CN103543886B - Capacitive touch screen and manufacturing method thereof - Google Patents
Capacitive touch screen and manufacturing method thereof Download PDFInfo
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- CN103543886B CN103543886B CN201210237308.9A CN201210237308A CN103543886B CN 103543886 B CN103543886 B CN 103543886B CN 201210237308 A CN201210237308 A CN 201210237308A CN 103543886 B CN103543886 B CN 103543886B
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Abstract
The invention relates to a capacitive touch screen. The capacitive touch screen comprises panel glass, and the panel glass comprises a touching area and a wiring area placed on the edge of the touching area. The capacitive touch screen further comprises an induction layer, a ground layer, a driving layer, a first circuit and a second circuit, wherein the induction layer, the ground layer and the driving layer are sequentially laminated on the touching area, the first circuit is led out from the induction layer, the second circuit is led out from the driving layer, and the first circuit and the second circuit are arranged in the wiring area of the panel glass in an overlapping mode. By the aid of the ground layer, two capacitors are formed by the driving layer and the ground, and the induction layer and the ground respectively, variations of the two capacitors are both led out in a grounding mode, hence, the capacitors formed by the induction layer and the driving layer are prevented, and when the first circuit and the second circuit are arranged in the wiring area in the overlapping mode, the work of the capacitive touch screen can not be affected; due to the fact that the first circuit and the second circuit are arranged in the overlapping mode, wiring space is greatly reduced, the size of the wiring area is decreased, a frame of the capacitive touch screen is made to be small, and the application of the capacitive touch screen can cater to light and thin large-window design. The invention further provides a manufacturing method of the capacitive touch screen.
Description
Technical field
The present invention relates to touch screen technology field, more particularly to a kind of capacitance touch screen and preparation method thereof.
Background technology
At present, smart mobile phone is increasingly popularized, and the display screen of smart mobile phone is toward large-sized trend development.Mobile phone
Display screen is big, correspondingly requires the size of mobile phone also increasing.However, when the size of mobile phone increases to a certain extent
Afterwards, the size of mobile phone produces a very large impact handling to the portability of mobile phone and just.In order to alleviate smart mobile phone giant-screen with just
The property taken and handling contradiction, mobile-phone manufacturers and mobile phone touch manufacturer propose a new concept-capacitance touch screen
Narrow frame design.However, in the wiring area of existing capacitance touch screen narrow side design, the circuit of driving layer and inductive layer can not
Overlapping cross wire.Thus required wiring space is larger so that the frame size of capacitance touch screen larger it is impossible to effectively
Ground reduces the overall dimensions of mobile phone, is unfavorable for that smart mobile phone develops toward big form and lightening direction.
Content of the invention
Based on this it is necessary to for the larger problem of the frame of existing capacitance touch screen, provide a kind of frame less
Capacitance touch screen and preparation method thereof.
A kind of capacitance touch screen, including face glass, described face glass includes Touch Zone and is located at described Touch Zone side
The wiring region of edge, described capacitance touch screen also includes stacking gradually inductive layer on described Touch Zone, ground plane and drives layer,
And the first line from the extraction of described inductive layer and the second circuit drawn from described driving layer, described first line and second
Circuit arranged superposed is in described wiring region.
Wherein in an embodiment, also include being arranged at described the first adhesive-layer driving between layer and ground plane, set
It is placed in the second adhesive-layer between described ground plane and inductive layer and be arranged at the between described inductive layer and face glass the 3rd
Adhesive-layer.
Wherein in an embodiment, described driving layer, ground plane and inductive layer include transparent base film and are laminated in described
Indium tin oxide layer on transparent base film, nano metal layer or carbon nanotube layer, wherein, the described transparent base film driving layer, ground connection
The transparent base film of the transparent base film of layer and inductive layer is respectively positioned on the side away from described face glass.
Wherein in an embodiment, the table of the indium tin oxide layer of described ground plane, nano metal layer or carbon nanotube layer
Circuit is provided with face.
Wherein in an embodiment, described transparent base film is polyethylene terephthalate layer.
