with the first part, and the fourth part is used for overlapping alignment with the second part, so as to achieve alignment of the first part and the second part. The width of the third part is equal to the width of the first part, the length of the third part is less than the length of the first part, the width of the fourth part is equal to the width of the second part, and the length of the fourth part is less than the length of the second part, so that the offset between the first identifier and the second identifier can be determined through steps of a non-overlapping region between the third part and the first part and a non-overlapping region between the fourth part and the second part. Compared with conventional alignment identifiers, the identifiers are more accurate in alignment.

Description

Electronic equipment and alignment method thereof
Technical field
The present invention relates to Display Technique field, more particularly, it relates to a kind of electronic equipment and alignment method thereof.
Background technology
Existing electronic equipment needs to use para-position mark such as FPC (FlexiblePrintedCircuit, the surface-mounted integrated circuit) binding procedure showing module.Prior art realizes para-position by laying respectively at two marks on FPC and display floater, and then realizes the connection of corresponding with the circuit on display floater for the circuit on FPC overlap.
As shown in Figure 1, Fig. 1 is the structural representation of existing a kind of para-position mark, wherein the cross that is designated on FPC identifies 1, being designated on the glass substrate of display floater has the mark 2 of four squares, identify 2 central points to overlap with the central point O of mark 1, and mark 1 and the mark 2 after central point O coincidence constitutes similar square structures.
But, identify the outward flange of 1 due to cross and the inward flange identifying 2 of four squares has gap L, this gap L be about 20 μm and more than, therefore, staff is difficult to judge whether cross mark 1 overlaps with the central point O of four squares marks 2 by naked eyes, or it is difficult to judge that whether the gap L of the inward flange of the outward flange of cross mark 1 and four square marks 2 is equal, so may result in the circuit of FPC relatively low with the aligning accuracy of the circuit of display floater, it is easily caused and produces therebetween dislocation, the reliability and stability of impact display modular structure.
Summary of the invention
In view of this, the invention provides a kind of electronic equipment and alignment method thereof, the problem relatively low to solve para-position of the prior art mark aligning accuracy.
For achieving the above object, the present invention provides following technical scheme:
A kind of electronic equipment, including first component and second component, described first component has the first mark, described second component has the second mark;
Described first mark at least includes Part I and Part II, described second mark at least includes Part III and Part IV, described Part III is for carrying out overlapping para-position with described Part I, described Part IV is for carrying out overlapping para-position with described Part II, to realize the para-position of described first component and second component, make the connection corresponding to the circuit on described second component of the circuit on described first component;
Wherein, the width of described Part III equal to the width of described Part I, the length of described Part III less than the length of described Part I, and, the width of described Part IV is equal to the width of described Part II, and the length of described Part IV is less than the length of described Part II.
A kind of alignment method, is applied to electronic equipment described above, and described alignment method includes:
Mobile first component or second component, make the second mark on described second component identify overlapping para-position with first on described first component;
At least judge the Part III of described second mark and the whether overlapping para-position of Part I of described first mark, the Part IV of described second mark and the described first whether overlapping para-position of Part II identified;
If the para-position overlapping with described Part I of described Part III, and the para-position overlapping with described Part II of described Part IV, then the para-position of described first component and second component completes;
If the para-position not overlapping with any one in described Part II with described Part I and described Part IV of described Part III, then move described first component or described second component, to realize the overlapping para-position of described first component and second component.
Compared with prior art, technical scheme provided by the present invention has the advantage that
Electronic equipment provided by the present invention and alignment method thereof, owing to the length of Part III is less than the length of Part I, the length of Part IV is less than the length of Part II, therefore, the drift condition between the first mark and the second mark can be judged by the step of the step of Part III and Part I not overlapping region and Part IV and Part II not overlapping region;
And, owing to the width of Part III is equal to the width of Part I, the width of Part IV is equal to the width of Part II, therefore, after only Part III and Part I are completely overlapped, Part IV is completely overlapped with Part II, ability para-position completes, ratio sensible with existing register guide, aligning accuracy is higher.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to the accompanying drawing provided.
Fig. 1 is the structural representation of existing a kind of para-position mark;
First mark of a kind of L-shaped that Fig. 2 a provides for the embodiment of the present invention and the schematic diagram of the second mark;
First mark of a kind of T-shaped that Fig. 2 b provides for the embodiment of the present invention and the schematic diagram of the second mark;
Fig. 2 c for the embodiment of the present invention provide a kind of criss-cross first mark and second mark schematic diagram;
Fig. 3 a~3d is the schematic diagram that in Fig. 2 b, T-shaped first identifies four kinds of overlap modes with the second mark;
Fig. 4 a~Fig. 4 e is the first mark in Fig. 3 b and second five kinds of drift condition schematic diagrams of mark;
