CN105728957A - Processing method and processing device for pocket hole of carrier band of miniature electronic component - Google Patents
Processing method and processing device for pocket hole of carrier band of miniature electronic component Download PDFInfo
- Publication number
- CN105728957A CN105728957A CN201610307078.7A CN201610307078A CN105728957A CN 105728957 A CN105728957 A CN 105728957A CN 201610307078 A CN201610307078 A CN 201610307078A CN 105728957 A CN105728957 A CN 105728957A
- Authority
- CN
- China
- Prior art keywords
- carrier band
- hole
- laser
- pocket hole
- miniature electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 238000004080 punching Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 7
- 238000003754 machining Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 description 8
- 238000003825 pressing Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The invention relates to a processing method for a pocket hole of a carrier band of a miniature electronic component. The mechanical punching type in the prior art is replaced by a laser processing method with accurate positioning and indexing. The invention also relates to a processing device for the pocket hole of the carrier band of the miniature electronic component. The processing device comprises a machine frame tabletop, an accurate positioning device, a laser punching device, an indexing driving device and a control system, wherein the accurate positioning device, the laser punching device, the indexing driving device and the control system are arranged on the machine frame tabletop; the positioning device is used for accurately positioning the carrier band, and then a micro hole of the carrier band is processed by laser. The processing method and the processing device have the advantage that the micro hole of the carrier band of any material can be processed, so that the problem of poor processing capability and accuracy on the micro hole of the carrier band by the traditional processing method and equipment is solved.
Description
Technical field
The present invention relates to the processing method in the pocket hole of a kind of miniature electronic components and parts carrier band and device, especially can carry out being accurately positioned laser hole-punching method and the device that micro-hole (diameter carrier band pocket hole less than 0.2mm) is processed.
Background technology
Carrier band is that chip electronic component manufacture and circuit board paster assemble indispensable critical material, can be divided into paper carrying belt and plastic material carrier band according to the difference of material, mainly include the key elements such as index hole, pocket, pocket hole.Wherein index hole is the sprocket wheel drive as braid equipment and chip mounter feeding mechanism and the use of location; pocket plays and electronic devices and components is carried and protective effect; pocket hole is currently used primarily in before cover strip sealing and after stripping, and the electronic devices and components in pocket are undertaken retraining fixing use by negative pressure by pocket hole.
After electronic devices and components packaging and testing complete, being put in the carrier band pocket of ordered arrangement by braid equipment, be wound into plastics reel after then sealing by cover strip, this stage carrier band plays the function of packaging, protection.When circuit board paster assembles, carrier band plays again the function that electronic devices and components carry out precise alignment and location, to realize electronic devices and components rapidly and efficiently attachment on circuit boards.
Development along with electronic devices and components encapsulation technology, electronic devices and components overall dimensions is more and more less, minimum encapsulation 0201 in the world at present, overall dimensions only has 0.2mmX0.1mm, corresponding carrier band pocket-sized only has 0.25mmX0.15mm, and in so little pocket, to reprocess a diameter hole less than 0.15mm, position accuracy demand with hole when opposing pockets is very high, hole can be caused to be flushed to pocket side walls for deviation pocket center or negative pressure cannot act on miniature electronic components and parts center and cause upset, and hole borderline quality requires very high, can not there is obvious burr phenomena, otherwise miniature electronic components and parts orientation in pocket can be produced impact, if burr comes off, electronic devices and components can be polluted, have influence on follow-up welding.Therefore its difficulty of processing is well imagined.
The processing method in the carrier band pocket hole being currently known is machinery punching, is made up of punch (circular red needle), die (circular port) etc..Difficulty of processing and the processing cost of the diameter red needle less than 0.2mm and die hole are high, and the life-span of mould is extremely low simultaneously, and red needle very easily produces fracture and abrasion.And adopt the carrier band pocket hole quality that the method processes unstable, it is easy to produce burr.And the laser boring mechanism of a kind of index hole disclosed in prior art such as CN204221203U, the size of index hole is more much bigger than described pocket hole dimension, is generally 1.5mm, and does not have accurate positioning device, therefore cannot be used as the processing in miniature pocket hole.
Summary of the invention
For overcoming the existing processing method deficiency to miniature electronic components and parts carrier band pocket hole machined ability, the invention provides one and be accurately positioned laser punched hole processing method, the method can realize being accurately positioned the high-quality processing of miniature pocket hole (diameter is less than 0.2mm).Provide simultaneously and a kind of be accurately positioned laser hole punched device based on the method.
The technical solution adopted for the present invention to solve the technical problems is:
The processing method in a kind of miniature electronic components and parts carrier band pocket hole, adopts laser instrument to replace machinery punching die of the prior art, utilizes high energy laser beam to replace red needle of the prior art, according to the unlike material of processed carrier band, can select different types of laser.First the horizontal and vertical position of carrier band being accurately positioned, then laser instrument sends high energy laser beam, and carrier band is punched out processing, and the dust of generation is got rid of via cleaning vacuum plant, then passes through index driving device by carrier band brought forward.
The processing unit (plant) in a kind of miniature electronic components and parts carrier band pocket hole, including rack table and the accurate positioning device being disposed thereon, laser hole punched device, index driving device and control system thereof.
Described accurate positioning device includes mounting seat, guide pillar, guide pin bushing, taper positioning needle, pressing plate, contour bolt, spring and driving device, driving device can be cylinder or motor-driven cam, linkage, in order to the driving force providing positioning needle and pressing plate to move up and down.
Described laser hole punched device includes laser instrument, laser instrument installing rack (with focus adjustment function) and vacuum dust collection device, the suction nozzle of vacuum dust collection device is arranged on below track, the position of positive corresponding laser instrument punching, in order to the dust and the fragment that produce when laser beam acts on carrier band are discharged in time.
Described index driving device includes index sprocket wheel and driving device.The index hole precise match processed on the tooth of sprocket wheel and carrier band, driving device can be that private takes motor, it is also possible to is the dispenser of driven by motor.This device, except driving carrier band to advance to realize Continuous maching and producing, also acts as and is accurately positioned, for next cycle, the effect carrying out preliminary pre-determined bit.
Described control system master controller adopts PLC.
First pass through accurate positioning device, the carrier band (i.e. index hole and the manufactured carrier band of pocket) having be carried out preliminary working in track is accurately positioned, taper positioning needle together with pressing plate under the driving of driving device, move downward, after carrier band position is accurately adjusted to target location, pressing plate compresses carrier band, and spring starts compression.Then the laser instrument of laser hole punched device receives pulse command, carries out pocket hole machined in corresponding pocket, and the dust produced in the course of processing is discharged by cleaning vacuum plant.One cycle is driven carrier band to advance by the sprocket wheel of index driving device after machining.Each cycle includes driving location laser punching and dedusting to drive, and hole number and the bore dia of the processing of each cycle are set by the control system of laser hole punched device and are regulated.
The invention has the beneficial effects as follows, it is possible to the small pocket hole to miniature electronic components and parts carrier band efficient, high-precision carries out high-quality processing.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the Method And Principle figure of the present invention.
Fig. 2 is the equipment mechanism figure of embodiment.
Fig. 3 is carrier band figure.
Fig. 4 is the mechanism map of accurate positioning device.
In figure: 1. rack table, 2. track, 3. carrier band, 31. carrier band index hole, 32. carrier band pocket, 33. carrier band pocket hole, 4. accurate positioning device, 41, positioner mounting seat, 42. guide pillar, 43. taper positioning needle, 44. guide pin bushing, 45. movable holding pad, 46. positioning needle fixes plate, 47. contour bolt, 48.T type hanging platform, 49. driving device (cylinder), 410. cylinder mount frame, 411. Rectangular Spring, 5. laser hole punched device, 51. vacuum dust collection device suction nozzle, 52. laser instrument, 53. laser instrument installing rack (band focus adjustment), 6. index driving device, 61. driving device (servomotor), 62. chain wheel index is taken turns.
