CN105743458B - Vibrating device and electronic equipment - Google Patents
Vibrating device and electronic equipment Download PDFInfo
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- CN105743458B CN105743458B CN201610058207.3A CN201610058207A CN105743458B CN 105743458 B CN105743458 B CN 105743458B CN 201610058207 A CN201610058207 A CN 201610058207A CN 105743458 B CN105743458 B CN 105743458B
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- 239000000463 material Substances 0.000 claims abstract description 185
- 230000002093 peripheral effect Effects 0.000 claims description 24
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 230000035939 shock Effects 0.000 abstract description 168
- 230000000007 visual effect Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 14
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 241001247986 Calotropis procera Species 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 238000010276 construction Methods 0.000 description 5
- 238000003032 molecular docking Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
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- 239000010936 titanium Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Refuge Islands, Traffic Blockers, Or Guard Fence (AREA)
Abstract
The present invention relates to vibrating device and electronic equipment, for the purpose of realizing and miniaturization can be realized in plane visual.The vibrating device has：One drive shaft 22 carries out round-trip asymmetry micro-vibration in axis direction axial direction；One micro-vibration generating unit 20 makes the driving 22 of connection one end carry out round-trip asymmetry micro-vibration in axis direction axial direction；One framework 12 is that drive shaft 22 axially can carry out micro-vibration in axis direction freely, supports at least one of 20 component 20 of drive shaft 22 or micro-vibration generating unit material；One shock portion material 24, according to the round-trip asymmetry micro-vibration of drive shaft 22, so as to be combined in the axis direction axial direction of drive shaft 22 with drive shaft 22 to mobility.Shock portion material 24 moves in drive shaft 22, is then knocked portion 26 by hitting to be arranged in framework 12, and vibration is generated in framework 26.
Description
The application is applicant on March 4th, 2014 submits, application No. is " 201410076612.9 ", invention name
The referred to as divisional application of the application for a patent for invention of " vibrating device and electronic equipment ".
Technical field
It is applied the present invention relates to the vibrating device applied in the input equipments such as touch panel and in the vibrating device
Electronic equipment.
Background technology
Introduce the equipment of configuration touch panel function and the input equipment using operation key in a display device always before this.
In such devices, preset configuration vibrating device, operator are pressed by finger or manipulation pen, you can input information.Input letter
During breath, vibration will be passed back by finger and manipulation pen, and operator can have any actual knowledge of equipment by thoughts and feelings and manipulate situation.Such as patent text
The piezoelectricity for described in 1 (JP2011-245437), being configured in this vibrating device and a terminal being fixed on pedestal is offered to cause
Dynamic device, induction hammer is configured on other terminals of piezoelectric actuator by medium of damper, can be succeeded by these measures real
The lightness of existing vibrating device.
In the vibrating device described in patent document 1, although thickness success is thinning, in order to obtain defined vibration, need
Using the induction hammer of tens of milliseconds length, therefore realize that miniaturization has difficulties in plane visual.
Invention content
Present invention seek to address that above-mentioned traditional subject, provides the vibrating device that miniaturization can be realized in plane visual and answers
With the electronic equipment of the vibrating device.
To achieve the above object, a kind of vibrating device, its main feature is that, including：
Carry out the drive shaft of round-trip asymmetry axial direction micro-vibration；
The micro-vibration that being connected to one end of above-mentioned drive shaft makes drive shaft axially carry out round-trip asymmetry micro-vibration occurs
Component；
Above-mentioned drive shaft or above-mentioned micro-vibration generation part is supported to enable drive shaft freely to axial progress micro-vibration
Framework；
Shock portion material being moved axially due to the micro-vibration of above-mentioned drive shaft along drive shaft, with driving axis connection；
Wherein, above-mentioned shock portion material moves and then hits the portion of being knocked being arranged in framework then to frame on the driving shaft
Body generates vibrating effect.
The vibrating device, further feature are：Above-mentioned micro-vibration generation part is to include elastic sheet and stretch
The deformable plates of contracting thin plate add above-mentioned flexible thin plate after driving voltage to flexible thin plate of the configuration in elastic sheet at least one side
Flexible central part can carry out Relative Displacement with peripheral part to the normal direction of above-mentioned elastic sheet.
The vibrating device, further feature are：Above-mentioned micro-vibration generation part only passes through above-mentioned drive shaft quilt
Framework supports.
The vibrating device, further feature are：The peripheral part of above-mentioned micro-vibration generation part is with dotted edge
It is circumferential to be equidistantly fixed in above-mentioned framework.
The vibrating device, further feature are：Above-mentioned shock portion material or at least one party for being knocked portion are faces
It highlights to other side.
The vibrating device, further feature are：Above-mentioned framework has the wall body that above-mentioned shock portion material two sides faces,
The above-mentioned portion of being knocked is arranged on the wall surface of each above-mentioned wall body, so that above-mentioned shock portion material is hit repeatedly back and forth is knocked portion.
The vibrating device, further feature are：Above-mentioned shock portion material is useful for the through hole of insert drive shaft,
Gap between through hole and drive shaft is filled by the heat-shrinkable resin handled through overheat contraction, passes through heat-shrinkable resin
Thermal shrinkage force, shock portion material agree with drive shaft friction.
The vibrating device, further feature are：The driving that above-mentioned shock portion material is made to be moved axially to drive shaft
Voltage waveform, make above-mentioned shock portion material from reference position to the time of the close direction in the portion that is knocked movement be according to mobile first away from
From setting, first distance than above-mentioned shock portion material in said reference position and it is above-mentioned be knocked portion between distance also
Long, above-mentioned shock portion material does not really want mobile the first set distance, but to strike above-mentioned be knocked in portion.
The vibrating device, further feature are：The driving that above-mentioned shock portion material is made to be moved axially to drive shaft
Voltage waveform, since shock portion, material docks the position that a side is knocked portion to the time that the opposing party portion of being knocked moves be by
It is set according to mobile second distance, which is knocked portion's material compared to one side of docking and the opposing party is knocked between portion
Distance is also long, and above-mentioned shock portion material does not really want mobile set second distance, but to hit above-mentioned the opposing party and be knocked portion.
The vibrating device, further feature are：The driving that above-mentioned shock portion material is made to be moved axially to drive shaft
Voltage waveform is to make material movement side of shock portion to being knocked the signal obtained after the shock in portion based on sensor detection shock portion's material
It is set to reversion occurs.
The invention further relates to the electronic equipments for having aforementioned vibrating device.
Above-mentioned drive shaft is shifted to top by above-mentioned shock portion material, by being knocked component with being arranged in above-mentioned framework,
So as to generate vibration in framework.By these structures, shock portion material with being arranged in framework is knocked component due to high speed
Generate shock, can in framework excited vibrational.The vibration generated in framework will be passed to the electronics that is configured with vibrating device and set
It is standby upper.Therefore, it can be vibrated the size for not increasing impact member, it is small also vibrating device can be harvested in plane visual
The effect of type.
Description of the drawings
The above and other features of the present invention, property and advantage will pass through retouching with reference to the accompanying drawings and examples
It states and becomes readily apparent from, wherein：
Fig. 1 shows the longitdinal cross-section diagram of the vibrating device composition of implementation form 1 of the present invention.
Fig. 2 shows the driving voltage waveform of vibrating device and the position example of shock portion material of implementation form 1 of the present invention.
Fig. 3 shows the longitdinal cross-section diagram of the vibrating device composition of implementation form 2 of the present invention.
Fig. 4 shows the driving voltage waveform of vibrating device and the position example of shock portion material of implementation form 2 of the present invention.
Fig. 5 shows the longitdinal cross-section diagram of the vibrating device composition of implementation form 3 of the present invention.
Fig. 6 shows the driving voltage waveform of vibrating device and the position example of shock portion material of implementation form 3 of the present invention.
Fig. 7 shows the framework of vibrating device and the perspective oblique view of other shapes 1 in implementation form 1~3 of the present invention.
Fig. 8 shows the framework of vibrating device and the perspective oblique view of other shapes 2 in implementation form 1~3 of the present invention.
Fig. 9 shows the longitdinal cross-section diagram of the vibrating device composition of implementation form 4 of the present invention.
Figure 10 expresses the framework of the vibrating device of implementation form 4 of the present invention and the shape of other micro-vibration generating unit materials is closed
System and be the view watched from below, wherein (a) to (f) is different exemplary views.
The explanation of main appended drawing reference in figure：
10 vibrating devices
12 frameworks
12a side walls
12b upper walls
12c lower walls
12d, 12e through hole
12f is open
12g lower ends
12h fixed parts
14 driving portion materials
16 flexible thin plates
18 elastic sheets
20 micro-vibration generation parts
20a peripheral parts
22 drive shafts
24 shock portion materials
24a through holes
26 heat-shrinkable resins
26 are knocked portion
28 rubber bush
30 drive control parts
32 sensors
Specific embodiment
(implementation form 1)
The vibrating device in the implementation form 1 of the present invention is put up with below, is described with reference to the accompanying drawings.In the accompanying drawings, attached drawing
Top with " on ", lower section with " under " illustrate.Vibrating device 10 as shown in Figure 1, which is used in real device, has been incorporated into touch
Shield the electronic equipment of function and using in electronic equipment as the input unit of operation key.In this class of electronic devices, in advance
When being mounted with vibrating device 10, operator's finger or pen pressing input information, vibration true feeling also feeds back to finger and nib
Give operator sense of touch on the spot in person.
As shown in Figure 1, the vibrating device 10 of this implementation form 1 has following composition, round-trip asymmetry movement in an axial direction
Micro-vibration drive shaft 22, being connected to one end of drive shaft 22 makes drive shaft 22 round-trip the micro- of asymmetry micro-vibration shakes in an axial direction
Dynamic generation part 20 can carry out the framework 12 that micro-vibration supports drive shaft 22 for drive shaft 22, pass through drive shaft 22 freely
Round-trip asymmetry micro-vibration can be to the shock portion material 24 axial movement, being connect with drive shaft 22 of drive shaft 22.
Vibrating device 10 is to move to be knocked portion 26 to hit to be arranged in framework 12 above drive shaft 22 by shock portion material 24
So as to make that vibration is generated in framework 12.
As described later, the driving voltage of setting is added in into micro-vibration generation part 20, drive shaft 22 carries out round-trip non-right
Title property micro-vibration, every 1 stroke of micro-vibration will rise shock portion material 24, and high-speed impact is arranged on being hit in framework 12
Portion 26 is hit, thus hits and vibration is brought to framework 12, this vibration is also passed to above-mentioned electronic equipment, is then passed to operation
Person brings true feeling on the spot in person to operator.
Vibrating device 10 can be made of the size of the angle from several mm to 1cm × number mm height, even if shock portion material 24 is not
Very big vibrating effect can also be obtained greatly.Therefore make great efforts to minimize the vibrating device 10 in planar observation.
The composition for putting up with the vibrating device 10 of this implementation form 1 below is described in detail.
As shown in Figure 1, framework 12 is in order to which vibration and shock is made to express come but with metal or alloy etc. well
Material is made.Framework 12 is protruded above side wall 12a by upper wall 12b, since the lower section of side wall 12a and upper wall
Lower wall 12c opposite 12b is prominent and is made.Through hole 12d is provided on upper wall 12b, through hole is provided on lower wall 12c
Rubber bushing 28 is mounted on 12e, through hole 12d, 12e, and drive shaft 22 is installed by the intervention of rubber bushing 28.Therefore, even
Connect through hole 12d, 12e central part bit line be designed to it is perpendicular with upper wall 12b and lower wall 12c.In addition, it highlights from periphery
The lower part for being knocked portion 26 and being arranged on upper wall 12b.The top of lower wall 12c can also be arranged on by being knocked portion 26, as described later,
It can also be arranged on other compositions.In addition, portion 26 is knocked non-bulging.
The drive component 14 of mobile shock portion material 24 is made of micro-vibration generation part 20 and drive shaft 22.Micro-vibration is sent out
Raw component 20 is deformable plates, which is made of elastic sheet 18 and flexible thin plate 16, and the deformable plates are by giving bullet
Property thin plate 18 the flexible thin plate 16 of at least one side configuration apply driving voltage and make flexible thin plate 16 flexible, then center portion
Relative Displacement occurs to the normal direction of elastic sheet 18 with peripheral part.In this implementation form 1, micro-vibration generation part 20 is
Flexible thin plate 16 is configured in 18 one side of elastic sheet, i.e. piezoelectric monocrystal section bar material.
Flexible thin plate 16 be the piezoelectric material of electrode material is attached to by two sides, electrostriction material is formed.Electrode material
Material generally uses such as copper or copper alloy.Piezoelectric material, electrostriction material can be metatitanic acid lead silicate, metatitanic acid titanium or magnoniobate
Lead etc..Flexible thin plate 16 is rounded or polygon.
Elastic sheet 18 is to use such as copper, copper alloy elastomeric material.For elastic sheet 18, by that as shown in Figure 1
When the flexible thin plate 16 of kind is arranged on the single side of elastic sheet 18, if the appearance for corresponding to flexible thin plate 16 and designing just compares
It is more satisfactory, but even if even not corresponding.Flexible thin plate 16 is fixed on elastic sheet 18 with such as conductive adhesive
, and be mounted with to apply alive wiring at each position on the two sides of micro-vibration generation part 20, on flexible thin plate 16, match
Line access drive control position 30.
Drive shaft 22 is the material using light weight and rigid high material such as carbon system, cylindrical.Before its axis of drive shaft 22
End is integrally fixed at the position of micro-vibration generation part 20.In this implementation form 1, axis fore-end is fabricated to axle center
Compared to axle center, it is a little can also to be made smaller by almost similary thickness for the diameter of axis front end.In addition, drive shaft 22 is
The front end face at axis front end position is fixed on to the surface of micro-vibration generation part 20 with adhesive.In addition, in micro-vibration generating unit
Through hole can be designed on part 20, the lateral parts for fixing the axis front end position of drive shaft 22 can also.
Drive shaft 22 is that the progress of micro-vibration is supported by rubber bush 28.Rubber bush 28 is support drive shaft 22
Elastic material, so being designed with the centre bore being inserted into convenient for drive shaft 22.Rubber bush 28 mounted on through hole 12d is will be solid
The front end for being scheduled on the drive shaft 22 of the opposite side of the side of micro-vibration generation part 20 is subject to by the inner face of centre bore
Then it fixes.But the rubber bushing 28 mounted on through hole 12e is not that drive shaft 22 is fastened in centre bore
Face is only merely to pressurize to support from outside.With such a configuration, drive shaft 22 is micro- to shake to axial progress micro-vibration
The dynamic movement that drive shaft 22 is caused not need to carry out long range as shock portion material 24 in itself.
Shock portion material 24 is to give framework 12 vibrating effect by hitting, so quality is larger.To make its miniaturization, hit
The material that portion's material 24 can use the density as tungsten alloy larger makes.24 rounded or polygon of shock portion material, central portion have
Facilitate insertion into the through hole 24a of drive shaft 22.Gap between through hole 24a and drive shaft 22 will fill as with drive shaft 22
Between frictional engagement portion through overheat contraction handle heat-shrinkable resin 25, pass through the thermal shrinkage force of heat-shrinkable resin 25
(frictional force of outside pressurised driving axis), shock portion material 24 is connected in drive shaft 22.
Drive control part 30 is that specified drive waveform pressurization is carried out to flexible thin plate 16.Drive control part 30 is to incite somebody to action
The rectangular waves of tens of kHz degree frequencies, zigzag wave, return shake time and the triangular waveform of turnaround time difference etc. stress on it is flexible
Then thin plate 16 makes shock portion material 24 be moved to the portion that is knocked 26.Then, after the shock of shock portion material 24 is knocked portion 26, make shock
The moving direction of portion's material 2424 occurs reversion and changes the waveform of driving voltage and stress on flexible thin plate 16.This implementation form 1
In, use the triangular wave of rise and fall time difference as shown in Figure 2.
It next it will be described for the manufacturing method of vibrating device 10 in this implementation form 1.First, electrode is set up on two sides
Flexible conductive adhesive of thin plate 16 etc., which is fixed on, produces micro-vibration generation part 20 on elastic sheet 18.Then it will drive
Moving axis 22 is fixed on micro-vibration generation part 20 in this, as drive component 14.Next drive shaft 22 is inserted into framework 12
Through hole 12e, the through hole 24a of shock portion material 24, framework 12 through hole 12d in, while support with rubber bush 28, use
Shock portion material 24 is connect by heat-shrinkable resin 25 with drive shaft 22 to be agreed with.Later, pacify on the two sides of micro-vibration generation part 20
Assembly line is connect with drive control part 30.
Next the operation with regard to the vibrating device 10 of this implementation form 1 illustrates.
The thin plate 16 that stretches after driving voltage rising will be extended in thickness direction, and horizontal direction will be shunk, elasticity
The telescopic variation does not occur for thin plate 18, so its center portion of micro-vibration generation part 20 will conjugate upward, periphery
Part can conjugate downwards.Being fixed on the drive shaft 22 of 20 central portion of micro-vibration generation part can also be moved upward, with
The shock portion material 24 that drive shaft 22 is agreed with can also move upward.When driving voltage reaches rated voltage Vd, driving voltage
Meeting dramatic decrease, the deformation of micro-vibration generation part 20 can also restore to the original state rapidly.Associated is that drive shaft 22 can also be returned therewith
Original position is gone back to, but shock portion material 24 will not downwards be moved with drive shaft 22, but stop in situ.As a result, shock portion material
24 have occurred slight top movement.With this round-trip asymmetry axial movement of drive shaft 22, shock portion material 24 also exists
1 μm-several μm are moved upward in round-trip every time.Above-mentioned action is run repeatedly with the frequency of tens of kHz.
As shown in Fig. 2, about driving voltage waveform of the shock portion material 24 to the axial movement of drive shaft 22 is made, by the portion of hitting
Material 24 is set from reference position to the time that 26 direction of closing of the portion that is knocked moves according to mobile first distance L1, and is somebody's turn to do
First distance L1 is also longer with being knocked the distance between portion 26 D1 than being in the shock portion material 24 of reference position.Shock portion material
24 be not mobile the first distance L1 being set, but hits and be knocked portion 26.
Shock portion material 24 only needs the distance D1 at the beginning of moving reference position with regard to that can hit appointed part 26, driving voltage waveform
Maintain original sample waveform, the time required to mobile first distance L1 before constantly pressurizeed.Then, needed for mobile first distance L1
If time is up, change driving voltage waveform for shock portion material 24 is made to move downwards, 24 layback D1 of shock portion material
Time in pressurize.The 24 layback D1 times of shock portion material then again make micro-vibration generation part shock portion material 24
It is moved upward in the time as the first distance L1 and pressurizes.After the shock of shock portion material 24 is knocked portion 26, until making to hit
It hits before the driving voltage waveform change that portion's material 24 is moved downwards and set, the holding of shock portion material 24 agrees with being knocked portion 26
.Operation repeatedly in this way, shock portion material 24 vibrate repeatedly with being knocked portion 26, and operator is allowed to experience vibration effect
Fruit.
In this such a 1 vibrating device 10 of implementation form, obtained shock portion material 24 makes less compared with
Big vibrating effect.So strive accomplishing that the lower vibrating device 10 of horizontal observation minimizes.In addition, because micro-vibration generation part 20
It is thin plate, so vibrating device 10 itself can also reducing thickness.Micro-vibration generation part 20 is merely by drive shaft 22
It is held in framework 12.Therefore, the micro-vibration of micro-vibration generation part 20 will not be absorbed by the other materials as framework 12, and
It is to be communicated directly to drive shaft 22 so the micro-vibration amount that drive shaft 22 can be expanded.In addition, be knocked portion 26, be towards in pair
The shock portion material 24 of face position and highlight.Therefore, make only by prominent part the displacement distance of shock portion material 24 compared with
It is small.Thus, for example situations below, can reduce the amount of movement of the round-trip asymmetry axial direction of drive shaft 22, can reduce and be driven needed for it
Dynamic voltage Vd, then the driving of shock portion material 24 will become light.
In addition, shock portion material 24 is useful for the through hole of insert drive shaft 22, the sky between through hole 24a and drive shaft 22
Gap is filled by the heat-shrinkable resin 25 handled through overheat contraction, passes through the thermal shrinkage force of heat-shrinkable resin 25, shock portion material
24 agree with the friction of drive shaft 22.Therefore, simple structure can reduce number of parts.In addition, 22 surrounding of drive shaft can integrally be done
Into unified construction, drive shaft 22 can be just arranged on to the central part of shock portion material 24, also with regard to symmetric shape can be formed.
By shock portion material 24 to the driving voltage waveform of the axial movement of drive shaft 22, make shock portion material 24 from reference position
It is set to the portion that is knocked 26 close to the time that direction is moved according to mobile first distance L1, first distance is than being in base
The shock portion material 24 that level is put will be grown with being knocked the distance between portion 26 D1.Therefore, shock portion material 24 is not that movement is set
The first distance L1, but hit designated position 26.Therefore, 24 shock to position 26 of material of shock portion can accurately be implemented.
(implementation form 2)
Next, illustrate the vibrating device in the present invention in implementation form 2 with reference to the accompanying drawings.
The vibrating device 10 of this implementation form 2, as shown in the figure, framework 12 has corresponding wall on the two sides of shock portion material 24
Face.Each position of the upside wall surface of wall surface and lower wall 12c that portion 26 is arranged on the downside of upper wall 12b is knocked, so making shock portion material
24 can hit designated position 26 back and forth.
In addition, in implementation form 1, portion 26 will be knocked and designed towards the protrusion of shock portion material 24.But in this reality
It applies in form 2, the portion 26 that is knocked on peripheral part towards the opposite of shock portion material 24 protrudes.This protrusion is, relative to quilt
Shock portion 26 has on the two sides of shock portion material 24, designs on the two sides of shock portion material 24.
As shown in figure 4, in this implementation form 2, to the driving voltage of the axial movement shock portion material 24 of drive shaft 22
Shock portion material 24 is knocked the position in portion 26 by waveform from docking, and to be knocked time for moving in portion 26 to another be according to movement
Second distance L2 is set.Second distance L2 ratios dock a shock portion material 24 for being knocked portion 26 and are knocked portion with another
Distance D2 will be grown between 26.Shock portion material 24 is not the mobile second distance L2 set, but hits another and be knocked portion
26。
Distance D2 and for reference position shock portion material 24 and be knocked the distance between portion 26.In this case
Reference position is that shock portion material 24 docks the position that a side is knocked portion 26.I.e. that is, as long as shock portion material 24 is from benchmark position
It is exactly to hit another to be knocked portion 26 to put and be moved to D2 distances, and driving voltage waveform keeps original state, needed for displacement distance L2
Constantly pressurization before time arrives.Shock portion material 24 hits other directions and is hit a little after 26, until making shock portion material 24 downwards
Until mobile driving voltage waveform change, shock portion material 24 is knocked portion 26 with another and keeps mated condition.
Then, when arriving the time required to mobile second distance L2, change drive for shock portion material 24 is made to move downwards
Dynamic voltage waveform, shock portion material 24 return to the time pressurization of second distance L2.The displacement distance D2 downwards of shock portion material 24
A side will be hit afterwards is knocked portion 26, and driving voltage waveform keeps original state.The time required to mobile second distance L2
It constantly pressurizes before arrival.Shock portion material 24 hit a side be knocked portion 26 after, until being moved upward shock portion material 24
Before the driving voltage waveform change of setting, shock portion material 24 keeps the portion 26 that is knocked with a side to be always maintained at agreeing with.
Shock portion material 24 can change the mobile required driving electricity in side again up after the time for returning to second distance L2 arrives
At this moment corrugating need to only be moved upward in the time of second distance L2 in shock portion material 24 and pressurize.By these repeatedly
Action, shock portion material 24 constantly hit a side and are knocked portion 26 in many ways repeatedly, also operator are allowed to experience vibrating effect.
The vibrating device 10 of this implementation form 2, the constantly round-trip shock of the meeting of shock portion material 24 is knocked portion 26, so can produce
Raw high-efficiency vibration effect.Then, driving voltage waveform, shock portion material 24 from docking one position for being knocked portion 26 and being knocked portion 26
It puts and is knocked time of the movement of portion 26 to another and is set according to mobile second distance L2.The second distance is than docking one
Side be knocked portion 26 shock portion material 24 and another be knocked portion 26 between distance D2 to grow.Therefore, shock portion material 24 is not
The mobile second distance L2 set, but hit another and be knocked portion 26.Therefore, it can realize that hitting material hits quilt really
Shock portion 26.
In addition, shock portion material 24 is highlighted towards being knocked portion 26 of opposite, so the movement of shock portion material 24
Distance is shorter, and the driving is lighter.In addition, shock portion material 24 is heavier compared with simple tabular, so framework 12 can be given
Strong vibration sense.Particularly this implementation form 2, because two sides all devises protrusion shock portion material 24 can be relatively heavy
A bit, so can also bring stronger vibrating effect to framework 12.In addition, the peripheral part in shock portion 24 is as protruding portion
Point, so also can efficiently aggravate the weight of shock portion material 24.It can also by protruding part is made closer to the position of central part.
In addition, shock portion material 24 is made by the techniques such as casting, firing, protruding part can also be made simultaneously, so than in framework 12
Upper setting protrusion is easier.
(implementation form 3)
Referring next to the vibrating device in the implementation form 3 of the description of the drawings present invention.
In addition, about that will enclose the same symbol with 1,2 identical construction of implementation form and omit the description.This implementation form 3
Vibrating device 10 be combined deformation case example.
As shown in figure 5, in the vibrating device 10 of this implementation form 3, make 24 axial movement to drive shaft 22 of material of shock portion
Driving voltage waveform, be that shock portion material 24 is detected to being knocked the signal obtained after the shock in portion 26 based on sensor 32 to set
Invert 24 moving direction of shock portion material surely.
Sensor 32 is that the configuration such as piezoelectric transducer that can detect impact effects is being knocked portion in this implementation form 3
26 part.
In addition, being knocked portion 26 is designed in the material different from framework 12.For example, 12 body part of framework uses appearance
The material of intended form is easily formed, portion 26 is knocked and uses the material that the impact force of shock portion material 24 can be transmitted to framework 12 very well
Material.
In addition, micro-vibration generation part 20 is exactly so-called double piezo crystals section bar material.It is exactly micro-vibration generation part 20
Be by applying driving voltage to the flexible thin plate 16 for being arranged on 18 two sides of elastic sheet, and make flexible thin plate 16 flexible then in
The deformable plates of Relative Displacement occur to the normal direction of elastic sheet 18 for centre part and peripheral part.
In addition, drive shaft 22 is to connect the rear end face of the phase negative side for the side for securing micro-vibration generation part 20 to fix
Below rubber bush 28, the bushing design is in the through hole 12d of 12 upper wall 12b of framework.Rubber serves as a contrast in this implementation form 3
Set 28 is equipped with centre bore.In addition, through hole 12e is only worked hard in glove with without design rubber bush, drive shaft 22 in lower wall 12c.
The driving voltage waveform that shock portion material 24 is made to be moved axially to drive shaft 22 in the vibrating device 10 of this implementation form 3
It is to detect shock portion material 24 based on sensor 32 to make shock portion material 24 to being knocked the signal obtained after the shock in portion 26 to set
Moving direction inverts.
As shown in fig. 6, drive control position 30 is to carry out the first driving voltage to the flexible thin plate 16 below Fig. 5 first to add
Pressure.Then, the shock portion material 24 in reference position will rise, and displacement distance D3 shocks top is knocked portion 26.It hits
After the arrival of portion's material 23 top is knocked portion 26, is detected by the sensor 32 of top, generate the first enabling signal.It is opened according to first
Dynamic signal, the first driving voltage stop, and the second driving voltage pressurization of the flexible thin plate 16 in driving top starts.Second driving voltage
With the same waveform of the first driving voltage, so the flexible thin plate 16 of top, the lower section under pressurizeing with the first driving voltage of receiving is stretched
Contracting thin plate 16 occurs equally to shrink, so, inverse warping when micro-vibration generation part 20 occurs to pressurize with the first driving voltage.
Therefore, it lowers under shock portion material 24 and is knocked portion 26 below shock after displacement distance D3.Shock portion material 24 is under arrival
Side is detected when being knocked portion 26 by the sensor of lower section 32, generates the second enabling signal.According to the second enabling signal, second
Driving voltage stops, and the first driving voltage of the flexible thin plate 16 of downside is driven to start to pressurize.Therefore, shock portion material 24 again on
It rises.
Detection impact effects, which make moving direction that reversion occur, just can accurately implement shock portion material 24 to being knocked portion 26
It hits.
In addition, as implementation form 1 and implementation form 2, after detection is hit, further to equidirectional pressurization predetermined time
And after time number of micro-vibration etc., moving direction can be inverted.Also shock portion material 24 can accurately be implemented to being knocked portion
26 shock.
In this implementation form 3, sensor 32 is piezoelectric transducer, such as the magnetic sensors such as MR sensors, is configured right
The framework 12 that portion 26 should be knocked is positioned to put and also may be used.The dial (not sectioned out in figure) of respective sensor 32, be by
The arranged side by side magnetic sensor of two magnetic poles in the axial direction of drive shaft 22, when in shock portion, the shock of material 24 is knocked portion 26, with
Sensor 32 is oppositely arranged on the side of shock portion material 24.It in addition, can also with optic position sensor.
In addition, framework 12 can be made by being bent one block of plank in implementation form 1-3.At this moment, through hole 12d, 12e is prior
Set can also, after 12 shape formable of framework setting can also.But other shapes cannot be made in framework 12.
For example, framework 12 is made bottomless box-like as shown in Figure 7, one side wall 12a is cut, is allowed to upper wall 12b in flat
It can also as lower wall 12c after the bending of row shape.In addition, through hole 12d, 12e there is provided other purposes.Make such shape
Afterwards, the rigidity of framework 12 can be increased compared with the framework 12 illustrated in implementation form 1-3, therefore be conveyed by vibrating device 10
Vibration to electronic equipment can also be strengthened.It partly not cut off as opening 12f at this point, most handy dotted line is indicated.It can make
Vibrating device 10 is light-weighted simultaneously, also can easily be combined by 24 grade part containings of shock portion material in framework 12.
In addition, framework 12 is made box shown in Fig. 7 as shown in Figure 8, opposite side wall 12a is cut, bending each section makes
It is parallel to upper wall 12b, can also as lower wall 12c.At this point, the lower wall 12c of various pieces, each lower end before incision is several
It is to stretch.In addition, cutting away the part of the lower end before each lower wall 12c is cut, through hole 12e is formed after bending and also may be used
With.Through hole 12d is made of other methods.In addition, designed openings 12f is ideal as shown in Figure 7.It is cut in advance when manufacturing box
Except the edge of side wall 12a, through hole 12e also is made simultaneously after bending, so easily making.
(implementation form 4)
Next, it is described with reference to the vibrating device of the implementation form 4 of the present invention.
In addition, about that will enclose the same symbol with 1,2 identical construction of implementation form and omit the description.As shown in figure 9,
In the vibrating device 10 of this implementation form 4, peripheral part of micro-vibration generation part 20 is equidistantly solid with circumferencial direction with point
It is scheduled in framework 12.
Framework 12 be arranged to it is bottomless box, on upper wall 12b be configured rubber bush 28 support drive shaft 22 it is freely micro-
The through hole of vibration is also made.In addition, the lower end 12g of side wall 12a, a side of interior peripheral edge is arranged on and compares peripheral edge
The high top of a bit, as the fixed part 12h of micro-vibration generation part 20.
Micro-vibration generation part 20 is to be fixed on peripheral part 20a on the fixed part 12h of framework 12 with dotted (small area).
In this implementation form 4, the framework 12 as shown in Figure 10 (a) sees that micro-vibration generation part 20 is peripheral part in quadrangle from below
The quadrangle of 20a slightly falls within rounded on the fixed part 12h of framework 12.In addition, as shown in figure 9, peripheral part 20a is will be elastic
Thin plate 18 extends from flexible thin plate 16 to outer periphery and is made, and regard elastic sheet 18 as upside, and the thin plate 16 that stretches is as downside
Mounted on the fixed part 12h of framework 12.Like this, it stretches in thin plate 16, elastic sheet 18, is stretched out from outside and be fixed on framework 12
The part of fixed part 12h be configured above as peripheral part 20a, thus circuit layout easy to operate.
Micro-vibration generation part 20 is secured directly in framework 12, so the drive of the stabilization of driving portion material 14 can be obtained
Dynamic effect.In addition, it is not the whole of peripheral part 20a but is fixed with point, so the quilt that micro-vibration generation part 20 is sent out
The micro-vibration amount that framework 12 is absorbed is little, and the driving force of drive component 14 is very big.
In addition, as shown in figure 9, the thickness than micro-vibration generation part 20 that the difference of height of fixed part 12h is done is also deep
If, micro-vibration generation part 20 would not expose from the lower part of framework 12, and be surrounded by framework 12, be filled in this way in vibration
It puts in 10 combination, micro-vibration generation part 20 would become hard to be destroyed by external force after combination.
In addition, being knocked portion 26, it is not only provided at the upper wall 12b positions of framework 12, the top of micro-vibration generation part 20
Also there is setting, shock portion material is made to carry out round-trip percussion movement.Because being back and forth movement, efficient vibrating effect can be generated.
In addition, the quality close to the peripheral part 20a positions of micro-vibration generation part 20 is larger, so can also make micro-vibration generation part 20
Generated driving force increase.
In addition, the framework 12 and the combination of shapes of micro-vibration generation part 20 of the vibrating device 10 of this implementation form 4 also have
Situation except above-mentioned.For example, Figure 10 (b) is that framework 12 opposite with figure (a) is rounded, micro-vibration generation part 20 is in quadrangle
Shape.Framework 12 and micro-vibration generation part 20 are in quadrangle in Figure 10 (c).In this case, micro-vibration generation part 20
On the fixed part 12h of dimetric edge that the peripheral part 20 at each angle of quadrangle will be equipped on framework 12.Framework in Figure 10 (d)
12 be in octagonal, and micro-vibration component 20 is quadrangle.The corner of the tetragonal framework 12 of Figure 10 (c) can also be made chamfering
Shape.Therefore, framework 12 need not make octagonal, and making fillet quadrangle can also.It is the micro-vibration of Figure 10 (d) in Figure 10 (e)
The shape of generation part 20 has been made as circle.Figure 10 (f) by micro-vibration generation part 20 neither round nor quadrangle,
But hexagon.These shapes.Framework 12 and the shape of micro-vibration generation part 20 in this way can be with multiple combinations.
Although in addition, not shown in Fig. 9, on the side wall 12a of framework 12, can also set as shown in Figures 7 and 8
Opening.In addition, the shape of the framework 12 of this implementation project mode 4 has been made box, it is equally curved that implementation form 1 can also be same as
One block of plank of folding is made.
In addition, in implementation form 1-4 of the present invention, micro-vibration generation part 20 is to use piezoelectric monocrystal type and double piezo crystals
Section bar material.But this is also not limited to, so-called accumulation type material can also be used, can be driven with small driving voltage, institute
It can be made at lower cost with drive control part 30.
Other implementation forms of the present invention
Implementation form 5
A kind of vibrating device：Carry out in the axial direction round-trip asymmetry slight vibration drive shaft, in the axial direction push connect
The above-mentioned drive shaft for connecing one end carries out the micro-vibration generating unit material of round-trip asymmetry slight vibration, to make above-mentioned drive shaft in axis
Upward free slight vibration, the framework being at least supported to above-mentioned drive shaft or micro-vibration generating unit material, by above-mentioned driving
The round-trip asymmetry slight vibration of axis, the shock portion for moving in the axial direction of above-mentioned drive shaft and being combined with above-mentioned drive shaft
Material.Above-mentioned drive shaft is shifted to top by above-mentioned shock portion material, by being knocked components hit with being arranged in above-mentioned framework, from
And vibration is generated in framework.
Shock portion material due to high speed be arranged in framework be knocked component generate shock, can excite and shake in framework
It is dynamic.The vibration generated in frame will be passed on the electronic equipment for being configured with vibrating device.Therefore, even if not increasing shock portion
The size of part can also be vibrated, and the effect of vibrating device miniaturization can be also harvested in plane visual.
Implementation form 6, on the basis of implementation form 5, which is thin plate.Principle is sent out using above-mentioned micro-vibration
Life portion material, to flexible thin plate print plus driving voltage of the configuration in elastic sheet at least one side, flexible thin plate carries out flexible running,
Central part and the peripheral part Relative Displacement in the normal direction of above-mentioned elastic sheet cause to deform.
Since micro-vibration generating unit material is thin plate, vibrating device itself can reduce thickness.
Implementation form 7 on the basis of implementation form 6, using above-mentioned micro-vibration generating unit material, only passes through above-mentioned drive shaft
It is supported by above-mentioned framework.
Since the slight vibration of micro-vibration generating unit material is not absorbed by other component material, drive shaft can be conveyed to,
The slight vibration degree of drive shaft can be enhanced.
Implementation form 8, on the basis of implementation form 6, the peripheral edge portions of above-mentioned micro-vibration generating unit material are by dot
It is fixed in a manner of equally spaced in a circumferential direction in above-mentioned framework.
Since micro-vibration generating unit material is secured directly in framework, stable driving can be obtained.
Implementation form 9 on the basis of implementation form 5, above-mentioned shock portion material or above-mentioned is knocked at least one of component face
It is prominent to opposite side.
Since the displacement distance of shock portion material is very short, driving shock portion material very comfortable.In addition, it dashes forward in shock portion material
In the case of going out, since shock portion material is heavier, larger vibration can be transmitted to framework.
Implementation form 10, on the basis of implementation form 5, above-mentioned framework is equipped with and is respectively facing above-mentioned shock portion material two sides
Wall surface, the above-mentioned portion of being knocked are respectively provided on above-mentioned wall surface, and above-mentioned shock portion material hits above-mentioned shock portion back and forth.
By round-trip shock, good efficient vibration is generated.
Implementation form 11, on the basis of implementation form 5, above-mentioned shock portion material possesses running through for above-mentioned drive shaft insert
Hole, the heat-shrinkable resin that the gap between above-mentioned through hole and above-mentioned drive shaft was heat-shrinked are filled, and pass through above-mentioned heat
The above-mentioned shock portion material friction of thermal shrinkage force of shrinkage resin agrees in above-mentioned drive shaft.
Although construction is simple, number of parts can be reduced.It in addition, because can be by drive shaft periphery configured in one piece Cheng Jun
One construction so drive shaft can be configured to the central part of shock portion material, forms symmetrical shape.
Implementation form 12 on the basis of implementation form 9, makes the driving that above-mentioned shock portion material is moved axially to drive shaft electric
Corrugating makes above-mentioned shock portion material from reference position be according to mobile first distance to the time of the close direction in the portion that is knocked movement
Come what is set, first distance than the above-mentioned shock portion material in said reference position and it is above-mentioned be knocked portion between distance it is also long.
Above-mentioned shock portion material does not really want mobile the first set distance, but to strike above-mentioned be knocked in portion.
It can actually accomplish to make shock material to hit to being knocked portion.
Implementation form 13, on the basis of implementation form 10, driving that above-mentioned shock portion material is made to be moved axially to drive shaft
Voltage waveform, since shock portion, material docks the position that a side is knocked portion to the time that the opposing party portion of being knocked moves be by
It is set according to mobile second distance.The second distance is knocked portion's material compared to docking one side and is knocked portion with the opposing party
Between distance it is also long.Above-mentioned shock portion material does not really want mobile set second distance, but to hit above-mentioned the opposing party and be hit
Hit portion.
It can actually accomplish to make shock material to hit to being knocked portion.
Implementation form 14 on the basis of implementation form 5, makes the driving that above-mentioned shock portion material is moved axially to drive shaft electric
Corrugating is to detect shock material based on sensor to make shock material moving direction to being knocked the signal obtained after the shock in portion
Reversion occurs to set.
Because being to hit to invert moving direction by detecting, can accomplish to be knocked the material shock of shock portion really
Portion.
Implementation form 15 is a kind of electronic equipment for having aforementioned vibrating device.
Portion is knocked since shock portion material can hit at a high speed to be located in framework, so huge shake can be generated to framework
It is dynamic.The vibration generated in framework is conveyed on the electronic equipment for being mounted with vibrating device.Therefore, shock portion material is even if less
Huge vibration force can be generated.Try hard to the vibrating device of plane angle can be made lightly to change, so also electronic equipment can be made to reach small
Type.
Claims (10)
1. a kind of driving device, which is characterized in that including：
The drive shaft of axial micro-vibration；
Being connected to one end of above-mentioned drive shaft makes the micro-vibration generation part of drive shaft axial direction micro-vibration；
Above-mentioned drive shaft is supported to enable drive shaft freely to the axial framework for carrying out micro-vibration；
Portion's material being moved axially due to the micro-vibration of above-mentioned drive shaft along drive shaft, with driving axis connection；
Wherein, the peripheral part of above-mentioned micro-vibration generation part is fixed in above-mentioned framework with dotted.
2. device according to claim 1, it is characterised in that：The peripheral part of above-mentioned micro-vibration generation part is with dotted edge
It is circumferential to be equidistantly fixed in above-mentioned framework.
3. device according to claim 1, it is characterised in that：Above-mentioned micro-vibration generation part is in polygonal, above-mentioned micro- to shake
The peripheral part at each angle of polygonal of dynamic generation part is fixed in above-mentioned framework.
4. device according to claim 3, it is characterised in that：Above-mentioned micro-vibration generation part is in quadrangle.
5. device according to claim 3, it is characterised in that：Above-mentioned framework is rounded.
6. device according to claim 1, it is characterised in that：Above-mentioned framework is in polygonal, above-mentioned micro-vibration generation part
Peripheral part be fixed in polygonal edge of above-mentioned framework.
7. device according to claim 6, it is characterised in that：Above-mentioned framework is in quadrangle.
8. device according to claim 6, it is characterised in that：Above-mentioned micro-vibration generation part is rounded.
9. device according to claim 1, it is characterised in that：Above-mentioned micro-vibration generation part is to include elastic sheet and stretch
The deformable plates of contracting thin plate add above-mentioned flexible thin plate after driving voltage to flexible thin plate of the configuration in elastic sheet at least one side
Flexible central part and peripheral part can carry out Relative Displacement to the normal direction of above-mentioned elastic sheet, above-mentioned elastic sheet be by
It is fixed in above-mentioned framework.
10. has the electronic equipment of the device recorded in claim 1 to 9 any one.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-086934 | 2013-04-01 | ||
| JP2013086934A JP5540249B1 (en) | 2013-04-01 | 2013-04-01 | Vibration device and electronic device |
| CN201410076612.9A CN104104353B (en) | 2013-04-01 | 2014-03-04 | Vibrating device and electronic equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410076612.9A Division CN104104353B (en) | 2013-04-01 | 2014-03-04 | Vibrating device and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105743458A CN105743458A (en) | 2016-07-06 |
| CN105743458B true CN105743458B (en) | 2018-07-06 |
Family
ID=51409458
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410076612.9A Active CN104104353B (en) | 2013-04-01 | 2014-03-04 | Vibrating device and electronic equipment |
| CN201420096211.5U Expired - Lifetime CN203883780U (en) | 2013-04-01 | 2014-03-04 | Vibration device and electronic equipment |
| CN201610058207.3A Active CN105743458B (en) | 2013-04-01 | 2014-03-04 | Vibrating device and electronic equipment |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410076612.9A Active CN104104353B (en) | 2013-04-01 | 2014-03-04 | Vibrating device and electronic equipment |
| CN201420096211.5U Expired - Lifetime CN203883780U (en) | 2013-04-01 | 2014-03-04 | Vibration device and electronic equipment |
Country Status (2)
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| JP (1) | JP5540249B1 (en) |
| CN (3) | CN104104353B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019012408A (en) * | 2017-06-30 | 2019-01-24 | 日本電産サンキョー株式会社 | Input device |
| CN110891105B (en) * | 2019-11-20 | 2021-09-24 | Oppo广东移动通信有限公司 | Vibration transmission device and electronic equipment |
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|---|---|---|---|---|
| JP2004050154A (en) * | 2002-07-24 | 2004-02-19 | Fdk Corp | Vibration generating device |
| JP2005176121A (en) * | 2003-12-12 | 2005-06-30 | Tdk Corp | Apparatus for converting direction of displacement of magnetostriction, and magnetostriction actuator and magnetostriction vibrating apparatus using the same |
| CN1898856A (en) * | 2004-03-02 | 2007-01-17 | 株式会社压电技术 | Small piezoelectric or electrostrictive linear motor |
| JP2008259345A (en) * | 2007-04-06 | 2008-10-23 | Shicoh Engineering Co Ltd | Linear drive unit, lens drive unit, camera, and portable telephone with camera |
| JP2011245437A (en) * | 2010-05-28 | 2011-12-08 | Nec Tokin Corp | Vibration device |
| JP2012240038A (en) * | 2011-05-24 | 2012-12-10 | Panasonic Corp | Impact actuator |
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| JPH0271298A (en) * | 1988-09-06 | 1990-03-09 | Seiko Electronic Components Ltd | Oscillatory buzzer |
| JP3615883B2 (en) * | 1996-11-06 | 2005-02-02 | 株式会社モリテックス | Giant magnetostrictive actuator and giant magnetostrictive speaker using the same |
| JPH1119589A (en) * | 1997-06-30 | 1999-01-26 | Alps Electric Co Ltd | Vibration generating apparatus |
| KR101136307B1 (en) * | 2001-03-09 | 2012-04-25 | 임머숀 코퍼레이션 | Haptic interface for laptop computers and other portable devices |
| WO2005083874A1 (en) * | 2004-03-02 | 2005-09-09 | Piezoelectric Technology Co., Ltd. | Small piezoelectric or electrostrictive linear motor |
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2013
- 2013-04-01 JP JP2013086934A patent/JP5540249B1/en active Active
-
2014
- 2014-03-04 CN CN201410076612.9A patent/CN104104353B/en active Active
- 2014-03-04 CN CN201420096211.5U patent/CN203883780U/en not_active Expired - Lifetime
- 2014-03-04 CN CN201610058207.3A patent/CN105743458B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004050154A (en) * | 2002-07-24 | 2004-02-19 | Fdk Corp | Vibration generating device |
| JP2005176121A (en) * | 2003-12-12 | 2005-06-30 | Tdk Corp | Apparatus for converting direction of displacement of magnetostriction, and magnetostriction actuator and magnetostriction vibrating apparatus using the same |
| CN1898856A (en) * | 2004-03-02 | 2007-01-17 | 株式会社压电技术 | Small piezoelectric or electrostrictive linear motor |
| JP2008259345A (en) * | 2007-04-06 | 2008-10-23 | Shicoh Engineering Co Ltd | Linear drive unit, lens drive unit, camera, and portable telephone with camera |
| JP2011245437A (en) * | 2010-05-28 | 2011-12-08 | Nec Tokin Corp | Vibration device |
| JP2012240038A (en) * | 2011-05-24 | 2012-12-10 | Panasonic Corp | Impact actuator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105743458A (en) | 2016-07-06 |
| CN104104353A (en) | 2014-10-15 |
| JP2014200783A (en) | 2014-10-27 |
| CN203883780U (en) | 2014-10-15 |
| CN104104353B (en) | 2016-01-06 |
| JP5540249B1 (en) | 2014-07-02 |
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