CN105699711B - A kind of device automatic fixer applied to semiconductor devices thermal resistance measurement - Google Patents
A kind of device automatic fixer applied to semiconductor devices thermal resistance measurement Download PDFInfo
- Publication number
- CN105699711B CN105699711B CN201610166698.3A CN201610166698A CN105699711B CN 105699711 B CN105699711 B CN 105699711B CN 201610166698 A CN201610166698 A CN 201610166698A CN 105699711 B CN105699711 B CN 105699711B
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- fpga
- stepper motor
- host computer
- fixture
- pressure sensor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The invention discloses the automatic fixers in a kind of semiconductor devices thermal resistance measurement, including host computer, FPGA, driving circuit, stepper motor, pressure sensor, AD conversion chip, fixture.Host computer turns TTL modules by USB with FPGA and is connected, and FPGA is connected by driving circuit with stepper motor, and stepper motor is connected with fixture, and pressure sensor is fixed on fixture, and pressure sensor is connected by AD conversion chip with FPGA.A pressure value is set by host computer, stepper motor applies pressure by driving lead screw to rotate to device, device pressure can form closed-loop control system by sensor Real-time Feedback to host computer in pressure process, host computer controls stepper motor rotation according to the pressure value fed back to compared with setting value, it is ensured that the final pressure value for being applied to device is accurate.High degree of automation of the present invention, operation is simple, can ensure that the pressure value applied is accurate, improve semiconductor devices thermal resistance measurement accuracy.
Description
Technical field
The present invention, which relates to, belongs to semiconductor devices thermal resistance measurement field, and in particular to one kind can arbitrary setup pressure value and energy
The device of enough automatic stationary semiconductor devices.
Background technology
Currently, semiconductor devices thermo-resistance measurement mostly uses electric method, device need to be pressed on constant temperature by when measurement with fixing device
On platform, which influences measurement result very big.Existing simple device fixing device is complicated for operation, and is difficult to
Stressed repeatability is applied in guarantee, and size can not also be learnt, causes the inaccurate even damage device of measurement result.Stepping
The semiconductor devices automatic fixer of motor control, is utilized the powerful operational capabilities of FPGA, logic judgment ability, in addition pressure
Force snesor, the automatic control system of the compositions such as circuit, high degree of automation, operation is simple, can ensure the pressure value applied
Accurately, semiconductor devices thermal resistance measurement accuracy is improved.
Invention content
For the deficiency of existing fixing device, the object of the present invention is to provide a kind of performance stabilizations, and pressure value is accurate,
High degree of automation, semiconductor devices automatic fixer easy to operate.
In order to realize above-mentioned task, the present invention is realised by adopting the following technical scheme：
A kind of device automatic fixer applied to semiconductor devices thermal resistance measurement, it is characterised in that：Including host computer,
FPGA module, USB turn TTL modules, driving circuit, stepper motor, AD conversion chip, fixture；Host computer is turned with FPGA by USB
TTL modules are connected, and FPGA is connected by driving circuit with stepper motor, and stepper motor is connected with fixture, and pressure sensor is fixed
It is a part for fixture on fixture, pressure sensor is connected by AD conversion chip with FPGA；
The structure of the fixture is：Stepper motor is connected by shaft coupling with ball screw, is installed one piece on guide rail and is worn
The sliding block for crossing ball screw fixes a upperpush rod on sliding block, and outer sleeve is fixed on by horizontal gird in vertical pillars, interior
Sleeve is sleeved in outer sleeve, and inner sleeve can be free to slide in outer sleeve, and for spring in inner sleeve, upperpush rod passes through inner sleeve
It is contacted with spring, pressure sensor is housed between lower spring end and down-pressed pole, vertical pillars are fixed on the base.
The present invention also has following technical characterstic：
The FPGA module uses EP2C8Q208C8N chips
The USB turns TTL modules and uses PL2303 modules
The AD conversion chip uses MAX197
The pressure sensor uses resistive pressure sensor FSR402
High degree of automation of the present invention, pressure value is accurate, and stable structure is reliable, and flexibility ratio height can freely be put, operation letter
Just efficiency can be improved, it is simple in structure to be readily produced.
Description of the drawings
Fig. 1 is the catenation principle figure of the present invention.
Fig. 2 is the clamp structure schematic diagram of the present invention.
In figure：1. stepper motor, 2. ball screws, 3. guide rails, 4. vertical pillars, 5. horizontal girds, 6. pedestals, 7. shaft couplings
Device, 8. sliding blocks, 9. upperpush rods, 10. outer sleeves, 11. springs, 12. inner sleeves, 13. pressure sensors, 14. down-pressed poles.
Specific implementation mode
The present invention is described in further detail in the following with reference to the drawings and specific embodiments.
In compliance with the above technical solution, as depicted in figs. 1 and 2, the present invention includes host computer, FPGA module, driving circuit, step
Stepper motor, pressure sensor, AD conversion chip, fixture.Host computer turns TTL modules by USB with FPGA and is connected, and FPGA passes through drive
Dynamic circuit is connected with stepper motor, and stepper motor is connected with fixture, and pressure sensor is fixed on fixture, and pressure sensor passes through
AD conversion chip is connected with FPGA.
Stepper motor 1 is connected by shaft coupling 7 with ball screw 2, is installed one piece on guides 3 and is passed through ball screw 2
Sliding block 8 fixes a upperpush rod 9 on sliding block, and outer sleeve 10 is fixed on by horizontal gird 5 in vertical pillars 4, inner sleeve 12
It is sleeved in outer sleeve 10, inner sleeve can be free to slide in outer sleeve, and for spring in inner sleeve, upperpush rod 9 passes through inner sleeve
It is contacted with spring 11, pressure sensor is housed between lower spring end and down-pressed pole 14, vertical pillars 4 are fixed on pedestal 6.
The USB turns TTL modules and uses PL2303 modules, device internal USB function control device, USB transceiver, the oscillation
Device and UART with whole modem control signals only need an external several capacitances to achieve that usb signal is believed with RS232
Number conversion, can conveniently be embedded into various equipment.
The FPGA module uses EP2C8Q208C8N chips.
It is the high-speed a/d conversion chip with 12 measurement accuracy that the AD conversion chip, which uses MAX197, MAX197, only
It needs single power supply to power, and conversion time is very short (6us), there are 8 tunnel input channels, can also directly be connect with major part FPGA
Mouthful, use is very convenient.
The pressure sensor uses resistive pressure sensor FSR402.
A certain pressure value is set by upper computer software, host computer sends an instruction to FPGA by serial ports, and FPGA is to drive
Dynamic circuit sends instruction control stepper motor rotation, and stepper motor drives ball screw rotation, existed by the turning block of lead screw
Linear motion drives upper and lower pressure bar movement, upper and lower pressure bar inner sleeve can be driven to slide up and down by squeezing spring on lead screw, instantly
When compression bar touches device, stepper motor is rotated further generation certain pressure value, and pressure sensor detects that pressure value will at this time
Analog signal, which is sent to AD conversion chip and converts analog signals into digital signal, is sent to FPGA, and FPGA is by serial ports by pressure
Value is sent to host computer, and actual pressure value is compared by host computer with setting value sends instruction control stepping to FPGA again
Motor rotates, and forms closed-loop control system until actual pressure value reaches setting value.
Claims (5)
1. a kind of device automatic fixer applied to semiconductor devices thermal resistance measurement, it is characterised in that：Including host computer,
FPGA module, USB turn TTL modules, driving circuit, stepper motor, AD conversion chip, fixture；Host computer is turned with FPGA by USB
TTL modules are connected, and FPGA is connected by driving circuit with stepper motor, and stepper motor is connected with fixture, and pressure sensor is fixed
It is a part for fixture on fixture, pressure sensor is connected by AD conversion chip with FPGA；
The structure of the fixture is：Stepper motor is connected by shaft coupling with ball screw, and one piece is installed on guide rail and passes through rolling
The sliding block of ballscrew fixes a upperpush rod on sliding block, and outer sleeve is fixed on by horizontal gird in vertical pillars, inner sleeve
It is sleeved in outer sleeve, inner sleeve can be free to slide in outer sleeve, and for spring in inner sleeve, upperpush rod passes through inner sleeve and bullet
Spring contacts, and pressure sensor is housed between lower spring end and down-pressed pole, vertical pillars are fixed on the base；
A certain pressure value is set by upper computer software, host computer sends an instruction to FPGA by serial ports, and FPGA gives driving electricity
Road sends instruction control stepper motor rotation, and stepper motor drives ball screw rotation, by the sliding block of ball screw in lead screw
Upper linear motion drives upper and lower compression bar movement, upper and lower compression bar to drive inner sleeve to slide up and down by squeezing spring, work as down-pressed pole
When touching device, stepper motor is rotated further generation certain pressure value, and pressure sensor detects that pressure value will be simulated at this time
Signal, which is sent to AD conversion chip and converts analog signals into digital signal, is sent to FPGA, and FPGA is sent out pressure value by serial ports
Host computer is given, actual pressure value is compared by host computer with setting value sends instruction control stepper motor to FPGA again
Rotation forms closed-loop control system until actual pressure value reaches setting value.
2. automatic fixer according to claim 1, it is characterised in that：The FPGA module uses EP2C8Q208C8N
Chip.
3. automatic fixer according to claim 1, it is characterised in that：The USB turns TTL modules and uses PL2303 moulds
Block.
4. automatic fixer according to claim 1, it is characterised in that：The AD conversion chip uses MAX197.
5. automatic fixer according to claim 1, it is characterised in that：The pressure sensor uses resistive pressure
Sensor FSR402.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610166698.3A CN105699711B (en) | 2016-03-20 | 2016-03-20 | A kind of device automatic fixer applied to semiconductor devices thermal resistance measurement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610166698.3A CN105699711B (en) | 2016-03-20 | 2016-03-20 | A kind of device automatic fixer applied to semiconductor devices thermal resistance measurement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105699711A CN105699711A (en) | 2016-06-22 |
| CN105699711B true CN105699711B (en) | 2018-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610166698.3A Active CN105699711B (en) | 2016-03-20 | 2016-03-20 | A kind of device automatic fixer applied to semiconductor devices thermal resistance measurement |
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| Country | Link |
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| CN (1) | CN105699711B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112782216A (en) * | 2020-12-29 | 2021-05-11 | 中国电子科技集团公司第五十八研究所 | Thermal resistance test fixture for flip chip packaging |
Citations (6)
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|---|---|---|---|---|
| DE10237162A1 (en) * | 2002-08-14 | 2004-02-26 | Robert Bosch Gmbh | Crash or collision sensor for a motor vehicle has at least one pressure sensor, the output signal of which is normalized with the atmospheric pressure prior to processing in a control unit processor |
| CN2819235Y (en) * | 2005-03-09 | 2006-09-20 | 湖南科技大学 | On-line quality state monitoring system of electromagnetic component |
| CN201016946Y (en) * | 2007-03-07 | 2008-02-06 | 华为技术有限公司 | Heat conductive material parameter testing device |
| CN103230279A (en) * | 2013-04-27 | 2013-08-07 | 重庆绿色智能技术研究院 | Continuous changeable stress test system |
| CN104614560A (en) * | 2015-01-18 | 2015-05-13 | 北京工业大学 | Fixing device for measuring thermal resistance of semiconductor device |
| CN205426968U (en) * | 2016-03-20 | 2016-08-03 | 北京工业大学 | Be applied to automatic fixing device of semiconductor device thermal resistance measuring device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63124910A (en) * | 1986-11-14 | 1988-05-28 | Jeco Co Ltd | Display device for automobile |
-
2016
- 2016-03-20 CN CN201610166698.3A patent/CN105699711B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10237162A1 (en) * | 2002-08-14 | 2004-02-26 | Robert Bosch Gmbh | Crash or collision sensor for a motor vehicle has at least one pressure sensor, the output signal of which is normalized with the atmospheric pressure prior to processing in a control unit processor |
| CN2819235Y (en) * | 2005-03-09 | 2006-09-20 | 湖南科技大学 | On-line quality state monitoring system of electromagnetic component |
| CN201016946Y (en) * | 2007-03-07 | 2008-02-06 | 华为技术有限公司 | Heat conductive material parameter testing device |
| CN103230279A (en) * | 2013-04-27 | 2013-08-07 | 重庆绿色智能技术研究院 | Continuous changeable stress test system |
| CN104614560A (en) * | 2015-01-18 | 2015-05-13 | 北京工业大学 | Fixing device for measuring thermal resistance of semiconductor device |
| CN205426968U (en) * | 2016-03-20 | 2016-08-03 | 北京工业大学 | Be applied to automatic fixing device of semiconductor device thermal resistance measuring device |
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| CN105699711A (en) | 2016-06-22 |
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