Wherein in an embodiment, the described thickness driving layer, ground plane and inductive layer is 0.05 ~ 0.188 millimeter, institute
The thickness stating face glass is 0.3 ~ 2.0mm, and the thickness of described first adhesive-layer, the second adhesive-layer and the 3rd adhesive-layer is 0.05
~0.175mm.
A kind of preparation method of capacitance touch screen, comprises the steps：
The wiring region that face glass is divided into Touch Zone and is located at described touch-control area edge, is existed using silk-screen printing technique
Described wiring region printing-ink；
Prepare inductive layer, and draw first line from described inductive layer；
Prepare ground plane；
Preparation drives layer, and draws the second circuit from described driving layer；
Described inductive layer, ground plane and driving layer are sequentially laminated on the Touch Zone of described face glass, then by institute
State first line and the second circuit arranged superposed obtains capacitance touch screen in described wiring region.
Wherein in an embodiment, described inductive layer and driving layer include transparent base film and are laminated in described transparent base film
On indium tin oxide layer, nano metal layer or carbon nanotube layer；Described transparent base film and described indium tin oxide layer, nano metal layer
Or carbon nanotube layer prepared using modes such as magnetron sputtering techniques.
Wherein in an embodiment, it is additionally included in indium tin oxide layer, nano metal layer or the carbon nanometer of described inductive layer
On the surface of tube layer, the step of induction line is prepared and in described driving layer using silk-screen printing technique or gold-tinted making technology
The step that driver circuit is prepared on the surface of indium tin oxide layer, nano metal layer or carbon nanotube layer, described first line and institute
State induction line to connect, described second circuit is connected with described driver circuit.
Wherein in an embodiment, described ground plane includes transparent base film and the oxidation being laminated on described transparent base film
Indium tin layer, nano metal layer or carbon nanotube layer, described transparent base film and described indium tin oxide layer, nano metal layer or carbon nanometer
Tube layer adopts magnetron sputtering to prepare, and adopts silk screen on the surface of described indium tin oxide layer, nano metal layer or carbon nanotube layer
Typography or the preparation of gold-tinted making technology have circuit.
Above-mentioned capacitance touch screen in inductive layer and drives setting ground plane between layer, and the first line drawn from inductive layer
With the second circuit arranged superposed drawn from driving layer in the wiring region of face glass.Ground plane makes to drive layer and inductive layer
Form two electric capacity with the earth respectively, the change that this two electric capacity produce all is grounded layer and derives, thus prevent inductive layer with
Drive the electric capacity that layer is formed, thus first line and the second circuit arranged superposed do not interfere with the work of capacitance touch screen, and the
One circuit and the second circuit arranged superposed, substantially reduce wiring space, need not arrange big wiring region to meet wiring requirements,
The wiring region of therefore face glass is less so that the frame of capacitance touch screen is less, is conducive to the devices such as smart mobile phone, panel computer
Part develops toward big form direction.
Brief description
Fig. 1 is the structural representation of the capacitance touch screen of an embodiment；
Fig. 2 is the structural representation of the face glass shown in Fig. 1；
Fig. 3 is the wire structures schematic diagram of the capacitance touch screen shown in Fig. 1；
Fig. 4 is the working state schematic representation of the capacitance touch screen shown in Fig. 1；
Fig. 5 is the preparation method flow chart of the capacitance touch screen of an embodiment；
Fig. 6 is the flow chart of the preparation method another way of capacitance touch screen shown in Fig. 5.
Specific embodiment
Frame for solving the problems, such as existing capacitance touch screen is larger, provide a kind of less capacitance touch screen of frame and
Its preparation method.It is expanded on further below by way of specific embodiment and accompanying drawing.
Refer to Fig. 1, the capacitance touch screen 100 of an embodiment, including the driving layer 110 stacking gradually, the first viscose glue
Layer 120, ground plane 130, the second adhesive-layer 140, inductive layer 150, the 3rd adhesive-layer 160 and face glass 170.
Drive the drive electrode that layer 110 is capacitance touch screen 100.During capacitance touch screen 100 work, layer 110 is driven to send
Low-voltage high-frequency signal.
Layer 110 is driven to include transparent base film（Not shown）And it is laminated in the conductive layer on transparent base film（Not shown).Take into account
Drive electric conductivity and the light transmission of layer 110, drive the thickness of layer 110 to be preferably 0.05 ~ 0.188 millimeter.Transparent base film plays support
And protective effect.Transparent base film is preferably polyethylene terephthalate（PET）Layer.The light transmission of PET is preferable.Conductive layer can
Think tin indium oxide（ITO）Layer, nano metal layer or carbon nanotube layer.Conductive layer is preferably indium tin oxide layer.Tin indium oxide
Electric conductivity preferably, is conducive to improving the sensitivity of capacitance touch screen 100, and indium tin oxide films has higher light transmission, make
Capacitance touch screen 100 light transmission is higher.
The surface etch of conductive layer has drive pattern, drive pattern is provided with driver circuit logical as driving layer 110
Road contact conductor.Driver circuit can be silver electrode lead wires, copper electrode silver wire or aluminium electrode lead etc..Draw from driving layer 110
Second circuit（Not shown）, one end of the second circuit is connected with driver circuit, and the other end stretches out driving layer 110.
First adhesive-layer 120 is used for connecting driving layer 110 and ground plane 130.The material of the first adhesive-layer 120 is preferably
OCA optical cement.OCA optical cement is optically transparent double faced adhesive tape, to ensure the light transmission of capacitance touch screen 100.And, OCA light
Learn glue and do not contain acid, ito thin film is had no effect.It is appreciated that in other embodiments, the first adhesive-layer 120 can also
For the good UV glue-line of light transmission.The viscosity of comprehensive first adhesive-layer 120 and light transmission, the thickness of the first adhesive-layer 120 is preferably
0.05 ~ 0.175 millimeter.
Ground plane 130 is used for being grounded, so that driving layer 110 and inductive layer 150 to form two electric capacity with the earth respectively.Ground connection
Layer 130 includes transparent base film（Not shown）And it is laminated in the conductive layer on transparent base film（Not shown）.Transparent base film is preferably poly-
Ethylene glycol terephthalate（PET）Layer.Conductive layer can be tin indium oxide（ITO）Layer, nano metal layer or carbon nanotube layer.
Tin indium oxide（ITO）It is provided with circuit on the surface of layer, nano metal layer or carbon nanotube layer（Not shown）.Circuit can reduce
The resistance of ground plane 130, plays a part to accelerate conducting.Preferably, circuit can be copper cash, aluminum steel or silver wire etc..It is preferably
Annular silver wire.The thickness of ground plane 130 is 0.05 ~ 0.188 millimeter.
Second adhesive-layer 140 is used for connecting ground plane 130 and inductive layer 150.The material of the second adhesive-layer 140 is OCA light
Learn glue.The thickness of the second adhesive-layer 150 is 0.05 ~ 0.175 millimeter.
Inductive layer 150 is as the receiving electrode of capacitance touch screen 100.
Inductive layer 150 includes transparent base film（Not shown）And it is laminated in the conductive layer on transparent base film（Not shown).Sensing
The thickness of layer 150 is 0.05 ~ 0.188 millimeter.Transparent base film is preferably polyethylene terephthalate（PET）Layer.Conductive layer
For indium tin oxide layer, nano metal layer, printed metal layer or carbon nanotube layer.
Sensing figure is etched with the surface of conductive layer.It is provided with induction line as inductive layer 150 on sensing figure
Channel electrode lead.Induction line can be silver electrode lead wires, copper electrode silver wire or aluminium electrode lead etc..Draw from inductive layer 150
Go out first line（Not shown）.One end of first line is connected with induction line, and the other end stretches out inductive layer 150.
3rd adhesive-layer 160 is used for connecting inductive layer 150 and face glass 170.The material of the 3rd adhesive-layer 160 is OCA
Optical cement.The thickness of the 3rd adhesive-layer 160 is 0.05 ~ 0.175 millimeter.
Face glass 170 is used for protecting inductive layer 150.Inductive layer 150 plays interactive function served as bridge, and inductive layer
150 conductive layer is more fragile indium tin oxide layer, nano metal layer or carbon nanotube layer.Inductive layer 150 is once impaired, then electricity
Hold touch screen 100 can not work.Face glass 170 can not only protect inductive layer 150 well, and also playing prevents external environment
Factor impacts to capacitance touch screen 100.When filth, dust or oil stain are speckled with face glass 170, due to inductive layer
150 are not affected by filth, dust or oil stain, thus capacitance touch screen 100 can accurately calculate touch location.
The thickness of face glass 170 is 0.30 ~ 2.0 millimeter.Face glass 170 is preferably strengthens glass, strengthens glass
Impact strength is higher, so that capacitance touch screen 100 is durable in use.
Preferably, face glass 170 is through antistatic treatment, to prevent capacitance touch screen 100 by electrostatic breakdown.
Please refer to Fig. 2, face glass 170 includes wiring region 172 and Touch Zone 174.Wiring region 172 is located at Touch Zone
174 edge.
3rd adhesive-layer 160, inductive layer 150, the second adhesive-layer 140, ground plane 130, the first adhesive-layer 120 and driving layer
110 stack gradually on the Touch Zone 174 of face glass 170.Wherein, the transparent base film of layer 110, the saturating of ground plane 130 are driven
The transparent base film of bright basement membrane and inductive layer 150 is respectively positioned on the side away from face glass 170.
From inductive layer 150 first line drawn and the second circuit arranged superposed drawn from driving layer 110 in wiring region
In 172, form circuit 310, as shown in Figure 3.
The operation principle of general capacitance touch screen is identical with the operation principle of capacity plate antenna, from the circuit driving layer to draw
Electric capacity can be produced when overlapping with the circuit drawn from inductive layer, once touching, have capacitance and producing change, touch chip is
Can calculate touch location, thus non-touch-control region be circuit in wiring region can not overlapping cross wire, otherwise can affect capacitive touch
Touch the work of screen.
The working condition of capacitance touch screen 100 is as shown in figure 4, from the second circuit driving layer 110 to draw with from inductive layer
The first line of 150 extractions can produce electric capacity when overlapping, but the presence due to ground plane 130, drive shape between layer 110 and the earth
Become an electric capacity, between inductive layer 150 and the earth, form another electric capacity, the change that this two electric capacity produce all is grounded layer
130 derivation, thus stop driving layer 110 and inductive layer 150 from forming electric capacity.Thus, in first line and the overlapping friendship of the second circuit
In the case of fork arrangement, the work of capacitance touch screen 100 will not be affected, and touches non-touch-control region（I.e. wiring region
172）Capacitance variation will not be produced.And because first line and the second circuit overlap arranged crosswise in wiring region 172 so that electricity
The wiring space in wiring region 172 holding touch screen 100 greatly reduces it is thus possible to reduce compared to general capacitance touch screen
The wiring region 172 of face glass 170 is so that the frame of capacitance touch screen 100 is less.
The wiring space on wiring region 172 of capacitance touch screen 100 is less so that the size of wiring region 172 can be done
Obtain less, thus the Touch Zone 174 of capacitance touch screen 100 is viewing area increasing, is conducive to using this capacitance touch screen 100
The direction that the electronic products such as smart mobile phone, panel computer show depending on form towards large scale is developed.
The ground connection effect of ground plane 130 will drive electric capacity and inductive layer 150 and the earth formation of layer 110 and the earth formation
Capacity earth is derived and is allow from the second circuit driving layer 110 to draw and the first line overlap drawn from inductive layer 150
It is arranged in wiring region 172, be equal to for practical effect and increased second layer interference shielding layer, make capacitance touch screen
100 overcome the ability of interference to greatly increase, or even whole face is attached on interference source and all effectively can overcome interference problem, normal work
Make.Thus, compared to general capacitance touch screen, the adaptive capacity to environment of capacitance touch screen 100 can expand general electric capacity to
Touch screen cannot normal work scope it is possible to allow smart mobile phone etc. use capacitance touch screen 100 equipment more lightening.
Preferably, the surface of ground plane 130 is provided with the circuits such as copper cash, aluminum steel or silver wire, and circuit plays and accelerates conducting
Effect is so that ground plane 130 rapidly can will drive the electric capacity being formed between layer 110 and the earth and inductive layer 150 and the earth
Between formed electric capacity guide in time, further increase the capacity of resisting disturbance of capacitance touch screen 100.
Please refer to Fig. 5 and Fig. 6, the preparation method of the capacitance touch screen of an embodiment, comprise the steps：
Step S110：The wiring region 172 that face glass 170 is divided into Touch Zone 174 and is located at Touch Zone 174 edge,
Using silk-screen printing technique in wiring region 172 printing-ink.
Face glass 170 preferred thickness is 0.30 ~ 2.0 millimeter of glass.
First face glass 170 being carried out intensive treatment makes face glass 170 become strengthens glass, so that face glass
170 intensity is higher, and shock resistance is good.The method of the strengthening of face glass 170 can be strong using chemical enhanced method or physics
Change method.Then the wiring region 172 face glass 170 after strengthening being divided into Touch Zone 174 and being located at Touch Zone 174 edge.
Using silk-screen printing technique in wiring region 172 printing-ink, to block circuit in wiring.
Step S120：Prepare inductive layer 150, and draw first line from inductive layer 150.
Inductive layer 150 includes transparent base film and is arranged at the conductive layer on transparent base film.Transparent base film is poly- terephthaldehyde
Sour glycol ester（PET）Layer, conductive layer is tin indium oxide（ITO）Layer, nano metal layer or carbon nanotube layer.Transparent base film and leading
Electric layer is prepared from using magnetron sputtering coating method.The thickness of inductive layer is 0.05 ~ 0.188 millimeter.
Etching sensing figure on conductive layer is away from the surface of transparent base film.The etching of sensing figure can adopt gold-tinted work
Skill etching, silk-screen printing technique or laser etching process.
After the completion of sensing pattern etching, carry in conductive layer and induction line, induction line are made on the surface of sensing figure
Channel electrode lead as inductive layer 150.Sensing silver wire can be using silk-screen printing technique or the preparation of gold-tinted making technology.Sense
Connection is answered to sense each passage of figure to winding displacement position.
Binding is opened up on inductive layer 150 and avoids design, the position of transparent base film that will be useless on inductive layer 150 is passed through
The mode of perforate removes, in order to connect up.Then connect up on inductive layer 150, draw first line from inductive layer 150（Figure is not
Show）.One end of first line is connected with induction line, and the other end stretches out inductive layer 150.
Step S130：Prepare ground plane 130.
Ground plane 130 includes transparent base film and is arranged at the conductive layer on transparent base film.Transparent base film is poly- terephthaldehyde
Sour glycol ester（PET）Layer, conductive layer is tin indium oxide（ITO）Layer, nano metal layer or carbon nanotube layer.Transparent base film and leading
Electric layer is prepared from using magnetron sputtering membrane process.The thickness of ground plane 130 is 0.05 ~ 0.188 millimeter.
Preferably, the circuit of annular is prepared using silk-screen printing technique on the surface of conductive layer.
Step S140：Preparation drives layer 110, and draws the second circuit from driving layer 110.
Layer 110 is driven to include transparent base film and be arranged at the conductive layer on transparent base film.Transparent base film is poly- terephthaldehyde
Sour glycol ester（PET）Layer, conductive layer is tin indium oxide（ITO）Layer, nano metal layer or carbon nanotube layer.Transparent base film and leading
Electric layer is prepared from using magnetron sputtering coating method.The thickness driving layer is 0.05 ~ 0.188 millimeter.
Drive pattern is etched on conductive layer is away from the surface of transparent base film.The etching of drive pattern can adopt gold-tinted work
Skill etching, silk-screen printing technique or laser etching process.
After the completion of drive pattern etching, carry in conductive layer and driver circuit, driver circuit are made on the surface of drive pattern
As the channel electrode lead driving layer 110.Driver circuit can be using silk-screen circuit technique thereof or the preparation of gold-tinted making technology.Drive
Each passage of dynamic connection drive pattern is to winding displacement position.
Connect up on driving layer 110, draw the second circuit from driving layer 110（Not shown）.One end of second circuit and drive
Dynamic connection, the other end stretches out driving layer 110.
Step S150：Inductive layer 150, ground plane 130 and driving layer 110 are sequentially laminated on the touch-control of face glass 170
In area 174, then first line and the second circuit arranged superposed are obtained capacitance touch screen 100 in wiring region 172.
Inductive layer 150, ground plane 130 are sequentially connected by viscose glue and drive layer 110, driving layer 110 and ground plane 130
Between form the first adhesive-layer 120, form the second adhesive-layer 140 between ground plane 130 and inductive layer 150.First adhesive-layer 120
Connect and drive the transparent base film of layer 110 and the conductive layer of ground plane 130, the second adhesive-layer 140 connects the transparent base of ground plane 130
Film and the conductive layer of inductive layer 150.
Layer 110, the first adhesive-layer 120, ground plane 130, the second adhesive-layer 140 and inductive layer 150 is driven to stack gradually group
Become composite bed（Figure is not marked）.Then adopt tool composite bed carried out sharp processing with and face glass 170 Touch Zone 174
Size and shape matches.
Finally by viscose glue, composite bed is layered on the Touch Zone 174 of face glass 170, obtains capacitance touch screen 100,
Form the 3rd adhesive-layer 160, then by first line and the second circuit arranged superposed in cloth between composite bed and face glass 170
In line area 172.Wherein, the transparent base film of the 3rd adhesive-layer 160 and inductive layer 110 is passed through in the screen printing brush finish of face glass 170
Stacked together.
The preparation method of above-mentioned capacitance touch screen, by introducing ground plane 130 between driving layer 110 and inductive layer 150,
And draw first line from inductive layer 150, draw the second circuit, first line and the second circuit arranged superposed from driving layer 110
On the wiring region 172 of face glass 170.Two electric capacity that layer 110 and inductive layer 150 are formed with the earth respectively are driven to produce
Change is all grounded layer 130 and derives, thus preventing inductive layer 150 and the electric capacity driving layer 110 to be formed, thus first line and
Second circuit arranged superposed does not interfere with the work of capacitance touch screen 100, and first line and the second circuit arranged superposed are in cloth
In line area 172, substantially reduce wiring space, large-sized wiring region need not be set to meet wiring requirements, thus panel glass
The size of the wiring region 172 of glass 170 is less so that the frame of capacitance touch screen 100 is less, is conducive to smart mobile phone, flat board electricity
The devices such as brain develop toward big form direction.
Therefore, the preparation method of above-mentioned capacitance touch screen can prepare the less capacitance touch screen of frame, can cater to big
Form, lightening design.
Embodiment described above only have expressed the several embodiments of the present invention, and its description is more concrete and detailed, but simultaneously
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the guarantor of the present invention
Shield scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (7)
1. a kind of capacitance touch screen, including face glass it is characterised in that described face glass includes Touch Zone and is located at described
The wiring region of touch-control area edge, described capacitance touch screen also includes stacking gradually inductive layer on described Touch Zone, ground plane
With drive layer, and from described inductive layer draw first line and from described drive layer draw the second circuit, described first
, in described wiring region, wherein, described ground plane is used for being grounded, and described ground plane makes institute for circuit and the second circuit arranged superposed
State driving layer and form two electric capacity with the earth respectively with described inductive layer, the change that this two electric capacity produce all is grounded layer and leads
Go out, thus preventing described inductive layer and the described electric capacity driving layer to be formed；
Described drive layer, ground plane and inductive layer include transparent base film and be laminated in indium tin oxide layer on described transparent base film,
Nano metal layer or carbon nanotube layer, wherein, described drive the saturating of the transparent base film of layer, the transparent base film of ground plane and inductive layer
Bright basement membrane is respectively positioned on the side away from described face glass；The indium tin oxide layer of described ground plane, nano metal layer or carbon nanometer
It is provided with circuit, described circuit is annular silver wire on the surface of tube layer.
2. capacitance touch screen according to claim 1 is it is characterised in that also include being arranged at described driving layer and ground plane
Between the first adhesive-layer, the second adhesive-layer being arranged between described ground plane and inductive layer and be arranged at described inductive layer with
The 3rd adhesive-layer between face glass.
3. capacitance touch screen according to claim 2 is it is characterised in that the thickness of described driving layer, ground plane and inductive layer
Spend for 0.05～0.188 millimeter, the thickness of described face glass is 0.3～2.0mm, described first adhesive-layer, the second adhesive-layer
And the 3rd adhesive-layer thickness be 0.05～0.175mm.
4. capacitance touch screen according to claim 1 is it is characterised in that described transparent base film is poly terephthalic acid second two
Alcohol ester layer.
5. a kind of preparation method of capacitance touch screen is it is characterised in that comprise the steps：
The wiring region that face glass is divided into Touch Zone and is located at described touch-control area edge, using silk-screen printing technique described
Wiring region printing-ink；
Prepare inductive layer, and draw first line from described inductive layer；
Prepare ground plane；
Preparation drives layer, and draws the second circuit from described driving layer；
By described inductive layer, ground plane and drive layer to be sequentially laminated on the Touch Zone of described face glass, then by described the
One circuit and the second circuit arranged superposed obtain capacitance touch screen in described wiring region, and wherein, described ground plane is used for being grounded,
Described ground plane makes described driving layer and described inductive layer form two electric capacity with the earth respectively, the change that this two electric capacity produce
Change and be all grounded layer derivation, thus preventing described inductive layer and the described electric capacity driving layer to be formed；
Described drive layer, ground plane and inductive layer include transparent base film and be laminated in indium tin oxide layer on described transparent base film,
Nano metal layer or carbon nanotube layer, wherein, described drive the saturating of the transparent base film of layer, the transparent base film of ground plane and inductive layer
Bright basement membrane is respectively positioned on the side away from described face glass；The indium tin oxide layer of described ground plane, nano metal layer or carbon nanometer
It is provided with circuit, described circuit is annular silver wire on the surface of tube layer.
6. the preparation method of capacitance touch screen according to claim 5 is it is characterised in that be additionally included in described inductive layer
Silk-screen printing technique or the preparation sense of gold-tinted making technology are adopted on the surface of indium tin oxide layer, nano metal layer or carbon nanotube layer
Answer step and the preparation driving on the surface of the described indium tin oxide layer, nano metal layer or carbon nanotube layer driving layer of circuit
The step of circuit, described first line is connected with described induction line, and described second circuit is connected with described driver circuit.
7. the preparation method of capacitance touch screen according to claim 5 is it is characterised in that the described oxidation of described ground plane
Indium tin layer, nano metal layer or carbon nanotube layer adopt magnetron sputtering to prepare, and the described indium tin oxide layer of described ground plane, receive
On the surface of rice metal level or carbon nanotube layer, circuit is had using silk-screen silver paste technique or the preparation of gold-tinted making technology.
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| JP6325342B2 (en) * | 2014-05-26 | 2018-05-16 | 日本航空電子工業株式会社 | Touch panel and manufacturing method thereof |
| CN105373246B (en) * | 2014-08-29 | 2018-08-14 | 宝宸（厦门）光学科技有限公司 | Touch panel |
| CN106020547B (en) * | 2016-05-26 | 2019-11-05 | 京东方科技集团股份有限公司 | A kind of substrate, touch screen and touch display unit |
| CN109696977A (en) * | 2017-10-20 | 2019-04-30 | 南昌欧菲光科技有限公司 | Electronic device, touch screen and touch panel |
| CN108091078B (en) * | 2017-12-12 | 2020-11-17 | 深圳市旭子科技有限公司 | Capacitive touch screen and financial payment electronic equipment |
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| CN101393502B (en) * | 2008-10-31 | 2012-03-07 | 敦泰科技有限公司 | Mutual capacitance touch screen and combined mutual capacitance touch screen |
| JP2012038873A (en) * | 2010-08-06 | 2012-02-23 | Nec Tokin Corp | Semiconductor device |
| CN101976149A (en) * | 2010-11-05 | 2011-02-16 | 牧东光电（苏州）有限公司 | Hardening structure touch panel and manufacturing method thereof |
| JP3174901U (en) * | 2012-02-01 | 2012-04-12 | 介面光電股▲ふん▼有限公司 | Touch panel |
| CN202677362U (en) * | 2012-07-10 | 2013-01-16 | 深圳欧菲光科技股份有限公司 | Capacitive touch screen |
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