CN105733470B - A kind of denatured conductive filler, its preparation method and application - Google Patents
A kind of denatured conductive filler, its preparation method and application Download PDFInfo
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- CN105733470B CN105733470B CN201410765911.3A CN201410765911A CN105733470B CN 105733470 B CN105733470 B CN 105733470B CN 201410765911 A CN201410765911 A CN 201410765911A CN 105733470 B CN105733470 B CN 105733470B
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Abstract
The invention discloses a kind of denatured conductive filler, its preparation method and application.The denatured conductive filler includes the micron metal powder for being mainly modified and removing with substituting agent and reducing agent after surface organic lubricant, and the substituting agent includes polyaldehyde or/and short-chain polyol acid, the reducing agent are selected from inorganic and/or organic reducing agent.Its preparation method includes：Micron metal powder is handled with substituting agent and reducing agent, so as to by the modification of micron metal powder and remove the organic lubricant on micron metal powder surface.The present invention improves the connection between conductive filler and conductive filler by the organic lubricant on the removal filler surface in conductive filler Process of Surface Modification；And the metallic of in-situ preparation small particle makes the contact area between filler rough surface increase filler, strengthens the connection between conductive filler, the gap between filler is filled, so as to improve the electric conductivity of conductive filler and conducting resinl.
Description
Technical field
Conductive filler preparing technical field of the present invention, and in particular to a kind of denatured conductive with excellent conductive performance is filled out
Material, its preparation method and application.
Background technology
In microelectronics Packaging field, have the health that virose tin-lead solder not only endangers operating personnel, Er Qieyin
The environmental problem risen increasingly causes the concern of people.And the application of Pb/Sn solders is confined to the connection of below 0.65mm pitches
And connect temperature and meet 200 DEG C of conditions；And micromation, the densification development trend of electronic package material, it is meant that member
Device is less and less, I/O number of pins further increases, and lead spacing further reduces.Most electronic product temperature tolerances are no more than
100 DEG C, this is just there is an urgent need to develop new conductive connecting material, to adapt to the Electronic Packaging requirement being continuously improved.Conducting resinl
Mainly it is made of resin matrix, conducting particles and dispersing additive, auxiliary agent etc., with certain conductive after being a kind of curing or being dry
The adhesive of performance.These adhesives form the molecular structure of conducting resinl after hardening, there is provided mechanical property and viscous
Performance guarantee is connect, and filler grain is formed conductive channel.Its with it is environmental-friendly, processing conditions is gentle, technique is simple and line
The advantages that resolution ratio is small, has caused the broad interest of people.But conducting resinl generally existing electrical conductivity is relatively low and contact resistance
The problems such as unstable.Therefore, develop function admirable, the conductive adhesive of traditional plumber's solder can be substituted to become people's research
Focus.
Conducting resinl is typically what is be made of matrix resin and conductive filler two large divisions.Wherein, conductive filler is mainly gold
Belong to powders A g, Cu, Ni etc..Silver powder has the advantages of good conductivity and strong oxidation resistance concurrently, but expensive, and in damp and hot ring
Silver-colored transport phenomena easily occurs under border, causes silver conductive adhesive resistance unstable；Copper powder price is relatively low, good conductivity, but its antioxygen
Change energy force difference, be chronically exposed to surface in air and easily form oxide-film so as to have a significant impact to its electrical property.Silver-coated copper powder is protected
Silver-colored good electric conductivity has been stayed, and silver coating can effectively prevent the oxidation of copper, and its cost will drop significantly relative to silver powder
It is low.Therefore, it can be as ideal conductive filler.But there is also some problems for the silver-coated copper powder prepared at present in industry：
Copper Powder Surface is not covered by silverskin completely, its electric conductivity, inoxidizability still are below fine silver powder；And prepared by conductive filler
Cheng Zhonghui adds some organic lubricants, this is conducive to conductive filler in the polymer scattered, reduces the viscosity of conducting resinl simultaneously
Facilitate the implementation of conducting resinl；But the presence of this layer of lubricant can make the contact between filler be metal-lubricant-metal shape
State, which adds the resistance that electric current passes through conductive filler；Oxidation work can occur during storage for conductive filler at the same time
With layer of oxide layer can be formed on conductive filler surface, which increases electric current to pass through the resistance that makes.These problems limit silver
Application of the copper-clad powder in conducting resinl field.Therefore research and develop that a kind of cost is low and the conducting resinl of good electrical property has become at present urgently
The technical problem of solution.
The content of the invention
In view of the deficiencies in the prior art, it is a primary object of the present invention to provide a kind of denatured conductive filler, its preparation side
Method and application.
To realize aforementioned invention purpose, main technical schemes of the present invention are as follows：
A kind of denatured conductive filler, comprising being mainly modified with substituting agent and reducing agent and remove organic lubrication on surface
Micron metal powder after agent, wherein the substituting agent includes polyaldehyde or/and short-chain polyol acid, the reducing agent are selected from inorganic
And/or organic reducing agent.
Further, the conductive filler includes micron-sized silver powder, copper powder, nickel powder or silver-coated copper powder, but not limited to this.
Further, the polyaldehyde includes glyoxal, malonaldehyde, butanedial, glutaraldehyde, hexandial or terephthalaldehyde
Deng short-chain polyol acid includes ethanedioic acid, malonic acid, succinic acid, glutaric acid or adipic acid etc., but is not limited to this.
Further, the inorganic reducing agent includes hydroiodic acid, hydrobromic acid, hydrochloric acid, bromine or iodine, the organic reducing agent
Including polyalcohol, the polyalcohol include ethylene glycol, propane diols, butanediol, hexylene glycol, any of pentanediol or two kinds with
On mixture, but be not limited to this.
Further, it is described to be mainly modified with substituting agent and reducing agent and remove the micron metal after surface lubricant
Generated in-situ nano metal particles are also distributed with the surface of powder.
The preparation method of the denatured conductive filler, including：Micron metal powder is handled with substituting agent and reducing agent,
So as to by the modification of micron metal powder and it remove the organic lubricant on micron metal powder surface.
As more one of preferred embodiment, which specifically may include：By 0.001 ~ 0.09 parts by weight
The micron metal powder of modifying agent, the reducing agent of 0.001 ~ 1 parts by weight and 100 parts by weight is mixed in the ethanol of 100 ~ 1000 parts by weight
Middle carry out ultrasonic disperse, so that the organic lubricant on micron metal powder surface is removed, and in the surface in situ of micron metal powder
Nano metal particles are generated, is washed out and is dried in vacuo, obtain the denatured conductive filler.
A kind of conducting resinl, includes aforementioned modified conductive filler.
Further, the conducting resinl is also comprising thermoplasticity, the liquid resin material of thermosetting property or light solidity and corresponding
Curing agent；
Wherein, the liquid resin material includes epoxy resin or polyurethane etc., and the epoxy resin includes bisphenol-A or F
Type epoxy resin, but not limited to this.
Wherein, the curing agent includes acid anhydride type curing agent（Such as methyl hexahydrophthalic anhydride, maleic anhydride）And/or
Amine curing agent（Such as ethylenediamine, diethylenetriamine）And/or latent curing agent（As dicyandiamide, three boron nitride ethamine are complexed
Thing）, but not limited to this.
Wherein, the accelerating agent includes imidazoles（Such as -4 methylimidazole of -2 ethyl of 1- cyanoethyls）And/or ethers, but not
It is limited to this.
Wherein, the diluent is for acetone, toluene, butyl glycidyl ether etc., but not limited to this.
Wherein, the additive is trisnonyl phenyl phosphite（TNPP）, 2,6- three-level butyl -4- methylphenols etc.,
But not limited to this.
Among a preferred embodiment, the conducting resinl can include the following component calculated in parts by weight：Epoxy
100 parts of resin, 85 parts of curing agent, 1 ~ 2 part of accelerating agent, 200 ~ 800 parts of denatured conductive filler, 50 ~ 100 parts of diluent, additive
2 ~ 10 parts.
