CN103543886A - Capacitive touch screen and manufacturing method thereof - Google Patents

Capacitive touch screen and manufacturing method thereof Download PDF

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Publication number
CN103543886A
CN103543886A CN201210237308.9A CN201210237308A CN103543886A CN 103543886 A CN103543886 A CN 103543886A CN 201210237308 A CN201210237308 A CN 201210237308A CN 103543886 A CN103543886 A CN 103543886A
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layer
circuit
touch screen
capacitance touch
inductive
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CN103543886B (en
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张涛
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Suzhou OFilm Tech Co Ltd
OFilm Group Co Ltd
Anhui Jingzhuo Optical Display Technology Co Ltd
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Shenzhen OFilm Tech Co Ltd
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Abstract

The invention relates to a capacitive touch screen. The capacitive touch screen comprises panel glass, and the panel glass comprises a touching area and a wiring area placed on the edge of the touching area. The capacitive touch screen further comprises an induction layer, a ground layer, a driving layer, a first circuit and a second circuit, wherein the induction layer, the ground layer and the driving layer are sequentially laminated on the touching area, the first circuit is led out from the induction layer, the second circuit is led out from the driving layer, and the first circuit and the second circuit are arranged in the wiring area of the panel glass in an overlapping mode. By the aid of the ground layer, two capacitors are formed by the driving layer and the ground, and the induction layer and the ground respectively, variations of the two capacitors are both led out in a grounding mode, hence, the capacitors formed by the induction layer and the driving layer are prevented, and when the first circuit and the second circuit are arranged in the wiring area in the overlapping mode, the work of the capacitive touch screen can not be affected; due to the fact that the first circuit and the second circuit are arranged in the overlapping mode, wiring space is greatly reduced, the size of the wiring area is decreased, a frame of the capacitive touch screen is made to be small, and the application of the capacitive touch screen can cater to light and thin large-window design. The invention further provides a manufacturing method of the capacitive touch screen.

Description

Capacitance touch screen and preparation method thereof
Technical field
The present invention relates to touch screen technology field, particularly relate to a kind of capacitance touch screen and preparation method thereof.
Background technology
At present, smart mobile phone is more and more universal, and the display screen of smart mobile phone is toward large-sized trend development.The display screen of mobile phone is large, correspondingly requires the size of mobile phone also increasing.Yet after the size of mobile phone increases to a certain degree, the size of mobile phone is to the portable of mobile phone and handlingly just produce a very large impact.In order to alleviate smart mobile phone giant-screen and portability and handling contradiction, mobile-phone manufacturers and mobile phone touch screen manufacturer have proposed a narrow frame design of new concept-capacitance touch screen.Yet in the wiring region of existing capacitance touch screen narrow limit design, driving layer and the circuit of inductive layer can not overlapping cross wires.Thereby required wiring space is larger, thereby make the frame size of capacitance touch screen larger, can not effectively reduce the physical dimension of mobile phone, be unfavorable for that smart mobile phone is toward large form and lightening future development.
Summary of the invention
Based on this, being necessary, for the larger problem of the frame of existing capacitance touch screen, provides capacitance touch screen that a kind of frame is less and preparation method thereof.
A kind of capacitance touch screen, comprise face glass, described face glass comprises Touch Zone and is positioned at the wiring region at edge, described Touch Zone, described capacitance touch screen also comprises inductive layer, ground plane and the driving layer stacking gradually on described Touch Zone, and first circuit of drawing from described inductive layer and from described second circuit that drives layer to draw, described the first circuit and the second circuit arranged superposed are in described wiring region.
Therein in an embodiment, also comprise being arranged at describedly driving the first adhesive-layer between layer and ground plane, being arranged at the second adhesive-layer between described ground plane and inductive layer and being arranged at the 3rd adhesive-layer between described inductive layer and face glass.
Therein in an embodiment, described driving layer, ground plane and inductive layer comprise transparent basement membrane and are laminated in described transparent epilamellar indium tin oxide layer, nano metal layer or carbon nanotube layer, wherein, described transparent basement membrane, the transparent basement membrane of ground plane and the transparent basement membrane of inductive layer of layer of driving is all positioned at the side away from described face glass.
In an embodiment, on the surface of the indium tin oxide layer of described ground plane, nano metal layer or carbon nanotube layer, be provided with circuit therein.
In an embodiment, described transparent basement membrane is polyethylene terephthalate layer therein.
In an embodiment, the thickness of described driving layer, ground plane and inductive layer is 0.05 ~ 0.188 millimeter therein, and the thickness of described face glass is 0.3 ~ 2.0mm, and the thickness of described the first adhesive-layer, the second adhesive-layer and the 3rd adhesive-layer is 0.05 ~ 0.175mm.
A preparation method for capacitance touch screen, comprises the steps:
Face glass is divided into Touch Zone and the wiring region that is positioned at edge, described Touch Zone, adopts silk-screen printing technique at described wiring region printing-ink;
Prepare inductive layer, and draw the first circuit from described inductive layer;
Prepare ground plane;
Preparation drives layer, and draws the second circuit from described driving layer;
Described inductive layer, ground plane and driving layer are stacked gradually on the Touch Zone of described face glass, then described the first circuit and the second circuit arranged superposed are obtained to capacitance touch screen in described wiring region.
In an embodiment, described inductive layer and driving layer comprise transparent basement membrane and are laminated in described transparent epilamellar indium tin oxide layer, nano metal layer or carbon nanotube layer therein; Described transparent basement membrane and described indium tin oxide layer, nano metal layer or carbon nanotube layer adopt the modes such as magnetron sputtering technique to prepare.
Therein in an embodiment, also be included in the step that adopts silk-screen printing technique or gold-tinted making technology to prepare induction line on the surface of indium tin oxide layer, nano metal layer or carbon nanotube layer of described inductive layer and on the surface of described indium tin oxide layer, nano metal layer or the carbon nanotube layer that drives layer, prepare the step of driver circuit, described the first circuit is connected with described induction line, and described the second circuit is connected with described driver circuit.
Therein in an embodiment, described ground plane comprises transparent basement membrane and is laminated in described transparent epilamellar indium tin oxide layer, nano metal layer or carbon nanotube layer, described transparent basement membrane and described indium tin oxide layer, nano metal layer or carbon nanotube layer adopt magnetron sputtering preparation, and on the surface of described indium tin oxide layer, nano metal layer or carbon nanotube layer, adopt silk-screen printing technique or gold-tinted making technology to be prepared with circuit.
Above-mentioned capacitance touch screen is at inductive layer and drive between layer ground plane is set, and first circuit of drawing from inductive layer and from driving the second circuit arranged superposed that layer draws in the wiring region of face glass.Ground plane makes to drive layer and inductive layer to form two electric capacity with the earth respectively, the variation that these two electric capacity produce is all grounded layer and derives, thereby inductive layer and the electric capacity that drives layer to form have been stoped, thereby first circuit and the second circuit arranged superposed can not affect the work of capacitance touch screen, and the first circuit and the second circuit arranged superposed, greatly reduced wiring space, without large wiring region being set to meet wiring demand, therefore the wiring region of face glass is less, make the frame of capacitance touch screen less, be conducive to smart mobile phone, the devices such as panel computer are toward large form future development.
Accompanying drawing explanation
Fig. 1 is the structural representation of the capacitance touch screen of an embodiment;
Fig. 2 is the structural representation of the face glass shown in Fig. 1;
Fig. 3 is the wire structures schematic diagram of the capacitance touch screen shown in Fig. 1;
Fig. 4 is the working state schematic representation of the capacitance touch screen shown in Fig. 1;
Fig. 5 is preparation method's process flow diagram of the capacitance touch screen of an embodiment;
Fig. 6 is the process flow diagram of preparation method's another way of the capacitance touch screen shown in Fig. 5.
Embodiment
For solving the larger problem of frame of existing capacitance touch screen, provide capacitance touch screen that a kind of frame is less and preparation method thereof.By embodiment and accompanying drawing, further set forth below.
Refer to Fig. 1, the capacitance touch screen 100 of an embodiment, comprises the driving layer 110, the first adhesive-layer 120, ground plane 130, the second adhesive-layer 140, inductive layer 150, the 3rd adhesive-layer 160 and the face glass 170 that stack gradually.
Driving layer 110 is the drive electrode of capacitance touch screen 100.During capacitance touch screen 100 work, drive layer 110 to send low-voltage high-frequency signal.
Drive layer 110 to comprise transparent basement membrane (not shown) and be laminated in transparent epilamellar conductive layer (not shown).Take into account the electric conductivity and the light transmission that drive layer 110, drive the thickness of layer 110 to be preferably 0.05 ~ 0.188 millimeter.Transparent basement membrane rises and supports and protective effect.Transparent basement membrane is preferably polyethylene terephthalate (PET) layer.The light transmission of PET is better.Conductive layer can be tin indium oxide (ITO) layer, nano metal layer or carbon nanotube layer.Conductive layer is preferably indium tin oxide layer.The electric conductivity of tin indium oxide is better, is conducive to improve the sensitivity of capacitance touch screen 100, and indium tin oxide films has higher light transmission, makes capacitance touch screen 100 light transmissions higher.
The surface etch of conductive layer has drive pattern, is provided with driver circuit as the channel electrode lead-in wire that drives layer 110 on drive pattern.Driver circuit can be silver electrode lead wires, copper electrode silver line or aluminium contact conductor etc.From driving layer 110 to draw the second circuit (not shown), one end of the second circuit is connected with driver circuit, and the other end stretches out and drives layer 110.
The first adhesive-layer 120 drives layer 110 and ground plane 130 for connecting.The material of the first adhesive-layer 120 is preferably OCA optical cement.OCA optical cement is optically transparent double faced adhesive tape, to guarantee the light transmission of capacitance touch screen 100.And OCA optical cement, containing acid, does not have no effect to ito thin film.Be appreciated that in other embodiments, the first adhesive-layer 120 can be also the good UV glue-line of light transmission.The viscosity of comprehensive the first adhesive-layer 120 and light transmission, the thickness of the first adhesive-layer 120 is preferably 0.05 ~ 0.175 millimeter.
Ground plane 130 is for ground connection, so that drive layer 110 and inductive layer 150 to form two electric capacity with the earth respectively.Ground plane 130 comprises transparent basement membrane (not shown) and is laminated in transparent epilamellar conductive layer (not shown).Transparent basement membrane is preferably polyethylene terephthalate (PET) layer.Conductive layer can be tin indium oxide (ITO) layer, nano metal layer or carbon nanotube layer.On the surface of tin indium oxide (ITO) layer, nano metal layer or carbon nanotube layer, be provided with circuit (not shown).Circuit can reduce the resistance of ground plane 130, plays a part to accelerate conducting.Preferably, circuit can be copper cash, aluminum steel or silver-colored line etc.Be preferably annular silver-colored line.The thickness of ground plane 130 is 0.05 ~ 0.188 millimeter.
The second adhesive-layer 140 is for connecting ground plane 130 and inductive layer 150.The material of the second adhesive-layer 140 is OCA optical cement.The thickness of the second adhesive-layer 150 is 0.05 ~ 0.175 millimeter.
Inductive layer 150 is as the receiving electrode of capacitance touch screen 100.
Inductive layer 150 comprises transparent basement membrane (not shown) and is laminated in transparent epilamellar conductive layer (not shown).The thickness of inductive layer 150 is 0.05 ~ 0.188 millimeter.Transparent basement membrane is preferably polyethylene terephthalate (PET) layer.Conductive layer is indium tin oxide layer, nano metal layer, printed metal layer or carbon nanotube layer.
On the surface of conductive layer, be etched with induction figure.On induction figure, be provided with induction line as the channel electrode lead-in wire of inductive layer 150.Induction line can be silver electrode lead wires, copper electrode silver line or aluminium contact conductor etc.From inductive layer 150, draw the first circuit (not shown).One end of the first circuit is connected with induction line, and the other end stretches out inductive layer 150.
The 3rd adhesive-layer 160 is for connecting inductive layer 150 and face glass 170.The material of the 3rd adhesive-layer 160 is OCA optical cement.The thickness of the 3rd adhesive-layer 160 is 0.05 ~ 0.175 millimeter.
Face glass 170 is for the protection of inductive layer 150.Inductive layer 150 plays interactive function served as bridge, and the conductive layer of inductive layer 150 is more fragile indium tin oxide layer, nano metal layer or carbon nanotube layer.Once inductive layer 150 is impaired, capacitance touch screen 100 can not be worked.Face glass 170 not only can be protected inductive layer 150 well, also plays and prevents that external environment factor from impacting capacitance touch screen 100.While speckling with filth, dust or oil stain on face glass 170, because inductive layer 150 is not subject to the impact of filth, dust or oil stain, thereby capacitance touch screen 100 can accurately be calculated touch location.
The thickness of face glass 170 is 0.30 ~ 2.0 millimeter.Face glass 170 is preferably tempered glass, and the impact strength of tempered glass is higher, so that capacitance touch screen 100 is durable in use.
Preferably, face glass 170 is for process antistatic treatment, to prevent that capacitance touch screen 100 is by electrostatic breakdown.
Please refer to Fig. 2, face glass 170 comprises 172He Touch Zone, wiring region 174.Wiring region 172 is positioned at the edge of Touch Zone 174.
The 3rd adhesive-layer 160, inductive layer 150, the second adhesive-layer 140, ground plane 130, the first adhesive-layer 120 and driving layer 110 stack gradually on the Touch Zone 174 of face glass 170.Wherein, drive transparent basement membrane, the transparent basement membrane of ground plane 130 and the transparent basement membrane of inductive layer 150 of layer 110 to be all positioned at the side away from face glass 170.
First circuit of drawing from inductive layer 150 with from driving the layer 110 second circuit arranged superposed of drawing in wiring region 172, form circuit 310, as shown in Figure 3.
The principle of work of general capacitance touch screen is identical with the principle of work of capacity plate antenna, when overlapping from the circuit that drives layer circuit of drawing and draw from inductive layer, can produce electric capacity, once touch, have capacitance and change, touch-control chip gets final product calculated touch location, therefore non-touch area is circuit in wiring region can not overlapping cross wire, otherwise can affect the work of capacitance touch screen.
The duty of capacitance touch screen 100 as shown in Figure 4, from the first circuit that drives layer 110 second circuit of drawing and draw from inductive layer 150, can produce electric capacity when overlapping, but the existence due to ground plane 130, drive between layer 110 and the earth and form an electric capacity, between inductive layer 150 and the earth, form another electric capacity, the variation that these two electric capacity produce is all grounded layer 130 and derives, thereby stop, drives layer 110 and inductive layer 150 to form electric capacity.Thereby the in the situation that of the first circuit and the overlapping arranged crosswise of the second circuit, the work of capacitance touch screen 100 can not be affected, touch non-touch area (being wiring region 172) and can not produce capacitance variation.And because the first circuit and the overlapping arranged crosswise of the second circuit in wiring region 172,172 the wiring space in wiring region of capacitance touch screen 100 is reduced greatly than general capacitance touch screen, thereby can reduce the wiring region 172 of face glass 170, make the frame of capacitance touch screen 100 less.
The wiring space on wiring region 172 of capacitance touch screen 100 is less, make the size of wiring region 172 can do littlely, thereby the 174Ji viewing area, Touch Zone of capacitance touch screen 100 strengthens, be conducive to use the electronic products such as smart mobile phone, panel computer of this capacitance touch screen 100 towards the future development of the aobvious form of large scale.
The capacity earth that the ground connection effect of ground plane 130 forms the electric capacity that drives layer 110 and the earth to form and inductive layer 150 and the earth derive the first circuit of making from driving layer 110 second circuit of drawing and drawing from inductive layer 150 can arranged superposed in wiring region 172, from practical effect, equal to have increased second layer interference shielding layer, the ability that makes capacitance touch screen 100 overcome interference increases greatly, even whole face is attached on interference source all can effectively overcome interference problem, normal operation.Thereby than general capacitance touch screen, the adaptive capacity to environment of capacitance touch screen 100 can expand the scope that general capacitance touch screen cannot work to, and can allow the equipment of the use capacitance touch screens 100 such as smart mobile phone more lightening.
Preferably, the surface of ground plane 130 is provided with the circuits such as copper cash, aluminum steel or silver-colored line, circuit plays a part to accelerate conducting, ground plane 130 can be led away the electric capacity forming between the electric capacity forming between driving layer 110 and the earth and inductive layer 150 and the earth rapidly in time, further improved the antijamming capability of capacitance touch screen 100.
Please refer to Fig. 5 and Fig. 6, the preparation method of the capacitance touch screen of an embodiment, comprises the steps:
Step S110: face glass 170 is divided into Touch Zone 174 and the wiring region 172 that is positioned at 174 edges, Touch Zone, and employing silk-screen printing technique is 172 printing-inks in wiring region.
Face glass 170 preferred thickness are the glass of 0.30 ~ 2.0 millimeter.
First face glass 170 is carried out to intensive treatment and make face glass 170 become tempered glass, so that the intensity of face glass 170 is higher, shock resistance is good.The method of the strengthening of face glass 170 can adopt chemical enhanced method or physical strengthening method.Then the face glass 170 after strengthening is divided into Touch Zone 174 and the wiring region 172 that is positioned at 174 edges, Touch Zone.Employing silk-screen printing technique is 172 printing-inks in wiring region, to block circuit when wiring.
Step S120: prepare inductive layer 150, and draw the first circuit from inductive layer 150.
Inductive layer 150 comprises transparent basement membrane and is arranged at transparent epilamellar conductive layer.Transparent basement membrane is polyethylene terephthalate (PET) layer, and conductive layer is tin indium oxide (ITO) layer, nano metal layer or carbon nanotube layer.Transparent basement membrane and conductive layer adopt magnetron sputtering coating method to be prepared from.The thickness of inductive layer is 0.05 ~ 0.188 millimeter.
Conductive layer away from the surface of transparent basement membrane on etching induction figure.The etching of induction figure can adopt gold-tinted technique etching, silk-screen printing technique or laser ablation technique.
After induction pattern etching completes, on the surface at conductive layer with induction figure, make induction line, induction line is as the channel electrode lead-in wire of inductive layer 150.Respond to silver-colored line and can adopt silk-screen printing technique or the preparation of gold-tinted making technology.Induction line connects each passage of induction figure to winding displacement position.
On inductive layer 150, offer binding and dodge design, remove by the mode of perforate the position that is about to transparent basement membrane useless on inductive layer 150, so that wiring.Then wiring on inductive layer 150, draws the first circuit (not shown) from inductive layer 150.One end of the first circuit is connected with induction line, and the other end stretches out inductive layer 150.
Step S130: prepare ground plane 130.
Ground plane 130 comprises transparent basement membrane and is arranged at transparent epilamellar conductive layer.Transparent basement membrane is polyethylene terephthalate (PET) layer, and conductive layer is tin indium oxide (ITO) layer, nano metal layer or carbon nanotube layer.Transparent basement membrane and conductive layer adopt magnetron sputtering membrane process to be prepared from.The thickness of ground plane 130 is 0.05 ~ 0.188 millimeter.
Preferably, adopt silk-screen printing technique on the surface of conductive layer, to prepare annular circuit.
Step S140: preparation drives layer 110, and from driving layer 110 to draw the second circuit.
Drive layer 110 to comprise transparent basement membrane and be arranged at transparent epilamellar conductive layer.Transparent basement membrane is polyethylene terephthalate (PET) layer, and conductive layer is tin indium oxide (ITO) layer, nano metal layer or carbon nanotube layer.Transparent basement membrane and conductive layer adopt magnetron sputtering coating method to be prepared from.Driving the thickness of layer is 0.05 ~ 0.188 millimeter.
Conductive layer away from the surface of transparent basement membrane on etching drive pattern.The etching of drive pattern can adopt gold-tinted technique etching, silk-screen printing technique or laser ablation technique.
After drive pattern etching completes, on the surface at conductive layer with drive pattern, make driver circuit, driver circuit is as the channel electrode lead-in wire that drives layer 110.Driver circuit can adopt silk-screen circuit technique thereof or the preparation of gold-tinted making technology.Driver circuit connects each passage of drive pattern to winding displacement position.
Driving wiring on layer 110, from driving layer 110 to draw the second circuit (not shown).One end of the second circuit is connected with driver circuit, and the other end stretches out and drives layer 110.
Step S150: inductive layer 150, ground plane 130 and driving layer 110 are stacked gradually on the Touch Zone 174 of face glass 170, then the first circuit and the second circuit arranged superposed are obtained to capacitance touch screen 100 in wiring region 172.
By viscose glue, connect successively inductive layer 150, ground plane 130 and drive layer 110, between driving layer 110 and ground plane 130, forming the first adhesive-layer 120, between ground plane 130 and inductive layer 150, forming the second adhesive-layer 140.The first adhesive-layer 120 connects the transparent basement membrane of driving layer 110 and the conductive layer of ground plane 130, and the second adhesive-layer 140 connects the transparent basement membrane of ground plane 130 and the conductive layers of inductive layer 150.
Drive layer the 110, first adhesive-layer 120, ground plane 130, the second adhesive-layer 140 and inductive layer 150 to stack gradually and form composite bed (figure is mark not).Then adopting tool to carry out sharp processing to composite bed matches with the size and shape of the Touch Zone 174 with face glass 170.
Finally by viscose glue, composite bed is layered on the Touch Zone 174 of face glass 170, obtains capacitance touch screen 100, between composite bed and face glass 170, form the 3rd adhesive-layer 160, then by the first circuit and the second circuit arranged superposed in wiring region 172.Wherein, the screen printing brush finish of face glass 170 stacks by the 3rd adhesive-layer 160 and the transparent base membrane layer of inductive layer 110.
The preparation method of above-mentioned capacitance touch screen, by introduce ground plane 130 between driving layer 110 and inductive layer 150, and from inductive layer 150, draw the first circuit, from driving layer 110 to draw the second circuit, the first circuit and the second circuit arranged superposed are on the wiring region 172 of face glass 170.The variation that two electric capacity that drive layer 110 and inductive layer 150 to form with the earth respectively produce is all grounded layer 130 is derived, thereby inductive layer 150 and the electric capacity that drives layer 110 to form have been stoped, thereby first circuit and the second circuit arranged superposed can not affect the work of capacitance touch screen 100, and the first circuit and the second circuit arranged superposed are in wiring region 172, greatly reduced wiring space, without large-sized wiring region being set to meet wiring demand, thereby the size of the wiring region 172 of face glass 170 is less, make the frame of capacitance touch screen 100 less, be conducive to smart mobile phone, the devices such as panel computer are toward large form future development.
Therefore, the preparation method of above-mentioned capacitance touch screen can prepare the capacitance touch screen that frame is less, can cater to large form, lightening design.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (10)

1. a capacitance touch screen, comprise face glass, it is characterized in that, described face glass comprises Touch Zone and is positioned at the wiring region at edge, described Touch Zone, described capacitance touch screen also comprises inductive layer, ground plane and the driving layer stacking gradually on described Touch Zone, and first circuit of drawing from described inductive layer and from described second circuit that drives layer to draw, described the first circuit and the second circuit arranged superposed are in described wiring region.
2. capacitance touch screen according to claim 1, it is characterized in that, also comprise being arranged at describedly driving the first adhesive-layer between layer and ground plane, being arranged at the second adhesive-layer between described ground plane and inductive layer and being arranged at the 3rd adhesive-layer between described inductive layer and face glass.