First mark of the another kind of L-shaped that Fig. 5 a provides for the embodiment of the present invention and the schematic diagram of the second mark;
First mark of the another kind of T-shaped that Fig. 5 b provides for the embodiment of the present invention and the schematic diagram of the second mark;
Fig. 5 c identifies and the second schematic diagram identified for the another kind criss-cross first that the embodiment of the present invention provides;
Fig. 6 a~6b is the schematic diagram that the T-shaped first in Fig. 5 b identifies the two of which overlap mode with the second mark;
Fig. 6 c is the schematic diagram of a kind of drift condition of the first mark in Fig. 5 b and the second mark;
First mark of another L-shaped that Fig. 7 a provides for the embodiment of the present invention and the schematic diagram of the second mark;
First mark of another T-shaped that Fig. 7 b provides for the embodiment of the present invention and the schematic diagram of the second mark;
Another criss-cross first mark and second schematic diagram identified that Fig. 7 c provides for the embodiment of the present invention;
Fig. 8 a~8b is the schematic diagram that the cross first in Fig. 7 c identifies the two of which overlap mode with the second mark;
Fig. 8 c is the schematic diagram that the first mark and second in Fig. 7 c identifies a kind of drift condition;
The flow chart of the alignment method that Fig. 9 provides for the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
The embodiment provides a kind of electronic equipment, this electronic equipment includes the first component and the second component that need to carry out para-position connection, this first component has the first mark, second component has the second mark, wherein, first mark at least includes Part I and Part II, and the second mark at least includes Part III and Part IV.Optionally, at least centrage of Part I and the central axis of Part II or crossing, at least centrage of Part III and the central axis of Part IV or crossing.
Optionally, electronic equipment in the present embodiment is display device, first component is surface-mounted integrated circuit or the FPC of display device, second component is the display floater of display device, and second mark be positioned on the substrate of display floater, the first mark and the second mark are for the binding of surface-mounted integrated circuit or FPC and display floater, certainly, the present invention is not limited to this, and the parts of other electronic equipments can also apply the first mark in the embodiment of the present invention and the second mark carries out para-position.
Need further exist for illustrating, first component can have one first mark, it is possible to have multiple first marks, correspondingly, second component can also have one second mark, it is possible to have multiple second marks.Such as, the both sides in surface-mounted integrated circuit binding region can each arrange one first mark, and on the substrate of display floater, corresponding binding both sides, region can also each arrange one second mark.
As shown in Fig. 2 a~2c, first mark of a kind of L-shaped that Fig. 2 a provides for the embodiment of the present invention and the schematic diagram of the second mark, first mark of a kind of T-shaped that Fig. 2 b provides for the embodiment of the present invention and the schematic diagram of the second mark, Fig. 2 c for the embodiment of the present invention provide a kind of criss-cross first mark and second mark schematic diagram, the first mark A in the present embodiment includes Part I A1 and Part II A2, second mark B includes Part III B1 and Part IV B2, wherein, Part III B1 is for carrying out overlapping para-position with Part I A1, Part IV B2 is for carrying out overlapping para-position with Part II A2, to connect after realizing the para-position overlap of the circuit on first component and the circuit on second component.
In the present embodiment, the length L1 of Part III B1 is less than the length L2 of Part I A1, the length L3 of Part IV B2 is less than the length L4 of Part II A2, and, the width W1 of Part III B1 is equal to the width W2 of Part I A1, the width W3 of Part IV B2 is equal to the width W4 of Part II A2, as shown in Figure 2 a.
Certainly, the length and width of Part I to Part IV is not specifically limited by the present invention, and technical staff can be set as the case may be.Optionally, first length L2 or L4 and the surface-mounted integrated circuit of mark A or being approximately equal in length of FPC, namely the length of the first mark A changes with the length change of surface-mounted integrated circuit or FPC.
Owing to the length L1 of Part III B1 is less than the length L2 of Part I A1, the length L3 of Part IV B2 is less than the length L4 of Part II A2, therefore, the drift condition between the first mark A and second mark B can be judged by the step of the step of Part III B1 and Part I A1 not overlapping region and Part IV B2 and Part II A2 not overlapping region, and the position of first component or second component is adjusted according to drift condition, so that first component and second component para-position success.
Owing to the width W1 of Part III B1 is equal to the width W2 of Part I A1, the width W3 of Part IV B2 is equal to the width W4 of Part II A2, therefore, very close to each other between the edge of the first mark edge of A and the second mark B carry out para-position fluctuation, that is, only Part III B1 and Part I A1 is completely overlapped, Part IV B2 and Part II A2 is completely overlapped just can complete para-position afterwards, therefore, ratio sensible with existing register guide, the aligning accuracy that the first mark A and the second in the present invention identifies B is higher.
Optionally, the first mark A in the present embodiment can be L-shaped, T-shaped or decussate texture, second mark B can be L-shaped, T-shaped or decussate texture, certainly, the present invention is not limited to this, first mark A and the second identifies B in other embodiments can also be other shapes, but it should be noted that, the shape need that the shape of the first mark A identifies B with second are identical, in other words, the projection of the first mark A overlaps with the second projection identifying B, and the central point O2 of central point O1 and the second mark B of the first mark A after para-position needs to overlap.It is to say, as shown in Figure 2 a, when the first mark A is L-shaped, the second mark B is also L-shaped;As shown in Figure 2 b, when the first mark A is T-shaped, the second mark B is also T-shaped;As shown in Figure 2 c, when the first mark A is decussate texture, the second mark B is also decussate texture.
In one specifically embodiment, after namely first mark A and the second mark B overlap para-position aligns, a Part III B1 side in the longitudinal direction and a Part I A1 overlapping sideways in the longitudinal direction, or, Part III B1 is overlapping with the zone line of Part I A1;A Part IV B2 side in the longitudinal direction and a Part II A2 overlapping sideways in the longitudinal direction, or, Part IV B2 is overlapping with the zone line of Part II A2.
Being that in Fig. 2 b, T-shaped first identifies the schematic diagram that A and the second identifies four kinds of overlap modes of B with reference to Fig. 3 a to Fig. 3 d, Fig. 3 a~3d, identify A and the second mark B for first and be T-shaped, the overlap mode that the first mark A and the second identifies B illustrates.
As shown in Figure 3 a, Part III B1 short side B10 and Part I A1 in the longitudinal direction short side A10 in the longitudinal direction is overlapping, and Part IV B2 short side B20 and Part II A2 in the longitudinal direction short side A20 in the longitudinal direction is overlapping.
Or, as shown in Figure 3 b, Part III B1 is overlapping with the zone line of Part I A1, namely, Part III B1 and Part I A1 two short side B10 and A10 side B11 and A11 not overlapping, short in the longitudinal direction are not overlapping, Part IV B2 is overlapping with the zone line of Part II A2, and namely Part IV B2 and Part II A2 two short side B20 and A20 side B21 and A21 not overlapping, short in the longitudinal direction are not overlapping.
Or, as shown in Figure 3 c, Part III B1 short side B10 and Part I A1 in the longitudinal direction short side A10 in the longitudinal direction is overlapping, and Part IV B2 is overlapping with the zone line of Part II A2.Or, as shown in Figure 3 d, Part III B1 is overlapping with the zone line of Part I A1, and Part IV B2 short side B20 and Part II A2 in the longitudinal direction short side A20 in the longitudinal direction is overlapping.Certainly.The present invention only illustrates for the structure shown in Fig. 3 a~Fig. 3 d, is not limited to that.
It is five kinds of drift condition schematic diagrams that the first mark A and the second in Fig. 3 b identifies B with reference to Fig. 4 a to Fig. 4 e, Fig. 4 a to Fig. 4 e, identifies A and the second for T-shaped first and identify B, the para-position process of first component and second component is described.
First, mobile first component and second component, the on first component first mark A is made to overlap with the second mark B on second component, identify A and the second by first and identify B as reference, first component and second component para-position are fitted, gather the first mark A and the second subsequently through equipment such as CCD (Charge-coupledDevice, imageing sensor) and identify the image of B, and show this image by monitor.
Staff before monitor observes image, and by the whether overlapping para-position of region decision Part III B1 and Part I A1 in the not overlapping region of Part III B1 and Part I A1 and square frame C1 and C2, by the whether overlapping para-position of region decision Part IV B2 and Part II A2 in the not overlapping region of Part IV B2 and Part II A2 and square frame C3 and C4.
With reference to Fig. 4 a and Fig. 4 b, if having step (in figure heavy line) between the Part III B1 in square frame C1 and C2 and Part I A1, or the width in the region that the width in other regions is significantly greater than in square frame on Part III B1, the then not overlapping para-position of Part III B1 and Part I A1, if Part IV B2 para-position overlapping with Part II A2, as shown in fig. 4 a, second mark B is inclined along the width of Part III B1, or, as shown in Figure 4 b, second mark B is inclined under the width of Part III B1, now can move up or down first component, so that Part IV B2 para-position overlapping with Part II A2.
With reference to Fig. 4 c and Fig. 4 d, if having step (in figure heavy line) between the Part IV B2 in square frame C3 and C4 and Part II A2, or the width in the region that the width in other regions is significantly greater than in square frame on Part IV B2, the then not overlapping para-position of Part IV B2 and Part II A2, if Part III B1 para-position overlapping with Part I A1, as illustrated in fig. 4 c, second identifies the B width left avertence along Part IV B2, or, as shown in figure 4d, second identifies the B width right avertence along Part IV B2, now can move first component to the left or to the right, so that Part III B1 para-position overlapping with Part I A1.
With reference to Fig. 4 e, if there is step between the Part III B1 in square frame C1 and C2 and Part I A1, and between Part IV B2 and the Part II A2 in square frame C3 and C4, there is step, the then not overlapping para-position of Part III B1 and Part I A1, the not overlapping para-position of Part IV B2 and Part II A2, now can be moved to the left first component and make Part III B1 para-position overlapping with Part I A1, moving down first component and make Part IV B2 para-position overlapping with Part II A2, the first mark A and the second after overlapping para-position identifies B as shown in Figure 3 b.
The first mark A on first component identifies after the overlapping para-position of B with second on second component, can complete the para-position of first component and second component.With first component be display device surface-mounted integrated circuit or FPC, second component is the display floater of display device is example, surface-mounted integrated circuit and display floater realize crimping by anisotropy conductiving glue, the process of crimping is identified the overlapping para-position of B by the first mark A and the second, it is achieved the docking of circuit on circuit and display floater on surface-mounted integrated circuit.
Need further exist for illustrate be, the Part I A1 and Part II A2 of the first mark A in the present embodiment are continuous print structure, the Part III B1 and Part IV B2 of the second mark B are discontinuous structure, certainly, the present invention is not limited to this, in other embodiments, Part I A1 and Part II A2 can also be discontinuous structure.
Need further exist for illustrating, the mode that first evaporated film such as Copper thin film can be adopted in the present embodiment to be then etched into, surface-mounted integrated circuit is formed the first mark of respective shapes, or on the substrate of display floater, forms the second mark of respective shapes.Wherein, the first mark can be identical with the material of the second mark, it is also possible to different.
Need further exist for illustrate be, in the present embodiment, Part III B1 and the nonoverlapping region of Part I A1 are possible not only to for judging the whether overlapping para-position of Part III B1 and Part I A1, it is also possible to the rupture event of the conducting particles being used between surface-mounted integrated circuit and the display floater after checking binding in conducting resinl.Equally, the not overlapping region of Part IV B2 and Part II A2 can be used for checking the rupture event of conducting particles.
In another embodiment of the present invention, with reference to Fig. 5 a-Fig. 5 c, first mark of the another kind of L-shaped that Fig. 5 a provides for the embodiment of the present invention and the schematic diagram of the second mark, first mark of the another kind of T-shaped that Fig. 5 b provides for the embodiment of the present invention and the schematic diagram of the second mark, Fig. 5 c identifies and the second schematic diagram identified for the another kind criss-cross first that the embodiment of the present invention provides, first mark A also includes Part V A3, second mark B also includes Part VI B3, Part VI B3 is for carrying out overlapping para-position with Part V A3, wherein, the width W6 of Part VI B3 is equal to the width W5 of Part V A3, the length L6 of Part VI B3 is less than the length L5 of Part V A3.It is to say, the first mark A includes Part I A1, Part II A2 and Part V A3, the second mark B includes Part III B1, Part IV B2 and Part VI B3.
Optionally, it can also be L-shaped that the first mark A and the second in the present embodiment identifies B, as shown in Figure 5 a;Or, it can also be T-shaped that the first mark A and the second identifies B, as shown in Figure 5 b;Or, it can also be cross that the first mark A and the second identifies B, as shown in Figure 5 c.Wherein, the centrage of Part V A3 and Part II A2 overlaps, the centrage of Part VI B3 and Part IV B2 overlaps, certainly, the present invention is not limited to this, Part V A3 can also overlap with the centrage of Part I A1, and Part VI B3 can also overlap with the centrage of Part III B1.
Optionally, in Fig. 5 b, the length L4 of Part II A2 can be 0.3mm, the length L5 of Part V A3 can be 0.3mm, width W4 or W5 can be 0.1mm, the length L1 of Part III B1 can be 0.3mm, and the gap of the right side edge of Part III B1 left side edge and Part IV B2 can be 0.04mm.
In a specific embodiment, after first mark A and the second identifies B alignment, a Part III B1 side in the longitudinal direction and a Part I A1 overlapping sideways in the longitudinal direction, or, Part III B1 is overlapping with the zone line of Part I A1;A Part IV B2 side in the longitudinal direction and a Part II A2 overlapping sideways in the longitudinal direction, or, Part IV B2 is overlapping with the zone line of Part II A2;A Part VI B3 side in the longitudinal direction and a Part V A3 overlapping sideways in the longitudinal direction, or, Part VI B3 is overlapping with the zone line of Part V A3.
Being the schematic diagram that the T-shaped in Fig. 5 b first identifies that A and the second identifies two kinds of overlap modes of B with reference to Fig. 6 a to Fig. 6 b, Fig. 6 a~6b, identify A and the second mark B for first and be T-shaped, the overlap mode that the first mark A and the second identifies B illustrates.
As shown in Figure 6 a, after first mark A and the second identifies B alignment, Part III B1 short side B10 and Part I A1 in the longitudinal direction short side A10 in the longitudinal direction is overlapping, Part IV B2 short side B20 and Part II A2 in the longitudinal direction short side A20 in the longitudinal direction is overlapping, and Part VI B3 short side B30 and Part V A3 in the longitudinal direction short side A30 in the longitudinal direction is overlapping.
Or, as shown in Figure 6 b, Part III B1 is overlapping with the zone line of Part I A1, namely Part III B1 and Part I A1 two short side B10 and A10 and B11 and A11 in the longitudinal direction are all not overlapping, Part IV B2 is overlapping with the zone line of Part II A2, namely Part IV B2 and Part II A2 two short side B20 and A20 and B21 and A21 in the longitudinal direction are all not overlapping, Part VI B3 is overlapping with the zone line of Part V A3, namely Part VI B3 and Part V A3 two short side B30 and A30 and B31 and A31 in the longitudinal direction are all not overlapping.Certainly, Part III B1 short side B10 in the longitudinal direction can be overlapping with Part I A1 short side A10 in the longitudinal direction, Part IV B2 can be overlapping with the zone line of Part II A2, Part VI B3 can also be overlapping with the zone line of Part V A3, and this is no longer going to repeat them.
In the present embodiment, as fig. 6 c, Fig. 6 c is the schematic diagram that the first mark A and the second in Fig. 5 b identifies a kind of drift condition of B, can judge the whether overlapping para-position of Part III B1 and Part I A1 by the step in the not overlapping region of Part III B1 and Part I A1 and square frame C1 and C2;The whether overlapping para-position of Part IV B2 and Part II A2 is judged by the step in the not overlapping region of Part IV B2 and Part II A2 and square frame C3 and C4;The whether overlapping para-position of Part VI B3 and Part V A3 is judged by the step in the not overlapping region of Part VI B3 and Part V A3 and square frame C5 and C6.
In specific implementation process, if the centrage of Part V A3 and Part II A2 overlaps, the centrage of Part VI B3 and Part IV B2 overlaps, it is possible to only by judging that the whether overlapping para-position of Part III B1 and Part I A1 and the whether overlapping para-position of Part IV B2 and Part II A2 judge the whether overlapping para-position of the first mark A and second mark B.Wherein, the para-position process of the first mark A on the first component in the present embodiment and the second mark B on second component is essentially identical with the para-position process of above-described embodiment, does not repeat them here.
In another embodiment of the present invention, with reference to Fig. 7 a to Fig. 7 c, first mark of another L-shaped that Fig. 7 a provides for the embodiment of the present invention and the schematic diagram of the second mark, first mark of another T-shaped that Fig. 7 b provides for the embodiment of the present invention and the schematic diagram of the second mark, another criss-cross first mark and second schematic diagram identified that Fig. 7 c provides for the embodiment of the present invention, first mark A also includes Part VII A4, second mark B also includes Part VIII B4, Part VIII B4 for carrying out overlapping para-position with Part VII A4;Wherein, the width W8 of Part VIII B4 is equal to the width W7 of Part VII A4, and the length L8 of Part VIII B4 is less than the length L7 of Part VII A4.It is to say, the first mark A includes Part I A1, Part II A2, Part V A3 and Part VII A4, the second mark B includes Part III B1, Part IV B2 and Part VI B3 and Part VIII B4.
Optionally, it can also be L-shaped that the first mark A and the second in the present embodiment identifies B, as shown in Figure 7a;Or, it can also be T-shaped that the first mark A and the second identifies B, as shown in Figure 7b;Or, it can also be cross that the first mark A and the second identifies B, as shown in Figure 7 c.Optionally, in the present embodiment, Part V A3 overlaps with the centrage of Part II A2, and the centrage of Part VII A4 and Part I A1 overlaps, and the centrage of Part VI B3 and Part IV B2 overlaps, the centrage of Part VIII B4 and Part III B1 overlaps, but the present invention is not limited to this.
Need further exist for explanation, the side in the longitudinal direction of the Part III B1 in the present embodiment and a Part I A1 overlapping sideways in the longitudinal direction, or, Part III B1 is overlapping with the zone line of Part I A1;A Part IV B2 side in the longitudinal direction and a Part II A2 overlapping sideways in the longitudinal direction, or, Part IV B2 is overlapping with the zone line of Part II A2;A Part VI B3 side in the longitudinal direction and a Part V A3 overlapping sideways in the longitudinal direction, or, Part VI B3 is overlapping with the zone line of Part V A3;A Part VIII B4 side in the longitudinal direction and a Part VII A4 overlapping sideways in the longitudinal direction, or, Part VIII B4 is overlapping with the zone line of Part VII A4.
With reference to Fig. 8 a to Fig. 8 b, Fig. 8 a~8b is the schematic diagram that the cross first in Fig. 7 c identifies the two of which overlap mode with the second mark, identifying A and the second mark B for first and be cross, the overlap mode identifying A and the second mark B to first illustrates.
As shown in Figure 8 a, Part III B1 short side B10 and Part I A1 in the longitudinal direction short side A10 in the longitudinal direction is overlapping, Part IV B2 short side B20 and Part II A2 in the longitudinal direction short side A20 in the longitudinal direction is overlapping, Part VI B3 short side B30 and Part V A3 in the longitudinal direction short side A30 in the longitudinal direction is overlapping, and Part VIII B4 short side B40 and Part VII A4 in the longitudinal direction short side A40 in the longitudinal direction is overlapping.
Or, as shown in Figure 8 b, Part III B1 is overlapping with the zone line of Part I A1, and Part IV B2 is overlapping with the zone line of Part II A2, Part VI B3 is overlapping with the zone line of Part V A3, and Part VIII B4 is overlapping with the zone line of Part VII A4.
Certainly, Part III B1 short side B10 in the longitudinal direction can be overlapping with Part I A1 short side A10 in the longitudinal direction, Part IV B2 can be overlapping with the zone line of Part II A2, Part VI B3 can also be overlapping with the zone line of Part V A3, Part VIII B4 is overlapping with the zone line of Part VII A4, and this is no longer going to repeat them.
In the present embodiment, as shown in Figure 8 c, Fig. 8 c is the schematic diagram that the first mark and second in Fig. 7 c identifies a kind of drift condition, can judge the whether overlapping para-position of Part III B1 and Part I A1 by the step in the not overlapping region of Part III B1 and Part I A1 and square frame C1 and C2;The whether overlapping para-position of Part IV B2 and Part II A2 is judged by the step in the not overlapping region of Part IV B2 and Part II A2 and square frame C3 and C4;The whether overlapping para-position of Part VI B3 and Part V A3 is judged by the step in the not overlapping region of Part VI B3 and Part V A3 and square frame C5 and C6;The whether overlapping para-position of Part VIII B4 and Part VII A4 is judged by the step in the not overlapping region of Part VIII B4 and Part VII A4 and square frame C7 and C8.
In specific implementation process, if the centrage of Part V A3 and Part II A2 overlaps, the centrage of Part VII A4 and Part I A1 overlaps, the centrage of Part VI B3 and Part IV B2 overlaps, the centrage of Part VIII B4 and Part III B1 overlaps, then can only by judging that the whether overlapping para-position of Part III B1 and Part I A1 and the whether overlapping para-position of Part IV B2 and Part II A2 judge the whether overlapping para-position of the first mark A and second mark B.Wherein, the para-position process of the first mark A on the first component in the present embodiment and the second mark B on second component is essentially identical with the para-position process of above-described embodiment, does not repeat them here.
Below with first component be display device surface-mounted integrated circuit or FPC, second component is the display floater of display device, the first mark and second to be designated T-shaped be the measurement that example carries out aligning accuracy.Selecting 20 samples, measure the aligning accuracy of surface-mounted integrated circuit, the para-position side-play amount of each sample is as shown in the table.Wherein, that in 20 samples, side-play amount is maximum is 30um, and this pressure binding tolerance is 20.06um.And the maximum offset of mark of the prior art is 60um, this pressure tolerance is 66.93um, and therefore, the aligning accuracy in the present invention significantly improves, CPK (ComplexProcessCapabilityindex, process capability index) has also brought up to 0.87 from 0.26.
Sample 1 2 3 4 5 6 7 8 9 10
Side-play amount (um) 0.00 -27.16 6.33 8.07 7.54 -9.20 12.96 -14.05 5.74 6.52
Sample 11 12 13 14 15 16 17 18 19 20
Side-play amount (um) 5.17 -9.43 9.79 5.71 0.00 -18.93 -9.19 -7.01 -6.79 6.95
The electronic equipment that the present embodiment provides, owing to the length of Part III is less than the length of Part I, the length of Part IV is less than the length of Part II, therefore, the drift condition between the first mark and the second mark can be judged by the step of the step of Part III and Part I not overlapping region and Part IV and Part II not overlapping region;
And, owing to the width of Part III is equal to the width of Part I, the width of Part IV is equal to the width of Part II, therefore, after only Part III and Part I are completely overlapped, Part IV is completely overlapped with Part II, ability para-position completes, ratio sensible with existing register guide, aligning accuracy is higher.
Embodiments of the invention also provide for a kind of alignment method, are applied to the electronic equipment that any of the above-described embodiment provides, as it is shown in figure 9, the flow chart of alignment method that Fig. 9 provides for the embodiment of the present invention, this alignment method includes:
S901: mobile first component or second component;
Mobile first component or second component, make the second mark B on second component substantially overlapping with the first mark A on first component, then pass through equipment collection the first mark A and the second such as CCD and identify the image of B, and show this image by monitor.
S902: at least judge the Part III of described second mark and the whether overlapping para-position of Part I of described first mark, the Part IV of described second mark and the described first whether overlapping para-position of Part II identified;
Staff before monitor observes image, and at least through the whether overlapping para-position of region decision Part III B1 and Part I A1 in the not overlapping region of Part III B1 and Part I A1 and square frame C1 and C2, and the whether overlapping para-position of region decision Part IV B2 and Part II A2 in the not overlapping region of Part IV B2 and Part II A2 and square frame C3 and C4, judge the first mark A and the second mark B whether para-position success.
S903: if Part III para-position overlapping with Part I, and Part IV para-position overlapping with Part II, then enter S905;
S904: if Part III para-position not overlapping with any one in Part II with Part I and Part IV, then enter S906;
S905: the para-position of first component and second component completes;
S906: mobile first component or second component, to realize the overlapping para-position of first component and second component.
With reference to Fig. 4 a~Fig. 4 d, if having step (in figure heavy line) between the Part III B1 in square frame C1 and C2 and Part I A1, or the width in the region that the width in other regions is significantly greater than in square frame on Part III B1, the then not overlapping para-position of Part III B1 and Part I A1, if Part IV B2 para-position overlapping with Part II A2, as shown in fig. 4 a, second mark B is inclined along the width of Part III B1, or, as shown in Figure 4 b, second mark B is inclined under the width of Part III B1, now can move up or down first component, so that Part IV B2 para-position overlapping with Part II A2.
If having step (in figure heavy line) between the Part IV B2 in square frame C3 and C4 and Part II A2, or the width in the region that the width in other regions is significantly greater than in square frame on Part IV B2, the then not overlapping para-position of Part IV B2 and Part II A2, if Part III B1 para-position overlapping with Part I A1, as illustrated in fig. 4 c, second identifies the B width left avertence along Part IV B2, or, as shown in figure 4d, second identifies the B width right avertence along Part IV B2, now can move first component to the left or to the right, so that Part III B1 para-position overlapping with Part I A1.
If there is step between the Part III B1 in square frame C1 and C2 and Part I A1, and between Part IV B2 and the Part II A2 in square frame C3 and C4, there is step, the then not overlapping para-position of Part III B1 and Part I A1, the not overlapping para-position of Part IV B2 and Part II A2, as shown in fig 4e, now can be moved to the left first component and make Part III B1 para-position overlapping with Part I A1, move down first component and make Part IV B2 para-position overlapping with Part II A2.
It is to say, optional, if Part III para-position overlapping with Part I, Part IV para-position not overlapping with Part II, then the process moving first component or second component includes:
Width along Part IV moves first component or second component.
Optionally, if Part III para-position not overlapping with Part I, Part IV para-position overlapping with Part II, then the process moving first component or second component includes:
Width along Part III moves first component or second component.
Optionally, if Part III para-position not overlapping with Part I, Part IV para-position not overlapping with Part II, then the process moving first component or second component includes:
Width along Part III moves first component or second component;
Width along Part IV moves first component or second component.
The alignment method that the present embodiment provides, owing to the length of Part III is less than the length of Part I, the length of Part IV is less than the length of Part II, therefore, the drift condition between the first mark and the second mark can be judged by the step of the step of Part III and Part I not overlapping region and Part IV and Part II not overlapping region;
And, owing to the width of Part III is equal to the width of Part I, the width of Part IV is equal to the width of Part II, therefore, after only Part III and Part I are completely overlapped, Part IV is completely overlapped with Part II, ability para-position completes, ratio sensible with existing register guide, aligning accuracy is higher.
In this specification, each embodiment adopts the mode gone forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually referring to.For device disclosed in embodiment, owing to it corresponds to the method disclosed in Example, so what describe is fairly simple, relevant part illustrates referring to method part.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses the present invention.The multiple amendment of these embodiments be will be apparent from for those skilled in the art, and generic principles defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Certainly, it is contemplated that the impact of actual process, the width W1 of Part III B1 can the width W3 of width W2, Part IV B2 slightly larger than Part I A1 can also width W4 slightly larger than Part II A2.Therefore, the present invention is not intended to be limited to the embodiments shown herein, and is to fit to the widest scope consistent with principles disclosed herein and features of novelty.

Claims (12)

1. an electronic equipment, it is characterised in that include first component and second component, described first component has the first mark, described second component has the second mark;
Described first mark at least includes Part I and Part II, described second mark at least includes Part III and Part IV, described Part III is for carrying out overlapping para-position with described Part I, described Part IV is for carrying out overlapping para-position with described Part II, to realize the para-position of described first component and second component, make the connection corresponding to the circuit on described second component of the circuit on described first component;
Wherein, the width of described Part III equal to the width of described Part I, the length of described Part III less than the length of described Part I, and, the width of described Part IV is equal to the width of described Part II, and the length of described Part IV is less than the length of described Part II.
2. electronic equipment according to claim 1, it is characterized in that, after described first mark and the overlapping para-position of the second mark, a described Part III side in the longitudinal direction and a described Part I overlapping sideways in the longitudinal direction, or, described Part III is overlapping with the zone line of described Part I;
A described Part IV side in the longitudinal direction and a described Part II overlapping sideways in the longitudinal direction, or, described Part IV is overlapping with the zone line of described Part II.
3. electronic equipment according to claim 1, it is characterised in that described first mark also includes Part V, and described second mark also includes Part VI, and described Part VI is for carrying out overlapping para-position with described Part V;
Wherein, the width of described Part VI is equal to the width of described Part V, and the length of described Part VI is less than the length of described Part V.
4. electronic equipment according to claim 3, it is characterized in that, after described first mark and the overlapping para-position of the second mark, a described Part III side in the longitudinal direction and a described Part I overlapping sideways in the longitudinal direction, or, described Part III is overlapping with the zone line of described Part I;
A described Part IV side in the longitudinal direction and a described Part II overlapping sideways in the longitudinal direction, or, described Part IV is overlapping with the zone line of described Part II;
A described Part VI side in the longitudinal direction and a described Part V overlapping sideways in the longitudinal direction, or, described Part VI is overlapping with the zone line of described Part V.
5. electronic equipment according to claim 3, it is characterised in that described first mark also includes Part VII, and described second mark also includes Part VIII, and described Part VIII is for carrying out overlapping para-position with described Part VII;
Wherein, the width of described Part VIII is equal to the width of described Part VII, and the length of described Part VIII is less than the length of described Part VII.
6. electronic equipment according to claim 5, it is characterized in that, after described first mark and the overlapping para-position of the second mark, a described Part III side in the longitudinal direction and a described Part I overlapping sideways in the longitudinal direction, or, described Part III is overlapping with the zone line of described Part I;
A described Part IV side in the longitudinal direction and a described Part II overlapping sideways in the longitudinal direction, or, described Part IV is overlapping with the zone line of described Part II;
A described Part VI side in the longitudinal direction and a described Part V overlapping sideways in the longitudinal direction, or, described Part VI is overlapping with the zone line of described Part V;
A described Part VIII side in the longitudinal direction and a described Part VII overlapping sideways in the longitudinal direction, or, described Part VIII is overlapping with the zone line of described Part VII.
7. the electronic equipment according to any one of claim 1~6, it is characterized in that, described first is designated L-shaped, T-shaped or decussate texture, and described second is designated L-shaped, T-shaped or decussate texture, and the shape of described first mark is identical with the shape of described second mark.
8. electronic equipment according to claim 1, it is characterised in that described electronic equipment is display device, described first component is the surface-mounted integrated circuit of described display device, and described second component is the display floater of described display device.
9. an alignment method, it is characterised in that being applied to electronic equipment described in any one of claim 1~8, described alignment method includes:
Mobile first component or second component, make the second mark on described second component identify overlapping para-position with first on described first component;
At least judge the Part III of described second mark and the whether overlapping para-position of Part I of described first mark, the Part IV of described second mark and the described first whether overlapping para-position of Part II identified;
If the para-position overlapping with described Part I of described Part III, and the para-position overlapping with described Part II of described Part IV, then the para-position of described first component and second component completes;
If the para-position not overlapping with any one in described Part II with described Part I and described Part IV of described Part III, then move described first component or described second component, to realize the overlapping para-position of described first component and second component.
10. alignment method according to claim 9, it is characterized in that, if the para-position overlapping with described Part I of described Part III, the para-position not overlapping with described Part II of described Part IV, then the process moving described first component or described second component includes:
Width along described Part IV moves described first component or described second component.
11. alignment method according to claim 9, it is characterized in that, if the para-position not overlapping with described Part I of described Part III, the para-position overlapping with described Part II of described Part IV, then the process moving described first component or described second component includes:
Width along described Part III moves described first component or described second component.
12. alignment method according to claim 9, it is characterized in that, if the para-position not overlapping with described Part I of described Part III, the para-position not overlapping with described Part II of described Part IV, then the process moving described first component or described second component includes:
Width along described Part III moves described first component or described second component;
Width along described Part IV moves described first component or described second component.
CN201610112987.5A 2016-02-29 2016-02-29 Electronic equipment and alignment method thereof Active CN105764278B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610112987.5A CN105764278B (en) 2016-02-29 2016-02-29 Electronic equipment and alignment method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610112987.5A CN105764278B (en) 2016-02-29 2016-02-29 Electronic equipment and alignment method thereof

Publications (2)

Publication Number Publication Date
CN105764278A true CN105764278A (en) 2016-07-13
CN105764278B CN105764278B (en) 2020-04-03

Family

ID=56330413

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610112987.5A Active CN105764278B (en) 2016-02-29 2016-02-29 Electronic equipment and alignment method thereof

Country Status (1)

Country Link
CN (1) CN105764278B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI771567B (en) * 2018-03-28 2022-07-21 日商Fdk股份有限公司 Circuit board and method of manufacturing the same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1647596A (en) * 2002-04-12 2005-07-27 新藤电子工业株式会社 Circuit board and method for manufacturing the same
JP2005216699A (en) * 2004-01-30 2005-08-11 Pioneer Plasma Display Corp Plasma display device, its manufacturing method and manufacturing method of plasma display panel
US20070146587A1 (en) * 2005-12-23 2007-06-28 Innolux Display Corp. Liquid crystal display with positional marks
CN101097302A (en) * 2006-06-30 2008-01-02 Lg.菲利浦Lcd株式会社 Flexible display and method for forming alignment key of the same
CN101672997A (en) * 2009-09-28 2010-03-17 友达光电(苏州)有限公司 LCD panel
CN103135826A (en) * 2011-11-27 2013-06-05 宸鸿科技(厦门)有限公司 Touch sensing device and manufacturing method thereof
CN203338279U (en) * 2013-05-29 2013-12-11 华映视讯(吴江)有限公司 Aligning structure used for touch panel
CN203616553U (en) * 2013-12-19 2014-05-28 Tcl显示科技(惠州)有限公司 Flexible printed circuit board, touchpad, liquid crystal panel and liquid crystal display screen

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1647596A (en) * 2002-04-12 2005-07-27 新藤电子工业株式会社 Circuit board and method for manufacturing the same
JP2005216699A (en) * 2004-01-30 2005-08-11 Pioneer Plasma Display Corp Plasma display device, its manufacturing method and manufacturing method of plasma display panel
US20070146587A1 (en) * 2005-12-23 2007-06-28 Innolux Display Corp. Liquid crystal display with positional marks
CN101097302A (en) * 2006-06-30 2008-01-02 Lg.菲利浦Lcd株式会社 Flexible display and method for forming alignment key of the same
CN101672997A (en) * 2009-09-28 2010-03-17 友达光电(苏州)有限公司 LCD panel
CN103135826A (en) * 2011-11-27 2013-06-05 宸鸿科技(厦门)有限公司 Touch sensing device and manufacturing method thereof
CN203338279U (en) * 2013-05-29 2013-12-11 华映视讯(吴江)有限公司 Aligning structure used for touch panel
CN203616553U (en) * 2013-12-19 2014-05-28 Tcl显示科技(惠州)有限公司 Flexible printed circuit board, touchpad, liquid crystal panel and liquid crystal display screen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI771567B (en) * 2018-03-28 2022-07-21 日商Fdk股份有限公司 Circuit board and method of manufacturing the same

Also Published As

Publication number Publication date
CN105764278B (en) 2020-04-03

Similar Documents

Publication Publication Date Title
KR102047068B1 (en) Display panel, electric device having the same and method of bonding the same
CN107329297A (en) The binding structure and display panel of display panel
CN102036511B (en) Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards
KR101124104B1 (en) Method for inspecting polarizer bonding precision and bonding precision inspection apparatus
CN105116580A (en) Touch display panel and method for attaching panel covering glass to liquid crystal panel
CN103135826A (en) Touch sensing device and manufacturing method thereof
CN208079493U (en) Printed circuit board with aligning structure
CN101395522B (en) Component bonding method and component bonding device
CN109068478A (en) Flexible circuit board and display device
CN105764278A (en) Electronic device and alignment method thereof
US11169648B2 (en) Touch electrode, touch display panel, and touch display device
CN108828856B (en) Array substrate and display panel
JP2002329941A (en) Connection structure of wiring board and connection structure of liquid crystal display panel
CN207099444U (en) A kind of quick film for checking FPC etching line widths
CN105357502A (en) Local centered display method for dynamic image of optical-fiber welding machine
US20090087624A1 (en) Laminated structure
CN110076098B (en) Bare cell end face glue water mark quality inspection method and equipment
JP2011238657A (en) Chip-on film
CN209297656U (en) A kind of flexible display panels and display device
CN207423129U (en) A kind of multilayer circuit board pressing harmomegathus amount layering measurement structure
KR20180045322A (en) The align-inspection device and the method using the same
CN208207764U (en) Touch device and its touch control component
CN118011583B (en) Alignment bonding device and alignment bonding method
CN101980071B (en) Wire pattern and method for monitoring adhesion deviation of film material
CN204651292U (en) Amount of alignment geodesic structure and mask

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant