CN105704987B - A kind of electronic equipment and its heat dissipating method - Google Patents
A kind of electronic equipment and its heat dissipating method Download PDFInfo
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- CN105704987B CN105704987B CN201610184819.7A CN201610184819A CN105704987B CN 105704987 B CN105704987 B CN 105704987B CN 201610184819 A CN201610184819 A CN 201610184819A CN 105704987 B CN105704987 B CN 105704987B
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 421
- 238000004891 communication Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 17
- 238000005452 bending Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 9
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- 239000010408 film Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
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- 230000001681 protective effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 241001391944 Commicarpus scandens Species 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
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- 238000005259 measurement Methods 0.000 description 2
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- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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Abstract
The invention discloses a kind of electronic equipment and its heat dissipating method, including：Control instruction is received, the control instruction is used to control the heat dissipation of the electronic equipment, wherein, the electronic equipment is can shape-changing devices；The control instruction is responded, determines the radiating mode of the electronic equipment；Based on the radiating mode, the electronic equipment is controlled to generate deformation, the deformation matches with the radiating mode.
Description
Technical Field
The present invention relates to heat dissipation technologies, and in particular, to an electronic device and a heat dissipation method thereof.
Background
With the rapid development of mobile devices, flexible electronic devices that are small and lightweight have become the target of users. When a user uses the flexible electronic device, the flexible electronic device is usually laid on a table top, which is not favorable for heat dissipation of the flexible electronic device. And the flexible electronic equipment is limited by the size and the weight of the machine body, and heat emitted by the processor during working cannot be dissipated by adopting a large radiator and a fan, so that the performance of the processor is greatly reduced, and the use experience of a user is seriously influenced.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention provide an electronic device and a heat dissipation method thereof.
The heat dissipation method of the electronic equipment provided by the embodiment of the invention comprises the following steps:
receiving a control instruction, wherein the control instruction is used for controlling the heat dissipation of the electronic equipment, and the electronic equipment is deformable equipment;
responding to the control instruction, and determining a heat dissipation mode of the electronic equipment;
and controlling the electronic equipment to deform based on the heat dissipation mode, wherein the deformation is matched with the heat dissipation mode.
In an embodiment of the present invention, the heat dissipation mode includes: a first heat dissipation mode, a second heat dissipation mode and a third heat dissipation mode;
the heat dissipation rate of the first heat dissipation mode is lower than that of the second heat dissipation mode, and the heat dissipation rate of the second heat dissipation mode is lower than that of the third heat dissipation mode.
In an embodiment of the present invention, the controlling the electronic device to generate a deformation based on the heat dissipation mode, where the deformation is matched with the heat dissipation mode includes:
when the heat dissipation mode is a first heat dissipation mode, the first end of the electronic device is controlled to bend towards a first direction according to a first curvature.
In an embodiment of the present invention, the controlling the electronic device to generate a deformation based on the heat dissipation mode, where the deformation is matched with the heat dissipation mode includes:
and when the heat dissipation mode is a second heat dissipation mode, controlling at least one of the four corners of the electronic device to bend towards a second direction according to a second curvature.
In an embodiment of the present invention, the controlling the electronic device to generate a deformation based on the heat dissipation mode, where the deformation is matched with the heat dissipation mode includes:
when the heat dissipation mode is a third heat dissipation mode, controlling a second end of the electronic device to bend towards the first direction according to a third curvature; the third curvature is greater than the first curvature.
In an embodiment of the present invention, the determining the heat dissipation mode of the electronic device includes:
determining a heat dissipation mode of the electronic equipment according to the selection operation; or,
and determining the heat dissipation mode of the electronic equipment according to the working parameters of the electronic equipment.
In an embodiment of the present invention, the determining a heat dissipation mode of the electronic device according to the selection operation includes:
collecting fingerprint information;
when the fingerprint information is matched with preset first template fingerprint information, the heat dissipation mode of the electronic equipment is a first heat dissipation mode;
when the fingerprint information is matched with preset second template fingerprint information, the heat dissipation mode of the electronic equipment is a second heat dissipation mode;
and when the fingerprint information is matched with the preset third template fingerprint information, the heat dissipation mode of the electronic equipment is a third heat dissipation mode.
The electronic equipment provided by the embodiment of the invention is deformable equipment, and comprises:
the communication interface is used for receiving a control instruction, and the control instruction is used for controlling the heat dissipation of the electronic equipment;
the controller is used for responding to the control instruction and determining the heat dissipation mode of the electronic equipment; and controlling the electronic equipment to deform based on the heat dissipation mode, wherein the deformation is matched with the heat dissipation mode.
In an embodiment of the present invention, the heat dissipation mode includes: a first heat dissipation mode, a second heat dissipation mode and a third heat dissipation mode;
the heat dissipation rate of the first heat dissipation mode is lower than that of the second heat dissipation mode, and the heat dissipation rate of the second heat dissipation mode is lower than that of the third heat dissipation mode.
In an embodiment of the present invention, the controller is further configured to control the first end of the electronic device to bend towards the first direction according to the first curvature when the heat dissipation mode is the first heat dissipation mode.
In an embodiment of the present invention, the controller is further configured to control at least one of four corners of the electronic device to bend toward the second direction according to the second curvature when the heat dissipation mode is the second heat dissipation mode.
In an embodiment of the present invention, the controller is further configured to control the second end of the electronic device to bend towards the first direction according to a third curvature when the heat dissipation mode is a third heat dissipation mode; the third curvature is greater than the first curvature.
In the embodiment of the present invention, the controller is further configured to determine a heat dissipation mode of the electronic device according to a selection operation; or determining the heat dissipation mode of the electronic equipment according to the working parameters of the electronic equipment.
In an embodiment of the present invention, the electronic device further includes: the sensor is used for collecting fingerprint information;
the controller is further configured to determine that the heat dissipation mode of the electronic device is a first heat dissipation mode when the fingerprint information matches preset first template fingerprint information; when the fingerprint information is matched with preset second template fingerprint information, determining that the heat dissipation mode of the electronic equipment is a second heat dissipation mode; and when the fingerprint information is matched with the preset third template fingerprint information, determining that the heat dissipation mode of the electronic equipment is a third heat dissipation mode.
In the technical scheme of the embodiment of the invention, a control instruction is received, wherein the control instruction is used for controlling the heat dissipation of electronic equipment, and the electronic equipment is deformable equipment; responding to the control instruction, and determining a heat dissipation mode of the electronic equipment; and controlling the electronic equipment to deform based on the heat dissipation mode, wherein the deformation is matched with the heat dissipation mode. Therefore, the electronic equipment forms a specific shape through deformation, and forms an air flow space through the specific shape, so that the heat dissipation effect is improved. In addition, the electronic equipment has multiple heat dissipation modes, and different heat dissipation modes correspond different deformations, provide multiple heat dissipation modes for the user.
Drawings
Fig. 1 is a schematic flow chart illustrating a heat dissipation method of an electronic device according to a first embodiment of the present invention;
fig. 2 is a schematic flow chart illustrating a heat dissipation method of an electronic device according to a second embodiment of the present invention;
fig. 3 is a schematic flow chart illustrating a heat dissipation method of an electronic device according to a third embodiment of the present invention;
fig. 4 is a schematic flow chart illustrating a heat dissipation method of an electronic device according to a fourth embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electronic device according to a fifth embodiment of the present invention;
fig. 6 is a schematic structural composition diagram of an electronic device according to a sixth embodiment of the present invention;
fig. 7 is a schematic diagram illustrating deformation corresponding to a first heat dissipation mode according to an embodiment of the invention;
fig. 8 is a schematic diagram illustrating deformation corresponding to a second heat dissipation mode according to an embodiment of the invention;
fig. 9 is a schematic deformation diagram corresponding to a third heat dissipation mode according to an embodiment of the invention.
Detailed Description
So that the manner in which the features and aspects of the embodiments of the present invention can be understood in detail, a more particular description of the embodiments of the invention, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings.
Fig. 1 is a schematic flow chart of a heat dissipation method of an electronic device according to a first embodiment of the present invention, and as shown in fig. 1, the heat dissipation method of the electronic device includes the following steps:
step 101: and receiving a control instruction, wherein the control instruction is used for controlling the heat dissipation of the electronic equipment, and the electronic equipment is deformable equipment.
In the embodiment of the present invention, the electronic device is a deformable device, and specifically, the electronic device may be deformed according to any shape or according to some specific shapes. In one embodiment, the deformation of the electronic device is bending, which is a flexible device, and the electronic device may be bent in any shape or in some specific shape, and after bending, the shape of the electronic device is fixed and the final shape after bending is achieved.
In an implementation manner of the embodiment of the present invention, the electronic device may be a flexible screen, where the flexible screen refers to a screen that is flexible and good in flexibility. In a specific implementation, the flexible screen may be made of an Organic Light-Emitting Diode (OLED), and the OLED is made of a plastic substrate, and a protective film is adhered to the back of the panel by using a thin film packaging technology, so that the panel is bendable and is not easily broken. The flexible screen can be curled, can be folded along with the improvement of the process, and can be changed in shape according to any shape.
Certainly, the deformable device in the embodiment of the present invention is not limited to the flexible screen, and may also be other deformable electronic devices, and such electronic devices generate heat during operation, generally, a source of the heat is generated when a processor of the electronic device operates, and after the heat is generated, temperatures of the processor and other devices of the electronic device may rise, which may greatly affect working performances of the processor and other devices.
In the embodiment of the invention, the electronic equipment receives a control instruction, and the control instruction is used for controlling the heat dissipation of the electronic equipment. Here, the control command carries at least the following information: a heat dissipation mode of the electronic device. Here, the electronic device has more than two heat dissipation modes, and the heat dissipation effects corresponding to different heat dissipation modes are different. The present example provides different heat dissipation modes for the user to accommodate different scene requirements. For example, when the external temperature is low, the heat conduction between the electronic device and the outside is large, and therefore, the corresponding heat dissipation mode can be selected as the heat dissipation mode with the low heat dissipation rate. For another example, when the temperature of the electronic device is high, the corresponding heat dissipation mode may select a heat dissipation mode with a high heat dissipation rate.
Step 102: and responding to the control instruction, and determining the heat dissipation mode of the electronic equipment.
In this embodiment of the present invention, after receiving the control instruction, responding to the control instruction, where a process of responding to the control instruction at least includes: and analyzing the control command, and extracting a heat dissipation mode from the control command. Thus, the heat dissipation mode of the electronic equipment can be determined. The heat dissipation rates corresponding to different heat dissipation modes are different, and the heat dissipation rate refers to the heat value conducted from the electronic equipment to the outside in unit time and unit area. The higher the heat dissipation rate is, the better the heat dissipation effect is; conversely, the lower the heat dissipation rate, the worse the heat dissipation effect.
Step 103: and controlling the electronic equipment to deform based on the heat dissipation mode, wherein the deformation is matched with the heat dissipation mode.
In the embodiment of the invention, the heat dissipation rates corresponding to different heat dissipation modes are different, and the heat dissipation rate is associated with the shape of the electronic equipment, so that the shape of the electronic equipment is associated with the heat dissipation modes. In order to realize heat dissipation of the electronic equipment, the electronic equipment is controlled to deform, and the final shape after deformation determines the heat dissipation rate of the current heat dissipation mode.
In the embodiment of the present invention, the deformation of the electronic device may be realized by a driving component in the electronic device, where the driving component may be in an electrical structural form or a physical mechanical structural form. The electronic equipment is driven to deform through the driving part, so that the deformed electronic equipment generates an air flow space based on the shape of the deformed electronic equipment, and the heat dissipation effect matched with the current heat dissipation mode is achieved.
Fig. 2 is a schematic flow chart of a heat dissipation method of an electronic device according to a second embodiment of the present invention, and as shown in fig. 2, the heat dissipation method of the electronic device includes the following steps:
step 201: and receiving a control instruction, wherein the control instruction is used for controlling the heat dissipation of the electronic equipment, and the electronic equipment is deformable equipment.
In the embodiment of the present invention, the electronic device is a deformable device, and specifically, the electronic device may be deformed according to any shape or according to some specific shapes. In one embodiment, the deformation of the electronic device is bending, which is a flexible device, and the electronic device may be bent in any shape or in some specific shape, and after bending, the shape of the electronic device is fixed and the final shape after bending is achieved.
In an implementation manner of the embodiment of the present invention, the electronic device may be a flexible screen, where the flexible screen refers to a screen that is flexible and good in flexibility. During specific implementation, the flexible screen can be made of OLED (organic light emitting diode) which adopts a plastic substrate, a thin film packaging technology is used, and a protective film is pasted on the back of the panel, so that the panel can be bent and is not easy to break. The flexible screen can be curled, can be folded along with the improvement of the process, and can be changed in shape according to any shape.
Certainly, the deformable device in the embodiment of the present invention is not limited to the flexible screen, and may also be other deformable electronic devices, and such electronic devices generate heat during operation, generally, a source of the heat is generated when a processor of the electronic device operates, and after the heat is generated, temperatures of the processor and other devices of the electronic device may rise, which may greatly affect working performances of the processor and other devices.
In the embodiment of the invention, the electronic equipment receives a control instruction, and the control instruction is used for controlling the heat dissipation of the electronic equipment. Here, the control command carries at least the following information: a heat dissipation mode of the electronic device. Here, the electronic device has more than two heat dissipation modes, and the heat dissipation effects corresponding to different heat dissipation modes are different. The present example provides different heat dissipation modes for the user to accommodate different scene requirements. For example, when the external temperature is low, the heat conduction between the electronic device and the outside is large, and therefore, the corresponding heat dissipation mode can be selected as the heat dissipation mode with the low heat dissipation rate. For another example, when the temperature of the electronic device is high, the corresponding heat dissipation mode may select a heat dissipation mode with a high heat dissipation rate.
Step 202: and responding to the control instruction, and determining the heat dissipation mode of the electronic equipment.
In this embodiment of the present invention, after receiving the control instruction, responding to the control instruction, where a process of responding to the control instruction at least includes: and analyzing the control command, and extracting a heat dissipation mode from the control command. Thus, the heat dissipation mode of the electronic equipment can be determined. The heat dissipation rates corresponding to different heat dissipation modes are different, and the heat dissipation rate refers to the heat value conducted from the electronic equipment to the outside in unit time and unit area. The higher the heat dissipation rate is, the better the heat dissipation effect is; conversely, the lower the heat dissipation rate, the worse the heat dissipation effect.
In an embodiment of the present invention, the heat dissipation mode includes: a first heat dissipation mode, a second heat dissipation mode and a third heat dissipation mode;
the heat dissipation rate of the first heat dissipation mode is lower than that of the second heat dissipation mode, and the heat dissipation rate of the second heat dissipation mode is lower than that of the third heat dissipation mode.
In an embodiment of the present invention, the determining the heat dissipation mode of the electronic device includes:
determining a heat dissipation mode of the electronic equipment according to the selection operation; or,
and determining the heat dissipation mode of the electronic equipment according to the working parameters of the electronic equipment.
Here, the heat dissipation mode of the electronic device may be determined according to a selection operation of a user, and then information of the heat dissipation mode may be carried in the control instruction. The heat dissipation mode of the electronic equipment can be determined according to the working parameters of the electronic equipment, and then the information of the heat dissipation mode is carried in the control instruction. The operating parameters of the electronic device may be: a frequency of a processor of the electronic device, a temperature of the electronic device, a power consumption of the electronic device, and the like.
In an embodiment of the present invention, determining a heat dissipation mode of the electronic device according to a selection operation includes: collecting fingerprint information; when the fingerprint information is matched with preset first template fingerprint information, the heat dissipation mode of the electronic equipment is a first heat dissipation mode; when the fingerprint information is matched with preset second template fingerprint information, the heat dissipation mode of the electronic equipment is a second heat dissipation mode; and when the fingerprint information is matched with the preset third template fingerprint information, the heat dissipation mode of the electronic equipment is a third heat dissipation mode. In this way, the electronic device automatically determines the heat dissipation mode through fingerprint recognition.
In addition, the electronic equipment can also be automatically deformed and attached to a bearing object for curvature measurement, and then the heat dissipation mode is automatically determined according to the curvature measurement structure.
In an embodiment of the present invention, the electronic device is a flexible screen, and after the electronic device determines the heat dissipation mode, the deformation process matched with the heat dissipation mode is automatically previewed, so that a user can visually view the deformation matched with the heat dissipation mode.
Step 203: when the heat dissipation mode is a first heat dissipation mode, the first end of the electronic device is controlled to bend towards a first direction according to a first curvature.
In the embodiment of the invention, the heat dissipation rates corresponding to different heat dissipation modes are different, and the heat dissipation rate is associated with the shape of the electronic equipment, so that the shape of the electronic equipment is associated with the heat dissipation modes. In order to realize heat dissipation of the electronic equipment, the electronic equipment is controlled to deform, and the final shape after deformation determines the heat dissipation rate of the current heat dissipation mode.
In the embodiment of the present invention, the deformation of the electronic device may be realized by a driving component in the electronic device, where the driving component may be in an electrical structural form or a physical mechanical structural form. The electronic equipment is driven to deform through the driving part, so that the deformed electronic equipment generates an air flow space based on the shape of the deformed electronic equipment, and the heat dissipation effect matched with the current heat dissipation mode is achieved.
In the embodiment of the invention, the heat dissipation mode is the first heat dissipation mode, and the corresponding heat dissipation rate is lower than that of the other two heat dissipation modes (namely the second heat dissipation mode and the third heat dissipation mode). The first heat dissipation mode is also referred to as a micro heat dissipation mode, in which the first end of the electronic device is bent toward the first direction according to a first curvature.
Specifically, referring to fig. 7, a common shape of the electronic device is a two-dimensional flat plate shape, taking the shape of the electronic device as a rectangle as an example, two ends of the electronic device refer to two ends of the rectangle, and when the electronic device is placed on a carrying object (for example, a desktop), a first end of the electronic device is slightly bent downward. Here, downward means that the first end of the electronic device is bent toward the desktop; here, slightly means that the first curvature is small, and the bending degree is small, so that when the deformed electronic device is placed on a carrying object (such as a table top), a certain airflow space is formed between the first end of the electronic device and the carrying object, and heat dissipation is achieved through the airflow space.
Fig. 3 is a schematic flow chart of a heat dissipation method of an electronic device according to a third embodiment of the present invention, and as shown in fig. 3, the heat dissipation method of the electronic device includes the following steps:
step 301: and receiving a control instruction, wherein the control instruction is used for controlling the heat dissipation of the electronic equipment, and the electronic equipment is deformable equipment.
In the embodiment of the present invention, the electronic device is a deformable device, and specifically, the electronic device may be deformed according to any shape or according to some specific shapes. In one embodiment, the deformation of the electronic device is bending, which is a flexible device, and the electronic device may be bent in any shape or in some specific shape, and after bending, the shape of the electronic device is fixed and the final shape after bending is achieved.
In an implementation manner of the embodiment of the present invention, the electronic device may be a flexible screen, where the flexible screen refers to a screen that is flexible and good in flexibility. During specific implementation, the flexible screen can be made of OLED (organic light emitting diode) which adopts a plastic substrate, a thin film packaging technology is used, and a protective film is pasted on the back of the panel, so that the panel can be bent and is not easy to break. The flexible screen can be curled, can be folded along with the improvement of the process, and can be changed in shape according to any shape.
Certainly, the deformable device in the embodiment of the present invention is not limited to the flexible screen, and may also be other deformable electronic devices, and such electronic devices generate heat during operation, generally, a source of the heat is generated when a processor of the electronic device operates, and after the heat is generated, temperatures of the processor and other devices of the electronic device may rise, which may greatly affect working performances of the processor and other devices.
In the embodiment of the invention, the electronic equipment receives a control instruction, and the control instruction is used for controlling the heat dissipation of the electronic equipment. Here, the control command carries at least the following information: a heat dissipation mode of the electronic device. Here, the electronic device has more than two heat dissipation modes, and the heat dissipation effects corresponding to different heat dissipation modes are different. The present example provides different heat dissipation modes for the user to accommodate different scene requirements. For example, when the external temperature is low, the heat conduction between the electronic device and the outside is large, and therefore, the corresponding heat dissipation mode can be selected as the heat dissipation mode with the low heat dissipation rate. For another example, when the temperature of the electronic device is high, the corresponding heat dissipation mode may select a heat dissipation mode with a high heat dissipation rate.
Step 302: and responding to the control instruction, and determining the heat dissipation mode of the electronic equipment.
In this embodiment of the present invention, after receiving the control instruction, responding to the control instruction, where a process of responding to the control instruction at least includes: and analyzing the control command, and extracting a heat dissipation mode from the control command. Thus, the heat dissipation mode of the electronic equipment can be determined. The heat dissipation rates corresponding to different heat dissipation modes are different, and the heat dissipation rate refers to the heat value conducted from the electronic equipment to the outside in unit time and unit area. The higher the heat dissipation rate is, the better the heat dissipation effect is; conversely, the lower the heat dissipation rate, the worse the heat dissipation effect.
In an embodiment of the present invention, the heat dissipation mode includes: a first heat dissipation mode, a second heat dissipation mode and a third heat dissipation mode;
the heat dissipation rate of the first heat dissipation mode is lower than that of the second heat dissipation mode, and the heat dissipation rate of the second heat dissipation mode is lower than that of the third heat dissipation mode.
Step 303: and when the heat dissipation mode is a second heat dissipation mode, controlling at least one of the four corners of the electronic device to bend towards a second direction according to a second curvature.
In the embodiment of the invention, the heat dissipation rates corresponding to different heat dissipation modes are different, and the heat dissipation rate is associated with the shape of the electronic equipment, so that the shape of the electronic equipment is associated with the heat dissipation modes. In order to realize heat dissipation of the electronic equipment, the electronic equipment is controlled to deform, and the final shape after deformation determines the heat dissipation rate of the current heat dissipation mode.
In the embodiment of the present invention, the deformation of the electronic device may be realized by a driving component in the electronic device, where the driving component may be in an electrical structural form or a physical mechanical structural form. The electronic equipment is driven to deform through the driving part, so that the deformed electronic equipment generates an air flow space based on the shape of the deformed electronic equipment, and the heat dissipation effect matched with the current heat dissipation mode is achieved.
In the embodiment of the invention, the heat dissipation mode is the second heat dissipation mode, and the corresponding heat dissipation rate is higher relative to the second heat dissipation mode and lower relative to the third heat dissipation mode. The second heat dissipation mode is also referred to as a normal heat dissipation mode, in which four corners of the electronic device are bent in a second direction according to a second curvature.
Specifically, referring to fig. 8, a common shape of the electronic device is a two-dimensional flat plate shape, taking the shape of the electronic device as a rectangle as an example, four corners of the electronic device refer to four corners of the rectangle, and when the electronic device is placed on a carrying object (for example, a desktop), the four corners of the electronic device are bent downward. Here, downward means that four corners of the electronic device are bent toward the desktop. The degree of bending is determined in accordance with the second curvature. Like this, when the electronic equipment after the deformation was placed on bearing the thing (for example desktop), four angles of electronic equipment made electronic equipment and bear and form hollow structure between the thing, and hollow structure forms great wind current space, realized the heat dissipation through this wind current space.
Fig. 4 is a schematic flow chart of a heat dissipation method of an electronic device according to a fourth embodiment of the present invention, and as shown in fig. 4, the heat dissipation method of the electronic device includes the following steps:
step 401: and receiving a control instruction, wherein the control instruction is used for controlling the heat dissipation of the electronic equipment, and the electronic equipment is deformable equipment.
In the embodiment of the present invention, the electronic device is a deformable device, and specifically, the electronic device may be deformed according to any shape or according to some specific shapes. In one embodiment, the deformation of the electronic device is bending, which is a flexible device, and the electronic device may be bent in any shape or in some specific shape, and after bending, the shape of the electronic device is fixed and the final shape after bending is achieved.
In an implementation manner of the embodiment of the present invention, the electronic device may be a flexible screen, where the flexible screen refers to a screen that is flexible and good in flexibility. During specific implementation, the flexible screen can be made of OLED (organic light emitting diode) which adopts a plastic substrate, a thin film packaging technology is used, and a protective film is pasted on the back of the panel, so that the panel can be bent and is not easy to break. The flexible screen can be curled, can be folded along with the improvement of the process, and can be changed in shape according to any shape.
Certainly, the deformable device in the embodiment of the present invention is not limited to the flexible screen, and may also be other deformable electronic devices, and such electronic devices generate heat during operation, generally, a source of the heat is generated when a processor of the electronic device operates, and after the heat is generated, temperatures of the processor and other devices of the electronic device may rise, which may greatly affect working performances of the processor and other devices.
In the embodiment of the invention, the electronic equipment receives a control instruction, and the control instruction is used for controlling the heat dissipation of the electronic equipment. Here, the control command carries at least the following information: a heat dissipation mode of the electronic device. Here, the electronic device has more than two heat dissipation modes, and the heat dissipation effects corresponding to different heat dissipation modes are different. The present example provides different heat dissipation modes for the user to accommodate different scene requirements. For example, when the external temperature is low, the heat conduction between the electronic device and the outside is large, and therefore, the corresponding heat dissipation mode can be selected as the heat dissipation mode with the low heat dissipation rate. For another example, when the temperature of the electronic device is high, the corresponding heat dissipation mode may select a heat dissipation mode with a high heat dissipation rate.
Step 402: and responding to the control instruction, and determining the heat dissipation mode of the electronic equipment.
In this embodiment of the present invention, after receiving the control instruction, responding to the control instruction, where a process of responding to the control instruction at least includes: and analyzing the control command, and extracting a heat dissipation mode from the control command. Thus, the heat dissipation mode of the electronic equipment can be determined. The heat dissipation rates corresponding to different heat dissipation modes are different, and the heat dissipation rate refers to the heat value conducted from the electronic equipment to the outside in unit time and unit area. The higher the heat dissipation rate is, the better the heat dissipation effect is; conversely, the lower the heat dissipation rate, the worse the heat dissipation effect.
In an embodiment of the present invention, the heat dissipation mode includes: a first heat dissipation mode, a second heat dissipation mode and a third heat dissipation mode;
the heat dissipation rate of the first heat dissipation mode is lower than that of the second heat dissipation mode, and the heat dissipation rate of the second heat dissipation mode is lower than that of the third heat dissipation mode.
Step 403: and when the heat dissipation mode is a third heat dissipation mode, controlling the second end of the electronic device to bend towards the first direction according to a third curvature.
In the embodiment of the invention, the heat dissipation rates corresponding to different heat dissipation modes are different, and the heat dissipation rate is associated with the shape of the electronic equipment, so that the shape of the electronic equipment is associated with the heat dissipation modes. In order to realize heat dissipation of the electronic equipment, the electronic equipment is controlled to deform, and the final shape after deformation determines the heat dissipation rate of the current heat dissipation mode.
In the embodiment of the present invention, the deformation of the electronic device may be realized by a driving component in the electronic device, where the driving component may be in an electrical structural form or a physical mechanical structural form. The electronic equipment is driven to deform through the driving part, so that the deformed electronic equipment generates an air flow space based on the shape of the deformed electronic equipment, and the heat dissipation effect matched with the current heat dissipation mode is achieved.
In the embodiment of the invention, the heat dissipation mode is the third heat dissipation mode, and the corresponding heat dissipation rate is higher than that of the second heat dissipation mode and the third heat dissipation mode. The third heat dissipation mode is also referred to as a strong heat dissipation mode, in which the second end of the electronic device is bent toward the first direction according to a third curvature.
Specifically, referring to fig. 9, a common shape of the electronic device is a two-dimensional flat plate shape, taking the shape of the electronic device as a rectangle as an example, the second end of the electronic device refers to the second end of the rectangle, and when the electronic device is placed on a carrying object (for example, a desktop), the second end of the electronic device is bent downward and integrally. Here, downward means that the second end of the electronic device is bent toward the desktop. The bending degree is determined according to the third curvature, the third curvature is larger, and the whole electronic equipment is bent into an arc shape. Therefore, when the deformed electronic equipment is placed on a bearing object (such as a desktop), the electronic equipment is supported on the bearing object in a semicircular shape, a larger airflow space is formed by a hollow structure formed between the electronic equipment and the bearing object, and heat dissipation is realized through the airflow space.
Fig. 5 is a schematic structural composition diagram of an electronic device according to a fifth embodiment of the present invention, where the electronic device is a deformable device, as shown in fig. 5, and includes:
a communication interface 51, configured to receive a control instruction, where the control instruction is used to control heat dissipation of the electronic device;
a controller 52, configured to determine a heat dissipation mode of the electronic device in response to the control instruction; and controlling the electronic equipment to deform based on the heat dissipation mode, wherein the deformation is matched with the heat dissipation mode.
In an embodiment of the present invention, the heat dissipation mode includes: a first heat dissipation mode, a second heat dissipation mode and a third heat dissipation mode;
the heat dissipation rate of the first heat dissipation mode is lower than that of the second heat dissipation mode, and the heat dissipation rate of the second heat dissipation mode is lower than that of the third heat dissipation mode.
In this embodiment of the present invention, the controller 52 is further configured to control the first end of the electronic device to bend toward the first direction according to the first curvature when the heat dissipation mode is the first heat dissipation mode.
In this embodiment of the present invention, the controller 52 is further configured to control at least one of the four corners of the electronic device to bend toward the second direction according to the second curvature when the heat dissipation mode is the second heat dissipation mode.
In this embodiment of the present invention, the controller 52 is further configured to control the second end of the electronic device to bend toward the first direction according to a third curvature when the heat dissipation mode is a third heat dissipation mode; the third curvature is greater than the first curvature.
In this embodiment of the present invention, the controller 52 is further configured to determine a heat dissipation mode of the electronic device according to a selection operation; or determining the heat dissipation mode of the electronic equipment according to the working parameters of the electronic equipment.
It will be understood by those skilled in the art that the functions implemented by the units in the electronic device shown in fig. 5 can be understood by referring to the related description of the heat dissipation method of the former electronic device.
Fig. 6 is a schematic structural composition diagram of an electronic device according to a sixth embodiment of the present invention, where the electronic device is a deformable device, and as shown in fig. 6, the electronic device includes:
a communication interface 61, configured to receive a control instruction, where the control instruction is used to control heat dissipation of the electronic device;
a controller 62, configured to determine a heat dissipation mode of the electronic device in response to the control instruction; and controlling the electronic equipment to deform based on the heat dissipation mode, wherein the deformation is matched with the heat dissipation mode.
In an embodiment of the present invention, the heat dissipation mode includes: a first heat dissipation mode, a second heat dissipation mode and a third heat dissipation mode;
the heat dissipation rate of the first heat dissipation mode is lower than that of the second heat dissipation mode, and the heat dissipation rate of the second heat dissipation mode is lower than that of the third heat dissipation mode.
In this embodiment of the present invention, the controller 62 is further configured to control the first end of the electronic device to bend toward the first direction according to the first curvature when the heat dissipation mode is the first heat dissipation mode.
In this embodiment of the present invention, the controller 62 is further configured to control at least one of the four corners of the electronic device to bend toward the second direction according to the second curvature when the heat dissipation mode is the second heat dissipation mode.
In this embodiment of the present invention, the controller 62 is further configured to control the second end of the electronic device to bend toward the first direction according to a third curvature when the heat dissipation mode is a third heat dissipation mode; the third curvature is greater than the first curvature.
In this embodiment of the present invention, the controller 62 is further configured to determine a heat dissipation mode of the electronic device according to a selection operation; or determining the heat dissipation mode of the electronic equipment according to the working parameters of the electronic equipment.
In an embodiment of the present invention, the electronic device further includes: a sensor 63 for collecting fingerprint information;
the controller 62 is further configured to determine that the heat dissipation mode of the electronic device is the first heat dissipation mode when the fingerprint information matches preset first template fingerprint information; when the fingerprint information is matched with preset second template fingerprint information, determining that the heat dissipation mode of the electronic equipment is a second heat dissipation mode; and when the fingerprint information is matched with the preset third template fingerprint information, determining that the heat dissipation mode of the electronic equipment is a third heat dissipation mode.
It will be understood by those skilled in the art that the functions implemented by the units in the electronic device shown in fig. 6 can be understood by referring to the related description of the heat dissipation method of the former electronic device.
The technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
In the embodiments provided in the present invention, it should be understood that the disclosed method and intelligent device may be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, all the functional units in the embodiments of the present invention may be integrated into one second processing unit, or each unit may be separately regarded as one unit, or two or more units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (12)
1. A method of dissipating heat from an electronic device, comprising:
receiving a control instruction, wherein the control instruction is used for controlling the heat dissipation of the electronic equipment, and the electronic equipment is deformable equipment;
responding to the control instruction, and determining a heat dissipation mode of the electronic equipment;
controlling the electronic equipment to generate deformation based on the heat dissipation mode, wherein the deformation is matched with the heat dissipation mode; wherein the heat dissipation pattern comprises: a first heat dissipation mode, a second heat dissipation mode and a third heat dissipation mode; when the heat dissipation mode is a first heat dissipation mode, the first end of the electronic device is controlled to bend towards a first direction according to a first curvature.
2. The heat dissipation method of the electronic device according to claim 1, wherein a heat dissipation rate of the first heat dissipation mode is lower than a heat dissipation rate of the second heat dissipation mode, and the heat dissipation rate of the second heat dissipation mode is lower than a heat dissipation rate of the third heat dissipation mode.
3. The method for dissipating heat of an electronic device according to claim 2, wherein the controlling the electronic device to generate deformation based on the heat dissipation mode, the deformation matching with the heat dissipation mode comprises:
and when the heat dissipation mode is a second heat dissipation mode, controlling at least one of the four corners of the electronic device to bend towards a second direction according to a second curvature.
4. The method for dissipating heat of an electronic device according to claim 1, wherein the controlling the electronic device to generate a deformation based on the heat dissipation pattern, the deformation matching with the heat dissipation pattern comprises:
when the heat dissipation mode is a third heat dissipation mode, controlling a second end of the electronic device to bend towards the first direction according to a third curvature; the third curvature is greater than the first curvature.
5. The method for dissipating heat from an electronic device according to claim 1, the determining a heat dissipation mode of the electronic device comprising:
determining a heat dissipation mode of the electronic equipment according to the selection operation; or,
and determining the heat dissipation mode of the electronic equipment according to the working parameters of the electronic equipment.
6. The method for dissipating heat from an electronic device according to claim 5, wherein the determining a heat dissipation mode of the electronic device according to the selection operation comprises:
collecting fingerprint information;
when the fingerprint information is matched with preset first template fingerprint information, the heat dissipation mode of the electronic equipment is a first heat dissipation mode;
when the fingerprint information is matched with preset second template fingerprint information, the heat dissipation mode of the electronic equipment is a second heat dissipation mode;
and when the fingerprint information is matched with the preset third template fingerprint information, the heat dissipation mode of the electronic equipment is a third heat dissipation mode.
7. An electronic device, the electronic device being a deformable device, comprising:
the communication interface is used for receiving a control instruction, and the control instruction is used for controlling the heat dissipation of the electronic equipment;
the controller is used for responding to the control instruction and determining the heat dissipation mode of the electronic equipment; controlling the electronic equipment to generate deformation based on the heat dissipation mode, wherein the deformation is matched with the heat dissipation mode; wherein the heat dissipation pattern comprises: a first heat dissipation mode, a second heat dissipation mode and a third heat dissipation mode; when the heat dissipation mode is a first heat dissipation mode, the first end of the electronic device is controlled to bend towards a first direction according to a first curvature.
8. The electronic device of claim 7, the first heat dissipation mode having a lower heat dissipation rate than the second heat dissipation mode, the second heat dissipation mode having a lower heat dissipation rate than the third heat dissipation mode.
9. The electronic device of claim 7, the controller further configured to control at least one of the four corners of the electronic device to bend in a second direction with a second curvature when the heat dissipation mode is a second heat dissipation mode.
10. The electronic device of claim 7, the controller further configured to control the second end of the electronic device to bend in a third curvature toward the first direction when the heat dissipation mode is a third heat dissipation mode; the third curvature is greater than the first curvature.
11. The electronic device of claim 7, the controller further configured to determine a heat dissipation mode of the electronic device according to a selection operation; or determining the heat dissipation mode of the electronic equipment according to the working parameters of the electronic equipment.
12. The electronic device of claim 11, further comprising: the sensor is used for collecting fingerprint information;
the controller is further configured to determine that the heat dissipation mode of the electronic device is a first heat dissipation mode when the fingerprint information matches preset first template fingerprint information; when the fingerprint information is matched with preset second template fingerprint information, determining that the heat dissipation mode of the electronic equipment is a second heat dissipation mode; and when the fingerprint information is matched with the preset third template fingerprint information, determining that the heat dissipation mode of the electronic equipment is a third heat dissipation mode.
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| CN201610184819.7A CN105704987B (en) | 2016-03-28 | 2016-03-28 | A kind of electronic equipment and its heat dissipating method |
| CN201810374585.1A CN108401403B (en) | 2016-03-28 | 2016-03-28 | Electronic equipment and heat dissipation method thereof |
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| CN108401403A (en) * | 2016-03-28 | 2018-08-14 | 联想(北京)有限公司 | A kind of electronic equipment and its heat dissipating method |
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| CN109951581B (en) * | 2019-02-27 | 2021-01-15 | 武汉华星光电半导体显示技术有限公司 | High-temperature screen protection device and method suitable for folding mobile terminal |
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| CN108401403A (en) | 2018-08-14 |
| CN108401403B (en) | 2021-07-16 |
| CN105704987A (en) | 2016-06-22 |
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