CN105700747A - Jointing method of curved touch panel and flexible circuit board - Google Patents

Jointing method of curved touch panel and flexible circuit board Download PDF

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Publication number
CN105700747A
CN105700747A CN201610013914.0A CN201610013914A CN105700747A CN 105700747 A CN105700747 A CN 105700747A CN 201610013914 A CN201610013914 A CN 201610013914A CN 105700747 A CN105700747 A CN 105700747A
Authority
CN
China
Prior art keywords
circuit board
flexible circuit
contact panel
curved surface
surface contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610013914.0A
Other languages
Chinese (zh)
Other versions
CN105700747B (en
Inventor
王志胜
林惠燕
王雅萍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TPK Touch Solutions Xiamen Inc
Original Assignee
TPK Touch Solutions Xiamen Inc
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Filing date
Publication date
Application filed by TPK Touch Solutions Xiamen Inc filed Critical TPK Touch Solutions Xiamen Inc
Priority to CN201610013914.0A priority Critical patent/CN105700747B/en
Publication of CN105700747A publication Critical patent/CN105700747A/en
Application granted granted Critical
Publication of CN105700747B publication Critical patent/CN105700747B/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Abstract

The invention discloses a joint method of a curved touch panel and a flexible printed circuit board. The method comprises following steps of S10, placing conductive adhesive in the joint area of the curved touch panel; S20, bending the flexible printed circuit board, wherein the bended flexible printed circuit board has a joint area and a non-joint area; S40, laminating the joint area of the bended flexible printed circuit board and the joint area of the curved touch panel, wherein the connection mat of the joint area of the bended flexible printed circuit board and the joint mat of the curved touch panel are communicated through the conductive adhesive. Through adoption of the joint method provided by the invention, the flexible printed circuit board is prevented from generating size offset in the joint process; and the flexible printed circuit board and the curved touch panel are jointed effectively.

Description

A kind of method that curved surface contact panel is fitted with flexible circuit board
Technical field
The method that the present invention relates to the laminating of a kind of contact panel and flexible circuit board, specifically, relates to a kind of by method to fit in curved surface contact panel after flexible circuit board bending forming。
Background technology
In recent years, mobile phone, Vehicular guidance system, pocket computer, computer etc. have the electronic equipment of touch-control input function and are widely used, and these products are commonly provided with contact panel。Contact panel of the prior art can be resistance-type, condenser type, infrared induction, induction, sound wave vicarious etc.。
For example, as shown in Figure 1, capacitance type touch-control panel 1 can be defined a Touch Zone 100V and be positioned at the surrounding zone 100B of at least side, this Touch Zone, multiple touch-control sensing unit 10 may be disposed at Touch Zone 100V, and multiple first joint sheets 11 being connected with described touch-control sensing unit 10 and multiple second joint sheet 12 may be disposed at surrounding zone 100B。Each touch-control sensing unit 1010 can pass through first joint sheet 11 of surrounding zone 100B and the second joint sheet 12 couples with the connection gasket 21 of a flexible circuit board 2 respectively, and then touch-control sensing unit 1010 is electrically connected to flexible circuit board 2, the control circuit of welding system in addition。
In traditional plane contact panel, the joint of the joint sheet of the connection gasket of flexible circuit board 2 and contact panel 1 has been mature technology。As shown in Figure 2 a, directly adopt hot pressing pressure head 4 pressing flexible circuit board 2 on the conducting resinl 3 of contact panel 1, make the circuit of flexible circuit board 2 and contact panel 1 be turned on by conducting resinl 3。
Along with popularizing of smart electronics product, the application of curved surface contact panel is more and more extensive, as shown in Figure 2 b, when the flexible circuit board of traditional plane contact panel is fixed and interconnection technique is applied in curved surface contact panel 1 ', when hot pressing pressure head is pressed for 4 times, flexible circuit board 2 can occur bending and deformation, the microscope carrier of flexible circuit board 2 cannot fix flexible circuit board 2 well, and cause flexible circuit board 2 size offset, cannot be directed at conducting resinl 3, produce the problem that curved surface contact panel 1 ' can not effectively be connected with flexible circuit board 2。
Below only illustrate with the combination of flexible circuit board with curved surface contact panel, the problem being easily generated size offset when there is also above-mentioned laminating in the process that other workpiece to be formed combines with curved surface。
Summary of the invention
Present invention aim to address the problem that the applying method of existing flexible circuit board is not suitable for curved surface contact panel, there is provided a kind of curved surface contact panel and flexible circuit board to carry out the method fitted, fit in curved surface contact panel again by after flexible circuit board bending forming。
To achieve these goals, the curved surface contact panel of the present invention comprises the steps: with the method for flexible circuit board laminating
S10, is placed in the bonding land of curved surface contact panel by conducting resinl;
S20, carries out bending forming by flexible circuit board, and the flexible circuit board after bending forming is formed with conformable region and non-conformable region;
S40, is turned on the joint sheet of the bonding land of the bonding land pressing of the conformable region of the flexible circuit board after bending forming Yu curved surface contact panel, the connection gasket of the conformable region of the flexible circuit board after bending forming and curved surface contact panel by conducting resinl。
In one embodiment of the method that above-mentioned curved surface contact panel is fitted with flexible circuit board, further comprise the steps of: between described step S20 and step S40
S30, conforms in advance by the conformable region of the flexible circuit board after bending forming on the conducting resinl of bonding land of curved surface contact panel。
Above-mentioned curved surface contact panel is with an embodiment of the method for flexible circuit board laminating, and described step S20 also comprises the steps:
Flexible circuit board is crossed bending forming, then makes flexible circuit board recoil to required angle。
Above-mentioned curved surface contact panel is with an embodiment of the method for flexible circuit board laminating, and described step S30 also comprises the steps:
S31, adopts the flexible circuit board after the pre-pressing pressure head absorption bending forming with vac sorb。
Above-mentioned curved surface contact panel is with an embodiment of the method for flexible circuit board laminating, and described step S30 also comprises the steps:
S32, before carrying out laminating in advance, is directed at location to the conformable region of the flexible circuit board after bending forming with the bonding land of curved surface contact panel。
Above-mentioned curved surface contact panel is with an embodiment of the method for flexible circuit board laminating, and described step S30 also comprises the steps:
S33, forces in pre-pressing pressure head by a pressing pressure head, fits in advance with the bonding land by the conformable region of the flexible circuit board after bending forming Yu curved surface contact panel。
Above-mentioned curved surface contact panel is with an embodiment of the method for flexible circuit board laminating, and described step S31 also comprises the steps:
Pre-pressing pressure head adsorbs the conformable region of the flexible circuit board after bending forming and non-conformable region simultaneously。
Above-mentioned curved surface contact panel is with an embodiment of the method for flexible circuit board laminating, and described step S40 also comprises the steps:
Use malleation combined pressure head by the complete pressing in bonding land of the conformable region of the flexible circuit board after bending forming Yu curved surface contact panel, the composition surface of the conformable region of described malleation combined pressure head and flexible circuit board has the first height and the second height, first height is less than the second height, there is the region of pad region periphery in the conformable region of the first composition surface correspondence flexible circuit board highly, there is the pad region in the correspondence conformable region, composition surface of the second height with connection gasket。
Above-mentioned curved surface contact panel is with an embodiment of the method for flexible circuit board laminating, and the length of the connection gasket in the conformable region of flexible circuit board is 0.1~0.5mm。
Above-mentioned curved surface contact panel is with an embodiment of the method for flexible circuit board laminating, and described curved surface contact panel includes a reeded cover plate of tool, and the bonding land of described curved surface contact panel is positioned at described groove。
Above-mentioned curved surface contact panel is with an embodiment of the method for flexible circuit board laminating, and described depth of groove is be more than or equal to 0.2mm。
The beneficial functional of the present invention is in that, adopt the applying method of the present invention it can be avoided that size offset occurs flexible circuit board when engaging, ensure that flexible circuit board effectively engages with curved surface contact panel, particularly less in flexible circuit board land area, and/or curved surface contact panel groove deeper when, adopt and first bend flexible circuit board, flexible circuit board and curved surface contact panel after pressing bending again, it is possible to effective fixing and realize the joint of flexible circuit board and curved surface contact panel accurately。
Following connection with figures and specific embodiment describe the present invention, but not as a limitation of the invention。
Accompanying drawing explanation
Fig. 1 is the structural representation of contact panel。
Fig. 2 a is plane contact panel and flexible circuit board laminating schematic diagram。
Fig. 2 b is the schematic diagram of application prior art laminating curved surface contact panel and flexible circuit board。
Fig. 3 is the structural representation after using the applying method of the present invention to fit。
Fig. 4 is the block diagram of the applying method of the present invention。
Fig. 5 is the operation chart of the S10 of the applying method of the present invention。
Fig. 6 is the operation chart of the S20 of the applying method of the present invention。
Fig. 7 is the operation chart of the S30 of the applying method of the present invention。
Fig. 8 is the operation chart of the S40 of the applying method of the present invention。
Fig. 9 is the concrete steps figure of the S30 of the applying method of the present invention。
Figure 10 be the applying method of the present invention S40 in the structural representation of malleation combined pressure head。
Wherein, accompanying drawing labelling
In prior art:
1 contact panel
100V Touch Zone
100B surrounding zone
10 touch-control sensing unit
11 first joint sheets
12 second joint sheets
2 flexible circuit boards
21 connection gaskets
3 conducting resinls
4 hot pressing pressure heads
In the present invention:
S10-S40, S31-S33 step
300 flexible circuit boards
330 conformable regions
340 non-conformable regions
400 curved surface contact panels
410 bonding lands
500 conducting resinls
Y1 pre-pressing pressure head
Y2 malleation combined pressure head
S1 composition surface
S2 composition surface
H1 the first height
H2 the second height
Detailed description of the invention
Technical solution of the present invention is described in detail by connection with figures and specific embodiment below, to be further understood that the purpose of the present invention, scheme and effect, but is not intended as the restriction of claims protection domain of the present invention。
The curved surface contact panel of the present invention and the contact panel that the curved surface contact panel in the applying method of flexible circuit board is such as 2.5D or 3D。As it is shown on figure 3, curved surface contact panel 400 is 2.5D, contact panel 400 includes a cover plate, and the side of cover plate is bending relative to first type surface, therefore the side of cover plate and first type surface make cover plate be formed with a groove。The touch-control sensing unit (not shown) of curved surface contact panel 400 is usually located at the groove side of cover plate, for instance be formed directly in groove surfaces, and the bonding land that touch-control sensing unit is corresponding is positioned at groove the side of contiguous cover plate。Flexible circuit board 300 usually plane, although having certain pliability, but still there is certain hardness, when engaging with curved surface contact panel 400, easily there is size offset and conducting resinl 500 cannot be passed through with the circuit of the bonding land of curved surface contact panel 400 and turn on。Particularly, when the area of the conformable region of flexible circuit board 300 is only small, the length of such as connection gasket is at about 0.1mm~0.5mm, and/or the depth of groove of cover plate is deeper, such as, when the degree of depth is be more than or equal to 0.2mm, flexible circuit board 300 is bigger with the joint difficulty of curved surface contact panel 400, if size slightly offsets, and the problem causing Joint failure most probably。
Adopt the applying method in the present invention, before joint, first flexible circuit board 300 is carried out bending forming, it is possible to avoid flexible circuit board 300 that size offset occurs when engaging, it is ensured that flexible circuit board 300 and curved surface contact panel 400 are effectively fitted。
As shown in Figure 4, the method that the curved surface contact panel of the present invention is fitted with flexible circuit board, comprise the steps:
S10, is placed in the bonding land 410 (as shown in Figure 5) of curved surface contact panel 400 by conducting resinl 500, and bonding land 410 has joint sheet, and the touching signals of curved surface contact panel 400 all can pass through joint sheet and outwards transmit。
S20, carries out bending forming (as shown in Figure 6) by flexible circuit board 300, and the flexible circuit board 300 after bending forming is formed with conformable region 330 and non-conformable region 340。Conformable region 330 has the connection gasket that the joint sheet of the bonding land 410 with curved surface contact panel 400 is corresponding。
S30, the conformable region 330 of the flexible circuit board 300 after bending forming is conformed on the conducting resinl 500 of the bonding land 410 of curved surface contact panel 400 (as shown in Figure 7) by use pre-pressing pressure head Y1 in advance;
S40, use malleation combined pressure head Y2 by the complete pressing (such as Fig. 8) in bonding land 410 of the conformable region 330 of flexible circuit board 300 with curved surface contact panel 400, the joint sheet of the connection gasket of the conformable region 330 of flexible circuit board 300 and the bonding land 410 of curved surface contact panel 400 is turned on by conducting resinl 500, the touching signals of curved surface contact panel 400 is transferred to flexible circuit board 300 by joint sheet, and touching signals is passed to controller by flexible circuit board 300 again。
In conjunction with Fig. 6, in one embodiment, in above-mentioned steps S20, during bending forming flexible circuit board 300, first flexible circuit board 300 can be crossed bending forming, such as 30 degree, then utilize the resilience force of flexible circuit board 300 self to make it recoil to the angle of applicable 2.5D contact panel laminating。
Consulting Fig. 9, in one embodiment, above-mentioned steps S30 also comprises the steps:
S31, the flexible circuit board 300 after adopting the pre-pressing pressure head Y1 with vac sorb to adsorb bending forming。
S32, before carrying out laminating in advance, is directed at location to the conformable region 330 of the flexible circuit board 300 after bending forming with the bonding land 410 of curved surface contact panel 400。
S33, forces in pre-pressing pressure head Y1 by malleation combined pressure head Y2, carries out laminating (as shown in Figure 7) in advance with the bonding land 410 by the conformable region 330 of flexible circuit board 300 with curved surface contact panel 400。
Wherein, also comprise the steps: that pre-pressing pressure head Y1 adsorbs the conformable region 330 of the flexible circuit board 300 after bending forming and non-conformable region 340 simultaneously in conjunction with Fig. 7, described step S31。Particularly when the area of the conformable region 330 of flexible circuit board 300 is only small, the size of connection gasket is limited especially, the absorption affinity of pre-pressing pressure head Y1 is also limited, in order to improve the reliability of absorption, pre-pressing pressure head Y1 adsorbs conformable region 330 and the non-conformable region 340 of flexible circuit board 300 simultaneously, to strengthen absorption affinity, with relatively reliable fixing flexible circuit board 300。
Separately, in one embodiment, the height of the pad region with connection gasket of the conformable region 330 of flexible circuit board 300 is less than the height of the neighboring area being positioned at pad region in conformable region 330, in order to ensure that when positive pressing the connection gasket of the bonding land 410 of the joint sheet of conformable region 330 and curved surface contact panel 400 can completely closely pressing, described step S40 also comprises the steps: that the composition surface of the conformable region 330 of malleation combined pressure head Y2 and flexible circuit board 300 has the first height and the second height, first height is less than the second height, there is the region of pad region periphery in the conformable region 330 of the first composition surface correspondence flexible circuit board 300 highly, there is the pad region in the correspondence conformable region, composition surface 330 of the second height with connection gasket。
As shown in Figure 10, malleation combined pressure head Y2 can have the composition surface S1 and composition surface S2 of notch cuttype, and the height of faying face S1 is H1, and the height of faying face S2 is H2, H1 less than H2, and namely the height of the relative composition surface S1 of composition surface S2 is high。Having the pad region of connection gasket in the conformable region 330 of faying face S2 pressing flexible circuit board 300, composition surface S1 is for the region of pad region periphery in the conformable region 330 of pressing flexible circuit board 300。
Certainly; the present invention also can have other various embodiments; when without departing substantially from present invention spirit and essence thereof; those of ordinary skill in the art are when can make various corresponding change and deformation according to the present invention, but these change accordingly and deformation all should belong to the scope of the claims appended by the present invention。

Claims (11)

1. the method that a curved surface contact panel is fitted with flexible circuit board, it is characterised in that comprise the steps:
S10, is placed in the bonding land of curved surface contact panel by conducting resinl;
S20, carries out bending forming by flexible circuit board, and the flexible circuit board after bending forming is formed with conformable region and non-conformable region;
S40, is turned on the joint sheet of the bonding land of the bonding land pressing of the conformable region of the flexible circuit board after bending forming Yu curved surface contact panel, the connection gasket of the conformable region of the flexible circuit board after bending forming and curved surface contact panel by conducting resinl。
2. the method that curved surface contact panel according to claim 1 is fitted with flexible circuit board, it is characterised in that further comprise the steps of: between described step S20 and step S40
S30, conforms in advance by the conformable region of the flexible circuit board after bending forming on the conducting resinl of bonding land of curved surface contact panel。
3. the method that curved surface contact panel according to claim 1 is fitted with flexible circuit board, it is characterised in that described step S20 also comprises the steps:
Flexible circuit board is crossed bending forming, then makes flexible circuit board recoil to required angle。
4. the method that curved surface contact panel according to claim 2 is fitted with flexible circuit board, it is characterised in that described step S30 also comprises the steps:
S31, adopts the flexible circuit board after the pre-pressing pressure head absorption bending forming with vac sorb。
5. the method that curved surface contact panel according to claim 4 is fitted with flexible circuit board, it is characterised in that described step S30 also comprises the steps:
S32, before carrying out laminating in advance, is directed at location to the conformable region of the flexible circuit board after bending forming with the bonding land of curved surface contact panel。
6. the method that curved surface contact panel according to claim 4 is fitted with flexible circuit board, it is characterised in that described step S30 also comprises the steps:
S33, forces in pre-pressing pressure head by a pressing pressure head, fits in advance with the bonding land by the conformable region of the flexible circuit board after bending forming Yu curved surface contact panel。
7. the method that curved surface contact panel according to claim 4 is fitted with flexible circuit board, it is characterised in that described step S31 also comprises the steps:
Pre-pressing pressure head adsorbs the conformable region of the flexible circuit board after bending forming and non-conformable region simultaneously。
8. the method that curved surface contact panel according to claim 1 is fitted with flexible circuit board, it is characterised in that described step S40 also comprises the steps:
Use malleation combined pressure head by the complete pressing in bonding land of the conformable region of the flexible circuit board after bending forming Yu curved surface contact panel, the composition surface of the conformable region of described malleation combined pressure head and flexible circuit board has the first height and the second height, first height is less than the second height, there is the region of pad region periphery in the conformable region of the first composition surface correspondence flexible circuit board highly, there is the pad region in the correspondence conformable region, composition surface of the second height with connection gasket。
9. the method that curved surface contact panel according to claim 1 is fitted with flexible circuit board, it is characterised in that the length of the connection gasket in the conformable region of flexible circuit board is 0.1~0.5mm。
10. the method that curved surface contact panel according to claim 1 is fitted with flexible circuit board, it is characterised in that described curved surface contact panel includes a reeded cover plate of tool, and the bonding land of described curved surface contact panel is positioned at described groove。
11. the method that curved surface contact panel according to claim 1 is fitted with flexible circuit board, it is characterised in that described depth of groove is be more than or equal to 0.2mm。
CN201610013914.0A 2016-01-08 2016-01-08 Jointing method of curved touch panel and flexible circuit board Active CN105700747B (en)

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Application Number Priority Date Filing Date Title
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CN105700747B CN105700747B (en) 2017-03-22

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107422918A (en) * 2017-08-04 2017-12-01 业成科技(成都)有限公司 Touch-control sensing structure and preparation method thereof
CN108304097A (en) * 2018-04-13 2018-07-20 业成科技(成都)有限公司 Curved surface touch module structure and its applying method
TWI631498B (en) * 2017-08-07 2018-08-01 Interface Technology (Chengdu) Co., Ltd. Touch panel
CN108664158A (en) * 2017-03-29 2018-10-16 宸美(厦门)光电有限公司 Touch control display
CN108693998A (en) * 2018-05-11 2018-10-23 武汉华星光电半导体显示技术有限公司 Application of a surface device and application of a surface method
CN110174965A (en) * 2019-05-09 2019-08-27 业成科技(成都)有限公司 Narrow frame touch panel
CN110197618A (en) * 2019-06-28 2019-09-03 云谷(固安)科技有限公司 A kind of applying method of curved face display panel

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CN102508576A (en) * 2011-11-14 2012-06-20 友达光电(厦门)有限公司 Touch panel and manufacturing method for touch panel
CN204155238U (en) * 2014-10-15 2015-02-11 江西合力泰科技有限公司 All-transparent Rimless touch-screen
CN104777949A (en) * 2014-01-09 2015-07-15 广达电脑股份有限公司 Capacitive touch panel

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CN1979268A (en) * 2005-12-08 2007-06-13 群康科技(深圳)有限公司 Mfg. apparatus for liquid crystal display device and method thereof
CN102508576A (en) * 2011-11-14 2012-06-20 友达光电(厦门)有限公司 Touch panel and manufacturing method for touch panel
CN104777949A (en) * 2014-01-09 2015-07-15 广达电脑股份有限公司 Capacitive touch panel
CN204155238U (en) * 2014-10-15 2015-02-11 江西合力泰科技有限公司 All-transparent Rimless touch-screen

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108664158A (en) * 2017-03-29 2018-10-16 宸美(厦门)光电有限公司 Touch control display
CN108664158B (en) * 2017-03-29 2023-10-20 宸美(厦门)光电有限公司 touch display
CN107422918A (en) * 2017-08-04 2017-12-01 业成科技(成都)有限公司 Touch-control sensing structure and preparation method thereof
CN107422918B (en) * 2017-08-04 2020-12-08 业成科技(成都)有限公司 Touch sensing structure and manufacturing method thereof
TWI631498B (en) * 2017-08-07 2018-08-01 Interface Technology (Chengdu) Co., Ltd. Touch panel
CN108304097A (en) * 2018-04-13 2018-07-20 业成科技(成都)有限公司 Curved surface touch module structure and its applying method
CN108304097B (en) * 2018-04-13 2021-04-23 业成科技(成都)有限公司 Curved surface touch module structure and laminating method thereof
CN108693998A (en) * 2018-05-11 2018-10-23 武汉华星光电半导体显示技术有限公司 Application of a surface device and application of a surface method
CN108693998B (en) * 2018-05-11 2021-04-27 武汉华星光电半导体显示技术有限公司 Curved surface laminating device and curved surface laminating method
CN110174965A (en) * 2019-05-09 2019-08-27 业成科技(成都)有限公司 Narrow frame touch panel
CN110174965B (en) * 2019-05-09 2022-05-20 业成科技(成都)有限公司 Narrow-frame touch panel
CN110197618A (en) * 2019-06-28 2019-09-03 云谷(固安)科技有限公司 A kind of applying method of curved face display panel

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