CN105733470A - Modified conductive filling material, preparation method thereof and application - Google Patents
Modified conductive filling material, preparation method thereof and application Download PDFInfo
- Publication number
- CN105733470A CN105733470A CN201410765911.3A CN201410765911A CN105733470A CN 105733470 A CN105733470 A CN 105733470A CN 201410765911 A CN201410765911 A CN 201410765911A CN 105733470 A CN105733470 A CN 105733470A
- Authority
- CN
- China
- Prior art keywords
- conductive filler
- agent
- metal powder
- reducing agent
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a modified conductive filling material, a preparation method thereof and application. The modified conductive filling material mainly includes micrometer metal powder which is modified by a substituting agent and a reducing agent and from which surface an organic lubricant is removed. The substituting agent includes polyaldehyde or/and short chain polyprotic acid. The reducing agent is selected from inorganic and/or organic reducing agents. The preparation method includes the steps of: carrying out treatment on the micrometer metal powder by using the substituting agent and the reducing agent, and modifying the micrometer metal powder and removing the organic lubricant from the micrometer metal powder surface. According to the invention, the connection between the conductive filling materials is improved by removing the organic lubricant from the filling material surface in the modification of the conductive filling material. Metal particles with a small particle size are generated in situ. The metal particles increase the filling material surface roughness and contact areas of the filling materials, enhance the connection between the conductive filling materials, fill in the blank of the filling materials, thereby improving the conductive performances of the conductive filling material and a conductive adhesive.
Description
Technical field
Conductive filler preparing technical field of the present invention, is specifically related to a kind of have the denatured conductive filler of excellent conductive performance, its preparation method and application.
Background technology
In microelectronics Packaging field, have virose tin-lead solder and not only endanger the healthy of operator, and the environmental problem caused increasingly causes the concern of people.And the application of Pb/Sn solder is confined to the connection of below 0.65mm pitch and connects the satisfied 200 DEG C of conditions of temperature；And the microminiaturization of electronic package material, densification development trend, it is meant that components and parts are more and more less, I/O number of pins increases further, and lead spacing reduces further.Most electronic product temperature tolerances are less than 100 DEG C, and this is just in the urgent need to the conductive connecting material of development of new, to adapt to the Electronic Packaging requirement improved constantly.Conducting resinl is mainly made up of resin matrix, conducting particles and dispersing additive, auxiliary agent etc., is a kind of adhesive solidifying or having after drying certain electric conductivity.These adhesives define the molecular structure of conducting resinl after hardening, it is provided that mechanical property and adhesive property guarantee, and make filler grain form conductive channel.The advantages such as it has environmental friendliness, processing conditions is gentle, technique is simple and linear resolution is little, have caused the broad interest of people.But the problem such as conducting resinl ubiquity electrical conductivity is relatively low and contact resistance is unstable.Therefore, develop function admirable, can replace tradition plumber's solder conductive adhesive become people research focus.
Conducting resinl is usually by matrix resin and what conductive filler two large divisions formed.Wherein, conductive filler is mainly metal dust Ag, Cu, Ni etc..Argentum powder has good conductivity and the strong advantage of oxidation resistance concurrently, but expensive, and is susceptible to silver transport phenomena under hygrothermal environment, causes silver conductive adhesive resistance unstable；Copper powder price is relatively low, good conductivity, but its oxidation resistance is poor, is chronically exposed in air surface and is easily formed oxide-film thus its electrical property is had a significant impact.Silver-coated copper powder remains the electric conductivity that silver is good, and silver coating can be effectively prevented the oxidation of copper, and its cost will be substantially reduced relative to argentum powder.Therefore, it can as ideal conductive filler.But the silver-coated copper powder of preparation there is also some problems in industry at present: Copper Powder Surface is not covered by silverskin completely, and its electric conductivity, non-oxidizability still are below fine silver powder；And conductive filler can add some organic lubricants in preparation process, this is conducive to conductive filler dispersion in the polymer, reduces the viscosity of conducting resinl and facilitates the enforcement of conducting resinl；But the existence of this layer of lubricant can make the contact between filler be metallic lubricant metallic state, which adds the electric current resistance by conductive filler；Can there is Oxidation in conductive filler simultaneously in the process deposited, and can form layer of oxide layer on conductive filler surface, which increases the electric current resistance by making.These problems limit the silver-coated copper powder application in conducting resinl field.Therefore the conducting resinl researching and developing the low good electrical property again of a kind of cost has become as technical problem urgently to be resolved hurrily at present.
Summary of the invention
In view of the deficiencies in the prior art, present invention is primarily targeted at a kind of denatured conductive filler of offer, its preparation method and application.
For realizing aforementioned invention purpose, main technical schemes of the present invention is as follows:
A kind of denatured conductive filler, comprises the micron metal powder after the main organic lubricant being modified and removing surface with substituting agent and reducing agent, and wherein said substituting agent includes polyaldehyde or/and short-chain polyol is sour, and described reducing agent is selected from inorganic and/or organic reducing agent.
Further, described conductive filler includes micron-sized argentum powder, copper powder, nikel powder or silver-coated copper powder, but is not limited to this.
Further, described polyaldehyde includes Biformyl, malonaldehyde, butanedial, glutaraldehyde, hexandial or terephthalaldehyde etc., and described short-chain polyol acid includes ethanedioic acid, malonic acid, succinic acid, 1,3-propanedicarboxylic acid or adipic acid etc., but is not limited to this.
Further, described inorganic reducing agent includes hydroiodic acid, hydrobromic acid, hydrochloric acid, bromine or iodine, described organic reducing agent includes polyhydric alcohol, and described polyhydric alcohol includes the mixture of any one or more in ethylene glycol, propylene glycol, butanediol, hexanediol, pentanediol, but is not limited to this.
Further, described be mainly modified and remove surface lubricant with substituting agent and reducing agent after the surface of micron metal powder be also distributed and have generated in-situ nano metal particles.
The preparation method of described denatured conductive filler, including: with substituting agent and reducing agent, micron metal powder is processed, thus micron metal powder being modifiied and removed the organic lubricant on micron metal powder surface.
As comparatively one of preferred embodiment, this preparation method specifically comprises the steps that and the modifying agent of 0.001 ~ 0.09 weight portion, the reducing agent of 0.001 ~ 1 weight portion and the micron metal powder of 100 weight portions is mixed in the ethanol of 100 ~ 1000 weight portions and carries out ultrasonic disperse, thus the organic lubricant by micron metal powder surface removes, and at the surface in situ generation nano metal particles of micron metal powder, it is washed out and vacuum drying, obtains described denatured conductive filler.
A kind of conducting resinl, comprises aforementioned modified conductive filler.
Further, described conducting resinl also comprises the liquid resin material of thermoplasticity, thermosetting or light solidity and corresponding firming agent；
Wherein, described liquid resin material includes epoxy resin or polyurethane etc., and described epoxy resin includes bisphenol-A or F type epoxy resin, but is not limited to this.
Wherein, described firming agent includes acid anhydride type curing agent (such as methyl hexahydrophthalic anhydride, maleic anhydride etc.) and/or amine curing agent (such as ethylenediamine, diethylenetriamine etc.) and/or latent curing agent (such as dicyandiamide, three boron nitride ethylamine complex), but is not limited to this.
Wherein, described accelerator includes imidazoles (such as 1-cyanoethyl-2 ethyl-4 Methylimidazole .) and/or ethers, but is not limited to this.
Wherein, described diluent is acetone, toluene, butyl glycidyl ether etc., but is not limited to this.
Wherein, described additive is trisnonyl phenyl phosphite (TNPP), 2,6-tri-grades of butyl-4-methylphenols etc., but is not limited to this.
Among one preferably embodiment, described conducting resinl can comprise the following component calculated in parts by weight: epoxy resin 100 parts, 85 parts of firming agent, accelerator 1 ~ 2 part, denatured conductive filler 200 ~ 800 parts, diluent 50 ~ 100 parts, additive 2 ~ 10 parts.
The present invention do not have difference for the resin material in conducting resinl and firming agent thereof etc. with routine, micron metal powder is as conductive filler, by the modification of modifying agent and substituting agent make micron metal powder surface originally with the organic lubricant of insulation remove, improve the annexation between conductive filler.Simultaneously modifying agent and substituting agent can the little particle diameter of the Surface Creation of micron metal powder metallic, make the contact area between the coarse increase filler of filling surface.
Compared with prior art, the beneficial effect comprise that and improve the connection between conductive filler and conductive filler by its organic lubricant passing through to remove filling surface in conductive filler Process of Surface Modification；And the metallic of the little particle diameter of in-situ preparation makes filling surface coarse, increase the contact area between filler, and strengthen the connection between conductive filler, and fill the space between filler, thus the electric conductivity of conductive filler and conducting resinl is greatly improved.
Accompanying drawing explanation
Fig. 1 a is the surface Electronic Speculum figure of the conductive filler silver-coated copper powder that non-modified processes in comparative example 1；
Fig. 1 b is the surface Electronic Speculum figure of the conductive filler silver-coated copper powder of modification in embodiment 1；
Fig. 1 c is the surface Electronic Speculum figure of the conductive filler argentum powder that non-modified processes in comparative example 2；
Fig. 1 d is the surface Electronic Speculum figure of the conductive filler argentum powder of modification in embodiment 2；
Fig. 2 a is that contrast is implemented in 1 without copolymerization Jiao micro Raman spectra figure of the conductive filler silver-coated copper powder of modification in the conductive filler silver-coated copper powder of the inventive method process and embodiment 1；
Fig. 2 b is that contrast is implemented in 2 without copolymerization Jiao micro Raman spectra figure of the conductive filler argentum powder of modification in the conductive filler argentum powder of the inventive method process and embodiment 2；
Fig. 3 a is that contrast is implemented in 1 without the thermogravimetric analysis TGA curve of the conductive filler silver-coated copper powder of modification in the conductive filler silver-coated copper powder of the inventive method process and enforcement 1；
Fig. 3 b is that contrast is implemented in 2 without the thermogravimetric analysis TGA curve of the conductive filler argentum powder of modification in the conductive filler argentum powder of the inventive method process and embodiment 2.
Detailed description of the invention
Below in conjunction with example, specific embodiment of the invention is described further, but the enforcement of the present invention and protection domain are not limited to this.
Comparative example 1
By epoxy resin, firming agent, accelerator and commercially available silver-coated copper powder etc. by following portions by weight mixing:
Epoxy resin 828100 parts
Firming agent methyl hexahydrophthalic anhydride 85 parts
Accelerator 1-cyano group-2-ethyl-4 Methylimidazole. 1 ~ 2 part
Silver-coated copper powder 555 parts
50 ~ 100 parts of diluent acetone
Additive (TNPP) 2 ~ 10 parts
After being mixed by above-mentioned each material, stirring 30min, obtains unmodified silver-coated copper powder/epoxide resin conductive adhesive.
Clinging with two adhesive tapes in clean slide surface, one section of groove of intermediate formation, then by uniform for conducting resinl doctor blade blade coating in groove.Sample is put into 90 DEG C of precuring 1h in vacuum drying oven and gets rid of gas, then proceed to 150 DEG C of solidification 1h in electricity air dry oven.Adopting low-resistance test system to survey its resistance, finally calculating its specific insulation is 4.56 × 10-4Ω·cm。
Undressed daily conductive filler silver-coated copper powder is detected, and the surface Electronic Speculum figure obtained is Fig. 1 a, and copolymerization Jiao micro Raman spectra figure of this conductive filler silver-coated copper powder is shown in the dark strokes curve in Fig. 2 a and Fig. 3 a.
Embodiment 1
1) denatured conductive filler is prepared:
By mass parts, by silver-coated copper powder 100 parts, terephthalaldehyde 0.06 part, iodine 0.002 part, join ethanol 1000 parts and mix, be ultrasonic 20min under 100W at ultrasonic power, magnetic stirring apparatus then processes 3h.By washing with alcohol 3 times, until the modifying agent of remaining on silver-coated copper powder is removed.Last drying at room temperature 24h in vacuum drying oven, obtains denatured conductive filler.
2) conducting resinl is prepared
By following portions by weight, epoxy resin, firming agent, accelerator etc. are mixed:
Epoxy resin 828100 parts
Firming agent methyl hexahydrophthalic anhydride 85 parts
Accelerator 1-cyano group-2-ethyl-4 Methylimidazole. 1 ~ 2 part
Modified silver-coated copper powder 555 parts
50 ~ 100 parts of diluent acetone
Additive TNPP2 ~ 10 part
30min is to mix homogeneously in stirring, obtains modified silver-coated copper powder/epoxide resin conductive adhesive.
3) performance detection:
Clinging with two adhesive tapes in clean slide surface, one section of groove of intermediate formation, then by uniform for conducting resinl doctor blade blade coating in groove.Sample is put into 90 DEG C of precuring 1h in vacuum drying oven and gets rid of gas, then proceed to 150 DEG C of solidification 1h in electricity air dry oven.Adopting low-resistance test system to survey its resistance, finally calculating its specific insulation is 1.28 × 10-4Ω·cm。
Such as the surface Electronic Speculum figure that Fig. 1 b is the denatured conductive filler silver-coated copper powder that the present embodiment obtains, with Fig. 1 a contrast it can be seen that through terephthalaldehyde and the silver-coated copper powder surface that iodinates because defining undersized metallic, make surface become more coarse.The lubricant situation on modified silver-coated copper powder surface refers to Fig. 2 a and Fig. 3 a, it can be seen that modifying agent part really removes the lubricant on argentum powder surface after modifier treatment.
In the Raman spectrogram of Fig. 2 a, more can find corresponding evidence, the 1589cm of Raman spectrum-1and1394cm-1Asymmetric (the υ of corresponding COO-respectivelyas(COO-)) and symmetrical (υs(COO-)) stretching vibration, this illustrates that the lubricant on conductive filler surface is not free carboxylic acid, but the form of carboxylate；Through terephthalaldehyde and I2After process, it is found that the stretching vibration peak of C-H has an obvious decline.The intensity of Raman spectrum after treatment has one to be decreased obviously generally, and therefore after treatment, modifying agent removes the partial lubrication agent on silver-coated copper powder surface.
By the thermogravimetric analysis TGA curve (under 10 DEG C/min air atmosphere) in Fig. 3 a it can be seen that, the quality variation with temperature of silver-coated copper powder, the temperature range of 50 DEG C ~ 250 DEG C, quality reduces with the rising of temperature, mainly there is oxidation ablation in the lubricant on silver-coated copper powder surface in the atmosphere of air, in the interval of 250 DEG C ~ 300 DEG C, quality increases with the rising of temperature, after illustrating that the lubricant degradation on silver-coated copper powder surface is completely, silver, copper etc. and oxygen generation Oxidation in air, quality increases.Maximum weightlessness is there is in untreated silver-coated copper powder at 250 DEG C, quality remnants 99.6% after weightlessness, the silver-coated copper powder after process has maximum weightlessness at about 250 DEG C, and the quality remnants after weightlessness reach 99.8%, therefore, after surface modifier processes, the lubricant on silver-coated copper powder surface is really removed.
Comparative example 2
By high resilience polyurethane (PU), diluent, untreated argentum powder etc. by following portions by weight mixing:
PU100 part
Solvent N, N-dimethylformamide (DMF) 300 parts
555 parts of argentum powder
50 ~ 100 parts of diluent acetone
Additive TNPP2 ~ 10 part
By above-mentioned each mixing of materials, stir 30min, obtain unmodified argentum powder/PU conducting resinl.
Clinging with two adhesive tapes in clean slide surface, one section of groove of intermediate formation, then by uniform for conducting resinl doctor blade blade coating in groove.Sample is put into 90 DEG C of solidification 1h in vacuum drying oven and gets rid of gas.Adopting low-resistance test system to survey its resistance, finally calculating its specific insulation is 6.1 × 10-4Ω·cm。
After testing, the surface Electronic Speculum figure obtained is Fig. 1 c, and copolymerization Jiao micro Raman spectra figure of this conductive filler silver-coated copper powder is shown in the dark strokes curve in Fig. 2 b and Fig. 3 b.
Embodiment 2
1) denatured conductive filler is prepared
The preparation method of the denatured conductive filler of argentum powder is as follows, take each material of weight portion in following ratio: by 100 parts of argentum powder, ethanol 100 parts, hydrobromic acid and 0.06 part of hydroiodic acid mixture ultrasonic power be under 100W ultrasonic mixing 20min, then on magnetic stirring apparatus process 3h.By washing with alcohol for several times, until modifying agent excessive on argentum powder is removed.Drying at room temperature 24h in vacuum drying oven.
2) prepared by conducting resinl
Mainly it is made up of following steps:
By high resilience polyurethane, untreated argentum powder etc. by following portions by weight mixing:
PU100 part
Solvent DMF 300 parts
Modified 555 parts of argentum powder
50 ~ 100 parts of diluent acetone
Additive TNNP2 ~ 10 part
Stir, stir 30min, obtain the argentum powder/PU conducting resinl modifiied.Clinging with two adhesive tapes in clean slide surface, one section of groove of intermediate formation, then by uniform for conducting resinl doctor blade blade coating in groove.Sample is put into 90 DEG C of solidification 1h in vacuum drying oven and gets rid of gas.Adopting low-resistance test system to survey its resistance, finally calculating its specific insulation is 1 × 10-5Ω·cm。
Modified morphologies refers to Fig. 1 d, it can be seen that the argentum powder surface processed through hydrobromic acid becomes more coarse because defining undersized metallic.The lubricant situation on modified argentum powder surface refers to the light line curve of Fig. 2 b and 3b.Visible, after modification, the organic lubricant part on argentum powder surface is removed.
Such as Fig. 2 b, in Raman spectrum, it is possible to find corresponding evidence, the 1589cm of Raman spectrum-1and1394cm-1Asymmetric (the υ of corresponding COO-respectivelyas(COO-)) and symmetrical (υs(COO-)) stretching vibration, this illustrates that the lubricant on conductive filler surface is not free carboxylic acid, but the form of carboxylate；1050cm-1Corresponding CH2The symmetric curvature vibration 1464cm of middle C H key-1Corresponding to C CH3Bending vibration, after hydrobromic acid and hydroiodic acid process, it is found that the stretching vibration peak of C-H has an obvious decline.The intensity of Raman spectrum after treatment has one to be decreased obviously generally, and therefore after treatment, modifying agent removes the partial lubrication agent on argentum powder surface.
Such as Fig. 3 b, by thermogravimetric analysis TGA curve (under 10 DEG C/min air atmosphere) it can be seen that, the quality variation with temperature of argentum powder, the temperature range of 50 DEG C ~ 300 DEG C, quality reduces with the rising of temperature, mainly there is oxidation ablation in the lubricant on argentum powder surface in the atmosphere of air, maximum weightlessness is there is in untreated silver-coated copper powder at 300 DEG C, quality remnants 99.2% after weightlessness, maximum weightlessness is there is in the silver-coated copper powder after process at about 300 DEG C, quality remnants after weightlessness reach 99.5%, therefore after surface modifier processes, really the lubricant on silver-coated copper powder surface is removed.
Should be appreciated that above is only embodiment in the numerous concrete exemplary applications of the present invention, protection scope of the present invention is not constituted any limitation.The technical scheme that all employing equivalents or equivalence are replaced and formed, all falls within rights protection scope of the present invention.
Claims (10)
1. a denatured conductive filler, it is characterized in that the micron metal powder after comprising the main organic lubricant being modified and removing surface with substituting agent and reducing agent, described substituting agent includes polyaldehyde or/and short-chain polyol is sour, and described reducing agent is selected from inorganic and/or organic reducing agent.
2. denatured conductive filler according to claim 1, it is characterised in that described conductive filler includes micron-sized argentum powder, copper powder, nikel powder or silver-coated copper powder.
3. denatured conductive filler according to claim 1, it is characterized in that described polyaldehyde includes Biformyl, malonaldehyde, butanedial, glutaraldehyde, hexandial or terephthalaldehyde, described short-chain polyol acid includes ethanedioic acid, malonic acid, succinic acid, 1,3-propanedicarboxylic acid or adipic acid etc..
4. denatured conductive filler according to claim 1, it is characterized in that described inorganic reducing agent includes hydroiodic acid, hydrobromic acid, hydrochloric acid, bromine or iodine, described organic reducing agent includes polyhydric alcohol, and described polyhydric alcohol includes the mixture of any one or more in ethylene glycol, propylene glycol, butanediol, pentanediol, hexanediol.
5. denatured conductive filler according to claim 1, it is characterised in that described be mainly modified and remove surface lubricant with substituting agent and reducing agent after the surface of micron metal powder be also distributed and have generated in-situ nano metal particles.
6. the preparation method of denatured conductive filler according to any one of claim 1-5, it is characterised in that including: micron metal powder is processed with substituting agent and reducing agent, thus modifiying micron metal powder and remove the organic lubricant on micron metal powder surface.
7. the preparation method of denatured conductive filler according to claim 6, characterized by further comprising: the modifying agent of 0.001 ~ 0.09 weight portion, the reducing agent of 0.001 ~ 1 weight portion and the micron metal powder of 100 weight portions are mixed in the ethanol of 100 ~ 1000 weight portions and carry out ultrasonic disperse, thus the organic lubricant by micron metal powder surface removes, and at the surface in situ generation nano metal particles of micron metal powder, it is washed out and vacuum drying, obtains described denatured conductive filler.
8. a conducting resinl, it is characterised in that comprise the denatured conductive filler according to any one of claim 1-5.
9. conducting resinl as claimed in claim 8, it is characterised in that also comprise the liquid resin material of thermoplasticity, thermosetting or light solidity and corresponding firming agent；
Wherein, described liquid resin material includes epoxy resin or polyurethane, and described epoxy resin includes bisphenol-A or F type epoxy resin, and described firming agent includes methyl hexahydrophthalic anhydride and/or 1-cyanoethyl-2 ethyl-4 Methylimidazole..
10. conducting resinl as claimed in claim 8 or 9, it is characterised in that comprise the following component calculated in parts by weight: epoxy resin 100 parts, 85 parts of firming agent, accelerator 1 ~ 2 part, denatured conductive filler 200 ~ 800 parts, diluent 50 ~ 100 parts, additive 2 ~ 10 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410765911.3A CN105733470B (en) | 2014-12-11 | 2014-12-11 | A kind of denatured conductive filler, its preparation method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410765911.3A CN105733470B (en) | 2014-12-11 | 2014-12-11 | A kind of denatured conductive filler, its preparation method and application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105733470A true CN105733470A (en) | 2016-07-06 |
| CN105733470B CN105733470B (en) | 2018-04-24 |
Family
ID=56241432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410765911.3A Active CN105733470B (en) | 2014-12-11 | 2014-12-11 | A kind of denatured conductive filler, its preparation method and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105733470B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106753026A (en) * | 2016-12-30 | 2017-05-31 | 中国科学院深圳先进技术研究院 | The modified method in surface, modified silver powder and the conductive silver glue comprising it are carried out to silver powder |
| CN108728010A (en) * | 2017-04-18 | 2018-11-02 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of denatured conductive filler, preparation method and application |
| CN109880572A (en) * | 2019-01-29 | 2019-06-14 | 安徽天光传感器有限公司 | A kind of preparation method of sensor high-conductive heat-resistant conducting resinl |
| CN112961625A (en) * | 2021-02-03 | 2021-06-15 | 常州聚和新材料股份有限公司 | Conductive silver adhesive and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1948414A (en) * | 2006-11-13 | 2007-04-18 | 浙江理工大学 | Method of preparing high performance conductive glue |
| CN101805574A (en) * | 2010-03-11 | 2010-08-18 | 复旦大学 | Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof |
| CN102248176A (en) * | 2011-07-15 | 2011-11-23 | 云南铜业科技发展股份有限公司 | Preparation method of flake silver powder with low burning loss |
| CN104962226A (en) * | 2015-08-06 | 2015-10-07 | 中国振华集团云科电子有限公司 | Conductive silver adhesive, and preparation method and application thereof |
-
2014
- 2014-12-11 CN CN201410765911.3A patent/CN105733470B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1948414A (en) * | 2006-11-13 | 2007-04-18 | 浙江理工大学 | Method of preparing high performance conductive glue |
| CN101805574A (en) * | 2010-03-11 | 2010-08-18 | 复旦大学 | Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof |
| CN102248176A (en) * | 2011-07-15 | 2011-11-23 | 云南铜业科技发展股份有限公司 | Preparation method of flake silver powder with low burning loss |
| CN104962226A (en) * | 2015-08-06 | 2015-10-07 | 中国振华集团云科电子有限公司 | Conductive silver adhesive, and preparation method and application thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106753026A (en) * | 2016-12-30 | 2017-05-31 | 中国科学院深圳先进技术研究院 | The modified method in surface, modified silver powder and the conductive silver glue comprising it are carried out to silver powder |
| CN106753026B (en) * | 2016-12-30 | 2019-06-25 | 中国科学院深圳先进技术研究院 | The modified method in surface, modified silver powder are carried out to silver powder and include its conductive silver glue |
| CN108728010A (en) * | 2017-04-18 | 2018-11-02 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of denatured conductive filler, preparation method and application |
| CN108728010B (en) * | 2017-04-18 | 2021-02-26 | 中国科学院苏州纳米技术与纳米仿生研究所 | Modified conductive filler, preparation method and application thereof |
| CN109880572A (en) * | 2019-01-29 | 2019-06-14 | 安徽天光传感器有限公司 | A kind of preparation method of sensor high-conductive heat-resistant conducting resinl |
| CN112961625A (en) * | 2021-02-03 | 2021-06-15 | 常州聚和新材料股份有限公司 | Conductive silver adhesive and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105733470B (en) | 2018-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106753133B (en) | Conductive silver adhesive and preparation method and application thereof | |
| CN102977742B (en) | A kind of electrically conducting coating | |
| CN105733470A (en) | Modified conductive filling material, preparation method thereof and application | |
| CN104968746B (en) | Heat conductivity conductive adhesive composition | |
| US20160240278A1 (en) | Conductive film and method of manufacturing the same | |
| CN104830031B (en) | A kind of epoxy resin composite material and preparation method thereof having both heat conduction and antistatic property | |
| CN104619803B (en) | Conductive adhesive | |
| Nie et al. | Effect of carbon nanofiber (CNF) silanization on the properties of CNF/epoxy nanocomposites | |
| CN107207935A (en) | Thermal conductivity conductive adhesive composition | |
| CN103666354A (en) | Epoxy resin adhesive and preparation method thereof | |
| CN106098400B (en) | A kind of aminooimidazole Ionic Liquid Modified graphene nanometer sheet/composite polyethylene material and preparation method thereof | |
| CN108659467A (en) | The method of SiC/ graphene oxide compound modification of epoxy resin | |
| JP2012074288A (en) | Conductive composition and solar battery cell | |
| CN103996432A (en) | Easy-to-print circuit board silver paste and preparation method thereof | |
| KR20150117531A (en) | Paste for electromagnetic interference shielding and preparation method for thereof | |
| KR20120116702A (en) | Electrical conductive adhesives and fabrication method therof | |
| CN102069186A (en) | Methods for performing surface treatment on micron silver sheet and preparing high-conductivity conducting adhesive | |
| CN108384441A (en) | Electromagnetic shielding coating for communication equipment and preparation method thereof | |
| JP2006032165A (en) | Conductive metal particles and conductive resin composition using them, and conductive adhesive | |
| CN107474731A (en) | A kind of high-temperature resistant coating containing modified graphene and preparation method thereof | |
| JP2006316086A (en) | Liquid conductive resin composition for coating separator made of metal | |
| CN104673128A (en) | High-performance modified bismaleimide conductive adhesive as well as preparation method and curing method thereof | |
| JP6383183B2 (en) | Conductive adhesive and electronic component using the same | |
| CN108728010B (en) | Modified conductive filler, preparation method and application thereof | |
| CN105802488A (en) | Coating containing composite silicone rubber and preparation method of coating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |