CN105722332A - Manufacturing method of circuit - Google Patents
Manufacturing method of circuit Download PDFInfo
- Publication number
- CN105722332A CN105722332A CN201610131172.1A CN201610131172A CN105722332A CN 105722332 A CN105722332 A CN 105722332A CN 201610131172 A CN201610131172 A CN 201610131172A CN 105722332 A CN105722332 A CN 105722332A
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- Prior art keywords
- circuit
- carrier
- electromagnetic wave
- manufacture method
- electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
Abstract
The invention provides a manufacturing method of a circuit. The method comprises the steps as follows: (S1) a carrier for forming the circuit on the carrier is provided, wherein a substrate of the carrier is a high-molecular compound material added with an electromagnetic-wave absorbing material; (S2) selective electromagnetic irradiation is carried out on the carrier surface with an electromagnetic wave; the carrier surface is modified; and the electromagnetic-wave absorbing material strengthens absorption of the carrier in an illuminated region on the electromagnetic wave; and (S3) the carrier subjected to selective electromagnetic irradiation is electroplated or chemically plated; and the metal material is attached to the carrier surface in the illuminated region, so that the circuit is formed in the illuminated region. A metal compound or a metal medium does not need to be added to the carrier to assist the metal material in plating, so that the region, except for the circuit, of a circuit board cannot contain metal; the radio-frequency performance is excellent; the cost can be reduced; and the manufacturing technology is simple.
Description
Technical field
The invention belongs to electronic circuit field, particularly to the manufacture method of a kind of circuit, the circuit product of formation is especially suitable for being applied in radio frequency occasion.
Background technology
The method directly making circuit at present on common macromolecular compound material, it is common that laser direct organization (LDS).Concrete grammar is, use common macromolecular compound (such as plastics) injection-molded product containing certain metal solvent, then passing through laser makes the metal in region of needs come out, and based on the metal solvent of these exposures, carrying out plating or electric plating method obtain circuit.
Above method disadvantageously, due to need in the particle of common macromolecular compound add metal solvent, thus adding cost.In addition, owing to circuit block must contain for assisting plating or changing the metallic element of metallization, namely product logicalnot circuit part necessarily contains metal ingredient, in some radio frequency occasion, in such as antenna product, metal solvent is likely to radio-frequency performance is had a negative impact, if and above method does not increase the step making matrix contact with the ionic catalyst being made up of metallic, then directly when carrying out of irradiation area is plated, metal material is difficult to upper plating, thus manufacture antenna traces according to above method, then metal solvent is essential, the adverse effect of radiofrequency signal also can not be avoided by it.
In the application for a patent for invention CN103053227A of Patent Office of the People's Republic of China, disclose the manufacture method of a kind of molding circuit component, laser selective irradiation is carried out at synthetic resin matrix, then need to make matrix contact with the ionic catalyst being made up of metallic, after ionic catalyst is reduced to metal, then carrying out plating plates metal.The shortcoming of the method is in that, engineering plastics are not high to absorptivity, it is thus desirable to strengthen the energy of laser, therefore plastics easily burn, filling region hot spot due to laser facula must be overlapping, and owing to laser energy is big, the difference in height produced with normal areas in overlapping region and the characteristic difference of plastics are very big, being unfavorable for follow-up process, therefore roughness adds.And the method needs and emphasizes to increase the roughness of matrix surface, and the increase of roughness necessarily makes electronic circuit roughness increase, be very disadvantageous for microwave electronic circuits such as antennas, and change plating surface can be uneven, affect outward appearance, more can affect antenna performance.In 2012 " Xian Electronics Science and Technology University " published, in the 103rd page of " research that High-precision Microwave electronics electrical property is affected by surface roughness " write by Li Na, describe " increase along with surface roughness yardstick; the gain reduction of antenna ", be experimentally confirmed the roughness impact on antenna performance.
In the application for a patent for invention CN103442518A of Patent Office of the People's Republic of China, disclose the manufacture method of a kind of electronic circuit, adopt nonmetallic materials as carrier, carrier is irradiated, then carry out chemical reagent process, make surface by the nonpolar polarity that transfers to, after adopting activation, form metal crystal nuclei at irradiation area, on metal crystal nuclei, then deposit some metal levels again, to form electronic circuit.Also due to engineering plastic light absorbance is not high, and cause the problem as the method for CN103053227A.
Summary of the invention
The technical problem to be solved is to provide the manufacture method of a kind of circuit, it is not necessary to using metallic compound or metallic media to help plating on metal material, save manufacturing cost, processing technology is simple.
Furthermore it is possible to make the circuit product radio-frequency performance formed excellent.
For solving the problems referred to above, the present invention proposes the manufacture method of a kind of circuit, comprises the following steps successively:
S1: providing one in order to be formed on the carrier of circuit, wherein, the base material of described carrier is the macromolecular compound material being added with electromagnetic wave absorbent material；
S2: described carrier surface is carried out selective electromagnetic irradiation with electromagnetic wave, modified described carrier surface, described electromagnetic wave absorbent material strengthens the carrier of irradiation area to electromagnetic absorption；
S3: the carrier that plating or change plating are irradiated through selective electromagnetic, metal material is attached on the carrier surface of described irradiation area, thus forming circuit at irradiation area.
According to one embodiment of present invention, step S21 is also included: between described step S2 and S3, also include step S21: the carrier surface modification generation carbonization degraded of irradiation area or thawing between described step S2 and S3, described carrier surface acid medicine after irradiating or basic agent are processed, so that the carrier of irradiation area has polarity with Admicelle.
According to one embodiment of present invention, between described step S21 and step S3, step S211 is also included: activate described carrier surface.
According to one embodiment of present invention, the mode of described activation adopts palladium to activate.
According to one embodiment of present invention, without there being to assist the metal solvent of the carrier adsorption metal material of described irradiation area in the base material of described carrier.
According to one embodiment of present invention, the base material of described carrier is the material after thermoplastic and electromagnetic wave absorbent material Homogeneous phase mixing.
According to one embodiment of present invention, described thermoplastic is polyamide thermoplastic macromolecular material.
According to one embodiment of present invention, the base material of described carrier comprises following component by weight percentage:
A) polyamide 20～90%；B) radio-radar absorber 1～20%；C) auxiliary agent 0～70%.
According to one embodiment of present invention, described electromagnetic wave absorbent material is the electromagnetic wave absorbent material of carbon elements.
According to one embodiment of present invention, described electromagnetic wave absorbent material is the derivant material of carbon black material, carbon nano-tube material, graphite material or one of which.
According to one embodiment of present invention, described electromagnetic wave absorbent material acts the electromagnetic wave-length coverage strengthening Absorption between 200～20000nm.
According to one embodiment of present invention, described electromagnetic wave absorbent material acts the electromagnetic wave-length coverage strengthening Absorption between 200～1100nm.
According to one embodiment of present invention, use the electromagnetic wave that the uniform laser instrument of spot energy distribution sends that described carrier surface is carried out selective electromagnetic irradiation.
After adopting technique scheme, the present invention has the advantages that compared to existing technology and is added to by electromagnetic wave absorbent material in macromolecular compound material, carrier is made again with this material, use electromagnetic wave absorbent material that carrier is irradiated, irradiation area is the region needed for circuit, due to the effect of electromagnetic wave absorbent material in carrier, after carrier irradiates, irradiation area surface creates chemical change with not having the surface irradiated, the carrier mass generation carbonization of irradiation area and degraded, and grafting has chemical luminous energy group, thus this irradiation area part has polarity, certainly also have some physical changes, it is poor that such as hot spot overlapping region and Non-overlapping Domain produce little height, thus irradiation area can adsorbing metal material well, make Direct Electroplating or change plating on this irradiation area of carrier, adhesion metal material is to form circuit, if and be not added with electromagnetic wave absorbent material, owing to adding electromagnetic wave absorbent material, required electromagnetic wave such as laser energy substantially reduces, make the difference in height of hot spot overlapping region and Non-overlapping Domain and be not powered on the difference in height that electro-magnetic wave absorption material obtains through electromagnetic wave irradiation and be obviously reduced, final change plating, circuit surface after plating becomes smooth, antenna or wirebond (wire bond) routing is highly beneficial.Difference in height through overlay region, electromagnetic wave irradiation rear surface and non-overlapped district that measuring and calculating is not added with electromagnetic wave absorbent material is about 4-6um, and after interpolation, its difference in height of electromagnetic wave absorbent material can be reduced to 1-3um.The present invention is when making circuit, and without adding metal solvent composition in carrier, the product of formation possesses excellent radio-frequency performance, it is possible to reduce corresponding cost, improves the performance of the circuit used as antenna, and technique is also simple.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the manufacture method of the circuit of the embodiment of the present invention；
Fig. 2 a～2c is the cross section structure schematic diagram comprising circuit that each step of Fig. 1 method is formed.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Elaborate a lot of detail in the following description so that fully understanding the present invention.But the present invention can implement being much different from alternate manner described here, and those skilled in the art can do similar popularization when without prejudice to intension of the present invention, therefore the present invention is by the following public restriction being embodied as.
The manufacture method of the circuit of the present invention, by the composite material of common macromolecular compound material and electromagnetic wave absorbent material as circuit carrier, when adopting electromagnetic irradiation, carrier surface respective regions electro-magnetic wave absorption ability strengthens, and chemical modification occurs, it is easy to adsorbing metal material, plating can be made directly on region after electromagnetic irradiation or change plating, form circuit, without other metallic media, can also without other metallic elements in carrier.When the circuit parts manufactured is used under antenna rf occasion, radio-frequency performance is excellent, and has saved metal material, and cost is also reduced accordingly, and processing step is also simple.
Referring to Fig. 1, in the present embodiment, the manufacture method of circuit may comprise steps of:
S1: providing one in order to be formed on the carrier of circuit, wherein, the base material of described carrier is the macromolecular compound material being added with electromagnetic wave absorbent material；
S2: described carrier surface is carried out selective electromagnetic irradiation with electromagnetic wave, modified described carrier surface, described electromagnetic wave absorbent material strengthens the carrier of irradiation area to electromagnetic absorption；
S3: the carrier that plating or change plating are irradiated through selective electromagnetic, metal material is attached on the carrier surface of described irradiation area, thus forming circuit at irradiation area.
Concrete, below in conjunction with Fig. 1 and 2 a～2c, the embodiment of the present invention is described in detail.
Referring to Fig. 1 and Fig. 2 a, in step sl, first electromagnetic wave absorbent material and macromolecular compound material are mixed, the material formed after mixing, i.e. plastic pellet, it is used for making carrier 1, the mode made can be such as injection mo(u)lding, extrusion molding or blow molding etc., forming a plate-like articles, or can also be other shape, the shape of carrier 1 be not intended as restriction.
In order to play the advantage of product made by manufacture method of the present invention better, the radio-frequency performance of product is performed to the best, in other words, cost is preferably minimized, then the base material of carrier 1 does not preferably contain any metallic element (being certainly not precluded from the situation of metal impurities).But the embodiment being not intended to get rid of in carrier possibly together with some metallic elements, when in reality, when needing metal ingredient to realize corresponding effect as other functional additives, carrier 1 can also contain some corresponding metal ingredients, but still can make circuit in the method in accordance with the invention, thus whether carrier 1 contains metallic element and is not intended as restrictive condition, an object of the present invention is in that, ensure that carrier 1 can be entirely free of the metallic element of the carrier adsorption metal material for assisting described irradiation area in manufacturing process, equally can after electromagnetic irradiation well on plating, radio-frequency performance is excellent.And if carrier is not added with electromagnetic wave absorbent material, owing to optical absorption is poor, do not have the surface difference after treatment with irradiation surface and treatment with irradiation little, increase modified difficulty, plating or part plating leakage can be caused when changing plating.
For assisting the metallic element of the carrier adsorption metal material of described irradiation area can refer to for helping plating or changing the metallic media of plating line conductor, because changing plating or electroplating metal solvent that is required and that must contain in carrier of the prior art, in general, it is possible to be the various metal materials such as copper, the complex of copper, aluminum, nickel, gold.
In one embodiment, electromagnetic wave absorbent material can be the electromagnetic wave absorbent material of carbon elements.It is similarly radio-frequency performance the best and saves cost consideration, without metal ingredient in electromagnetic wave absorbent material.It is also preferred that the left electromagnetic wave absorbent material is specially the derivant material of carbon black material, carbon nano-tube material, graphite material or one of which, the better effects if of electromagnetic wave absorption.Contrast with adding the carbon black materials material as color masterbatch, Chinese patent application file CN103053227A such as, carried, the general adding proportion of color masterbatch material is 0.1～1%, the electromagnetic wave absorbent material proportion that the present invention adds is 1～20% (more than 1%), uses as electromagnetic wave absorbent material.
Electromagnetic wave absorbent material can select corresponding material according to electromagnetic wavelength scope, the extinction effect of electromagnetic wave absorbent material be the increase with electromagnetic wavelength and better, it it is namely the effect of linear increase between extinction effect and wavelength, but, actual electromagnetic waves are not easy to or are unfavorable for for radiation irradiation, thus, in one embodiment, electromagnetic wave absorbent material acts the electromagnetic wave-length coverage strengthening Absorption can between 100～20000, can be preferably between 200～1100nm, more preferably 500～1100nm, optimum can be 800～1100nm, so that obtaining wave source and corresponding electromagnetic wave absorbent material.Visible, the manufacture method of the present invention, it is not limited to a certain electromagnetic illumination radiation, but all electromagnetic waves in scope can be utilized all to can be used to irradiate, as long as electromagnetic wave absorbent material is and this is for the electromagnetic wave phase coupling irradiated, this brings very big facility to manufacturing process, and in prior art, for the irradiation of circuit, as a rule it is also limited to the electromagnetic wave of some wavelength, is otherwise likely to be unable to reach and irradiates the effect that rear surface is modified.
Referring to Fig. 1 and Fig. 2 b, in step s 2, adopt the mode that electromagenetic wave radiation irradiates that the surface of the carrier of step S1 is carried out selective electromagnetic irradiation, it is possible to be the single face at carrier, can also being all carry out selective electromagnetic irradiation on different surfaces, irradiation area 11 be all for forming circuit；The molecular structure of irradiation area 11 is destroyed, or generation physical arrangement is broken and changed, surface modification；Electromagnetic wavelength rises in the electromagnetic wave-length coverage strengthening Absorption at electromagnetic wave absorbent material, electromagnetic wave absorbent material enhances the carrier of irradiation area 11 to electromagnetic absorption, so that the carrier surface of irradiation area 11 can directly upper plate, prepare for plating or chemical plating.
Referring to Fig. 1 and Fig. 2 c, in step s3, carry out electroplating or change plating step, the mode of plating or change plating can adopt existing arbitrary plating or change plating mode, the carrier that plating or change plating are irradiated through selective electromagnetic, that is, directly carrier 1 surface passing through electromagnetic irradiation in step S2 is electroplated or changed plating, due to except other regions outside irradiation area 11 and without irradiation, surface physics or chemical property do not change or change little, thus on irradiation area 11, only easily form metal material 12, exactly because also the material of electromagnetic wave absorbent material and macromolecular compound material mixing is to electromagnetic efficient absorption, after making plating or changing plating, metal material 12 can be attached directly on carrier 1 surface of irradiation area 11, thus forming circuit at irradiation area 11, upper plating need not be helped by metal solvent, carrier 1 can also exist any metallic element.
The base material of carrier 1 can be the material after thermoplastic and electromagnetic wave absorbent material Homogeneous phase mixing, and thermoplastic is such as common plastics or rubber etc..
So that the circuit made is more stable, preferably, between step S2 and S3, also include step S21 between described step S2 and S3, also include step S21: the carrier surface modification generation carbonization degraded of irradiation area, described carrier surface acid medicine after irradiating or basic agent are processed, the carrier surface grafting modifiied is made to have chemical functional group, thus the carrier of irradiation area has polarity with adsorbing metal material.More preferably, step S211 can also be included between step S21 and step S3: activate described carrier surface.The mode of activation activates for example with palladium.
The plastics in the region after electromagnetic radiation is irradiated such as can occur chemical bond to be destroyed, plastics are carbonized, melt, again carrier surface acid reagent or alkaline reagent are processed, it it is such as dilute sulfuric acid, destroyed irradiation area will be ionic condition, can Admicelle, make follow-up metal activation agent can only deposit metallic or micelle in the region that electromagnetic radiation is irradiated, then this non-metal base plate of metal activation, such as palladium activation, area deposition metal ion or micelle at radiation irradiation, then again metallic is reduced to metal, and by micelle solution group, to expose the metal in this region, the mode then passing through plating or change plating forms metallic circuit.
In a preferred embodiment, thermoplastic is polyamide thermoplastic macromolecular material, the cooperation of polyamide thermoplastic macromolecular material and electromagnetic wave absorbent material, the reliability of product can be strengthened, make its heatproof moisture-proof, product compared to existing technology is higher to the stability of water, product can by significantly high hot and humid standard, it is possible to add more than 85% humidity 96h by 85 DEG C of temperature.
It is also preferred that the left the base material of carrier 1 comprises following component by weight percentage: a) polyamide 20～90%；B) radio-radar absorber 1～20%；C) auxiliary agent 0～70%.Auxiliary agent can be other additive.
Further, the manufacture method of circuit also includes step S4 (not shown): the carrier surface after forming circuit covers optically isolated protecting film.Due in carrier 1 possibly together with electromagnetic wave absorbent material, thus optically isolated protecting film can be set and protect, it is prevented that see that during light, the carrier of circuit parts is destroyed.
In a preferred embodiment, use the electromagnetic wave that the uniform laser instrument of spot energy distribution sends that carrier surface is carried out selective electromagnetic irradiation.Owing to the spot energy distribution center high surrounding of laser is low, therefore cause scanned rear surface roughening unavoidably, radio frequency can be had a negative impact by this rough surface, especially high frequency (more than 5GHz) or hyperfrequency (more than 20GHz), selects the uniform laser instrument of spot energy distribution can reduce this harmful effect.Wherein selecting more superior optical system is improve a kind of method of spot energy distribution uniformity.
Although the present invention is with preferred embodiment openly as above; but it is not for limiting claim; any those skilled in the art are without departing from the spirit and scope of the present invention; can making possible variation and amendment, therefore protection scope of the present invention should be as the criterion with the scope that the claims in the present invention define.
Claims (13)
1. the manufacture method of a circuit, it is characterised in that comprise the following steps successively:
S1: providing one in order to be formed on the carrier of circuit, wherein, the base material of described carrier is the macromolecular compound material being added with electromagnetic wave absorbent material；
S2: described carrier surface is carried out selective electromagnetic irradiation with electromagnetic wave, modified described carrier surface, described electromagnetic wave absorbent material strengthens the carrier of irradiation area to electromagnetic absorption；
S3: the carrier that plating or change plating are irradiated through selective electromagnetic, metal material is attached on the carrier surface of described irradiation area, thus forming circuit at irradiation area.
2. the manufacture method of circuit as claimed in claim 1, it is characterized in that, step S21 is also included: the carrier surface modification generation carbonization degraded of irradiation area or fusing between described step S2 and S3, described carrier surface acid medicine after irradiating or basic agent are processed, thus the carrier of irradiation area has polarity with Admicelle.
3. the manufacture method of circuit as claimed in claim 2, it is characterised in that also include step S211 between described step S21 and step S3: activate described carrier surface.
4. the manufacture method of circuit as claimed in claim 3, it is characterised in that the mode of described activation adopts palladium to activate.
5. the manufacture method of circuit as claimed in claim 1, it is characterised in that without there being to assist the metal solvent of the carrier adsorption metal material of described irradiation area in the base material of described carrier.
6. the manufacture method of circuit as claimed in claim 5, it is characterised in that the base material of described carrier is thermoplastic and the mixed material of electromagnetic wave absorbent material.
7. the manufacture method of circuit as claimed in claim 6, it is characterised in that described thermoplastic is polyamide thermoplastic macromolecular material.
8. the manufacture method of circuit as claimed in claims 6 or 7, it is characterised in that the base material of described carrier comprises following component by weight percentage:
A) polyamide 20～90%；B) radio-radar absorber 1～20%；C) auxiliary agent 0～70%.
9. the manufacture method of circuit as described in any one in claim 1-5, it is characterised in that described electromagnetic wave absorbent material is the electromagnetic wave absorbent material of carbon elements.
10. the manufacture method of circuit as claimed in claim 9, it is characterised in that described electromagnetic wave absorbent material is the derivant material of carbon black material, carbon nano-tube material, graphite material or one of which.
11. the manufacture method of circuit as claimed in claim 5, it is characterised in that described electromagnetic wave absorbent material acts the electromagnetic wave-length coverage strengthening Absorption between 200～20000nm.
12. the manufacture method of circuit as claimed in claim 11, it is characterised in that described electromagnetic wave absorbent material acts the electromagnetic wave-length coverage strengthening Absorption between 200～1100nm.
13. the manufacture method of circuit as claimed in claim 1, it is characterised in that use the electromagnetic wave that the uniform laser instrument of spot energy distribution sends that described carrier surface is carried out selective electromagnetic irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610131172.1A CN105722332B (en) | 2016-03-08 | 2016-03-08 | Manufacturing method of circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610131172.1A CN105722332B (en) | 2016-03-08 | 2016-03-08 | Manufacturing method of circuit |
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| Publication Number | Publication Date |
|---|---|
| CN105722332A true CN105722332A (en) | 2016-06-29 |
| CN105722332B CN105722332B (en) | 2017-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610131172.1A Active CN105722332B (en) | 2016-03-08 | 2016-03-08 | Manufacturing method of circuit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112917016A (en) * | 2021-05-12 | 2021-06-08 | 常州仁千电气科技股份有限公司 | Laser etching device and method for 5G antenna oscillator |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269984A (en) * | 2005-03-25 | 2006-10-05 | Furukawa Electric Co Ltd:The | Method for baking metallic particle for mutually fusing metallic particle by high-frequency electromagnetic-wave irradiation and electronic part and material for baking metallic particle manufactured by using its method |
| CN101859613A (en) * | 2009-04-09 | 2010-10-13 | 湖南美纳科技有限公司 | Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method |
| CN102480841A (en) * | 2011-09-05 | 2012-05-30 | 深圳光启高等理工研究院 | Method for preparing dielectric substrate |
| CN103053227A (en) * | 2010-11-04 | 2013-04-17 | 三共化成株式会社 | Method of producing formed circuit component |
| CN103442518A (en) * | 2013-08-02 | 2013-12-11 | 上海安费诺永亿通讯电子有限公司 | Manufacturing method of electronic circuit |
| CN105283513A (en) * | 2013-06-03 | 2016-01-27 | 昭和电工株式会社 | Conductive resin composition for microwave heating |
-
2016
- 2016-03-08 CN CN201610131172.1A patent/CN105722332B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269984A (en) * | 2005-03-25 | 2006-10-05 | Furukawa Electric Co Ltd:The | Method for baking metallic particle for mutually fusing metallic particle by high-frequency electromagnetic-wave irradiation and electronic part and material for baking metallic particle manufactured by using its method |
| CN101859613A (en) * | 2009-04-09 | 2010-10-13 | 湖南美纳科技有限公司 | Three-dimensional circuit manufacturing process and composite components of laser plastic material and manufacturing method |
| CN103053227A (en) * | 2010-11-04 | 2013-04-17 | 三共化成株式会社 | Method of producing formed circuit component |
| CN102480841A (en) * | 2011-09-05 | 2012-05-30 | 深圳光启高等理工研究院 | Method for preparing dielectric substrate |
| CN105283513A (en) * | 2013-06-03 | 2016-01-27 | 昭和电工株式会社 | Conductive resin composition for microwave heating |
| CN103442518A (en) * | 2013-08-02 | 2013-12-11 | 上海安费诺永亿通讯电子有限公司 | Manufacturing method of electronic circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112917016A (en) * | 2021-05-12 | 2021-06-08 | 常州仁千电气科技股份有限公司 | Laser etching device and method for 5G antenna oscillator |
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| CN105722332B (en) | 2017-03-22 |
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