CN105720014B - The design method of vehicle control device dedicated semiconductor and the semiconductor thus manufactured - Google Patents
The design method of vehicle control device dedicated semiconductor and the semiconductor thus manufactured Download PDFInfo
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- CN105720014B CN105720014B CN201510888136.5A CN201510888136A CN105720014B CN 105720014 B CN105720014 B CN 105720014B CN 201510888136 A CN201510888136 A CN 201510888136A CN 105720014 B CN105720014 B CN 105720014B
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The present invention relates to the design method of the vehicle control device dedicated semiconductor based on bare die and thus the vehicle control device dedicated semiconductor manufactured, departing from existing semiconductor technology, and the EIP (ECU in Package) as new concept vehicle control device dedicated semiconductor is designed and is manufactured that by merging new semiconductor process technique and control system technology, so as to which high-performance/high-quality semiconductor is realized in a manner of microminiature/microlight-type within the shorter exploitation time limit.
Description
Technical field
The present invention relates to the design method of the vehicle control device dedicated semiconductor based on bare die and thus the vehicle control manufactured
Device dedicated semiconductor processed, more specifically, core function to only aggregated chips and being integrated as the new of a system in the early stage
The semiconductor making method of concept is introduced.Further, as departing from existing semiconductor technology and having merged system
The novel semi-conductor technology of technology, the effect to the integrated semiconductor development based on bare die and die semiconductor thing from now on
Industry prospect is recorded.
Background technique
In general, automobile controller (Electronic Control Unit, ECU) is with whole by the chip of multiple completions
Close to the mode on a plate and developed, recently as convenience, diversity level to automobile function demand increasingly
Increase, causes internal controller to become complicated huge, and also result in negative effect to vehicle size and fuel efficiency aspect.
In order to cope with this phenomenon, semiconductor maker is dedicated to that multi-functional chip will be permitted being integrated into minimum as much as possible
Size, to realize semiconductor development as early as possible.Especially, towards will be including all peripheral devices including core (Core)
Function be integrated into an integrated circuit, thus exploitation be system-on-a-chip direction develop.
This, which to be born soon as by the element of the major functions such as power supply, sensor, driving, operation, develops at one
The systems-on-a-chip (System On the Chip, SOC) of the mode of a single semiconductor chip, and if as can not use
Single-chip realizes application specific functionality, then the special process manufacture semiconductor added such as communication, memory, core is multiple to integrate
System in package (System in Package, SIP) technology of the mode of semiconductor is also attracted attention by people.
However, in order to realize that multi-functional or realization meets the performance of system based on SOC or SIP chip, it is necessary to take into account
Semiconductor including development efficiency continues the level of cause.Especially, in order to meet only based on expensive software (SW)
Controller (ECU) technology of the semiconductor designing technique sustainable development of IP, have development cost rise, development time long life and
Lack the limitation of semiconductor technology etc..
Below will to based on the relevant picture of controller (ECU) development technique of existing semiconductor (SIP or SOC) into
Row explanation.
Fig. 1 is the figure for showing the huge controller of existing complexity, and Fig. 2 is to show for illustrating existing semiconductor development
The figure of the flow chart of technique and each processing step, Fig. 3 are the figure for showing existing SOC and SIP development scheme, and Fig. 4 is to show
The figure of the core chips of existing controller is constituted, Fig. 5 is the figure for showing the power supply chip for constituting existing controller, and Fig. 6 is
The figure for constituting the communication chip of existing controller is shown, Fig. 7 is the figure for showing existing SPAS controller and external equipment.
The core component for playing the part of the brain role of controller (ECU) is core semiconductor (with reference to Fig. 4), master in addition to this
Semiconductor is wanted to have memory, communication and power supply, sensor, actuator semiconductor (with reference to Fig. 3 to Fig. 6) etc..
Common semiconductor development method is based on software (SW) semiconductor IP as shown in Fig. 2, according to semiconductor technology sequence
And after carrying out circuit design, system-on-a-chip is assembled by wafer manufacturing process.
Wherein, semiconductor intellectual property (Intellectual Property, IP) is to realize in semiconductor device
And predefined functional block, it can make it possible the recycling of semiconductor design, so as to real within the faster time
Existing complicated circuit, and easily designed final products, are furthermore also easy to be assembled.But the disadvantage is that price is very expensive, and
Technically also rely on sophisticated semiconductor enterprise.
For the existing semiconductor technology of Fig. 2, the difference of existing SOC and SIP are, systems-on-a-chip
(System On Chip, SOC) is multiple functions to be realized on individually design circuit, and use the mode for being assembled into single-chip.
On the contrary, SIP uses mode that the is each semiconductor element that have passed through each semiconductor technology is integrated and being packaged on single-chip.
Thus, SOC development scheme is based on single-chip and by optimization specification and optimization design, reduces so as to have
The effect of area, and the effect simplified due to the technique by single technique can be brought.However, SIP development scheme is by again
Using existing semiconductors manufacture bare die, so that the process of circuit design and verifying is not necessarily in existing semiconductor technology, from
And development time can be shortened (with reference to Fig. 3).
Referring to figs. 1 to Fig. 7, the huge controller (ECU) of existing complexity is the set of multiple semiconductors (SIP or SOC)
Body, with the development of the function and performance of existing vehicle internal controller (ECU), the increase of the semiconductor number due to constituting it
With the connection structure of chip chamber complexity, lead to its difficult design, and can also inevitably lead to the increase of size and weight.This
A little problems become around the huge controller (ECU) of complexity, equipment space utilization rate lowly and the weight of vehicle is increased
Reason, and also will cause the negative effect of fuel efficiency reduction.
In addition, the difference of SOC and SIP as described above, if SOC is made with the circuit design by multiple functional blocks
When making the development scheme exploitation controller of single semiconductor, then can exist in terms of the development efficiency such as expense and time and ask as follows
Topic.
The problem of firstly, there are development cost increases.Since SOC designs semiconductor based on expensive IP, there is initial stage
Development cost bear big problem.Also, if controller (ECU) is constituted, it would be possible that having the identical function between chip
The case where overlapping.On the whole from controller (ECU), it is only necessary to which a function, core or communication for each SOC etc. are necessary
The function of including only will cause hardware waste, therefore lead to the increase of cost and development cost.Especially, and according to user
Requirement it is different come ASIC design, meeting specific use, SOC is that will have the system integration of multiple functions to a chip
On technology, thus from research and development many expenses can be generated to commercialization.
Secondly there are cause the development time to postpone.When usually developing a semiconductor chip, need to carry out a variety of
Test process (for example, precision test etc. before exposure mask simulation (mask simulation), wafer test production).However it is existing
Some controllers (ECU) have multiple chips, so leading to development time long life because of corresponding retest.It is same with this
When, if needing additionally to carry out function and performance improvement on developed controller (ECU), to return based on semiconductor IP
Initial designs step.For example, the core that only replacement is constituted in the component of SOC is also required to design based on new core again
Entire chip, and also to pass through semiconductor fabrication process and the test process according to different phase, thus necessarily cause to develop
The delay of time.
Third, it is difficult to recycle.For completing the fixation of design, assembling and verifying based on multiple IP semiconductors
For chip, each different semiconductor component for constituting chip can not be recycled.Especially, SOC be by it is multiple not
The element of congenerous is complicated must interlock made of single-chip (single chip), therefore can not be by only replacing processor or logical
The partial functions such as letter obtain identical chip.Thus, even if considering the long life of exploitation, if necessary to new to adding
Element and developed, the existing component that do not replace can not still be recycled.
4th, there is a problem of software (SW) compatible hardly possible.If developing controller based on existing SOC chip, due to
When chip manufacturer respectively provides different software (SW) platform with developing environment, therefore integrating multiple chips by controller-level
It need to consider the compatibility of software (SW).Therefore, having need to be designed and need in a manner of meeting each chip chamber interface regulation
The Integrated Development Environment (configuration equipment (configuration tool) etc.) of exploitation thus, and need in controller level authentication
The trouble of the consistency of chip chamber.
Summary of the invention
The technical problem to be solved in the present invention
The present invention is proposed to solve the problems, such as above-mentioned SOC development scheme, and the present invention is provided based on bare die
Vehicle control device dedicated semiconductor design method and the vehicle control device dedicated semiconductor thus manufactured.
Though the semiconductor integrated development method proposed by the present invention based on bare die using it is stated that SIP development scheme as base
Plinth, but in order to overcome by fever, Problem of Electromagnetic Waves (causing since the inside complexity between each semiconductor chip increases) etc.
The shortcomings that bring reliability low SIP, so the hardware for designing unification and optimization is very important.
Therefore, it is an object of the present invention to without applying flexibly recycling existing semiconductor in the case where designing circuit
The SIP development scheme of bare die, and make it while having the advantages that the semiconductor miniaturization of SOC development scheme and easy, thus
New concept vehicle control device dedicated semiconductor is realized in a manner of short-term/microminiature/microlight-type, by designing and manufacturing EIP
High-performance/the high-quality of (ECU In Package) integrates semiconductor.
Technical solution
In order to achieve the above object, the present invention is provided on the first level below based on the vehicle control device of bare die dedicated half
The design method of conductor：(a) to the step of there are the multiple bare chips for the common function being used in vehicle control device to classify；
And (b) in such a way that the multiple bare chips with common function for enabling above-mentioned classification are operated in a single-chip
After carrying out design, the step of being integrated into a single-chip.
Wherein it is preferred to be carried out after above-mentioned steps (a) to multiple bare chips with common function of above-mentioned classification
Digitization (DB) is come the step of storing and manage.
Preferably, in above-mentioned steps (b), said one single-chip can be collected using wire bonding and forming technique
At.
Preferably, in above-mentioned steps (b), said one single-chip may include that following technique is integrated：With predetermined big
First technique of small cutting crystal wafer；The electricity with multiple functions is integrated on the surface of the wafer block cut in above-mentioned first technique
Road manufactures the second technique of multiple single-chips；It will be manufactured in the second technique using design, wire bonding and forming technique
Bare chip in common function multiple bare chips manufacture at a single-chip third technique.
Preferably, in above-mentioned steps (a), above-mentioned multiple bare chips with common function can be by power supply chip, communication
Chip, core chips and memory chip are formed.
Preferably, it may additionally include after above-mentioned steps (b) and integrated on an above-mentioned integrated single-chip and verify software
The step of platform and application.
Preferably, the software integrated on an above-mentioned single-chip can be formed by standard base platform and application software.
Second level of the invention provides the design method of the vehicle control device dedicated semiconductor below based on bare die, special
Sign is, integrates the circuit with multiple functions on the surface of the wafer block cut with a certain size to manufacture multiple bare chips
Afterwards, design is carried out to multiple bare chips in the above-mentioned bare chip produced with common function and carrys out one list of Integrated manufacture
Chip.
Wherein it is preferred to may also include before above-mentioned design to above-mentioned multiple bare chips with common function
The process for carrying out digitization (DB) to store and manage.
Preferably, said one single-chip can be integrated by wire bonding and forming technique.
Preferably, above-mentioned multiple bare chips with common function by power supply chip, communication chip, core chips and can be deposited
Memory chip is formed.
Preferably, it may additionally include integrated software platform and application on an above-mentioned integrated single-chip and verified
Process.
Preferably, the software integrated on said one single-chip can be formed by standard base platform and application software.
Third level of the invention provides the vehicle control device dedicated semiconductor based on bare die, wherein with a certain size
The circuit with multiple functions is integrated on the surface of the wafer block of cutting to manufacture multiple bare chips, to the above-mentioned naked core produced
Multiple bare chips in piece with common function carry out design and carry out one single-chip of Integrated manufacture.
Wherein, said one single-chip can be integrated manufacture using wire bonding and forming technique.
Preferably, above-mentioned multiple bare chips with common function by power supply chip, communication chip, core chips and can be deposited
Memory chip is formed.
Preferably, it can be integrated on the said one single-chip of integrated production and verify software platform and application.
Preferably, the software integrated on said one single-chip can be formed by standard base platform and application software.
Beneficial effect
As described above, the vehicle control device dedicated semiconductor design method according to the present invention based on bare die, can be very
Vehicle control device dedicated semiconductor is realized in a manner of low price/high-performance/high-quality microminiature/microlight-type within the time limit of short
(EIP:ECU In Package).Detailed impression related to this is as follows.
According to the present invention, by the recycling of hardware and based on the Integrated design of bare die (Die), compared to existing valuableness
, IP-based design method can reduce development cost.That is, because relative to existing up to tens~several hundred hundred million
IP, bare die (Die) are the technological cores that this IP technology is included, and pass through the bare die in existing semiconductor fabrication process
(Die) price of technique is supplied, therefore can reduce comparable exploitation number.
According to the present invention, the EIP based on bare die has the advantages that realize recycling extensively.By communication, power supply, memory
Etc. core functions the integrated EIP of bare die (Die) be most of controller demand product, therefore it is general when be applicable to institute
There is controller, and if the use of the specific controller of SMK, TMPS etc. can be converted in conjunction with particular sensor, actuator etc.
On the way.
In addition, while cost can also being made to reduce, making to recycle hard for completing controller system-system level
Part is possibly realized.EIP based on bare die (Die) Integrated design be consider veneer on each bare die between connectivity and optimize and set
Meter, can be realized with minimal size, so if replacing the chip on existing controller with this EIP, it can be by reducing PCB etc.
Come prevent between chip It is not necessary to, the waste of duplicate hardware.
In addition, the controller of EIP has been applicable in, from the results of view, due to reducing whole controller size, so can live
Equipment with controller is surroundedRemaining space so that recycle equipment be possibly realized.
According to the present invention, EIP exploitation has the benefit for making controller light and shortization and improving quality.EIP is based on core
The integrated system of heart bare die (Die), wherein only each structure bare die and connect required for component, so as to simplify design and
Reduce number of components, weight and size.Therefore, it is possible to which the ECM for improving between each component is prevented and controller quality, and also additional tool
There is the advantages of reducing controller size and reducing external equipment, so whole vehicle fuel efficiency can be improved (with reference to figure
17)。
According to the present invention, EIP is the system-on-a-chip for being applicable in standard platform, and software compatibility may be implemented.Thus, nothing
It need to consider the platform and interface different from each other etc. of existing chip chamber, and realize behaviour by being then based on common standard platform
Make, therefore the purposes for being used in different controllers can also fast implement necessary application software (SW) and specific function, and
Have the advantages that be made up of the environmental structure of easy operation the standard interface between EIP.
According to the present invention, EIP is existing based on being added in bare die (Die) integrated new concept semiconductor process technique
The new system of platform possessed by part manufacturer and assessment technique can be regarded as leading Car Electronic Control field from now on
Semiconductor integration technology (Semiconductor Fusion Technology) core.
Detailed description of the invention
Fig. 1 is the figure for showing the huge controller of existing complexity.
Fig. 2 is the figure for showing flow chart and each processing step for illustrating existing semiconductor development technique.
Fig. 3 is the figure for showing existing SOC and SIP development scheme.
Fig. 4 is the figure for showing the core chips for constituting existing controller.
Fig. 5 is the figure for showing the power supply chip for constituting existing controller.
Fig. 6 is the figure for showing the communication chip for constituting existing controller.
Fig. 7 is the figure for showing existing SPAS controller and external equipment.
Fig. 8 is for illustrating the whole of the design method of the vehicle control device dedicated semiconductor according to the present invention based on bare die
Body flow chart.
Fig. 9 is the stream for illustrating the manufacturing method of the vehicle control device dedicated semiconductor according to the present invention based on bare die
Cheng Tu.
Figure 10 is the vehicle control device dedicated semiconductor shown according to an embodiment of the invention based on bare die
The figure of the product of wafer process and bare die technique is completed in manufacturing method.
Figure 11 is the vehicle control device dedicated semiconductor shown according to an embodiment of the invention based on bare die
In manufacturing method complete bare die technique after manufactured core bare die (core die) figure.
Figure 12 is the vehicle control device dedicated semiconductor shown according to an embodiment of the invention based on bare die
In manufacturing method complete bare die technique after manufactured power supply bare die figure.
Figure 13 and Figure 14 is to show in the vehicle control device according to an embodiment of the invention based on bare die dedicated half
The manufactured figure for communicating bare die after completion bare die technique in the manufacturing method of conductor.
Figure 15 is to show the inside and outside of EIP module according to an embodiment of the invention and be applicable in this EIP
SPAS controller model figure.
Figure 16 is the figure for showing EIP module according to an embodiment of the invention suitable for the actual sample of controller.
Figure 17 is to show actual verification to be applicable in the EIP module according to an embodiment of the invention based on bare die
The size and weight of SPAS controller reduce the figure of effect.
Specific embodiment
In the present invention so-called envelope EIP (Ecu In Package) mean controller institute it is functional be integrated into one,
Mean that semiconductor novel technique described above and systems technology realize fusion.Therefore, it can be as its core technology
Semiconductor integration technology and new concept semiconductor process technique based on bare die (Die), and be fused to the semiconductor of completion
Systems technology.
Hereinafter, with reference to appended attached drawing, the preferred embodiments of the present invention are described in detail.However, embodiment below is
In order to which those skilled in the art can fully understand the present invention and provide, therefore various other shapes are can be changed into it
Formula, and the scope of the present invention is not limited to the embodiment of following description.
Firstly, with reference to Fig. 8 and Fig. 9, to the multiple naked cores with main common function used in vehicle control device (ECU)
Piece (preferably power supply chip, communication chip, core chips and memory chip etc.) is classified (S100).
That is, if it is main to having the function of of using in vehicle control device (ECU) jointly (for example, power supply, communication, core,
Memory etc.) bare chipClassify, and carry out digitization (DB), then exist
When carrying out the EIP design based on bare die (Die), it can be recombinated by each functional unit and according to the EIP property to be realized.
In addition, as the usable EIP of common function, passing through software for the EIP integrated for the bare die being used in conjunction in by each EIP
Compatibility and can be applicable in and be reused in other controllers.On the other hand, can separately manage can not be by each common function
Come the element (that is, part member that size can not be reduced by physical methods such as heat releases) integrated.And, it is preferable that above-mentioned step
Multiple bare chips classify, with common function are realized in rapid S100, such as can realize digitization by manager terminal
(DB), it and in other servers or storage medium etc. is stored and is managed.
It take lower component as the chip of the main common function between being present in controller, it later can be based on corresponding to each chip
Corresponding bare die (Die) designs controller dedicated semiconductor EiP.
Firstly, power supply chip is according to vehicle-state come the voltage progress stabilized component more to mobility, and
The component (Component) of other assemblies is provided to reduce its voltage.
Secondly, communication chip be communicated in vehicle with other controllers and required component (for example, CAN, LIN,
K-Line, FlexRay, MOST, Ethernet etc.).
Third, core chips (core chip) are the component (8 that can be realized program relevant to controller (ECU) operation
Position/32 8-digit microcontrollers (micro controller)).
4th, memory chip is the group that technology relevant to operation or necessary item can be stored in controller (ECU)
Part.
Then, so that multiple bare chips classify in above-mentioned steps S100, with common function can be in a single
After realizing that the mode of operation carries out design process in piece, wire bonding (wire bonding) and forming technique are utilized
(molding technology) is integrated into a single-chip S200.
In addition, may additionally include after above-mentioned steps S200 and integrated on an above-mentioned integrated single-chip and verify software
The step of platform (software platform) and application (Application).
Also, as shown in figure 9, said one single-chip may include following technique and be made in above-mentioned steps S200
It makes：With the first technique S201 of predefined size cutting crystal wafer (Wafer)；The wafer block cut in above-mentioned first technique S201
The circuit with multiple functions is integrated on surface to manufacture the second technique S202 of multiple single-chips；Utilize design, lead
Bonding and forming technique will be multiple naked with common function in the bare chip (die chip) manufactured in the second technique S202
Chip manufacturing at a single-chip third technique S203.
Above-mentioned first technique S201 is wafer (Wafer) technique, and wafer (Wafer) is the material for making integrated circuit
Material, purified silicon (Si) is simultaneously cut with the thickness of several hundred μm (1 μm=1/1000mm), and is made on the surface of the cutting
Integrated circuit.In general, a wafer can produce multiple integrated circuits, when being based on IC manufacturing chip, in order to increase by one
The chip-count obtained on Zhang Jingyuan needs to reduce chip size (size) or increases the size (size) of wafer.
Above-mentioned second technique S202 is bare die (Die) technique, and bare die (Die) is the small by four of the semiconductor substance of cutting crystal wafer
Side shape block, has and is made on bare die with circuit, thus can be regarded as semiconductive core.The opposite software based on valuableness
(SW) IP and the systems-on-a-chip (System on Chip, SOC) that is designed and manufactures, bare die (Die) they are to reflect multiple IP
SOC intermediate product, EIP is based on this core bare die (Die) and developed.
Figure 10 is the vehicle control device dedicated semiconductor shown according to an embodiment of the invention based on bare die
The figure of the product of wafer process and bare die technique is completed in manufacturing method, Figure 11 is to show according to one embodiment of present invention
The vehicle control device dedicated semiconductor based on bare die manufacturing method in complete bare die technique after manufactured core bare die (example
Such as, 32 bare chip/TC275T of Infineon (Infineon 32bit bare die/TC275T)) figure, Figure 12 be show
Bare die work is completed in the manufacturing method of vehicle control device dedicated semiconductor according to an embodiment of the invention based on bare die
The figure of manufactured power supply bare die (for example, Infineon/TLE7368 (Infineon/TLE7368)) after skill, Figure 13 and Figure 14 are to show
It is completed in the manufacturing method of the vehicle control device dedicated semiconductor according to an embodiment of the invention based on bare die out naked
Manufactured communication bare die (microchip/MCP2562 (Microchip/MCP2562), microchip/MCP2003 after blade technolgy
(Microchip/MCP2003)) figure.
Above-mentioned third technique S203 is EIP technique, although multiple functional blocks are integrated into the general of a system-on-a-chip
It is identical as existing SOC in thought, but (it is being not based on IP's by intelligence software (SW) functional module and to wafer processing
Design) afterwards, the bare die through reliability demonstration (Die) aspect that is designed and is integrated in a manner of hardware it is different.
This technique is not the method such as the prior art, that is, is not to be designed as with the software (SW) based on semiconductor IP
It originates and is finally assembled into the assemble method of chip, but so that come from bare die (Die) energy of the wafer (Wafer) of processing
Enough modes operated on a single chip, hardwareThe controller of new way that ground is designed and integrates
Dedicated semiconductor process design technology.
If above-mentioned semiconductor process technique is will be by the bare die of multiple and different functions such as communication, power supply, memory
(Die) it is integrated into the designing technique by means of hardware an of chip, then systems technology is suitable for the software of semiconductor and last right
It carries out the technology for integrating evaluation.The software for being integrated into semiconductor has standard base platform (Standard basic
Platform) and application software (SW), evaluate and refer to hardware (HW) integration verifying and final system function detection.
Thus, if integration software (SW) platform and application on hardware (HW) chip of completion, and would complete final test
Step is demonstrate,proved, then is used as amalgamation technology product, although being apparently a simple chip on surface, it can replace existing
Complicated huge controller.With reference to relevant drawings, Figure 15 is the inside for showing EIP module according to an embodiment of the invention
With the figure of SPAS controller model that is external and being applicable in this EIP, Figure 16 be show it is according to an embodiment of the invention
EIP module is suitable for the figure of the actual sample of controller.
The present invention is detached from from the existing development thinking that multiple chips are integrated into controller (ECU), propose so that
The function of multiple chips realizes the semiconductor design methods that the mode of operation is integrated in a single-chip.
This integrated semiconductor is that the function of constituting controller is integrated into a chip and is designed and manufactures
Single-chip form, although shape seems semiconductor chip, but inside function can be performed and the identical function such as SPAS, TPMS
Can, therefore controller (ECU) can be replaced later.Thus, it is special referred to as the controller to controllers such as such as SPAS or TPMS
With semiconductor, it is defined as EIP (ECU In Package) in the present invention.
On the other hand, constitute controller (ECU) existing chip before carrying out semiconductor fabrication process, will first into
Row IP-based software (SW) design.When thus function is altered or modified as the chip for executing other purposes, need
Existing chip is abandoned, and is restarted from initial design to carry out semiconductor technology and verifying operation.
Certainly, it is also required to carry out reliability demonstration for being integrated in each bare die (Die) of EIP of the present invention, but it is existing with pressing
There is the cost of technology of each chip investment in controller to compare with the verifying time limit carried out by different step, by a reliability
The bare die (Die) of verifying can be directly applied for EIP, go out ETCD estimated time of commencing discharging so as to which controller is greatly decreased.In addition, as described above
, recycling to EIP of the invention, if connecting sensor, the actuator of specific function on the usable EIP of common function
(actuator) etc. it, then can be quickly converted as the purposes of the specific controllers such as SMK, TPMS, thus can make by different car types
The time to volume of controller exploitation shifts to an earlier date.
In addition, existing controller (ECU) is constituted using assembling fixed semiconductor chip as unit, thus even if each
It is also impossible to further reduce there are common elements between chip.At the same time, with caused by by controller function increase
Inner core the piece number increases, and there are problems that design becomes increasingly complex and size and weight will increase.
However, EIP of the invention is the core bare die (Die) based on semiconductor, and the system for being integrated to a chip, because
And component needed for need to only using connection bare die (Die), so that design is simplified, and the component count used, weight can be reduced
And size.From the results of view, it is designed by simplifying, being able to ascend EMC between component prevents and controller quality, and has as follows
Additional effect：Reduced by the lightweight of controller and size, vehicle fuel efficiency and controller equiment can be improved
Space usable floor area.
In addition, for existing chip, as including by driver provided by different Semiconductor enterprises
(Driver) platform including is different with software (SW) exploitation environment, malfunctions when can lead to integrated software (SW).However, of the invention
EIP be bare die (Die) needed for incorporating controller according to different function, and be applicable in the single-chip system of standard platform
System, there is no need to consider the mutually different platform of existing chip chamber and interface etc..In addition, due to being based on common standard platform
And realize operation, so as to fast implement application software (SW) and specific function, and have it is by standard interface, between EIP
Higher software (SW) compatibility.
In addition, if the integral design method based on bare die (Die) realizes standardization, and semiconductor fabrication process and evaluation
Technology steps into the track of batch production, it is contemplated that the competition between Semiconductor enterprises in order to sell bare die (Die) will accelerate.Cause
And cheap bare die (Die) will surrogate response valuableness IP price chip, hence into market, and will form with master
Level-one manufacture supplier (Tier1) for carrying out EIP cause and the supply system centered on component enterprise.
That is, selected bare die (Die) supply enterprise being applicable according to different EIP of the company for holding EIP technology, and by with finger
The active transaction of enterprise is determined to ensure that semiconductor integrates purchase right.To can also be brought newly to existing semiconductor buying pattern
Thoughtcast, it is therefore expected that the new semiconductor development strategy between automobile component enterprise and Semiconductor enterprises can be become.
As described above, the appearance of EIP is so that high-performance/high-quality semiconductor (enhances listing within the shorter exploitation time limit
Time (time-to-market)) realize microminiature/microlight-type, therefore while can be improved development efficiency, additionally it is possible to it copes with
Fast-changing semiconductor technology.Further, if hardware (HW) design method can be made to standardize, and with SPAS or TPMS etc.
Controller dedicated semiconductor realizes commercialization, then for activating semiconductor cause from now on to also bring along great influence.
From the results of view, EIP of the invention be merged based on bare die (Die) integrated novel semi-conductor technology,
The new technology mode of platform and assessment technique can lead vehicle semiconductor development field from now on.
The technical solution for wanting to propose in the present invention mentions for the exploitation of vehicle control device dedicated semiconductor
Out to the scheme of new concept EIP (ECU In Package) technology based on bare die (Die)；Secondly, by with EIP development company
Centered on, the scheme of specified and bare die (Die) the integration purchase of bare die (Die) supply enterprise, can prevent and pass through mould
The conflict of other enterprises of imitative EIP technology purchase bare die (Die).
The vehicle control device dedicated semiconductor design method about invention based on bare die is explained above and thus manufactures
Vehicle control device dedicated semiconductor preferred embodiment, but the present invention is not limited to this, can be in Patent right requirement model
It encloses and implements various deformation within the scope of detailed description of the invention and appended attached drawing, and this deformation also belongs to the present invention.
Claims (16)
1. a kind of design method of the vehicle control device dedicated semiconductor based on bare die comprising：
(a) to the step of there are multiple bare chips of the common function for ECU to classify, wherein each the multiple naked
The integrated circuit of chip is able to carry out one in the common function for ECU, so that ECU dedicated semiconductor is based on bare die；
(b) digitization is carried out to multiple bare chips and stored into different server, and manage multiple bare chips in database；
(c) so that the classification, multiple bare chips with common function the side of operation can be realized in a single-chip
After formula carries out design, the step of being integrated into a single-chip.
2. the design method of the vehicle control device dedicated semiconductor according to claim 1 based on bare die, which is characterized in that
In the step (c), one single-chip is integrated using wire bonding and forming technique.
3. the design method of the vehicle control device dedicated semiconductor according to claim 1 based on bare die, which is characterized in that
In the step (c), one single-chip includes that following technique is integrated：
First technique, with predefined size cutting crystal wafer；
Second technique integrates the circuit with multiple functions on the surface of the wafer block cut in first technique to manufacture
Multiple bare chips；
Third technique will have using design, wire bonding and forming technique in bare chip that second technique manufactures
Multiple bare chips of common function are manufactured into a single-chip.
4. the design method of the vehicle control device dedicated semiconductor according to claim 1 based on bare die, which is characterized in that
In the step (a), multiple bare chips with common function are by power supply chip, communication chip, core chips
It is formed with memory chip.
5. the design method of the vehicle control device dedicated semiconductor according to claim 1 based on bare die, which is characterized in that
Further include after the step (c)：It is integrated on an integrated single-chip and verifies software platform and application
Step.
6. the design method of the vehicle control device dedicated semiconductor according to claim 5 based on bare die, which is characterized in that
The software integrated on a single-chip is made of standard base platform and application software.
7. a kind of design method of the vehicle control device dedicated semiconductor based on bare die, which is characterized in that this method is specific as follows：
The circuit with multiple functions is integrated on the surface of the wafer block cut with a certain size come after manufacturing multiple bare chips,
To in the bare chip of the manufacture there are multiple bare chips of the common function for ECU to classify, and to described point
Class, multiple bare chips with common function carry out design and carry out one single-chip of Integrated manufacture,
Wherein, the circuit of multiple bare chips is able to carry out one in the common function for ECU, so as to ECU dedicated semiconductor
Based on bare die,
Also, before design, digitization is carried out to multiple bare chips, and be stored into different server, and to described more
A bare chip is managed.
8. the design method of the vehicle control device dedicated semiconductor according to claim 7 based on bare die, which is characterized in that
One single-chip is integrated by wire bonding and forming technique.
9. the design method of the vehicle control device dedicated semiconductor according to claim 7 based on bare die, which is characterized in that
Multiple bare chips with common function are made of power supply chip, communication chip, core chips and memory chip.
10. the design method of the vehicle control device dedicated semiconductor according to claim 7 based on bare die, feature exist
In further including：
The process of software platform and application is integrated and verified on the said one single-chip of integrated production.
11. the design method of the vehicle control device dedicated semiconductor according to claim 10 based on bare die, feature exist
In,
The software integrated on one single-chip is made of standard base platform and application software.
12. a kind of vehicle control device dedicated semiconductor based on bare die, wherein the vehicle control device dedicated semiconductor be by with
The manufacture of lower section method：
Integrating on the surface of the wafer block cut with a certain size, there is the circuit of multiple functions to manufacture multiple bare chips, right
There are multiple bare chips of common function for ECU to classify in the bare chip produced, and to the classification,
Multiple bare chips with common function carry out design and carry out one single-chip of Integrated manufacture,
Wherein, the circuit of multiple bare chips is able to carry out one in the common function for ECU, so as to ECU dedicated semiconductor
Based on bare die,
Also, multiple bare chips with common function are stored in the database in different server.
13. the vehicle control device dedicated semiconductor according to claim 12 based on bare die, which is characterized in that
One single-chip is Integrated manufacture using wire bonding and forming technique.
14. the vehicle control device dedicated semiconductor according to claim 12 based on bare die, which is characterized in that
Multiple bare chips with common function are made of power supply chip, communication chip, core chips and memory chip.
15. the vehicle control device dedicated semiconductor according to claim 12 based on bare die, which is characterized in that
It is integrated on one single-chip of integrated production and verifies software platform and application.
16. the vehicle control device dedicated semiconductor according to claim 15 based on bare die, which is characterized in that
The software integrated on one single-chip is made of standard base platform and application software.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0186392 | 2014-12-22 | ||
| KR1020140186392A KR101665794B1 (en) | 2014-12-22 | 2014-12-22 | Method for designing vehicle controller-only semiconductor based on die and vehicle controller-only semiconductor by the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105720014A CN105720014A (en) | 2016-06-29 |
| CN105720014B true CN105720014B (en) | 2018-11-30 |
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|---|---|---|---|
| CN201510888136.5A Active CN105720014B (en) | 2014-12-22 | 2015-12-07 | The design method of vehicle control device dedicated semiconductor and the semiconductor thus manufactured |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US10748887B2 (en) |
| KR (1) | KR101665794B1 (en) |
| CN (1) | CN105720014B (en) |
| DE (1) | DE102015121601A1 (en) |
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| US10903199B2 (en) | 2021-01-26 |
| CN105720014A (en) | 2016-06-29 |
| DE102015121601A1 (en) | 2016-06-23 |
| US20160180013A1 (en) | 2016-06-23 |
| KR101665794B1 (en) | 2016-10-13 |
| US10748887B2 (en) | 2020-08-18 |
| US20170103974A1 (en) | 2017-04-13 |
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