There is no difference with conventional for the resin material in conducting resinl and its curing agent etc. in the present invention, micron metal powder is made
For conductive filler, the insulation carried originally by the modification micron metal powder surface of modifying agent and substituting agent it is organic
Lubricant is removed, and improves the connection relation between conductive filler.Modifying agent and substituting agent can be in micron metals at the same time
The metallic of the Surface Creation small particle of powder, makes the contact area between filler rough surface increase filler.
Compared with prior art, beneficial effects of the present invention include：It in conductive filler Process of Surface Modification by moving
Except the organic lubricant on filler surface, improve the connection between conductive filler and conductive filler；And the gold of in-situ preparation small particle
Belonging to particle makes filler rough surface, increases the contact area between filler, and strengthens the connection between conductive filler, and fills out
Gap between material, so that the electric conductivity of conductive filler and conducting resinl greatly improved.
Brief description of the drawings
Fig. 1 a are the surface electron microscope of the conductive filler silver-coated copper powder of non-modified processing in comparative example 1；
Fig. 1 b are the surface electron microscope of the conductive filler silver-coated copper powder of modification in embodiment 1；
Fig. 1 c are the surface electron microscope of the conductive filler silver powder of non-modified processing in comparative example 2；
Fig. 1 d are the surface electron microscope of the conductive filler silver powder of modification in embodiment 2；
Fig. 2 a are that contrast is implemented to be modified in conductive filler silver-coated copper powder and embodiment 1 without the method for the present invention processing in 1
Copolymerization Jiao's micro Raman spectra figure of the conductive filler silver-coated copper powder of processing；
Fig. 2 b are modification in the conductive filler silver powder and embodiment 2 handled in contrast implementation 2 without the method for the present invention
Conductive filler silver powder copolymerization Jiao's micro Raman spectra figure；
Fig. 3 a are at modified during contrast implements the conductive filler silver-coated copper powder without the method for the present invention processing in 1 and implements 1
The thermogravimetric analysis TGA curves of the conductive filler silver-coated copper powder of reason；
Fig. 3 b are modification in the conductive filler silver powder and embodiment 2 handled in contrast implementation 2 without the method for the present invention
Conductive filler silver powder thermogravimetric analysis TGA curves.
Embodiment
It is described further below in conjunction with specific implementation of the example to the present invention, but the implementation of the present invention and protection domain are not
It is limited to this.
Comparative example 1
Epoxy resin, curing agent, accelerating agent and commercially available silver-coated copper powder etc. are mixed by following portions by weight：
828 100 parts of epoxy resin
85 parts of curing agent methyl hexahydrophthalic anhydride
1 ~ 2 part of -4 methylimidazole of accelerating agent 1- cyano group -2- ethyls
555 parts of silver-coated copper powder
50 ~ 100 parts of diluent acetone
Additive（TNPP）2 ~ 10 parts
30min will be stirred after above-mentioned each material mixing, obtain unmodified silver-coated copper powder/epoxide resin conductive adhesive.
Clung in clean slide surface with two adhesive tapes, centre forms one section of groove, then by conducting resinl scraper
Blade is uniformly scratched in groove.Sample is put into 90 DEG C of precuring 1h in vacuum drying oven and excludes gas, is then transferred to electric air blast
150 DEG C of curing 1h in drying box.Its resistance is surveyed using low-resistance test system, finally calculate its volume resistivity for 4.56 ×
10-4 Ω· cm。
Common conductive filler silver-coated copper powder of undressed day is detected, obtained surface electron microscope is Fig. 1 a, and
The burnt micro Raman spectra figure of copolymerization of the conductive filler silver-coated copper powder is shown in the dark strokes curve in Fig. 2 a and Fig. 3 a.
Embodiment 1
1）Prepare denatured conductive filler：
In parts by mass, by 100 parts of silver-coated copper powder, 0.06 part of terephthalaldehyde, 0.002 part of iodine, are added to ethanol 1000
Part is mixed, and 20 min of ultrasound in the case where ultrasonic power is 100 W, then handle 3h on magnetic stirring apparatus.3 are washed with ethanol
It is secondary, until modifying agent remaining on silver-coated copper powder is removed.Most after 24 h of drying at room temperature in vacuum drying oven, denatured conductive is obtained
Filler.
2）Prepare conducting resinl
Epoxy resin, curing agent, accelerating agent etc. are mixed by following portions by weight：
828 100 parts of epoxy resin
85 parts of curing agent methyl hexahydrophthalic anhydride
1 ~ 2 part of -4 methylimidazole of accelerating agent 1- cyano group -2- ethyls
Modified 555 parts of silver-coated copper powder
50 ~ 100 parts of diluent acetone
2 ~ 10 parts of additive TNPP
30min is stirred to being uniformly mixed, obtains modified silver-coated copper powder/epoxide resin conductive adhesive.
3）Performance detection：
Clung in clean slide surface with two adhesive tapes, centre forms one section of groove, then by conducting resinl scraper
Blade is uniformly scratched in groove.Sample is put into 90 DEG C of precuring 1h in vacuum drying oven and excludes gas, is then transferred to electric air blast
150 DEG C of curing 1h in drying box.Its resistance is surveyed using low-resistance test system, finally calculate its volume resistivity for 1.28 ×
10-4 Ω· cm。
, can be with Fig. 1 a contrasts if Fig. 1 b are the surface electron microscope of denatured conductive filler silver-coated copper powder that the present embodiment obtains
Find out, by the metallic of terephthalaldehyde and the silver-coated copper powder surface iodinated because foring small size, become surface
It is more coarse.The lubricant situation on modified silver-coated copper powder surface refers to Fig. 2 a and Fig. 3 a, can be with after modifier treatment
See that modifying agent partly removes the lubricant on silver powder surface really.
In the Raman spectrograms of Fig. 2 a, corresponding evidence, 1589 cm of Raman spectrum can be more found-1
and 1394 cm-1Asymmetry (the υ of COO- is corresponded to respectivelyas(COO-)) and symmetrical (υs(COO-)) stretching vibration, this explanation leading
The lubricant on electric filler surface is not free carboxylic acid, but the form of carboxylate；By terephthalaldehyde and I2After processing,
Can find the stretching vibration peak of C-H has an obvious decline.The intensity of Raman spectrum generally after treatment has one
It is decreased obviously, therefore after treatment, modifying agent removes the partial lubrication agent on silver-coated copper powder surface.
By the thermogravimetric analysis TGA curves in Fig. 3 a（Under 10 DEG C/min air atmospheres）It can be seen that the quality of silver-coated copper powder
Variation with temperature, in 50 DEG C ~ 250 DEG C of temperature range, quality is reduced with the rise of temperature, mainly silver-coated copper powder table
In the atmosphere of air oxidation ablation occurs for the lubricant in face, in 250 DEG C ~ 300 DEG C of section, quality with the rise of temperature and
Increase, illustrates after the lubricant degradation on silver-coated copper powder surface is complete, and with oxygen in air oxidation occurs for silver, copper etc.,
Quality increase.There are maximum weightless, the quality remnants 99.6% after weightlessness, after processing at 250 DEG C in untreated silver-coated copper powder
Silver-coated copper powder has maximum weightless at 250 DEG C or so, and the quality remnants after weightlessness reach 99.8%, therefore pass through surface modifier
After processing, the lubricant on silver-coated copper powder surface is removed really.
Comparative example 2
By high resilience polyurethane（PU）, diluent, untreated silver powder etc. mixes by following portions by weight：
100 parts of PU
Solvent N, 300 parts of N-dimethylformamide (DMF)
555 parts of silver powder
50 ~ 100 parts of diluent acetone
2 ~ 10 parts of additive TNPP
Above-mentioned each material is mixed, 30min is stirred, obtains unmodified silver powder/PU conducting resinls.
Clung in clean slide surface with two adhesive tapes, centre forms one section of groove, then by conducting resinl scraper
Blade is uniformly scratched in groove.Sample is put into vacuum drying oven and cures 1h exclusion gases for 90 DEG C.System is tested using low-resistance
Its resistance is surveyed, finally calculates its volume resistivity as 6.1 × 10-4Ω· cm。
After testing, the surface electron microscope obtained is Fig. 1 c, copolymerization Jiao's micro Raman spectra of the conductive filler silver-coated copper powder
Figure is shown in the dark strokes curve in Fig. 2 b and Fig. 3 b.
Embodiment 2
1）Prepare denatured conductive filler
The preparation method of the denatured conductive filler of silver powder is as follows, and each material of parts by weight is taken in following ratio：By silver powder 100
Part, 100 parts of ethanol, hydrobromic acid and 0.06 part of 20 min of ultrasonic mixing in the case where ultrasonic power is 100 W of hydroiodic acid mixture, then
3h is handled on magnetic stirring apparatus.Washed for several times with ethanol, until modifying agent excessive on silver powder is removed.The room in vacuum drying oven
Dry 24 h of temperature.
2）It is prepared by conducting resinl
Mainly it is made of following steps：
High resilience polyurethane, untreated silver powder etc. are mixed by following portions by weight：
100 parts of PU
300 parts of solvent DMF
Modified 555 parts of silver powder
50 ~ 100 parts of diluent acetone
2 ~ 10 parts of additive TNNP
Stir evenly, stir 30min, obtain modified silver powder/PU conducting resinls.In clean slide surface with two glue
Band is clung, and centre forms one section of groove, then uniformly scratches conducting resinl in groove with doctor blade.Sample is put into vacuum
Cure 1h exclusion gases for 90 DEG C in baking oven.Its resistance is surveyed using low-resistance test system, finally calculates its volume resistivity as 1
×10-5Ω· cm。
Modified morphologies please refer to Fig.1 d, it can be seen that the silver powder surface handled by hydrobromic acid is because foring
The metallic of small size becomes more coarse.The lubricant situation on modified silver powder surface refers to the light line of Fig. 2 b and 3b
Bar curve.As it can be seen that after modification, the organic lubricant part on silver powder surface is removed.
Such as Fig. 2 b, in Raman spectrum, corresponding evidence, 1589 cm of Raman spectrum can be found-1 and
1394 cm-1Asymmetry (the υ of COO- is corresponded to respectivelyas(COO-)) and symmetrical (υs(COO-)) stretching vibration, this explanation fills out in conduction
The lubricant for expecting surface is not free carboxylic acid, but the form of carboxylate；1050 cm-1Corresponding CH2Middle C-H keys it is symmetrical curved
1464 cm of Qu Zhendong-1Corresponding to C-CH3Flexural vibrations, after hydrobromic acid and hydroiodic acid processing, it is found that C-H's is flexible
Vibration peak has an obvious decline.The intensity of Raman spectrum generally after treatment has one to be decreased obviously, therefore passes through
After crossing processing, modifying agent removes the partial lubrication agent on silver powder surface.
Such as Fig. 3 b, by thermogravimetric analysis TGA curves（Under 10 DEG C/min air atmospheres）It can be seen that the quality of silver powder is with temperature
The change of degree, in 50 DEG C ~ 300 DEG C of temperature range, quality is reduced with the rise of temperature, mainly the lubrication on silver powder surface
Oxidation ablation occurs in the atmosphere of air for agent, and untreated silver-coated copper powder has maximum weightless, the matter after weightlessness at 300 DEG C
Remnants 99.2% are measured, the silver-coated copper powder after processing is weightless in the presence of maximum at 300 DEG C or so, and the quality remnants after weightlessness reach
99.5%, therefore after surface modifier is handled, the lubricant on silver-coated copper powder surface is removed really.
It should be appreciated that it the above is only the embodiment in the numerous concrete application examples of the present invention, to protection scope of the present invention
It is not limited in any way.All technical solutions formed using equivalents or equivalence replacement, are all fallen within right of the present invention and protected
Within the scope of shield.
Claims (9)
1. a kind of denatured conductive filler, it is characterised in that comprising being mainly modified with substituting agent and reducing agent and remove surface
The micron metal powder of organic lubricant and surface in situ generation nano metal particles, the substituting agent include polyaldehyde or/and short
Chain polyacid, the reducing agent are selected from inorganic and/or organic reducing agent.
2. denatured conductive filler according to claim 1, it is characterised in that the conductive filler includes micron-sized silver
Powder, copper powder, nickel powder or silver-coated copper powder.
3. denatured conductive filler according to claim 1, it is characterised in that the polyaldehyde include glyoxal, malonaldehyde,
Butanedial, glutaraldehyde, hexandial or terephthalaldehyde, the short-chain polyol acid include ethanedioic acid, malonic acid, succinic acid, penta 2
Acid or adipic acid.
4. denatured conductive filler according to claim 1, it is characterised in that the inorganic reducing agent includes hydroiodic acid, hydrogen
Bromic acid, hydrochloric acid, bromine or iodine, the organic reducing agent include polyalcohol, and the polyalcohol includes ethylene glycol, propane diols, fourth two
Any of alcohol, pentanediol, hexylene glycol or two or more mixtures.
5. the preparation method of denatured conductive filler any one of claim 1-4, it is characterised in that including：With substituting agent and
Reducing agent handles micron metal powder, so as to by the modification of micron metal powder and remove organic lubrication on micron metal powder surface
Agent, and generate nano metal particles in the surface in situ of micron metal powder.
6. the preparation method of denatured conductive filler according to claim 5, it is characterised in that further include：By 0.001~
The micron metal powder of the substituting agent of 0.09 parts by weight, the reducing agent of 0.001~1 parts by weight and 100 parts by weight is mixed in 100~
Ultrasonic disperse is carried out in the ethanol of 1000 parts by weight, so that the organic lubricant on micron metal powder surface is removed, and in micron
The surface in situ generation nano metal particles of metal powder, are washed out and are dried in vacuo, obtain the denatured conductive filler.
7. a kind of conducting resinl, it is characterised in that include the denatured conductive filler any one of claim 1-4.
8. conducting resinl as claimed in claim 7, it is characterised in that also include the liquid resin of thermoplasticity, thermosetting property or light solidity
Material and corresponding curing agent；
Wherein, the liquid resin material includes epoxy resin or polyurethane, and the epoxy resin includes bisphenol-A or F type ring oxygen
Resin, and the curing agent includes -4 methylimidazole of methyl hexahydrophthalic anhydride and/or -2 ethyl of 1- cyanoethyls.
9. conducting resinl as claimed in claim 7 or 8, it is characterised in that include the following component calculated in parts by weight：Epoxy
100 parts of resin, 85 parts of curing agent, 1~2 part of accelerating agent, 200~800 parts of denatured conductive filler, 50~100 parts of diluent, addition
2~10 parts of agent.
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| CN106753026B (en) * | 2016-12-30 | 2019-06-25 | 中国科学院深圳先进技术研究院 | The modified method in surface, modified silver powder are carried out to silver powder and include its conductive silver glue |
| CN108728010B (en) * | 2017-04-18 | 2021-02-26 | 中国科学院苏州纳米技术与纳米仿生研究所 | Modified conductive filler, preparation method and application thereof |
| CN109880572A (en) * | 2019-01-29 | 2019-06-14 | 安徽天光传感器有限公司 | A kind of preparation method of sensor high-conductive heat-resistant conducting resinl |
| CN112961625B (en) * | 2021-02-03 | 2022-09-30 | 常州聚和新材料股份有限公司 | Conductive silver adhesive and preparation method and application thereof |
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| CN1948414A (en) * | 2006-11-13 | 2007-04-18 | 浙江理工大学 | Method of preparing high performance conductive glue |
| CN101805574A (en) * | 2010-03-11 | 2010-08-18 | 复旦大学 | Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof |
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| CN104962226A (en) * | 2015-08-06 | 2015-10-07 | 中国振华集团云科电子有限公司 | Conductive silver adhesive, and preparation method and application thereof |
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| CN1948414A (en) * | 2006-11-13 | 2007-04-18 | 浙江理工大学 | Method of preparing high performance conductive glue |
| CN101805574A (en) * | 2010-03-11 | 2010-08-18 | 复旦大学 | Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof |
| CN102248176A (en) * | 2011-07-15 | 2011-11-23 | 云南铜业科技发展股份有限公司 | Preparation method of flake silver powder with low burning loss |
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