CN105702595B - The yield judgment method of wafer and the changeable quantity measuring method of wafer conformity testing - Google Patents
The yield judgment method of wafer and the changeable quantity measuring method of wafer conformity testing Download PDFInfo
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Abstract
The present invention provides a kind of yield judgment method of wafer and the changeable quantity measuring method of wafer conformity testing.Yield judgment method includes: to carry out wafer conformity testing to wafer to be measured, to generate multiple characterisitic parameters；A point group is carried out to these characterisitic parameters according to dependency list, to form multiple groups characterisitic parameter group；Analysis numerical value corresponding to one of these characterisitic parameters or combinations thereof in every group of characterisitic parameter group is calculated with multi-variables analysis, and judge whether the analysis numerical value is greater than default specification information corresponding to one of these characterisitic parameters or combinations thereof, will be greater than one of these characterisitic parameters corresponding to the analysis numerical value of the default specification information or combinations thereof as at least one beyond spec characteristic parameter；And according to the yield for judging wafer to be measured beyond spec characteristic parameter.
Description
Technical field
The invention relates to a kind of inspection technologies of wafer, and utilize wafer conformity testing in particular to a kind of
The yield judgment method of (Wafer acceptance test, abbreviation WAT) Lai Jinhang wafer and wafer conformity testing it is changeable
Measure (Multiple variable) detection method.
Background technique
In semiconductor process, it will usually carry out electrical detection to wafer using wafer conformity testing (WAT).
WAT can generate many electrical parameter and numerical value, and user can assess tested wafer by these electrical parameters and numerical value
Yield quality, and find the problem of may occurring in semiconductor process.If the WAT parameter that can early note abnormalities,
Whether the decision that can be manufactured for wafer draft, assess wafer needs to scrap, whether shipment all have to client etc. it is decisive
Influence.
It is the researcher by wafer with people by electrical parameter caused by WAT and numerical value for current technology
Work mode is tested, and is gone wrong with excavating from these electrical parameters.For example, wafer conformity testing system can be from movable property
Raw WAT parameter list, researcher detect whether these WAT parameters exceed preset range (Out of one by one
Specification, abbreviation OOS).If WAT parameter has exceeded preset range, researcher can detect these beyond default
Whether the WAT parameter of range influences the yield of wafer, and the WAT parameter of influence severity further in accordance with to(for) wafer yield is commented
Estimate whether this wafer needs to scrap.
However, the type of WAT parameter is very many and diverse, after some time it is possible to reach more than 300 kinds, if being looked in WAT parameter manually
It goes wrong and is actually not easy.It on the other hand, may mutual correlation between different WAT parameters；When a certain parameter exceeds preset range
When, other other parameters relevant to this parameter may also can exceed preset range, but this correlation is difficult to easily pass through
Manpower confirmation.Therefore, if detecting manually to WAT parameter, quite a lot of manpower and valuable time can be spent.
Therefore, it is necessary to seek to detect WAT parameter how rapidly and can substantially save the wafer yield detection and measuring technology of human cost.
Summary of the invention
The present invention provides a kind of yield judgment method of wafer and the changeable quantity measuring method of wafer conformity testing.This is good
Rate judgment method utilizes the control of multivariable manufacturing process (Multivariate statistical processcontrol, abbreviation
MSPC) and the auxiliary of hardware device is to list the WAT characterisitic parameter for exceeding preset range, to reduce research staff for WAT
The detection time of characterisitic parameter, and the testing cost in the yield for judging wafer to be measured can be saved.
The present invention proposes a kind of yield judgment method of wafer comprising the following steps.Wafer conjunction is carried out to wafer to be measured
Lattice test, to generate multiple characterisitic parameters.A point group is carried out to those characterisitic parameters according to a dependency list, to form multiple groups spy
Property parameter group.One of these characterisitic parameters or combinations thereof in every group of characterisitic parameter group are calculated with multi-variables analysis
Corresponding analysis numerical value, judges whether this analysis numerical value is greater than corresponding to one of these characterisitic parameters or combinations thereof
Default specification information, will be greater than one of these characterisitic parameters corresponding to the analysis numerical value of the default specification information
Or combinations thereof as at least one exceed spec characteristic parameter.And at least one judge beyond spec characteristic parameter according to this
The yield of this wafer to be measured.
In one embodiment of this invention, above-mentioned yield judgment method further includes the following steps.Count multiple and different crystalline substances
Circle generated characterisitic parameter after carrying out the wafer conformity testing, to analyze whether these characterisitic parameters have correlation.
And there are foundation multiple relevant featuring parameters of correlation to generate this dependency list.
In one embodiment of this invention, above-mentioned yield judgment method further includes the following steps.Record these characteristics ginseng
With multiple relevant featuring parameters of correlation in number, to form this dependency list.
In one embodiment of this invention, above-mentioned multi-variables analysis is with Huo Delin T square statistic (Hotelling's T-
Squared statistic) sequentially calculate one of these characterisitic parameters or combinations thereof in every group of characterisitic parameter group.
In one embodiment of this invention, calculate in every group of characterisitic parameter group one of these characterisitic parameters or its
The corresponding analysis numerical value of combination includes the following steps: sequentially to set the N in every group of characterisitic parameter group in these characterisitic parameters
It is a as variable, whether corresponding default rule are greater than with each N-dimensional T square statistic numerical value calculated in every group of characterisitic parameter group
Lattice information, wherein N is positive integer.
In one embodiment of this invention, the good of wafer to be measured is judged beyond spec characteristic parameter according to described at least one
Rate includes the following steps: to be classified as one beyond parameter of regularity list, for using beyond spec characteristic parameter item for described at least one
Person judges whether this wafer to be measured is abnormal.
From the point of view of another angle, the present invention proposes a kind of changeable quantity measuring method of wafer conformity testing, is suitable for wafer
In conformity testing system, this multivariable judgment method includes the following steps: to obtain wafer to be measured after carrying out wafer conformity testing
Generated multiple characterisitic parameters.A point group is carried out to these characterisitic parameters according to dependency list, to form multiple groups characterisitic parameter
Group；It is calculated in every group of characterisitic parameter group corresponding to one of these characterisitic parameters or combinations thereof with multi-variables analysis
Analysis numerical value whether be greater than default specification information corresponding to one of these characterisitic parameters or combinations thereof, will be greater than
One of these characterisitic parameters corresponding to the analysis numerical value of the default specification information or combinations thereof, which are used as, at least one to be surpassed
Spec characteristic parameter out；And it is whether qualified to detect this wafer to be measured beyond spec characteristic parameter according to described at least one.
Based on above-mentioned, the yield judgment method of the wafer of the embodiment of the present invention and the multivariable detection of wafer conformity testing
Multiple WAT characterisitic parameters with correlation are carried out a point group by method, and using multivariate statistics algorithm (for example, Huo Delin T
Square statistic) it tests to every character parameter, to filter out multiple WAT characterisitic parameters beyond preset range.Such as
This one, the embodiment of the present invention can be found as early as possible different by multivariable manufacturing process control technology and the auxiliary of hardware device
Normal WAT characterisitic parameter reduces research staff for the detection time of WAT characterisitic parameter, and can save and judge wafer to be measured
The testing cost of yield.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to cooperate attached drawing to make
Carefully it is described as follows.
Detailed description of the invention
Fig. 1 shows a kind of flow chart of the yield judgment method of wafer of one embodiment of the invention；
Fig. 2 shows the detail flowcharts of the generation dependency list of one embodiment of the invention；
Fig. 3 is two dimensional sample schematic diagram of two characterisitic parameters under multi-variables analysis；
Fig. 4 to fig. 6 shows one embodiment of the invention by using the analysis of experimental results of the yield judgment method of this wafer
Figure；
Fig. 7 shows a kind of flow chart of the changeable quantity measuring method of wafer conformity testing of one embodiment of the invention.
Description of symbols:
S110~S140, S210~S240, S710~S740: step；
310,320,330,410,510,610: region；
340: preset range；
Y1~Y5, Y1_310, Y2_320: characterisitic parameter；
360: the characterisitic parameter Y1_310 and Y2_320 point presented in region 330.
Specific embodiment
Fig. 1 shows a kind of flow chart of the yield judgment method of wafer of one embodiment of the invention.Referring to FIG. 1, so-called
Wafer be in semiconductor process to make semiconductor integrated circuit when carrier and material used.Each chip on wafer
It is then the product in semiconductor process.In order to save human cost, the yield of wafer described in the embodiment of the present invention
Judgment method and the changeable quantity measuring method of wafer conformity testing can be in by way of software (for example, application program)
It is existing, and the electronic equipment by having preferable hardware specification executes this software, to realize the embodiment of the present invention.This software
It is writable to be taken on media in non-volatile readable, e.g. equipment such as CD, mobile hard disk.It can also be with using the present embodiment person
The yield judgment method of wafer described in the embodiment of the present invention and the changeable quantity measuring method of wafer conformity testing are passed through solid
The mode of part or hardware is realized, and is not merely limited to this disclosure.
Illustrate the yield judgment method of wafer using the step process of Fig. 1 herein.In step s 110, to wafer to be measured
It carries out wafer conformity testing (WAT), to generate multiple characterisitic parameters.Wafer conformity testing can by one or more programs come
The relevant parameter of various electrical property and physical characteristic is obtained using as characterisitic parameter.These programs are, for example, wafer sequence (Wafer
Sort), wafer final test (Wafer finaltest), electronic circuit chip sequence (Electronic die sort) and
Circuit probe (Circuit Probe) etc..The present embodiment mainly comes to carry out the survey of wafer qualification to wafer to be measured with wafer probe
Examination.Other kinds of program can also be used using the present embodiment person to carry out wafer conformity testing.
After obtaining the characterisitic parameter, due to having correlation between many WAT characterisitic parameters, if will
These WAT characterisitic parameters with correlation are divided into same group, and in these group internals with multivariable manufacturing process control
It is if the whole yield judgement with wafer of system for making (MSPC) Lai Jinhang WAT characterisitic parameter, then more efficient.Signified " WAT herein
Correlation between characterisitic parameter " can be these WAT characterisitic parameters positive relevance, negative relevance or statistically each other
Any correlation.Therefore, in the step s 120, the embodiment of the present invention is according to a dependency list to these characteristics
Parameter carries out a point group, to form multiple groups characterisitic parameter group.Dependency list can be set by the experience of user in advance
Fixed output quota is raw, can also be obtained by the mass data of WAT characterisitic parameter with counting.
Fig. 2 shows the detail flowcharts of the generation dependency list of one embodiment of the invention.Referring to figure 2., in step
In S210, user can be according to its experience will have the characterisitic parameter of correlation to record.Then, in step S240,
The characterisitic parameter with correlation that these have been recorded is integrated into dependency list.It on the other hand, can also in step S220
To count considerable wafer generated characterisitic parameter after carrying out above-mentioned wafer conformity testing, whether to analyze these characterisitic parameters
With correlation.When obtaining doubtful multiple relevant featuring parameters with correlation by statistical, just enter step
Doubtful these relevant featuring parameters with correlation can be formed list and be supplied to user's viewing by S230, allow user
Judge whether these doubtful these relevant featuring parameters with correlation are really related.When user judges according to its experience
These relevant featuring parameters have correlation really, then enter step S240 from step S230, to integrate these with correlation
These characterisitic parameters and form dependency list.
With continued reference to FIG. 1, after these characterisitic parameters are divided into multiple groups characterisitic parameter group according to dependency list,
In step S130, one of these characterisitic parameters or its group in every group of characterisitic parameter group are just calculated with multi-variables analysis
Corresponding analysis numerical value is closed, then more above-mentioned analysis numerical value and preset specification information, use and judge every group of characterisitic parameter
Whether one of these characterisitic parameters or combinations thereof are beyond default specification in group.
Illustrate why to need to come with multi-variables analysis to these characteristics ginseng in every group of characterisitic parameter group with Fig. 3 at this
Number carries out the yield judgement of wafer.Fig. 3 is two dimensional sample schematic diagram of two characterisitic parameters under multi-variables analysis.It is said for simplification
Bright, Fig. 3 only has two characterisitic parameters Y1 and Y2 of multiple sample wafers.Characterisitic parameter Y1 is presented in region 310, and characteristic
Parameter Y2 is presented in region 320.Region 310 and region 320 indicate characterisitic parameter Y1 and characterisitic parameter Y2 default respectively
Maximum value, minimum value and median in range.Whereby, if the mode of univariate analysis comes analytical characteristics parameter Y1 and characteristic ginseng
Number Y2, then these sample wafers should all meet.But if characterisitic parameter Y1 and characterisitic parameter Y2 are indicated with negative relevance
When mode is presented in region 330, then it can find that the characterisitic parameter Y1_310 and Y2_320 of a certain sample wafer is in region 330
Existing point 360 is not in the preset range 340 of characterisitic parameter Y1 and characterisitic parameter Y2 as two-dimentional variable, knows this whereby
Sample wafer may be problematic and needs are scrapped.Therefore, multi-variables analysis can promote the judgement precision for wafer yield,
And problematic wafer to be measured can be being obtained easily by meeting the yield judgment method of the embodiment of the present invention.
Fig. 1 is returned to, in the present embodiment, " multi-variables analysis " of meaning of the embodiment of the present invention can be to count algorithm
In Huo Delin T square statistic (Hotelling's T-squared statistic) Lai Shixian.However, multi-variables analysis can
To be realized by a variety of implementations and statistical algorithm, it is flat that the embodiment of the present invention is not limited to Huo Delin T
Fang Tongji.The step S130 of the present embodiment can be subdivided into multiple detailed steps S132~S138, and herein by every group of characteristic
Each characterisitic parameter is considered as different variables in parameter group.Huo Delin T square statistic is referred to as being MYT algorithm,
Using chosen variable the specified criteria the case where under T squares of (T is carried out to its dependent variable respectively2) value calculating.Then, will
This T2Value (is denoted as T with the default gauge number under given the same termsspec) be compared, it uses and judges that these are chosen
Whether variable exceeds preset range (OOS).If T corresponding to these chosen variables2Value is all without departing from preset range, then to pass
The method of analysis is returned to select other chosen variables in order, and repeats above-mentioned process until being selected the corresponding T of variable2
Value is beyond until preset range.Whereby, the T beyond preset range can be passed through2Its in the corresponding characterisitic parameter of value is wherein
One or a combination set of judge the yield of wafer.
Each details process of step S132~S138 is described in detail herein.In step S132, every group of spy is sequentially set
It is wherein N number of as chosen variable in these characterisitic parameters in property parameter group.N is positive integer, and N can be started counting from 1, and
The maximum value of N is the quantity of multiple characterisitic parameters in this group of characterisitic parameter group.In the present embodiment, each characterisitic parameter is claimed
For different dimensions, and when one of characterisitic parameter is given condition, the T that is calculated at this time2Value is known as 1 dimension T2Statistics
Numerical value；When two of them characterisitic parameter is given condition, the T that is calculated at this time2Value is known as 2 dimension T2Statistic, and according to this
Analogize.In step S133, using chosen variable the specified criteria the case where under calculate in every group of characterisitic parameter group
Each N-dimensional T2Statistic.By Huo Delin T square statistic algorithm or the embodiment of the present invention can be met using the present embodiment person
Other statistics algorithms learn T2The calculation of statistic.In step S134, each N-dimensional T is judged2Statistical number
Whether value is greater than corresponding preset rules information (Tspec).If N-dimensional T at this time2Statistic is all not greater than corresponding default
Rule Information then enters step S135 from step S134, judges whether N is equal to the maximum value (maximum value of N namely group of N
The quantity of multiple characterisitic parameters in characterisitic parameter group).If N and when being not equal to its maximum value, with by N value from step S136
Add one, and repeats the corresponding process of step S132~S136.Relatively, if N is equal to its maximum value, then it represents that in the group
T corresponding to one of multiple characterisitic parameters or combinations thereof in characterisitic parameter group2Value is all without OOS, thus from step
S135 enters step S137, to judge that the yield of this wafer to be measured is good.
If one of N-dimensional T2Statistic is greater than corresponding preset rules information (Tspec) when, then enter from step S134
Step S138 will be greater than above-mentioned default specification information (Tspec) analysis numerical value (T2Statistic) corresponding to the characteristic ginseng
One of number or combinations thereof is regarded as being at least one beyond spec characteristic parameter.Stated differently, since these characteristics are joined
Analysis numerical value corresponding to one of number or combinations thereof has been above preset rules information (Tspec), indicate that these characteristics are joined
One of number or combinations thereof has exceeded preset rules (OOS).Whereby, the embodiment of the present invention just will exceed preset rules
(OOS) one of these these characterisitic parameters or combinations thereof are set to beyond spec characteristic parameter.Implement in part
In example, Huo Delin T square statistic algorithm can also be by all analysis numerical value (T under chosen variable2Statistic) it carries out
Aggregation, and this aggregation value is compared with presupposed information, it uses and judges whether the analysis numerical value under this chosen variable still has
Other analysis numerical value are excessively significant and possible problematic.If the aggregation value of the analysis numerical value under chosen variable is considered still asking
It inscribes (or whether aggregation value is significant thus), then the embodiment of the present invention can continue to execute step S132~S138, use acquisition
More exceed spec characteristic parameter.System of the embodiment of the present invention simply describes essence of the invention with above-mentioned steps S132~S138
Mind, using the present embodiment person can the step according to its demand in any set-up procedure S132~S138 carry out precedence, and
It is not merely limited to the disclosure above.
In step S140, the good of this wafer to be measured just is judged beyond spec characteristic parameter according to these above-mentioned found out
Rate.In the present embodiment, step S140 can be by a variety of practices to judge this crystalline substance to be measured beyond spec characteristic according to these
Round yield.One of practice can be, by these beyond spec characteristic parameter by wafer conformity testing judge system come
It calculates, and the calculation judging result of system is judged to judge whether this wafer to be measured is abnormal by wafer conformity testing.Separately
A kind of as rule is that these spec characteristic parameter items are classified as to a list (for example, beyond parameter of regularity list), allows user
Judge whether these WAT characterisitic parameters are abnormal, use the yield for judging this wafer to be measured according to its experience.
Fig. 4 to fig. 6 shows one embodiment of the invention by using the analysis of experimental results of the yield judgment method of this wafer
Figure.Characterisitic parameter Y3, Y4 and Y5 of wafer is presented in fig. 4 to fig. 6 respectively.Marking SpecH and SpecL is this special parameter respectively
Maximum value (e.g. 4.1, -10 and 1) and minimum value in the corresponding preset range of characterisitic parameter Y3, Y4 and Y5
(e.g. 2.3, -40 and 0.9).Whereby, it is found that if being sentenced by previous univariate analysis from region 410,510,610
When the yield of disconnected wafer, since the characterisitic parameter Y3 and Y4 in region 410,510 are all located in preset range and it will be considered that these
The yield of wafer is preferred, and the characterisitic parameter Y5 in region 610 is not in preset range.However, if being come with the analysis of volume variation
When judging the yield of wafer, these numerical value in region 410,510 actually can because of its dependent variable (e.g., characterisitic parameter Y5) and
Beyond preset range.
For another angle, the embodiment of the present invention proposes a kind of changeable quantity measuring method of wafer conformity testing, is applicable in
In wafer conformity testing system.This wafer conformity testing system may include to measure each WAT electrical parameter of wafer
Test platform and the computing module to execute this changeable quantity measuring method.This operation mould group can pass through the step process of Fig. 7
To realize the embodiment of the present invention.Fig. 7 shows a kind of changeable quantity measuring method of wafer conformity testing of one embodiment of the invention
Flow chart.In step S710, operation mould group obtains wafer to be measured and is being surveyed by above-mentioned test platform with carrying out this wafer qualification
Generated multiple characterisitic parameters after examination.In step S720, operation mould group according to dependency list to these characterisitic parameters into
Row divides group, to form multiple groups characterisitic parameter group.In step S730, operation mould group calculates every group of characteristic with multi-variables analysis
Analysis numerical value corresponding to one of these characterisitic parameters or combinations thereof in parameter group judges whether this analysis numerical value is big
Default specification information corresponding to one of these characterisitic parameters or combinations thereof, will be greater than this default specification information
One of these characterisitic parameters corresponding to this analysis numerical value or combinations thereof exceed spec characteristic parameter as at least one.
In step S740, whether at least one is qualified to detect this wafer to be measured beyond spec characteristic parameter according to this for operation mould group.
The details process of step S710~S740 please refers to above-described embodiment.
In conclusion the yield judgment method of the wafer of the embodiment of the present invention and the multivariable detection of wafer conformity testing
Multiple WAT characterisitic parameters with correlation are carried out a point group by method, and using multivariate statistics algorithm (for example, Huo Delin T
Square statistic) it tests to every character parameter, to filter out multiple WAT characterisitic parameters beyond preset range.Such as
This one, the embodiment of the present invention can be found as early as possible different by multivariable manufacturing process control technology and the auxiliary of hardware device
Normal WAT characterisitic parameter reduces research staff for the detection time of WAT characterisitic parameter, and can save and judge wafer to be measured
The testing cost of yield.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (12)
1. a kind of yield judgment method of wafer characterized by comprising
Wafer conformity testing is carried out to wafer to be measured, to generate multiple characterisitic parameters；
A point group is carried out to those characterisitic parameters according to dependency list, to form multiple groups characterisitic parameter group；
It is calculated in every group of characterisitic parameter group corresponding to one of those characterisitic parameters or combinations thereof with multi-variables analysis
Analysis numerical value, judge whether the analysis numerical value is greater than default rule corresponding to one of those characterisitic parameters or combinations thereof
Lattice information, will be greater than one of those characterisitic parameters corresponding to the analysis numerical value of the default specification information or its group
Cooperation is at least one beyond spec characteristic parameter；And
According at least one yield for judging the wafer to be measured beyond spec characteristic parameter.
2. the yield judgment method of wafer according to claim 1, which is characterized in that further include:
Multiple and different wafers those generated characterisitic parameters after carrying out the wafer conformity testing are counted, to analyze those characteristics
Whether parameter has correlation；And
The dependency list is generated according to having multiple relevant featuring parameters of the correlation.
3. the yield judgment method of wafer according to claim 1, which is characterized in that further include:
Multiple relevant featuring parameters in those characterisitic parameters with correlation are recorded, to form the dependency list.
4. the yield judgment method of wafer according to claim 1, which is characterized in that the multi-variables analysis is with Huo Delin T
Square statistic sequentially calculates one of those characterisitic parameters or combinations thereof in every group of characterisitic parameter group.
5. the yield judgment method of wafer according to claim 4, which is characterized in that calculate in every group of characterisitic parameter group
The analysis numerical value corresponding to one of those characterisitic parameters or combinations thereof includes the following steps:
Sequentially set in every group of characterisitic parameter group it is N number of as chosen variable in those characterisitic parameters, to calculate every group of spy
Each N-dimensional T square statistic numerical value in property parameter group；
Judge whether each N-dimensional T square statistic numerical value is greater than the corresponding default specification information, wherein N is positive integer.
6. the yield judgment method of wafer according to claim 1, which is characterized in that at least one special beyond specification according to this
Property parameter judges that the yield of the wafer to be measured includes the following steps:
This at least one is classified as beyond parameter of regularity list beyond spec characteristic parameter item, so that user judges the wafer to be measured
It is whether abnormal.
7. a kind of changeable quantity measuring method of wafer conformity testing, suitable for wafer conformity testing system, which is characterized in that should
Multivariable judgment method includes:
Obtain wafer to be measured generated multiple characterisitic parameters after carrying out wafer conformity testing；
A point group is carried out to those characterisitic parameters according to dependency list, to form multiple groups characterisitic parameter group；
It is calculated in every group of characterisitic parameter group corresponding to one of those characterisitic parameters or combinations thereof with multi-variables analysis
Analysis numerical value, judge whether the analysis numerical value is greater than default rule corresponding to one of those characterisitic parameters or combinations thereof
Lattice information, will be greater than one of those characterisitic parameters corresponding to the analysis numerical value of the default specification information or its group
Cooperation is at least one beyond spec characteristic parameter；And
According to this at least one beyond spec characteristic parameter it is whether qualified to detect the wafer to be measured.
8. changeable quantity measuring method according to claim 7, which is characterized in that further include:
Multiple and different wafers those generated characterisitic parameters after carrying out the wafer conformity testing are counted, to analyze those characteristics
Whether parameter has correlation；And
The dependency list is generated according to having multiple relevant featuring parameters of the correlation.
9. changeable quantity measuring method according to claim 7, which is characterized in that further include:
Multiple relevant featuring parameters in those characterisitic parameters with correlation are recorded, to form the dependency list.
10. changeable quantity measuring method according to claim 7, which is characterized in that the multi-variables analysis is flat with a Huo Delin T
Fang Tongji sequentially calculates one of those characterisitic parameters or combinations thereof in every group of characterisitic parameter group.
11. changeable quantity measuring method according to claim 10, which is characterized in that calculating should in every group of characterisitic parameter group
The analysis numerical value corresponding to one of a little characterisitic parameters or combinations thereof includes the following steps:
Sequentially set it is N number of as variable in those characterisitic parameters in every group of characterisitic parameter group, to calculate every group of characterisitic parameter
Whether each N-dimensional T square statistic numerical value in group is greater than the corresponding default specification information, and wherein N is positive integer.
12. changeable quantity measuring method according to claim 7, which is characterized in that according to this at least one exceed spec characteristic
Parameter judges that the yield of the wafer to be measured includes the following steps:
This at least one is classified as beyond spec characteristic parameter item beyond parameter of regularity list, so that user passes through according to its user
Test to judge whether the wafer to be measured is qualified.
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| CN109426655B (en) * | 2017-08-22 | 2021-10-15 | 合肥捷达微电子有限公司 | Data analysis method and device, electronic equipment and computer readable storage medium |
| CN107968057B (en) * | 2017-11-22 | 2020-04-24 | 上海华力微电子有限公司 | Wafer retesting method |
| CN110968984B (en) * | 2018-09-28 | 2022-12-09 | 长鑫存储技术有限公司 | Integrated circuit process analysis system and method |
| CN109741779B (en) * | 2018-12-29 | 2020-10-16 | 西安紫光国芯半导体有限公司 | Method for dynamically adjusting test conditions in wafer test process |
| CN110146798B (en) * | 2019-03-29 | 2021-04-09 | 福建省福联集成电路有限公司 | Automatic analysis method and system for failure core particles |
| CN114247661B (en) * | 2020-09-24 | 2023-04-28 | 长鑫存储技术有限公司 | Semiconductor product grading method and grading system |
| CN115032493B (en) * | 2022-07-15 | 2023-10-13 | 扬州晶新微电子有限公司 | Wafer testing method and system based on tube core parameter display |
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| TW201432479A (en) * | 2013-02-07 | 2014-08-16 | Foresight Technology Company Ltd | Method for searching and analyzing process parameters and computer program product thereof |
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