Detailed description of the invention:
In fig. 2, first undertaken carrier band to be processed initializing installing, carrier band (3) is sequentially passed through from a left side after being accurately positioned dress (4), track (2), chain wheel index wheel (62) of the index hole (31) on carrier band (3) with index driving device (6) is coupled together.After initializing installation, open whole device, first taper positioning needle (43) and movable holding pad (45) are under the driving of cylinder (49), move down, by the conical head of taper positioning needle (43), the lateral attitude of carrier band (3) is accurately positioned, after the column part of pin to be positioned (43) injects carrier band index hole (31), location work completes, along with cylinder continues to move downward, movable holding pad (45) starts and carrier band (3) upper surface, Rectangular Spring (411) is compressed, and carrier band (3) is compacted.Now the work that is accurately positioned and compresses of carrier band (3) is completed by accurate positioning device (4), and carrier band is fixed in track (2).Then control system and the laser instrument (52) of laser hole punched device (5) is sent instruction, starting carrier band (3) is carried out laser punching operation, in the course of processing, laser beam acts on dust that the upper high temperature of carrier band (3) produces and punching fragment is discharged in time by the suction nozzle (51) of vacuum dust collection device (5).After punching completes, control system sends instruction, and the motor (61) of index driving device (6) drives index wheel (62) to rotate certain angle, stops after driving the specific length of carrier band (3) feeding forward.So, a process-cycle completes, and repeats above action, can realize continuous-stable processing.
Claims (5)
1. the processing method in miniature electronic components and parts carrier band pocket hole, it is characterized in that adopt laser processing mode, be aided with and be accurately positioned and index, it is achieved to carrier band small pocket hole efficient, accurately process.
2. the processing unit (plant) in miniature electronic components and parts carrier band pocket hole, including accurate positioning device, laser hole punched device and index driving device, is characterized in that: first carrier band is accurately positioned, then uses laser that carrier band is carried out micro hole machining.
3. the processing method in miniature electronic components and parts carrier band pocket hole according to claim 1, is characterized in that: can be selected for different laser species according to carrier band material and carries out laser punching processing, and the intensity of laser beam and track adjustable.
4. the processing unit (plant) in miniature electronic components and parts carrier band pocket hole according to claim 2, is characterized in that: adopt conical head positioning needle by carrier band index hole, carrier band to be accurately positioned, and by movable holding pad, carrier band is fixed.
5. the processing unit (plant) in miniature electronic components and parts carrier band pocket hole according to claim 2, is characterized in that: adopts servomotor or Cam splitter drive sprocket, carries out accurate index drive by carrier band index hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610307078.7A CN105728957A (en) | 2016-05-11 | 2016-05-11 | Processing method and processing device for pocket hole of carrier band of miniature electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610307078.7A CN105728957A (en) | 2016-05-11 | 2016-05-11 | Processing method and processing device for pocket hole of carrier band of miniature electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105728957A true CN105728957A (en) | 2016-07-06 |
Family
ID=56288922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610307078.7A Pending CN105728957A (en) | 2016-05-11 | 2016-05-11 | Processing method and processing device for pocket hole of carrier band of miniature electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105728957A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI796797B (en) * | 2020-09-29 | 2023-03-21 | 南韓商伊諾光電股份有限公司 | Carrier tape hole processing apparatus using laser drilling |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005306418A (en) * | 2004-04-20 | 2005-11-04 | Shin Etsu Polymer Co Ltd | Electronic component carrying body and manufacturing method for the same |
| CN204221203U (en) * | 2014-11-11 | 2015-03-25 | 玮锋电子材料（昆山）有限公司 | The perforating mechanism of carrier band index hole |
| CN205009324U (en) * | 2015-08-18 | 2016-02-03 | 浙江洁美电子科技股份有限公司 | Cut -out press of carrier band |
| CN205673768U (en) * | 2016-05-11 | 2016-11-09 | 张澎涛 | Miniature electronic components and parts carrier band is accurately positioned laser hole punched device |
-
2016
- 2016-05-11 CN CN201610307078.7A patent/CN105728957A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005306418A (en) * | 2004-04-20 | 2005-11-04 | Shin Etsu Polymer Co Ltd | Electronic component carrying body and manufacturing method for the same |
| CN204221203U (en) * | 2014-11-11 | 2015-03-25 | 玮锋电子材料（昆山）有限公司 | The perforating mechanism of carrier band index hole |
| CN205009324U (en) * | 2015-08-18 | 2016-02-03 | 浙江洁美电子科技股份有限公司 | Cut -out press of carrier band |
| CN205673768U (en) * | 2016-05-11 | 2016-11-09 | 张澎涛 | Miniature electronic components and parts carrier band is accurately positioned laser hole punched device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI796797B (en) * | 2020-09-29 | 2023-03-21 | 南韓商伊諾光電股份有限公司 | Carrier tape hole processing apparatus using laser drilling |
| TWI827464B (en) * | 2020-09-29 | 2023-12-21 | 南韓商伊諾光電股份有限公司 | Carrier tape hole processing apparatus using laser drilling |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160706 |