CN105710980B - Laser in-situ Aided Machine delineates the device and method of hard brittle material - Google Patents
Laser in-situ Aided Machine delineates the device and method of hard brittle material Download PDFInfo
- Publication number
- CN105710980B CN105710980B CN201610046614.2A CN201610046614A CN105710980B CN 105710980 B CN105710980 B CN 105710980B CN 201610046614 A CN201610046614 A CN 201610046614A CN 105710980 B CN105710980 B CN 105710980B
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- CN
- China
- Prior art keywords
- diamond particles
- tool rest
- brittle material
- transparent diamond
- hard brittle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
Abstract
The invention provides the device that laser in-situ Aided Machine delineates hard brittle material, including the transparent diamond particles with cone cutter head for hard brittle material delineate operation, the handle of a knife and tool rest of through hole are offered along axis, it is passed through the embedded optical-fiber laser in through hole, the tool rest top surface is fixedly connected on handle of a knife bottom, the tool rest bottom side offers the holding tank corresponding with transparent diamond particles, the transparent diamond particles top surface is fixedly connected on holding tank inner top surface and transparent diamond particles top surface formation horizontal location face, the smooth pricker laser passes through handle of a knife, tool rest is radiated on the horizontal location face of transparent diamond particles and forms focus point in the bottom of transparent diamond particles cone cutter head.The processing method that the present invention also provides the device.The present invention carries out energy effect in situ using laser to being scored hard brittle material region, reaches the purpose of softening hard brittle material, and then improve the quality of hard brittle material delineation processing.
Description
Technical field
The present invention relates to the mechanical scribing techniques field of hard brittle material, the delineation of laser in-situ Aided Machine is specifically related to hard
The device and method of crisp material.
Background technology
Usually cause delineation due to the hard crisp characteristic of machined material currently for the mechanical scribing method of hard brittle material
Crudy is bad, and the hard crisp characteristic of machined material can cause damage to the diamond cutter used in mechanical scratching, enter
And influence the stabilization of delineation crudy.In order to solve this problem, in the prior art there is provided laser assisted mechanical scratching
Method, i.e., apply heat, and then the hard crisp characteristic of softener material, so as to improve the matter of machining in cutter front end or rear end
Amount.But such a method is difficult to make Laser energy transmission to cutter and the contact surface of material, and laser energy is understood and outer sometimes
Cutting coolant, lubricating fluid and chip for enclosing etc. produce interference, so as to be difficult to play useful effect.
The content of the invention
It is an object of the invention to provide a kind of laser in-situ Aided Machine delineate hard brittle material device and method, to gram
Take above-mentioned deficiency.
In order to solve the above technical problems, the present invention provides following technical scheme：The hard crisp material of laser in-situ Aided Machine delineation
The device of material, including for carrying out delineating the transparent diamond particles with cone cutter head of operation to hard brittle material, along axis
The handle of a knife and tool rest of through hole, the embedded optical-fiber laser being passed through in through hole are offered, the tool rest top surface is fixedly connected on handle of a knife
Bottom, the tool rest bottom side offers the holding tank corresponding with transparent diamond particles, the transparent diamond particles
Top surface is fixedly connected on holding tank inner top surface and transparent diamond particles top surface formation horizontal location face, and the optical-fiber laser is passed through
Handle of a knife, tool rest are radiated on the horizontal location face of transparent diamond particles and in the bottom shape of transparent diamond particles cone cutter head
Into focus point.
Preferential on the basis of such scheme, the transparent diamond particles side is brazed on the side wall of tool rest holding tank.
The method that laser in-situ Aided Machine delineates hard brittle material, including：
(1) holding tank corresponding with transparent diamond particles is opened up on tool rest, by the transparent gold with cone cutter head
Hard rock particle is fixed on the holding tank of tool rest, and the top surface of transparent diamond particles forms transparent diamond particles and contacted with holding tank
Horizontal location face；
(2) tool rest is fixed on handle of a knife bottom, and through hole is axially opened up on handle of a knife and tool rest, it is then logical to through hole
Enter embedded optical-fiber laser；
(3) optical-fiber laser passes through the horizontal location face of handle of a knife, tool rest just to transparent diamond particles, and passes through transparent Buddha's warrior attendant
Stone particle is radiated at the cone cutter head bottom of transparent diamond particles, forms Laser Focusing point, real by the optical effect of cone
Existing laser carries out energy effect in situ to being scored hard brittle material region, reaches the purpose of softening hard brittle material.
The present invention has an advantageous effect in that compared with prior art：The present invention passes through knife using embedded optical-fiber laser
The horizontal location face of handle, tool rest just to transparent diamond particles, and it is radiated at transparent diamond by transparent diamond particles
The cone cutter head bottom of grain, forms Laser Focusing point, realizes laser to being scored hard brittle material area by the optical effect of cone
Domain carries out energy effect in situ, reaches the purpose of softening hard brittle material, and then improve the quality of hard brittle material delineation processing.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention.
In figure marked as：The transparent diamond particles of 1-, 2- cone cutter heads, 3- handle of a knifes, 4- tool rests, 5- holding tanks, 6- levels
Locating surface, 7- optical-fiber lasers, 8- focus points, 9- hard brittle materials.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In the description of the invention, it is to be understood that term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " is based on accompanying drawing institutes
The orientation or position relationship shown, is for only for ease of the description present invention, rather than indicate or imply that the device or element of meaning must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Reference picture 1 understands that laser in-situ Aided Machine delineates the device of hard brittle material, including for entering to hard brittle material 9
Row delineates the transparent diamond particles 1 with cone cutter head 2 of operation, the handle of a knife 3 and tool rest 4 of through hole is offered along axis, is led to
Enter the embedded optical-fiber laser 7 in through hole, the top surface of tool rest 4 is fixedly connected on the bottom of handle of a knife 3, the bottom side of tool rest 4
The holding tank 5 corresponding with transparent diamond particles 1 is offered, the transparent top surface of diamond particles 1 is fixedly connected on receiving
The inner top surface of the groove 5 and top surface of transparent diamond particles 1 forms the horizontal location face 6 that transparent diamond particles 1 are contacted with tool rest 4, thoroughly
The bright side of diamond particles 1 is brazed on the side wall of the holding tank 5 of tool rest 4；The optical-fiber laser 7 irradiates through handle of a knife 3, tool rest 4
On the horizontal location face 6 of transparent diamond particles 1 and in the bottom shape focus point 8 of the transparent cone cutter head 2 of diamond particles 1.
Its method is：
(1) holding tank 5 corresponding with transparent diamond particles 1 is opened up on tool rest 4, by with the saturating of cone cutter head 2
Bright diamond particles 1 are fixed in the holding tank 5 of tool rest 4, and the top surface of transparent diamond particles 1 forms transparent diamond particles 1
The horizontal location face 6 contacted with holding tank 5；
(2) tool rest 4 is fixed on the bottom of handle of a knife 3, and axially opens up through hole on handle of a knife 3 and tool rest 4, then to logical
Hole is passed through embedded optical-fiber laser 7；Wherein, the parameter such as the clear aperature of optical-fiber laser 7, power and wavelength is according to transparent diamond
Particle 1 and it is scored the concrete technology condition of hard brittle material 9 to determine；
(3) optical-fiber laser 7 passes through the horizontal location face 6 of handle of a knife 3, tool rest 4 just to transparent diamond particles 1, and by saturating
Bright diamond particles 1 are radiated at the bottom of cone cutter head 2 of transparent diamond particles 1, Laser Focusing point 8 are formed, by cone
Optical effect realizes that laser carries out energy effect in situ to being scored hard brittle material region, reaches the purpose of softening hard brittle material 9,
And then improve the quality of hard brittle material delineation processing.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
Any modifications, equivalent substitutions and improvements made within refreshing and principle etc., should be included in the scope of the protection.
Claims (3)
1. laser in-situ Aided Machine delineates the device of hard brittle material, it is characterised in that including for being carved to hard brittle material
The transparent diamond particles with cone cutter head of operation are drawn, the handle of a knife and tool rest of through hole are offered along axis, is passed through in through hole
Embedded optical-fiber laser, the tool rest top surface is fixedly connected on handle of a knife bottom, the tool rest bottom side offer with it is transparent
The corresponding holding tank of diamond particles, the transparent diamond particles top surface is fixedly connected on holding tank inner top surface and transparent gold
Hard rock particle top surface formation horizontal location face, the optical-fiber laser is radiated at the water of transparent diamond particles through handle of a knife, tool rest
Calm down on plane and form focus point in the bottom of transparent diamond particles cone cutter head.
2. laser in-situ Aided Machine according to claim 1 delineates the device of hard brittle material, it is characterised in that：It is described
Bright diamond particles side is brazed on the side wall of tool rest holding tank.
3. the method that laser in-situ Aided Machine delineates hard brittle material, it is characterised in that including：
(1) holding tank corresponding with transparent diamond particles is opened up on tool rest, by the transparent diamond with cone cutter head
Particle is fixed on the holding tank of tool rest, and the top surface of transparent diamond particles forms the water that transparent diamond particles are contacted with holding tank
Calm down plane；
(2) tool rest is fixed on handle of a knife bottom, and through hole is axially opened up on handle of a knife and tool rest, be then passed through to through hole interior
Embedded optical-fiber laser；
(3) optical-fiber laser passes through the horizontal location face of handle of a knife, tool rest just to transparent diamond particles, and passes through transparent diamond
Grain is radiated at the cone cutter head bottom of transparent diamond particles, forms Laser Focusing point, realizes and swashs by the optical effect of cone
Light carries out energy effect in situ to being scored hard brittle material region, reaches the purpose of softening hard brittle material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610046614.2A CN105710980B (en) | 2016-01-17 | 2016-01-17 | Laser in-situ Aided Machine delineates the device and method of hard brittle material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610046614.2A CN105710980B (en) | 2016-01-17 | 2016-01-17 | Laser in-situ Aided Machine delineates the device and method of hard brittle material |
Publications (2)
| Publication Number | Publication Date |
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| CN105710980A CN105710980A (en) | 2016-06-29 |
| CN105710980B true CN105710980B (en) | 2017-08-22 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110340669A (en) * | 2019-07-22 | 2019-10-18 | 长春理工大学 | A method of the fast tool servo based on laser in-situ auxiliary processes hard brittle material free form surface |
| CN111299868B (en) * | 2020-03-03 | 2022-01-28 | 长春理工大学 | Optical system for mechanically scribing echelle grating by aid of laser in-situ |
| CN113478069A (en) * | 2021-07-23 | 2021-10-08 | 哈尔滨理工大学 | Laser heating auxiliary scribing device |
| CN113829081B (en) * | 2021-10-15 | 2022-06-07 | 华中科技大学 | Selective energy field auxiliary processing system |
| CN113843630B (en) * | 2021-10-15 | 2022-07-19 | 华中科技大学 | Laser high-frequency precise control system and method for selective field-assisted machining |
| CN114918530A (en) * | 2022-06-30 | 2022-08-19 | 华中科技大学 | Laser in-situ auxiliary indentation/scratch device and method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004096721A1 (en) * | 2003-04-28 | 2004-11-11 | Mitsuboshi Diamond Industrial Co., Ltd. | Brittle board dividing system and brittle board dividing method |
| WO2005028172A1 (en) * | 2003-09-24 | 2005-03-31 | Mitsuboshi Diamond Industrial Co., Ltd. | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| CN102741179B (en) * | 2009-11-30 | 2015-11-25 | 康宁股份有限公司 | For laser grooving and scribing and the method splitting glass substrate |
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