CN105758203B - Annealing device - Google Patents

Annealing device Download PDF

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Publication number
CN105758203B
CN105758203B CN201610228229.XA CN201610228229A CN105758203B CN 105758203 B CN105758203 B CN 105758203B CN 201610228229 A CN201610228229 A CN 201610228229A CN 105758203 B CN105758203 B CN 105758203B
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heat
control device
power supply
thermoelectric conversion
conversion member
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CN105758203A (en
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向井正行
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JTEKT Thermo Systems Corp
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Koyo Thermo Systems Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00Arrangements of controlling devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D17/00Arrangements for using waste heat; Arrangements for using, or disposing of, waste gases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Furnace Details (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The present invention provides a kind of annealing device, can be realized energy-saving, and the form supplied electric power can be made more diversified.Annealing device (1) has heat-treatment furnace (2), thermoelectric conversion member (3), control device (4) and switching part (5).Heat-treatment furnace (2) is provided for being heat-treated treated object (100).Thermoelectric conversion member (3) is used to the thermal energy from heat-treatment furnace (2) being converted to electric power.Control device (4) is provided for control heat-treatment furnace (2).Electric power from external power supply (20) and the electric power from thermoelectric conversion member (3) are selected a supply to control device (4) by switching part (5).

Description

Annealing device
It is on 2 28th, 2013 that the present invention, which is application No. is the 2013100643938, applying date, entitled " heat treatment The divisional application of the Chinese invention patent application of device ".
Technical field
The present invention relates to annealing devices.
Background technique
It has been known that there is the substrate heat treatment apparatus for heating the substrate processing (referring for example to patent document 1).? The substrate heat treatment apparatus recorded in patent document 1 has the processing chamber that can store substrate.Configured with heat in processing chamber Plate.Hot plate is provided for heating the substrate.Thermo-electric conversion module is configured in the side of hot plate.Thermo-electric conversion module is in the future Electric power is converted to from the thermal energy of hot plate.The power supply is to power supply source.Electric power from power supply source adds for substrate The driving in each portion of annealing device.By above structure, attempt efficiently uses the thermal energy of hot plate.
Patent document 1: Japanese Unexamined Patent Publication 2000-68183 bulletin (0026 section, 0032 section)
But annealing device needs larger to be heated by electrothermal heater to heating objects such as substrates Electric power.Therefore, annealing device is typically used as the external power supply of the power supply provided by Utilities Electric Co., required to ensure Electric power.In the structure recorded in patent document 1, it is supplied to by the electric power that thermo-electric conversion module supplies for drive substrate The power supply source in each portion of device is managed, and is used with being not different with the electric power from external power supply.In this way, patent document The structure recorded in 1 is not the structure for being used separately the electric power from thermo-electric conversion module and the electric power from external power supply.
Summary of the invention
By in view of the foregoing, it is an object of the invention to realize energy-saving in annealing device, and can Keep the form supplied electric power more diversified.
(1) in order to solve the above problems, annealing device related in a certain respect of the invention has heat-treatment furnace, heat Electric converting member, control device and switching part.The heat-treatment furnace is provided for being heat-treated treated object.The heat Electric converting member is used to the thermal energy from the heat-treatment furnace being converted to electric power.The control device is provided for control institute State heat-treatment furnace.The switching part is provided for will the electric power from external power supply and the electricity from the thermoelectric conversion member Power selects a supply to the control device.
According to this structure, the thermal energy of heat-treatment furnace can be converted to electric power by thermoelectric conversion member.Switching part can should Power supply is to control device.Thereby, it is possible to by the effective use to the thermal energy generated by heat-treatment furnace, to realize energy conservation Change.In addition, as needed, switching part can select the electric power from external power supply and the electric power from the thermoelectric conversion member One supplies to control device.The form of diverse that thereby, it is possible to supply electric power the control device of heat treated device.Moreover, Electric power necessary to control device is very small compared with thermal energy necessary to the heating to heat-treatment furnace.As a result, even as The thermoelectric conversion member of the relatively small power supply of generated energy is also sufficient to the power supply as control device.
According to the invention it is thus possible to realize energy-saving in annealing device, and the form supplied electric power can be made more For diversification.
In addition, the switching part is configured to, it, will be from described when the temperature of the heat-treatment furnace is less than scheduled threshold value The power supply of external power supply is to the control device.The switching part is configured to, and is described in the temperature of the heat-treatment furnace When more than threshold value, by the power supply from the thermoelectric conversion member to the control device.
According to this configuration, it can be realized energy-saving, and be not delayed the supply of electric power necessary to the movement to control device. Specifically, for example, when the starting of the heat-treatment furnace of the room temperature in halted state starts, the electric power from thermoelectric conversion member It is smaller, it is insufficient to allow control device to be acted.At this point, switching part is by the power supply from external power supply to control device. On the other hand, for example, heat-treatment furnace temperature it is very high, reach heat-treatment furnace can be to the journey that treated object is heat-treated In the case where degree, the electric power from thermoelectric conversion member is larger, it is sufficient to act control device.At this point, switching part is in the future From the power supply of thermoelectric conversion member to control device.At this point, control device does not need to consume the electric power from external power supply ?.
When the external power supply is abnormal, the switching part can will be supplied from the electric power of the thermoelectric conversion member To the extremely control device.
It according to this configuration, also can be by by heat to electricity conversion even if in the case where exceptions occur to have a power failure etc. for external power supply Component, which is used as, promptly uses power supply (no power failure power supply), to supply electric power to control device.Even if occurring as a result, in external power supply different Chang Shi can also make control device carry out necessary operation.That is, being able to suppress the exception with external power supply and making control device Movement the case where sudden shutting off.Thereby, it is possible to inhibit the phenomenon that be abnormal in control device and heat-treatment furnace.In addition, i.e. Make in the case where the exception etc. due to external power supply causes the heating of heat-treatment furnace to act stopping, due to the thermal capacitance of heat-treatment furnace Measure generally large, therefore the temperature of heat-treatment furnace is maintained in a long time.Even if as a result, in the heat treatment to treated object When middle external power supply is abnormal, the time that enough electric power can be generated using thermoelectric conversion member is also longer.Even if as a result, When external power supply is abnormal, also control device can be made to continue to act in a long time.Thereby, it is possible to carry out to control Operation necessary to backup job necessary to the stopping of device processed etc. and the stopping to annealing device.In addition, without using The electrical storage devices such as battery use power supply as urgent, or can reduce the usage amount of electrical storage device.It is therefore not necessary to electrical storage device Regularly replacement operation or electrical storage device replacement amount it is less.Thereby, it is possible to reduce the maintenance of control device to be spent The labour taken and time.In addition, passing through the reduction to electrical storage device, moreover it is possible to which to preserving our planet, environment contributes.
(2) preferably are as follows: the annealing device is further equipped with the ancillary equipment controlled by the control device.It is described Ancillary equipment can be acted using the electric power from the thermoelectric conversion element.
According to this configuration, as long as the subsidiary ancillary equipment for being set to heat-treatment furnace, it is relatively small to act required electric power ?.Thereby, it is possible to the electric power needed for fully being supplied to ancillary equipment by thermoelectric conversion member.
(3) preferably are as follows: the thermoelectric conversion member is installed in the wall portion of exhaust passage and the heat-treatment furnace at least One side, the exhaust passage are set to the heat-treatment furnace.
According to this configuration, the heat from heat-treatment furnace can be more reliably transferred to thermoelectric conversion member.
In accordance with the invention it is possible to realize energy-saving in annealing device, and the form supplied electric power can be made more more Sample.
Detailed description of the invention
Fig. 1 is the schematic diagram for showing the structure of annealing device of embodiments of the present invention.
Fig. 2 is the flow chart for an example for illustrating the movement of the control of the power supply in annealing device.
Fig. 3 is the schematic diagram for showing the major part of variation of the invention.
Fig. 4 is the schematic diagram for showing the major part of other variations of the invention.
Label declaration
1: annealing device;
2: heat-treatment furnace;
3,3A: thermoelectric conversion member;
4: control device;
5: switching part;
14: exhaust passage;
17: the wall portion of heat-treatment furnace;
20: external power supply;
21: valve (ancillary equipment);
23: locking mechanism (ancillary equipment);
24: measuring device (ancillary equipment);
25: display device (ancillary equipment);
100: treated object;
T: the temperature of heat-treatment furnace;
T1: threshold value.
Specific embodiment
In the following, being illustrated referring to attached drawing to mode for carrying out the present invention.In addition, the present invention can as pair The annealing device that treated object is heat-treated is widely applied.
Fig. 1 is the schematic diagram for showing the structure of annealing device 1 of embodiments of the present invention.Referring to Fig.1, heat treatment dress Setting 1 is for implementing heat-treating apparatus to treated object 100.As the heat treatment, Carburization Treatment may be exemplified out, at diffusion Reason, annealing, CVD (Chemical Vapor Deposition, chemical vapor deposition) processing etc..
Annealing device 1 has: heat-treatment furnace 2, thermoelectric conversion member 3, control device 4, switching part 5, the 1st converter 6, 2nd converter 7 and auxiliary equipment unit 8.
Heat-treatment furnace 2 is configured to, and is heat-treated in the state of being accommodated with treated object 100 to the treated object 100.
