CN105729722B - A kind of plastic package die - Google Patents

A kind of plastic package die Download PDF

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Publication number
CN105729722B
CN105729722B CN201610204669.1A CN201610204669A CN105729722B CN 105729722 B CN105729722 B CN 105729722B CN 201610204669 A CN201610204669 A CN 201610204669A CN 105729722 B CN105729722 B CN 105729722B
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China
Prior art keywords
groove
mould
air discharge
discharge duct
pcb
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CN201610204669.1A
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Chinese (zh)
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CN105729722A (en
Inventor
周青云
郭静
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USI Electronics Shanghai Co Ltd
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USI Electronics Shanghai Co Ltd
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Priority to CN201610204669.1A priority Critical patent/CN105729722B/en
Publication of CN105729722A publication Critical patent/CN105729722A/en
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Publication of CN105729722B publication Critical patent/CN105729722B/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention discloses a kind of plastic package die, is related to semiconductor plastic package field, including：Upper mould and the lower mould for placing PCB；The following table of the upper mould is recessed to form groove towards the upper surface of the upper mould；When the upper mould and the lower molding are closed, die cavity is formed between the groove and the PCB；One end connection air discharge duct of the die cavity；The groove is provided with the buffering area for being used for balancing mould stream close to one end of the air discharge duct.Using buffering area, balanced action is played to the mould stream in die cavity, adds the time that air is discharged in die cavity, improves product quality.

Description

A kind of plastic package die
Technical field
The present invention relates to semiconductor plastic package field, more particularly to a kind of plastic package die.
Background technology
The existing nearly 60 years developing history of Resin transfer molding moulding process (RTM, Resin Transfer Molding), Widely used in semicon industry.RTM refers to that low viscosity resin flows in Guan Bi mould, infiltrates reinforcing material and be solidified into A kind of technology of shape, belong to liquid shaping or the structured liquids forming technique category of composite.
In in general RTM mold, the air discharge duct (Air in connection die cavity (Cavity) region can be all designed with Venting), it is easy to extract die cavity in matched moulds and extrudes the air in die cavity, prevents unfilled problem in product being present.Type Chamber is to be formed by being embossed on mould on printed circuit board (PCB) (PCB, Printed Circuit Board).
During existing matched moulds, when mould stream is close to air discharge duct, clamping pressure directly reaches the final clamping pressure of setting, if Involvement air is excessive when plastic packaging material injects die cavity, and more air may be remained in die cavity, finally produces the circuit board of encapsulation Anger bubble, influence the quality of plastic packaging product.
The content of the invention
It is an object of the invention to provide a kind of plastic package die, balances mould stream, discharges more air in plastic packaging material, improves envelope Fill quality.
Technical scheme provided by the invention is as follows：
A kind of plastic package die, including：Upper mould and the lower mould for placing PCB；The following table of the upper mould is towards the upper mould Upper surface be recessed to form groove；When the upper mould and the lower molding are closed, die cavity is formed between the groove and the PCB； One end connection air discharge duct of the die cavity；The groove is provided with the buffering for being used for balancing mould stream close to one end of the air discharge duct Area.
It is further preferred that the height of the air discharge duct be plastic packaging material in filler particles maximum gauge 2/5 to 3/5 it Between.
It is further preferred that the edge of the buffering area and the air discharge duct, part connect, pressing portions PCB.
It is further preferred that the buffering area also includes：For stopping the stopper of mould stream, the stopper is from the groove Bottom extends to the PCB sides, and has gap between the PCB；For increasing the sub recessed of the mould stream flowing space Groove, the sub- groove are arranged at the stopper close to the side of the air discharge duct, and the sub- groove is to the bottom one of the groove Side is recessed, and the recess heights of the sub- groove are less than the recess heights of the groove.
It is further preferred that the side that the stopper is away from the sub- groove side is inclined-plane, the inclined-plane is to described Air discharge duct direction tilts.
Compared with prior art, the beneficial effects of the present invention are：
1st, buffering area is added in die cavity, the mould stream in die cavity is needed that type could be made close to air discharge duct by buffering area Air in chamber is squeezed intake and exhaust groove, and increased buffering area can reduce flowing speed of the mould stream in die cavity close to air discharge duct side Degree, make the extension that the opportunity of final clamping pressure application is appropriate, so as to add the time being extruded to the air in die cavity, drop Low interiors of products produces the probability of bubble.
2nd, the height of air discharge duct determines according to the maximum gauge of the actual filler particles of plastic packaging material, ensure that plastic packaging material is noted It is not plugged up when entering air discharge duct, if air discharge duct is blocked, the discharge of air in die cavity can be influenceed, reduce plastic packaging quality.
3rd, the edge of buffering area only some connected with air discharge duct, another part is directly pressed together on PCB, in die cavity Air by edge connect air discharge duct buffering area, into air discharge duct, the part contacted with PCB ensure that mould stream will not mistake More inflow air discharge ducts, so that air discharge duct blocks, influence to encapsulate quality.Meanwhile the design contacted with PCB ensure that die cavity Formed, applying clamping pressure to lower mould for upper mould provides the foundation.
4th, the design of stopper, to the plastic packaging material of liquid, i.e. mould stream, there is a stop, make the close exhaust that plastic packaging material is later Groove, increase the time that air is discharged in die cavity；Sub- groove gives the effect by one buffering of mould stream of stopper, it is necessary to more Mould flow away and fill sub- groove, so as to extend time of the mould stream close to air discharge duct, further increase air in die cavity and be squeezed The time gone out；The height of sub- groove is less than the height of die cavity, and main function is easy for cleaning, if the height of sub- groove is too deep, no Beneficial to maintenance of the later stage to mould, the clean-up performance of buffering area is not easy constantly to understand；Taken off in addition, contemplating plastic packaging material The situation of mould, highly too deep, bad so as to cause to be stripped, plastic packaging material, which remains sub- groove, influences exhaust effect, reduces product product Matter.
5th, stopper has the function that to balance mould stream, and the distance between stopper and PCB determine that the same time only has small part Mould stream could flow to sub- groove by stopper, and its inclined design plays guiding to the flow direction of mould stream, extend mould stream close to exhaust On the basis of groove, the probability that mould stream is blocked in stopper is reduced.
A kind of plastic package die of the present invention, using the stopper of buffering area, balanced action is played to the mould stream in die cavity, is increased The time that air is discharged in die cavity, improve product quality.In addition, the sub- groove in buffering area ensure that mould stream needs to possess More times go to fill, so as to which the air further extended in die cavity is extruded time, while the height and inclined-plane of sub- groove Design needs to consider the simplicity of follow-up part cleaning, it is ensured that the effect of exhaust, many-side ensure that to considering for buffering area The product quality of encapsulation.
Brief description of the drawings
Below by a manner of clearly understandable, preferred embodiment is described with reference to the drawings, to a kind of the above-mentioned of plastic package die Characteristic, technical characteristic, advantage and its implementation are further described.
Fig. 1 is the structural representation of plastic package die one embodiment of the present invention；
Fig. 2 is that the upper mould of another embodiment in plastic package die of the present invention is pressed together on connection air discharge duct one side when on PCB Front schematic view；
Fig. 3 is the left view of A-A in Fig. 2；
Fig. 4 is the left view of B-B in Fig. 2.
Drawing reference numeral explanation：
1. lower mould, 2.PCB, mould on 3., 4. buffering areas, 5. stoppers, 6. sub- grooves, 7. grooves, 8. air discharge ducts, 9. die cavities, 10. stopper is away from the side of sub- groove side.
Embodiment
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, control is illustrated below The embodiment of the present invention.It should be evident that drawings in the following description are only some embodiments of the present invention, for For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings Accompanying drawing, and obtain other embodiments.
To make simplified form, part related to the present invention is only schematically show in each figure, they are not represented Its practical structures as product.In addition, so that simplified form readily appreciates, there is identical structure or function in some figures Part, one of those is only symbolically depicted, or only marked one of those.Herein, "one" is not only represented " only this ", the situation of " more than one " can also be represented.
In one embodiment of the invention, referring to Fig. 1, Fig. 2, Fig. 3, a kind of plastic package die, including：Upper mould 3 and it is used for Place PCB 2 lower mould 1；The following table of the upper mould 3 is recessed to form groove towards the upper surface of the upper mould；The He of upper mould 3 When the lower mould 1 presses, die cavity 9 is formed between the groove 7 and the PCB 2；One end connection air discharge duct 8 of the die cavity 9； The groove 7 is provided with the buffering area 4 for being used for balancing mould stream close to one end of the air discharge duct 8.
Specifically, plastic package die designs for matched moulds, and matched moulds mainly comprises the following steps：1) board automatically pushes away PCB Into mould, automatic feeder knocks down plastic packaging material in injection molding tube；2) mould is put down by PCB by lower mould vacuum so as to which PCB be inhaled under It is fixed；3) mould moves down on, pushes down PCB, and upper mould applies certain clamping pressure to lower mould；4) being molded bar promotes plastic packaging material to lead to The injection hole for crossing die cavity is flowed into die cavity, while board extracts air in die cavity by V-pin passages；5) plastic packaging material can be in die cavity Middle flowing, mould stream is formed, flows to air discharge duct, it is necessary to close V-pin passages when close to V-pin passages and air discharge duct, and required Mould starts to apply final clamping pressure；And increased buffering area, the opportunity that can make finally to apply clamping pressure fit now Work as extension, add the time that air is extruded in die cavity, buffering area serves balance mould stream herein, extends the work of injection time With；6) after clamping pressure reaches final setting value, will complete to solidify in mould.
It should be noted that the Position Design of buffering area will not relate to actually active module region, module region It can be understood as PCB effective districts, i.e., the region containing part and circuit, in follow-up processing procedure, such as：It is cut by laser processing procedure In, buffer portion can be removed, and will not belong to a part for finished product, therefore buffering area is ensureing not influenceing PCB effective coverages On the basis of, the time of air extrusion when adding injection in die cavity, improve encapsulation quality.
Preferably, between the height of the air discharge duct 8 is 2/5 to 3/5 of filler particles maximum gauge in plastic packaging material.
Specifically, in general, the height of air discharge duct is designed according to the maximum gauge of filler particle in plastic packaging material , unit um.Such as：The maximum gauge of filler particle is 30um, and the height of air discharge duct then can be between 12um-18um Data, including 12um and 18um the two end points.Such height design both ensure that air discharge duct can be swimmingly vented, again Prevent plastic packaging material is spilt over from air discharge duct from influenceing operation in vacuum-pumping pipeline, product has higher modeling in plastic packaging so as to ensure Seal quality.
Preferably, connected referring to Fig. 3, Fig. 4, the edge of the buffering area 4 and the air discharge duct 8, part, pressing portions PCB 2。
Specifically, one end that upper mould 3 is provided with buffering area 4 is connected with air discharge duct 9, it is meant that, one in addition Divide and be pressed together on PCB 2.It is to be understood that upper mould 3, which is pressed together on PCB, forms a die cavity 9, and this die cavity 9 One end is provided with buffering area 4, and the part at the edge of buffering area 4, which hollows out, has connected air discharge duct 8, passes through the air in die cavity 9 Air discharge duct 8 is extruded, and reduces the generation of bubble.The formation that ensure that die cavity 9 of partially communicating structure, meanwhile, it also ensure that sky Gas can only add the time that air is extruded in die cavity 9 from the position extrusion of connection air discharge duct 8.
Preferably, also include referring to Fig. 3, Fig. 4, the buffering area 4：For stopping the stopper 5 of mould stream, the stopper 5 from The bottom of the groove 7 extends to the sides of PCB 2, and has gap between the PCB 2；For increasing the mould stream The sub- groove 6 of the flowing space, the sub- groove 6 are arranged at the stopper 5 close to the side of the air discharge duct 8, the sub- groove 6 It is recessed to the bottom side of the groove 7, and the recess heights of the sub- groove 6 are less than the recess heights of the groove 7.It is preferred that Ground, the side 10 that the stopper is away from the sub- groove side are inclined-plane, and the inclined-plane tilts to the direction of air discharge duct 8.
Specifically, the stopper 5 of buffering area 4 has a barrier effect to flowing into the mould stream in die cavity 9, make mould stream will not be at once Close to air discharge duct 8；Meanwhile it is inclined-plane that stopper, which is away from the side 10 of the sub- groove side, this design ensure that in die cavity 9 Mould stream while be blocked, there is a direction to be oriented to, mould stream is still flowed to the direction of air discharge duct 8, be unlikely in the position of stopper 5 Put and be blocked.Because the gap between stopper 5 and PCB is narrow, the same time can only allow a small amount of mould stream to flow through, therefore need Sub- groove 6 is designed between stopper 5 and air discharge duct 8, to one buffering of mould stream for flowing through stopper 5, it is unlikely in stopper 5 Place blocks, and the design of sub- groove 6 also makes mould stream needs more times go to fill sub- groove 6, it is hollow further to extend die cavity The time that gas is extruded, improve product quality.
In another embodiment of the present invention, referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4, a kind of plastic package die, including：Upper mould 3 With the lower mould 1 for placing PCB 2；The following table of the upper mould 3 is recessed to form groove towards the upper surface of the upper mould；On described When mould 3 and the lower mould 1 press, die cavity 9 is formed between the groove 7 and the PCB 2；One end connection row of the die cavity 9 Air drain 8；The groove 7 is provided with the buffering area 4 for being used for balancing mould stream close to one end of the air discharge duct 8；The height of air discharge duct 8 is In plastic packaging material between 2/5 to the 3/5 of filler particles maximum gauge；The edge of buffering area 4 and the air discharge duct 8, part connect, portion Partial pressure closes PCB 2；Buffering area 4 also includes：For stopping the stopper 5 of mould stream, the stopper 5 is from the bottom of the groove 7 to institute The extension of the sides of PCB 2 is stated, and there is gap between the PCB 2；For increasing the sub- groove 6 of the mould stream flowing space, The sub- groove 6 is arranged at the stopper 5 close to the side of the air discharge duct 8, and the sub- groove 6 is to the bottom of the groove 7 Side is recessed, and the recess heights of the sub- groove 6 are less than the recess heights of the groove 7.Preferably, the stopper is away from The side 10 of the sub- groove side is inclined-plane, and the inclined-plane tilts to the direction of air discharge duct 8.
Specifically, increasing buffering area between die cavity and air discharge duct, extension that can be suitably applies final clamping pressure Time, more efflux times are provided to the air in die cavity 9.Between between gap-ratio groove and PCB between stopper and PCB Gap is low, the mould in die cavity flow to air discharge duct close to when, it is impossible to make whole mould streams by stopper small part mould stream can only be made to pass through gear Portion is close to air discharge duct, and the sub- groove at this moment designed between stopper and air discharge duct provides a buffering to these mould streams, increases The receiving space for having added mould stream to flow, extends the time that air in die cavity is extruded.In addition, also have one to the height of sub- groove Individual restriction, it is mainly allowed to also allow for the clear of follow-up mould while providing the cushioning effect to mould stream, ensureing exhaust effect The good demoulding of clean maintenance and guarantee buffering area, if because the height of sub- groove is too deep, is unfavorable for cleaning buffering area, Can not well it be stripped, so as to influence whether the quality of plastic packaging product.
It should be noted that above-described embodiment can independent assortment as needed.Described above is only the preferred of the present invention Embodiment, it is noted that for those skilled in the art, do not departing from the premise of the principle of the invention Under, some improvements and modifications can also be made, these improvements and modifications also should be regarded as protection scope of the present invention.

Claims (4)

  1. A kind of 1. plastic package die, it is characterised in that including：
    Upper mould and the lower mould for placing PCB；
    The following table of the upper mould is recessed to form groove towards the upper surface of the upper mould；
    When the upper mould and the lower molding are closed, die cavity is formed between the groove and the PCB；
    One end connection air discharge duct of the die cavity；
    The groove is provided with the buffering area for being used for balancing mould stream close to one end of the air discharge duct；
    The edge of the buffering area and the air discharge duct, part connect, pressing portions PCB.
  2. 2. a kind of plastic package die as claimed in claim 1, it is characterised in that the height of the air discharge duct is to be filled in plastic packaging material Between 2/5 to the 3/5 of particle maximum gauge.
  3. 3. a kind of plastic package die as claimed in claim 1, it is characterised in that the buffering area also includes：
    For stopping the stopper of mould stream, the stopper extends from the bottom of the groove to the PCB sides, and with the PCB Between there is gap；
    For increasing the sub- groove of the mould stream flowing space, the sub- groove is arranged at the stopper close to the air discharge duct Side, the sub- groove is recessed to the bottom side of the groove, and the recess heights of the sub- groove are less than the groove Recess heights.
  4. A kind of 4. plastic package die as claimed in claim 3, it is characterised in that：
    The side that the stopper is away from the sub- groove side is inclined-plane, and the inclined-plane tilts to the air discharge duct direction.
CN201610204669.1A 2016-04-01 2016-04-01 A kind of plastic package die Active CN105729722B (en)

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Application Number Priority Date Filing Date Title
CN201610204669.1A CN105729722B (en) 2016-04-01 2016-04-01 A kind of plastic package die

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Application Number Priority Date Filing Date Title
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CN105729722B true CN105729722B (en) 2018-01-02

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107696422B (en) * 2017-11-06 2023-10-13 环维电子(上海)有限公司 Plastic packaging mold and plastic packaging method
CN110900961B (en) * 2018-09-18 2022-06-28 日月光半导体制造股份有限公司 Semiconductor packaging mold
CN110544637B (en) * 2019-08-28 2022-07-05 深圳赛意法微电子有限公司 Semiconductor device molding method and packaging mold used for same
CN110696275B (en) * 2019-10-31 2022-06-21 奇点新源国际技术开发(北京)有限公司 Plastic package method for cable node
CN111805814A (en) * 2020-06-19 2020-10-23 南通通富微电子有限公司 Method for determining structure of plastic package grinding tool and plastic package grinding tool

Citations (3)

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CN1946536A (en) * 2004-04-23 2007-04-11 赫斯基注射器成型系统有限公司 Method and apparatus for controlling a vent gap with active material elements
CN102104013A (en) * 2010-11-10 2011-06-22 华为终端有限公司 Data card and assembling method thereof
JP5926111B2 (en) * 2012-05-11 2016-05-25 藤倉ゴム工業株式会社 Development blade manufacturing die and development blade manufacturing method using the same

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JPS59165636A (en) * 1983-03-11 1984-09-18 Fujitsu Ltd Die for resin sealing

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN1946536A (en) * 2004-04-23 2007-04-11 赫斯基注射器成型系统有限公司 Method and apparatus for controlling a vent gap with active material elements
CN102104013A (en) * 2010-11-10 2011-06-22 华为终端有限公司 Data card and assembling method thereof
JP5926111B2 (en) * 2012-05-11 2016-05-25 藤倉ゴム工業株式会社 Development blade manufacturing die and development blade manufacturing method using the same

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