CN204221203U - The perforating mechanism of carrier band index hole - Google Patents
The perforating mechanism of carrier band index hole Download PDFInfo
- Publication number
- CN204221203U CN204221203U CN201420670011.6U CN201420670011U CN204221203U CN 204221203 U CN204221203 U CN 204221203U CN 201420670011 U CN201420670011 U CN 201420670011U CN 204221203 U CN204221203 U CN 204221203U
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- Prior art keywords
- carrier band
- index hole
- laser
- perforating mechanism
- laser beam
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Abstract
The utility model discloses a kind of perforating mechanism of carrier band index hole, it comprises the laser equipment of Emission Lasers bundle and receives the cutter lining of laser beam, described carrier band is arranged between laser equipment and cutter lining, owing to have employed laser boring, avoid physical mechanical to impact, thus improve product burr situation to a great extent, make the index hole be up to mellow and full smooth, additionally reduce simultaneously due to punch mechanism damage after the cost payout changed.
Description
Technical field
The utility model relates to a kind of industrial equipment, particularly relates to a kind of perforating mechanism of carrier band index hole.
Background technology
Carrier band is a kind of band-type product; mainly comprise belt body; and the pocket be arranged on belt body and index hole; during use, by resistance, electric capacity; transistor; the electronic devices and components carryings such as diode are accommodated in pocket, and then involution cover strip is to form the packaging of closed type, for the protection of electronic devices and components not contaminated and damage in transit.Electronic devices and components are when mounting, and cover strip is stripped, and the components and parts held in pocket, by the accurate location of index hole, take out by automatic mounting device successively, and are placed with and are arranged on surface-mounted integrated circuit (pcb board).
In prior art, the index hole of carrier band is impacted by mechanical punch mechanism and forms, but owing to needing large batch of physical shock every day, punch mechanism there will be damage, thus the carrier band index hole that can impact out is not round and smooth, there is burr situations, and punch mechanism damage after need again frequent replacing, from and cause cost waste.
Utility model content
The purpose of this utility model is for above-mentioned defect of the prior art, provides one can improve product burr situation, and the perforating mechanism of the carrier band index hole of minimizing production cost.
For realizing above-mentioned utility model object, the utility model have employed following technical scheme: the perforating mechanism of carrier band index hole, and it comprises the laser equipment of Emission Lasers bundle and receives the cutter lining of laser beam, and described carrier band is arranged between laser equipment and cutter lining.
In addition, the utility model also provides following attached technical scheme:
Described laser equipment comprises multiple laser beam emitting head, and described cutter lining comprises multiple laser pick-off hole relative with laser beam emitting head.
The perforating mechanism of described carrier band index hole also comprises a pair briquetting, and this flattens described carrier band to briquetting.
Compared to prior art, advantage of the present utility model is: the perforating mechanism disclosing a kind of carrier band index hole, this perforating mechanism comprises laser equipment and cutter lining, owing to have employed laser boring, avoid physical mechanical to impact, thus improve product burr situation to a great extent, make the index hole be up to mellow and full smooth, additionally reduce simultaneously due to punch mechanism damage after the cost payout changed.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the perforating mechanism of carrier band index hole.
Detailed description of the invention
Below in conjunction with preferred embodiment and accompanying drawing thereof, technical solutions of the utility model are further non-limitingly described in detail.
Shown in Fig. 1 is the perforating mechanism of carrier band index hole, and this perforating mechanism mainly utilizes laser beam to punch to carrier band 1, and the through hole got is the index hole (not shown) of carrier band.Particularly, perforating mechanism mainly comprises the laser equipment 3 of Emission Lasers bundle and receives the cutter Cen 5 of laser beam, carrier band 1 is arranged between laser equipment 3 and cutter Cen 5, because carrier band 1 is soft elasto material, as PC material, in order to avoid misalignment such as carrier band process are bending in drill process, this perforating mechanism also comprises a pair briquetting 6, this is separately positioned on the both sides of laser equipment 3 to briquetting 6, and it is for flattening carrier band 1, to ensure that carrier band 1 flatly accepts punching action.Laser equipment 3 comprises multiple laser beam emitting head 11, cutter lining 5 comprises multiple laser pick-off hole 15 relative with laser beam emitting head 11, laser beam is mainly emitted by the plurality of laser beam emitting head 11, because carrier band 1 is PC material, laser beam can be punched easily, after punching carrier band 1, the laser pick-off hole 15 of cutter lining 5 accepts laser beam, prevents laser beam from injuring staff.The quantity of laser beam emitting head 11 can change according to actual demand, and the quantity of laser beam emitting head 11 is 8 in the present embodiment, and the quantity in laser pick-off hole 15 is identical with the quantity of laser beam emitting head 11, is also 8.The radius that laser beam emitting head 11 emits laser beam also can be installed actual demand and change, and can change the size of light beam according to required index hole pore size.
Owing to have employed laser boring, avoid physical mechanical to impact, and hole on material with laser, the aperture quality got out is not only very good, particularly when beating hole same in a large number, can also ensure that the size shape in multiple hole is unified, and penetration rate is fast, production efficiency is high, thus improve product burr situation to a great extent, make the index hole be up to mellow and full smooth, and when needs change pore size, do not need again to change punch device, only need the size of adjusting laser beam; Additionally reduce because punch mechanism damages the rear cost payout changed simultaneously.
It is to be noted; above-mentioned preferred embodiment is only and technical conceive of the present utility model and feature is described; its object is to person skilled in the art can be understood content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.All equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed within protection domain of the present utility model.
Claims (3)
1. the perforating mechanism of carrier band index hole, it is characterized in that the cutter lining of it laser equipment comprising Emission Lasers bundle and reception laser beam, described carrier band is arranged between laser equipment and cutter lining.
2. the perforating mechanism of carrier band index hole according to claim 1, is characterized in that: described laser equipment comprises multiple laser beam emitting head, and described cutter lining comprises multiple laser pick-off hole relative with laser beam emitting head.
3. the perforating mechanism of carrier band index hole according to claim 1, it is characterized in that it also comprises a pair briquetting, this flattens described carrier band to briquetting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420670011.6U CN204221203U (en) | 2014-11-11 | 2014-11-11 | The perforating mechanism of carrier band index hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420670011.6U CN204221203U (en) | 2014-11-11 | 2014-11-11 | The perforating mechanism of carrier band index hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204221203U true CN204221203U (en) | 2015-03-25 |
Family
ID=52919345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420670011.6U Active CN204221203U (en) | 2014-11-11 | 2014-11-11 | The perforating mechanism of carrier band index hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204221203U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105728957A (en) * | 2016-05-11 | 2016-07-06 | 张澎涛 | Processing method and processing device for pocket hole of carrier band of miniature electronic component |
| CN106001943A (en) * | 2016-07-06 | 2016-10-12 | 成都格虹电子科技有限责任公司 | Hole punching tool for carrier tape |
-
2014
- 2014-11-11 CN CN201420670011.6U patent/CN204221203U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105728957A (en) * | 2016-05-11 | 2016-07-06 | 张澎涛 | Processing method and processing device for pocket hole of carrier band of miniature electronic component |
| CN106001943A (en) * | 2016-07-06 | 2016-10-12 | 成都格虹电子科技有限责任公司 | Hole punching tool for carrier tape |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |