CN105732963A - Phenol-free resin for offset printing ink - Google Patents
Phenol-free resin for offset printing ink Download PDFInfo
- Publication number
- CN105732963A CN105732963A CN201610271893.2A CN201610271893A CN105732963A CN 105732963 A CN105732963 A CN 105732963A CN 201610271893 A CN201610271893 A CN 201610271893A CN 105732963 A CN105732963 A CN 105732963A
- Authority
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- phenol
- phenol resin
- offset ink
- microwave power
- insulation reaction
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- Pending
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- 239000011347 resin Substances 0.000 title abstract description 14
- 229920005989 resin Polymers 0.000 title abstract description 14
- 238000007645 offset printing Methods 0.000 title abstract 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims abstract description 18
- 239000001530 fumaric acid Substances 0.000 claims abstract description 9
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims abstract description 9
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims abstract description 8
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims abstract description 8
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims abstract description 8
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims abstract description 8
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims abstract description 8
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims description 37
- 238000009413 insulation Methods 0.000 claims description 28
- 239000005011 phenolic resin Substances 0.000 claims description 20
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 229940059574 pentaerithrityl Drugs 0.000 claims description 7
- 238000001291 vacuum drying Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 24
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- 230000006378 damage Effects 0.000 abstract description 3
- 238000007639 printing Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000003786 synthesis reaction Methods 0.000 abstract 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 150000001299 aldehydes Chemical class 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- -1 alkyl phenol Chemical compound 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 230000000711 cancerogenic effect Effects 0.000 description 2
- 231100000315 carcinogenic Toxicity 0.000 description 2
- 230000001684 chronic effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 206010012735 Diarrhoea Diseases 0.000 description 1
- 206010020751 Hypersensitivity Diseases 0.000 description 1
- 208000005374 Poisoning Diseases 0.000 description 1
- 206010047700 Vomiting Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 231100000570 acute poisoning Toxicity 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000013566 allergen Substances 0.000 description 1
- 208000026935 allergic disease Diseases 0.000 description 1
- 230000007815 allergy Effects 0.000 description 1
- 208000007502 anemia Diseases 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 231100000481 chemical toxicant Toxicity 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 206010061428 decreased appetite Diseases 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 208000002173 dizziness Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000003908 liver function Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000003471 mutagenic agent Substances 0.000 description 1
- 231100000707 mutagenic chemical Toxicity 0.000 description 1
- 230000003505 mutagenic effect Effects 0.000 description 1
- 210000000653 nervous system Anatomy 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 231100000572 poisoning Toxicity 0.000 description 1
- 230000000607 poisoning effect Effects 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 230000009325 pulmonary function Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 210000002345 respiratory system Anatomy 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 231100000057 systemic toxicity Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 230000008673 vomiting Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/52—Polycarboxylic acids or polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation
- C08G63/54—Polycarboxylic acids or polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation the acids or hydroxy compounds containing carbocyclic rings
- C08G63/553—Acids or hydroxy compounds containing cycloaliphatic rings, e.g. Diels-Alder adducts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/78—Preparation processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09F—NATURAL RESINS; FRENCH POLISH; DRYING-OILS; OIL DRYING AGENTS, i.e. SICCATIVES; TURPENTINE
- C09F1/00—Obtaining purification, or chemical modification of natural resins, e.g. oleo-resins
- C09F1/04—Chemical modification, e.g. esterification
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention relates to the technical field of resin for printing ink, in particular to phenol-free resin for offset printing ink.The phenol-free resin is prepared from, by weight, 70-90 parts of rosin, 2-8 parts of fumaric acid, 1-6 parts of phthalic anhydride, 1-5 parts of itaconic acid, 10-20 parts of pentaerythritol and 5-15 parts of neopentyl glycol.All performance items of the phenol-free resin for offset printing ink meet the use requirement of the offset printing ink, no phenolic substance or formaldehyde is used in the synthesis process, and the phenol-free resin is environmentally friendly and does not cause harm to human bodies and the environment; according to a preparing method, the preparing cycle is greatly shortened, the yield is increased, and cost is reduced.
Description
Technical field
The present invention relates to resin for printing ink technical field, particularly to used for offset ink without phenol resin.
Background technology
General resin used for offset ink mainly with phenol, bisphenol-A, alkyl phenol and formaldehyde condensation, condensation produce thing again with Colophonium additive reaction, generate phenolic-modified abietic resin with polyhydric alcohol again after reaction.Introduce aldehydes matter and the formaldehyde such as phenol, bisphenol-A, alkyl phenol in the process.
Phenolic compound is a kind of prototype matter poisonous substance, and all living individuals are had toxic action.Protein coagulating can be made, so there being strong bactericidal action.Its aqueous solution easily causes systemic toxicity profiles by skin very；Its steam is sucked by respiratory tract, and nervous system damage is bigger.The long-term water polluted for concentration phenol steam or phenol that sucks can cause chronic accumulation poisoning；Suck high-concentration phenol steaming or phenol liquid or a large amount of phenol liquid splashes and can cause acute poisoning on skin.Chronic carbdism is common vomiting, diarrhoea, inappetence, dizziness, anemia and various nerveous system disease.
Another kind of reactant formaldehyde is more highly toxic material, and on China's toxic chemical priority acccess control list, formaldehyde is in second.Formaldehyde has been defined as carcinogenic and cause deformed material by World Health Organization (WHO), the allergen being well recognized as, and is also one of potential strong mutagen.Lot of documents is recorded, and formaldehyde has strong carcinogenic and promotion canceration effect.The impact of health is mainly manifested in the aspects such as heterosmia, stimulation, allergy, abnormal pulmonary function, abnormal liver function by formaldehyde.So operator and later stage ink manufacture and ink user are had certain harm by tradition ink resin process, do not meet the requirement of environmental protection development.
And the Chinese invention patent that notification number is CN102226059B discloses used for offset ink without phenol resin and preparation method,, this resin formula by mass weight part is: Colophonium: 60-80, fumaric acid: 1-10, maleic anhydride: 1-10, fatty acid 1-10, polyhydric alcohol: 10-20, catalyst: 0.1-1；Described performance indications without phenol resin used for offset ink: viscosity mPa.s/25 DEG C: 15000-25000, release property ml/2g: >=5, acid value mgKOH/g :≤25, softening point DEG C: 160-175.A kind of preparation method without phenol resin used for offset ink is provided simultaneously.
Summary of the invention
The technical problem to be solved is to provide used for offset ink without phenol resin, and this resin properties meets offset ink and uses, and does not use aldehydes matter and formaldehyde, environmental protection, will not human body and environment be worked the mischief in building-up process.
For achieving the above object, the present invention adopts the following technical scheme that
Used for offset ink without phenol resin, it is made up of the raw material of following weight portion:
Preferably, bortz powder particle diameter of the present invention is 50～100nm.The resin that the bortz powder that the present invention adds the is made ink for preparing, has notable anti-wear performance and resistance to elevated temperatures.
It is highly preferred that bortz powder particle diameter of the present invention is 75nm.
Of the present invention used for offset ink it is made up of following preparation method without phenol resin:
1) being added in microwave reaction kettle by the Colophonium of proportional quantity, adjustment microwave power is 450～480W, and insulation reaction 10～20min is to melting completely；
2) tetramethylolmethane and neopentyl glycol are added, with step 1) the Colophonium mixing and stirring melted, adjustment microwave power is 530～560W, insulation reaction 15～25min；
3) continuously adding itaconic acid, adjustment microwave power is 530～560W, insulation reaction 5～10min；
4) being further continued for adding fumaric acid and phthalic anhydride, adjustment microwave power is 455～475W, insulation reaction 8～15min；
5) it is eventually adding bortz powder, stirs 20～30min, take out product, with hot wash 3～5 times, vacuum drying,.
Preferably, step 5 of the present invention) stirring 25min.
Preferably, of the present invention used for offset ink without phenol resin, it is made up of the raw material of following weight portion:
Beneficial effects of the present invention:
1, the properties without phenol resin used for offset ink of the present invention meets offset ink use, does not use aldehydes matter and formaldehyde, environmental protection in building-up process, human body and environment will not be worked the mischief, and its preparation method, greatly reduce manufacturing cycle, improve yield, reduce cost.Test shows, the performance indications of resin of the present invention are: softening point: 170～185 DEG C, acid number: 20mgKOH/g, viscosity: 17000～26000mPa.s/25 DEG C.
2, the used for offset ink of the present invention passes through reasonable compatibility without phenol resin, has good stability, does not have too big change, and do not have the phenomenon of precipitation within this time at least 40 months in color, concentration, viscosity.
3, the product tool obtained for preparing ink without phenol resin used for offset ink of the present invention has good wearability, after tested, without phenol resin, the present invention used for offset ink is prepared into ink be used for printing the leaflet obtained, use the power of 500G, with 100 frictions back and forth of 98% ethanol, observing printed matter surface, layer of ink dropping situations do not occur, printed matter surface is also without destroyed.
4, using the ink heat resisting temperature made without phenol resin used for offset ink up to 190～220 DEG C, moment heat resisting temperature is up to 300 DEG C.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described, but the invention is not limited in these embodiments.
Embodiment 1
1) following raw material is weighed by weight:
2) adding in microwave reaction kettle by the Colophonium of proportional quantity, adjustment microwave power is that 450W, insulation reaction 20min are to melting completely；
3) tetramethylolmethane and neopentyl glycol are added, with step 1) the Colophonium mixing and stirring melted, adjustment microwave power is 530W, insulation reaction 25min；
4) continuously adding itaconic acid, adjustment microwave power is 530W, insulation reaction 10min；
5) being further continued for adding fumaric acid and phthalic anhydride, adjustment microwave power is 475W, insulation reaction 15min；
6) it is eventually adding the bortz powder that particle diameter is 50nm, stirs 20min, take out product, with hot wash 5 times, vacuum drying,.
Embodiment 2
1) following raw material is weighed by weight:
2) adding in microwave reaction kettle by the Colophonium of proportional quantity, adjustment microwave power is that 455W, insulation reaction 18min are to melting completely；
3) tetramethylolmethane and neopentyl glycol are added, with step 1) the Colophonium mixing and stirring melted, adjustment microwave power is 535W, insulation reaction 22min；
4) continuously adding itaconic acid, adjustment microwave power is 540W, insulation reaction 9min；
5) being further continued for adding fumaric acid and phthalic anhydride, adjustment microwave power is 470W, insulation reaction 13min；
6) it is eventually adding the bortz powder that particle diameter is 60nm, stirs 22min, take out product, with hot wash 4 times, vacuum drying,.
Embodiment 3
1) following raw material is weighed by weight:
2) adding in microwave reaction kettle by the Colophonium of proportional quantity, adjustment microwave power is that 465W, insulation reaction 15min are to melting completely；
3) tetramethylolmethane and neopentyl glycol are added, with step 1) the Colophonium mixing and stirring melted, adjustment microwave power is 545W, insulation reaction 20min；
4) continuously adding itaconic acid, adjustment microwave power is 545W, insulation reaction 8min；
5) being further continued for adding fumaric acid and phthalic anhydride, adjustment microwave power is 465W, insulation reaction 12min；
6) it is eventually adding the bortz powder that particle diameter is 75nm, stirs 25min, take out product, with hot wash 4 times, vacuum drying,.
Embodiment 4
1) following raw material is weighed by weight:
2) adding in microwave reaction kettle by the Colophonium of proportional quantity, adjustment microwave power is that 475W, insulation reaction 12min are to melting completely；
3) tetramethylolmethane and neopentyl glycol are added, with step 1) the Colophonium mixing and stirring melted, adjustment microwave power is 555W, insulation reaction 18min；
4) continuously adding itaconic acid, adjustment microwave power is 555W, insulation reaction 6min；
5) being further continued for adding fumaric acid and phthalic anhydride, adjustment microwave power is 460W, insulation reaction 10min；
6) it is eventually adding the bortz powder that particle diameter is 80nm, stirs 27min, take out product, with hot wash 3 times, vacuum drying,.
Embodiment 5
1) following raw material is weighed by weight:
2) adding in microwave reaction kettle by the Colophonium of proportional quantity, adjustment microwave power is that 480W, insulation reaction 10min are to melting completely；
3) tetramethylolmethane and neopentyl glycol are added, with step 1) the Colophonium mixing and stirring melted, adjustment microwave power is 560W, insulation reaction 15min；
4) continuously adding itaconic acid, adjustment microwave power is 560W, insulation reaction 5min；
5) being further continued for adding fumaric acid and phthalic anhydride, adjustment microwave power is 455W, insulation reaction 8min；
6) it is eventually adding the bortz powder that particle diameter is 100nm, stirs 30min, take out product, with hot wash 3 times, vacuum drying,.
Claims (5)
1. used for offset ink without phenol resin, it is characterised in that to be made up of the raw material of following weight portion:
The described preparation method without phenol resin used for offset ink, comprises the following steps:
1) being added in microwave reaction kettle by the Colophonium of proportional quantity, adjustment microwave power is 450～480W, and insulation reaction 10～20min is to melting completely；
2) tetramethylolmethane and neopentyl glycol are added, with step 1) the Colophonium mixing and stirring melted, adjustment microwave power is 530～560W, insulation reaction 15～25min；
3) continuously adding itaconic acid, adjustment microwave power is 530～560W, insulation reaction 5～10min；
4) being further continued for adding fumaric acid and phthalic anhydride, adjustment microwave power is 455～475w, insulation reaction 8～15min；
5) it is eventually adding bortz powder, stirs 20～30min, take out product, with hot wash 3～5 times, vacuum drying,.
2. according to claim 1 used for offset ink without phenol resin, it is characterised in that to be made up of the raw material of following weight portion:
3. according to claim 1 and 2 used for offset ink without phenol resin, it is characterised in that: described bortz powder particle diameter is 50～100nm.
4. according to claim 1 and 2 used for offset ink without phenol resin, it is characterised in that: described bortz powder particle diameter is 75nm.
5. according to claim 1 and 2 used for offset ink without phenol resin, it is characterised in that: described step 5) stirring 25min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610271893.2A CN105732963A (en) | 2016-04-27 | 2016-04-27 | Phenol-free resin for offset printing ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610271893.2A CN105732963A (en) | 2016-04-27 | 2016-04-27 | Phenol-free resin for offset printing ink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105732963A true CN105732963A (en) | 2016-07-06 |
Family
ID=56287516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610271893.2A Pending CN105732963A (en) | 2016-04-27 | 2016-04-27 | Phenol-free resin for offset printing ink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105732963A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102226059A (en) * | 2011-05-10 | 2011-10-26 | 天津市天宁树脂有限公司 | Phenol-free resin for offset printing ink and preparation method thereof |
| CN104650648A (en) * | 2015-02-26 | 2015-05-27 | 韦棋 | Wear-resistant and high-temperature-resistant printing ink |
| CN105038393A (en) * | 2015-07-30 | 2015-11-11 | 安徽省中彩印务有限公司 | High-temperature-resistant ink and preparation method thereof |
-
2016
- 2016-04-27 CN CN201610271893.2A patent/CN105732963A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102226059A (en) * | 2011-05-10 | 2011-10-26 | 天津市天宁树脂有限公司 | Phenol-free resin for offset printing ink and preparation method thereof |
| CN104650648A (en) * | 2015-02-26 | 2015-05-27 | 韦棋 | Wear-resistant and high-temperature-resistant printing ink |
| CN105038393A (en) * | 2015-07-30 | 2015-11-11 | 安徽省中彩印务有限公司 | High-temperature-resistant ink and preparation method thereof |
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