Heat-treatment furnace 2 has furnace main body 11, door 12, heater 13 and exhaust passage 14.
Furnace main body 11 is provided for storage treated object 100.Furnace main body 11 is for example formed by metal.Furnace main body 11 is for example Be formed as hollow box-formed shape, there is the storage space 16 for storing treated object 100.Furnace main body 11 has multiple walls Portion 17 forms storage space 16 by these wall portions 17.The thickness of each wall portion 17 is set as very big value.Furnace as a result, The thermal capacity of main body 11 is set to very big.
In addition, the side in furnace main body 11 is equipped with door 12.Door 12 links via hinge member 18 and furnace main body 11, and It can be opened and closed relative to furnace main body 11.By opening the door 12, storage space 16 can be made to the space of the outside of furnace main body 11 It is open.In the state that door 12 is opened, treated object 100 is moved to storage space 16 from the space of the outside of furnace main body 11 In.In addition, treated object 100 is moved out from storage space 16 in the state that door 12 is opened.In addition, by closing the door 12, It can be by the space partition of storage space 16 and the outside of furnace main body 11.In addition, furnace main body 11 is connected to air inlet pipe (not shown). Carry out the gas required for heat treatment of the supply to treated object 100 into storage space 16 via the air inlet pipe.It is closed in door 12 In the state of, treated object 100 is heat-treated.Furnace main body 11 is heated by heater 13.
Heater 13 is, for example, electrothermal heater, is the heavy current installation using larger work about electric power.Heater 13, which has, to be added Hot portion 19.Heating part 19 for example configures in the storage space 16 of furnace main body 11.Heating part 19 is generated heat and being supplied to electric power. The heat of heating part 19 is transferred to furnace main body 11, storage space 16 and treated object 100.As a result, by furnace main body 11, storage space 16 gas and treated object 100 is heated to scheduled heat treatment temperature.The heat treatment temperature of the situation is, for example, about several In the range of hundred DEG C~thousands of DEG C.Heater 13 has power circuit (not shown).The power circuit is connect with external power supply 20. The power circuit by the electric power from external power supply 20 the voltage and current for the movement for being adjusted to be suitable for heating part 19 base Heating part 19 is output on plinth.
External power supply 20 is, for example, source power supply, is the power supply provided by Utilities Electric Co..The voltage of external power supply 20 is for example For several hundred volts.In the present embodiment, external power supply 20 is AC power source.It is heated by the heater 13 with above structure Gas in storage space 16 is discharged after the heat treatment of treated object 100 to exhaust passage 14.
Exhaust passage 14 is provided for for the gas in storage space 16 being discharged to the outside of furnace main body 11.Exhaust passage 14 are formed by heat proof materials such as metals.Exhaust passage 14 is formed as tubulose.In the present embodiment, exhaust passage 14 is formed as L Shape.The middle part of exhaust passage 14 has curved shape.The wall portion 17 of furnace main body 11 is run through in one end of exhaust passage 14, and It is connected with storage space 16.The other end of exhaust passage 14 is connected with the space of the outside of furnace main body 11.
Valve 21 is installed in exhaust passage 14.A part of the composition auxiliary equipment unit 8 of valve 21.The valve 21 is, for example, electromagnetism Valve is supplied electric power by control device 4, and control is opened and closed by control device 4.Valve 21 is in stopping of annealing device 1 etc. When close.On the other hand, which opens when treated object 100 acts.Valve 21 for example carries out treated object 100 It is opened when heat treatment.Valve 21 can also be in the just closing when treated object 100 is heat-treated, and to treated object 100 It is opened after heat treatment.In storage space 16, by opening valve 21, the gas of the high temperature after being heated by heater 13 is from row Gas channel 14 passes through, and is discharged to the space of the outside of furnace main body 11.When being heat-treated to treated object 100, such as Fruit opens valve 21, then the discharge gas of high temperature flow to exhaust passage 14 always during heat treatment.Thereby, it is possible to be not vented The constraint of the thermal capacity in channel 14 gives enough heats to thermoelectric conversion member 3.In addition, to treated object 100 into In the case where opening valve 21 when row heat treatment, during heat treatment, always from air inlet pipe supply gas (not shown).
In addition, exhaust passage 14 is connected with furnace main body 11.Therefore, the heat from heater 13 is transmitted via furnace main body 11 To exhaust passage 14.As a result, when heat is when furnace main body 11 is put aside, exhaust passage 14 is inhibited temperature to reduce by the heat.This Outside, the thermal capacity of the ratio of heat capacities furnace main body 11 of exhaust passage 14 is small.Therefore, exhaust passage 14 is transmitted to from furnace main body 11 in heat In the state of, the temperature reductions of furnace main body 11 are very small.The exhaust passage 14 keeps thermoelectric conversion member 3.
Thermoelectric conversion member 3 is provided for being converted to the thermal energy of heat-treatment furnace 2 into electric power (electric energy).It is filled as heat treatment 1 power supply is set, in the present embodiment, uses the thermoelectric conversion member 3 and external power supply 20.External power supply 20 is used as can The power supply that heat treated furnace 2 (heater 13) and 4 both sides of control device supply electric power.On the other hand, thermoelectric conversion member 3 by with Make the power supply supplied electric power to control device 4 but heat treated furnace 2 does not supply electric power.
Thermoelectric conversion member 3 is the thermoelectric conversion element that Seebeck effect (Seebeck effect) is utilized, and is had Multiple Peltier elements.More specifically, thermoelectric conversion member 3 is combined by p-type semiconductor and n-type semiconductor and is formed.Thermoelectricity turns Component 3 is changed with surface 3a and back side 3b.Thermoelectric conversion member 3 is configured to by generating temperature between surface 3a and back side 3b Difference generates electric power.It is, for example, several volts by the voltage that thermoelectric conversion member 3 generates.
The size of thermoelectric conversion member 3 is appropriately set according to amount of power required thermoelectric conversion member 3 etc..In addition, The shape of thermoelectric conversion member 3 is not particularly limited.Thermoelectric conversion member 3 is configured to receive from heat-treatment furnace 2 The heat of furnace main body 11.
In the present embodiment, thermoelectric conversion member 3 is integrally formed as L-shaped, has along exhaust passage 14 Outer surface 14a shape shape.More specifically, the surface 3a of thermoelectric conversion member 3 has part 1 3c and the 2nd Divide 3d.Part 1 3c and part 2 3d are formed as planar.Part 1 3c and part 2 3d extend in an orthogonal manner.Institute State part 1 3c and part 2 3d respectively with the outer surface 14a face contact of exhaust passage 14.In the present embodiment, thermoelectricity turns The surface 3a for changing component 3 is fixed on the outer surface 14a of exhaust passage 14.The heat of exhaust passage 14 is efficiently transfer to heat as a result, The surface 3a of electric converting member 3.
Direction of the back side 3b of thermoelectric conversion member 3 away from exhaust passage 14.Back side 3b have part 1 3e and Part 2 3f.Part 1 3e is extended in the mode parallel with the part 1 3c of surface 3a.Part 2 3f is with surface 3a's Part 2 3d parallel mode extends.Thermal component 22 is installed in the back side 3b with above structure.
Thermal component 22 is provided for promoting the heat dissipation from the back side 3b of thermoelectric conversion member 3.Thereby, it is possible to make thermoelectricity Temperature difference between the surface 3a and back side 3b of converting member 3 is bigger.As a result, can make to be generated by thermoelectric conversion member 3 Electric power is bigger.Thermal component 22 is formed such as using the excellent material of heat conductivity aluminium alloy, copper alloy.Thermal component 22 It is fixed on the part 1 3e and part 2 3f of the back side 3b of thermoelectric conversion member 3.The electric power energy generated by thermoelectric conversion member 3 Enough it is output to control device 4.
Control device 4 is provided for control heat-treatment furnace 2.In the present embodiment, control device 4 is set as light current Standby control circuit.More specifically, it includes CPU (Central Processing Unit, central processing that control device 4, which has, Device), ROM (Read Only Memory, read-only memory) and RAM (Random Access Memory, random access memory Device) hardware.In addition, control device 4 has software stored in ROM.Control device 4 is stored in the ROM by CPU reading Program and execute the program to be acted.In addition, control device 4 can cooperating come real by software and hardware like this It is existing, it can also be realized by hardware.
The operation voltage of control device 4 is, for example, tens volts.Control device 4 is electrically connected with heat-treatment furnace 2 Deng.More have Body, control device 4 is connect with the heater 13 of heat-treatment furnace 2 and auxiliary equipment unit 8, to control 13 He of heater Auxiliary equipment unit 8 etc..Control device 4 is controlled according to measurement result of aftermentioned measuring device 24 of auxiliary equipment unit 8 etc. Heat-treatment furnace 2.
Auxiliary equipment unit 8 has the subsidiary multiple ancillary equipments for being set to heat-treatment furnace 2.These ancillary equipments are connected to Control device 4 is acted by supplying electric power from control device 4, and controlled device 4 is controlled.
Auxiliary equipment unit 8 includes the valve 21, locking mechanism 23, measuring device 24 and display dress as ancillary equipment Set 25.
Locking mechanism 23 is provided for locking door 12.Locking mechanism 23 is for example with electric screwed pipe.The bar of the electric screwed pipe is logical Connection furnace main body 11 and door 12 are crossed, to limit opening action of the door 12 relative to furnace main body 11.In addition, by releasing the bar to furnace Connection between main body 11 and door 12, to release on the door 12 locking.Locking mechanism 23 is carried out by the control of control device 4 The releasing of above-mentioned locking and locking.
Measuring device 24 is provided for measuring the action state of heat-treatment furnace 2.Measuring device 24 is installed on heat Treatment furnace 2.Measuring device 24 is, for example, the temperature sensor of digital-code type, is configured to be acted using electric power.Measuring device The equal temperature of the storage space 16 of 24 pairs of heat-treatment furnaces 2 measures.Measuring device 24 using come the electric power of self-control device 4 come It is acted, and measurement result is exported to control device 4.Control device 4 according to the measurement result come to make heater 13 into Opportunity and opening and closing opportunity of valve 21 of exhaust passage 14 that action is made etc. are controlled.
Display device 25 is, for example, liquid crystal display.Display device 25 is configured to, and reads the display provided by control device 4 With data, and show the image determined by display data.Display device 25 is to temperature in heat-treatment furnace 2 and outer as a result, The presence or absence of exception of portion's power supply 20 etc. is shown.In addition, for control the control device 4 of display device 25 also with switching part 5 Connection receives the electric power from switching part 5, and controls the movement of switching part 5.
Switching part 5 is provided for selecting one by the electric power from external power supply 20 and from the electric power of thermoelectric conversion member 3 It supplies to control device 4.In other words, switching part 5 is configured to cut the supply path that control device for reversing 4 supplies electric power.
Switching part 5 is, for example, relay switch.In addition, switching part 5 or the PLC formed using semiconductor element (Programmable Logic Controller, programmable logic controller) etc..Switching part 5 and 26 phase of the 1st conductive component Connection.1st conductive component 26 is, for example, electric wire, to connect with external power supply 20 via plug 27,28 etc..In addition, switching part 5 It is connected with the 2nd conductive component 29.2nd conductive component 29 is, for example, electric wire, is connect with thermoelectric conversion member 3.In addition, switching Portion 5 is connected via the 3rd conductive component 30 with control device 4.3rd conductive component 30 is, for example, the conductor figure for being formed in substrate Case.
Switching part 5 is configured to the 1st conductive component 26 and the 3rd conductive component 30 through the control of control device 4 It connects.By the connecting moves, come realize including the 1st conductive component 26 and the 3rd conductive component 30 the 1st for circuit Diameter 31.In addition, in fig. 1 it is shown that being formed with the state of the 1st supply path 31.In addition, switching part 5 is configured to pass through The control of control device 4 and the 2nd conductive component 29 and the 3rd conductive component 30 are connected.By the connecting moves, to realize The 2nd supply path 32 including the 2nd conductive component 29 and the 3rd conductive component 30.It is set in the middle part of the 1st conductive component 26 There is the 1st converter 6.In addition, the middle part in the 2nd conductive component 29 is equipped with the 2nd converter 7.
1st converter 6 be configured to will the electrical power conversion from external power supply 20 at be suitable for control device 4 movement electric current With voltage and export.In the present embodiment, the 1st converter 6 is AC/DC (ac/dc) converter.1st converter 6 is in the future After direct current power is converted to from the AC power of external power supply 20, it is output to switching part 5 and control device 4.1st converter 6 with Control device 4 is connected.Whether the 1st converter 6 will be to being abnormal the information being determined in external power supply 20 and is output to control Device 4 processed.Control device 4 is able to determine whether that the exception such as power failure occurs in external power supply 20 as a result,.
2nd converter 7 be configured to will the electrical power conversion from thermoelectric conversion member 3 at the movement for being suitable for control device 4 Electric current and voltage simultaneously export.In the present embodiment, the 2nd converter 7 is DC/DC (DC/DC) converter.2nd converter 7 After to voltage adjustment is carried out from the direct current power of thermoelectric conversion member 3, which is output to switching part 5.2nd converter 7 also have make from the stabilized function of the electric current of thermoelectric conversion member 3.Therefore, even if in the electricity from thermoelectric conversion member 3 Flow it is unstable in the case where, also can by the 2nd converter 7 to control device 4 supply be suitble to control device 4 driving, Stable electric power.
According to above structure, when being heat-treated to treated object 100, control device 4 controls heater 13 first, with By the power supply from external power supply 20 to heater 13.As a result, to the treated object in furnace main body 11 and furnace main body 11 100 are heated.Control device 4 controls the movement of heater 13, so that the temperature measured by measuring device 24 As scheduled heat treatment temperature.After the heat treatment to treated object 100, control device 4 stops heater 13.
In addition, as described later, control device 4 powers to the 1st supply path 31 and the 2nd according to the temperature T of furnace main body 11 Path 32 switches over.In addition, even if control device 4 can also continue in the case where external power supply 20 generates the exceptions such as power failure It is acted.Hereinafter, being illustrated to an example of the movement of the power supply control in annealing device 1.
Fig. 2 is the flow chart for an example for illustrating the movement of the control of the power supply in annealing device 1.Reference Fig. 1 and Fig. 2, control device 4 are determined (step S1) to whether the temperature T of furnace main body 11 is less than scheduled threshold value T1.At this point, Control device 4 using the temperature measured by measuring device 24 as the temperature T of furnace main body 11 come using.
For example, at the time of the heat-treatment furnace 2 of annealing device 1 starts since the halted state of room temperature, heater 13 Temperature T with furnace main body 11 is room temperature, and is less than threshold value T1 (being YES (YES) in step S1).At this point, the control of control device 4 is cut Portion 5 is changed so that control device 4 is connected (step S2) with external power supply 20.Electric power as a result, from external power supply 20 is via the 1st Supply path 31 is supplied to control device 4.
That is, the electric power from external power supply 20 is led via the 1st conductive component 26, the 1st converter 6, switching part 5 and the 3rd Electrical components 30 are supplied to control device 4.Control device 4 can be acted using the electric power from external power supply 20 as a result,. Control device 4 maintain the state that is connected with external power supply 20 until the temperature T of furnace main body 11 for threshold value T1 or more (step S1, S2)。
On the other hand, when generating heat since heater 13 by the predetermined time, the temperature T of furnace main body 11 becomes threshold value T1 or more (being NO (no) in step S1).At this point, control device 4 controls switching part 5 so that control device 4 and thermoelectric conversion member 3 are connected (step S3).Electric power as a result, from thermoelectric conversion member 3 is supplied via the 2nd supply path 32 to control device 4. That is, the electric power from thermoelectric conversion member 3 is via the 2nd conductive component 29, the 2nd converter 7, switching part 5 and the 3rd conductive component 30 supply to control device 4.Control device 4 is acted using the electric power from thermoelectric conversion member 3 as a result,.In addition, with control Valve 21, locking mechanism 23, measuring device 24, switching part 5 and the display device 25 that device 4 processed connects also are utilized to be turned from thermoelectricity The electric power of component 3 is changed to be acted.
Then, whether control device 4 in external power supply 20 to being abnormal and determined (step S4).Specifically, it controls Device 4 determines whether the electric power from external power supply 20 is input to the 1st converter 6.Control device 4 is coming from external electrical It is determined as that in 20 no exceptions of external power supply (be NO) in step S4 in the case where the electric power input in source 20 to the 1st converter 6. At this point, control device 4 carries out the processing of step S1 again.
On the other hand, in the case where electric power is not input to the 1st converter 6 from external power supply 20, control device 4 is determined as Being abnormal in external power supply 20 (is YES) in step S4.As the state not supplied electric power to the 1st converter 6, may be exemplified External power supply 20 is in the state of power failure out.
It is determined as in control device 4 in the case where external power supply 20 is abnormal, handled when external power supply exception (step S5).In addition, stopping to the energization of heater 13, therefore heat-treatment furnace 2 is in when external power supply 20 is abnormal Halted state.But since control device 4 is supplied electric power by thermoelectric conversion member 3, when being able to carry out external power supply exception Processing.
Specifically, control device 4 disconnects the energization being powered from external power supply 20 to heater 13 with switch.As a result, can Enough prevent the heater 13 in the abnormal releasing of external power supply 20 from arbitrarily being heated.In addition, control device 4 is according to by measuring device 24 data provided, to being monitored whether heat-treatment furnace 2 is abnormal.When heat-treatment furnace 2 is abnormal, control dress 4 are set to show the anomalous content in display device 25.In addition, control device 4 measures the temperature of measuring device 24 as the result is shown In display device 25.
In addition, control device 4 controls locking mechanism 23 so that locking mechanism 23 on the door 12 locking do not solved It removes.Thereby, it is possible to prevent operator from accidentally extending into hand in the furnace main body 11 of the high temperature after just having a power failure.In addition, control device 4 Control valve 21 maintains valve 21 in off position.In addition, control device 4 is handled, so that program in execution can be just Often stop.In addition, control device 4 carries out carrying out the back-up processing saved etc. to the data obtained by measuring device 24.It arrives During the temperature T of furnace main body 11 is decreased below until threshold value T1, that is, by 3 apparatus for controlling of supply 4 of thermoelectric conversion member During electric power necessary to acting, control device 4 carries out these above-mentioned processing.
As described above, according to annealing device 1, thermoelectric conversion member 3 can be converted to the thermal energy of heat-treatment furnace 2 Electric power.Switching part 5 can be by the power supply to control device 4.Thereby, it is possible to by the thermal energy generated by heat-treatment furnace 2 Effective use, to realize energy-saving.In addition, as needed, switching part 5 by the electric power from external power supply 20 and can come from The electric power of thermoelectric conversion member 3 selects a supply to control device 4.Thereby, it is possible to keep the form supplied electric power to control device 4 more Sample.Moreover, electric power necessary to control device 4 is very small compared with thermal energy necessary to the heating to heat-treatment furnace 2.By This is also sufficient to the electricity as control device 4 even as the thermoelectric conversion member 3 of the relatively small power supply of generated energy Source.
Therefore, energy-saving can be realized in annealing device 1, and the form supplied electric power can be made more diversified.
In addition, when the temperature T of heat-treatment furnace 2 is less than threshold value T1, switching part 5 will be from outside according to annealing device 1 The power supply of power supply 20 is to control device 4.In addition, switching part 5 is in the future when the temperature T of heat-treatment furnace 2 is threshold value T1 or more From the power supply of thermoelectric conversion member 3 to control device 4.According to this configuration, it can be realized energy-saving, and be not delayed to control The supply of electric power necessary to the movement of device 4.
For example, when the starting of the heat-treatment furnace 2 of the room temperature in halted state starts, from thermoelectric conversion member 3 Electric power is smaller, and control device 4 is insufficient to allow to be acted.At this point, switching part 5 extremely controls the power supply from external power supply 20 Device 4 processed.On the other hand, for example, heat-treatment furnace 2 temperature it is very high, reach heat-treatment furnace 2 can to treated object 100 into In the case where the degree of row heat treatment, the electric power from thermoelectric conversion member 3 is larger, it is sufficient to act control device 4.This When, switching part 5 is by the power supply from thermoelectric conversion member 3 to control device 4.Come at this point, control device 4 does not need consumption From the electric power of external power supply 20.
In addition, according to annealing device 1, even if can also lead in the case where the exceptions such as power failure occur for external power supply 20 It crosses and thermoelectric conversion member 3 is used as promptly with power supply (no power failure power supply, UPS:Uninterruptible Power Supply (uninterruptible power supply)), to be supplied electric power to control device 4.Even if can also make when external power supply 20 is abnormal as a result, Control device 4 carries out necessary operation.That is, being able to suppress with the exception of external power supply 20 and keeping the movement of control device 4 prominent So the case where cutting.Thereby, it is possible to inhibit the phenomenon that be abnormal in control device 4 and heat-treatment furnace 2.
In addition, even if in the case where causing the heating of heat-treatment furnace 2 to act to stop due to external power supply 20 abnormal etc., Since the thermal capacity of heat-treatment furnace 2 is larger, the temperature of heat-treatment furnace 2 is maintained in a long time.Even if as a result, right External power supply 20 is abnormal in the heat treatment of treated object 100, can generate enough electric power using thermoelectric conversion member 3 Time is also longer.Even if as a result, when external power supply 20 is abnormal, can also make in a long time control device 4 continue into Action is made.Stopping thereby, it is possible to carrying out backup job necessary to the stopping to control device 4 etc. and to annealing device 1 Necessary operation.In addition, as power supply is promptly used, without using electrical storage devices such as batteries.It therefore, there is no need to periodically be stored The replacement operation of electric installation, labour and time needed for the maintenance to control device 4 can be reduced.In addition, by being filled to electric power storage The reduction set, moreover it is possible to which environment contributes to preserving our planet.
In addition, valve 21, locking mechanism according to annealing device 1, as the subsidiary ancillary equipment for being set to heat-treatment furnace 2 23, electric power necessary to the respective movement of measuring device 24 and display device 25 is relatively small.Thereby, it is possible to pass through Thermoelectric conversion member 3 is filled to as the valve 21 of these ancillary equipments, locking mechanism 23, measuring device 24 and display device 25 Electric power needed for dividing ground supply.
In addition, thermoelectric conversion member 3 is installed on the exhaust passage 14 that heat-treatment furnace 2 is arranged according to annealing device 1. According to this configuration, the heat from heat-treatment furnace 2 can be more reliably transferred to thermoelectric conversion member 3.
More than, embodiments of the present invention are illustrated, but the present invention is not limited to above embodiment.This hair It is bright to be made various changes in the range of being recorded in claims.
[variation]
(1) in the above-described embodiment, as thermoelectric conversion member 3, the structure for having used Peltier element is carried out Explanation, however, you can also not be in this way.Thermoelectric conversion member has the structure that can convert heat energy into electric power.For example, It, can also be using the knot of the boiler including turbine, generator and the heat for receiving heat-treatment furnace 2 as thermoelectric conversion member Structure.At this point, generating steam by boiler, rotate turbine by the steam.By the rotation for the generator being connect with turbine come Generate electric power.Using the electric power as the electric power from thermoelectric conversion member come using.
(2) in addition, in the above-described embodiment, for switching part 5, with the control by control device 4 come to power supply It is illustrated for the form that path 31,32 switches over, however, you can also not be in this way.For example, switching part 5 also may be constructed To switch supply path 31,32 by the manual operation of operating personnel.
(3) in addition, in the above-described embodiment, as ancillary equipment, instantiating valve 21, locking mechanism 23, measurement dress 24 and display device 25 are set, however, you can also not be in this way.For example, it is also possible to omit valve 21, locking mechanism 23, measuring device 24 And at least one of display device 25.In addition, the others other than temperature sensor also can be used as measuring device Measuring device.In addition, above-mentioned valve 21, locking mechanism 23, measuring device 24 and display dress also can be used as ancillary equipment Set the ancillary equipment other than 25.
(4) in addition, in the above-described embodiment, by taking thermoelectric conversion member 3 is mounted on the form of exhaust passage 14 as an example It is illustrated, however, you can also not be in this way.For example, as shown in figure 3, the wall portion 17 for being installed on furnace main body 11 also can be set Thermoelectric conversion member 3A.Thermoelectric conversion member 3A has structure same as thermoelectric conversion member 3.In addition, below, to such as The different structure of embodiment shown in FIG. 1 is illustrated, and for identical structure, identical label is added in figure and is omitted Explanation.At this point, the outer surface of the wall portion 17 of the surface 3a of thermoelectric conversion member 3A and furnace main body 11 is at face contact.Heat to electricity conversion portion Part 3A is connected with the 2nd conductive component 29.In addition, as shown in figure 4, thermoelectric conversion member 3,3A both sides also can be set.In addition, By the configuration of thermoelectric conversion member 3 in the place that can receive the heat from heat-treatment furnace 2.Accordingly it is also possible to by thermoelectricity State configuration of the converting member 3 to be separated with heat-treatment furnace 2.
(5) in addition, in the above-described embodiment, with when external power supply 20 is abnormal control device 4 only by carrying out self-heating It is illustrated for the form that the electric power of electric converting member 3 is acted, however, you can also not be in this way.For example, it is also possible to be, When external power supply 20 is abnormal, on the basis of from the electric power of thermoelectric conversion member 3, using the electric power from electrical storage device, Act control device 4.Even in this case, since the output required electrical storage device is smaller, prepare The negligible amounts of electrical storage device.
(6) in addition, in the above-described embodiment, being said so that heater 13 is the form of electrothermal heater as an example Bright, however, you can also not be in this way.For example, heater may be the heater to be generated heat using the burning of gas.
Industrial availability
The present invention can be widely applied as annealing device.

Claims (3)

1. a kind of annealing device, which is characterized in that the annealing device has:
Heat-treatment furnace is used to be heat-treated treated object;
Thermal energy from the heat-treatment furnace is converted to electric power by thermoelectric conversion member;
Control device is used to control the heat-treatment furnace;
Switching part is used to select one by the AC power from external power supply and from the direct current power of the thermoelectric conversion member Supply controls the switching part by the control device to the control device;
1st conductive component is used to connect the switching part and the external power supply, be provided on the 1st conductive component by AC power from the external power supply is converted to the 1st converter of the direct current power of the control device;
2nd conductive component is used to connect the switching part and the thermoelectric conversion member, is arranged on the 2nd conductive component There is the 2nd converter of the direct current power that the direct current power from the thermoelectric conversion member is converted into the control device; And
3rd conductive component connects the switching part and the control device,
The switching part is configured to,
When the temperature of the heat-treatment furnace is less than scheduled threshold value, by the power supply from the external power supply to the control Device processed, also,
When the temperature of the heat-treatment furnace is the threshold value or more, by the power supply from the thermoelectric conversion member to institute Control device is stated,
The thermoelectric conversion member is used as supplying electric power to the control device but not supply electric power to the heat-treatment furnace Power supply.
2. annealing device according to claim 1, which is characterized in that
The annealing device is further equipped with the ancillary equipment controlled by the control device,
The ancillary equipment can be acted using the electric power from the thermoelectric conversion member.
3. annealing device according to claim 1 or 2, which is characterized in that
The thermoelectric conversion member is installed on at least one party in the wall portion of exhaust passage and the heat-treatment furnace, and the exhaust is logical Road is set to the heat-treatment furnace.
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