3. capacitance touch screen according to claim 1, it is characterized in that, described driving layer, ground plane and inductive layer comprise transparent basement membrane and are laminated in described transparent epilamellar indium tin oxide layer, nano metal layer or carbon nanotube layer, wherein, described transparent basement membrane, the transparent basement membrane of ground plane and the transparent basement membrane of inductive layer of layer of driving is all positioned at the side away from described face glass.
4. capacitance touch screen according to claim 3, is characterized in that, on the surface of the indium tin oxide layer of described ground plane, nano metal layer or carbon nanotube layer, is provided with circuit.
5. according to the capacitance touch screen described in claim 3 or 4, it is characterized in that, described transparent basement membrane is polyethylene terephthalate layer.
6. capacitance touch screen according to claim 2, it is characterized in that, the thickness of described driving layer, ground plane and inductive layer is 0.05 ~ 0.188 millimeter, the thickness of described face glass is 0.3 ~ 2.0mm, and the thickness of described the first adhesive-layer, the second adhesive-layer and the 3rd adhesive-layer is 0.05 ~ 0.175mm.
7. a preparation method for capacitance touch screen, is characterized in that, comprises the steps:
Face glass is divided into Touch Zone and the wiring region that is positioned at edge, described Touch Zone, adopts silk-screen printing technique at described wiring region printing-ink;
Prepare inductive layer, and draw the first circuit from described inductive layer;
Prepare ground plane;
Preparation drives layer, and draws the second circuit from described driving layer;
Described inductive layer, ground plane and driving layer are stacked gradually on the Touch Zone of described face glass, then described the first circuit and the second circuit arranged superposed are obtained to capacitance touch screen in described wiring region.
8. the preparation method of capacitance touch screen according to claim 7, is characterized in that, described inductive layer and driving layer comprise transparent basement membrane and be laminated in described transparent epilamellar indium tin oxide layer, nano metal layer or carbon nanotube layer; Described transparent basement membrane and described indium tin oxide layer, nano metal layer or carbon nanotube layer adopt magnetron sputtering technique preparation.
9. the preparation method of capacitance touch screen according to claim 8, it is characterized in that, also be included in the step that adopts silk-screen printing technique or gold-tinted making technology to prepare induction line on the surface of indium tin oxide layer, nano metal layer or carbon nanotube layer of described inductive layer and on the surface of described indium tin oxide layer, nano metal layer or the carbon nanotube layer that drives layer, prepare the step of driver circuit, described the first circuit is connected with described induction line, and described the second circuit is connected with described driver circuit.
10. the preparation method of capacitance touch screen according to claim 8, it is characterized in that, described ground plane comprises transparent basement membrane and is laminated in described transparent epilamellar indium tin oxide layer, nano metal layer or carbon nanotube layer, described transparent basement membrane and described indium tin oxide layer, nano metal layer or carbon nanotube layer adopt magnetron sputtering preparation, and on the surface of described indium tin oxide layer, nano metal layer or carbon nanotube layer, adopt silk-screen silver sizing process or gold-tinted making technology to be prepared with circuit.
CN201210237308.9A 2012-07-10 2012-07-10 Capacitive touch screen and manufacturing method thereof Active CN103543886B (en)

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CN105320374A (en) * 2014-05-26 2016-02-10 日本航空电子工业株式会社 Touch panel and production method thereof
CN106020547A (en) * 2016-05-26 2016-10-12 京东方科技集团股份有限公司 Substrate, touch screen and touch display device
TWI623862B (en) * 2014-08-29 2018-05-11 寶宸(廈門)光學科技有限公司 Touch panel
CN108091078A (en) * 2017-12-12 2018-05-29 深圳市旭子科技有限公司 Capacitance touch screen and financial payment electronic equipment
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CN105320374A (en) * 2014-05-26 2016-02-10 日本航空电子工业株式会社 Touch panel and production method thereof
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